WO2019117302A1 - Agent adhésif temporaire à base d'eau et procédé pour la fabrication dudit agent adhésif temporaire à base d'eau, et procédé pour la fabrication de divers éléments ou composants à l'aide dudit agent adhésif temporaire à base d'eau - Google Patents

Agent adhésif temporaire à base d'eau et procédé pour la fabrication dudit agent adhésif temporaire à base d'eau, et procédé pour la fabrication de divers éléments ou composants à l'aide dudit agent adhésif temporaire à base d'eau Download PDF

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Publication number
WO2019117302A1
WO2019117302A1 PCT/JP2018/046165 JP2018046165W WO2019117302A1 WO 2019117302 A1 WO2019117302 A1 WO 2019117302A1 JP 2018046165 W JP2018046165 W JP 2018046165W WO 2019117302 A1 WO2019117302 A1 WO 2019117302A1
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Prior art keywords
water
adhesive
metal ion
performance
less
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PCT/JP2018/046165
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English (en)
Japanese (ja)
Inventor
邦彦 小田切
Original Assignee
株式会社Dnpファインケミカル
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Application filed by 株式会社Dnpファインケミカル filed Critical 株式会社Dnpファインケミカル
Priority to JP2019502109A priority Critical patent/JP6535427B1/ja
Priority to CN201880072975.1A priority patent/CN111328340B/zh
Publication of WO2019117302A1 publication Critical patent/WO2019117302A1/fr

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02Polyalkylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • C09J201/02Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/06Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a water based temporary tack adhesive.
  • Adhesives include various members and parts used in various applications such as home appliances, office equipment, information appliances, various electronic appliances such as home electric appliances, optical instruments, medical instruments, automobile appliances etc. It is used in various applications up to various industrial applications such as the production of “a bonded object”. It is needless to say that the originally required performance of the adhesive is adhesion performance, but depending on the application, it exhibits adhesion performance when temporarily fixing one or more members and parts, and then peels off after that. The performance which exhibits exfoliation performance (Hereafter, it may be called "temporary tack performance”.) May be called for.
  • an optical lens used in an optical device is temporarily fixed to a support and subjected to various mechanical processing such as cutting, polishing, cutting, grinding, and drilling to form a predetermined shape and surface property,
  • an adhesive used in the production of an optical lens, which is produced by peeling from the support is required to have temporary tack performance.
  • Temporary tack adhesive In mechanical processing of a member such as a wafer, which is a member for a semiconductor device used in an electronic device or the like, the member is temporarily fixed to a support, and cut, polished, cut as in the production of the optical lens. , And various mechanical processes such as grinding and drilling to form a predetermined shape and surface property, and then peeling off from the support to produce a method (for example, Patent Document 1), which is used for this Temporary adhesive performance is also required for such adhesives.
  • various machines such as sapphire, gallium arsenide, quartz, magnetic members, metal members, glass members, resin members, members for semiconductor devices, etc. such as cutting, polishing, cutting, grinding, drilling, etc.
  • an adhesive having temporary tack performance hereinafter, may be referred to as "temporary tack adhesive" may be used.
  • the temporary fixing adhesive described in Patent Document 1 is an organic solvent-based adhesive containing a cycloolefin polymer and a UV absorber, and therefore, is removed using another organic solvent when peeling off the adherend. Or need to be removed using an oxidizing detergent such as a strong acid.
  • an oxidizing detergent such as a strong acid.
  • Patent Document 2 describes a water-peelable energy ray-curable adhesive containing a water-soluble resin having a cationic photopolymerizable oxirane ring, etc. When such a water-based tackiness adhesive is used, Peeling of the adherend can be easily performed by immersion in water or warm water.
  • the temporary tacking adhesive used for temporarily fixing various members and parts such as optical lenses and wafers incorporated in optical instruments and electronic instruments etc. contaminates due to the process of producing raw materials and adhesives, etc. Substances such as particles, metal ions, corrosive ions, and organic substances may be contained. As a result, the reliability of various members and parts may be reduced and the manufacturing yield may be reduced. However, until now, the frequency is extremely small and has not become a major problem. However, along with the progress in thinning, downsizing, and weight reduction of various members and parts along with thinning, downsizing, and weight reduction of portable devices such as mobile phones in recent years, the influence of these contaminants is more significant.
  • the present invention has been made under such circumstances, and it is an aqueous temporary tacking adhesive having both coating performance and anti-repellent performance together with excellent tacking performance, various members and parts used for optical devices, electronic devices, etc.
  • Water-based temporary tacking adhesive having an ability to control the deterioration of the function, water-based temporary tacking adhesive having coating performance and safety performance with excellent temporary tacking performance and low environmental impact, and the water-based temporary tacking adhesive It is an object of the present invention to provide a method of manufacturing various members or parts.
  • the inventor of the present invention can use a thermoplastic resin having a hydroxyl group as a water-based adhesive, and exhibits temporary tacking performance combining adhesion performance and peeling performance. It has been found that the above-mentioned problems can be solved by the invention relating to a water-based temporary tacking adhesive containing at least (A) a thermoplastic resin having a hydroxyl group. That is, the present invention provides an aqueous temporary tacking adhesive and the like having the following constitution.
  • thermoplastic resin which has (A) a hydroxyl group, (B) surface-control agent, and (C) compatibilizer, and whose melting
  • thermoplastic resin having a hydroxyl group Containing at least (A) a thermoplastic resin having a hydroxyl group, the total content of sodium metal ion, aluminum metal ion, iron metal ion, zinc metal ion, copper metal ion, nickel metal ion, chromium metal ion and lead metal ion is 3000 ppb
  • the water-based tackiness adhesive according to any of the following, wherein the content of each of sodium metal ion, iron metal ion, zinc metal ion and copper metal ion is 1,000 ppb or less. 3.
  • a water based temporary tacking adhesive having a coating performance and a repelling prevention performance as well as excellent temporary tacking performance, and a water system temporary tacking performance of various members and parts used in optical devices, electronic devices, etc.
  • Patent application title Water-based tacking adhesive which has a coating adhesive and safety performance as well as a tacking adhesive, excellent tacking performance and low environmental impact, and a method of manufacturing various members or parts using the water-based tacking adhesive Can be provided.
  • the water-based temporary tacking adhesive of the present invention can be used as a water-based adhesive, and includes a thermoplastic resin having a hydroxyl group (A) that exhibits tacking performance combining adhesion performance and peeling performance.
  • the following first to third water-based tackiness adhesives are characterized in that they have excellent tackiness even though they are adhesives.
  • First water-based tackiness adhesive (A) thermoplastic resin having a hydroxyl group, (B) a surface conditioner, and (C) a compatibilizer, and having a melting point of 30 measured according to JIS K 0064: 1992
  • Water-based tackiness adhesive which is at least Second water-based temporary tacking adhesive: containing a thermoplastic resin having at least (A) hydroxyl group, sodium metal ion, aluminum metal ion, iron metal ion, zinc metal ion, copper metal ion, nickel metal ion, chromium metal ion And a water-based tackiness adhesive wherein the total content of lead metal ions is 3,000 ppb or less and the contents of sodium metal ions, iron metal ions, zinc metal ions, and copper metal ions are each 1,000 ppb or less.
  • Third aqueous temporary tacking adhesive (A) a thermoplastic resin having a hydroxyl group, and (B) a solvent containing water, wherein the content of water in the solvent is 95% by mass or more, 25
  • water-based tackiness adhesive which is 20 mN / m or more and 55 mN / m or less in surface tension in (degreeC), and whose adhesive strength is 0.1 Mpa or more and 20 Mpa or less.
  • the first aqueous temporary tacking adhesive will be described below.
  • the first aqueous temporary tacking adhesive of the present invention comprises (A) a thermoplastic resin having a hydroxyl group, (B) a surface conditioner, and (C) a compatibilizer, and is measured according to JIS K 0064: 1992. The melting point is 30 ° C. or higher.
  • component (A) A thermoplastic resin having a hydroxyl group (hereinafter sometimes referred to as “component (A)”) is a component that exhibits temporary tacking performance mainly having adhesion performance and peeling performance
  • component (B) The surface conditioner (hereinafter sometimes referred to as “component (B)”) is a component that mainly exhibits coating performance
  • component (C) a compatibilizer (hereinafter referred to as “component (C)”) Is a component that exhibits anti-slip performance mainly by improving the compatibility between the component (A) and the component (B).
  • component (C) a compatibilizer
  • the coating performance resulting from the compatibility between the temporary adhesive and the adherend due to the difference in the material, surface characteristics, etc. By improving the heat resistance to heat generation during mechanical processing, the occurrence of positional deviation and peeling of the adherend to the support during processing is suppressed, adhesion performance is improved, and temporary properties of various adherends are also improved.
  • the versatility which can respond to a stop is also obtained.
  • thermoplastic resin having a hydroxyl group contained in the first water-based tackiness adhesive of the present invention is a component that exhibits tackiness having mainly adhesion performance and peeling performance.
  • the resin contained in the thermoplastic resin having a hydroxyl group (A) is not particularly limited as long as it is a thermoplastic resin having a hydroxyl group in the molecule, but a resin having a melting point of 30 ° C. or more is preferable.
  • the melting point of the resin contained in the thermoplastic resin having a hydroxyl group is 30 ° C.
  • the melting point of the first aqueous temporary tacking adhesive of the present invention tends to be 30 ° C. or more. Also improves the quality.
  • the melting point of the resin contained in the thermoplastic resin having a hydroxyl group (A) is more preferably 35 ° C. or more, still more preferably 37 ° C., still more preferably 40 ° C. or more, particularly preferably 43 ° C. It is above.
  • the upper limit is preferably 200 ° C. or less, more preferably 180 ° C. or less, still more preferably 160 ° C. or less, still more preferably 120 ° C. or less, particularly preferably 100 ° C. or less.
  • the melting point of the component (A) means the melting end point measured in accordance with JIS K 0064: 1992. The specific measurement will be described later.
  • the number average molecular weight of the resin contained in the thermoplastic resin having a hydroxyl group is preferably 800 or more, more preferably 1,000 or more, from the viewpoint of improving the coating performance and the anti-slip performance together with the temporary tacking performance.
  • the upper limit is preferably 1,200 or more, particularly preferably 1,400 or more, and the upper limit is preferably 25,000 or less, more preferably 20,000 or less, still more preferably 15,000 or less, particularly preferably 10,000 or less is there.
  • the number average molecular weight is measured by gel permeation chromatography (GPC method) using polystyrene as a standard substance.
  • thermoplastic resin having a hydroxyl group (A) having the above properties a thermoplastic resin having an oxyalkylene group is preferably mentioned from the viewpoint of obtaining more excellent temporary tacking performance, and a kind of oxyalkylene group It is more preferable that it is resin which makes these structural units.
  • the oxyalkylene group preferably has 1 or more carbon atoms, more preferably 2 or more carbon atoms, and has an upper limit of 12 or less, more preferably 8 or less, still more preferably 4 or less. Particularly preferably, 3 or less are mentioned.
  • the number of repeating units of the oxyalkylene group is preferably 10 or more, more preferably 30 or more, still more preferably 50 or more, and the upper limit is preferably 500 or less, more preferably 300 or less, still more preferably 150 or less. .
  • thermoplastic resin having an oxyalkylene group include polyalkylene glycol, polyoxyalkylene ester, polyoxyalkylene alkyl ether and polyoxyalkylene alkyl aryl ether, and more preferable is polyalkylene glycol, Polyoxyalkylene esters and polyoxyalkylene alkyl ethers are preferable, polyalkylene glycols and polyoxyalkylene esters are more preferable, and polyalkylene glycols are particularly preferable.
  • thermoplastic resins can be used alone or in combination of two or more.
  • Preferred polyalkylene glycols include polyethylene glycol, polypropylene glycol, polybutylene glycol and the like, polyethylene glycol and polypropylene glycol are more preferred, and polyethylene glycol is more preferred.
  • Preferred examples of the polyoxyalkylene ester include esters of fatty acids having 12 to 24 carbon atoms, and more specifically, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol monooleate, polypropylene glycol mono Preferred examples include polyoxyalkylene monoesters such as laurate, polypropylene glycol monostearate and polypropylene glycol monooleate, and polyoxyalkylene diesters such as polyethylene glycol distearate and polyethylene glycol dioleate, and polyoxyalkylene monoesters. More preferred is polyoxyethylene monoester, and more preferred is polyoxyethylene monostearate.
  • the polyoxyalkylene alkyl ether is preferably one having an alkyl group having 12 to 24 carbon atoms, and more specifically, polyoxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxypropylene oleyl ether, Polyoxypropylene lauryl ether etc. are mentioned preferably.
  • the polyoxyalkylene alkyl aryl ether preferably includes those having an alkyl aryl group having 12 to 24 carbon atoms, and more specifically, polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether, polyoxy Propylene octyl phenyl ether, polyoxypropylene nonyl phenyl ether and the like are preferably mentioned.
  • thermoplastic resin having a hydroxyl group (A) a resin having a predetermined melting point and a number average molecular weight exemplified above, a resin having an oxyalkylene group, and a kind of oxyalkylene group as a structural unit It is preferable to include at least a resin and the like, and it may include ones other than the resins exemplified above, but it is preferable that all the contained resins are the resins exemplified above.
  • thermoplastic resin having one or more hydroxyl groups may be used as the thermoplastic resin having a hydroxyl group (A), from the viewpoint of improving the coating performance and the anti-slip performance as well as the temporary tacking performance. It is also possible to use species or more of thermoplastic resins, such as two or more species of polyalkylene glycols different in number average molecular weight.
  • polyalkylene glycol A a polyalkylene glycol having a number average molecular weight of 800 to less than 5,000
  • polyalkylene glycol B a polyalkylene glycol having a number average molecular weight of 800 to less than 5,000
  • polyethylene glycol having a number average molecular weight of 800 to less than 5,000 a polyethylene glycol having a number average molecular weight of 800 to less than 5,000
  • number average molecular weight of 5,000 to 10 It is more preferable to combine 000 000 or less polyethylene glycol.
  • the blending ratio (mass ratio) of polyalkylene glycol A and polyalkylene glycol B is preferably 10:90 to 90:10, more preferably 15:85 to 85:15, still more preferably 20:80 to 80:20. It is.
  • the compounding ratio is within the above range, the film thickness of the coating film of the aqueous temporary tacking adhesive can be easily secured, and a more stable adhesion performance can be obtained, and the temporary tacking performance is improved, and the coating performance and repelling Preventive performance also improves.
  • the content of the (A) hydroxyl group-containing thermoplastic resin in the aqueous temporary tacking adhesive is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 12% by mass or more, particularly preferably 15% by mass
  • the upper limit is preferably 50% by mass or less, more preferably 47% by mass or less, still more preferably 45% by mass or less, and particularly preferably 42% by mass or less.
  • the surface conditioning agent (B) contained in the first water-based temporary tacking adhesive of the present invention is a component that exhibits mainly the coating performance, in particular, the coating performance to an adherend such as a wafer.
  • a surface conditioner, a surface conditioner, and a leveling agent having the ability to eliminate defects in the coating film caused due to the change in viscosity, the change in surface tension, and the generation of bubbles as the molecular weight increases.
  • a wetting agent or an antifoaming agent it can be used without particular limitation, and examples thereof include acrylics, vinyls, silicones, fluorines, celluloses, natural waxes, and water-soluble organic compounds.
  • surfactants are also preferably mentioned. Among these, surfactants, among which nonionic surfactants are preferable.
  • nonionic surfactants acetylene surfactants having an acetylene bond such as acetylene alcohol surfactants, acetylene glycol surfactants, fluorine surfactants, fatty acid monoglycerides, sorbitan fatty acid esters And nonionic surfactants such as sucrose fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene-added acetylene glycol and the like.
  • acetylene-based surfactants having an acetylene bond such as acetylene alcohol-based surfactants and acetylene glycol-based surfactants, and fluorine-based surfactants are preferable, and acetylene-based surfactants are more preferable.
  • the above-mentioned ones can be used alone or in combination of two or more.
  • an acetylene-based surfactant having an acetylene bond such as an acetylene alcohol-based surfactant or an acetylene glycol-based surfactant
  • an acetylene alcohol-based surfactant represented by the following general formula (1) an acetylene alcohol-based surfactant represented by the following general formula (1)
  • the acetylene glycol type-surfactant shown by General formula (2) is mentioned preferably.
  • R 11 and R 12 each independently represent a hydrocarbon group having 1 to 8 carbon atoms
  • a 11 represents a single bond or an oxyalkylene group having 1 to 30 repeating units.
  • R 21 , R 22 , R 23 and R 24 each independently represent a hydrocarbon group having 1 to 8 carbon atoms
  • a 21 and A 22 each independently represent a single bond or a repeat.
  • the unit number is 1 or more and 30 or less oxyalkylene group.
  • Examples of the hydrocarbon group R 11, R 12, R 21 , R 22, R 23 and R 24, an alkyl group, an alkenyl group, and the like, more preferably an alkyl group, these hydrocarbon groups may be linear It may be branched.
  • as an upper limit of carbon number six or less are preferable and four or less are more preferable.
  • the acetylene alcohol surfactant represented by the above general formula (1) is an alkylene oxide adduct of acetylene alcohol
  • the acetylene glycol surfactant represented by the above general formula (2) is an alkylene oxide adduct of acetylene glycol.
  • the number of repeating units of A 11 , A 21 and A 22 is preferably 2 or more, more preferably 3 or more, and the upper limit is preferably 24 or less, more preferably 12 or less, still more preferably 8 or less, particularly preferably 6 or less.
  • the oxyalkylene group of A 11 , A 21 and A 22 preferably has 1 or more carbon atoms, more preferably 2 or more carbon atoms, and has an upper limit of 12 or less carbon atoms, more preferably Those having 8 or less, more preferably 4 or less, particularly preferably 3 or less can be mentioned.
  • the alkylene group may be linear or branched.
  • a 11, A 21 and the number of repeating units A 22 is 2 or more, plural A 11, A 21 and A 22 may be the same or different.
  • a 11 may be one and the oxyethylene groups and oxypropylene groups linked, A 21 and A 22 is the same.
  • acetylene glycol-based surfactants represented by the general formula (2) are preferable, and at least one of A 21 and A 22 is an oxyalkylene group having 1 to 30 repeating units.
  • An alkylene oxide adduct of an acetylene glycol is more preferable, and an alkylene oxide adduct of an acetylene glycol of an oxyalkylene group in which A 21 and A 22 each have 1 to 30 repeating units is more preferable.
  • Examples of the above-mentioned acetylene-based surfactant include Surfynol 104E, 104H, 104A, 104PA, 104PG-50, 104S, 420, 440, 465, 485, SE, SE-F, PSA-336, DF-110, DF37. , Olfin E1004, E1006, E1010, E1020, E1030W, EXP. 4001, EXP. 4200, EXP. 4300, PD-002W, SPC, AF-103, AK-02 (all manufactured by Nisshin Chemical Industry Co., Ltd.), etc. It is available as a commercial product.
  • fluorine-based surfactant examples include fluorine-containing group / lipophilic group-containing oligomers, and fluorine-containing groups / hydrophilic groups / lipophilic group-containing oligomers.
  • fluorine-containing group / lipophilic group-containing oligomer for example, it is available as a commercial product such as Megafac F-569, F-574 (above, manufactured by DIC Corporation), etc.
  • group-containing oligomers for example, commercially available products such as Megafac F-477, F-553, F-556, R-94, and F-559 (all manufactured by DIC Corporation) are available.
  • n is an integer of 1 or more and 40 or less.
  • the fluorinated surfactant may, for example, be a partially fluorinated alcohol, and is commercially available as Capstone FS-65 (manufactured by Dupont).
  • surface conditioners such as an acrylic surface conditioner
  • acrylic surface conditioners include acrylic copolymers such as poly (meth) acrylates and modified poly (meth) acrylates.
  • BYK-381, BYK-3440, BYK-3441 (all, Big Chemie Japan) It is available as a commercial product such as manufactured by Co., Ltd.).
  • an acetylene-based surfactant having an acetylene bond such as an acetylene alcohol-based surfactant or an acetylene glycol-based surfactant
  • Surface conditioners such as fluorosurfactants and acrylic surface conditioners are preferred, acetylene surfactants, fluorosurfactants and acrylic surface conditioners are more preferred, and acetylene surfactants are more preferred.
  • the (B) surface conditioner preferably contains at least the above-described surface conditioner, and may include other than the above-exemplified ones, but all the included ones It is preferable that it is the surface-control agent illustrated above.
  • the content of the (B) surface conditioner in the water-based temporary tacking adhesive is preferably 0.01% by mass or more, more preferably 0.03, from the viewpoint of improving the coating performance and the anti-peeling performance together with the temporary tacking performance.
  • % By mass more preferably 0.05% by mass, particularly preferably 0.10% by mass, and the upper limit is preferably 5% by mass or less, more preferably 3% by mass or less, still more preferably 1.5% by mass % Or less, particularly preferably 1% by mass or less.
  • the (C) compatibilizer contained in the first aqueous temporary tacking adhesive of the present invention mainly improves the compatibility between the (A) thermoplastic resin having a hydroxyl group and the (B) surface conditioner, It is a component that exhibits anti-slip performance. Since the component (A) contains a hydroxyl group, it exhibits hydrophilicity, while the component (B) surface conditioner tends to exhibit hydrophobicity, and therefore the components (A) and (B) have high compatibility with each other. It can not be said.
  • the component (A) and the component (B) are used in combination, the amount of the adhesive applied by the part of the coating film of the adhesive is particularly small, or a part of the adhesive which is not coated tends to be generated, Etc. It becomes difficult to apply
  • the compatibilizer (C) is not particularly limited as long as it is a compound having a compatibilizing ability to improve the compatibility between the component (A) exhibiting hydrophilicity and the component (B) exhibiting hydrophobicity. It is preferable to use a compound having a hydrophilic portion and a hydrophobic portion therein. As such a compound, a copolymer of an alkylene oxide is preferably mentioned.
  • the alkylene oxide is preferably an alkylene oxide having 2 to 8 carbon atoms, more preferably 2 to 4 carbon atoms, for example, ethylene oxide, 1,2-propylene oxide, 1,3-propylene oxide, 1,2-butylene Oxide, 2,3-butylene oxide, 1,3-butylene oxide, tetrahydrofuran and the like can be mentioned, and among them, a combination of ethylene oxide and propylene oxide is preferable.
  • the alkylene oxide copolymer may be any of random type, block type and graft type, but it is a block type from the viewpoint of exhibiting better compatibility performance and improving the repelling performance. Is preferred.
  • copolymers of ethylene oxide and propylene oxide are preferable, and block copolymers of ethylene oxide and propylene oxide (hereinafter And “ethylene oxide-propylene oxide block copolymers” are more preferable, and among the ethylene oxide-propylene oxide block copolymers, a triblock copolymer having a propylene oxide chain as a main chain and ethylene oxide chains at both ends is particularly preferable.
  • ethylene oxide-propylene oxide-ethylene oxide triblock copolymer a triblock copolymer having an ethylene oxide chain as a main chain and a propylene oxide chain at both ends thereof
  • Polymer hereinafter., Also referred to as “propylene oxide - - ethylene oxide-propylene oxide triblock copolymer”
  • Ethylene oxide-propylene oxide block copolymer especially ethylene oxide-propylene oxide-ethylene oxide triblock copolymer, propylene oxide-ethylene oxide-propylene oxide triblock copolymer, the ethylene oxide chain is hydrophilic and the propylene oxide chain is hydrophobic
  • the compatibilization performance to improve the compatibility between the component (A) exhibiting hydrophilicity and the component (B) presenting hydrophobicity is more remarkably exhibited, and more excellent anti-flip performance is obtained.
  • ethylene oxide-propylene oxide block copolymer a diblock copolymer of ethylene oxide and propylene oxide (also referred to as "ethylene oxide-propylene oxide diblock copolymer”) is also preferable. Similar to the above triblock copolymer, ethylene oxide chains exhibit hydrophilicity and propylene oxide chains exhibit hydrophobicity, so that the compatibility between the component (A) exhibiting hydrophilicity and the component (B) exhibiting hydrophobicity is achieved. The improved compatibilization performance is more significantly exhibited, and better anti-repellency performance is obtained.
  • copolymers of alkylene oxides such as the above-mentioned ethylene oxide-propylene oxide-ethylene oxide triblock copolymer and propylene oxide-ethylene oxide-propylene oxide triblock copolymer are, for example, Neupol PE 61, 62, 64, 68, 71, 74, 75, 78, 108, 128 (all manufactured by Sanyo Chemical Industries, Ltd.), Pluronic P85, F88, F108 (all manufactured by ADEKA, Inc.), Unilobe 70DP-600B, 70DP-950B, Pronon # 208, It is also available as a commercial product, such as Pronon # 238, Pronon # 357 (all manufactured by NOF Corporation), Epan 485, Epan 680, Epan 785, Epan U-108 (all manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.), etc. is there.
  • the ratio of propylene oxide to ethylene oxide is preferably 10% by mass or more, more preferably 15% by mass or more, still more preferably 20% by mass or more, and the upper limit is preferably 300%. % Or less, more preferably 200% by mass or less, still more preferably 100% by mass or less.
  • the compatibilizer (C) is a copolymer of alkylene oxide
  • the number average molecular weight thereof is preferably 5,000 or more, more preferably 6,000 or more, still more preferably 7,000 or more, particularly preferably 8, or more.
  • the upper limit thereof is preferably 500,000 or less, more preferably 250,000 or less, still more preferably 100,000 or less, particularly preferably 50,000 or less.
  • the (C) compatibilizer preferably contains at least the copolymer of the alkylene oxide exemplified above, and may contain other than the copolymer of the alkylene oxide exemplified above. It is preferable that all of the included be copolymers of the alkylene oxides exemplified above.
  • the above ethylene oxide-propylene oxide copolymer can be prepared by a known method.
  • ethylene oxide-propylene oxide-ethylene oxide triblock copolymer propylene oxide chain as a main chain and ethylene oxide at both ends thereof
  • the block copolymer having a chain is polymerized by blowing ethylene oxide under pressure and heat into propylene glycol in the presence of an alkali catalyst to prepare polypropylene oxide, and then, for example, in the presence of a metal alcoholate catalyst
  • Ethylene oxide can be prepared by polymerizing both ends of the polypropylene oxide as a polymerization base.
  • the content of the (C) compatibilizer in the water-based temporary tacking adhesive is preferably 0.1% by mass or more, more preferably 0.3, from the viewpoint of improving the coating performance and the anti-peeling performance together with the temporary tacking performance.
  • the upper limit is preferably 20% by mass or less, more preferably 15% by mass or less, and still more preferably 10% by mass or less.
  • the first aqueous temporary tacking adhesive of the present invention can be used by dissolving the components (A), (B) and (C) in a solvent.
  • a solvent water is used, and for example, ion exchange water may be used.
  • a solvent other than water may be contained as a solvent, for example, various organic solvents, but considering the reduction of environmental load such as natural environment and working environment, safety etc., the organic solvent is not included. preferable. That is, the first water-based tackiness adhesive of the present invention is a substantially completely water-based tackiness adhesive containing no organic solvent.
  • does not contain an organic solvent means that the content of the organic solvent is 0% by mass and that the organic solvent is not intentionally used, for example, the above component (A), component (B) and The inclusion of the organic solvent which can be unavoidably contained in the component (C) is acceptable.
  • the content of the organic solvent contained in all the solvents is preferably 1% by mass or less, more preferably 0.5% by mass or less More preferably, it means that it is 0.1 mass% or less.
  • additives As the first aqueous temporary tacking adhesive of the present invention, if desired, as additives other than the above components, antifoaming agents, leveling agents, silane coupling agents, crystal nucleating agents, plasticizers, preservatives, etc. May be included.
  • the first aqueous temporary tacking adhesive of the present invention needs to have a melting point of 30 ° C. or higher. If the melting point is not 30 ° C. or more, it is not possible to suppress the decrease in the coating performance due to the compatibility between the temporary adhesive and the adherend due to the difference in the material, surface characteristics, etc. As the heat resistance is improved, it is not possible to suppress the occurrence of positional deviation or peeling of the adherend to the support during processing, so excellent temporary tacking performance (especially adhesion performance) can not be obtained, and various The versatility which can respond to temporary attachment of a thing to be bonded is not obtained, either.
  • the melting point of the water-based tackiness adhesive is preferably 30 ° C. or more, more preferably 35 ° C. or more, still more preferably 37 ° C. or more, still more preferably 40 ° C. or more, particularly preferably 43 ° C. or more.
  • the upper limit is preferably 200 ° C. or less, more preferably 180 ° C. or less, still more preferably 160 ° C. or less, still more preferably 120 ° C. or less, particularly preferably 100 ° C. or less.
  • the melting point of the water based temporary tacking adhesive is within the above range, not only the adhesion performance but also the peeling performance of the first water based temporary tacking adhesive of the present invention is improved, and the tacking performance is improved, and the versatility is also improved. improves.
  • the melting point means, as described above, a melting end point measured in accordance with JIS K 0064: 1992 (method of measuring melting point and melting range of chemical product).
  • the first aqueous temporary tacking adhesive of the present invention is heated and melted (temperature condition: 30 to 90 ° C.) and cooled (temperature condition: ⁇ 20 to 30 ° C.) to be fine (maximum particle diameter: 300 ⁇ m) powdered and dried for 24 hours in a desiccator as required according to “4.
  • Melting range measurement method defined in JIS K 0064: 1992 (melting point and melting range measuring method for chemical products)
  • a sample As a sample, it is filled in a capillary tube (glass, ID: 0.8 to 1.2 mm, thickness: 0.2 to 0.3 mm, length: 150 mm), which is heated at a heating rate of 1 ° C./min. The temperature was raised under the conditions, and the melting temperature at which no solid was observed by visual observation (the temperature at which the powdery solid sample was completely liquefied) was taken as the melting point of the first water-based tackiness adhesive of the present invention .
  • the first water-based temporary tacking adhesive of the present invention has coating performance and anti-slip performance together with excellent temporary tacking performance, and since it is water-based, it reduces the environmental load such as natural environment and working environment. It is an adhesive that is excellent and safe. Therefore, the first water-based temporary tacking adhesive of the present invention is used in applications where temporary tacking performance is required, for example, various electronic devices such as OA devices, information devices, home electric appliances, optical devices, medical devices, Various members and parts used in various devices such as automotive devices, for example, wafers such as silicon wafers, optical lenses, sapphire, gallium arsenide, quartz, magnetic members, metal members, glass members, resin members, members for semiconductor devices Etc. It is suitably used for temporarily fixing (temporarily fixing) to a temporary support during various mechanical processing such as cutting, grinding, cutting, grinding, and drilling.
  • the first aqueous temporary tacking adhesive of the present invention is uniformly applied to the entire surface of one side of a wafer by a coating method such as a spin coater method, a spray method, a die coating method, an inkjet method, a dip coating method or a roll coating method.
  • a coating method such as a spin coater method, a spray method, a die coating method, an inkjet method, a dip coating method or a roll coating method.
  • the adhesive coating is dried if necessary, and the wafer and the platen of the polishing machine are thermocompression bonded, usually at a temperature of 50 to 140 ° C., to fix the wafer on the platen of the polishing machine.
  • the wafer surface is polished by a polishing machine.
  • the wafer may be peeled off from the surface plate of the polishing machine using a razor or by heating and melting.
  • the method of applying the adhesive is not particularly limited.
  • the adhesive may be applied to an adherend such as a wafer, or may be applied to a support, and peeling after polishing
  • the method of the above is also not particularly limited, and can be appropriately selected according to the shape of the wafer.
  • the first water-based temporary tacking adhesive of the present invention is also water-based, and therefore has an advantage that it can be easily removed from the adherend by washing with water or warm water or the like.
  • the first aqueous temporary tacking adhesive of the present invention exhibits an adhesion performance such that the wafer is not peeled off or displaced from the surface plate during polishing, and the wafer is fixed using a razor or the like after polishing is completed. Allows easy peeling from the disc.
  • the first water-based temporary tacking adhesive of the present invention can also cope with high accuracy requirements such as mechanical processing, for example. It becomes possible.
  • the first aqueous temporary tacking adhesive of the present invention exhibits the same effect not only in the above-mentioned wafer polishing processing but also in mechanical processing of other various members and parts, and responds to high accuracy requirements. Is possible.
  • the second aqueous temporary tacking adhesive of the present invention contains a thermoplastic resin having at least (A) a hydroxyl group, and includes sodium metal ion, aluminum metal ion, iron metal ion, zinc metal ion, copper metal ion, nickel metal ion, A total content of chromium metal ion and lead metal ion is 3000 ppb or less, and contents of sodium metal ion, iron metal ion, zinc metal ion and copper metal ion are each 1000 ppb or less. is there.
  • thermoplastic resin having a hydroxyl group (A) contained in the second aqueous temporary tacking adhesive of the present invention is a component that exhibits tacking performance mainly having adhesion performance and peeling performance, and generally various types. Since the content of metal ions tends to be small, it is advantageous also in terms of the improvement of the function deterioration suppressing performance of various members and parts used in optical devices, electronic devices and the like.
  • the resin contained in the thermoplastic resin having a hydroxyl group (A) is not particularly limited as long as it is a thermoplastic resin having a hydroxyl group in the molecule, but a resin having a melting point of 30 ° C. or more is preferable.
  • the melting point of the resin contained in the thermoplastic resin having a hydroxyl group is 30 ° C. or more, the melting point of the aqueous temporary tacking adhesive of the present invention tends to be 30 ° C. or more, temporary tacking performance is improved, and general purpose Also improves the quality.
  • the melting point of the resin contained in the thermoplastic resin having a hydroxyl group (A) is more preferably 35 ° C. or more, still more preferably 37 ° C. or more, still more preferably 40 ° C. or more, particularly preferably 43 ° C or more.
  • the upper limit is preferably 200 ° C. or less, more preferably 180 ° C. or less, still more preferably 160 ° C.
  • the melting point means the melting end point measured in accordance with JIS K 0064: 1992. The specific measurement will be described later.
  • the number average molecular weight of the resin contained in the thermoplastic resin having a hydroxyl group (A) is preferably 800 or more, more preferably 1,000 or more, still more preferably 1,200 or more, particularly from the viewpoint of improving temporary tacking performance
  • the upper limit thereof is preferably 25,000 or less, more preferably 20,000 or less, still more preferably 15,000 or less, and particularly preferably 10,000 or less.
  • versatility is also improved as a number average molecular weight is in the said range.
  • the number average molecular weight is measured by gel permeation chromatography (GPC method) using polystyrene as a standard substance.
  • thermoplastic resin having an oxyalkylene group is preferably mentioned from the viewpoint of obtaining more excellent temporary tacking performance, and a kind of oxyalkylene group It is more preferable that it is resin which makes these structural units.
  • the carbon number of the oxyalkylene group and the repeating unit number of the oxyalkylene group are the same as the oxyalkylene group of the component (A) of the first water-based temporary tacking adhesive.
  • thermoplastic resin having an oxyalkylene group include polyalkylene glycol, polyoxyalkylene ester, polyoxyalkylene alkyl ether and polyoxyalkylene alkyl aryl ether, and more preferable is polyalkylene glycol, A polyoxyalkylene ester, a polyoxyalkylene alkyl ether, more preferably a polyalkylene glycol, a polyoxyalkylene ester, and the content of various metal ions is small, and various members used in more excellent optical devices, electronic devices, etc. And, from the viewpoint of obtaining the functional deterioration suppressing performance of the part, a polyalkylene glycol is particularly preferable.
  • thermoplastic resins can be used alone or in combination of two or more.
  • polyalkylene glycol polyoxyalkylene ester, polyoxyalkylene alkyl ether and polyoxyalkylene alkyl aryl ether are those exemplified as the component (A) of the first water-based temporary tacking adhesive. The same thing is mentioned.
  • thermoplastic resin having a hydroxyl group (A) a kind of thermoplastic resin may be used, and the thermoplastic resin having a number average molecular weight It is also possible to use two or more different thermoplastic resins, for example, two or more polyalkylene glycols different in number average molecular weight.
  • polyalkylene glycol A a polyalkylene glycol having a number average molecular weight of 800 to less than 5,000
  • polyalkylene glycol B a polyalkylene glycol having a number average molecular weight of 800 to less than 5,000
  • polyethylene glycol having a number average molecular weight of 800 to less than 5,000 a polyethylene glycol having a number average molecular weight of 800 to less than 5,000
  • number average molecular weight of 5,000 to 10 It is more preferable to combine 000 000 or less polyethylene glycol.
  • the blending ratio (mass ratio) of polyalkylene glycol A and polyalkylene glycol B is preferably 10:90 to 90:10, more preferably 15:85 to 85:15, still more preferably 20:80 to 80:20. It is.
  • the compounding ratio is within the above range, the film thickness of the coating film of the water-based tackiness adhesive can be easily secured, and more stable adhesion performance can be obtained, so that tackiness performance is improved.
  • the content of the thermoplastic resin having a hydroxyl group (A) in the second water-based tackiness adhesive is preferably 5% by mass or more, more preferably 10% by mass or more, and further preferably, from the viewpoint of improving the tackiness performance. Is 12% by mass or more, particularly preferably 15% by mass or more, preferably 50% by mass or less as the upper limit, more preferably 47% by mass or less, still more preferably 45% by mass or less, particularly preferably 42% by mass or less It is.
  • the content of the thermoplastic resin is in the above range, the film thickness of the coating film of the aqueous temporary tacking adhesive can be easily secured, and a more stable adhesion performance can be obtained, so that the temporary tacking performance is improved.
  • the second aqueous temporary tacking adhesive according to the present invention includes various metal ions of sodium metal ion, aluminum metal ion, iron metal ion, zinc metal ion, copper metal ion, nickel metal ion, chromium metal ion and lead metal ion And the total content of "(B) component" may be 3,000 ppb or less, and the contents of sodium metal ion, iron metal ion, zinc metal ion and copper metal ion are each 1,000 ppb or less . In the present specification, unless otherwise specified, “ppb” means “mass ppb”.
  • the content of various metal ions (B) is preferably as low as possible, preferably 2500 ppb or less, more preferably 2000 ppb or less, still more preferably 1000 ppb or less, still more preferably 500 ppb or less, particularly preferably 200 ppb or less. Preferably it is 100 ppb or less.
  • the lower limit value of the content of various metal ions (B) is preferably 0 ppb, that is, it is preferable that various metal ions are not contained, but it is practically about 0.5 ppb or more in practice.
  • the content of sodium metal ion, iron metal ion, zinc metal ion and copper metal ion is preferably 950 ppb or less, more preferably 750 ppb or less, still more preferably 600 ppb or less, particularly preferably 450 ppb or less. Is 0 ppb, practically it is usually 0.5 ppb or more.
  • the content of (B) various metal ions is a measured value measured by an appropriate analysis method according to the type of various metal ions, and specifically, Examples. It is the measured value measured by the method described in 4.
  • the content of (B) various metal ions can be reduced, for example, by selecting the type of the thermoplastic resin having a hydroxyl group (A).
  • the resin component used for these salt type and emulsion type is contained in the manufacturing process which itself contains a metal ion or is contained in the raw material of these resin components.
  • the content of contaminants such as metal ions tends to be high for reasons such as
  • the salt type resin component has an extremely high content of various metal ions contained in itself (B), and the resin component of the emulsion type has (B) various metal ions incorporated in the particles of the emulsion. It is difficult to remove various metal ions.
  • a thermoplastic resin having a sulfonic acid group (-SO 3 H) or a carboxyl group (-COOH) may be employed in some cases, but (A) a thermoplastic resin having a hydroxyl group Since the resin has a high affinity to water compared to these resins, the stability as a water-based tacking adhesive can be obtained.
  • thermoplastic resin having a hydroxyl group (B) further containing (B) various metal ions by removing various metal ions. It is easy to reduce the amount, and it is possible to extremely reduce the content of (B) various metal ions in the adhesive.
  • the second aqueous temporary tacking adhesive of the present invention may contain (C) a surface conditioner as another component other than the thermoplastic resin having (A) a hydroxyl group and (B) various metal ions.
  • the surface conditioning agent (C) is a component that mainly improves the coating performance of the adhesive, particularly the coating performance on various electronic members such as wafers.
  • the adhesive extends to the outer edge of the various members and parts due to the difference between the adhesive and the materials of the various members and parts. It can not be applied and may not be applied to the entire surface. In such a case, excellent coating performance can be obtained regardless of the difference in materials of various members and parts by using the (C) surface conditioner together with the (A) thermoplastic resin having a hydroxyl group. become.
  • a surface control agent As a surface control agent, a surface control agent, a leveling agent having the ability to eliminate defects in the coating film caused due to the change in viscosity, the change in surface tension, and the generation of bubbles generally as the molecular weight increases. And so long as it is referred to as a wetting agent or an antifoaming agent, it can be used without particular limitation, and examples thereof include acrylics, vinyls, silicones, fluorines, celluloses, natural waxes, and water-soluble organic compounds.
  • surfactants are also preferably mentioned, and among them, nonionic surfactants are preferable.
  • Nonionic surfactants used as surface conditioners acetylene alcohol surfactants, acetylene surfactants having an acetylene bond such as acetylene glycol surfactants, fluorosurfactants, acrylic surface conditioning
  • surface conditioners such as agents are the same as those described as being usable as the (B) surface conditioner in the first aqueous temporary tacking adhesive.
  • an acetylene-based surfactant having an acetylene bond such as an acetylene alcohol-based surfactant or an acetylene glycol-based surfactant
  • Surface conditioners such as fluorosurfactants and acrylic surface conditioners are preferred, acetylene surfactants, fluorosurfactants and acrylic surface conditioners are more preferred, and acetylene surfactants are more preferred. Further, nonionic ones are preferable particularly from the viewpoint of metal removal.
  • the (C) surface conditioner preferably contains at least the surface conditioner exemplified above, and may contain other than the above exemplified ones. However, it is preferable that all contained things are the surface conditioners illustrated above.
  • the content of the (C) surface conditioner in the second aqueous temporary tacking adhesive is preferably 0.01 mass% or more, more preferably 0.03 mass, from the viewpoint of improving the coating performance together with the temporary tacking performance. % Or more, more preferably 0.05% by mass or more, particularly preferably 0.10% by mass or more, and the upper limit is preferably 5% by mass or less, more preferably 3% by mass or less, still more preferably 1.5% by mass Or less, particularly preferably 1% by mass or less.
  • the second aqueous temporary tacking adhesive of the present invention may contain (D) a compatibilizer (hereinafter sometimes referred to as “component (D)”) as another component.
  • component (D) a compatibilizer
  • the (D) compatibilizer mainly improves the compatibility between the (A) thermoplastic resin having a hydroxyl group and the (C) surface conditioner to prevent repelling. It is a component that exhibits performance.
  • the thermoplastic resin having the (A) hydroxyl group exhibits hydrophilicity because it contains a hydroxyl group, while the (C) surface conditioner tends to exhibit hydrophobicity, so the (A) component and the (C) component are mutually phase-shifted. It can not be said that the solubility is high.
  • the amount of the adhesive applied due to repelling of a part of the coating film of the adhesive is particularly small, or a repelled part tends not to be applied. It may be difficult to apply uniformly to various members and parts such as.
  • (C) a surface conditioner is used as the thermoplastic resin having the above (A) hydroxyl group, occurrence of repelling can be reduced by using the (D) compatibilizer, and the second of the present invention
  • the water-based temporary tacking adhesive has excellent coating performance and anti-peeling performance, as well as excellent temporary tacking performance and performance deterioration suppressing performance of various members and parts used in optical devices, electronic devices and the like.
  • the (D) compatibilizer that can be used in the second aqueous temporary tacking adhesive of the present invention is the same as the (C) compatibilizing agent used in the first aqueous temporary tacking adhesive, and a co-polymer of an alkylene oxide A polymer is preferably used.
  • a specific example of the alkylene oxide copolymer is the same as the (C) compatibilizer used in the first aqueous temporary tacking adhesive, and such a copolymer has an ethylene oxide chain having a hydrophilicity, a propylene and a propylene.
  • the oxide chain exhibits hydrophobicity, it exhibits more significantly the compatibilization performance to improve the compatibility between the component (A) exhibiting hydrophilicity and the component (C) exhibiting hydrophobicity, and more excellent repelling Preventive performance is obtained.
  • copolymers of these alkylene oxides themselves are used in optical devices, electronic devices, etc., without containing metal ions or containing them in the raw materials of the copolymers and in the production process. It is effective in the improvement of the function fall suppression performance of various members and.
  • ethylene oxide-propylene oxide copolymer the ratio of propylene oxide to ethylene oxide, (D) when the compatibilizer is a copolymer of alkylene oxide, its number average molecular weight, the ethylene oxide-propylene oxide copolymer is known.
  • the method of preparation is the same as the contents described in the first aqueous temporary tacking adhesive.
  • the content of the (D) compatibilizer in the second aqueous temporary tacking adhesive is preferably 0.1% by mass or more, and more preferably, from the viewpoint of improving the coating performance and the anti-peeling performance together with the temporary tacking performance. It is 0.3% by mass or more, more preferably 0.5% by mass or more, preferably 20% by mass or less as the upper limit, more preferably 15% by mass or less, still more preferably 10% by mass or less.
  • the second aqueous temporary tacking adhesive of the present invention can be used by dissolving it in a solvent.
  • a solvent water is used, and for example, ion exchange water may be used.
  • the content of the solvent in the case of using water as the solvent is preferably 50% by mass or more, more preferably 55% by mass in consideration of the characteristics of the second temporary tacking adhesive of the present invention which is aqueous, ease of handling, etc. % Or more, more preferably 60% by mass or more, and the upper limit thereof is preferably 95% by mass or less, more preferably 90% by mass or less, still more preferably 85% by mass or less.
  • the second aqueous temporary tacking adhesive of the present invention may contain a solvent other than water as a solvent, for example, various organic solvents, but considering the reduction of environmental load such as natural environment and working environment, safety, etc. It is preferable not to contain the organic solvent. That is, the second water-based tackiness adhesive of the present invention is a substantially completely water-based tackiness adhesive containing no organic solvent.
  • “does not contain an organic solvent” means that the content of the organic solvent is 0% by mass and that the organic solvent is not intentionally used, for example, the component (A) to component (D).
  • the content of the organic solvent which can be unavoidably contained is acceptable, and in this case, the content of the organic solvent contained in all solvents is preferably 5% by mass or less, more preferably 2% by mass or less, still more preferably 1% by mass Hereinafter, more preferably, it means that it is 0.5% by mass or less, particularly preferably 0.1% by mass or less. That is, the content of water contained in all solvents is preferably 95% by mass or more, more preferably 98% by mass or more, still more preferably 99% by mass or more, still more preferably 99.5% by mass or more, particularly preferably It is 99.9 mass% or more.
  • the solvent (A) to the component (D) can be unavoidably contained in the solvent (A) to the component (D) other than the above-mentioned solvents other than water and organic solvents.
  • Components other than the component (D) are also included.
  • additives As the second aqueous temporary tacking adhesive of the present invention, if desired, as additives other than the above components, antifoaming agents, leveling agents, silane coupling agents, crystal nucleating agents, plasticizers, preservatives, etc. May be included.
  • the second aqueous temporary tacking adhesive of the present invention preferably has a melting point of 30 ° C. or higher.
  • the melting point is 30 ° C. or higher, the decrease in coating performance due to the compatibility between the temporary adhesive and the adherend due to the difference in the material, surface characteristics, etc. can be suppressed, and the heat resistance against heat generation during mechanical processing is
  • excellent temporary tacking performance especially adhesive performance
  • various adherends can be obtained.
  • the versatility which can respond to temporary tacking is also obtained.
  • the melting point of the second water-based temporary tacking adhesive is more preferably 35 ° C. or more, still more preferably 37 ° C. or more, still more preferably 40 ° C. or more, particularly preferably 43 ° C. or more.
  • the upper limit is preferably 200 ° C. or less, more preferably 180 ° C. or less, still more preferably 160 ° C. or less, still more preferably 120 ° C. or less, particularly preferably 100 ° C. or less.
  • the melting point is to be measured by the same method as the melting point of the first aqueous temporary tacking adhesive.
  • the second water-based temporary tacking adhesive of the present invention has excellent temporary tacking performance and has a low content of various metal ions, so the function deterioration suppressing performance of various members and parts used in optical devices, electronic devices, etc. Because it is an aqueous system, it is an adhesive that can reduce the load on the environment, such as the natural environment and the work environment, and is also excellent in safety.
  • the second aqueous temporary tacking adhesive of the present invention is used as an adhesive in applications where temporary tacking performance is required, for example, various electronic devices such as OA devices, information devices, home electric appliances, optical devices, medical devices, Various members and parts used in various devices such as automotive devices, for example, wafers such as silicon wafers, optical lenses, sapphire, gallium arsenide, quartz, magnetic members, metal members, glass members, resin members, members for semiconductor devices Etc. It is suitably used for temporarily fixing (temporarily fixing) to a temporary support during various mechanical processing such as cutting, grinding, cutting, grinding, and drilling.
  • the second water-based temporary tacking adhesive of the present invention exhibits adhesive performance such that various members and parts do not peel or shift from a processing substrate (such as a platen) during mechanical processing, and polishing processing is completed. After that, various members and parts can be easily peeled off from the processing substrate (such as a platen) by using a razor or by heating and melting.
  • the coating film of the adhesive is uniformly present on the entire surface of various members and parts without repelling, the second water-based tackiness adhesive of the present invention meets, for example, high accuracy requirements such as mechanical processing.
  • the second aqueous temporary tacking adhesive of the present invention is particularly mechanical processing requiring high accuracy, for example, a wafer such as a silicon wafer, an optical lens, a member for a semiconductor device, especially a wafer such as a silicon wafer. It is suitably used for polishing.
  • thermoplastic resin having a hydroxyl group and a composition containing a metal ion are brought into contact with an ion exchanger, and sodium metal ion, aluminum metal ion,
  • the total content of iron metal ion, zinc metal ion, copper metal ion, nickel metal ion, chromium metal ion and lead metal ion is 3000 ppb or less, and contains sodium metal ion, iron metal ion, zinc metal ion and copper metal ion
  • the amount is respectively 1000 ppb or less.
  • organic ion exchangers such as ion exchange resin, and an inorganic ion exchanger are mentioned, for example, (B)
  • organic ion exchangers such as ion exchange resins are preferred, and those having cation trapping performance are preferred.
  • an inorganic ion exchanger as having an ability to capture cations, for example, zirconium phosphate, zirconium tungstate, zirconium molybdate, zirconium tungstate, zirconium antimonate, zirconium selenate, zirconium tellurate, zirconium silicate, Examples thereof include metal oxides such as zirconium phosphosilicate and zirconium polyphosphate. These inorganic ion exchangers can be used alone or in combination of two or more.
  • a strongly acidic cation exchange resin such as a sulfonic acid type strongly acidic cation exchange resin having a sulfonic acid group (RSO 3 - H + ) as an acidic group; a carboxylic acid group (R-COO as an acidic group) - H +), a phosphonic acid group (R-P (O) ( O - H +) 2), phosphinic acid group (R-PH (O) ( O - H +)) weakly acidic cation exchange resin having such Any of such may be used.
  • a strongly acidic cation exchange resin such as a sulfonic acid type strongly acidic cation exchange resin having a sulfonic acid group (RSO 3 - H + ) as an acidic group; a carboxylic acid group (R-COO as an acidic group) - H +), a phosphonic acid group (R-P (O) ( O - H +) 2), phosphinic acid group (R-
  • the ion type of the cation exchange resin is preferably a hydrogen type or an ammonia type, and from the viewpoint of further reducing the content of various metal ions (B), a hydrogen type cation exchange resin is more preferable.
  • These organic ion exchangers can be used alone or in combination of two or more.
  • the form of the organic ion exchanger is not particularly limited, and may be, for example, in the form of particles, fibers, liquids, gels, etc. Further, for example, resin ions such as acrylic resin and styrene resin may be used as organic ions. It may be of a type decorated with a replacement resin.
  • thermoplastic resin having a hydroxyl group thermoplastic resin having a hydroxyl group
  • B various metal ions
  • C surface conditioner
  • D compatibilizer
  • the second aqueous temporary tacking adhesive of the present invention is not particularly limited in its production method, but is preferably produced by the above-mentioned second aqueous tackiness adhesive producing method of the present invention.
  • a water-based tackiness adhesive having performance deterioration suppressing performance of various members and parts used in optical devices, electronic devices, etc., together with excellent tackiness performance. Can be easily obtained.
  • the second aqueous temporary tacking adhesive of the present invention is manufactured by selecting a thermoplastic resin having a hydroxyl group (A), which is a component contained in the adhesive, and using a predetermined metal ion content. It is also possible.
  • the present manufacturing method has been described as a method for manufacturing the second water-based tackiness adhesive, but in the production of the first water-based tackiness adhesive and the third water-based tacking adhesive described later, (A) hydroxyl group
  • (A) hydroxyl group In the case of using a composition containing a resin and a metal ion, it is also possible to manufacture using an ion exchanger according to the present manufacturing method.
  • the method for manufacturing a member or part of the present invention comprises the step of temporarily fixing the precursor of the member or part and the processing substrate using the second aqueous temporary fixing adhesive of the present invention, and the machine using the precursor It has a processing step of subjecting it to mechanical processing to produce a member or part.
  • the temporary fixing step and the processing step will be described in detail below.
  • the aqueous temporary tacking adhesive used is the second aqueous temporary tacking adhesive, but the first aqueous temporary tacking adhesive, the third aqueous base described later It is also possible to use a tack adhesive.
  • the temporary fixing step is a step of temporarily fixing the precursor of the member or part and the processing substrate using the second aqueous temporary fixing adhesive of the present invention, and more specifically, the precursor and the processing substrate Forming a coating film of the aqueous temporary tacking adhesive of the present invention, and temporarily tacking the precursor and the processing substrate.
  • a temporary fixing adhesive is applied on one side of the precursor to form a coating film, and the surface provided with the coating film is used as a bonding surface on a processing substrate
  • Method (i) of temporarily tacking the precursor, applying a tackiness adhesive to a processing substrate to form a coating film, and disposing the precursor on the coating film, so as to intervene through the coating film Any of the methods (ii) of temporarily fixing the precursor to the processing substrate may be used.
  • the second aqueous temporary tacking adhesive As a method of applying the second aqueous temporary tacking adhesive, coating methods such as spin coating method, spray method, die coating method, ink jet method, dip coating method, roll coating method, etc. It can be mentioned.
  • the amount of application of the second aqueous temporary tacking adhesive depends on the area of the surface on which the precursor is temporarily tacked, but applies about 1 to 3 mL to the precursor of a wafer member such as a 4-inch silicon wafer, for example do it. Thereafter, while the coating film provided on the precursor is opposed to the processing substrate, the precursor is disposed at a predetermined position of the processing substrate and temporarily fixed.
  • the precursor and the processing substrate at a temperature of usually 50 to 140 ° C. and temporarily fix them, because temporary fixing can be performed more reliably.
  • the surface may be roughly polished with an abrasive or the like, and surface treatment may be performed by chemical etching if necessary.
  • the processing step is a step of processing the surface to be processed of the precursor temporarily fixed to the processing substrate in the temporary fixing step.
  • Examples of processing in the manufacturing method of the present invention include various mechanical processing such as cutting, polishing, cutting, grinding, and drilling, and these may be single processing or processing combining these processing.
  • the processing in the processing step in the manufacturing method of the present invention is roughly classified into general processing which requires no particular precision and precision processing which requires high precision.
  • mechanical processing of a wafer such as a silicon wafer, an optical lens, and a member for a semiconductor device
  • polishing processing of the surface of a wafer such as a silicon wafer requires processing by precision processing.
  • the precursor can be tacked to the processing substrate without tilting, and the adhesive The in-plane film thickness difference of the coating film is small, and the non-coating area is very small.
  • the pressure applied from the jig for mechanical processing to the precursor on the surface to be processed of the precursor can be made substantially uniform to the surface to be processed on the precursor as a result, since the precursor can be processed with high accuracy, high quality members or parts can be manufactured.
  • processing can be performed with high accuracy even under severe mechanical processing conditions, and as a wafer, in addition to silicon wafers, materials for wafers such as sapphire, gallium phosphide, gallium nitride, etc.
  • materials for wafers such as sapphire, gallium phosphide, gallium nitride, etc.
  • These various wafers can be mentioned, but it is also suitable as a method of producing these various wafers, in particular, as a method of producing wafers having a Mohs altitude of 9 or more (for example, sapphire wafers etc.).
  • the method of manufacturing a member or part of the present invention may have a peeling step of peeling the member or part subjected to mechanical processing from the processing substrate after the above-described processing step.
  • the peeling may be performed by, for example, using a razor, a scraper or the like, or heating and melting to peel a member or part such as a wafer from the processing substrate.
  • cleaning may be performed to remove the residue of the temporary tacking adhesive on the member or part using water or warm water or the like. Since the water-based tackiness adhesive of the present invention is water-based, it also has an advantage that it can be easily removed from the adherend by washing with water or warm water or the like.
  • Examples of members and parts obtained by the method of manufacturing a member or part of the present invention include various devices such as OA devices, information devices, various electronic devices such as home electric appliances, optical devices, medical devices, and automotive devices.
  • Various members and parts to be used more specifically, wafers such as silicon wafers, optical lenses, sapphire, gallium arsenide, quartz, magnetic members, metal members, glass members, resin members, members for semiconductor devices, etc. may be mentioned. .
  • various wafers made of wafer materials such as sapphire, gallium phosphide or gallium nitride, optical lenses and members for semiconductor devices are preferable. Among them, various wafers are preferable.
  • the third aqueous temporary tacking adhesive of the present invention comprises (A) a thermoplastic resin having a hydroxyl group, and (B) a solvent containing water, and the content of water in the solvent is 95% by mass or more. It is characterized in that the surface tension at 25 ° C. is 20 mN / m to 55 mN / m, and the adhesive strength is 0.1 MPa to 20 MPa.
  • component (A) is a component that exhibits temporary tacking performance mainly having adhesion performance and peeling performance, and is at 25 ° C.
  • the adhesive has high safety performance and low environmental impact.
  • Thermoplastic resin having a hydroxyl group The resin contained in the thermoplastic resin having a hydroxyl group (A) is not particularly limited as long as it is a thermoplastic resin having a hydroxyl group in the molecule, but a resin having a melting point of 30 ° C. or more is preferable.
  • the melting point of the resin contained in the thermoplastic resin having a hydroxyl group is more preferably 35 ° C. or more, still more preferably 37 ° C. or more, still more preferably 40 ° C.
  • the upper limit thereof is preferably 200 ° C. or less, more preferably 180 ° C. or less, still more preferably 160 ° C. or less, still more preferably 120 ° C., particularly preferably 100 ° C. or less.
  • the melting point means the melting end point measured in accordance with JIS K 0064: 1992. The specific measurement will be described later.
  • the number average molecular weight of the thermoplastic resin having a hydroxyl group (A) is preferably 800 or more, more preferably 1,000 or more, still more preferably 2,000 or more, particularly from the viewpoint of improving coating performance as well as temporary tacking performance.
  • the upper limit is preferably 3,000 or more, more preferably 25,000 or less, more preferably 20,000 or less, still more preferably 15,000 or less, and particularly preferably 10,000 or less.
  • versatility is also improved as a number average molecular weight is in the said range.
  • the number average molecular weight is measured by gel permeation chromatography (GPC method) using polystyrene as a standard substance.
  • thermoplastic resin having a hydroxyl group (A) having the above properties a thermoplastic resin having an oxyalkylene group is preferably mentioned from the viewpoint of temporary tacking performance, and one kind of oxyalkylene group is a structural unit. Is more preferred.
  • the carbon number of the oxyalkylene group and the repeating unit number of the oxyalkylene group are the same as the oxyalkylene group of the component (A) of the first water-based temporary tacking adhesive.
  • thermoplastic resin having an oxyalkylene group examples include the same thermoplastic resins having an oxyalkylene group as the component (A) of the first aqueous temporary tacking adhesive, and the coating performance together with the tacking performance
  • polyalkylene glycol from the viewpoint of improving
  • polyalkylene glycol, polyoxyalkylene ester, polyoxyalkylene alkyl ether and polyoxyalkylene alkyl aryl ether are those exemplified as the component (A) of the first water-based temporary tacking adhesive. The same thing is mentioned.
  • thermoplastic resin having a hydroxyl group a kind of thermoplastic resin may be used, and a number average molecular weight It is also possible to use two or more thermoplastic resins different from each other, for example, two or more polyalkylene glycols different in number average molecular weight.
  • polyalkylene glycol A a polyalkylene glycol having a number average molecular weight of 800 to less than 5,000
  • polyalkylene glycol B a polyalkylene glycol having a number average molecular weight of 800 to less than 5,000
  • polyethylene glycol having a number average molecular weight of 800 to less than 5,000 a polyethylene glycol having a number average molecular weight of 800 to less than 5,000
  • number average molecular weight of 5,000 to 10 It is more preferable to combine 000 000 or less polyethylene glycol.
  • the blending ratio (mass ratio) of polyalkylene glycol A and polyalkylene glycol B is preferably 10:90 to 90:10, more preferably 15:85 to 85:15, still more preferably 20:80 to 80:20. It is.
  • the compounding ratio is within the above range, the film thickness of the coating film of the water-based tackiness adhesive can be easily secured, and more stable adhesion performance can be obtained, so that tackiness performance is improved.
  • shellac resin can also be used as a thermoplastic resin which has a (A) hydroxyl group.
  • the shellac resin is obtained by purifying a resinous substance which is secreted by Lactocystis by a known solution extraction method, soda method or the like, and the resin content thereof is a resin acid such as aleuritic acid, jaralic acid, laccinaric acid, etc.
  • a natural shellac resin containing as a main component an ester compound thereof, or a synthetic shellac resin and specific examples thereof include a purified shellac resin, a bleached shellac resin, and a decolorized shellac resin.
  • the ammonium neutralization thing of these shellac resin may be sufficient.
  • the content of the thermoplastic resin having a hydroxyl group (A) in the third water-based tackiness adhesive is preferably 5% by mass or more, more preferably 10% by mass from the viewpoint of improving the coating performance together with the tackiness performance.
  • the content is more preferably 12% by mass or more, particularly preferably 15% by mass or more, and the upper limit thereof is preferably 50% by mass or less, more preferably 47% by mass or less, still more preferably 45% by mass or less. It is 42 mass% or less.
  • the third aqueous temporary tacking adhesive of the present invention is a solvent containing water (hereinafter sometimes referred to as “component (B)”), and the content of water in the solvent is 95% by mass or more.
  • component (B) a solvent containing water
  • the third aqueous temporary tacking adhesive of the present invention may contain a solvent other than water, for example, various organic solvents as the solvent, but it is possible to reduce the load on the environment such as natural environment and work environment, safety etc. Considering it, the smaller the content of the organic solvent, the better.
  • the content of water in the solvent containing water needs to be 95% by mass or more.
  • the content of water in the solvent containing (B) water is preferably 96% by mass or more, more preferably 98% by mass or more, still more preferably substantially completely free of an organic solvent It is preferable that it is a water based temporary tacking adhesive.
  • “does not contain an organic solvent” means that the content of the organic solvent is 0% by mass and that the organic solvent is not intentionally used, for example, the above-mentioned component (A), and a compound (C)
  • the content of the organic solvent which can be unavoidably contained in the component (D) and the component (D) is acceptable, and in this case, the content of the organic solvent contained in all solvents is preferably 1% by mass or less, more preferably 0.5. It means that it is not more than mass%, more preferably not more than 0.1 mass%.
  • “does not contain an organic solvent” means that the content of water in all solvents is preferably 99% by mass or more, more preferably 99.5% by mass or more, still more preferably 99.9% It means that it is% or more.
  • the content of the solvent containing water (B) in the third water-based temporary tacking adhesive is appropriately changed in accordance with the contents of the component (A) and other components described later, but usually, 50 mass% or more and 95 mass% or so.
  • the third aqueous temporary tacking adhesive of the present invention may contain (C) a surface conditioner as another component other than the above-described thermoplastic resin having (A) a hydroxyl group and (B) a solvent containing water.
  • the surface conditioning agent (C) is a component that mainly improves the coating performance of the adhesive, particularly the coating performance on various electronic components such as wafers. When an adhesive is applied to various parts such as optical instruments and electronic parts, the adhesive can not be applied to the outer edge of the various parts due to the difference between the adhesive and the material of the various parts, etc. There is something I can not do.
  • the surface tension of the third water-based temporary tacking adhesive of the present invention is adjusted by using the surface conditioner (C) together with the thermoplastic resin having (A) a hydroxyl group, materials of various parts, etc. Excellent coating performance can be obtained regardless of the difference between
  • (C) As a surface control agent a surface control agent, a surface control agent, a leveling agent having the ability to eliminate defects in the coating film caused due to the change in viscosity, the change in surface tension, and the generation of bubbles generally as the molecular weight increases. And so long as it is referred to as a wetting agent or an antifoaming agent, it can be used without particular limitation, and examples thereof include acrylics, vinyls, silicones, fluorines, celluloses, natural waxes, and water-soluble organic compounds. Preferred are various surface conditioners such as solvents, leveling agents, wetting agents, antifoaming agents and the like. Moreover, as a (C) surface-control agent, surfactant is also mentioned preferably, and nonionic surface activity is preferable.
  • Nonionic surfactants used as surface conditioners acetylene alcohol surfactants, acetylene surfactants having an acetylene bond such as acetylene glycol surfactants, fluorosurfactants, acrylic surface conditioning
  • surface conditioners such as agents are the same as those described as being usable as the (B) surface conditioner in the first aqueous temporary tacking adhesive.
  • an acetylene-based surfactant having an acetylene bond such as an acetylene alcohol-based surfactant or an acetylene glycol-based surfactant
  • Surface conditioners such as fluorosurfactants and acrylic surface conditioners are preferred, acetylene surfactants, fluorosurfactants and acrylic surface conditioners are more preferred, and acetylene surfactants are more preferred.
  • the nonionic surfactants In addition to nonionic surfactants, amphoteric surfactants and the like also exist as the fluorinated surfactants, but from the viewpoint of improving the coating performance and the anti-peeling performance together with the temporary fixing performance, the nonionic surfactants are preferable.
  • the (C) surface conditioner it is preferable to include at least the above-described surface conditioner, and it may include other than the above-described ones. However, it is preferable that all contained things are the surface conditioners illustrated above.
  • the content of the (C) surface conditioner in the third water-based temporary tacking adhesive is preferable from the viewpoint of improving the performance deterioration suppressing performance and coating performance of various parts such as optical devices and electronic parts as well as the temporary tacking performance.
  • the content is preferably 3% by mass or less, more preferably 1.5% by mass or less, and particularly preferably 1% by mass or less.
  • the third water-based temporary tacking adhesive of the present invention may contain (D) a compatibilizer (hereinafter, may be referred to as “component (D)”) as another component.
  • component (D) a compatibilizer
  • the present invention is mainly due to the compatibility between the (A) thermoplastic resin having a hydroxyl group and the (C) surface conditioner. Even if the third temporary tacking adhesive can be applied to the outer edges of various parts, so-called repellence may occur due to partial repelling and inability to be applied uniformly.
  • repelling occurs, the compatibility of the thermoplastic resin having a hydroxyl group (A) with the surface conditioner (C) is improved by using the (D) compatibilizing agent to improve the anti-repelling performance. It becomes possible.
  • thermoplastic resin having a hydroxyl group exhibits hydrophilicity because it contains a hydroxyl group, while the (C) surface conditioner tends to exhibit hydrophobicity, so that the (A) component and the (C) component are mutually compatible. Is not high. Therefore, when the component (A) and the component (C) are used in combination, the amount of the adhesive applied due to repelling of a part of the coating film of the adhesive is particularly small, or a repelled part tends not to be applied. It may be difficult to apply uniformly to various members and parts such as.
  • thermoplastic resin having the above (A) hydroxyl group When (C) a surface conditioner is used for the thermoplastic resin having the above (A) hydroxyl group, occurrence of repelling can be reduced by using the (D) compatibilizer, and the third aspect of the present invention
  • the water-based tackiness adhesive has coating performance and anti-peeling performance as well as excellent tackiness performance.
  • the (D) compatibilizer which may be used in the third aqueous temporary tacking adhesive is the same as the (C) compatibilizing agent used in the first aqueous temporary tacking adhesive, and a copolymer of an alkylene oxide is It is preferably used.
  • a specific example of the alkylene oxide copolymer is the same as the (C) compatibilizer used in the first aqueous temporary tacking adhesive, and such a copolymer has an ethylene oxide chain having a hydrophilicity, a propylene and a propylene. Since the oxide chain exhibits hydrophobicity, it exhibits more significantly the compatibilization performance to improve the compatibility between the component (A) exhibiting hydrophilicity and the component (C) exhibiting hydrophobicity, and more excellent repelling Preventive performance is obtained.
  • ethylene oxide-propylene oxide copolymer the ratio of propylene oxide to ethylene oxide, (D) when the compatibilizer is a copolymer of alkylene oxide, its number average molecular weight, the ethylene oxide-propylene oxide copolymer is known.
  • the method of preparation is the same as the contents described in the first aqueous temporary tacking adhesive.
  • the content of the (D) compatibilizer in the third water-based temporary tacking adhesive is preferably 0.1% by mass or more, more preferably from the viewpoint of improving the coating performance and the anti-scratch performance as well as the temporary tacking performance. It is 0.3% by mass or more, more preferably 0.5% by mass or more, preferably 20% by mass or less as the upper limit, more preferably 15% by mass or less, still more preferably 10% by mass or less.
  • additives As the third aqueous temporary tacking adhesive of the present invention, if desired, as additives other than the above components, antifoaming agents, leveling agents, silane coupling agents, crystal nucleating agents, plasticizers, preservatives, etc. May be included.
  • the third aqueous temporary tacking adhesive of the present invention is required to have a surface tension at 25 ° C. of 20 mN / m or more and 55 mN / m or less. If the surface tension at 25 ° C. does not fall within the above range, coating performance can not be obtained together with excellent temporary tacking performance.
  • the surface tension at 25 ° C. of the third aqueous temporary tacking adhesive of the present invention is preferably 20 mN / m or more, more preferably 22 mN / m or more, and still more preferably from the viewpoint of improving the coating performance together with the temporary tacking performance.
  • the upper limit is preferably 55 mN / m or less, more preferably 50 mN / m or less, and still more preferably 45 mN / m or less.
  • the surface tension at 25 ° C. can be adjusted by (A) type of thermoplastic resin having a hydroxyl group and its content, and can also be adjusted by using (C) surface conditioner. .
  • the surface tension at 25 ° C. is a value measured by the Wolhelmy method at a measurement temperature of 25 ° C.
  • a surface tension meter (“CBVP-Z (model number)” manufactured by Kyowa Interface Chemicals Co., Ltd.) Etc. is a value that can be measured.
  • the third aqueous temporary tacking adhesive of the present invention needs to have an adhesive strength of 0.1 MPa or more and 20 MPa or less. If the adhesive strength is not within the above range, excellent temporary tacking performance can not be obtained. From the viewpoint of improving the temporary tacking performance, the adhesive strength of the third aqueous temporary tacking adhesive of the present invention is preferably 0.15 Pa or more, more preferably 0.2 MPa or more, and still more preferably 0.5 MPa or more. The upper limit is preferably 15 MPa or less, more preferably 10 MPa or less, still more preferably 7 MPa or less, and still more preferably 5 MPa or less. In the present specification, the adhesive strength is 5 drops on one stainless steel substrate, dried by heating at 100 ° C.
  • the shear force of the bonded substrate is a shear force measured using a tensile strength measuring instrument in accordance with the “tensile shear adhesion strength test method” defined in JIS K 6850: 1999.
  • the third aqueous temporary tacking adhesive of the present invention preferably has a melting point of 30 ° C. or higher.
  • the melting point of the third water-based temporary tacking adhesive is more preferably 35 ° C. or higher, still more preferably 37 ° C. or higher, still more preferably 40 ° C., from the viewpoint of improving coating performance and general versatility as well as temporary tacking performance. It is particularly preferably 43 ° C. or more, and the upper limit is preferably 200 ° C. or less, more preferably 180 ° C. or less, still more preferably 160 ° C. or less, still more preferably 120 ° C., particularly preferably 100 ° C. or less.
  • the melting point is to be measured by the same method as the melting point of the first aqueous temporary tacking adhesive.
  • the third water-based tackiness adhesive of the present invention is an adhesive having coating performance and safety performance as well as excellent tackiness performance and having a low environmental load. Therefore, the third aqueous temporary tacking adhesive of the present invention is used as an adhesive in applications where temporary tacking performance is required, for example, various electronic devices such as optical devices, OA devices, information devices, home electric appliances, medical devices, Various members and parts used in various devices such as automotive devices, for example, wafers such as silicon wafers, optical lenses, sapphire, gallium arsenide, quartz, magnetic members, metal members, glass members, resin members, members for semiconductor devices Etc. is suitably used for temporary fixing (temporary fixing) in various mechanical processing such as cutting, grinding, cutting, grinding, and drilling.
  • the third aqueous temporary tacking adhesive of the present invention is uniformly applied to the entire surface of one side of the wafer by a coating method such as spin coating, spraying, die coating, inkjet, dip coating, or roll coating.
  • a coating method such as spin coating, spraying, die coating, inkjet, dip coating, or roll coating.
  • the adhesive coating is dried if necessary, and the wafer and the platen of the polishing machine are thermocompression bonded, usually at a temperature of 50 to 140 ° C., to fix the wafer on the platen of the polishing machine.
  • the wafer surface is polished by a polishing machine.
  • the wafer may be peeled off from the surface plate of the polishing machine using a razor or by heating and melting.
  • the method of applying the adhesive is not particularly limited.
  • the adhesive may be applied to an adherend such as a wafer, or may be applied to a support, and peeling after polishing
  • the method of the above is also not particularly limited, and can be appropriately selected according to the shape of the wafer.
  • cleaning may be performed to remove the residue of the temporary tacking adhesive on the wafer using water or warm water or the like.
  • the third water-based temporary tacking adhesive of the present invention is also water-based, and therefore has an advantage that it can be easily removed from the adherend by washing with water or warm water or the like.
  • the third aqueous temporary tacking adhesive of the present invention exhibits adhesion performance such that the wafer does not peel off from the platen during polishing, and after polishing is completed, the wafer can be easily removed from the platen using a razor or the like. It is possible to peel off.
  • the aqueous temporary tacking adhesive of the present invention can also cope with high accuracy requirements such as mechanical processing, for example. .
  • the third aqueous temporary tacking adhesive of the present invention is not limited to the polishing processing of the above-mentioned wafer, and exerts the same effect in mechanical processing of other various members and parts, and meets high accuracy requirements. Is possible.
  • A The silicon wafer was peeled off from the surface plate with an insertion amount of less than 10 mm.
  • B The silicon wafer was peeled off from the surface plate with an insertion amount of 10 mm or more and less than 15 mm.
  • C The silicon wafer was peeled off from the surface plate with an insertion amount of 15 mm or more.
  • Examples 1-1 to 17-1 and Comparative Examples 1-1 to 4-1 First water-based tackiness adhesive An adhesive was prepared in the amount (% by mass) shown in Table 1-1. The obtained adhesive was evaluated for coating performance, repellence prevention performance, and temporary tacking performance (adhesion performance and peeling performance) by the methods of (1-1) to (5-1). The evaluation results are shown in Table 1-1.
  • A-PEG1 polyethylene glycol (number average molecular weight: 1,000, melting point: 40 ° C.)
  • A-PEG2 polyethylene glycol (number average molecular weight: 3,100, melting point: 55 ° C.)
  • A-PEG3 polyethylene glycol (number average molecular weight: 8,800, melting point: 60 ° C.)
  • A-PEG 4 polyethylene glycol (number average molecular weight: 20,000, melting point: 65 ° C.)
  • A-PEG 5 polyethylene glycol (number average molecular weight: 600, melting point: 18 to 23 ° C.)
  • A-PPGS polypropylene glycol monostearate (number of oxyethylene group repeating units: 140, melting point: 56.5 to 61.5 ° C.)
  • B-1 Acetylene glycol surfactant (in the above general formula (2), R 21 and R 23 are methyl groups, R 22 and R 24 are isobutyl
  • the first water-based temporary tacking adhesive of the present invention has excellent tacking performance combining adhesion performance and peeling performance, and is also excellent in coating performance and anti-peeling performance. As a result, a silicon wafer with high accuracy was obtained. Further, since the adhesive of the present invention is a water-based adhesive substantially free of organic solvents, it can reduce the load on the environment such as the natural environment and the working environment, and is excellent in safety. is there. On the other hand, the adhesive of Comparative Example 1-1 which did not contain the component (A) was inferior in coating performance and did not exhibit adhesion performance.
  • the adhesive of Comparative Example 2-1 which does not contain the component (C), is inferior in anti-repellent performance
  • the adhesive of Comparative Example 3-1 which does not contain the component (B)
  • the adhesive of Comparative Example 4-1 having a melting point of less than 30 ° C., the adhesive did not solidify and adhesion could not be performed, so that performance evaluation could not be performed.
  • Examples 18-1 to 22-1 First Water-based Tack Adhesives Adhesives were prepared at the blending amounts (% by mass) shown in Table 2-1. The obtained adhesive was evaluated for coating performance, repellence prevention performance, and temporary tacking performance (adhesion performance and peeling performance) by the methods of (1-1) to (5-1). The evaluation results are shown in Table 2-1.
  • A-PEG6 polyethylene glycol (number average molecular weight: 1,540, melting point: 45 ° C.)
  • A-PEG7 polyethylene glycol (number average molecular weight: 2,000, melting point: 50 ° C.)
  • the first water-based tackiness adhesive has excellent tackiness performance, which has both adhesion performance and peeling performance, and also has excellent coating performance and anti-peeling performance. It was also confirmed that the silicon wafer was excellent, and as a result, a silicon wafer with high accuracy was obtained. Further, since the adhesive of the present invention is a water-based adhesive substantially free of organic solvents, it can reduce the load on the environment such as the natural environment and the working environment, and is excellent in safety. is there.
  • the adhesive obtained in each of the examples and comparative examples was weighed in a Teflon (registered trademark) beaker, thermally decomposed with sulfuric acid, nitric acid and perchloric acid, and then dissolved in dilute nitric acid to make a constant volume. .
  • the content of lead metal ions was measured by ICP mass spectrometry using an ICP mass spectrometer (“SPQ6500 (model number)” manufactured by Seiko Instruments Inc.). The measured contents (ppb) of various metal ions are shown in Table 1-2.
  • SPQ6500 model number
  • the measured contents (ppb) of various metal ions are shown in Table 1-2.
  • (2-2) Measurement of Melting Point The adhesive obtained in each Example and Comparative Example was measured for the melting point according to JIS K 0064: 1992.
  • a sample (2 ml of the adhesive was placed in a small petri dish having an inner diameter of 40 mm) obtained by subjecting the moisture contained in the adhesive obtained in each example and comparative example to a drying treatment in a clean oven without lid
  • Samples dried at 120 ° C for 60 minutes) and A-PEG1 used in these examples were heated and melted (temperature conditions: 30 to 130 ° C) and cooled (temperature conditions: -20 to 30 ° C)
  • a fine powder (maximum particle size: 300 ⁇ m) was powdered and dried in a desiccator for 24 hours as a sample, which was used as a capillary (glass, inner diameter 0.8 to 1.2 mm, thickness: 0.2 It is packed in ⁇ 0.3 mm, length: 150 mm, and this is heated at a heating rate of 1 ° C / min. Melting temperature (solid sample in powder form is complete) when solid is not recognized by visual observation State of liquefied state), Was the point.
  • An adhesive is prepared using the compounding amount (mass%) shown in Table 1-2, The metal ions were removed in accordance with the metal ion removal method in Table 2 and used as the adhesive of each example and comparative example.
  • the metal ion removal method was performed by the following method.
  • the content of various metal ions of the obtained adhesive is measured by the method of (1-2), and the melting point is measured by the method of (2-2), and the above (3-2) and (4) are also measured.
  • the temporary tacking performance was evaluated by the method of -2).
  • the evaluation results are shown in Table 1-2.
  • - Metal ion removal was not performed.
  • the second water-based temporary tacking adhesive of the present invention has excellent tacking performance combining adhesion performance and peeling performance, and the content of various metal ions is small, It is excellent in the function deterioration suppression performance of various members and parts used for an optical instrument, an electronic instrument, etc.
  • the content of various metal ions can be made within a predetermined range without performing various metal ion removal treatments, and furthermore, an ion exchanger
  • the content of various metal ions can be reduced to an extremely small amount by performing various metal ion removal processing using a metal, and the function deterioration suppressing performance of various members and parts used in optical devices, electronic devices and the like can be reduced. It can be an extremely excellent adhesive. From the results of Examples 1-2 and 4-2, the second aqueous temporary tacking adhesive of the present invention can be selected from various metal ions depending on the selection of the component ((A) a thermoplastic resin having a hydroxyl group) contained in the adhesive.
  • thermoplastic resin having a hydroxyl group has a high affinity to water, and therefore, the stability as a water-based tackiness adhesive can be obtained.
  • metal ion removal treatment may be performed as shown in Examples 2-2, 3-2, 5-2 and 6-2.
  • thermoplastic resin having a hydroxyl group By using a thermoplastic resin having a hydroxyl group, the content of metal ions can be more easily reduced.
  • the total content of various metal ions can not be 3000 ppb or less if the thermoplastic resin having a (A) hydroxyl group is not used as the resin component, and
  • the adhesives of Comparative Examples 1-2 and 4-2 are intended to reduce the content of various metal ions with an ion exchanger, the adhesive of Comparative Example 1-2 has an excessively high content of sodium metal ions. It could not be reduced to the predetermined content (Comparative Examples 2-2 and 3-2). The content of the adhesive of Comparative Example 2-2 could not be measured because the ion exchange resin was precipitated.
  • the adhesive of Comparative Example 4-2 uses an emulsion type as a resin component, it can not be reduced to a predetermined content because various metal ions are taken into the emulsion (Comparative Example 5-2 and 6-2).
  • Examples 7-2 to 15-2 Second Water-based Tack Adhesives Adhesives were prepared at the amounts (% by mass) shown in Table 2-2. About the obtained adhesive agent, content of various metal ions is measured by the method of said (1-2) about the obtained adhesive agent, melting
  • A-PEG2 polyethylene glycol (number average molecular weight: 1,540, melting point: 45 ° C.)
  • the second water-based tackiness adhesive has excellent tackiness performance which has both adhesion performance and peeling performance, and further contains various metal ions.
  • the amount is small, and the performance deterioration suppressing performance of various members and parts used in optical devices, electronic devices and the like is excellent.
  • the content of various metal ions can be made within a predetermined range without performing various metal ion removal treatments, and furthermore, an ion exchanger
  • the content of various metal ions can be reduced to an extremely small amount by performing various metal ion removal processing using a metal, and the function deterioration suppressing performance of various members and parts used in optical devices, electronic devices and the like can be reduced. It can be an extremely excellent adhesive.
  • Examples 1-3 to 14-3, comparative examples 1-3 to 4-3 The adhesive was prepared at the blending amounts (% by mass) shown in Table 1-3. Moreover, as a solvent containing (B) water, ionic water was used (the content of water in the solvent is 100% by mass). The surface tension of the obtained adhesive is measured by the method of (1-3), the melting point is measured by the method of (2-3), and the adhesion strength is measured by the method of (3-3). The various performances were also evaluated by the methods (4-3) to (7-3) above. The measurement results and the evaluation results are shown in Table 1-3.
  • A-PEG1 polyethylene glycol (number average molecular weight: 1,000, melting point: 40 ° C., surface tension at 25 ° C .: 56 mN / m [20% aqueous solution])
  • A-PEG2 polyethylene glycol (number average molecular weight: 3,100, melting point: 55 ° C., surface tension at 25 ° C .: 56 mN / m [20% aqueous solution])
  • A-PEG3 polyethylene glycol (number average molecular weight: 8,800, melting point: 60 ° C., surface tension at 25 ° C .: 55 mN / m [20% aqueous solution])
  • A-PEG 4 polyethylene glycol (number average molecular weight: 20,000, melting point: 65 ° C., surface tension at 25 ° C .: 54 mN / m [20% aqueous solution]) Resin component
  • the third water-based tackiness adhesive according to the present invention has excellent surface tension and has adhesive strength, so it is an excellent tackiness having both adhesion performance and peeling performance. It was confirmed that it had performance and was excellent in coating performance, and as a result, a highly accurate silicon wafer was obtained.
  • the third water-based tackiness adhesive is a water-based adhesive that does not substantially contain an organic solvent, so that the load on the environment such as the natural environment and the working environment can be reduced, and the safety is excellent. It is On the other hand, in Comparative Examples 1-3 to 4-3, because the surface tension is large or small and the adhesive strength is small, excellent coating performance can not be obtained, and it does not function as a temporary fixing of the silicon wafer. It became.
  • the water-based tackiness adhesive of the present invention has a water-based tackiness adhesive that has both coating performance and repellence prevention performance as well as excellent tackiness performance, and the function deterioration suppression performance of various members and parts used in optical devices, electronic devices, etc. Because it is a water based temporary tacking adhesive that has coating performance and safety performance as well as an excellent temporary tacking performance and has a low impact on the environment, and because it is water based, it has a natural environment and a working environment. It is an adhesive that can reduce environmental impact such as, and is also excellent in safety.
  • the aqueous temporary tacking adhesive of the present invention is used in applications where temporary tacking performance is required as an adhesive, for example, various electronic devices such as OA devices, information devices, home electric appliances, optical devices, medical devices, automotive devices
  • various members and parts used in various devices such as wafers such as silicon wafers, optical lenses, cutting of sapphire, gallium arsenide, quartz, magnetic members, metal members, glass members, resin members, members for semiconductor devices, etc. It is suitably used for temporary fixing (temporary fixing) in various mechanical processing such as grinding, cutting, grinding, and drilling.

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne : un agent adhésif temporaire à base d'eau qui comprend une résine thermoplastique comportant au moins (A) un groupe hydroxy et qui présente d'excellentes performances à la fois en termes d'adhérence temporaire, d'application et de prévention de l'étalement ; un agent adhésif temporaire à base d'eau qui présente la capacité d'inhiber la dégradation des fonctions de divers éléments et composants qui sont utilisés dans des dispositifs optiques, des dispositifs électroniques et analogues ; un agent adhésif temporaire à base d'eau qui, conjointement avec d'excellentes performances d'adhérence temporaire, présente d'excellentes performances d'application et de sécurité et n'a que de faibles effets sur l'environnement ; et un procédé de fabrication d'un élément ou d'un composant à l'aide de l'agent adhésif temporaire à base d'eau.
PCT/JP2018/046165 2017-12-15 2018-12-14 Agent adhésif temporaire à base d'eau et procédé pour la fabrication dudit agent adhésif temporaire à base d'eau, et procédé pour la fabrication de divers éléments ou composants à l'aide dudit agent adhésif temporaire à base d'eau WO2019117302A1 (fr)

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JP2019502109A JP6535427B1 (ja) 2017-12-15 2018-12-14 水系仮止め接着剤及び水系仮止め接着剤の製造方法、並びに該水系仮止め接着剤を用いた各種部材又は部品の製造方法
CN201880072975.1A CN111328340B (zh) 2017-12-15 2018-12-14 水系临时固定粘接剂和水系临时固定粘接剂的制造方法、以及使用了该水系临时固定粘接剂的各种构件或部件的制造方法

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JP2017240909 2017-12-15
JP2017-240909 2017-12-15
JP2018-037485 2018-03-02
JP2018037485 2018-03-02

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WO2019117302A1 true WO2019117302A1 (fr) 2019-06-20

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JPH06240224A (ja) * 1993-02-16 1994-08-30 The Ink Tec Kk 温水洗浄性液状接着剤
JPH06299031A (ja) * 1993-02-22 1994-10-25 Nippon Synthetic Chem Ind Co Ltd:The ポリビニルアルコール系樹脂組成物、ホットメルト接着剤及びその製造方法
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JP2020196813A (ja) * 2019-06-03 2020-12-10 株式会社Dnpファインケミカル 水系仮止め接着剤及び該水系仮止め接着剤を用いた各種部材又は部品の製造方法
WO2020246470A1 (fr) * 2019-06-03 2020-12-10 株式会社Dnpファインケミカル Adhésif de fixation temporaire à base d'eau et procédé de fabrication de divers éléments ou pièces à l'aide dudit adhésif de fixation temporaire à base d'eau
JP7288807B2 (ja) 2019-06-03 2023-06-08 株式会社Dnpファインケミカル 水系仮止め接着剤及び該水系仮止め接着剤を用いた各種部材又は部品の製造方法

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JP7267107B2 (ja) 2023-05-01
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JPWO2019117302A1 (ja) 2019-12-19
JP2023099535A (ja) 2023-07-13
CN111328340B (zh) 2022-07-01
JP2019163485A (ja) 2019-09-26

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