WO2019119608A1 - 刻蚀设备 - Google Patents

刻蚀设备 Download PDF

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Publication number
WO2019119608A1
WO2019119608A1 PCT/CN2018/074010 CN2018074010W WO2019119608A1 WO 2019119608 A1 WO2019119608 A1 WO 2019119608A1 CN 2018074010 W CN2018074010 W CN 2018074010W WO 2019119608 A1 WO2019119608 A1 WO 2019119608A1
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Prior art keywords
exhaust
etching apparatus
pump
frame
exhaust duct
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PCT/CN2018/074010
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English (en)
French (fr)
Inventor
董磊磊
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武汉华星光电半导体显示技术有限公司
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Publication of WO2019119608A1 publication Critical patent/WO2019119608A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to the field of flexible display manufacturing processes, and more particularly to an etching apparatus.
  • the mainstream AMOLED flexible display technology generally needs to first fabricate an Array circuit on a whole substrate, and cut the substrate prepared with the Array circuit into two halves, respectively perform evaporation of the light-emitting layer, and then simultaneously vapor-deposit two layers of the light-emitting layer.
  • the touch circuit is fabricated on the half board to achieve the purpose of flexible display touch.
  • the production of double-half-panel touch circuits requires a dry-etching process.
  • the two-half-plate production of dry-engraving equipment can achieve only 20% uniformity of etching, which seriously affects product yield.
  • the present invention provides an etching device capable of optimizing an etching environment, improving etching uniformity, and improving product yield.
  • the specific technical solution proposed by the present invention is: providing an etching device, the etching device comprising a sealing cover, a carrier plate, a baffle, a frame, and a plurality of first exhaust structures, the carrier plate, the baffle and the frame
  • the frame and the baffle are disposed on the carrying plate, and the baffle is located in the middle of the frame and surrounds the frame to form two receiving portions, the two receiving portions
  • the portion is for placing a touch panel
  • the plurality of first exhaust structures are disposed around the frame
  • the plurality of first exhaust structures are for discharging air in the sealing cover.
  • the etching apparatus further includes a first exhaust duct and a second exhaust structure, the first exhaust duct penetrating the baffle and the carrier plate and communicating the sealing cover with the first Two exhaust structure.
  • the second exhaust structure includes a first control valve and a first air pump, and the first control valve is disposed between the first exhaust duct and the first air pump.
  • the first exhaust duct includes a horizontal portion and a vertical portion communicating with the horizontal portion, the vertical portion penetrating the baffle and the carrier plate and communicating the sealing cover and the horizontal portion
  • the horizontal portion is coupled between the vertical portion and the first control valve.
  • the first exhaust duct is made of a corrosion-resistant and insulating material.
  • the first exhaust structures are symmetrically disposed on opposite sides of the carrier plate.
  • the first exhaust structure includes a second exhaust duct, a second control valve, and a second exhaust pump
  • the second exhaust duct is in communication with the sealing cover
  • the second control valve is disposed on The second exhaust duct is between the second exhaust pump and the second exhaust pump.
  • the etching device further includes a third air pump, and the third air pump is respectively connected to the first air pump and the second air pump.
  • the first air pump and the second air pump are all molecular pumps.
  • the third air pump is a vacuum pump.
  • the etching apparatus provided by the invention comprises a plurality of first exhaust structures, and in the dry etching, the flow of the process gas in the sealing cover can be promoted by the plurality of first exhaust structures, so that the process gas is evenly distributed in the sealing cover Internally, optimizing the etching environment, improving etch uniformity, and improving product yield.
  • FIG. 1 is a schematic structural view of an etching apparatus
  • Figure 2 is a cross-sectional view of the etching apparatus of Figure 1;
  • FIG. 3 is another cross-sectional view of the etching apparatus of FIG. 1.
  • the etching apparatus includes a sealing cover 1 , a carrier plate 2 , a baffle 3 , a frame 4 , and a plurality of first exhaust structures 5 , a carrier plate 2 , and a baffle plate 3 .
  • the frame 4 is located in the sealing cover 1
  • the frame 4 and the baffle 3 are disposed on the carrier plate 2
  • the baffle 3 is located in the middle of the frame 4 and is combined with the frame 4 to form two receiving portions 6
  • the two receiving portions 6 are used for placing
  • the touch panel 7 has a plurality of first exhaust structures 5 disposed around the bezel 4, and a plurality of first exhaust structures 5 for discharging air in the sealing cover 1.
  • the etching device in this embodiment can etch two touch panels 7 at the same time, the frame 4 is a rectangular frame structure, and the baffle 3 is disposed in the middle of the frame 4 and perpendicular to the two sides of the frame 4, and the frame 4 and the block The board 3 is used to limit the two touch panels 7.
  • a plurality of first exhaust structures 5 are in communication with the seal cover 1 for discharging air in the seal cover 1.
  • the flow of the process gas in the sealing cover 1 can be promoted by the plurality of first exhaust structures 5, so that the process gas is evenly distributed in the sealing cover 1, thereby optimizing the etching environment and improving the etching uniformity. And improve product yield.
  • the plurality of first exhaust structures 5 are symmetrically distributed on both sides of the frame 4, so that the process gas can be evenly distributed in the sealing cover 1 to optimize the etching environment, improve the etching uniformity, and improve the product yield. .
  • the first exhaust structure 5 includes a second exhaust duct 51, a second control valve 52, and a second air pump 53, the second exhaust duct 51 is in communication with the seal cover 1, and the second control valve 52 is disposed in the second exhaust duct. 51 is between the second air pump 53 and the second air pump 53.
  • the second control valve 52 is an APC valve for controlling the magnitude of the pressure in the sealing cover 1.
  • the material of the second exhaust duct 51 in this embodiment is a corrosion-resistant and insulating material, for example, a ceramic material or an aluminum material produced by anodizing coating.
  • a corrosion-resistant and insulating material for example, a ceramic material or an aluminum material produced by anodizing coating.
  • the etching apparatus further includes a first exhaust duct 8 and a second exhaust structure 9, and the carrier plate 2 and the baffle 3 are provided with through holes for placing the first exhaust duct 8, and the first exhaust duct 8 is located in the through hole
  • the first exhaust duct 8 penetrates the carrier plate 2 and the baffle 3 and communicates with the sealing cover 1 and the second exhaust structure 9.
  • the process gas above the baffle 3 can be discharged through the first exhaust duct 8 and the second exhaust structure 9, thereby avoiding a comparison of the concentration of the process gas above the baffle 3 due to the absence of the touch panel 7 at the baffle 3. Large, the process gas above the baffle 3 will diffuse to both sides of the baffle 3, and the etching speed of the touch panel 7 near the side of the baffle 3 is faster, resulting in a decrease in etching uniformity and a decrease in product yield.
  • the number of the first exhaust ducts 8 in this embodiment may be plural, and the number of the second exhaust structures 9 is also plural, and each of the first exhaust ducts 8 corresponds to one second exhaust structure 9.
  • the shape and size of the plurality of first exhaust ducts 8 may be different, so that the amount of exhaust of the first exhaust duct 8 may be controlled by the difference in shape and size of the plurality of first exhaust ducts 8, or a plurality of The shape and size of the first exhaust duct 8 are the same, and the amount of exhaust of the first exhaust duct 8 is controlled by controlling the exhaust speed of the plurality of second exhaust structures 9.
  • the second exhaust structure 9 includes a first control valve 91 and a first air pump 92, and the first control valve 91 is disposed between the first exhaust duct 8 and the first air pump 92.
  • the first control valve 91 is an APC valve for controlling the magnitude of the pressure in the sealing cover 1.
  • the material of the first exhaust duct 8 in this embodiment is a corrosion-resistant and insulating material, for example, a ceramic material or an aluminum material produced by anodizing coating.
  • a corrosion-resistant and insulating material for example, a ceramic material or an aluminum material produced by anodizing coating.
  • the plurality of first exhaust ducts 8 in this embodiment may share a second exhaust structure 9.
  • the first exhaust duct 8 includes a horizontal portion 81 and a vertical portion 82 communicating with the horizontal portion 81.
  • the vertical portion 82 penetrates the carrier plate 2 and the baffle 3 and communicates with the sealing cover 1 and the horizontal portion 81, and the horizontal portion 81 is connected to The vertical portion 82 is between the first control valve 91.
  • the second exhaust structure 9 is disposed in the middle of the plurality of first exhaust ducts 8, such that the plurality of first exhaust ducts 8 can communicate with the second exhaust structure 9 through the horizontal portion 81.
  • the etching apparatus in this embodiment further includes a third air pump 10, and the third air pump 10 is connected to the first air pump 92 and the second air pump 53, respectively.
  • the first air pump 92 and the second air pump 53 are molecular pumps (TMP) for performing exhaust gas with a high degree of vacuum of the sealing cover 1
  • the third air pump 10 is a vacuum pump for When the degree of vacuum of the sealing cover 1 is low, the exhaust gas is exhausted.
  • TMP molecular pumps
  • Each of the first air pump 92 and the second air pump 53 is connected to a third air pump 10.
  • the plurality of first exhaust structures 5 are further used to support the entire etching device, and the carrier plate 2 rests on the top of the first exhaust structure 5 and partially covers the top of the first exhaust structure 5, thus, the first The exhaust structure 5 can also support the entire etching apparatus during the exhaust process.

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  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种刻蚀设备，包括密封罩（1）、承载板（2）、挡板（3）、边框（4）以及多个第一排气结构（5）。所述承载板、挡板及边框位于所述密封罩内，所述边框和所述挡板设于所述承载板上，所述挡板位于所述边框的中间并与所述边框围合成两个收容部（6），所述两个收容部用于放置触摸面板（7），所述多个第一排气结构环绕所述边框设置，所述多个第一排气结构用于将密封罩中的空气排出。该刻蚀设备包括多个第一排气结构，在干法刻蚀促进密封罩内的工艺气体的流动，使得工艺气体均匀分布在密封罩内，从而优化刻蚀环境、提高刻蚀均一性以及提升产品良率。

Description

刻蚀设备 技术领域
本发明涉及柔性显示制造工艺领域，尤其涉及一种刻蚀设备。
背景技术
随着柔性显示技术的发展，柔性显示装置的应用越来越广泛，而柔性显示装置对半导体制造设备的要求很高。目前，主流的AMOLED柔性显示技术，一般需要先在整片基板上制作Array电路，将制备有Array电路的基板切成两半后分别进行发光层蒸镀，然后同时在蒸镀有发光层的两片半板上进行触控电路制作，以实现柔性显示触摸的目的。双半板触控电路的制作需要用到干刻工艺，但目前双半板生产干刻设备，刻蚀的均一性只能做到20％以上，严重影响产品良率。
发明内容
为了解决现有技术的不足，本发明提供一种刻蚀设备，能够优化刻蚀环境、提高刻蚀均一性、提升产品良率。
本发明提出的具体技术方案为：提供一种刻蚀设备，所述刻蚀设备包括密封罩、承载板、挡板、边框以及多个第一排气结构，所述承载板、挡板及边框位于所述密封罩内，所述边框和所述挡板设于所述承载板上，所述挡板位于所述边框的中间并与所述边框围合成两个收容部，所述两个收容部用于放置触摸面板，所述多个第一排气结构环绕所述边框设置，所述多个第一排气结构用于将密封罩中的空气排出。
可选地，所述刻蚀设备还包括第一排气管道和第二排气结构，所述第一排气管道贯穿所述挡板及所述承载板并连通所述密封罩与所述第二排气结构。
可选地，所述第二排气结构包括第一控制阀和第一抽气泵，所述第一控制阀设于所述第一排气管道与所述第一抽气泵之间。
可选地，所述第一排气管道包括水平部及与所述水平部连通的垂直部，所述垂直部贯穿所述挡板和所述承载板并连通所述密封罩与所述水平部，所述水平部连接于所述垂直部与所述第一控制阀之间。
可选地，所述第一排气管道的材质为耐腐蚀、绝缘材质。
可选地，所述第一排气结构对称的设置于所述承载板的相对的两侧。
可选地，所述第一排气结构包括第二排气管道、第二控制阀以及第二抽气泵，所述第二排气管道与所述密封罩连通，所述第二控制阀设于所述第二排气管道与所述第二抽气泵之间。
可选地，所述刻蚀设备还包括第三抽气泵，所述第三抽气泵分别与所述第一抽气泵、第二抽气泵连接。
可选地，所述第一抽气泵、第二抽气泵均为分子泵。
可选地，所述第三抽气泵为真空泵。
本发明提出的刻蚀设备包括多个第一排气结构，在干法刻蚀时，可以通过多个第一排气结构促进密封罩内的工艺气体的流动，使得工艺气体均匀分布在密封罩内，从而优化刻蚀环境、提高刻蚀均一性以及提升产品良率。
附图说明
图1为刻蚀设备的结构示意图；
图2为图1中刻蚀设备的剖面图；
图3为图1中刻蚀设备的另一剖面图。
具体实施方式
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。在附图中，相同的标号将始终被用于表示相同的元件。
参照图1、图2、图3，本实施例提供的刻蚀设备包括密封罩1、承载板2、挡板3、边框4以及多个第一排气结构5，承载板2、挡板3及边框4位于密封罩1内，边框4和挡板3设于承载板2上，挡板3位于边框4的中间并与边框4围合成两个收容部6，两个收容部6用于放置触摸面板7，多个第一排气结构5环绕边框4设置，多个第一排气结构5用于将密封罩1中的空气排出。
本实施例中的刻蚀设备可以同时对两块触摸面板7进行刻蚀，边框4为矩形框状结构，挡板3设置于边框4的中间并与边框4相对的两边垂直，边框4和挡板3用于对两块触摸面板7进行限位。多个第一排气结构5与密封罩1连通，用于将密封罩1中的空气排出。
在干法刻蚀时，通过多个第一排气结构5可以促进密封罩1内的工艺气体的流动，使得工艺气体均匀分布在密封罩1内，从而优化刻蚀环境、提高刻蚀均一性以及提升产品良率。
较佳地，多个第一排气结构5对称分布于边框4的两侧，这样可以进一步使得工艺气体均匀分布在密封罩1内，优化刻蚀环境、提高刻蚀均一性以及提升产品良率。
第一排气结构5包括第二排气管道51、第二控制阀52以及第二抽气泵53，第二排气管道51与密封罩1连通，第二控制阀52设于第二排气管道51与第二抽气泵53之间。第二控制阀52为APC阀，用于控制密封罩1中的压力大小。
本实施例中的第二排气管道51的材质为耐腐蚀、绝缘材质，例如，陶瓷材料或者经过阳极氧化coating制作后的铝材料。这样，密封罩1中的工艺气体不会对第二排气管道51进行腐蚀。
刻蚀设备还包括第一排气管道8和第二排气结构9，承载板2和挡板3上设有用于放置第一排气管道8的通孔，第一排气管道8位于通孔中，第一排气管道8贯穿承载板2及挡板3并连通密封罩1与第二排气结构9。通过第一排气管道8和第二排气结构9可以将挡板3上方的工艺气体排出，从而避免因挡板3处没有放置触摸面板7而导致挡板3的上方的工艺气体的浓度比较大，挡板3上方的工艺气体会向挡板3两侧扩散，触摸面板7靠近挡板3的一侧的刻蚀速度较快，导致刻蚀均一性降低、产品良率也降低。
本实施例中的第一排气管道8的数目可以为多个，第二排气结构9的数目 也为多个，每一个第一排气管道8均对应一个第二排气结构9。多个第一排气管道8的形状和尺寸可以不相同，从而可以通过多个第一排气管道8的形状和尺寸的不同来控制第一排气管道8的排气量，或者，多个第一排气管道8的形状和尺寸相同，通过控制多个第二排气结构9的排气速度来控制第一排气管道8的排气量。
第二排气结构9包括第一控制阀91和第一抽气泵92，第一控制阀91设于第一排气管道8与第一抽气泵92之间。第一控制阀91为APC阀，用于控制密封罩1中的压力大小。
本实施例中的第一排气管道8的材质为耐腐蚀、绝缘材质，例如，陶瓷材料或者经过阳极氧化coating制作后的铝材料。这样，密封罩1中的工艺气体不会对第一排气管道8进行腐蚀。
如图3所示，在另一实施方式中，本实施例中的多个第一排气管道8可以共用一个第二排气结构9。此时，第一排气管道8包括水平部81及与水平部81连通的垂直部82，垂直部82贯穿承载板2和挡板3并连通密封罩1与水平部81，水平部81连接于垂直部82与第一控制阀91之间。第二排气结构9设于多个第一排气管道8的中间，这样多个第一排气管道8均可以通过水平部81与第二排气结构9连通。
本实施例中的刻蚀设备还包括第三抽气泵10，第三抽气泵10分别与第一抽气泵92、第二抽气泵53连接。具体地，第一抽气泵92、第二抽气泵53为分子泵(TMP)，用于在密封罩1的真空度较高的情况下进行排气，第三抽气泵10为真空泵，用于在密封罩1的真空度较低的情况下进行排气。每一个第一抽气泵92、第二抽气泵53均连接一个第三抽气泵10。
本实施例中多个第一排气结构5还用于支撑整个刻蚀设备，承载板2搁置于第一排气结构5的顶部并部分覆盖第一排气结构5的顶部，这样，第一排气结构5在排气的过程中还可以支撑整个刻蚀设备。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (17)

  1. 一种刻蚀设备，其中，包括密封罩、承载板、挡板、边框以及多个第一排气结构，所述承载板、挡板及边框位于所述密封罩内，所述边框和所述挡板设于所述承载板上，所述挡板位于所述边框的中间并与所述边框围合成两个收容部，所述两个收容部用于放置触摸面板，所述多个第一排气结构环绕所述边框设置，所述多个第一排气结构用于将密封罩中的空气排出。
  2. 根据权利要求1所述的刻蚀设备，其中，还包括第一排气管道和第二排气结构，所述第一排气管道贯穿所述挡板及所述承载板并连通所述密封罩与所述第二排气结构。
  3. 根据权利要求2所述的刻蚀设备，其中，所述第二排气结构包括第一控制阀和第一抽气泵，所述第一控制阀设于所述第一排气管道与所述第一抽气泵之间。
  4. 根据权利要求3所述的刻蚀设备，其中，所述第一排气管道包括水平部及与所述水平部连通的垂直部，所述垂直部贯穿所述挡板和所述承载板并连通所述密封罩与所述水平部，所述水平部连接于所述垂直部与所述第一控制阀之间。
  5. 根据权利要求2所述的刻蚀设备，其中，所述第一排气管道的材质为耐腐蚀、绝缘材质。
  6. 根据权利要求3所述的刻蚀设备，其中，所述第一排气管道的材质为耐腐蚀、绝缘材质。
  7. 根据权利要求4所述的刻蚀设备，其中，所述第一排气管道的材质为耐腐蚀、绝缘材质。
  8. 根据权利要求3所述的刻蚀设备，其中，所述第一排气结构对称的设置于所述承载板的相对的两侧。
  9. 根据权利要求4所述的刻蚀设备，其中，所述第一排气结构对称的设置于所述承载板的相对的两侧。
  10. 根据权利要求8所述的刻蚀设备，其中，所述第一排气结构包括第二排气管道、第二控制阀以及第二抽气泵，所述第二排气管道与所述密封罩连通，所述第二控制阀设于所述第二排气管道与所述第二抽气泵之间。
  11. 根据权利要求9所述的刻蚀设备，其中，所述第一排气结构包括第二排气管道、第二控制阀以及第二抽气泵，所述第二排气管道与所述密封罩连通，所述第二控制阀设于所述第二排气管道与所述第二抽气泵之间。
  12. 根据权利要求10所述的刻蚀设备，其中，还包括第三抽气泵，所述第三抽气泵分别与所述第一抽气泵、第二抽气泵连接。
  13. 根据权利要求11所述的刻蚀设备，其中，还包括第三抽气泵，所述第三抽气泵分别与所述第一抽气泵、第二抽气泵连接。
  14. 根据权利要求12所述的刻蚀设备，其中，所述第一抽气泵、第二抽气泵均为分子泵。
  15. 根据权利要求13所述的刻蚀设备，其中，所述第一抽气泵、第二抽气泵均为分子泵。
  16. 根据权利要求14所述的刻蚀设备，其中，所述第三抽气泵为真空泵。
  17. 根据权利要求15所述的刻蚀设备，其中，所述第三抽气泵为真空泵。
PCT/CN2018/074010 2017-12-20 2018-01-24 刻蚀设备 WO2019119608A1 (zh)

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