WO2019088079A1 - 積層フィルム及び積層フィルムの製造方法 - Google Patents

積層フィルム及び積層フィルムの製造方法 Download PDF

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Publication number
WO2019088079A1
WO2019088079A1 PCT/JP2018/040273 JP2018040273W WO2019088079A1 WO 2019088079 A1 WO2019088079 A1 WO 2019088079A1 JP 2018040273 W JP2018040273 W JP 2018040273W WO 2019088079 A1 WO2019088079 A1 WO 2019088079A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
protective film
film
laminated film
laminated
Prior art date
Application number
PCT/JP2018/040273
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English (en)
French (fr)
Japanese (ja)
Inventor
貴至 西村
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積水化学工業株式会社
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Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to KR1020207012133A priority Critical patent/KR102667700B1/ko
Priority to CN201880070111.6A priority patent/CN111278639B/zh
Publication of WO2019088079A1 publication Critical patent/WO2019088079A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B32B2038/045—Slitting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a laminated film provided with a substrate, a resin layer, and a protective film. Moreover, this invention relates to the manufacturing method of a laminated film provided with a base material, a resin layer, and a protective film.
  • a resin composition is used to form an insulating layer to insulate the inner layers, or to form an insulating layer located on the surface layer portion.
  • the laminated film provided with the resin layer is used.
  • the adhesive sheet with a protective film provided with a support body, a resin composition layer, and a protective film is disclosed by following patent document 1 as an example of the said laminated
  • a step of slitting (cutting) the adhesive sheet with a protective film is performed.
  • the both ends of the width direction of the adhesive sheet with a protective film are slit.
  • the end surface of the both sides in the width direction of a support body, a resin composition layer, and a protective film is arrange
  • a protective film peels at the time of use of a resin layer.
  • the resin layer exposed by peeling off the protective film is adhered to an adherend such as a metal layer (for example, a laminate of a substrate and a metal wiring or the like), and the resin layer is formed by heating or the like. Cure.
  • An object of the present invention is to provide a laminated film which can suppress cracking of a resin layer at the time of peeling of a protective film and can suppress curing unevenness of the resin layer.
  • the present invention comprises a substrate, a resin layer laminated on the surface of the substrate, and a protective film laminated on the surface of the resin layer opposite to the substrate side.
  • the end faces of the base material and the protective film protrude outward with respect to the end face of the resin layer, and at the other end side opposite to the one end of the laminated film.
  • the end faces of the base material, the resin layer, and the protective film are aligned, or the base relative to the end face of the resin layer in both the one end side of the laminated film and the other end side opposite to the one end
  • the end faces of the material and the protective film are respectively projected to the outside, and the protruding distance between the base material and the protective film at the other end side is the distance between the base material and the protective film at the one end side Hami Smaller than the distance you are laminated film is provided.
  • the end faces of the substrate and the protective film protrude outward with respect to the end face of the resin layer, and At the other end side opposite to the one end, the end faces of the base, the resin layer, and the protective film are aligned.
  • the dimension of the substrate is W 1 mm and the dimension of the resin layer is W 2 mm in the direction connecting the one end and the other end of the laminated film
  • W 2 / W 1 is 0.9 or more and 0.999 or less.
  • the dimension of the resin layer is W 2 mm and the dimension of the protective film is W 3 mm in the direction connecting the one end and the other end of the laminated film
  • W 2 / W 3 is 0.9 or more and 0.999 or less.
  • the resin layer contains an inorganic filler, a curing agent, and a thermosetting compound.
  • the content of the inorganic filler is 30% by weight or more in 100% by weight of the resin layer.
  • a method for producing a laminated film as described above wherein the resin is extruded on the surface of the substrate such that the end surface of the substrate is projected outward with respect to the end surface of the resin layer on one end side.
  • the first step of disposing a layer, and on the surface of the resin layer opposite to the substrate side the end face of the protective layer is protected against the end face of the resin layer on the one side.
  • a second step of disposing a film wherein at one end side of the laminated film corresponding to the one end of the resin layer, the end faces of the base and the protective film are outside with respect to the end face of the resin layer
  • the end faces of the substrate, the resin layer and the protective film are aligned, or one end side of the laminated film and the one end Both sides with opposite end
  • the end faces of the base and the protective film protrude outward with respect to the end face of the resin layer, and the distance between the base and the protective film on the other end side is
  • the manufacturing method of a lamination film which obtains a lamination film smaller than the projection distance of the base material and the protective film in the one end side is provided.
  • the method for producing a laminated film comprises, after the second step, the base material on the other end side opposite to the one end of the resin layer Or aligning the end faces of the resin layer and the protective film, or after the second step, on the other end side opposite to the one end of the resin layer, the base material and the base on the other end side
  • the method further comprises a third step of reducing the distance of extension with the protective film to be smaller than the distance of extension of the base material with the protective film at the one end side.
  • the base, the resin layer, and the protective film are slit.
  • the end face of the base material and the protective film with respect to the end face of the resin layer on one end side of the laminated film corresponding to the one end of the resin layer
  • a laminated film is obtained in which the end faces of the substrate, the resin layer and the protective film are aligned on the other end side of the laminated film opposite to the one end.
  • the laminated film according to the present invention comprises a substrate, a resin layer laminated on the surface of the substrate, and a protective film laminated on the surface of the resin layer opposite to the substrate side.
  • the laminated film according to the present invention has the following configuration (1) or (2). (1) At one end side of the laminated film, the end faces of the base material and the protective film protrude outward with respect to the end face of the resin layer, and at the other end side opposite to the one end of the laminated film The end faces of the base, the resin layer, and the protective film are aligned.
  • the end face of the base material and the protective film is projected to the outside with respect to the end face of the resin layer on both the one end side of the laminated film and the other end side opposite to the one end, and
  • the overhanging distance between the base and the protective film at the other end is smaller than the overhanging distance between the base and the protective film at the one end.
  • the laminated film according to the present invention is provided with the above-described configuration, so cracking of the resin layer at the time of peeling of the protective film can be suppressed, and curing unevenness of the resin layer can be suppressed.
  • FIG. 1 is a cross-sectional view schematically showing a laminated film according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing a laminated film according to a second embodiment of the present invention.
  • FIG. 3 is sectional drawing for demonstrating an example of the manufacturing method of the laminated
  • the laminated film according to the present invention comprises a substrate, a resin layer, and a protective film.
  • the substrate, the resin layer, and the protective film are laminated in this order.
  • the resin layer is laminated on the surface of the substrate.
  • the protective film is laminated on the surface of the resin layer opposite to the substrate side.
  • the laminated film according to the present invention has the following configuration (1) or (2).
  • the end faces of the base material and the protective film protrude outward with respect to the end face of the resin layer, and at the other end side opposite to the one end of the laminated film
  • the end faces of the base, the resin layer, and the protective film are aligned. (Hereafter, it may be described as laminated film (1).)
  • the laminated film according to the present invention is provided with the above-described configuration, so cracking of the resin layer at the time of peeling of the protective film can be suppressed, and curing unevenness of the resin layer can be suppressed. As a result, it is possible to improve the insulation reliability of an electronic component such as a multilayer printed wiring board manufactured using the laminated film according to the present invention.
  • the end faces of the substrate, the resin layer, and the protective film are aligned, or the base and the protective film at the other end of the laminated film.
  • the overhanging distance is smaller than the overhanging distance between the base material and the protective film at one end.
  • the resin layer When the end faces of the substrate, the resin layer, and the protective film are not aligned at both ends of the laminated film, depending on the distance between the substrate and the protective film with respect to the resin layer, the resin layer It is difficult to suppress the curing unevenness of the resin layer because the curing unevenness of the resin layer easily occurs.
  • the end surfaces of the base and the protective film protrude outward with respect to the end surface of the resin layer on one end side of the laminated film.
  • the end faces of the base, the resin layer, and the protective film are aligned.
  • the end face of the base material and the protective film is to the end face of the resin layer on both the one end side of the laminated film and the other end side opposite to the one end. Each one is projected outside.
  • the protruding distance between the base and the protective film at the other end is greater than the distance between the base and the protective film at the one end. small.
  • the laminated film according to the present invention is provided with the above-described configuration, so that cracking of the resin layer at the time of peeling of the protective film can be suppressed, and uneven curing of the resin layer can be suppressed.
  • a protective film can be easily peeled from the end side of a laminated film.
  • the laminate film (1) Is preferred.
  • the end face of the base material and the protective film is projected outward with respect to the end face of the resin layer on one end side of the laminated film (1). There is a method of shifting the
  • the end face of the base material and the protective film is projected outward with respect to the end face of the resin layer on both the one end side of the laminated film (2) and the other end side opposite to the one end.
  • the method of shifting an end surface is mentioned at the time of lamination
  • the shift distance of the end face is adjusted.
  • the method for producing a laminated film according to the present invention has the following configuration (A) or (B).
  • the production method (A) is a production method of the laminated film (1)
  • the production method (B) is a production method of the laminated film (2). It is preferable that the manufacturing method of laminated
  • the resin layer is disposed on the surface of the substrate such that the end surface of the substrate protrudes outward with respect to the end surface on one end side of the resin layer.
  • the end face of the base material and the protective film is to the end face of the resin layer on one end side of the laminated film corresponding to the one end of the resin layer Obtain a laminated film protruding outside.
  • an end face of the substrate, the resin layer and the protective film are aligned. Get).
  • the resin layer is disposed on the surface of the substrate such that the end surface of the substrate protrudes outward with respect to the end surface on one end side of the resin layer
  • the end face of the protective film protrudes outward with respect to the end face of the one end side of the resin layer on the surface of the resin layer opposite to the substrate side.
  • a second step of disposing a protective film is provided.
  • a protective film is applied to both end faces of the one end of the resin layer and the other end opposite to the one end. It is preferable to arrange a protective film so that the end face of the outer side protrudes.
  • the base material and the protective film with respect to the end face of the resin layer on both the one end side of the laminated film and the other end side opposite to the one end The laminated film (2) which the end surface of each has protruded on the outer side is obtained.
  • the protruding distance between the base and the protective film on the other end side is protruding from the base and the protective film on the one end side Obtain a laminated film (2) smaller than the distance.
  • the method further comprises a third step of aligning the end faces.
  • a third step of aligning the end faces in the method for producing a laminated film according to the present invention, in the second step, an end face of the base material, the resin layer, and the protective film on the other end side opposite to the one end of the resin layer. May be aligned.
  • the protruding distance between the base and the protective film on the other end side is the distance between the base on the one end and the base It may be smaller than the protruding distance with the protective film.
  • the resin layer is preferably slit.
  • the substrate, the resin layer and the protective film are preferably slit.
  • the protective film is peeled off when the resin layer is used.
  • An adherend such as a metal layer (for example, a laminate of a substrate and a metal wire) is generally laminated on the surface of the resin layer after the protective film is peeled off.
  • FIG. 1 is a cross-sectional view schematically showing a laminated film according to a first embodiment of the present invention.
  • FIG. 1 is a cross-sectional view showing the laminated film (1).
  • the laminated film 1 has one end 1a and the other end 1b opposite to the one end 1a.
  • the one end 1a and the other end 1b of the laminated film 1 are end portions on both sides facing each other.
  • the laminated film 1 includes a base 4, a resin layer 2, and a protective film 3.
  • the protective film 3 is laminated on the first surface 2 a of the resin layer 2.
  • the substrate 4 is laminated on the second surface 2 b opposite to the first surface 2 a of the resin layer 2.
  • the dimension of the base 4 is larger than the dimension of the resin layer 2 in the direction connecting the one end 1 a and the other end 1 b of the laminated film 1.
  • the dimension of the protective film 3 is larger than the dimension of the resin layer 2.
  • the dimension of the resin layer 2 is smaller than the dimension of the substrate 4 in the direction connecting the one end 1 a and the other end 1 b of the laminated film 1.
  • the dimension of the resin layer 2 is smaller than the dimension of the protective film 3.
  • the end faces of the base material 4 and the protective film 3 protrude to the outside with respect to the end face of the resin layer 2.
  • the end faces of the substrate 4 and the resin layer 2 are not aligned, and the end faces of the resin layer 2 and the protective film 3 are not aligned.
  • the end face on the end 1 a side of the laminated film 1 has a concave shape in which the resin layer 2 portion is concaved.
  • FIG. 2 is a cross-sectional view schematically showing a laminated film according to a second embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing the laminated film (2).
  • the laminated film 1A has one end 1Aa and the other end 1Ab opposite to the one end 1Aa.
  • One end 1Aa and the other end 1Ab of the laminated film 1A are ends on both sides facing each other.
  • the laminated film 1A includes a base 4A, a resin layer 2A, and a protective film 3A.
  • Protective film 3A is laminated on first surface 2Aa of resin layer 2A.
  • the base 4A is laminated on a second surface 2Ab opposite to the first surface 2Aa of the resin layer 2A.
  • the dimension of the base 4A is larger than the dimension of the resin layer 2A in the direction connecting the one end 1Aa and the other end 1Ab of the laminated film 1A.
  • the dimensions of the protective film 3A are larger than the dimensions of the resin layer 2A.
  • the dimension of the resin layer 2A is smaller than the dimension of the base 4A in the direction connecting the one end 1Aa and the other end 1Ab of the laminated film 1A.
  • the dimension of the resin layer 2A is smaller than the dimension of the protective film 3A.
  • the end faces of the base 4A and the protective film 3A protrude outward with respect to the end face of the resin layer 2A.
  • the end faces of the substrate 4A and the resin layer 2A are not aligned, and the end faces of the resin layer 2A and the protective film 3A are not aligned.
  • the end surface on the end 1Aa side of the laminated film 1A has a concave shape in which the resin layer 2A portion is concaved.
  • On the end 1Aa side of the laminated film 1A there is a portion where the resin layer 2A is not laminated on the base 4A, and a portion where the resin layer 2A is not laminated on the protective film 3A.
  • the end faces of the base 4A and the protective film 3A protrude outward with respect to the end face of the resin layer 2A.
  • the end faces of the base 4A and the resin layer 2A are not aligned, and the end faces of the resin layer 2A and the protective film 3A are not aligned.
  • the end face on the other end 1Ab side of the laminated film 1A has a concave shape in which the resin layer 2A portion is concaved.
  • the protruding distance of the base 4A and the protective film 3A on the other end 1Ab side of the laminated film 1A is smaller than the protruding distance of the base 4A and the protective film 3A on the one end 1Aa side.
  • FIG. 3 is sectional drawing for demonstrating an example of the manufacturing method of the laminated
  • FIG. 3 is sectional drawing for demonstrating an example of the manufacturing method (A) of the said laminated
  • the laminated film 1 shown in FIG. 1 may be obtained, for example, through the steps shown in FIG. 3 (a), FIG. 3 (b-1) or FIG. 3 (b-2) and FIG. 3 (c). it can.
  • FIG. 3A By partially changing each process shown in FIG. 3A, FIG. 3B, FIG. 3B, and FIG. 3C, the laminated film 1A shown in FIG. You can also get it.
  • the resin layer 2 is disposed on the surface of the base 4 so that the end face of the base 4 protrudes outward with respect to the end face on one end side of the resin layer 2 (first Process).
  • the resin layer 2 is disposed such that the end face of the base material 4 protrudes outside with respect to the end face on the other end side opposite to the one end of the resin layer 2.
  • the resin layer 2 may be disposed so that the end face on the other end side of the resin layer 2 and the end face of the base 4 are aligned.
  • the resin composition for forming the resin layer 2 may be coated on the surface of the substrate 4 and the resin composition may be formed into a film to form the resin layer.
  • the temperature at the time of drying is preferably 80 ° C. or more, more preferably 100 ° C. or more, preferably 160 ° C. or less, more preferably 140 ° C. or less.
  • the solvent in the resin composition can be volatilized.
  • the resin layer 2 is preferably a B-stage film.
  • the end faces of the substrate 4, the resin layer 2 and the protective film 3 are aligned at the other end side opposite to one end of the resin layer 2 Absent.
  • the resin layer 2 is disposed such that the end face of the protective film 3 protrudes outside with respect to the end face of the resin layer 2 on the other end side opposite to the one end.
  • the resin layer 2 is disposed such that the end face of the protective film 3 is inside with respect to the end face on the other end side opposite to the one end of the resin layer 2.
  • the end faces of the substrate, the resin layer and the protective film may be aligned.
  • the temperature during lamination is preferably 70 ° C. or less, more preferably 65 ° C. or less.
  • the lower limit of the temperature during lamination is not particularly limited, but is usually 20 ° C. or 25 ° C. or the like.
  • the pressure during lamination is preferably 0.01 MPa or more, more preferably 0.02 MPa or more, preferably 1.0 MPa or less, more preferably 0.8 MPa or less.
  • the laminated film preferably has a MD (Machine Direction) direction and a TD (Transverse Direction) direction.
  • the MD direction is the flow direction of the laminated film at the time of production of the laminated film, and is, for example, the length direction.
  • the TD direction is a direction perpendicular to the flow direction of the laminated film at the time of production of the laminated film, and a direction perpendicular to the thickness direction of the laminated film.
  • the TD direction is the width direction. It is preferable that the said one end and said other end of the said laminated film are the edge parts of the both sides which the width direction of a laminated film opposes.
  • the dimension of the substrate is W 1 mm
  • the dimension of the resin layer is W 2 mm
  • the dimension of the protective film is W 3 mm in the direction connecting the one end and the other end of the laminated film according to the present invention.
  • W 1 is greater than W 2
  • W 3 is larger than W 2.
  • the laminated film according to the present invention generally satisfies W 1 > W 2 and W 3 > W 2 .
  • W 2 / W 1 (the ratio of the size of the resin layer to the size of the base material) is preferably 0.9 or more, more preferably 0.92 or more, still more preferably 0.94 or more, particularly preferably 0.96 or more It is.
  • W 2 / W 1 (the ratio of the size of the resin layer to the size of the base material) is preferably at most 0.999, more preferably at most 0.998, still more preferably at most 0.997, particularly preferably at most 0.996 It is.
  • W 2 / W 1 is equal to or less than the above lower limit or more and the upper limit, cracking of the resin layer at the time of peeling the protective film further suppressed, and it is possible to suppress the hardening irregularity of resin layer further.
  • W 2 / W 3 (the ratio of the dimension of the resin layer to the dimension of the protective film) is preferably 0.9 or more, more preferably 0.92 or more, still more preferably 0.94 or more, particularly preferably 0.96 or more It is.
  • the ratio of W 2 / W 3 (the ratio of the size of the resin layer to the size of the protective film) is preferably at most 0.999, more preferably at most 0.998, still more preferably at most 0.997, particularly preferably at most 0.996 It is.
  • W 3 / W 1 (the ratio of the dimension of the protective film to the dimension of the substrate) is preferably 0.997 or more, more preferably 0.998 or more, still more preferably 0.999 or more, particularly preferably 1.0 or more It is.
  • W 3 / W 1 (ratio of dimension of protective film to dimension of substrate) is preferably 1.01 or less, more preferably 1.009 or less, still more preferably 1.008 or less, particularly preferably 1.007 or less It is.
  • the overhanging distance of the substrate at one end side is more than 0 mm, preferably 3 mm or more, preferably 15 mm or less, more preferably 10 mm or less.
  • the extension distance of the protective film on one end side is more than 0 mm, preferably 3 mm or more, preferably 15 mm or less, more preferably 10 mm or less.
  • the absolute value of the difference between the overhanging distance of the substrate at the other end and the overhanging distance of the substrate at one end exceeds 0 mm, preferably 3 mm or more, more preferably Is 5 mm or more, more preferably 10 mm or more.
  • the absolute value of the difference between the protruding distance of the protective film at the other end and the protruding distance of the protective film at the one end exceeds 0 mm, preferably 3 mm or more, more preferably Is 5 mm or more, more preferably 10 mm or more.
  • the crack of the resin layer at the time of peeling of a protective film can be further suppressed as the absolute value of the above-mentioned difference is more than the above-mentioned minimum, respectively, and the hardening nonuniformity of a resin layer can be suppressed further.
  • the overhanging distance of the substrate on the other end side is more than 0 mm, preferably 10 mm or less, more preferably 5 mm or less, still more preferably 1 mm or less.
  • the overhanging distance of the protective film on the other end side is more than 0 mm, preferably 10 mm or less, more preferably 5 mm or less, still more preferably 1 mm or less.
  • the substrate examples include metal foils, polyester resin films such as polyethylene terephthalate films and polybutylene terephthalate films, olefin resin films such as polyethylene films and polypropylene films, and polyimide films.
  • the surface of the substrate may be subjected to release treatment, if necessary.
  • the substrate may be a metal foil or a resin film.
  • the substrate is preferably a resin film.
  • the said metal foil is copper foil.
  • the thickness of the above-mentioned base material is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, preferably 75 ⁇ m or less, from the viewpoint of making the operability of the laminated film good and making the lamination of the resin layer good. 60 ⁇ m or less.
  • the resin layer is laminated on the surface of the substrate. It is preferable that the said resin layer contains the inorganic filler mentioned later, the hardening
  • the resin layer preferably contains an inorganic filler.
  • the use of the inorganic filler reduces the dimensional change of the cured resin layer due to heat. Furthermore, the surface roughness of the surface of the cured product of the resin layer is further reduced, and the adhesive strength between the cured product and the metal layer is increased.
  • the inorganic filler may be used alone or in combination of two or more.
  • examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.
  • the above-mentioned inorganic filler is preferably silica or alumina, more preferably silica, and still more preferably fused silica.
  • the use of silica further lowers the thermal expansion coefficient of the cured product, effectively reduces the surface roughness of the surface of the cured product, and effectively increases the adhesion strength between the cured product and the metal layer.
  • the shape of the silica is preferably spherical.
  • the inorganic filler is spherical silica Is preferred.
  • the average particle diameter of the above inorganic filler is preferably 10 nm or more, more preferably 50 nm or more, still more preferably 100 nm or more, preferably 5 ⁇ m or less, more preferably 3 ⁇ m or less, still more preferably 1 ⁇ m or less, particularly preferably 0.5 ⁇ m It is below.
  • cured material and a metal layer becomes it still higher that the average particle diameter of the said inorganic filler is more than the said minimum and below the said upper limit.
  • the average particle diameter of the above-mentioned inorganic filler a value of median diameter (d50) which is 50% is adopted.
  • the average particle size can be measured using a laser diffraction scattering type particle size distribution measuring apparatus.
  • the inorganic filler is preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and the adhesion strength between the cured product and the metal layer is effectively increased.
  • the aspect ratio of the inorganic filler is preferably 2 or less, more preferably 1.5 or less.
  • the inorganic filler is preferably surface-treated, more preferably a surface-treated product with a coupling agent, and still more preferably a surface-treated product with a silane coupling agent.
  • silane coupling agent a silane coupling agent, a titanium coupling agent, an aluminum coupling agent etc.
  • silane coupling agent examples include methacryl silane, acryl silane, aminosilane, imidazole silane, vinyl silane, and epoxy silane.
  • the content of the inorganic filler is preferably 30% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, particularly preferably 60% by weight or more, and most preferably 100% by weight of the resin layer. Is 70% by weight or more, preferably 90% by weight or less, more preferably 85% by weight or less, still more preferably 83% by weight or less, particularly preferably 80% by weight or less.
  • the content of the inorganic filler is the lower limit or more and the upper limit or less, the surface roughness of the surface of the cured product is further decreased, and the adhesion strength between the cured product and the metal layer is further enhanced, and cured. Finer wiring is formed by the surface of the object.
  • this inorganic filler it is also possible to make smear removability good simultaneously with lowering the coefficient of thermal expansion of a hardened material.
  • the content of the inorganic filler is at least the lower limit, the dielectric loss tangent is effectively reduced.
  • the crack of the resin layer at the time of peeling of a protective film can be suppressed much more effectively as content of the said inorganic filler is below the said upper limit.
  • the resin layer preferably contains a thermosetting compound.
  • the said thermosetting compound is not specifically limited.
  • thermosetting compound conventionally known thermosetting compounds can be used.
  • thermosetting compound examples include styrene compounds, phenoxy compounds, oxetane compounds, epoxy compounds, episulfide compounds, (meth) acrylic compounds, phenol compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds. It can be mentioned. Only one type of the thermosetting compound may be used, or two or more types may be used in combination.
  • the thermosetting compound is preferably an epoxy compound.
  • the epoxy compound refers to an organic compound having at least one epoxy group. Only one type of the thermosetting compound and the epoxy compound may be used, or two or more types may be used in combination.
  • epoxy compounds examples include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds , Fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthalene ether type
  • skeleton, etc. are mentioned.
  • the epoxy compound preferably has an aromatic skeleton, preferably has a biphenyl skeleton, and is preferably a biphenyl type epoxy compound.
  • the molecular weight of the epoxy compound is more preferably 1,000 or less. In this case, when the resin layer is laminated on the substrate, the inorganic filler can be uniformly present.
  • the molecular weight of the epoxy compound and the molecular weight of the curing agent described later mean the molecular weight that can be calculated from the structural formula. Do. Moreover, when an epoxy compound or a hardening
  • the content of the thermosetting compound (epoxy compound when the thermosetting compound is an epoxy compound) in 100% by weight of the resin layer is preferably 10% by weight or more, more preferably 20% by weight or more, and preferably Is 70% by weight or less, more preferably 65% by weight or less, still more preferably 60% by weight or less, and particularly preferably 55% by weight or less.
  • the adhesive strength of an insulating layer and a metal layer can be further heightened as the said content is more than the said minimum and below the said upper limit.
  • the resin layer preferably contains a curing agent.
  • the curing agent is not particularly limited. A conventionally known curing agent can be used as the above-mentioned curing agent. Only one type of the curing agent may be used, or two or more types may be used in combination.
  • cyanate ester compounds cyanate ester curing agents
  • phenol compounds phenol curing agents
  • amine compounds amine curing agents
  • thiol compounds thiol curing agents
  • imidazole compounds phosphine compounds
  • acid anhydrides Active ester compounds and dicyandiamide
  • the thermosetting compound is an epoxy compound
  • the curing agent preferably has a functional group capable of reacting with the epoxy group of the epoxy compound.
  • novolak-type cyanate ester resin novolak-type cyanate ester resin, bisphenol-type cyanate ester resin, the prepolymer by which these were partially trimerized, etc.
  • the novolac type cyanate ester resin include phenol novolac type cyanate ester resin and alkylphenol type cyanate ester resin.
  • bisphenol type cyanate ester resin bisphenol A type cyanate ester resin, bisphenol E type cyanate ester resin, tetramethyl bisphenol F type cyanate ester resin, etc. are mentioned.
  • cyanate ester compounds include phenol novolac type cyanate ester resins ("PT-30” and “PT-60” manufactured by Lonza Japan Co., Ltd.), and prepolymers in which bisphenol type cyanate ester resins are trimerized (Lonza Japan Company-made “BA-230S”, “BA-3000S”, “BTP-1000S” and “BTP-6020S” etc. are mentioned.
  • phenol compound examples include novolac type phenol, biphenol type phenol, naphthalene type phenol, dicyclopentadiene type phenol, aralkyl type phenol and dicyclopentadiene type phenol.
  • novolac type phenol (“TD-2091” manufactured by DIC Corporation), biphenyl novolac type phenol (“MEH-7851” manufactured by Meiwa Kasei Co., Ltd.), aralkyl type phenol compound (“MEH manufactured by Meiwa Chemical Co., Ltd.”
  • phenol having an aminotriazine skeleton (“LA1356” and “LA3018-50P” manufactured by DIC Corporation).
  • the curing agent preferably contains an active ester compound.
  • the active ester compound refers to a compound having at least one ester bond in the structure and having an aromatic ring bonded to both sides of the ester bond.
  • the compound represented by following formula (1) as a preferable example of an active ester compound is mentioned.
  • X1 and X2 each represent a group containing an aromatic ring.
  • the group containing the said aromatic ring the benzene ring which may have a substituent, the naphthalene ring which may have a substituent, etc. are mentioned.
  • a hydrocarbon group is mentioned as said substituent.
  • the carbon number of the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and still more preferably 4 or less.
  • the combination of X 1 and X 2 is a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent, and which has a substituent
  • a combination of a benzene ring which may be substituted with a naphthalene ring which may have a substituent is also included.
  • the combination of X 1 and X 2 includes a combination of a naphthalene ring which may have a substituent and a naphthalene ring which may have a substituent.
  • the said active ester compound is not specifically limited.
  • Examples of commercially available products of the above active ester compounds include "HPC-8000-65T”, “EXB9416-70BK”, “EXB8100-65T” and “EXB-8000L-65MT” manufactured by DIC Corporation.
  • curing agent is 1000 or less. In this case, when the resin layer is laminated on the substrate, the inorganic filler can be uniformly present.
  • the content of the total of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are preferably 100% by weight of the components excluding the inorganic filler in the resin layer. Is 75% by weight or more, more preferably 80% by weight or more, preferably 99% by weight or less, and more preferably 97% by weight or less.
  • a still better cured product is obtained when the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are the lower limit or more and the upper limit or less. Since the melt viscosity can be adjusted, the dispersibility of the inorganic filler is improved. Furthermore, in the curing process, it is possible to prevent the resin layer from wetting and spreading to unintended regions.
  • the dimensional change of the cured product due to heat can be further suppressed.
  • the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are at least the lower limit, the melt viscosity does not become too low, and the curing process Therefore, the insulating film tends to be difficult to spread excessively in the unintended region.
  • the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are less than or equal to the upper limit, it is easy to bury the circuit board in holes or asperities.
  • the inorganic filler tends to be difficult to be present unevenly.
  • the content of the curing agent is preferably 30% by weight or more, more preferably 40% by weight or more, and preferably 70% by weight or less in 100% by weight of the components excluding the inorganic filler in the resin layer. Preferably it is 60 weight% or less.
  • the content of the curing agent is at least the lower limit and the upper limit, a more favorable cured product is obtained, and the dielectric loss tangent is effectively reduced.
  • the resin layer preferably contains a thermoplastic resin.
  • the thermoplastic resin include polyvinyl acetal resin and phenoxy resin. Only one type of the thermoplastic resin may be used, or two or more types may be used in combination.
  • the thermoplastic resin is preferably a phenoxy resin from the viewpoint of effectively reducing the dielectric loss tangent and effectively improving the adhesion of the metal wiring regardless of the curing environment.
  • phenoxy resin By the use of phenoxy resin, the deterioration of the filling property of the resin layer to the holes or irregularities of the circuit board and the nonuniformity of the inorganic filler can be suppressed.
  • the use of the phenoxy resin makes it possible to adjust the melt viscosity, so that the dispersibility of the inorganic filler is improved, and the resin layer is less likely to wet and spread in an unintended region in the curing process.
  • the phenoxy resin is not particularly limited. A conventionally known phenoxy resin can be used as the phenoxy resin.
  • the phenoxy resin may be used alone or in combination of two or more.
  • phenoxy resin examples include a bisphenol A type skeleton, a bisphenol F type skeleton, a bisphenol S type skeleton, a biphenyl skeleton, a novolak skeleton, a naphthalene skeleton, and a phenoxy skeleton having a skeleton such as an imide skeleton.
  • Examples of commercial products of the phenoxy resin include “YP50”, “YP55” and “YP70” manufactured by Nippon Steel Sumikin Chemical Co., Ltd., and “1256B40”, “4250”, “4256H40”, “4275” manufactured by Mitsubishi Chemical Corporation. And “YX6954BH30” and “YX8100BH30”.
  • the weight average molecular weight of the thermoplastic resin is preferably 5000 or more, more preferably 10000 or more, preferably 100000 or less, more preferably 50000 or less.
  • the said weight average molecular weight of the said thermoplastic resin shows the weight average molecular weight in polystyrene conversion measured by gel permeation chromatography (GPC).
  • the content of the thermoplastic resin and the phenoxy resin is not particularly limited.
  • the content of the thermoplastic resin (the content of the phenoxy resin when the thermoplastic resin is a phenoxy resin) is preferably 1% by weight or more in 100% by weight of the components excluding the inorganic filler in the resin layer. More preferably, it is 5% by weight or more, preferably 30% by weight or less, and more preferably 15% by weight or less.
  • the content of the thermoplastic resin is not less than the lower limit and not more than the upper limit, the burying property of the resin layer to the hole or the unevenness of the circuit board is improved.
  • thermoplastic resin When the content of the thermoplastic resin is equal to or more than the above lower limit, the formation of the resin layer is further facilitated, and a better insulating layer can be obtained.
  • cured material becomes it still lower that content of the said thermoplastic resin is below the said upper limit.
  • the surface roughness of the surface of the cured product is further reduced, and the adhesion strength between the cured product and the metal layer is further enhanced.
  • the resin layer preferably contains a curing accelerator.
  • the use of the above curing accelerator makes the curing speed faster. By rapidly curing the resin layer, the crosslinked structure in the cured product becomes uniform, and the number of unreacted functional groups is reduced, resulting in an increase in the crosslinking density.
  • the curing accelerator is not particularly limited, and conventionally known curing accelerators can be used.
  • the said hardening accelerator may be used only by 1 type, and 2 or more types may be used together.
  • an imidazole compound As said hardening accelerator, an imidazole compound, a phosphorus compound, an amine compound, an organic metal compound etc. are mentioned, for example.
  • Examples of the phosphorus compounds include triphenylphosphine and the like.
  • Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine and 4,4-dimethylaminopyridine.
  • organic metal compounds examples include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bis (acetylacetonato) cobalt (II), and tris (acetylacetonato) cobalt (III).
  • the content of the curing accelerator is not particularly limited.
  • the content of the curing accelerator is preferably 0.005% by weight or more, more preferably 0.01% by weight or more, and preferably 5% by weight or less in 100% by weight of the components excluding the inorganic filler in the resin layer. More preferably, it is 3% by weight or less.
  • the resin layer does not contain or contains a solvent. Moreover, the said solvent may be used in order to obtain the slurry containing the said inorganic filler.
  • the solvent may be used alone or in combination of two or more.
  • solvents acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone
  • examples include N, N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone and naphtha as a mixture.
  • the boiling point of the solvent is preferably 200 ° C. or less, more preferably 180 ° C. or less.
  • the content of the solvent in the resin layer is not particularly limited. The content of the solvent can be appropriately changed to such an extent that the layer shape of the resin layer can be maintained.
  • the resin layer contains a leveling agent, a flame retardant, a coupling agent, a coloring agent, an antioxidant, an anti-ultraviolet deterioration inhibitor, and a light-emitting agent.
  • a foaming agent, a thickener, a thixotropic agent and a thermosetting resin other than the above-mentioned thermosetting compound may be added.
  • silane coupling agent a silane coupling agent, a titanium coupling agent, an aluminum coupling agent etc. are mentioned.
  • silane coupling agent examples include vinylsilane, aminosilane, imidazolesilane and epoxysilane.
  • thermosetting resin examples include polyphenylene ether resin, divinyl benzyl ether resin, polyarylate resin, diallyl phthalate resin, polyimide resin, benzoxazine resin, benzoxazole resin, bismaleimide resin, acrylate resin and the like.
  • the following method etc. are mentioned as a method of obtaining the said resin layer.
  • An extrusion molding method in which a material for forming a resin layer is melt-kneaded and extruded using an extruder, and then formed into a film by a T die or a circular die.
  • a casting method in which a material for forming a resin layer containing a solvent is cast and formed into a film.
  • the material for forming a resin layer can be laminated
  • the extrusion molding method or the casting molding method is preferable because it can cope with thinning.
  • the film includes a sheet.
  • a resin that is a B-stage film is formed by forming a material for forming a resin layer into a film and heating and drying it at, for example, 50 ° C. to 150 ° C. for 1 minute to 10 minutes so that curing by heat does not proceed excessively You can get a layer.
  • the film-like resin layer obtainable by the above-mentioned drying step is referred to as a B-stage film.
  • the B-stage film is in a semi-cured state.
  • the semi-cured product is not completely cured, and curing can be further advanced.
  • the resin layer is preferably a B-stage film.
  • the thickness of the resin layer is preferably 5 ⁇ m.
  • the thickness is more preferably 10 ⁇ m or more, preferably 200 ⁇ m or less, and more preferably 100 ⁇ m or less.
  • the protective film is laminated on the surface of the resin layer opposite to the substrate side.
  • Examples of the material of the protective film include polyolefins such as polypropylene and polyethylene, and polyethylene terephthalate.
  • the material of the protective film is preferably a polyolefin, more preferably polypropylene.
  • the thickness of the protective film is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, preferably 75 ⁇ m or less, more preferably 60 ⁇ m or less.
  • the laminated film according to the present invention is suitably used to form an insulating layer in a multilayer printed wiring board.
  • An insulating layer can be formed by the resin layer of the laminated film according to the present invention.
  • the multilayer printed wiring board is a multilayer printed wiring board including a circuit board, a plurality of insulating layers stacked on the circuit board, and a metal layer disposed between the plurality of insulating layers. At least one of the insulating layers is formed of the resin layer. The insulating layer in contact with the circuit board may be formed of the resin layer. An insulating layer disposed between two insulating layers may be formed by the resin layer. The insulating layer farthest from the circuit board may be formed of the resin layer. Among the plurality of insulating layers, a metal layer may be disposed on the outer surface of the insulating layer remote from the circuit board.
  • Protective film (“Alfan MA-411" manufactured by Oji F-TEX, 15 ⁇ m thick, 550 mm wide)
  • the material for forming a resin layer was prepared as follows.
  • Materials for forming a resin layer 107 parts by weight of a cyclohexanone slurry (solid content: 70% by weight) of aminophenylsilane-treated silica ("SOC 2" manufactured by Admatex Co., Ltd.) was prepared. To this slurry, 11 parts by weight of a biphenyl type epoxy compound ("NC 3000H” manufactured by Nippon Kayaku Co., Ltd.), 5 parts by weight of a bisphenol A type epoxy compound ("850S” manufactured by DIC), 7.9 parts by weight of cyclohexanone, and methyl ethyl ketone 7.7 parts by weight were added. Stirring was performed at 1200 rpm for 60 minutes using a stirrer, and it was confirmed that the undissolved matter disappeared.
  • NC 3000H manufactured by Nippon Kayaku Co., Ltd.
  • a bisphenol A type epoxy compound (“850S” manufactured by DIC)
  • Example 1 Placing a resin layer on the surface of the substrate: Using a die coater, the material (varnish) for forming the obtained resin layer is coated on the substrate with a width of 410 mm, excluding the range of 70 mm from both ends in the width direction of the substrate, It was dried at an average temperature of 100 ° C. for 3 minutes to evaporate the solvent. In this way, a resin layer having a thickness of 40 ⁇ m and a width of 410 mm was formed on the base material.
  • a protective film is thermally laminated at a pressure of 0.4 MPa and a temperature of 50 ° C. on the surface opposite to the substrate side of the resin layer, and then wound up in a roll to obtain a laminate of the substrate, the resin layer and the protective film. Obtained.
  • Step of aligning one end face in the width direction of the laminate A slitter is provided at a position 84 mm inward from one end (the other end) in the width direction of the obtained laminate and a position 66 mm inward from the end (one end) opposite to the other end. Slit at a speed of 10 m / min to align the end face of the base on the other end side, the end face of the resin layer, and the end face of the protective film.
  • a laminate film having a width (W 1 ) of the substrate in the width direction of 400 mm, a width (W 2 ) of the resin layer of 396 mm, and a width (W 3 ) of the protective film of 400 mm.
  • Example 2 Placing a resin layer on the surface of the substrate: A resin layer was formed in the same manner as in Example 1.
  • Step of aligning the end face of the other end of the laminated film A slitter is formed at a position 120 mm inward from one end (the other end) in the width direction of the obtained laminate, and 30 mm from the end (one end) opposite to the other end in the width direction. Slit at a speed of 10 m / min to align the end face of the base on the other end side, the end face of the resin layer, and the end face of the protective film.
  • a laminated film having a width (W 1 ) of the substrate in the width direction of 400 mm, a width (W 2 ) of the resin layer of 360 mm, and a width (W 3 ) of the protective film of 400 mm.
  • Example 3 Placing a resin layer on the surface of the substrate: A resin layer was formed in the same manner as in Example 1.
  • Step of aligning one end face in the width direction of the laminate A slitter is formed at a position 140 mm inward from one end (the other end) in the width direction of the obtained laminate and at a position 10 mm inward from the end (one end) opposite to the other end. Slit at a speed of 10 m / min to align the end face of the base on the other end side, the end face of the resin layer, and the end face of the protective film.
  • a laminated film having a width (W 1 ) of the substrate in the width direction of 340 mm, a width (W 2 ) of the resin layer of 400 mm, and a width (W 3 ) of the protective film of 400 mm.
  • a slitter is provided at a position 48 mm inward from one end (the other end) in the width direction of the obtained laminate, and 48 mm from the end (one end) opposite to the other end in the width direction. Slit at a speed of 10 m / min.
  • the substrate width dimension (W 1 ) is 454 mm
  • the resin layer width direction dimension (W 2 ) is 410 mm
  • the protective film width direction dimension (W 3 ) is 454 mm.
  • a laminated film was obtained in which both end faces in the width direction of the film were not aligned.
  • Step of aligning both end faces in the width direction of the laminate A slitter is provided at a position 75 mm inward from one end (the other end) in the width direction of the obtained laminate, and 75 mm from the other end (one end) in the width direction. Slit at a speed of 10 m / min.
  • the dimension in the width direction of the substrate (W 1 ), the dimension in the width direction of the resin layer (W 2 ), and the dimension in the width direction of the protective film (W 3 ) are all 400 mm.
  • a laminated film in which both end faces in the width direction of the film are aligned is obtained.
  • the laminate of the obtained base material, resin layer and glass epoxy substrate was placed in a heating oven ("SPHH-201" manufactured by ESPEC) and heated at a temperature of 170 ° C. for 60 minutes to cure the resin layer. After heating, the base was left to stand at normal temperature and cooled, and then the base material was peeled off to obtain a laminate of a resin layer (cured product) and a glass epoxy substrate.
  • SPHH-201 manufactured by ESPEC
  • the glass transition temperatures Tg of the obtained three cured product samples were measured using a temperature measurement rate of 3 ° C./min and a temperature range of -30 ° C. to 250 ° C. using “Q2000” manufactured by TA Instruments. The In the obtained measurement results, the unevenness of curing of the resin layer was evaluated by determining the difference between the maximum value and the minimum value of the Tg of the three cured product samples.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2018/040273 2017-11-02 2018-10-30 積層フィルム及び積層フィルムの製造方法 WO2019088079A1 (ja)

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