WO2019116978A1 - Encre métallique, procédé de production d'une encre métallique et procédé de production d'un substrat présentant un motif métallique - Google Patents

Encre métallique, procédé de production d'une encre métallique et procédé de production d'un substrat présentant un motif métallique Download PDF

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Publication number
WO2019116978A1
WO2019116978A1 PCT/JP2018/044668 JP2018044668W WO2019116978A1 WO 2019116978 A1 WO2019116978 A1 WO 2019116978A1 JP 2018044668 W JP2018044668 W JP 2018044668W WO 2019116978 A1 WO2019116978 A1 WO 2019116978A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
less
dispersion medium
mpa
substrate
Prior art date
Application number
PCT/JP2018/044668
Other languages
English (en)
Japanese (ja)
Inventor
渡部　功治
善之 山口
祥晴 大西
Original Assignee
ナガセケムテックス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ナガセケムテックス株式会社 filed Critical ナガセケムテックス株式会社
Priority to JP2019559573A priority Critical patent/JP7248592B2/ja
Publication of WO2019116978A1 publication Critical patent/WO2019116978A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/324—Inkjet printing inks characterised by colouring agents containing carbon black
    • C09D11/326—Inkjet printing inks characterised by colouring agents containing carbon black characterised by the pigment dispersant
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une encre métallique, qui est appliquée sur un substrat dans le but de former un motif métallique, l'encre contenant un colloïde métallique et un milieu de dispersion. Pour ce qui concerne le substrat, au moins une région dans laquelle doit être formé le motif métallique contient une résine thermoplastique. L'écart Dc entre le paramètre de solubilité Hansen du milieu de dispersion et le paramètre de solubilité Hansen du colloïde métallique est de 10 MPa0,5 ou moins ; et l'écart Ds entre le paramètre de solubilité Hansen du milieu de dispersion et le paramètre de solubilité Hansen de la résine thermoplastique est de 10 MPa0,5 ou plus.
PCT/JP2018/044668 2017-12-14 2018-12-05 Encre métallique, procédé de production d'une encre métallique et procédé de production d'un substrat présentant un motif métallique WO2019116978A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019559573A JP7248592B2 (ja) 2017-12-14 2018-12-05 金属インク、金属インクの製造方法、および金属パターンを備える基材の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017240046 2017-12-14
JP2017-240046 2017-12-14

Publications (1)

Publication Number Publication Date
WO2019116978A1 true WO2019116978A1 (fr) 2019-06-20

Family

ID=66820259

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/044668 WO2019116978A1 (fr) 2017-12-14 2018-12-05 Encre métallique, procédé de production d'une encre métallique et procédé de production d'un substrat présentant un motif métallique

Country Status (3)

Country Link
JP (1) JP7248592B2 (fr)
TW (1) TW201932551A (fr)
WO (1) WO2019116978A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7398299B2 (ja) 2020-03-16 2023-12-14 株式会社日本触媒 ３ｄプリンター用光硬化性組成物セット、それを用いた光造形品ならびにその製造方法
WO2024004866A1 (fr) * 2022-06-30 2024-01-04 株式会社レゾナック Dispersion liquide de particules

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04363287A (ja) * 1991-06-10 1992-12-16 Ono Gijutsu Kenkyusho:Kk ポリエステルフィルムの表面に情報記録層を設けた　情報記録用媒体
JP2009215501A (ja) * 2008-03-12 2009-09-24 Hitachi Chem Co Ltd インクジェット用低粘度分散液
JP2011256382A (ja) * 2010-06-09 2011-12-22 Xerox Corp 特定のハンセン溶解度パラメータを有する溶媒を含む銀ナノ粒子組成物
WO2013157514A1 (fr) * 2012-04-16 2013-10-24 ダイソー株式会社 Composition d'encre électroconductrice
JP2014201618A (ja) * 2013-04-02 2014-10-27 旭硝子株式会社 金属微粒子分散液からなる導電インク、導体付き基材
WO2016189866A1 (fr) * 2015-05-27 2016-12-01 ナガセケムテックス株式会社 Encre nanométallique et procédé de production d'un film métallique l'utilisant

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04363287A (ja) * 1991-06-10 1992-12-16 Ono Gijutsu Kenkyusho:Kk ポリエステルフィルムの表面に情報記録層を設けた　情報記録用媒体
JP2009215501A (ja) * 2008-03-12 2009-09-24 Hitachi Chem Co Ltd インクジェット用低粘度分散液
JP2011256382A (ja) * 2010-06-09 2011-12-22 Xerox Corp 特定のハンセン溶解度パラメータを有する溶媒を含む銀ナノ粒子組成物
WO2013157514A1 (fr) * 2012-04-16 2013-10-24 ダイソー株式会社 Composition d'encre électroconductrice
JP2014201618A (ja) * 2013-04-02 2014-10-27 旭硝子株式会社 金属微粒子分散液からなる導電インク、導体付き基材
WO2016189866A1 (fr) * 2015-05-27 2016-12-01 ナガセケムテックス株式会社 Encre nanométallique et procédé de production d'un film métallique l'utilisant

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7398299B2 (ja) 2020-03-16 2023-12-14 株式会社日本触媒 ３ｄプリンター用光硬化性組成物セット、それを用いた光造形品ならびにその製造方法
WO2024004866A1 (fr) * 2022-06-30 2024-01-04 株式会社レゾナック Dispersion liquide de particules

Also Published As

Publication number Publication date
JP7248592B2 (ja) 2023-03-29
TW201932551A (zh) 2019-08-16
JPWO2019116978A1 (ja) 2020-12-17

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