WO2019054349A1 - Élément oscillateur à cristal et son procédé de fabrication - Google Patents

Élément oscillateur à cristal et son procédé de fabrication Download PDF

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Publication number
WO2019054349A1
WO2019054349A1 PCT/JP2018/033552 JP2018033552W WO2019054349A1 WO 2019054349 A1 WO2019054349 A1 WO 2019054349A1 JP 2018033552 W JP2018033552 W JP 2018033552W WO 2019054349 A1 WO2019054349 A1 WO 2019054349A1
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WIPO (PCT)
Prior art keywords
main surface
central portion
electrode
vibrating element
excitation electrode
Prior art date
Application number
PCT/JP2018/033552
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English (en)
Japanese (ja)
Inventor
有彌 井田
和彦 指崎
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201880057404.0A priority Critical patent/CN111052602B/zh
Priority to JP2019542052A priority patent/JP6842682B2/ja
Publication of WO2019054349A1 publication Critical patent/WO2019054349A1/fr

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz

Definitions

  • the present invention relates to a quartz crystal vibrating element and a method of manufacturing the same.
  • the piezoelectric vibrator is mounted on a mobile communication device or the like, and is used as, for example, a timing device or a load sensor.
  • a quartz oscillator which is a type of piezoelectric oscillator, utilizes artificial quartz for the piezoelectric body and has high frequency accuracy.
  • the quartz crystal vibrating element mounted on the quartz oscillator is formed, for example, by performing outline processing on a quartz piece by etching using photolithography technology, and patterning various electrodes on the quartz piece. In order to improve processing accuracy by etching, various configurations have been studied.
  • a quartz chip is etched using a photoresist and a corrosion resistant film as a mask to form a step surface and an inclined surface, a step of removing the photoresist and the corrosion resistant film, and a metal film using a photoresist as a mask And forming an excitation electrode, an extraction electrode, and the like.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide a quartz crystal vibrating element capable of reducing a manufacturing error of vibration characteristics and a method of manufacturing the same.
  • a method of manufacturing a quartz crystal vibrating element includes a first main surface and a second main surface opposite to the first main surface, and is positioned on the center side when the first main surface is viewed in plan.
  • a quartz crystal vibrating element has a first main surface and a second main surface opposite to the first main surface, and a center located on the center side when the first main surface is viewed in plan. And a peripheral portion located outside the central portion, and a first side surface is formed between the central portion and the peripheral portion on at least the first main surface side of the first main surface and the second main surface
  • the first main surface of the crystal piece covers at least a portion of the first excitation electrode, and extends from the central portion to the peripheral portion That.
  • FIG. 1 is an exploded perspective view schematically showing the configuration of a quartz oscillator according to the first embodiment.
  • FIG. 2 is a cross sectional view schematically showing a configuration of a cross section taken along line II-II of the quartz oscillator shown in FIG.
  • FIG. 3 is a cross-sectional view schematically showing the configuration of the quartz crystal vibrating element shown in FIG.
  • FIG. 4 is a flow chart schematically showing a part of the method of manufacturing a quartz crystal vibrating element according to the first embodiment.
  • FIG. 5 is a flowchart schematically showing a method of manufacturing the crystal vibrating element according to the first embodiment, following the flowchart shown in FIG.
  • FIG. 6 is a cross-sectional view schematically showing a process of etching a crystal piece.
  • FIG. 1 is an exploded perspective view schematically showing the configuration of a quartz oscillator according to the first embodiment.
  • FIG. 2 is a cross sectional view schematically showing a configuration of a cross section taken along line II-
  • FIG. 7 is a cross sectional view schematically showing a step of providing a second adhesive layer and a second conductive layer.
  • FIG. 8 is a cross sectional view schematically showing a process of patterning a photoresist.
  • FIG. 9 is a cross sectional view schematically showing a step of etching the second adhesive layer and the second conductive layer.
  • FIG. 10 is a cross-sectional view schematically showing a process of scraping the electrode surface in the central portion.
  • FIG. 11 is a cross-sectional view schematically showing a configuration of a crystal unit according to a second embodiment.
  • FIG. 12 is an exploded perspective view schematically showing the configuration of a crystal unit according to a third embodiment.
  • FIG. 13 is a cross-sectional view schematically showing a configuration of a crystal unit according to a third embodiment.
  • FIG. 14 is a perspective view schematically showing the configuration of a quartz crystal vibrating element according to a fourth embodiment.
  • FIG. 1 is an exploded perspective view schematically showing the configuration of a quartz oscillator according to the first embodiment.
  • FIG. 2 is a cross sectional view schematically showing a configuration of a cross section taken along line II-II of the quartz oscillator shown in FIG.
  • FIG. 3 is a cross-sectional view schematically showing the configuration of the quartz crystal vibrating element shown in FIG.
  • the first direction D1, the second direction D2, and the third direction D3 shown in the drawing are directions orthogonal to each other.
  • the first direction D1, the second direction D2, and the third direction D3 may be directions intersecting each other at an angle other than 90 °.
  • the first direction D1, the second direction D2, and the third direction D3 are not limited to the direction (positive direction) of the arrow shown in FIG. 1, but also includes the direction (negative direction) opposite to the arrow.
  • a quartz crystal resonator unit (Quartz Crystal Resonator Unit) 1 is a type of piezoelectric vibrator (Piezoelctric Resonator Unit), and excites a quartz crystal resonator element (Quartz Crystal Resonator) 10 according to an applied voltage.
  • the crystal vibrating element 10 utilizes a quartz crystal element 11 as a piezoelectric body that vibrates according to an applied voltage.
  • the crystal unit 1 includes a crystal vibrating element 10, a lid member 20, a base member 30, and a bonding member 40.
  • the base member 30 and the lid member 20 are a holder for housing the quartz crystal vibrating element 10.
  • the lid member 20 has a concave shape, specifically a box shape having an opening
  • the base member 30 has a flat shape.
  • the shapes of the lid member 20 and the base member 30 are not limited to the above, and for example, the base member may have a concave shape, and the concave member has an opening on the side where both the lid member and the base member face each other. It may be
  • the quartz crystal vibrating element 10 has a thin plate-like quartz piece 11.
  • the crystal piece 11 has a first main surface 11a and a second main surface 11b facing each other.
  • the first major surface 11 a is located on the opposite side to the side facing the base member 30, and the second major surface 11 b is located on the side facing the base member 30.
  • the crystal piece 11 is, for example, an AT cut type crystal piece.
  • the main surface of the AT-cut quartz crystal piece is hereinafter referred to as a plane parallel to the plane specified by the X-axis and Z'-axis (hereinafter referred to as "XZ 'plane". About planes specified by other axes or other directions The same is true. Therefore, the first major surface 11 a and the second major surface 11 b of the quartz crystal piece 11 correspond to the XZ ′ plane, respectively.
  • the AT-cut type crystal piece is formed, for example, by etching a quartz substrate obtained by cutting and polishing a synthetic crystal which has been crystal grown.
  • the X axis, the Y axis, and the Z axis are crystallographic axes of crystal (Crystallographic Axes), the X axis corresponds to an electric axis, the Y axis corresponds to a mechanical axis, and the Z axis corresponds to an optical axis.
  • the Y ′ axis and the Z ′ axis are axes obtained by rotating the Y axis and the Z axis around the X axis by 35 degrees 15 minutes ⁇ 1 minute 30 seconds in the direction from the Y axis to the Z axis.
  • the cut angle of a crystal piece may apply different cut (for example, BT cut etc.) other than AT cut.
  • the AT cut type crystal piece 11 has a long side direction in which a long side parallel to the X axis direction extends, a short side direction in which a short side parallel to the Z ′ axis direction extends, and a parallel side in the Y ′ axis direction Thickness extending in the thickness direction.
  • the crystal piece 11 has a rectangular shape when the first main surface 11 a is viewed in plan, and a central portion 17 located at the center and contributing to excitation, and a peripheral edge adjacent to the central portion 17 on the negative direction side of the X axis. It has a portion 18 and a peripheral portion 19 adjacent to the central portion 17 on the positive direction side of the X axis.
  • the central portion 17 and the peripheral portions 18 and 19 are each provided in the shape of a strip along the Z ′ axis direction, and extend from one end to the other end of the quartz piece 11 opposite in the Z ′ axis direction. Therefore, the first major surface 11 a of the crystal piece 11 includes the first major surface 17 a of the central portion 17, the first major surface 18 a of the peripheral portion 18, and the first major surface 19 a of the peripheral portion 19. Similarly, the second major surface 11 b of the crystal piece 11 includes the second major surface 17 b of the central portion 17, the second major surface 18 b of the peripheral portion 18, and the second major surface 19 b of the peripheral portion 19.
  • the crystal piece 11 is a mesa structure in which the central portion 17 is thicker than the peripheral portions 18 and 19. Specifically, a first side surface 12 a connecting the first major surface 17 a of the central portion 17 and the first major surface 18 a of the peripheral portion 18 is formed between the central portion 17 and the peripheral portion 18. A second side surface 12b connecting the second main surface 17b of the second embodiment and the second main surface 18b of the peripheral portion 18 is formed. Similarly, a step is formed between the central portion 17 and the peripheral portion 19, and a first side surface 13a connecting the first major surface 17a of the central portion 17 and the first major surface 19a of the peripheral portion 19 is formed.
  • a second side surface 13 b connecting the second major surface 17 b of the central portion 17 and the second major surface 19 b of the peripheral portion 19 is formed.
  • the first side surfaces 12a and 13a and the second side surfaces 12b and 13b of the crystal piece 11 extend in the direction orthogonal to the first main surface 11a and the second main surface 11b of the crystal piece 11, respectively.
  • the first side faces 12a and 13a and the second side faces 12b and 13b of the crystal piece 11 extend along the Y′Z ′ plane.
  • the first side surfaces 12a and 13a and the second side surfaces 12b and 13b of the crystal piece 11 may be tapered.
  • first side surface 12a and the second side surface 13b extend in a direction inclined from the Y'-axis positive direction to the X-axis positive direction
  • second side surface 12b and the first side surface 13a are X-axis negative from the Y'-axis positive direction. It may extend in a direction inclined to the direction.
  • step difference may be formed only in any one surface by the side of the 1st main surface 11a and the 2nd main surface 11b.
  • the quartz crystal piece 11 is not limited to the above as long as the side surface is formed between the central portion and the peripheral portion.
  • the crystal piece 11 may be provided with a peripheral edge adjacent to the central portion 17 in the positive or negative direction of the Z ′ axis.
  • the crystal piece 11 is not limited to the mesa structure, and the central portion 17 may be a reverse mesa structure thinner than the peripheral portions 18 and 19.
  • the change in thickness of the central portion 17 and the peripheral portions 18 and 19 may be a convex shape or a bevel shape which changes continuously.
  • a slit may be formed between the central portion and the peripheral portion.
  • the shape of the crystal piece 11 is not limited to a plate, and for example, when the first major surface 11 a is viewed in plan, a pair of parallel both arm portions and a connecting portion that connects the both arm portions And may be comb-tooth shaped.
  • the X axis is parallel to the first direction D1
  • the Z 'axis is parallel to the second direction D2
  • the Y' axis is the third direction D3. It is determined to be parallel to the
  • the quartz crystal vibrating element 10 includes a first excitation electrode 14 a and a second excitation electrode 14 b that constitute a pair of electrodes.
  • the first excitation electrode 14 a is provided on the first major surface 17 a of the central portion 17.
  • the second excitation electrode 14 b is provided on the second major surface 17 b of the central portion 17.
  • the first excitation electrode 14a and the second excitation electrode 14b are opposed to each other with the quartz crystal piece 11 in between in the third direction D3.
  • the first excitation electrode 14 a and the second excitation electrode 14 b are disposed so that substantially the whole overlap in the XZ ′ plane.
  • Each of the first excitation electrode 14a and the second excitation electrode 14b has a long side parallel to the X-axis direction, a short side parallel to the Z'-axis direction, and a thickness parallel to the Y'-axis direction. .
  • the outer edge of the first excitation electrode 14 a extends to the boundary with the first side surface 12 a of the central portion 17.
  • the outer edge of the second excitation electrode 14 b extends to the boundary between the central portion 17 and the second side surface 12 b.
  • the outer shape of the main surface facing the central portion 17 of the first excitation electrode 14 a matches the outer shape of the first main surface 17 a of the central portion 17.
  • the outer shape of the main surface facing the central portion 17 of the second excitation electrode 14 b matches the outer shape of the second main surface 17 b of the central portion 17. According to this, the utilization efficiency of the region contributing to the excitation in the central portion 17 is improved, and the crystal vibrating element 10 can be miniaturized. Moreover, the confinement efficiency of the vibration excited in the center part 17 can be improved.
  • the quartz crystal vibrating element 10 has a pair of first lead electrodes 15a and second lead electrodes 15b, and a pair of first connection electrodes 16a and second connection electrodes 16b.
  • the first connection electrode 16a is electrically connected to the first excitation electrode 14a via the first lead electrode 15a.
  • the second connection electrode 16b is electrically connected to the second excitation electrode 14b via the second lead electrode 15b.
  • the first connection electrode 16a and the second connection electrode 16b are terminals for electrically connecting the first excitation electrode 14a and the second excitation electrode 14b to the base member 30, respectively.
  • the first lead-out electrode 15a covers a part of the first excitation electrode 14a when the first main surface 11a of the crystal piece 11 is viewed in plan, and the first side surface 12a from the central portion 17 in the first main surface 11a. It extends through the periphery 18.
  • the first lead-out electrode 15a is further drawn around the first major surface 18a of the peripheral portion 18 to the second major surface 18b.
  • the second lead-out electrode 15b covers a part of the second excitation electrode 14b when the second major surface 11b of the crystal piece 11 is viewed in plan, and the second side surface 12b is separated from the central portion 17 in the second major surface 11b. It extends through the periphery 18.
  • the first lead-out electrode 15a covers at least a part of the first excitation electrode 14a, the contact area between the first excitation electrode 14a and the first lead-out electrode 15a is increased, and the electrical connection is stabilized. Further, since damage such as peeling of the electrode is likely to occur at the corner of the crystal piece 11, the first lead electrode 15a covers the end of the first excitation electrode 14a, thereby suppressing the damage of the first excitation electrode 14a. it can. Therefore, the deterioration of the frequency characteristic of the crystal vibrating element 10 can be suppressed.
  • the first lead-out electrode 15a may be adjacent to the first excitation electrode 14a without covering the first excitation electrode 14a when the first major surface 11a of the crystal piece 11 is viewed in plan.
  • the first lead-out electrode 15a may cover the entire first excitation electrode 14a when the first major surface 11a of the crystal piece 11 is viewed in plan.
  • the second lead-out electrode 15b may be adjacent to the second excitation electrode 14b when the second major surface 11b of the crystal piece 11 is viewed in plan, and may cover the entire second excitation electrode 14b.
  • the first connection electrode 16 a is provided on the second major surface 18 b of the peripheral portion 18, and the second connection electrode 16 b is provided on the second major surface 18 b of the peripheral portion 18.
  • the first lead electrode 15a and the first connection electrode 16a are integrally formed.
  • the second lead electrode 15b and the second connection electrode 16b are also integrally formed.
  • the first excitation electrode 14 a includes a first contact layer 51 and a first conductive layer 52.
  • the first adhesion layer 51 has higher adhesion to the quartz piece 11 than the first conductive layer 52.
  • the first adhesion layer 51 is provided on the first main surface 11 a side of the crystal piece 11 and is in contact with the first main surface 17 a of the central portion 17.
  • the first conductive layer 52 has conductivity higher than that of the first adhesion layer 51 and chemical stability higher than that of the first adhesion layer 51.
  • the first conductive layer 52 covers the first adhesion layer 51 when the first main surface 11 a of the crystal piece 11 is viewed in plan.
  • the second excitation electrode 14b is provided on the second principal surface 11b side of the quartz piece 11 and in contact with the second principal surface 17b of the central portion 17 and the second principal surface 11b of the quartz piece 11 And a first conductive layer 54 covering the first adhesive layer 53 when viewed in plan.
  • the first excitation electrode 14 a and the second excitation electrode 14 b are not limited to the two-layer structure, and may be a single layer structure or a multilayer structure of three or more layers.
  • the first lead-out electrode 15 a includes a second contact layer 55 and a second conductive layer 56.
  • the second adhesion layer 55 has higher adhesion to the crystal piece 11 than the second conductive layer 56.
  • the second adhesion layer 55 is provided on the first main surface 11 a side of the crystal piece 11 and is in contact with the first main surface 17 a and the second main surface 17 b of the central portion 17.
  • the second adhesive layer 55 is also in contact with the second side surface 12 b and covers the end of the first excitation electrode 14 a, that is, the end of the first conductive layer 52.
  • the second conductive layer 56 has conductivity higher than that of the second adhesion layer 55 and chemical stability higher than that of the second adhesion layer 55.
  • the second conductive layer 56 covers the second adhesion layer 55 when the first major surface 11 a and the second major surface 11 b of the crystal piece 11 are viewed in plan. That is, in a region where the first lead electrode 15a of the central portion 17 overlaps the first excitation electrode 14a, the electrode has a four-layer structure, the first conductive layer 52 covers the first adhesive layer 51, and the second adhesive layer 55 The first conductive layer 52 is covered, and the second conductive layer 56 covers the second adhesion layer 55.
  • first connection electrode 16a is integrally formed with the first lead electrode 15a
  • the second connection layer 55 and the second conductive layer 56 are provided similarly to the first lead electrode 15a.
  • the second lead electrode 15 b and the second connection electrode 16 b are similarly provided with a second adhesion layer and a second conductive layer.
  • the first extraction electrode 15a, the second extraction electrode 15b, the first connection electrode 16a, and the second connection electrode 16b are not limited to a two-layer structure, and may have a single-layer structure, and three or more layers It may be a multilayer structure of
  • the first adhesion layer 51 of the first excitation electrode 14a, the first adhesion layer 53 of the second excitation electrode 14b, and the second adhesion layer 55 of the first extraction electrode 15a are each made of a metal material containing chromium (Cr). .
  • the first conductive layer 52 of the first excitation electrode 14a, the first conductive layer 54 of the second excitation electrode 14b, and the second conductive layer 56 of the first extraction electrode 15a are each made of a metal material containing gold (Au) .
  • the adhesion between the quartz piece and the electrode is improved, and by providing an Au layer with low reactivity with oxygen on the surface, deterioration of the electrode due to oxidation is suppressed. Ru. According to this, the reliability of the crystal vibrating element can be improved.
  • the thickness of the portion of the first excitation electrode 14 a exposed from the first lead electrode 15 a (hereinafter, the thickness along the third direction D 3 simply represents “thickness”) T 1.
  • the thickness T2 is smaller than the thickness T2 of the portion of the first excitation electrode 14a overlapping the first lead electrode 15a (T1 ⁇ T2).
  • the thickness T3 of the portion provided at the central portion 17 of the first lead electrode 15a is smaller than the thickness T4 of the portion provided at the peripheral portion 18 of the first lead electrode 15a (T3 ⁇ T4).
  • the thickness T1 of the first excitation electrode 14a is equal to the thickness of the first adhesion layer 51 as compared to the thickness T2, and the thickness of the first conductive layer 52 is smaller.
  • the thickness T3 of the first lead-out electrode 15a is the same as the thickness of the second adhesion layer 55, and the thickness of the second conductive layer 56 is smaller than that of the thickness T4.
  • the frequency characteristics of the crystal vibrating element 10 can be adjusted by shaving the surface of the electrode provided in the central portion 17 and adjusting the thickness of the electrode.
  • the thickness of the electrode provided in central portion 17 is small in a portion facing central surface 17 of the entire first main surface 17 a, but at least central portion 17 has The thickness may be reduced at a portion facing the central portion of the first major surface 17a. Further, the surface of the electrode provided at the central portion 17 does not necessarily have to be scraped, and the thickness T1 and the thickness T2 of the first excitation electrode 14a may be equal, and the thickness T3 of the first lead electrode 15a The thickness T4 may be equal.
  • the shape of the lid member 20 is concave and has a box shape opened toward the first major surface 32 a of the base member 30.
  • the lid member 20 is joined to the base member 30.
  • An internal space 26 surrounded by the lid member 20 and the base member 30 is provided.
  • the crystal vibrating element 10 is accommodated in the internal space 26.
  • the shape of the lid member 20 is not particularly limited as long as the quartz crystal vibrating element 10 can be accommodated.
  • the shape of the lid member 20 is rectangular when the main surface of the top surface 21 is viewed in plan.
  • the rectangular lid member 20 is defined by, for example, a long side parallel to the first direction D1, a short side parallel to the second direction D2, and a height parallel to the third direction D3.
  • the material of the cover member 20 is not particularly limited, it is made of, for example, a conductor such as metal.
  • the lid member 20 made of a conductive material has an electromagnetic shielding function of shielding at least a part of the electromagnetic wave to the internal space 26.
  • the lid member 20 has an inner surface 24 and an outer surface 25.
  • the inner surface 24 is a surface on the inner space 26 side
  • the outer surface 25 is a surface opposite to the inner surface 24.
  • the lid member 20 is connected to the top surface 21 facing the first main surface 32 a of the base member 30 and the outer edge of the top surface 21 and is a sidewall extending in a direction intersecting the main surface of the top surface 21.
  • the lid member 20 has an opposing surface 23 opposed to the first major surface 32 a of the base member 30 at the concave opening end (the end of the side wall 22 closer to the base member 30).
  • the facing surface 23 extends in a frame shape so as to surround the periphery of the crystal vibrating element 10.
  • the base member 30 holds the crystal vibrating element 10 so as to be able to excite.
  • the base member 30 has a flat plate shape.
  • the base member 30 has a long side parallel to the first direction D1, a short side parallel to the second direction D2, and a side in a thickness direction parallel to the third direction D3.
  • the base member 30 has a base 31.
  • the base 31 has a first main surface 32a (front surface) and a second main surface 32b (back surface) facing each other.
  • the base 31 is, for example, a sintered material such as insulating ceramic (alumina).
  • the base member 30 has electrode pads 33a and 33b provided on the first major surface 32a, and external electrodes 35a, 35b, 35c and 35d provided on the second major surface 32b.
  • the electrode pads 33 a and 33 b are terminals for electrically connecting the base member 30 and the crystal vibrating element 10.
  • the external electrodes 35a, 35b, 35c, and 35d are terminals for electrically connecting the unshown circuit board and the crystal unit 1.
  • the electrode pad 33a is electrically connected to the external electrode 35a via the via electrode 34a extending in the third direction D3, and the electrode pad 33b is an external electrode via the via electrode 34b extending in the third direction D3. It is electrically connected to 35b.
  • the via electrodes 34a and 34b are formed in via holes penetrating the base 31 in the third direction D3.
  • the external electrodes 35c and 35d may be dummy electrodes to which no electrical signal or the like is input / output, or may be ground electrodes for supplying a ground potential to the lid member 20 to improve the electromagnetic shielding function of the lid member 20.
  • the external electrodes 35c and 35d may be omitted.
  • the conductive holding members 36a and 36b electrically connect the pair of connection electrodes 16a and 16b of the crystal vibrating element 10 to the pair of electrode pads 33a and 33b of the base member 30, respectively.
  • the conductive holding members 36 a and 36 b hold the crystal vibrating element 10 on the first main surface 32 a of the base member 30 so as to be able to excite.
  • the conductive holding members 36a and 36b are made of, for example, a conductive adhesive containing a thermosetting resin or an ultraviolet curable resin containing an epoxy resin or a silicone resin as a main component, and in order to impart conductivity to the adhesive. And additives such as conductive particles. Furthermore, a filler may be added to the adhesive to increase the strength of the adhesive or to maintain the distance between the base member and the quartz vibrating element.
  • a sealing member 37 is provided on the first major surface 32 a of the base member 30.
  • the sealing member 37 has a rectangular frame shape when the first main surface 32 a is viewed in plan.
  • the electrode pads 33 a and 33 b are disposed inside the sealing member 37, and the sealing member 37 is provided so as to surround the crystal vibrating element 10.
  • the sealing member 37 is made of a conductive material. For example, by forming the sealing member 37 with the same material as the electrode pads 33a and 33b, the sealing member 37 can be provided simultaneously in the process of providing the electrode pads 33a and 33b.
  • the bonding member 40 is provided along the entire circumference of the lid member 20 and the base member 30. Specifically, the bonding member 40 is provided on the sealing member 37 and is formed in a rectangular frame shape. The sealing member 37 and the bonding member 40 are sandwiched between the facing surface 23 of the side wall portion 22 of the lid member 20 and the first major surface 32 a of the base member 30.
  • the internal space 26 is preferably in a vacuum state where the pressure is lower than the atmospheric pressure. According to this, it is possible to reduce the temporal variation of the frequency characteristic of the crystal unit 1 due to the oxidation of the first excitation electrode 14a and the second excitation electrode 14b.
  • the quartz crystal vibrator 1 an alternating electric field is applied between the first excitation electrode 14 a and the second excitation electrode 14 b constituting the quartz crystal vibrating element 10 via the external electrodes 35 a and 35 b of the base member 30. Thereby, the crystal piece 11 is vibrated by a predetermined vibration mode such as thickness shear vibration mode, and a resonance characteristic associated with the vibration is obtained.
  • a predetermined vibration mode such as thickness shear vibration mode
  • FIG. 4 is a flow chart schematically showing a part of the method of manufacturing a quartz crystal vibrating element according to the first embodiment.
  • FIG. 5 is a flowchart schematically showing a method of manufacturing the crystal vibrating element according to the first embodiment, following the flowchart shown in FIG.
  • FIG. 6 is a cross-sectional view schematically showing a process of etching a crystal piece.
  • FIG. 7 is a cross sectional view schematically showing a step of providing a second adhesive layer and a second conductive layer.
  • FIG. 8 is a cross sectional view schematically showing a process of patterning a photoresist.
  • FIG. 9 is a cross sectional view schematically showing a step of etching the second adhesive layer and the second conductive layer.
  • FIG. 10 is a cross-sectional view schematically showing a process of scraping the electrode surface in the central portion.
  • a crystal piece is prepared (S11).
  • the quartz crystal piece 111 is a flat plate-like member cut out from artificial quartz so that the XZ ′ plane is the main surface.
  • the surface of the crystal piece 111 is flattened.
  • polishing processing such as chemical mechanical polishing is used for planarization processing.
  • the size of the thickness of the quartz piece has a great influence on the frequency characteristics as a piezoelectric vibrating element. For this reason, the thickness of the crystal piece may be adjusted by the polishing process of this process so as to realize the targeted frequency characteristics.
  • a first adhesion layer is provided (S12).
  • the first adhesion layers 151 and 153 are formed to cover the entire surfaces of the first major surface 111 a and the second major surface 111 b of the crystal piece 111.
  • the first adhesion layers 151 and 153 before being patterned correspond to an integral series of metal films that wrap the crystal piece 111.
  • the first adhesion layers 151 and 153 are formed, for example, by depositing a metal material containing Cr on the surface of the quartz piece 111 by sputtering.
  • the first adhesion layers 151 and 153 are formed to have a thickness of 1 nm or more and 20 nm or less.
  • the thickness of the first adhesion layers 151 and 153 is 1 nm or more, the decrease in adhesion of the first excitation electrode 114 a and the second excitation electrode 114 b to the crystal piece 111 can be suppressed. As a result, the occurrence of damage such as peeling of the first excitation electrode 114a and the second excitation electrode 114b can be reduced. In addition, when the thickness of the first adhesive layers 151 and 153 is 20 nm or less, the deterioration of the vibration characteristics of the quartz crystal vibrating element 110 can be suppressed.
  • a first conductive layer is provided (S13).
  • the first conductive layers 152 and 154 are formed to cover the first adhesion layers 151 and 153 on the first main surface 111 a side and the second main surface 111 b side of the crystal piece 111, respectively.
  • the first conductive layers 152 and 154 before being patterned correspond to an integral series of metal films for wrapping the first adhesion layers 151 and 153 for wrapping the quartz piece 111.
  • the first conductive layers 152 and 154 are formed by depositing a metal material containing Au on the surfaces of the first adhesion layers 151 and 153 by sputtering.
  • the first conductive layers 152 and 154 are formed to have a thickness of 1 nm to 500 nm.
  • the thickness of the first conductive layers 152 and 154 is 1 nm or more, sufficient conductivity is given to the first excitation electrode 114a and the second excitation electrode 114b. Further, the first conductive layers 152 and 154 can suppress the oxidation of the first adhesion layers 151 and 153 corresponding to the base. Therefore, the deterioration of the vibration characteristic of the quartz crystal vibrating element 110 can be suppressed. In addition, when the thickness of the first conductive layers 152 and 154 is 500 nm or less, the amount of use of the metal material containing Au can be reduced. Therefore, the manufacturing cost of the quartz crystal vibrating element 110 can be reduced, and the time required for forming the first conductive layers 152 and 154 can be shortened.
  • the film forming method of the first adhesion layer 151, 153 and the first conductive layer 152, 154 is not limited to sputtering, and may be dry plating such as PVD (Physical Vapor Deposition) or CVD (Chemical Vapor Deposition), or electroplating. It may be formed by wet plating such as electroless plating.
  • a photoresist is provided (S14).
  • the photoresist is formed to cover the entire surface of the first conductive layers 152 and 154.
  • a photoresist solution is coated on the entire surface of the first conductive layers 152 and 154 by spin coating, injection, printing such as gravure coating, or the like.
  • the photoresist solution is dried to remove the solvent, and solidified to form a photoresist made of a photosensitive resin.
  • the photoresist is patterned (S15).
  • the photoresist is preferably a positive photosensitive resin that removes the exposed portion by dissolution from the viewpoint of adaptability to microfabrication.
  • a positive photosensitive resin is used, the photoresist is exposed in a state where the area corresponding to the central portion 117 is shielded by a photomask. Thereafter, the portion exposed by the developer is washed away. As a result, the shape of the light shielding area of the photomask is transferred to the photoresist.
  • the photoresist remaining on the first conductive layers 152 and 154 the outline of the central portion 117 is patterned.
  • the photoresist may be a negative photosensitive resin that removes the light-shielded portion by dissolution.
  • the first conductive layer is etched (S16).
  • the removal process of the first conductive layers 152 and 154 is performed by wet etching using a first etching solution containing a potassium iodide aqueous solution as a main component. Since the potassium iodide aqueous solution has a high etching rate to Au and a low etching rate to Cr, the exposed first conductive layers 152 and 154 may be etched while leaving the first adhesion layers 151 and 153 corresponding to the base. it can.
  • the first adhesion layer is etched (S17). Removal processing of the first adhesion layers 151 and 153 is performed by wet etching using a second etching solution containing a cerium ammonium nitrate aqueous solution as a main component.
  • the aqueous solution of cerium ammonium nitrate has a low etching rate to Au and a high etching rate to Cr, so that the first adhesion is exposed while suppressing the corrosion of the remaining first conductive layer 152, 154 covered with the patterned photoresist.
  • the layers 151, 153 can be etched.
  • the first etching solution and the second etching solution appropriately select etching solutions having different etching rates for the first adhesive layer and the first conductive layer, respectively.
  • the etched first conductive layer 152 and the first adhesion layer 151 form the outer shape of the first excitation electrode 114a
  • the etched first conductive layer 154 and the first adhesion layer 153 form the outer shape of the second excitation electrode 114b.
  • the outer shapes of the first excitation electrode 114a and the second excitation electrode 114b are not limited to those by wet etching, but may be formed by other removal processing such as dry etching.
  • the quartz piece is etched (S18).
  • the first excitation electrode 114a and the second excitation electrode 114b are used as a metal mask to protect the central portion 117 of the quartz piece 111, and the peripheral portion 118 and the peripheral portion 119 are removed and processed.
  • the removal process of the quartz piece 111 is implemented by wet etching with hydrofluoric acid. As a result, as shown in FIG. 6, a step is generated between the central portion 117 and the peripheral portion 118, and a first side surface connecting the first major surface 117a of the central portion 117 and the first major surface 118a of the peripheral portion 118.
  • a second side surface 112 b connecting the second main surface 117 b of the central portion 117 and the second main surface 118 b of the peripheral portion 118 is formed.
  • a first side surface 113a connecting the first major surface 117a of the central portion 117 and the first major surface 119a of the peripheral portion 119 is formed, and a second major surface 117b of the central portion 117 and a second main of the peripheral portion 119 are formed.
  • a second side surface 113b connecting to the surface 119b is formed. That is, the quartz crystal piece 111 becomes an uneven member having a mesa structure on both sides of the first major surface 111 a and the second major surface 111 b by removing a part of the flat plate-like member.
  • the first excitation electrode 114a used as a metal mask remains on the first main surface 117a of the central portion 117
  • the second excitation electrode 114b used as a metal mask is present on the second main surface 117b of the central portion 117. It remains.
  • the formation of the mesa structure of the crystal piece 111 is not limited to wet etching, and may be performed by other removal processing such as dry etching. However, the removal process of the crystal piece 111 is preferably performed by wet etching from the viewpoint of reducing damage to the first excitation electrode 114a and the second excitation electrode 114b.
  • the film thickness of the photoresist becomes uneven due to the surface tension of the photoresist solution and the like.
  • the photoresist is thinner at the corners of the steps and thicker at flat areas. Therefore, the patterning accuracy of the photoresist is lowered, and the pattern shape of the photoresist in the vicinity of the corner of the step is not stable. Then, it becomes difficult to form the excitation electrode having a uniform film thickness up to the edge of the main surface of the central portion, and when the main surface of the central portion is planarly viewed, the outer edge of the excitation electrode is positioned inside the main surface of the central portion It will be done.
  • the first excitation electrode 114a when used as a metal mask for forming a mesa structure on the quartz piece 111, the first excitation electrode 114a is an edge of the first major surface 117a of the central portion 117, ie, the central portion It can be formed up to the boundary with the first side surface 112 a of 117.
  • the fluctuation of the shape of the first excitation electrode 114a can be suppressed, and the fluctuation of the frequency characteristic of the crystal vibrating element 110 can be suppressed.
  • the second excitation electrode 114 b can also be formed to the boundary with the second side surface 112 b of the central portion 117.
  • a second adhesion layer is provided (S21).
  • the second adhesion layer 155 which constitutes a part of the first lead electrode 115 a and a part of the second lead electrode (not shown) is a surface of the peripheral portion 118 of the crystal piece 111, the first It is formed to cover the surface of the excitation electrode 114a and the surface of the second excitation electrode 114b.
  • the second adhesion layer 155 before being patterned corresponds to an integral series of metal films that wrap the crystal piece 111, the first excitation electrode 114a, and the second excitation electrode 114b.
  • the second adhesive layer 155 can be formed by the same method as the first adhesive layers 151 and 153 so as to have the same configuration as the first adhesive layers 151 and 153. That is, the second adhesion layer 155 is a metal film in which a metal material containing Cr is deposited by sputtering, and the thickness thereof is 1 nm or more and 20 nm or less.
  • a second conductive layer is provided (S22). As shown in FIG. 7, the second conductive layer 156 that constitutes a part of the first lead electrode 115 a and a part of the second lead electrode (not shown) is formed so as to cover the second adhesion layer 155. .
  • the second conductive layer 156 before being patterned corresponds to an integral series of metal films which wrap the second adhesion layer 155 which wraps the quartz piece 111.
  • the second conductive layer 156 can be formed to have the same configuration by the same method as the first conductive layers 152 and 154. That is, the second conductive layer 156 is a metal film in which a metal material containing Au is deposited by sputtering, and the thickness thereof is 1 nm or more and 500 nm or less.
  • a photoresist is provided (S23).
  • the photoresist 161 is formed to cover the entire surface of the second conductive layer 156.
  • the photoresist 161 provided in step S23 can be formed to have the same configuration by the same method as the photoresist provided in step S14.
  • step S24 the photoresist is patterned (S24).
  • the patterning in step S24 is performed by the same method as step S15.
  • the outer shape of the first lead electrode 115a and the second lead electrode (not shown) is patterned on the photoresist 161 by photolithography.
  • the second conductive layer is etched (S25).
  • the exposed second conductive layer 156 can be etched while the second adhesion layer 155 corresponding to the base can be left.
  • the second adhesion layer is etched (S26).
  • the exposed second adhesion is prevented while suppressing the corrosion of the remaining second conductive layer 156 covered by the patterned photoresist.
  • Layer 155 can be etched. As shown in FIG. 9, by etching the second adhesion layer 155, the first conductive layer 152 of the first excitation electrode 114a and the first conductive layer 154 of the second excitation electrode 114b are exposed.
  • the second etching solution has a low etching rate to Au, it is possible to suppress the corrosion of the exposed first excitation electrode 114 a by the etching solution on the first conductive layer 152 and the second excitation electrode 114 b by the etching solution.
  • the extraction electrode can be patterned while suppressing damage to the excitation electrode.
  • formation of a lead-out electrode is not limited to the wet etching which utilized the photolithographic method.
  • the extraction electrode may be patterned by arranging a sputtering mask in which the shape of the extraction electrode is patterned around the quartz piece 111 and sputtering the second adhesion layer 155 and the second conductive layer 156 through the sputtering mask.
  • the electrode surface at the central portion is scraped (S26).
  • the surface of the first excitation electrode 114a facing the first main surface 117a of the central portion 117 and the surface of the first lead electrode 115a are scraped by ion milling.
  • the thickness of the electrode formed in the central portion 117 is reduced, and the frequency characteristic of the quartz crystal vibrating element 110 is adjusted.
  • the quartz crystal vibrating element 110 having desired frequency characteristics is manufactured.
  • the surface may be scraped in step S26 on at least one of the first main surface 117a and the second main surface 117b of the central portion 117, or both electrodes.
  • FIG. 11 is a cross-sectional view schematically showing a configuration of a crystal unit according to a second embodiment.
  • the quartz crystal vibrating element 210 includes a quartz piece 211, a first excitation electrode 214a, a second excitation electrode 214b, a first lead electrode 215a, and a first connection electrode 216a.
  • the crystal piece 211 includes a central portion 217 and peripheral portions 218 and 219.
  • the crystal piece 211 has a first side surface 212a connecting the first main surface 217a and the first main surface 218a between the central portion 217 and the peripheral portion 218, and the second main surface 217b and the second surface A second side surface 212b connecting to the two major surfaces 218b is formed.
  • the crystal piece 211 has a first side surface 213a connecting the first main surface 217a and the first main surface 219a between the central portion 217 and the peripheral portion 219, and the second main surface 217b and the second side A second side surface 213b connecting the two main surfaces 219b is formed.
  • the first excitation electrode 214 a includes a first adhesion layer 251 and a first conductive layer 252.
  • the second excitation electrode 214 b includes a first contact layer 253 and a first conductive layer 254.
  • the first lead electrode 215 a includes a second contact layer 255 and a second conductive layer 256.
  • the crystal piece 211 has an inverted mesa structure. That is, the thickness of the peripheral portions 218 and 219 is larger than the thickness of the central portion 217.
  • the central portion 217 is a quartz piece 211 having a both-side reverse mesa structure thinner than the peripheral portions 218 and 219.
  • the central portion 217 may be a quartz piece 211 having a single-sided reverse mesa structure thinner than the peripheral portions 218 and 219 in only one of the first main surface 217 a and the second main surface 217 b.
  • FIG. 12 is an exploded perspective view schematically showing the configuration of a crystal unit according to a third embodiment.
  • FIG. 13 is a cross-sectional view schematically showing a configuration of a crystal unit according to a third embodiment.
  • the quartz crystal vibrator 900 has a so-called sandwich structure in which the quartz crystal vibrating element 910 is sandwiched between the first lid member 920a and the second lid member 920b.
  • the crystal vibrating element 910 includes a quartz piece 911, a first excitation electrode 914 a, a second excitation electrode 914 b, a first lead electrode 915 a, and a second lead electrode 915 b.
  • the first lid member 920a is joined to the first main surface 911a of the quartz crystal piece 911 with the first sealing member 937a interposed therebetween, and the second lid member 920b is attached to the first quartz crystal member 911 with the second sealing member 937b interposed therebetween. It is joined to 2 principal surfaces 911b.
  • the crystal piece 911 When the first main surface 911 a of the crystal piece 911 is viewed in plan, the crystal piece 911 includes a central portion 917 and a peripheral portion 919 surrounding the central portion 917 with a space. That is, a slit is formed between the central portion 917 and the peripheral portion 919.
  • the thickness of the peripheral portion 919 is greater than the thickness of the central portion 917.
  • the central portion 917 is supported by the peripheral portion 919 by a pair of support portions 918.
  • the thickness of the support portion 918 is smaller than the thickness of the central portion 917.
  • the support portion 918 corresponds to a part of the peripheral portion.
  • a first side surface 912a connecting the first major surface 917a of the central portion 917 and the first major surface 918a of the support portion 918 is formed.
  • a second side surface 912 b is formed connecting the 917 b and the second major surface 918 b of the support portion 918.
  • a third side surface 913 connecting the first main surface 917a and the second main surface 917b of the central portion 917 is formed.
  • the first lid member 920 a is joined to the first major surface 919 a of the peripheral portion 919
  • the second lid member 920 b is joined to the second major surface 919 b of the peripheral portion 919.
  • the outer edge of the first excitation electrode 914a extends to the boundary with the first side surface 912a and the boundary with the third side surface 913 in the central portion 917 There is.
  • the outer edge of the second excitation electrode 914 b extends to the boundary with the second side surface 912 b and the boundary with the third side surface 913 in the central portion 917 There is.
  • the first lead-out electrode 915a covers a part of the first excitation electrode 914a, and is routed to the first main surface 919a of the peripheral portion 919 through one of the first side surface 912a and the pair of support portions 918.
  • the second lead-out electrode 915 b covers a part of the second excitation electrode 914 b and is routed to the second main surface 919 b of the peripheral portion 919 through the other of the second side surface 912 b and the pair of support portions 918. .
  • FIG. 14 is a perspective view schematically showing the configuration of a quartz crystal vibrating element according to a fourth embodiment.
  • the difference between the present embodiment and the first embodiment is the peripheral portion PR1 adjacent to the central portion 417 on the positive direction side of the Z ′ axis and the peripheral portion PR2 adjacent to the central portion 417 on the negative direction side of the Z ′ axis. And a point.
  • the peripheral portion PR1 connects one end of each of the peripheral portions 418 and 419
  • the peripheral portion PR2 connects each other end of the peripheral portions 418 and 419.
  • a first excitation electrode 414 a is provided on the entire first surface 417 a of the central portion 417, and a first lead electrode 415 a and a first connection electrode 416 a are provided on the peripheral portion 418.
  • central portion 417 has an island shape surrounded by peripheral portions 418 and 419 and PR1 and PR2, and the second excitation is provided over the entire second main surface of central portion 417.
  • An electrode is provided. Also in such a quartz crystal vibrating element 410, the same effect as described above can be obtained.
  • the shapes of the central portion and the peripheral portion are not particularly limited as long as the first and second excitation electrodes are formed over the entire surfaces of the first and second main surfaces of the central portion.
  • the shape of the central portion may be a circle or an oval when the first main surface of the crystal piece is viewed in plan, or may be a polygon other than a square.
  • a step may be further formed on the first main surface side and the second main surface side of the crystal piece.
  • a thin area and a thick area are formed in the central part, the thin area in the central part is adjacent to the peripheral part, and the thick area in the central part is adjacent to the opposite side to the peripheral part of the thin area.
  • the thin region at the central portion may be formed in a band shape extending from the opposite end to the other at the opposite end in the Z ′ axis direction of the crystal piece.
  • the thick region at the central portion may be formed in a band shape across the entire width of the crystal piece as in the thin region at the central portion, or may be formed in an island shape surrounded by the thin region at the central portion.
  • the thick region at the central portion may be sandwiched by the thin region at the central portion in the X-axis direction, and either the positive direction or the negative direction of the X-axis direction It may be adjacent to the thin-walled area at the central portion only on one side.
  • the positional relationship between the thin-walled area and the thick-walled area at the central portion may be reversed. That is, the thick region of the central portion may be adjacent to the peripheral portion, and the thin region of the central portion may be adjacent to the opposite side of the peripheral portion of the thick region.
  • a thin region and a thick region are formed in the peripheral portion, and the thick region of the peripheral portion is a central portion And the thin-walled region of the peripheral portion is adjacent to the opposite side of the central portion of the thick-walled region.
  • the thickened region of the peripheral portion may be formed in a band shape over the entire width of the crystal piece.
  • the central portion may be formed in a band shape extending over the entire width of the crystal piece as in the thick region of the peripheral portion, or may be formed in an island shape surrounded by the thick region of the peripheral portion.
  • the thick region of the peripheral portion may be formed in an island shape surrounded by the thin region.
  • the central portion may be formed in a band shape extending over the entire width of the thick region, or may be formed in an island shape surrounded by the thick region.
  • the positional relationship between the thick and thin regions of the peripheral portion may be reversed. That is, the thin region of the peripheral portion may be adjacent to the central portion, and the thick region of the peripheral portion may be adjacent to the opposite side of the central portion of the thin region.
  • the first main surface 111a and the second main surface 111b opposed to the first main surface 111a are provided, and the center side when the first main surface 111a is viewed in plan Preparing the quartz crystal piece 111 having the central portion 117 located on the outer side and the peripheral edge portion 118 located on the outer side of the central portion 117, and the first excitation on the central portion 117 of the first main surface 111a of the quartz crystal piece 111.
  • the first excitation electrode 114a is used as a metal mask to protect the central portion 117, and a part of the peripheral portion 118 is removed, and the central portion 117 and the peripheral edge on the first main surface 111a side of the quartz piece 111
  • a step of providing a first lead electrode 115a to the manufacturing method of the quartz crystal vibrating element 110 is provided.
  • the first excitation electrode can be formed to the edge of the first main surface of the central portion, that is, to the boundary with the first side surface of the central portion.
  • the first lead electrode 115a may pass through the first side surface 112a.
  • the first lead-out electrode 115 a may cover at least a part of the first excitation electrode 114 a at the central portion 117 when the first main surface 111 a of the crystal piece 111 is viewed in plan. According to this, the contact area between the first excitation electrode and the first extraction electrode is increased, and the electrical connection between the first excitation electrode and the first extraction electrode is stabilized. Moreover, damage to the first excitation electrode can be suppressed, and deterioration of the frequency characteristic of the quartz crystal vibrating element can be suppressed.
  • the step of providing the first excitation electrode 114 a has the step of providing the first adhesion layer 151 on the side of the first major surface 111 a of the quartz piece 111 and the conductivity higher than that of the first adhesion layer 151. And a step of providing a first conductive layer 152 covering the first adhesive layer 151 when the first main surface 111a of the first main surface 111a is viewed in plan.
  • the step of providing the first lead-out electrode 115 a has a step of providing the second adhesion layer 155 on the side of the first main surface 111 a of the quartz piece 111 and the conductivity higher than the second adhesion layer 155. And the step of providing a second conductive layer 156 covering the second adhesive layer 155 when the first main surface 111a of the second main surface 111a is viewed in plan.
  • the base with the second adhesion layer having high reactivity with oxygen the adhesion between the quartz piece and the first lead electrode can be improved, and the surface with the reactivity with oxygen is low. Deterioration of the first lead-out electrode due to oxidation can be suppressed by providing. That is, the reliability of the crystal vibrating element can be improved.
  • the first adhesion layer 151 and the second adhesion layer 155 may be made of a metal material containing chromium, and the first conductive layer and the second conductive layer may be made of a metal material containing gold. According to this, Cr has higher adhesion to quartz than Au, Au has higher conductivity and higher chemical stability than Cr. Therefore, the effects described above can be obtained.
  • the step of providing the first lead electrode 115a the step of providing the metal films 155 and 156, the step of providing the photoresist 161 covering the metal films 155 and 156, and the step of patterning the photoresist 161 in the shape of the first lead electrode 115a. And etching the metal films 155 and 156. According to this, compared with the case where the first excitation electrode and the first lead-out electrode are formed in the same process by the photolithographic method, the required accuracy of patterning is lower, so that the manufacturing cost can be suppressed.
  • a step of providing the first lead electrode a step of providing a first metal film and a second metal film so as to cover the first metal film on the first main surface side of the quartz piece, and a photo covering the second metal film
  • a step of providing a resist a step of patterning a photoresist in the shape of a first lead-out electrode, a step of etching a second metal film using a first etchant so as to expose a first metal film, a first step Etching the first metal film using a second etching solution different in etching rate from the etching solution.
  • the step of disposing the sputtering mask on which the shape of the first lead electrode 115a is patterned is disposed on the first main surface 111a side of the crystal piece 111, and the metal films 155 and 156 are passed through the sputtering mask. And sputtering may be included. According to this, the number of steps can be reduced compared to the case where the outer shape of the first lead electrode is formed by the photolithography method.
  • the method may further include the step of adjusting the frequency by reducing the thickness of the electrodes 114a and 115a provided in the central portion 117. According to this, the manufacturing error of the frequency characteristic of the crystal vibrating element can be suppressed.
  • the method may further include the step of providing a second lead-out electrode 115b extending to the peripheral portion 118 on the second principal surface 111b side of the crystal piece 111 so as to contact the used second excitation electrode 114b. According to this, the same effect as described above can be obtained.
  • the first main surface 11a and the second main surface 11b opposite to the first main surface 11a are provided, and the first main surface 11a is located on the center side in plan view A central portion 17 and a peripheral portion 18 having a central portion 17 and peripheral portions 18 and 19 located outside the central portion 17 and at least the first main surface 11 a side of the first major surface 11 a and the second major surface 11 b , 19 between the crystal piece 11 and the first excitation electrode 14 a provided at the central portion 17 of the first major surface 11 a of the crystal piece 11, and the crystal piece Among the second main surfaces 11b of 11, the second excitation electrode 14b provided in the central portion 17 and facing the first excitation electrode 14a, and the first lead electrode 15a electrically connected to the first excitation electrode 14a , And a second extraction electrode electrically connected to the second excitation electrode 14b.
  • the first lead electrode 15a covers at least a portion of the first excitation electrode 14a when the first major surface 11a of the crystal piece 11 is viewed in plan, and the central portion 17 to the peripheral portion 18 A quartz crystal vibrating element 10 is provided, which extends across.
  • the utilization efficiency of the region contributing to excitation in the central portion is improved
  • the crystal vibrating element can be miniaturized.
  • the confinement efficiency of the vibration excited in the central portion can be improved. Since the first lead-out electrode covers a part of the first excitation electrode, the contact area between the first excitation electrode and the first lead-out electrode is increased, and the electrical connection between the first excitation electrode and the first lead-out electrode is Stabilize. Moreover, damage to the first excitation electrode can be suppressed, and deterioration of the frequency characteristic of the quartz crystal vibrating element can be suppressed.
  • the outer edge of the first excitation electrode 14 a may extend to the boundary of the central portion 17 with the first side surface 12 a. According to this, by matching the shapes of the first main surface in the central portion and the first excitation electrode, it is possible to suppress the fluctuation of the shape of the first excitation electrode and to suppress the fluctuation of the frequency characteristic of the crystal vibrating element.
  • the first excitation electrode 14 a has higher conductivity than the first adhesion layer 51 provided on the side of the first major surface 11 a of the crystal piece 11 and the first adhesion layer 51.
  • the first conductive layer 52 may be provided to cover the first adhesive layer 51 when the main surface 11 a is viewed in plan. According to this, by providing the first adhesion layer having high reactivity with oxygen on the base, the adhesion between the quartz piece and the first excitation electrode can be improved, and the first conductive layer has low reactivity with oxygen on the surface. Deterioration of the first excitation electrode due to oxidation can be suppressed by providing. That is, the reliability of the crystal vibrating element can be improved.
  • the first lead-out electrode 15 a has higher conductivity than the second adhesion layer 55 provided on the side of the first main surface 11 a of the crystal piece 11 and the second adhesion layer 55. You may provide the 2nd conductive layer 56 which covers the 2nd contact layer 55, when the main surface 11a is planarly viewed. According to this, by providing the base with the second adhesion layer having high reactivity with oxygen, the adhesion between the quartz piece and the first lead electrode can be improved, and the surface with the reactivity with oxygen is low. Deterioration of the first lead-out electrode due to oxidation can be suppressed by providing. That is, the reliability of the crystal vibrating element can be improved.
  • the first adhesion layer 51 and the second adhesion layer 55 may be made of a metal material containing chromium, and the first conductive layer 52 and the second conductive layer 56 may be made of a metal material containing gold. According to this, Cr has higher adhesion to quartz than Au, Au has higher conductivity and higher chemical stability than Cr. Therefore, the effects described above can be obtained.
  • the thickness T3 of the portion provided in the central portion 17 of the first lead electrode 15a may be smaller than the thickness T4 of the portion provided in the peripheral portion 18 of the first lead electrode 15a. According to this, the frequency characteristics of the crystal vibrating element can be adjusted by scraping the surface of the electrode provided in the central portion. Therefore, the manufacturing error of the frequency characteristic of the crystal vibrating element can be suppressed.
  • the thickness of the central portion 17 is larger than the thickness of the peripheral portions 18 and 19, and the first side surfaces 12 a and 13 a may connect the central portion 17 and the peripheral portions 18 and 19. According to this, the above-described effect can be obtained in the step formed by the so-called forward mesa structure.
  • the thickness of the central portion 217 is smaller than the thickness of the peripheral portions 218 and 219, and the first side surfaces 212a and 213a may connect the central portion 217 and the peripheral portions 218 and 219. According to this, the above-described effect can be obtained in the step formed by the so-called reverse mesa structure.
  • the crystal piece 11 has second side surfaces 12 b and 13 b formed between the central portion 17 and the peripheral portions 18 and 19 on the second main surface 11 b side, and the second lead-out electrode 15 b is a second piece of the crystal piece 11. At least a part of the second excitation electrode 14b is covered when the main surface 11b is viewed in plan, and it extends from the central portion 17 to the peripheral portion 18 on the second main surface 11b side of the crystal piece 11 Good. According to this, the same effect as described above can be obtained.
  • the crystal piece 911 may have a slit formed between the central portion 917 and the peripheral portion 919. Even in such a configuration, the above-described effects can be obtained.
  • a quartz crystal vibrating element capable of reducing a manufacturing error of vibration characteristics and a method of manufacturing the same.

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Abstract

Cette invention concerne un procédé de fabrication d'un élément oscillateur à cristal (10), comprenant : une étape de préparation d'une pièce de cristal (111) ; une étape de fourniture d'une première électrode d'excitation (114a) sur une partie centrale (117) de la pièce de cristal (111) ; une étape de formation d'une première surface latérale (112a) entre la partie centrale (117) et une partie périphérique (118) de la pièce de cristal (111) en éliminant une partie de la partie périphérique (118), tout en utilisant la première électrode d'excitation (114a) en tant que masque métallique qui protège la partie centrale (117) ; et une étape de fourniture d'une première électrode de sortie (115a), qui s'étend dans la partie périphérique (118) de la pièce de cristal (111), de telle sorte que la première électrode de sortie est en contact avec la première électrode d'excitation (114a).
PCT/JP2018/033552 2017-09-13 2018-09-11 Élément oscillateur à cristal et son procédé de fabrication WO2019054349A1 (fr)

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CN201880057404.0A CN111052602B (zh) 2017-09-13 2018-09-11 晶体振动元件及其制造方法
JP2019542052A JP6842682B2 (ja) 2017-09-13 2018-09-11 水晶振動素子およびその製造方法

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2021049087A1 (fr) * 2019-09-09 2021-03-18 株式会社村田製作所 Dispositif de résonance, carte d'assemblage et procédé de fabrication de dispositif de résonance
CN112970195A (zh) * 2019-03-29 2021-06-15 株式会社村田制作所 振子和振子的制造方法

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TWI828371B (zh) * 2022-10-17 2024-01-01 台灣晶技股份有限公司 壓電振動元件

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