WO2014153827A1 - 一种基板减压干燥方法及装置 - Google Patents

一种基板减压干燥方法及装置 Download PDF

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Publication number
WO2014153827A1
WO2014153827A1 PCT/CN2013/076178 CN2013076178W WO2014153827A1 WO 2014153827 A1 WO2014153827 A1 WO 2014153827A1 CN 2013076178 W CN2013076178 W CN 2013076178W WO 2014153827 A1 WO2014153827 A1 WO 2014153827A1
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WIPO (PCT)
Prior art keywords
zone
baffle
drying
substrate
decompression
Prior art date
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PCT/CN2013/076178
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English (en)
French (fr)
Inventor
王耸
万冀豫
冯贺
吴洪江
Original Assignee
京东方科技集团股份有限公司
北京京东方显示技术有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方显示技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/362,049 priority Critical patent/US9347706B2/en
Publication of WO2014153827A1 publication Critical patent/WO2014153827A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • F26B5/045—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum for drying thin, flat articles in a batch operation, e.g. leather, rugs, gels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Definitions

  • the present invention relates to the field of substrate manufacturing technology, and in particular, to a substrate decompression drying method and device. Background technique
  • the venting holes of current decompression drying (VCD) equipment are provided in two ways, one is central exhaust and the other is ambient exhaust.
  • VCD current decompression drying
  • the exhaust gas is uneven due to the small number of vent holes and the distribution problem.
  • decompression and drying spots are generated after drying under reduced pressure, and the most common is a crescent-like shape. spot.
  • it is impossible to effectively control the spots under reduced pressure and dryness which increases the false positive rate of the substrate quality, which is not conducive to the detection of the substrate quality, affects the quality of the substrate, and brings inconvenience to subsequent work. Summary of the invention
  • the technical problem to be solved by the present invention is to provide a method and a device for drying a substrate under reduced pressure to solve the problem of decompression and drying spots existing in a vacuum drying process of a conventional substrate.
  • a method for drying a substrate under reduced pressure comprising the steps of: S1: placing a substrate in a sealed space;
  • the step S3 may include:
  • step S31 selecting one of the sealing zones as the first decompression zone for pumping and depressurizing; when the pressure in the first decompression zone is less than the set pressure value, proceeding to step S32;
  • step S32 if the first decompression zone has an adjacent sealing zone, the region formed by connecting the first decompression zone and the adjacent sealing zone of the first decompression zone is used as the first decompression zone. Go to step S33; Otherwise, there is no adjacent sealing zone in the first decompression zone, and the pumping is over;
  • the method further comprises: re-dividing the first decompression zone into the set sealing zone.
  • the step S4 may include:
  • step S41 selecting one of the sealing zones as the first drying zone for air drying, when the humidity in the first drying zone is less than the set humidity value, proceeding to step S42;
  • step S42 if the first drying zone has an adjacent sealing zone, the first drying zone and the first sealing zone adjacent to a sealing zone formed as a first drying zone, proceeds to step S43; Otherwise, the first drying zone has no adjacent sealing zone, and the drying ends, and the substrate is taken out from the sealed space;
  • a substrate vacuum drying apparatus for implementing the above method, wherein the apparatus comprises: a first baffle, a second baffle, a third baffle, a bottom plate, a sealing cover and a control panel a drying chamber for placing a substrate to be dried, wherein the first baffle, the second baffle, the third baffle, the bottom plate and the control panel form a rectangular groove, and the sealing cover is disposed opposite to the bottom plate One side for isolating the drying chamber from outside air; wherein the control board is used to control the drying process of the substrate.
  • control board is provided with slots at intervals.
  • the first baffle and the control panel are located on opposite sides of the drying chamber, it is preferable that the first baffle is provided with a groove corresponding to the groove on the control panel.
  • the second baffle is spaced apart from the groove.
  • the third baffle is provided with a slot corresponding to the slot on the second baffle.
  • the device further includes a spacer baffle for dividing the rectangular slot by a slot on the first baffle and a slot on the control board or a slot on the second baffle and a slot on the third baffle .
  • the isolation baffle is provided with a pressure control valve connected to both sides of the isolation baffle.
  • an air suction port is disposed between the slots on the control board.
  • a blowing port is provided between the slots on the control board.
  • a pressure sensor is disposed between the slots on the control board.
  • a humidity sensor is disposed between the slots on the control board.
  • control panel is provided with a control panel for monitoring the vacuum drying process.
  • an air pump is disposed in the control panel, one end of the air pump is connected to the control panel, and the other end of the air pump is connected to the air suction port and the air blowing port.
  • the drying chamber can be adjusted according to the shape of the substrate by a rectangular groove formed by the first baffle, the second baffle, the third baffle, the bottom plate and the control plate, and the substrate of various sizes can be dried under reduced pressure;
  • the first baffle, the second baffle, the third baffle and the control panel are correspondingly provided with slots for installing the isolating baffles, which can flexibly control the size of the sealing zone;
  • the adjacent sealing zone is connected and controlled by the pressure control valve, the structure of the cylinder is effective, the process is easy to control, and the pressure control valve is arranged with the cylinder;
  • the pumping port and the blowing port can be realized through one port, which reduces the cost and saves the control process
  • the method and apparatus of the present invention are not only suitable for vacuum drying of substrates, but also for other flat planar devices that require reduced pressure drying.
  • FIG. 1 is a flow chart of a method for drying a substrate under reduced pressure according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a substrate vacuum drying apparatus according to an embodiment of the present invention. detailed description
  • the present invention proposes a substrate decompression drying method and apparatus.
  • FIG. 1 A flow chart of the method of the present invention is shown in FIG. 1. Referring to the drawing, the method specifically includes the following steps: S1: placing the substrate in a sealed space.
  • Adjacent sequentially means that the substrate is divided into geometrically sealed regions of the cartridge in order to reduce the pressure according to the actual shape of the substrate, from left to right or from top to bottom.
  • the setting means that the surface on which the substrate is to be dried under reduced pressure is divided into the number of sealing regions in accordance with the actual substrate size.
  • S3 Pumping and decompressing the sealed area.
  • S3 can include the following steps:
  • step S31 Select one of the sealing zones as the first decompression zone for suction and decompression; and when the pressure in the first decompression zone is less than the set pressure value, proceed to step S32.
  • step S32 if the first decompression zone has an adjacent sealing zone, the region formed by connecting the first decompression zone and the adjacent sealing zone of the first decompression zone is used as the first decompression zone. Proceed to step S33; otherwise, the first decompression zone has no adjacent sealing zone, indicating that the substrate has been completely decompressed, and the pumping is completed, and the first decompression zone is re-divided into the set sealing zone. When the sealing zone is re-divided, the first decompression zone of this moment can be restored to the set sealing zone before the decompression and decompression.
  • step S33 The first decompression zone is evacuated and decompressed at this time.
  • the process returns to step S32.
  • step S33 the pressure in the first decompression zone formed after the communication increases, and then gradually decreases. The uniformity of pressure and humidity is ensured to the utmost, and the formation of spots under reduced pressure is avoided.
  • Step S4 The sealing zone is blown and dried, and the substrate is taken out from the sealed space.
  • Step S4 can further include the following steps:
  • S41 Select one of the sealing zones as the first drying zone for blow drying, and when the humidity in the first drying zone is less than the set humidity value, proceed to step S42.
  • S42 if the first drying zone has an adjacent sealing zone, the first drying zone and the first sealing zone adjacent to a sealing zone formed as a first drying zone, proceeds to step S43; Otherwise, there is no adjacent sealing zone in the first drying zone, indicating that the substrate has been completely dried, and the drying is completed, and the substrate is taken out from the sealed space.
  • step S43 The first drying zone at this time is blown and dried, and when the humidity in the first drying zone is less than the set humidity value, the process returns to step S42.
  • the process proceeds to step S43, the humidity in the first drying zone formed after the communication increases, and then gradually decreases.
  • an apparatus for implementing the above method is also provided.
  • the device includes:
  • control board 1 By the control board 1, the first baffle 2, the second baffle 3, the third baffle 4, the bottom plate 11, and the sealing cover
  • a closed drying chamber for placing the substrate to be dried
  • first baffle 2, the second baffle 3, the third baffle 4, the bottom plate 11 and the control panel 1 constitute a rectangular groove, and the sealing cover is disposed on a side opposite to the bottom plate 11 for The drying chamber is isolated from the outside air;
  • the control board 1 is used to control the drying process of the substrate.
  • the position of the first baffle 2, the second baffle 3 and the third baffle 4 in the drying chamber is adjustable to accommodate the shape of the substrate.
  • control panel 1 and the first shutter 2 are located on opposite sides of the drying chamber, and the second shutter 3 and the third shutter 4 are located on opposite sides of the drying chamber.
  • control board 1 and the first shutter 2 are correspondingly spaced apart from each other by a slot 6.
  • slot on the control board 1 and the slot on the first shutter 2 are arranged in parallel, and the number and spacing are also corresponding.
  • the second baffle 3 may be provided with a groove 6 at intervals.
  • the third baffle 4 may be provided with a groove 6 at intervals corresponding to the grooves on the second baffle 3.
  • the correspondence between the second baffle 3 and the third baffle 4 is the same as that between the control board 1 and the first baffle 2.
  • the apparatus further includes an isolation baffle 12 for passing through the slot 6 on the first baffle 2 and the slot 6 on the control board 1 or the slot 6 on the second baffle 3 and the third baffle 4
  • the groove 6 divides the rectangular groove to form an area of appropriate size for drying. In this way, the sealing area of the large-sized substrate is divided into d, and the drying area is decompressed and dried, which reduces the difficulty of the vacuum drying process and is easy to implement.
  • the isolation baffle 12 is provided with a pressure control valve 7 connected to both sides of the isolation baffle, and a pressure control valve 7 When connected, the sealing area on both sides of the isolation baffle 12 can be connected.
  • the pressure control valve 7 has a controllable pressure value which can be adjusted automatically or manually.
  • An air suction port 13 and a blow port 5 are provided between the slots 6 on the control board 1.
  • the air port 13 and the air port 5 can be implemented with one port.
  • a pressure sensor 9 and a humidity sensor 10 are disposed between the slots 6 on the control board 1.
  • the pressure sensor 9 and the humidity sensor 10 can be arranged at each interval between the slots 6 on the control board 1, and a few interval settings are also possible.
  • the control panel 1 is provided with a control panel 8 for monitoring the vacuum drying process.
  • An air pump (not shown) is disposed in the control panel 1, one end of the air pump is connected to the control panel 8; the other end of the air pump is connected to the air suction port 13 and the air blowing port 5 connections.
  • the air blowing port 5 When the air is depressurized, the air blowing port 5 is closed, and the air pumping port 13 communicates with the air pump to pump air from the inside of the substrate; when the air blowing is dry, the air pumping port 13 is closed, and the air blowing port 5 and the air pump are connected. Blowing is performed in the outward substrate.
  • the control board 1 is connected to an external power source.
  • the sealing cover is opened, and the substrate is placed on the bottom plate of the drying chamber so that the surface to be dried under reduced pressure corresponds to the sealing cover, and one side of the substrate is pressed against the control plate.
  • the substrate is divided into several sealing zones by the isolation baffle as needed (the isolation baffle is installed in the slot of the control board and the first baffle, the second baffle and the third baffle), and the spacer is adjusted The parameters of the pressure control valve. Finally, cover the sealing cover. At this time, a sealed space is formed by the sealing cover, the first flap, the second flap, the third flap, the bottom plate, and the control panel.
  • the isolation baffle further divides the sealed space into small sealed areas. Dividing a large-sized substrate into a small sealing zone for drying under reduced pressure reduces the difficulty of the vacuum drying process and is easy to implement.
  • the sealing zone is evacuated and decompressed.
  • the outermost sealing zone of the drying chamber is usually selected as the first decompression zone for suction and decompression. If you choose to depressurize from the middle seal area, you need to move the suction port and the blow port to the corresponding seal area.
  • the control panel on the control panel pumps the first decompression zone through the air pump and the suction port in the control panel, when the first decompression zone is in the first decompression zone.
  • the control pressure control valve opens the next adjacent seal zone, and so on, so that all seal zones are connected for decompression evacuation.
  • the uniformity of pressure and humidity is ensured to the utmost, and the formation of spots under reduced pressure is avoided.
  • the adjacent sealing zone is connected and controlled by the pressure control valve, the structural cylinder is effective, the process is easy to control, and the pressure control valve is arranged.
  • Pressure and humidity sensors provide real-time monitoring of pressure and humidity values in the seal area.
  • the pressure control valve on the isolation baffle between each sealing zone needs to be closed to reconstitute the sealing zone, and then the air drying process is performed.
  • blowing drying process and the pumping and depressurizing process are not described here.
  • the method and apparatus of the embodiment of the present invention by drying the large-sized substrate in a staged manner, it is ensured that the exhaust gas is uniform in a small area at each stage, and by changing the reduced-pressure drying method, high-quality light is avoided.
  • the demand for engraving reduces the cost of materials.
  • this method meets the tact time of a single product, greatly reducing the generation of decompressed dry spots and improving product quality.

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Abstract

一种基板减压干燥方法及装置。首先将基板置于密封空间；然后将所述基板的待干燥面划分为设定个密封区；之后对所述密封区抽气减压；最后对所述密封区吹起干燥，从密封空间取出基板。该方法能够对各种尺寸的基板进行减压干燥；保证了压力和湿度均匀，避免了减压干燥斑点的形成。

Description

一种基板减压干燥方法及装置 技术领域
本发明涉及基板制造技术领域,特别涉及一种基板减压干燥方法及装置。 背景技术
目前的减压干燥（VCD )设备的排气孔设置有两种方式， 一种是中心排 气， 另一种是四周排气。但无论哪种排气方式， 对于大尺寸的玻璃基板来说， 会由于排气孔数量少及分布问题， 造成排气不均匀。 此外， 由于光刻胶本身 的流动性较差， 导致基板表面的气流不均， 基板表面的湿度不同等原因， 在 减压干燥后， 会产生减压干燥斑点， 最常见的是类似月牙形的斑点。 目前业 内无法对减压干燥的斑点进行有效控制， 增加了基板质量的误判率， 不利于 对基板质量的检测， 影响了基板的品质， 给后续工作带来不便。 发明内容
(一）要解决的技术问题
本发明要解决的技术问题是提供一种基板减压干燥方法及装置， 以解决 现有基板减压干燥过程中存在的减压干燥斑点的问题。
(二）技术方案
根据本发明实施例， 提供了一种基板减压干燥方法， 其包括以下步骤： S1 : 将基板置于密封空间；
S2: 将所述基板的待干燥面划分为设定个密封区；
S3: 对所述密封区抽气减压；
S4: 对所述密封区吹气干燥， 从密封空间取出基板。
优选， 所述步骤 S3可以包括：
S31 : 选择一个所述密封区作为第一减压区进行抽气减压； 当所述第一 减压区内的压力小于设定压力值时进入步骤 S32;
S32: 若第一减压区有相邻的密封区， 则将所述第一减压区和所述第一 减压区相邻的一个密封区连通后形成的区域作为第一减压区，进入步骤 S33; 否则， 第一减压区没有相邻的密封区， 抽气结束；
S33: 对此时的第一减压区进行抽气减压， 当第一减压区内的压力小于 所述设定压力值时， 返回步骤 S32。
更优选地， 在所述步骤 S32中， 抽气结束之后还包括： 将第一减压区重 新划分为所述设定个密封区。
优选， 所述步骤 S4可以包括：
S41 : 选择一个所述密封区作为第一干燥区进行吹气干燥， 当所述第一 干燥区内的湿度小于设定湿度值时进入步骤 S42;
S42: 若第一干燥区有相邻的密封区， 则将所述第一干燥区和所述第一 干燥区相邻的一个密封区连通后形成的区域作为第一干燥区，进入步骤 S43; 否则， 第一干燥区没有相邻的密封区， 干燥结束， 从密封空间取出基板；
S43: 对此时的第一干燥区进行吹气干燥， 当第一干燥区内的湿度小于 所述设定湿度值时， 返回步骤 S42。
根据本发明实施例， 还提供一种实施上述方法的基板减压干燥装置， 其 中， 该装置包括： 由第一挡板、 第二挡板、 第三挡板、 底板、 密封盖和控制 板围成的干燥仓， 用于放置待干燥的基板， 其中所述第一挡板、 第二挡板、 第三挡板、 底板和控制板构成矩形槽， 所述密封盖设置在与所述底板相反的 一侧， 用于将所述干燥仓和外部空气隔绝； 其中所述控制板用于控制基板的 干燥过程。
优选， 所述控制板上间隔设置有槽。
在所述第一挡板和控制板位于所述干燥仓的相反两侧的情况下， 优选所 述第一挡板上对应所述控制板上的槽间隔地设置有槽。
优选所述第二挡板上间隔设置有槽。
优选， 所述第三挡板对应所述第二挡板上的槽间隔地设置有槽。
优选， 所述装置还包括隔离挡板， 用于通过所述第一挡板上的槽和控制 板上的槽或第二挡板上的槽和第三挡板上的槽划分所述矩形槽。
优选， 所述隔离挡板上设有连通隔离挡板两侧的压力控制阀。
优选， 所述控制板上的槽之间设有抽气端口。
优选， 所述控制板上的槽之间设有吹气端口。
优选， 所述控制板上的槽之间设有压力传感器。 优选， 所述控制板上的槽之间设有湿度传感器。
优选， 所述控制板上设有用于监控减压干燥过程的控制面板。
优选， 所述控制板内设有空气泵， 所述空气泵的一端与所述控制面板连 接； 所述空气泵的另一端与所述抽气端口和吹气端口连接。
(三)有益效果
根据本发明不同实施例， 可以实现以下优点中的一个或多个：
1.将大尺寸的基板划分小的密封区进行减压干燥， 降低了减压干燥过程 的难度， 易于实现；
2.对密封区逐个进行减压 /干燥， 最大限度地保证了压力和湿度的均匀， 避免了减压干燥斑点的形成；
3. 干燥仓可通过第一挡板、 第二挡板、 第三挡板、 底板和控制板构成的 矩形槽可根据基板的形状进行调整， 能对各种尺寸的基板进行减压干燥；
4. 第一挡板、 第二挡板、 第三挡板和控制板上对应设置有用于安装隔离 挡板的槽， 可以对密封区的大小灵活控制；
5.相邻的密封区通过压力控制阀进行连通控制， 结构筒单有效， 过程容 易控制， 压力控制阀设置筒单；
6.抽气端口和吹气端口可以通过一个端口实现， 减少了成本， 节约了控 制流程；
7.控制板上的槽之间设有压力传感器和湿度传感器，能够实时对密封区 内的压力值和湿度值进行监控；
8.本发明的方法和装置不仅适用于对基板的减压干燥， 也适用于其他需 要减压干燥的有平整平面的器件。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1是根据本发明实施例的基板减压干燥方法的流程图； 以及
图 2是根据本发明实施例的基板减压干燥装置的结构示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
为了解决现有基板减压干燥过程中存在的干燥斑的问题， 本发明提出了 一种基板减压干燥方法及装置。
本发明方法的流程图如图 1所示，参照图示，该方法具体包括以下步骤： S1 : 将基板置于密封空间。
S2: 将所述基板的待干燥面划分为依次相邻的设定个密封区。
依次相邻是指根据基板的实际形状， 按从左到右或从上到下等方式， 将 基板划分为筒单的几何形密封区以便减压干燥。 设定个是指根据实际的基板 尺寸将基板要减压干燥的面划分为密封区的数量。
S3: 对所述密封区抽气减压。 S3可以包括以下步骤：
S31 : 选择一个所述密封区作为第一减压区进行抽气减压； 当所 述第一减压区内的压力小于设定压力值时进入步骤 S32。
S32: 若第一减压区有相邻的密封区， 则将所述第一减压区和所 述第一减压区相邻的一个密封区连通后形成的区域作为第一减压区， 进入步 骤 S33; 否则， 第一减压区没有相邻的密封区， 说明基板已经全部减压过了， 抽气结束， 将第一减压区重新划分为所述设定个密封区。 其中重新划分密封 区时， 可以将此刻的第一减压区恢复成抽气减压前的设定个密封区即可。
S33: 对此时的第一减压区进行抽气减压， 当第一减压区内的压 力小于所述设定压力值时， 返回步骤 S32。 进入步骤 S33时， 连通后形成的 第一减压区内的压力会升高， 然后再逐渐降低。 最大限度地保证了压力和湿 度的均匀， 避免了减压干燥斑点的形成。
S4: 对所述密封区吹气干燥， 从密封空间取出基板。 步骤 S4 又可以包 括以下步骤：
S41 : 选择一个所述密封区作为第一干燥区进行吹气干燥， 当所 述第一干燥区内的湿度小于设定湿度值时进入步骤 S42。 S42: 若第一干燥区有相邻的密封区， 则将所述第一干燥区和所 述第一干燥区相邻的一个密封区连通后形成的区域作为第一干燥区， 进入步 骤 S43; 否则， 第一干燥区没有相邻的密封区， 说明基板已经全部干燥过了， 干燥结束， 从密封空间取出基板。
S43: 对此时的第一干燥区进行吹气干燥， 当第一干燥区内的湿 度小于所述设定湿度值时， 返回步骤 S42。 进入步骤 S43时， 连通后形成的 第一干燥区内的湿度会升高， 然后再逐渐降低。
根据本发明实施例， 还提供一种实现上述方法的装置。 如图 2所示， 该 装置包括：
由控制板 1、 第一挡板 2、 第二挡板 3、 第三挡板 4、 底板 11、 和密封盖
(图中未示出） 围成的干燥仓， 用于放置待干燥的基板，
其中所述第一挡板 2、 第二挡板 3、 第三挡板 4、 底板 11和控制板 1构 成矩形槽，所述密封盖设置在与所述底板 11相反的一侧，用于将所述干燥仓 和外部空气隔绝；
其中所述控制板 1用于控制基板的干燥过程。
第一挡板 2、 第二挡板 3和第三挡板 4在干燥仓内的位置可调， 以适应 基板的形状。
在图 2所示的示例中， 所述控制板 1与第一挡板 2位于干燥仓的相反两 侧， 第二挡板 3和第三挡板 4位于干燥仓的相反两侧。
如图 2所示， 控制板 1和第一挡板 2上对应地间隔设置有槽 6。 对应是 指控制板 1上的槽和第一挡板 2上的槽之间平行设置， 数量和间距也对应相 等。
所述第二挡板 3上可以间隔设置有槽 6。 所述第三挡板 4可以对应所述 第二挡板 3上的槽也间隔地设置有槽 6。 第二挡板 3和第三挡板 4之间的对 应关系同控制板 1和第一挡板 2之间的对应关系。
所述装置还包括隔离挡板 12,用于通过所述第一挡板 2上的槽 6和控制 板 1上的槽 6或第二挡板 3上的槽 6和第三挡板 4上的槽 6划分所述矩形槽， 以形成大小适当的区域进行干燥。 这样就将大尺寸的基板划分 d、的密封区进 行减压干燥， 降低了减压干燥过程的难度， 易于实现。
所述隔离挡板 12上设有连通隔离挡板两侧的压力控制阀 7,压力控制阀 7开启时能连通隔离挡板 12两侧的密封区。 该压力控制阀 7的压力值可控， 可通过自动或手动方式调节。
所述控制板 1上的槽 6之间设有抽气端口 13和吹气端口 5。吹气端口 13 和抽气端 5口可用一个端口实现。
所述控制板 1上的槽 6之间设有压力传感器 9和湿度传感器 10。压力传 感器 9和湿度传感器 10可在控制板 1上的槽 6之间的每个间隔设置，也可选 择几个间隔设置。
所述控制板 1上设有用于监控减压干燥过程的控制面板 8。
所述控制板 1内设有空气泵（图中未示出 ),所述空气泵的一端与所述控 制面板 8连接； 所述空气泵的另一端与所述抽气端口 13和吹气端口 5连接。 当抽气减压时，吹气端口 5封闭，抽气端口 13和空气泵连通从基板内向外进 行抽气； 当吹气干燥时，抽气端口 13封闭， 吹气端口 5和空气泵连通从外向 基板内进行吹气。 所述控制板 1和外部电源连接。
根据本发明实施例的上述装置的具体操作过程为：
首先， 打开密封盖， 将基板放在干燥仓的底板上， 使得需要减压干燥的 面对应密封盖， 并使基板的一个边靠紧控制板。 调整第一挡板、 第二挡板和 第三挡板的位置和尺寸使得调整第一挡板、 第二挡板、 第三挡板、 底板和控 制板紧密接触（各部件连接处能隔绝空气）。 这样能适应各种基板的形状， 能 对各种尺寸的基板进行减压干燥。 按需要通过隔离挡板将基板划分为几个密 封区 （隔离挡板安装在控制板和第一挡板、 第二挡板和第三挡板上的槽里）, 并调整隔离挡板上的压力控制阀的参数。 最后， 将密封盖盖上。 此时， 通过 密封盖、 第一挡板、 第二挡板、 第三挡板、 底板和控制板形成了密封空间。 隔离挡板又将密封空间划分为小的密封区。 将大尺寸的基板划分小的密封区 进行减压干燥， 降低了减压干燥过程的难度， 易于实现。
然后， 对密封区进行抽气减压。 通常选择干燥仓最外侧的密封区作为第 一减压区进行抽气减压。 若选择从中间的密封区进行减压， 则需要将抽气端 口和吹气端口移动到相应的密封区。 当选择最外侧作为第一减压区抽气减压 时， 控制板上的控制面板通过控制板内的空气泵和抽气端口对第一减压区进 行抽气，当第一减压区内的压力传感器检测到压力值小于设定的压力阈值时， 控制第一减压区和第一减压区相邻的一个密封区之间的隔离挡板上的压力控 制阀打开， 使得第一减压区和该密封区形成联通区进行抽气减压， 此时， 第 一减压区内的压力值会升高，和第一减压区相邻的密封区内的压力值会降低， 最后两个区内的压力值相等并同时降低。 当压力传感器测得压力值小于设定 的压力阈值时， 控制压力控制阀打开下一个相邻的密封区， 以此类推， 使得 所有的密封区都连通进行减压抽气。 最大限度地保证了压力和湿度的均匀， 避免了减压干燥斑点的形成。 相邻的密封区通过压力控制阀进行连通控制， 结构筒单有效， 过程容易控制， 压力控制阀设置筒单。 压力传感器和湿度传 感器， 能够实时对密封区内的压力值和湿度值进行监控。
抽气减压完成后， 需要将各个密封区之间的隔离挡板上的压力控制阀闭 合， 重新构成密封区， 之后再进行吹气干燥过程。
吹气干燥过程和抽气减压过程， 此处不再赘述。
根据本发明实施例的方法和装置， 通过将大尺寸的基板， 分阶段的进行 减压干燥， 保证在每个阶段的小区域内排气均匀， 通过改变减压干燥方式， 避免了对高品质光刻胶的需求， 降低了材料成本， 同时该方式满足单件产品 生产时间 （tact time ), 极大降低了减压干燥斑点的产生， 提高了产品品质。
以上实施方式仅用于说明本发明， 而并非对本发明的限制， 有关技术领 域的普通技术人员， 在不脱离本发明的精神和范围的情况下， 还可以做出各 种变化和变型， 因此所有等同的技术方案也属于本发明的范畴， 本发明的专 利保护范围应由权利要求限定。

Claims

权利要求书
1、 一种基板减压干燥方法， 其中， 该方法包括以下步骤：
S1 : 将基板置于密封空间；
S2: 将所述基板的待干燥面划分为设定个密封区；
S3: 对所述密封区抽气减压；
S4: 对所述密封区吹气干燥， 从密封空间取出基板。
2、 如权利要求 1所述的方法， 其中， 所述步骤 S3包括：
S31 : 选择一个所述密封区作为第一减压区进行抽气减压； 当所述第一 减压区内的压力小于设定压力值时进入步骤 S32;
S32: 若第一减压区有相邻的密封区， 则将所述第一减压区和所述第一 减压区相邻的一个密封区连通后形成的区域作为第一减压区，进入步骤 S33； 否则， 第一减压区没有相邻的密封区， 抽气结束；
S33: 对此时的第一减压区进行抽气减压， 当第一减压区内的压力小于 所述设定压力值时， 返回步骤 S32。
3、 如权利要求 2所述的方法， 其中， 在所述步骤 S32中， 抽气结束之 后还包括： 将第一减压区重新划分为所述设定个密封区。
4、 如权利要求 3所述的方法， 其中， 所述步骤 S4包括：
S41 : 选择一个所述密封区作为第一干燥区进行吹气干燥， 当所述第一 干燥区内的湿度小于设定湿度值时进入步骤 S42;
S42: 若第一干燥区有相邻的密封区， 则将所述第一干燥区和所述第一 干燥区相邻的一个密封区连通后形成的区域作为第一干燥区，进入步骤 S43; 否则， 第一干燥区没有相邻的密封区， 干燥结束， 从密封空间取出基板； S43: 对此时的第一干燥区进行吹气干燥， 当第一干燥区内的湿度小于 所述设定湿度值时， 返回步骤 S42。
5、一种实现权利要求 1所述方法的基板减压干燥装置， 其中， 该装置包 括：
由第一挡板、 第二挡板、 第三挡板、 底板、 密封盖和控制板围成的干燥 仓， 用于放置待干燥的基板，
其中所述第一挡板、 第二挡板、 第三挡板、 底板和控制板构成矩形槽， 所述密封盖设置在与所述底板相反的一侧， 用于将所述干燥仓和外部空气隔 绝；
其中所述控制板用于控制基板的干燥过程。
6、 如权利要求 5所述的装置， 其中， 所述控制板上间隔设置有槽。
7、如权利要求 6所述的装置， 其中， 所述第一挡板和控制板位于所述干 燥仓的相反两侧， 并且所述第一挡板上对应所述控制板上的槽设置有槽。
8、 如权利要求 7所述的装置， 其中， 所述第二挡板上间隔设置有槽。
9、如权利要求 8所述的装置， 其中， 所述第三挡板对应所述第二挡板上 的槽设置有槽。
10、 如权利要求 7或 9所述的装置， 其中， 所述装置还包括隔离挡板， 用于通过所述第一挡板上的槽和控制板上的槽或第二挡板上的槽和第三挡板 上的槽划分所述矩形槽。
11、如权利要求 10所述的装置， 其中， 所述隔离挡板上设有连通隔离挡 板两侧的压力控制阀。
12、 如权利要求 6-11所述的装置， 其中， 所述控制板上的槽之间设有抽 气端口。
13、 如权利要求 6-12所述的装置， 其中， 所述控制板上的槽之间设有吹 气端口。
14、 如权利要求 6-13所述的装置， 其中， 所述控制板上的槽之间设有压 力传感器。
15、 如权利要求 6-14所述的装置， 其中， 所述控制板上的槽之间设有湿 度传感器。
16、 如权利要求 6-15所述的装置， 其中， 所述控制板上设有用于监控减 压干燥过程的控制面板。
17、 如权利要求 6-16所述的装置， 其中， 所述控制板内设有空气泵， 所 述空气泵的一端与所述控制面板连接； 所述空气泵的另一端与所述抽气端口 和吹气端口连接。
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