WO2019124512A1 - はんだ粒子、導電材料、はんだ粒子の保管方法、導電材料の保管方法、導電材料の製造方法、接続構造体及び接続構造体の製造方法 - Google Patents

はんだ粒子、導電材料、はんだ粒子の保管方法、導電材料の保管方法、導電材料の製造方法、接続構造体及び接続構造体の製造方法 Download PDF

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Publication number
WO2019124512A1
WO2019124512A1 PCT/JP2018/047055 JP2018047055W WO2019124512A1 WO 2019124512 A1 WO2019124512 A1 WO 2019124512A1 JP 2018047055 W JP2018047055 W JP 2018047055W WO 2019124512 A1 WO2019124512 A1 WO 2019124512A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
conductive material
electrode
solder particles
connection
Prior art date
Application number
PCT/JP2018/047055
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
士輝 宋
周治郎 定永
雄太 山中
将大 伊藤
諭 齋藤
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to KR1020207011611A priority Critical patent/KR20200098485A/ko
Priority to CN201880077799.0A priority patent/CN111417488A/zh
Priority to JP2019515675A priority patent/JP7184759B2/ja
Publication of WO2019124512A1 publication Critical patent/WO2019124512A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/226—Non-corrosive coatings; Primers applied before welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections

Definitions

  • the absolute value of the calorific value at 200 ° C. or more of the solder particles is 100 mJ / mg or more.
  • solder particles as described above, wherein the solder particles are placed in a storage container and stored under an inert gas atmosphere, or the solder particles are placed in a storage container
  • a storage method of solder particles is provided, which is stored under vacuum under a condition of 1 ⁇ 10 2 Pa or less.
  • the melting point (activation temperature) of the flux in the conductive material is often lower than the Tg of the thermosetting component in the conductive material, and as the content of the flux in the conductive material increases, the cured product of the conductive material Heat resistance tends to decrease.
  • the heat resistance of the cured product of the conductive material can be effectively improved.
  • the generation of voids in the cured product of the conductive material can be effectively suppressed, and the generation of the curing failure of the conductive material is effective. Can be suppressed.
  • the solder particle has a solder particle body and an oxide film disposed on the outer surface of the solder particle body.
  • the solder particle main body both the central portion and the outer surface are formed of solder.
  • the solder particle main body is a particle in which both the central portion and the outer surface are solder.
  • the oxide film is formed by oxidizing the outer surface of the solder particle body with oxygen in the air.
  • the oxide film is made of tin oxide or the like.
  • commercially available solder particles have an outer surface oxidized by oxygen in air and have an oxide film.
  • the average thickness (average thickness A) of the oxide film before heating can be determined, for example, by observing the cross section of the solder particles using a transmission electron microscope.
  • the average thickness (average thickness A) of the above-mentioned oxide film before heating can be calculated, for example, from the average value of the thicknesses of ten arbitrarily selected oxide films.
  • the storage method of the solder particle which concerns on this invention is a method for storing the solder particle mentioned above.
  • the solder particles described above are preferably stored by the method for storing solder particles according to the present invention.
  • the solder particles are preferably stored in a storage container and stored under an inert gas atmosphere, or the solder particles are preferably stored in a storage container and vacuum stored under a condition of 1 ⁇ 10 2 Pa or less.
  • the storage method of the solder particles may be cold storage or freezing storage.
  • the viscosity ( ⁇ 25 (0.5 rpm)) of the above conductive material measured under conditions of 25 ° C. and 0.5 rpm using an E-type viscometer Is preferably 50 Pa ⁇ s or more, more preferably 100 Pa ⁇ s or more, preferably 400 Pa ⁇ s or less, more preferably 300 Pa ⁇ s or less.
  • the viscosity ( ⁇ 25 (0.5 rpm)) can be appropriately adjusted according to the type and the blending amount of the blending component.
  • the reaction initiation temperature of the thermosetting agent is preferably 50 ° C. or more, more preferably 70 ° C. or more, still more preferably 80 ° C. or more, preferably 250 ° C. or less, more preferably 200 ° C. or less, still more preferably 150 ° C.
  • the temperature is particularly preferably 140 ° C. or less.
  • the reaction initiation temperature of the thermosetting agent is particularly preferably 80 ° C. or more and 140 ° C. or less.
  • the melting point of the flux is preferably higher than the reaction initiation temperature of the thermosetting agent, more preferably 5 ° C. or more, and more preferably 10 ° C. or more Is more preferred.
  • the said flux is a flux which discharge
  • the use of a flux that releases cations upon heating allows the solder to be placed more efficiently on the electrodes.
  • a conductive material (anisotropic conductive paste) immediately after preparation is coated on the upper surface of the glass epoxy substrate by screen printing using a metal mask so as to have a thickness of 100 ⁇ m on the electrode of the glass epoxy substrate, A conductive material (anisotropic conductive paste) layer was formed.
  • the flexible printed circuit was laminated on the upper surface of the conductive material (anisotropic conductive paste) layer so that the electrodes face each other. At this time, no pressure was applied.
  • the weight of the flexible printed board is added to the conductive material (anisotropic conductive paste) layer. From that state, the temperature of the conductive material (anisotropic conductive paste) layer was heated to become the melting point of the solder 5 seconds after the start of the temperature rise.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2018/047055 2017-12-22 2018-12-20 はんだ粒子、導電材料、はんだ粒子の保管方法、導電材料の保管方法、導電材料の製造方法、接続構造体及び接続構造体の製造方法 WO2019124512A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020207011611A KR20200098485A (ko) 2017-12-22 2018-12-20 땜납 입자, 도전 재료, 땜납 입자의 보관 방법, 도전 재료의 보관 방법, 도전 재료의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
CN201880077799.0A CN111417488A (zh) 2017-12-22 2018-12-20 焊锡粒子、导电材料、焊锡粒子的保管方法、导电材料的保管方法、导电材料的制造方法、连接结构体及连接结构体的制造方法
JP2019515675A JP7184759B2 (ja) 2017-12-22 2018-12-20 導電材料、導電材料の保管方法、導電材料の製造方法及び接続構造体の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017246176 2017-12-22
JP2017-246176 2017-12-22

Publications (1)

Publication Number Publication Date
WO2019124512A1 true WO2019124512A1 (ja) 2019-06-27

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PCT/JP2018/047055 WO2019124512A1 (ja) 2017-12-22 2018-12-20 はんだ粒子、導電材料、はんだ粒子の保管方法、導電材料の保管方法、導電材料の製造方法、接続構造体及び接続構造体の製造方法

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JP (1) JP7184759B2 (zh)
KR (1) KR20200098485A (zh)
CN (1) CN111417488A (zh)
TW (1) TWI798321B (zh)
WO (1) WO2019124512A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021009774A (ja) * 2019-06-28 2021-01-28 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2021012758A (ja) * 2019-07-03 2021-02-04 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
EP4084051A4 (en) * 2019-12-27 2023-08-02 Resonac Corporation SOLDER DROP FORMING MEMB, METHOD FOR MAKING A SOLDER DROP FORMING MEMB, AND METHOD FOR MAKING AN ELECTRODE SUBSTRATE PROVIDED WITH A SOLDER DROP

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JPH06155070A (ja) * 1992-11-20 1994-06-03 Hitachi Ltd はんだペースト
JP2000094179A (ja) * 1998-09-22 2000-04-04 Harima Chem Inc ソルダペースト及びその製造方法並びにはんだプリコート方法
JP2013202632A (ja) * 2012-03-27 2013-10-07 Nitto Denko Corp 接合シート、電子部品およびその製造方法
WO2015125778A1 (ja) * 2014-02-24 2015-08-27 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
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WO2016140326A1 (ja) * 2015-03-04 2016-09-09 デクセリアルズ株式会社 導電用粒子の製造方法、異方性導電接着剤、部品の搭載方法
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021009774A (ja) * 2019-06-28 2021-01-28 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2021012758A (ja) * 2019-07-03 2021-02-04 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP7277289B2 (ja) 2019-07-03 2023-05-18 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
EP4084051A4 (en) * 2019-12-27 2023-08-02 Resonac Corporation SOLDER DROP FORMING MEMB, METHOD FOR MAKING A SOLDER DROP FORMING MEMB, AND METHOD FOR MAKING AN ELECTRODE SUBSTRATE PROVIDED WITH A SOLDER DROP

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TW201934704A (zh) 2019-09-01
JPWO2019124512A1 (ja) 2020-11-19
CN111417488A (zh) 2020-07-14
KR20200098485A (ko) 2020-08-20
JP7184759B2 (ja) 2022-12-06
TWI798321B (zh) 2023-04-11

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