WO2019054349A1 - Crystal oscillator element and method for producing same - Google Patents

Crystal oscillator element and method for producing same Download PDF

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Publication number
WO2019054349A1
WO2019054349A1 PCT/JP2018/033552 JP2018033552W WO2019054349A1 WO 2019054349 A1 WO2019054349 A1 WO 2019054349A1 JP 2018033552 W JP2018033552 W JP 2018033552W WO 2019054349 A1 WO2019054349 A1 WO 2019054349A1
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main surface
central portion
electrode
vibrating element
excitation electrode
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PCT/JP2018/033552
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French (fr)
Japanese (ja)
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有彌 井田
和彦 指崎
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株式会社村田製作所
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Priority to CN201880057404.0A priority Critical patent/CN111052602B/en
Priority to JP2019542052A priority patent/JP6842682B2/en
Publication of WO2019054349A1 publication Critical patent/WO2019054349A1/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz

Abstract

This method for producing a crystal oscillator element (10) comprises: a step for preparing a crystal piece (111); a step for providing a central part (117) of the crystal piece (111) with a first excitation electrode (114a); a step for forming a first lateral surface (112a) between the central part (117) and a peripheral part (118) of the crystal piece (111) by removing a part of the peripheral part (118), while using the first excitation electrode (114a) as a metal mask that protects the central part (117); and a step for providing a first lead-out electrode (115a), which extends in the peripheral part (118) of the crystal piece (111), so that the first lead-out electrode is in contact with the first excitation electrode (114a).

Description

水晶振動素子およびその製造方法Quartz oscillator and method of manufacturing the same
　本発明は、水晶振動素子およびその製造方法に関する。 The present invention relates to a quartz crystal vibrating element and a method of manufacturing the same.
　圧電振動子は、移動体通信機などに搭載されており、例えばタイミングデバイスや荷重センサとして利用される。特に、圧電振動子の一種である水晶振動子は、圧電体に人工水晶を利用しており、高い周波数精度を有している。水晶振動子に搭載される水晶振動素子は、例えば、フォトリソグラフィ技術を利用したエッチングによって、水晶片に外形加工を実施し、当該水晶片に各種電極をパターニング加工することで形成される。エッチングによる加工精度を向上させるため、様々な構成が検討されている。 The piezoelectric vibrator is mounted on a mobile communication device or the like, and is used as, for example, a timing device or a load sensor. In particular, a quartz oscillator, which is a type of piezoelectric oscillator, utilizes artificial quartz for the piezoelectric body and has high frequency accuracy. The quartz crystal vibrating element mounted on the quartz oscillator is formed, for example, by performing outline processing on a quartz piece by etching using photolithography technology, and patterning various electrodes on the quartz piece. In order to improve processing accuracy by etching, various configurations have been studied.
　例えば、特許文献１には、フォトレジストおよび耐食膜をマスクとして水晶片をエッチングし、段差面や傾斜面を設ける工程と、フォトレジストおよび耐食膜を除去する工程と、フォトレジストをマスクとして金属膜をエッチングし、励振電極、引出電極、などを形成する工程と、を含む水晶振動素子の製造方法が開示されている。 For example, in Patent Document 1, a quartz chip is etched using a photoresist and a corrosion resistant film as a mask to form a step surface and an inclined surface, a step of removing the photoresist and the corrosion resistant film, and a metal film using a photoresist as a mask And forming an excitation electrode, an extraction electrode, and the like.
特開２０１０－２８３６６０号公報JP, 2010-283660, A
　しかしながら、水晶片に段差面や傾斜面を形成し、水晶片の主面に対して凹凸が形成される外形形成を行う場合、当該外形形成の後にフォトレジストを成膜すると、表面張力などによって水晶片の主面の角においてフォトレジストの膜厚が小さくなる。このようなフォトレジストの膜厚変動のため、例えば励振電極の加工精度が低下するという課題があった。 However, in the case of forming a stepped surface or an inclined surface on a crystal piece and forming an outer shape in which unevenness is formed on the main surface of the crystal piece, when forming a photoresist after forming the outer shape, The film thickness of the photoresist decreases at the corners of the main surface of the piece. Due to such film thickness fluctuation of the photoresist, there is a problem that, for example, the processing accuracy of the excitation electrode is lowered.
　本発明はこのような事情に鑑みてなされたものであり、本発明の目的は、振動特性の製造誤差を低減できる水晶振動素子およびその製造方法の提供である。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a quartz crystal vibrating element capable of reducing a manufacturing error of vibration characteristics and a method of manufacturing the same.
　本発明の一態様に係る水晶振動素子の製造方法は、第１主面と第１主面に対向する第２主面を有し、第１主面を平面視したときに中央側に位置する中央部と中央部の外側に位置する周縁部とを有する、水晶片を準備する工程と、水晶片の第１主面のうち、中央部に第１励振電極を設ける工程と、中央部を保護するメタルマスクとして第１励振電極を用いつつ周縁部の一部を除去し、水晶片の第１主面側において中央部と周縁部との間に第１側面を形成する工程と、メタルマスクとして用いた第１励振電極に接触するように、水晶片の第１主面側において周縁部に延在する第１引出電極を設ける工程と、を含む。 A method of manufacturing a quartz crystal vibrating element according to an aspect of the present invention includes a first main surface and a second main surface opposite to the first main surface, and is positioned on the center side when the first main surface is viewed in plan. Preparing a quartz piece having a central portion and a peripheral portion located outside the central portion; providing a first excitation electrode at the central portion of the first main surface of the quartz piece; and protecting the central portion Forming a first side surface between the central portion and the peripheral portion on the first principal surface side of the crystal piece while using the first excitation electrode as the metal mask and forming the first side surface on the first principal surface side; Providing a first lead-out electrode extending to the peripheral edge on the first principal surface side of the crystal piece so as to contact the used first excitation electrode.
　本発明の他の一態様に係る水晶振動素子は、第１主面と第１主面に対向する第２主面を有するとともに、第１主面を平面視したときに中央側に位置する中央部と中央部の外側に位置する周縁部とを有し、第１主面および第２主面のうち少なくとも第１主面側において中央部と周縁部との間に第１側面が形成された、水晶片と、水晶片の第１主面のうち、中央部に設けられた第１励振電極と、水晶片の第２主面のうち、中央部に設けられ、第１励振電極と対向する第２励振電極と、第１励振電極に電気的に接続された第１引出電極と、第２励振電極に電気的に接続された第２引出電極と、を備え、少なくとも第１引出電極は、水晶片の第１主面を平面視したときに第１励振電極の少なくとも一部を覆っており、中央部から周縁部に亘って延在する。 A quartz crystal vibrating element according to another aspect of the present invention has a first main surface and a second main surface opposite to the first main surface, and a center located on the center side when the first main surface is viewed in plan. And a peripheral portion located outside the central portion, and a first side surface is formed between the central portion and the peripheral portion on at least the first main surface side of the first main surface and the second main surface A quartz crystal piece, a first excitation electrode provided at a central portion of the first principal surface of the quartz crystal piece, and a central portion of a second principal surface of the quartz crystal piece facing the first excitation electrode A second excitation electrode, a first extraction electrode electrically connected to the first excitation electrode, and a second extraction electrode electrically connected to the second excitation electrode, at least the first extraction electrode comprising When viewed in plan, the first main surface of the crystal piece covers at least a portion of the first excitation electrode, and extends from the central portion to the peripheral portion That.
　本発明によれば、振動特性の製造誤差を低減できる水晶振動素子およびその製造方法の提供が可能となる。 According to the present invention, it is possible to provide a quartz crystal vibrating element capable of reducing a manufacturing error of vibration characteristics and a method of manufacturing the same.
図１は、第１実施形態にかかる水晶振動子の構成を概略的に示す分解斜視図である。FIG. 1 is an exploded perspective view schematically showing the configuration of a quartz oscillator according to the first embodiment. 図２は、図１に示した水晶振動子のＩＩ－ＩＩ線に沿った断面の構成を概略的に示す断面図である。FIG. 2 is a cross sectional view schematically showing a configuration of a cross section taken along line II-II of the quartz oscillator shown in FIG. 図３は、図２に示した水晶振動素子の構成を概略的に示す断面図である。FIG. 3 is a cross-sectional view schematically showing the configuration of the quartz crystal vibrating element shown in FIG. 図４は、第１実施形態にかかる水晶振動素子の製造方法の一部を概略的に示すフローチャートである。FIG. 4 is a flow chart schematically showing a part of the method of manufacturing a quartz crystal vibrating element according to the first embodiment. 図５は、図４に示したフローチャートに続き、第１実施形態にかかる水晶振動素子の製造方法を概略的に示すフローチャートである。FIG. 5 is a flowchart schematically showing a method of manufacturing the crystal vibrating element according to the first embodiment, following the flowchart shown in FIG. 図６は、水晶片をエッチングする工程を概略的に示す断面図である。FIG. 6 is a cross-sectional view schematically showing a process of etching a crystal piece. 図７は、第２密着層および第２導電層を設ける工程を概略的に示す断面図である。FIG. 7 is a cross sectional view schematically showing a step of providing a second adhesive layer and a second conductive layer. 図８は、フォトレジストをパターニングする工程を概略的に示す断面図である。FIG. 8 is a cross sectional view schematically showing a process of patterning a photoresist. 図９は、第２密着層および第２導電層をエッチングする工程を概略的に示す断面図である。FIG. 9 is a cross sectional view schematically showing a step of etching the second adhesive layer and the second conductive layer. 図１０は、中央部の電極表面を削る工程を概略的に示す断面図である。FIG. 10 is a cross-sectional view schematically showing a process of scraping the electrode surface in the central portion. 図１１は、第２実施形態にかかる水晶振動子の構成を概略的に示す断面図である。FIG. 11 is a cross-sectional view schematically showing a configuration of a crystal unit according to a second embodiment. 図１２は、第３実施形態にかかる水晶振動子の構成を概略的に示す分解斜視図である。FIG. 12 is an exploded perspective view schematically showing the configuration of a crystal unit according to a third embodiment. 図１３は、第３実施形態にかかる水晶振動子の構成を概略的に示す断面図である。FIG. 13 is a cross-sectional view schematically showing a configuration of a crystal unit according to a third embodiment. 図１４は、第４実施形態にかかる水晶振動素子の構成を概略的に示す斜視図である。FIG. 14 is a perspective view schematically showing the configuration of a quartz crystal vibrating element according to a fourth embodiment.
　以下、図面を参照しながら本発明の実施形態について説明する。但し、第２実施形態以降において、第１実施形態と同一または類似の構成要素は、第１実施形態と同一または類似の符号で表し、詳細な説明を適宜省略する。また、第２実施形態以降の実施形態において得られる効果について、第１実施形態と同様のものについては説明を適宜省略する。各実施形態の図面は例示であり、各部の寸法や形状は模式的なものであり、本願発明の技術的範囲を当該実施形態に限定して解するべきではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, in the second and subsequent embodiments, the same or similar components as or to those of the first embodiment are denoted by the same or similar reference numerals as those of the first embodiment, and the detailed description will be appropriately omitted. Further, with regard to the effects obtained in the second and subsequent embodiments, the description of the same effects as those of the first embodiment will be appropriately omitted. The drawings of the respective embodiments are exemplifications, and the dimensions and shapes of the respective parts are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiments.
　＜第１実施形態＞
　まず、図１～図３を参照しつつ、本発明の第１実施形態に係る水晶振動子１の構成について説明する。図１は、第１実施形態にかかる水晶振動子の構成を概略的に示す分解斜視図である。図２は、図１に示した水晶振動子のＩＩ－ＩＩ線に沿った断面の構成を概略的に示す断面図である。図３は、図２に示した水晶振動素子の構成を概略的に示す断面図である。なお、図中に示した第１方向Ｄ１、第２方向Ｄ２、および第３方向Ｄ３は、それぞれ互いに直交する方向である。なお、第１方向Ｄ１、第２方向Ｄ２、および第３方向Ｄ３は、互いに９０°以外の角度で交差する方向であってもよい。また、第１方向Ｄ１、第２方向Ｄ２、および第３方向Ｄ３は、図１に示す矢印の方向（正方向）に限定されず、矢印とは反対の方向（負方向）も含む。 First Embodiment
First, the configuration of the crystal unit 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is an exploded perspective view schematically showing the configuration of a quartz oscillator according to the first embodiment. FIG. 2 is a cross sectional view schematically showing a configuration of a cross section taken along line II-II of the quartz oscillator shown in FIG. FIG. 3 is a cross-sectional view schematically showing the configuration of the quartz crystal vibrating element shown in FIG. The first direction D1, the second direction D2, and the third direction D3 shown in the drawing are directions orthogonal to each other. The first direction D1, the second direction D2, and the third direction D3 may be directions intersecting each other at an angle other than 90 °. Further, the first direction D1, the second direction D2, and the third direction D3 are not limited to the direction (positive direction) of the arrow shown in FIG. 1, but also includes the direction (negative direction) opposite to the arrow.
　水晶振動子（Ｑｕａｒｔｚ　Ｃｒｙｓｔａｌ　Ｒｅｓｏｎａｔｏｒ　Ｕｎｉｔ）１は圧電振動子（Ｐｉｅｚｏｅｌｃｔｒｉｃ　Ｒｅｓｏｎａｔｏｒ　Ｕｎｉｔ）の一種であり、印加電圧に応じて水晶振動素子（Ｑｕａｒｔｚ　Ｃｒｙｓｔａｌ　Ｒｅｓｏｎａｔｏｒ）１０を励振させる。水晶振動素子１０は、印加電圧に応じて振動する圧電体として水晶片（Ｑｕａｒｔｚ　Ｃｒｙｓｔａｌ　Ｅｌｅｍｅｎｔ）１１を利用する。 A quartz crystal resonator unit (Quartz Crystal Resonator Unit) 1 is a type of piezoelectric vibrator (Piezoelctric Resonator Unit), and excites a quartz crystal resonator element (Quartz Crystal Resonator) 10 according to an applied voltage. The crystal vibrating element 10 utilizes a quartz crystal element 11 as a piezoelectric body that vibrates according to an applied voltage.
　図１に示すように、水晶振動子１は、水晶振動素子１０と、蓋部材２０と、ベース部材３０と、接合部材４０と、を備える。ベース部材３０および蓋部材２０は、水晶振動素子１０を収容するための保持器である。ここで図示した例では、蓋部材２０は凹状、具体的には開口部を有する箱状、をなしており、ベース部材３０は平板状をなしている。蓋部材２０およびベース部材３０の形状は、上記に限定されるものではなく、例えばベース部材が凹状をなしていてもよく、蓋部材およびベース部材の両方が互いに対向する側に開口部を有する凹状であってもよい。 As shown in FIG. 1, the crystal unit 1 includes a crystal vibrating element 10, a lid member 20, a base member 30, and a bonding member 40. The base member 30 and the lid member 20 are a holder for housing the quartz crystal vibrating element 10. In the example illustrated here, the lid member 20 has a concave shape, specifically a box shape having an opening, and the base member 30 has a flat shape. The shapes of the lid member 20 and the base member 30 are not limited to the above, and for example, the base member may have a concave shape, and the concave member has an opening on the side where both the lid member and the base member face each other. It may be
　水晶振動素子１０は、薄片状の水晶片１１を有する。水晶片１１は、互いに対向する第１主面１１ａおよび第２主面１１ｂを有する。第１主面１１ａは、ベース部材３０と対向する側とは反対側に位置し、第２主面１１ｂは、ベース部材３０と対向する側に位置している。 The quartz crystal vibrating element 10 has a thin plate-like quartz piece 11. The crystal piece 11 has a first main surface 11a and a second main surface 11b facing each other. The first major surface 11 a is located on the opposite side to the side facing the base member 30, and the second major surface 11 b is located on the side facing the base member 30.
　水晶片１１は、例えば、ＡＴカット型の水晶片である。ＡＴカット型の水晶片の主面は、Ｘ軸およびＺ´軸によって特定される面と平行な面（以下、「ＸＺ´面」と呼ぶ。他の軸または他の方向によって特定される面についても同様である。）である。したがって、水晶片１１の第１主面１１ａおよび第２主面１１ｂは、それぞれＸＺ´面に相当する。ＡＴカット型の水晶片は、例えば、結晶成長させた人工水晶（Ｓｙｎｔｈｅｔｉｃ　Ｑｕａｒｔｚ　Ｃｒｙｓｔａｌ）を切断および研磨加工して得られる水晶基板をエッチング加工することで形成される。なお、Ｘ軸、Ｙ軸、Ｚ軸は、水晶の結晶軸（Ｃｒｙｓｔａｌｌｏｇｒａｐｈｉｃ　Ａｘｅｓ）であり、Ｘ軸が電気軸、Ｙ軸が機械軸、Ｚ軸が光学軸に相当する。Ｙ´軸およびＺ´軸は、それぞれ、Ｙ軸およびＺ軸をＸ軸の周りにＹ軸からＺ軸の方向に３５度１５分±１分３０秒回転させた軸である。なお、水晶片のカット角度は、ＡＴカット以外の異なるカット（例えばＢＴカットなど）を適用してもよい。 The crystal piece 11 is, for example, an AT cut type crystal piece. The main surface of the AT-cut quartz crystal piece is hereinafter referred to as a plane parallel to the plane specified by the X-axis and Z'-axis (hereinafter referred to as "XZ 'plane". About planes specified by other axes or other directions The same is true. Therefore, the first major surface 11 a and the second major surface 11 b of the quartz crystal piece 11 correspond to the XZ ′ plane, respectively. The AT-cut type crystal piece is formed, for example, by etching a quartz substrate obtained by cutting and polishing a synthetic crystal which has been crystal grown. The X axis, the Y axis, and the Z axis are crystallographic axes of crystal (Crystallographic Axes), the X axis corresponds to an electric axis, the Y axis corresponds to a mechanical axis, and the Z axis corresponds to an optical axis. The Y ′ axis and the Z ′ axis are axes obtained by rotating the Y axis and the Z axis around the X axis by 35 degrees 15 minutes ± 1 minute 30 seconds in the direction from the Y axis to the Z axis. In addition, the cut angle of a crystal piece may apply different cut (for example, BT cut etc.) other than AT cut.
　ＡＴカット型の水晶片１１は、Ｘ軸方向に平行な長辺が延在する長辺方向と、Ｚ´軸方向に平行な短辺が延在する短辺方向と、Ｙ´軸方向に平行な厚さが延在する厚さ方向とを有する。水晶片１１は、第１主面１１ａを平面視したときに矩形状をなしており、中央に位置し励振に寄与する中央部１７と、Ｘ軸の負方向側で中央部１７と隣り合う周縁部１８と、Ｘ軸の正方向側で中央部１７と隣り合う周縁部１９と、を有している。中央部１７及び周縁部１８，１９は、それぞれ、Ｚ´軸方向に沿って帯状に設けられており、水晶片１１のＺ´軸方向で対向する一端から他端に亘って延びている。したがって、水晶片１１の第１主面１１ａは、中央部１７の第１主面１７ａ、周縁部１８の第１主面１８ａ、および周縁部１９の第１主面１９ａを含む。同様に、水晶片１１の第２主面１１ｂは、中央部１７の第２主面１７ｂ、周縁部１８の第２主面１８ｂ、および周縁部１９の第２主面１９ｂを含む。 The AT cut type crystal piece 11 has a long side direction in which a long side parallel to the X axis direction extends, a short side direction in which a short side parallel to the Z ′ axis direction extends, and a parallel side in the Y ′ axis direction Thickness extending in the thickness direction. The crystal piece 11 has a rectangular shape when the first main surface 11 a is viewed in plan, and a central portion 17 located at the center and contributing to excitation, and a peripheral edge adjacent to the central portion 17 on the negative direction side of the X axis. It has a portion 18 and a peripheral portion 19 adjacent to the central portion 17 on the positive direction side of the X axis. The central portion 17 and the peripheral portions 18 and 19 are each provided in the shape of a strip along the Z ′ axis direction, and extend from one end to the other end of the quartz piece 11 opposite in the Z ′ axis direction. Therefore, the first major surface 11 a of the crystal piece 11 includes the first major surface 17 a of the central portion 17, the first major surface 18 a of the peripheral portion 18, and the first major surface 19 a of the peripheral portion 19. Similarly, the second major surface 11 b of the crystal piece 11 includes the second major surface 17 b of the central portion 17, the second major surface 18 b of the peripheral portion 18, and the second major surface 19 b of the peripheral portion 19.
　水晶片１１は、中央部１７が周縁部１８，１９よりも厚いメサ型構造である。具体的には、中央部１７と周縁部１８との間に、中央部１７の第１主面１７ａと周縁部１８の第１主面１８ａとをつなぐ第１側面１２ａが形成され、中央部１７の第２主面１７ｂと周縁部１８の第２主面１８ｂとをつなぐ第２側面１２ｂが形成されている。同様に、中央部１７と周縁部１９との間には段差が形成され、中央部１７の第１主面１７ａと周縁部１９の第１主面１９ａとをつなぐ第１側面１３ａが形成され、中央部１７の第２主面１７ｂと周縁部１９の第２主面１９ｂとをつなぐ第２側面１３ｂが形成されている。このように、水晶片１１の第１主面１１ａおよび第２主面１１ｂには、それぞれ、中央部１７と周縁部１８との間、および、中央部１７と周縁部１９との間において段差が形成されている。 The crystal piece 11 is a mesa structure in which the central portion 17 is thicker than the peripheral portions 18 and 19. Specifically, a first side surface 12 a connecting the first major surface 17 a of the central portion 17 and the first major surface 18 a of the peripheral portion 18 is formed between the central portion 17 and the peripheral portion 18. A second side surface 12b connecting the second main surface 17b of the second embodiment and the second main surface 18b of the peripheral portion 18 is formed. Similarly, a step is formed between the central portion 17 and the peripheral portion 19, and a first side surface 13a connecting the first major surface 17a of the central portion 17 and the first major surface 19a of the peripheral portion 19 is formed. A second side surface 13 b connecting the second major surface 17 b of the central portion 17 and the second major surface 19 b of the peripheral portion 19 is formed. Thus, on the first main surface 11a and the second main surface 11b of the crystal piece 11, there are steps between the central portion 17 and the peripheral portion 18, and between the central portion 17 and the peripheral portion 19, respectively. It is formed.
　水晶片１１の第１側面１２ａ，１３ａ、および第２側面１２ｂ，１３ｂは、それぞれ、水晶片１１の第１主面１１ａおよび第２主面１１ｂと直交する方向に延在する。言い換えれば、水晶片１１の第１側面１２ａ，１３ａ、および第２側面１２ｂ，１３ｂは、Ｙ´Ｚ´面に沿って延在している。なお、水晶片１１の第１側面１２ａ，１３ａ、および第２側面１２ｂ，１３ｂはそれぞれテーパ状に形成されてもよい。例えば、第１側面１２ａおよび第２側面１３ｂがＹ´軸正方向からＸ軸正方向へ傾いた方向に延在し、第２側面１２ｂおよび第１側面１３ａがＹ´軸正方向からＸ軸負方向へ傾いた方向に延在してもよい。また、図１に示す例では、中央部１７と周縁部１８，１９との間において、第１主面１１ａ側および第２主面１１ｂ側の両方に段差が形成される態様を示しているが、変形例として第１主面１１ａ側および第２主面１１ｂ側のいずれか一方の面にのみ段差が形成されてもよい。 The first side surfaces 12a and 13a and the second side surfaces 12b and 13b of the crystal piece 11 extend in the direction orthogonal to the first main surface 11a and the second main surface 11b of the crystal piece 11, respectively. In other words, the first side faces 12a and 13a and the second side faces 12b and 13b of the crystal piece 11 extend along the Y′Z ′ plane. The first side surfaces 12a and 13a and the second side surfaces 12b and 13b of the crystal piece 11 may be tapered. For example, the first side surface 12a and the second side surface 13b extend in a direction inclined from the Y'-axis positive direction to the X-axis positive direction, and the second side surface 12b and the first side surface 13a are X-axis negative from the Y'-axis positive direction. It may extend in a direction inclined to the direction. Further, in the example shown in FIG. 1, there is shown a mode in which a step is formed on both the first main surface 11 a side and the second main surface 11 b side between the central portion 17 and the peripheral portions 18 and 19. As a modification, a level | step difference may be formed only in any one surface by the side of the 1st main surface 11a and the 2nd main surface 11b.
　水晶片１１は、中央部と周縁部との間に側面が形成される形状であれば上記に限定されるものではない。例えば、水晶片１１は、Ｚ´軸正方向または負方向で中央部１７と隣り合う周縁部が設けられてもよい。また、水晶片１１はメサ型構造に限定されるものではなく、中央部１７が周縁部１８，１９よりも薄い逆メサ型構造であってもよい。中央部１７と周縁部１８，１９との厚みの変化が連続的に変化するコンベックス形状またはベヘル形状であってもよい。後述するように、中央部と周縁部との間にスリットが形成されてもよい。なお、水晶片１１の形状は板状に限定されるものではなく、例えば、第１主面１１ａを平面視したときに、一対の平行な両腕部と、両腕部を連結する連結部と、を有する櫛歯型などであってもよい。 The quartz crystal piece 11 is not limited to the above as long as the side surface is formed between the central portion and the peripheral portion. For example, the crystal piece 11 may be provided with a peripheral edge adjacent to the central portion 17 in the positive or negative direction of the Z ′ axis. Further, the crystal piece 11 is not limited to the mesa structure, and the central portion 17 may be a reverse mesa structure thinner than the peripheral portions 18 and 19. The change in thickness of the central portion 17 and the peripheral portions 18 and 19 may be a convex shape or a bevel shape which changes continuously. As described below, a slit may be formed between the central portion and the peripheral portion. The shape of the crystal piece 11 is not limited to a plate, and for example, when the first major surface 11 a is viewed in plan, a pair of parallel both arm portions and a connecting portion that connects the both arm portions And may be comb-tooth shaped.
　図１および図２に示した例では、水晶振動素子１０は、Ｘ軸が第１方向Ｄ１と平行であり、Ｚ´軸が第２方向Ｄ２と平行であり、Ｙ´軸が第３方向Ｄ３と平行となるように定められている。 In the example shown in FIGS. 1 and 2, in the quartz crystal vibrating element 10, the X axis is parallel to the first direction D1, the Z 'axis is parallel to the second direction D2, and the Y' axis is the third direction D3. It is determined to be parallel to the
　水晶振動素子１０は、一対の電極を構成する第１励振電極１４ａおよび第２励振電極１４ｂを備えている。第１励振電極１４ａは、中央部１７の第１主面１７ａに設けられている。また、第２励振電極１４ｂは、中央部１７の第２主面１７ｂに設けられている。第１励振電極１４ａと第２励振電極１４ｂは、第３方向Ｄ３において、水晶片１１を挟んで互いに対向している。第１励振電極１４ａと第２励振電極１４ｂとは、ＸＺ´面において略全体が重なり合うように配置されている。第１励振電極１４ａおよび第２励振電極１４ｂは、それぞれ、Ｘ軸方向に平行な長辺と、Ｚ´軸方向に平行な短辺と、Ｙ´軸方向に平行な厚さとを有している。 The quartz crystal vibrating element 10 includes a first excitation electrode 14 a and a second excitation electrode 14 b that constitute a pair of electrodes. The first excitation electrode 14 a is provided on the first major surface 17 a of the central portion 17. The second excitation electrode 14 b is provided on the second major surface 17 b of the central portion 17. The first excitation electrode 14a and the second excitation electrode 14b are opposed to each other with the quartz crystal piece 11 in between in the third direction D3. The first excitation electrode 14 a and the second excitation electrode 14 b are disposed so that substantially the whole overlap in the XZ ′ plane. Each of the first excitation electrode 14a and the second excitation electrode 14b has a long side parallel to the X-axis direction, a short side parallel to the Z'-axis direction, and a thickness parallel to the Y'-axis direction. .
　中央部１７の第１主面１７ａを平面視したとき、第１励振電極１４ａの外縁は、中央部１７における第１側面１２ａとの境界に至るまで延在している。また、中央部１７の第２主面１７ｂを平面視したとき、第２励振電極１４ｂの外縁は、中央部１７における第２側面１２ｂとの境界に至るまで延在している。言い換えると、第１励振電極１４ａの中央部１７と対向する主面の外形は、中央部１７の第１主面１７ａの外形と一致している。また、第２励振電極１４ｂの中央部１７と対向する主面の外形は、中央部１７の第２主面１７ｂの外形と一致している。これによれば、中央部１７における励振に寄与する領域の利用効率が改善し、水晶振動素子１０が小型化できる。また、中央部１７において励振された振動の閉じ込め効率が改善できる。 When the first major surface 17 a of the central portion 17 is viewed in plan, the outer edge of the first excitation electrode 14 a extends to the boundary with the first side surface 12 a of the central portion 17. Further, when the second major surface 17 b of the central portion 17 is viewed in plan, the outer edge of the second excitation electrode 14 b extends to the boundary between the central portion 17 and the second side surface 12 b. In other words, the outer shape of the main surface facing the central portion 17 of the first excitation electrode 14 a matches the outer shape of the first main surface 17 a of the central portion 17. The outer shape of the main surface facing the central portion 17 of the second excitation electrode 14 b matches the outer shape of the second main surface 17 b of the central portion 17. According to this, the utilization efficiency of the region contributing to the excitation in the central portion 17 is improved, and the crystal vibrating element 10 can be miniaturized. Moreover, the confinement efficiency of the vibration excited in the center part 17 can be improved.
　水晶振動素子１０は、一対の第１引出電極１５ａおよび第２引出電極１５ｂと、一対の第１接続電極１６ａおよび第２接続電極１６ｂと、を有している。第１接続電極１６ａは、第１引出電極１５ａを介して第１励振電極１４ａと電気的に接続されている。また、第２接続電極１６ｂは、第２引出電極１５ｂを介して第２励振電極１４ｂと電気的に接続されている。第１接続電極１６ａおよび第２接続電極１６ｂは、それぞれ、第１励振電極１４ａおよび第２励振電極１４ｂをベース部材３０に電気的に接続するための端子である。 The quartz crystal vibrating element 10 has a pair of first lead electrodes 15a and second lead electrodes 15b, and a pair of first connection electrodes 16a and second connection electrodes 16b. The first connection electrode 16a is electrically connected to the first excitation electrode 14a via the first lead electrode 15a. The second connection electrode 16b is electrically connected to the second excitation electrode 14b via the second lead electrode 15b. The first connection electrode 16a and the second connection electrode 16b are terminals for electrically connecting the first excitation electrode 14a and the second excitation electrode 14b to the base member 30, respectively.
　第１引出電極１５ａは、水晶片１１の第１主面１１ａを平面視したときに第１励振電極１４ａの一部を覆っており、第１主面１１ａにおいて中央部１７から第１側面１２ａを通って周縁部１８に亘って延在している。第１引出電極１５ａは、さらに、周縁部１８の第１主面１８ａ上を通って第２主面１８ｂに至るまで引き回されている。第２引出電極１５ｂは、水晶片１１の第２主面１１ｂを平面視したときに第２励振電極１４ｂの一部を覆っており、第２主面１１ｂにおいて中央部１７から第２側面１２ｂを通って周縁部１８に亘って延在している。第１引出電極１５ａが第１励振電極１４ａの少なくとも一部を覆っているため、第１励振電極１４ａと第１引出電極１５ａとの接触面積が増加し、電気的接続が安定する。また、水晶片１１の角部では電極の剥離等の損傷が生じやすいため、第１引出電極１５ａが第１励振電極１４ａの端部を覆っていることで、第１励振電極１４ａの損傷が抑制できる。したがって、水晶振動素子１０の周波数特性の劣化が抑制できる。 The first lead-out electrode 15a covers a part of the first excitation electrode 14a when the first main surface 11a of the crystal piece 11 is viewed in plan, and the first side surface 12a from the central portion 17 in the first main surface 11a. It extends through the periphery 18. The first lead-out electrode 15a is further drawn around the first major surface 18a of the peripheral portion 18 to the second major surface 18b. The second lead-out electrode 15b covers a part of the second excitation electrode 14b when the second major surface 11b of the crystal piece 11 is viewed in plan, and the second side surface 12b is separated from the central portion 17 in the second major surface 11b. It extends through the periphery 18. Since the first lead-out electrode 15a covers at least a part of the first excitation electrode 14a, the contact area between the first excitation electrode 14a and the first lead-out electrode 15a is increased, and the electrical connection is stabilized. Further, since damage such as peeling of the electrode is likely to occur at the corner of the crystal piece 11, the first lead electrode 15a covers the end of the first excitation electrode 14a, thereby suppressing the damage of the first excitation electrode 14a. it can. Therefore, the deterioration of the frequency characteristic of the crystal vibrating element 10 can be suppressed.
　なお、第１引出電極１５ａは、水晶片１１の第１主面１１ａを平面視したときに第１励振電極１４ａを覆わずに、第１励振電極１４ａに隣接してもよい。また、第１引出電極１５ａは、水晶片１１の第１主面１１ａを平面視したときに第１励振電極１４ａの全体を覆ってもよい。同様に、第２引出電極１５ｂは、水晶片１１の第２主面１１ｂを平面視したときに、第２励振電極１４ｂに隣接してもよく、第２励振電極１４ｂの全体を覆ってもよい。 The first lead-out electrode 15a may be adjacent to the first excitation electrode 14a without covering the first excitation electrode 14a when the first major surface 11a of the crystal piece 11 is viewed in plan. The first lead-out electrode 15a may cover the entire first excitation electrode 14a when the first major surface 11a of the crystal piece 11 is viewed in plan. Similarly, the second lead-out electrode 15b may be adjacent to the second excitation electrode 14b when the second major surface 11b of the crystal piece 11 is viewed in plan, and may cover the entire second excitation electrode 14b. .
　第１接続電極１６ａは周縁部１８の第２主面１８ｂに設けられ、第２接続電極１６ｂは周縁部１８の第２主面１８ｂに設けられている。第１引出電極１５ａおよび第１接続電極１６ａは一体的に形成されている。第２引出電極１５ｂおよび第２接続電極１６ｂも一体的に形成されている。 The first connection electrode 16 a is provided on the second major surface 18 b of the peripheral portion 18, and the second connection electrode 16 b is provided on the second major surface 18 b of the peripheral portion 18. The first lead electrode 15a and the first connection electrode 16a are integrally formed. The second lead electrode 15b and the second connection electrode 16b are also integrally formed.
　図３に示すように、上記の各種電極は、それぞれ多層構造となっている。第１励振電極１４ａは、第１密着層５１および第１導電層５２を備えている。第１密着層５１は、水晶片１１に対して第１導電層５２よりも高い密着性を有している。第１密着層５１は、水晶片１１の第１主面１１ａ側に設けられ、中央部１７の第１主面１７ａに接触している。第１導電層５２は、第１密着層５１よりも高い導電性を有し、第１密着層５１よりも高い化学的安定性を有している。第１導電層５２は、水晶片１１の第１主面１１ａを平面視したときに第１密着層５１を覆っている。第２励振電極１４ｂも同様に、水晶片１１の第２主面１１ｂ側に設けられ中央部１７の第２主面１７ｂに接触する第１密着層５３と、水晶片１１の第２主面１１ｂを平面視したときに第１密着層５３を覆う第１導電層５４とを備えている。但し、第１励振電極１４ａおよび第２励振電極１４ｂは２層構造に限定されるものではなく、単層構造であってもよく、３層以上の多層構造であってもよい。 As shown in FIG. 3, each of the various electrodes described above has a multilayer structure. The first excitation electrode 14 a includes a first contact layer 51 and a first conductive layer 52. The first adhesion layer 51 has higher adhesion to the quartz piece 11 than the first conductive layer 52. The first adhesion layer 51 is provided on the first main surface 11 a side of the crystal piece 11 and is in contact with the first main surface 17 a of the central portion 17. The first conductive layer 52 has conductivity higher than that of the first adhesion layer 51 and chemical stability higher than that of the first adhesion layer 51. The first conductive layer 52 covers the first adhesion layer 51 when the first main surface 11 a of the crystal piece 11 is viewed in plan. Similarly, the second excitation electrode 14b is provided on the second principal surface 11b side of the quartz piece 11 and in contact with the second principal surface 17b of the central portion 17 and the second principal surface 11b of the quartz piece 11 And a first conductive layer 54 covering the first adhesive layer 53 when viewed in plan. However, the first excitation electrode 14 a and the second excitation electrode 14 b are not limited to the two-layer structure, and may be a single layer structure or a multilayer structure of three or more layers.
　第１引出電極１５ａは、第２密着層５５および第２導電層５６を備えている。第２密着層５５は、水晶片１１に対して第２導電層５６よりも高い密着性を有している。第２密着層５５は、水晶片１１の第１主面１１ａ側に設けられ、中央部１７の第１主面１７ａおよび第２主面１７ｂに接触している。第２密着層５５は、第２側面１２ｂにも接触し、第１励振電極１４ａの端部、すなわち第１導電層５２の端部を覆っている。第２導電層５６は、第２密着層５５よりも高い導電性を有し、第２密着層５５よりも高い化学的安定性を有している。第２導電層５６は、水晶片１１の第１主面１１ａおよび第２主面１１ｂを平面視したときに第２密着層５５を覆っている。すなわち、中央部１７の第１引出電極１５ａが第１励振電極１４ａに重なる領域においては電極が４層構造からなり、第１導電層５２が第１密着層５１を覆い、第２密着層５５が第１導電層５２を覆い、第２導電層５６が第２密着層５５を覆っている。 The first lead-out electrode 15 a includes a second contact layer 55 and a second conductive layer 56. The second adhesion layer 55 has higher adhesion to the crystal piece 11 than the second conductive layer 56. The second adhesion layer 55 is provided on the first main surface 11 a side of the crystal piece 11 and is in contact with the first main surface 17 a and the second main surface 17 b of the central portion 17. The second adhesive layer 55 is also in contact with the second side surface 12 b and covers the end of the first excitation electrode 14 a, that is, the end of the first conductive layer 52. The second conductive layer 56 has conductivity higher than that of the second adhesion layer 55 and chemical stability higher than that of the second adhesion layer 55. The second conductive layer 56 covers the second adhesion layer 55 when the first major surface 11 a and the second major surface 11 b of the crystal piece 11 are viewed in plan. That is, in a region where the first lead electrode 15a of the central portion 17 overlaps the first excitation electrode 14a, the electrode has a four-layer structure, the first conductive layer 52 covers the first adhesive layer 51, and the second adhesive layer 55 The first conductive layer 52 is covered, and the second conductive layer 56 covers the second adhesion layer 55.
　なお、第１接続電極１６ａは、第１引出電極１５ａと一体的に形成されているため、第１引出電極１５ａと同様に第２密着層５５および第２導電層５６を備えている。図３には図示されていないが、第２引出電極１５ｂおよび第２接続電極１６ｂも同様に、第２密着層および第２導電層を備えている。但し、第１引出電極１５ａ、第２引出電極１５ｂ、第１接続電極１６ａ、および第２接続電極１６ｂは２層構造に限定されるものではなく、単層構造であってもよく、３層以上の多層構造であってもよい。 In addition, since the first connection electrode 16a is integrally formed with the first lead electrode 15a, the second connection layer 55 and the second conductive layer 56 are provided similarly to the first lead electrode 15a. Although not shown in FIG. 3, the second lead electrode 15 b and the second connection electrode 16 b are similarly provided with a second adhesion layer and a second conductive layer. However, the first extraction electrode 15a, the second extraction electrode 15b, the first connection electrode 16a, and the second connection electrode 16b are not limited to a two-layer structure, and may have a single-layer structure, and three or more layers It may be a multilayer structure of
　第１励振電極１４ａの第１密着層５１、第２励振電極１４ｂの第１密着層５３、および第１引出電極１５ａの第２密着層５５は、それぞれ、クロム（Ｃｒ）を含む金属材料からなる。第１励振電極１４ａの第１導電層５２、第２励振電極１４ｂの第１導電層５４、および第１引出電極１５ａの第２導電層５６は、それぞれ、金（Ａｕ）を含む金属材料からなる。下地に酸素との反応性が高いＣｒ層を設けることで水晶片と電極との密着力が向上し、表面に酸素との反応性が低いＡｕ層を設けることで酸化による電極の劣化が抑制される。これによると、水晶振動素子の信頼性が改善できる。 The first adhesion layer 51 of the first excitation electrode 14a, the first adhesion layer 53 of the second excitation electrode 14b, and the second adhesion layer 55 of the first extraction electrode 15a are each made of a metal material containing chromium (Cr). . The first conductive layer 52 of the first excitation electrode 14a, the first conductive layer 54 of the second excitation electrode 14b, and the second conductive layer 56 of the first extraction electrode 15a are each made of a metal material containing gold (Au) . By providing a Cr layer with high reactivity with oxygen on the base, the adhesion between the quartz piece and the electrode is improved, and by providing an Au layer with low reactivity with oxygen on the surface, deterioration of the electrode due to oxidation is suppressed. Ru. According to this, the reliability of the crystal vibrating element can be improved.
　図３に示すように、第１励振電極１４ａの第１引出電極１５ａから露出した部分の厚さ（以下、第３方向Ｄ３に沿った厚さを、単に「厚さ」を表す。）Ｔ１は、第１励振電極１４ａの第１引出電極１５ａと重なる部分の厚さＴ２よりも小さい（Ｔ１＜Ｔ２）。第１引出電極１５ａの中央部１７に設けられた部分の厚さＴ３は、第１引出電極１５ａの周縁部１８に設けられた部分の厚さＴ４よりも小さい（Ｔ３＜Ｔ４）。第１励振電極１４ａの厚さＴ１の部分は、厚さＴ２の部分と比べると、第１密着層５１の厚さが同等であり、第１導電層５２の厚さが小さくなっている。第１引出電極１５ａの厚さＴ３の部分は、厚さＴ４の部分と比べると、第２密着層５５の厚さが同等であり、第２導電層５６の厚さが小さくなっている。このように、中央部１７に設けられた電極の表面を削り、電極の厚さを調整することによって、水晶振動素子１０の周波数特性が調整できる。 As shown in FIG. 3, the thickness of the portion of the first excitation electrode 14 a exposed from the first lead electrode 15 a (hereinafter, the thickness along the third direction D 3 simply represents “thickness”) T 1. The thickness T2 is smaller than the thickness T2 of the portion of the first excitation electrode 14a overlapping the first lead electrode 15a (T1 <T2). The thickness T3 of the portion provided at the central portion 17 of the first lead electrode 15a is smaller than the thickness T4 of the portion provided at the peripheral portion 18 of the first lead electrode 15a (T3 <T4). The thickness T1 of the first excitation electrode 14a is equal to the thickness of the first adhesion layer 51 as compared to the thickness T2, and the thickness of the first conductive layer 52 is smaller. The thickness T3 of the first lead-out electrode 15a is the same as the thickness of the second adhesion layer 55, and the thickness of the second conductive layer 56 is smaller than that of the thickness T4. Thus, the frequency characteristics of the crystal vibrating element 10 can be adjusted by shaving the surface of the electrode provided in the central portion 17 and adjusting the thickness of the electrode.
　図３に示した構成例においては、中央部１７に設けられた電極は、中央部１７の第１主面１７ａの全面と対向する部分において厚さが小さくなっているが、少なくとも中央部１７の第１主面１７ａの中央部と対向する部分において厚さが小さくなっていればよい。また、必ずしも中央部１７に設けられた電極の表面が削られる必要はなく、第１励振電極１４ａの厚さＴ１と厚さＴ２とが等しくてもよく、第１引出電極１５ａの厚さＴ３と厚さＴ４とが等しくてもよい。 In the configuration example shown in FIG. 3, the thickness of the electrode provided in central portion 17 is small in a portion facing central surface 17 of the entire first main surface 17 a, but at least central portion 17 has The thickness may be reduced at a portion facing the central portion of the first major surface 17a. Further, the surface of the electrode provided at the central portion 17 does not necessarily have to be scraped, and the thickness T1 and the thickness T2 of the first excitation electrode 14a may be equal, and the thickness T3 of the first lead electrode 15a The thickness T4 may be equal.
　蓋部材２０の形状は、凹状をなしており、ベース部材３０の第１主面３２ａに向かって開口した箱状である。蓋部材２０は、ベース部材３０に接合されている。蓋部材２０およびベース部材３０に囲まれた内部空間２６が設けられる。この内部空間２６に水晶振動素子１０が収容される。蓋部材２０の形状は、水晶振動素子１０が収容できれば特に限定されるものではない。一例では、蓋部材２０の形状が、天面部２１の主面を平面視したときに矩形状である。矩形状の蓋部材２０は、例えば、第１方向Ｄ１に平行な長辺と、第２方向Ｄ２に平行な短辺と、第３方向Ｄ３に平行な高さとで定義される。蓋部材２０の材料は、特に限定されるものではないが、例えば金属などの導電体で構成されている。導電体により構成された蓋部材２０は、内部空間２６への電磁波の少なくとも一部を遮蔽する電磁シールド機能を有する。 The shape of the lid member 20 is concave and has a box shape opened toward the first major surface 32 a of the base member 30. The lid member 20 is joined to the base member 30. An internal space 26 surrounded by the lid member 20 and the base member 30 is provided. The crystal vibrating element 10 is accommodated in the internal space 26. The shape of the lid member 20 is not particularly limited as long as the quartz crystal vibrating element 10 can be accommodated. In one example, the shape of the lid member 20 is rectangular when the main surface of the top surface 21 is viewed in plan. The rectangular lid member 20 is defined by, for example, a long side parallel to the first direction D1, a short side parallel to the second direction D2, and a height parallel to the third direction D3. Although the material of the cover member 20 is not particularly limited, it is made of, for example, a conductor such as metal. The lid member 20 made of a conductive material has an electromagnetic shielding function of shielding at least a part of the electromagnetic wave to the internal space 26.
　図２に示すように、蓋部材２０は、内面２４および外面２５を有している。内面２４は、内部空間２６側の面であり、外面２５は、内面２４とは反対側の面である。蓋部材２０は、ベース部材３０の第１主面３２ａに対向する天面部２１と、天面部２１の外縁に接続されており且つ天面部２１の主面に対して交差する方向に延在する側壁部２２と、を有する。また、蓋部材２０は、凹状の開口端部（側壁部２２のベース部材３０に近い側の端部）においてベース部材３０の第１主面３２ａに対向する対向面２３を有する。この対向面２３は、水晶振動素子１０の周囲を囲むように枠状に延在している。 As shown in FIG. 2, the lid member 20 has an inner surface 24 and an outer surface 25. The inner surface 24 is a surface on the inner space 26 side, and the outer surface 25 is a surface opposite to the inner surface 24. The lid member 20 is connected to the top surface 21 facing the first main surface 32 a of the base member 30 and the outer edge of the top surface 21 and is a sidewall extending in a direction intersecting the main surface of the top surface 21. And 22. Further, the lid member 20 has an opposing surface 23 opposed to the first major surface 32 a of the base member 30 at the concave opening end (the end of the side wall 22 closer to the base member 30). The facing surface 23 extends in a frame shape so as to surround the periphery of the crystal vibrating element 10.
　ベース部材３０は、水晶振動素子１０を励振可能に保持するものである。ベース部材３０は平板状をなしている。ベース部材３０は、第１方向Ｄ１方向に平行な長辺と、第２方向Ｄ２に平行な短辺と、第３方向Ｄ３に平行な厚さ方向の辺とを有する。 The base member 30 holds the crystal vibrating element 10 so as to be able to excite. The base member 30 has a flat plate shape. The base member 30 has a long side parallel to the first direction D1, a short side parallel to the second direction D2, and a side in a thickness direction parallel to the third direction D3.
　ベース部材３０は基体３１を有する。基体３１は、互いに対向する第１主面３２ａ（表面）および第２主面３２ｂ（裏面）を有する。基体３１は、例えば絶縁性セラミック（アルミナ）などの焼結材である。 The base member 30 has a base 31. The base 31 has a first main surface 32a (front surface) and a second main surface 32b (back surface) facing each other. The base 31 is, for example, a sintered material such as insulating ceramic (alumina).
　ベース部材３０は、第１主面３２ａに設けられた電極パッド３３ａ，３３ｂと、第２主面３２ｂに設けられた外部電極３５ａ，３５ｂ，３５ｃ，３５ｄと、を有する。電極パッド３３ａ，３３ｂは、ベース部材３０と水晶振動素子１０とを電気的に接続するための端子である。また、外部電極３５ａ，３５ｂ，３５ｃ，３５ｄは、図示しない回路基板と水晶振動子１とを電気的に接続するための端子である。電極パッド３３ａは、第３方向Ｄ３に延在するビア電極３４ａを介して外部電極３５ａに電気的に接続され、電極パッド３３ｂは、第３方向Ｄ３に延在するビア電極３４ｂを介して外部電極３５ｂに電気的に接続されている。ビア電極３４ａ，３４ｂは基体３１を第３方向Ｄ３に貫通するビアホール内に形成される。外部電極３５ｃ，３５ｄは、電気信号等が入出力されないダミー電極でもよく、蓋部材２０に接地電位を供給して蓋部材２０の電磁シールド機能を向上させる接地電極であってもよい。外部電極３５ｃ，３５ｄは、省略されてもよい。 The base member 30 has electrode pads 33a and 33b provided on the first major surface 32a, and external electrodes 35a, 35b, 35c and 35d provided on the second major surface 32b. The electrode pads 33 a and 33 b are terminals for electrically connecting the base member 30 and the crystal vibrating element 10. The external electrodes 35a, 35b, 35c, and 35d are terminals for electrically connecting the unshown circuit board and the crystal unit 1. The electrode pad 33a is electrically connected to the external electrode 35a via the via electrode 34a extending in the third direction D3, and the electrode pad 33b is an external electrode via the via electrode 34b extending in the third direction D3. It is electrically connected to 35b. The via electrodes 34a and 34b are formed in via holes penetrating the base 31 in the third direction D3. The external electrodes 35c and 35d may be dummy electrodes to which no electrical signal or the like is input / output, or may be ground electrodes for supplying a ground potential to the lid member 20 to improve the electromagnetic shielding function of the lid member 20. The external electrodes 35c and 35d may be omitted.
　導電性保持部材３６ａ，３６ｂは、ベース部材３０の一対の電極パッド３３ａ，３３ｂに、水晶振動素子１０の一対の接続電極１６ａおよび１６ｂをそれぞれ電気的に接続している。また、導電性保持部材３６ａ，３６ｂは、ベース部材３０の第１主面３２ａに水晶振動素子１０を励振可能に保持している。導電性保持部材３６ａ，３６ｂは、例えば、エポキシ系樹脂あるいはシリコーン系樹脂を主剤とする熱硬化樹脂や紫外線硬化樹脂等を含む導電性接着剤によって構成されており、接着剤に導電性を与えるための導電性粒子等の添加剤を含んでいる。さらに、接着剤の強度を増加させるため、あるいはベース部材と水晶振動素子との間隔を保つために、フィラーが接着剤に添加されてもよい。 The conductive holding members 36a and 36b electrically connect the pair of connection electrodes 16a and 16b of the crystal vibrating element 10 to the pair of electrode pads 33a and 33b of the base member 30, respectively. The conductive holding members 36 a and 36 b hold the crystal vibrating element 10 on the first main surface 32 a of the base member 30 so as to be able to excite. The conductive holding members 36a and 36b are made of, for example, a conductive adhesive containing a thermosetting resin or an ultraviolet curable resin containing an epoxy resin or a silicone resin as a main component, and in order to impart conductivity to the adhesive. And additives such as conductive particles. Furthermore, a filler may be added to the adhesive to increase the strength of the adhesive or to maintain the distance between the base member and the quartz vibrating element.
　ベース部材３０の第１主面３２ａには、封止部材３７が設けられている。図１に示す例では、封止部材３７は、第１主面３２ａを平面視したときに矩形の枠状をなしている。第１主面３２ａを平面視したときに、電極パッド３３ａ，３３ｂは、封止部材３７の内側に配置されており、封止部材３７は水晶振動素子１０を囲むように設けられている。封止部材３７は、導電材料により構成されている。例えば、封止部材３７を電極パッド３３ａ，３３ｂと同じ材料で構成することで、電極パッド３３ａ，３３ｂを設ける工程で同時に封止部材３７を設けることができる。 A sealing member 37 is provided on the first major surface 32 a of the base member 30. In the example shown in FIG. 1, the sealing member 37 has a rectangular frame shape when the first main surface 32 a is viewed in plan. When the first major surface 32 a is viewed in plan, the electrode pads 33 a and 33 b are disposed inside the sealing member 37, and the sealing member 37 is provided so as to surround the crystal vibrating element 10. The sealing member 37 is made of a conductive material. For example, by forming the sealing member 37 with the same material as the electrode pads 33a and 33b, the sealing member 37 can be provided simultaneously in the process of providing the electrode pads 33a and 33b.
　接合部材４０は、蓋部材２０およびベース部材３０の各全周に亘って設けられている。具体的には、接合部材４０は封止部材３７上に設けられ、矩形の枠状に形成されている。封止部材３７および接合部材４０は、蓋部材２０の側壁部２２の対向面２３と、ベース部材３０の第１主面３２ａと、の間に挟まれる。 The bonding member 40 is provided along the entire circumference of the lid member 20 and the base member 30. Specifically, the bonding member 40 is provided on the sealing member 37 and is formed in a rectangular frame shape. The sealing member 37 and the bonding member 40 are sandwiched between the facing surface 23 of the side wall portion 22 of the lid member 20 and the first major surface 32 a of the base member 30.
　蓋部材２０およびベース部材３０の両者が封止部材３７および接合部材４０を挟んで接合されることによって、水晶振動素子１０が、蓋部材２０とベース部材３０とによって囲まれた内部空間（キャビティ）２６に封止される。この場合、内部空間２６は、気圧が大気圧よりも低圧な真空状態が好ましい。これによれば、第１励振電極１４ａおよび第２励振電極１４ｂの酸化による水晶振動子１の周波数特性の経時的な変動などが低減できる。 An internal space (cavity) in which the quartz crystal vibrating element 10 is surrounded by the lid member 20 and the base member 30 by joining the lid member 20 and the base member 30 with the sealing member 37 and the bonding member 40 interposed therebetween. 26 is sealed. In this case, the internal space 26 is preferably in a vacuum state where the pressure is lower than the atmospheric pressure. According to this, it is possible to reduce the temporal variation of the frequency characteristic of the crystal unit 1 due to the oxidation of the first excitation electrode 14a and the second excitation electrode 14b.
　水晶振動子１は、ベース部材３０の外部電極３５ａ，３５ｂを介して、水晶振動素子１０を構成する第１励振電極１４ａおよび第２励振電極１４ｂの間に交番電界が印加される。これにより、厚みすべり振動モード（Ｔｈｉｃｋｎｅｓｓ　Ｓｈｅａｒ　Ｖｉｂｒａｔｉｏｎ　Ｍｏｄｅ）などの所定の振動モードによって水晶片１１が振動し、該振動に伴う共振特性が得られる。 In the quartz crystal vibrator 1, an alternating electric field is applied between the first excitation electrode 14 a and the second excitation electrode 14 b constituting the quartz crystal vibrating element 10 via the external electrodes 35 a and 35 b of the base member 30. Thereby, the crystal piece 11 is vibrated by a predetermined vibration mode such as thickness shear vibration mode, and a resonance characteristic associated with the vibration is obtained.
　次に、図４～図１０を参照しつつ、第１実施形態にかかる水晶振動素子１１０の製造方法について説明する。図４は、第１実施形態にかかる水晶振動素子の製造方法の一部を概略的に示すフローチャートである。図５は、図４に示したフローチャートに続き、第１実施形態にかかる水晶振動素子の製造方法を概略的に示すフローチャートである。図６は、水晶片をエッチングする工程を概略的に示す断面図である。図７は、第２密着層および第２導電層を設ける工程を概略的に示す断面図である。図８は、フォトレジストをパターニングする工程を概略的に示す断面図である。図９は、第２密着層および第２導電層をエッチングする工程を概略的に示す断面図である。図１０は、中央部の電極表面を削る工程を概略的に示す断面図である。 Next, with reference to FIGS. 4 to 10, a method of manufacturing the crystal vibrating device 110 according to the first embodiment will be described. FIG. 4 is a flow chart schematically showing a part of the method of manufacturing a quartz crystal vibrating element according to the first embodiment. FIG. 5 is a flowchart schematically showing a method of manufacturing the crystal vibrating element according to the first embodiment, following the flowchart shown in FIG. FIG. 6 is a cross-sectional view schematically showing a process of etching a crystal piece. FIG. 7 is a cross sectional view schematically showing a step of providing a second adhesive layer and a second conductive layer. FIG. 8 is a cross sectional view schematically showing a process of patterning a photoresist. FIG. 9 is a cross sectional view schematically showing a step of etching the second adhesive layer and the second conductive layer. FIG. 10 is a cross-sectional view schematically showing a process of scraping the electrode surface in the central portion.
　まず、水晶片を準備する（Ｓ１１）。水晶片１１１は、ＸＺ´面が主面となるように人工水晶から切り出された平板状の部材である。水晶片１１１の表面は平坦化処理される。例えば、平坦化処理に化学機械研磨等の研磨処理が用いられる。厚みすべり振動モードの水晶振動素子において、水晶片の厚みの大きさは、圧電振動素子としての周波数特性に大きな影響を与える。このため、狙いの周波数特性を実現できるように、本工程の研磨処理によって水晶片の厚みを調整してもよい。 First, a crystal piece is prepared (S11). The quartz crystal piece 111 is a flat plate-like member cut out from artificial quartz so that the XZ ′ plane is the main surface. The surface of the crystal piece 111 is flattened. For example, polishing processing such as chemical mechanical polishing is used for planarization processing. In the quartz-crystal vibrating element in the thickness shear vibration mode, the size of the thickness of the quartz piece has a great influence on the frequency characteristics as a piezoelectric vibrating element. For this reason, the thickness of the crystal piece may be adjusted by the polishing process of this process so as to realize the targeted frequency characteristics.
　次に、第１密着層を設ける（Ｓ１２）。第１密着層１５１，１５３は、水晶片１１１の第１主面１１１ａおよび第２主面１１１ｂのそれぞれの全面を覆うように形成される。パターニングされる前の第１密着層１５１，１５３は、水晶片１１１を包む一体的な一連の金属膜に相当する。第１密着層１５１，１５３は、例えば、Ｃｒを含む金属材料をスパッタリングによって水晶片１１１の表面に堆積させて形成される。第１密着層１５１，１５３は、厚さが１ｎｍ以上２０ｎｍ以下となるように形成される。第１密着層１５１，１５３の厚さが１ｎｍ以上であることによって、第１励振電極１１４ａおよび第２励振電極１１４ｂの水晶片１１１に対する密着力の低下が抑制できる。これにより、第１励振電極１１４ａおよび第２励振電極１１４ｂの剥離などの損傷の発生が低減できる。また、第１密着層１５１，１５３の厚さが２０ｎｍ以下であることによって、水晶振動素子１１０の振動特性の劣化が抑制できる。 Next, a first adhesion layer is provided (S12). The first adhesion layers 151 and 153 are formed to cover the entire surfaces of the first major surface 111 a and the second major surface 111 b of the crystal piece 111. The first adhesion layers 151 and 153 before being patterned correspond to an integral series of metal films that wrap the crystal piece 111. The first adhesion layers 151 and 153 are formed, for example, by depositing a metal material containing Cr on the surface of the quartz piece 111 by sputtering. The first adhesion layers 151 and 153 are formed to have a thickness of 1 nm or more and 20 nm or less. When the thickness of the first adhesion layers 151 and 153 is 1 nm or more, the decrease in adhesion of the first excitation electrode 114 a and the second excitation electrode 114 b to the crystal piece 111 can be suppressed. As a result, the occurrence of damage such as peeling of the first excitation electrode 114a and the second excitation electrode 114b can be reduced. In addition, when the thickness of the first adhesive layers 151 and 153 is 20 nm or less, the deterioration of the vibration characteristics of the quartz crystal vibrating element 110 can be suppressed.
　次に、第１導電層を設ける（Ｓ１３）。第１導電層１５２，１５４は、それぞれ、水晶片１１１の第１主面１１１ａ側および第２主面１１１ｂ側において、第１密着層１５１，１５３を覆うように形成される。パターニングされる前の第１導電層１５２，１５４は、水晶片１１１を包む第１密着層１５１，１５３を包む一体的な一連の金属膜に相当する。第１導電層１５２，１５４は、Ａｕを含む金属材料をスパッタリングによって第１密着層１５１，１５３の表面に堆積させて形成される。第１導電層１５２，１５４は、厚さが１ｎｍ以上５００ｎｍ以下となるように形成される。第１導電層１５２，１５４の厚さが１ｎｍ以上であることによって、第１励振電極１１４ａおよび第２励振電極１１４ｂに充分な導電性が与えられる。また、第１導電層１５２，１５４によって、下地に相当する第１密着層１５１，１５３の酸化が抑制できる。したがって、水晶振動素子１１０の振動特性の劣化が抑制できる。また、第１導電層１５２，１５４の厚さが５００ｎｍ以下であることによって、Ａｕを含む金属材料の使用量が低減できる。したがって、水晶振動素子１１０の製造コストを低減し、第１導電層１５２，１５４の成膜に要する時間が短縮できる。 Next, a first conductive layer is provided (S13). The first conductive layers 152 and 154 are formed to cover the first adhesion layers 151 and 153 on the first main surface 111 a side and the second main surface 111 b side of the crystal piece 111, respectively. The first conductive layers 152 and 154 before being patterned correspond to an integral series of metal films for wrapping the first adhesion layers 151 and 153 for wrapping the quartz piece 111. The first conductive layers 152 and 154 are formed by depositing a metal material containing Au on the surfaces of the first adhesion layers 151 and 153 by sputtering. The first conductive layers 152 and 154 are formed to have a thickness of 1 nm to 500 nm. When the thickness of the first conductive layers 152 and 154 is 1 nm or more, sufficient conductivity is given to the first excitation electrode 114a and the second excitation electrode 114b. Further, the first conductive layers 152 and 154 can suppress the oxidation of the first adhesion layers 151 and 153 corresponding to the base. Therefore, the deterioration of the vibration characteristic of the quartz crystal vibrating element 110 can be suppressed. In addition, when the thickness of the first conductive layers 152 and 154 is 500 nm or less, the amount of use of the metal material containing Au can be reduced. Therefore, the manufacturing cost of the quartz crystal vibrating element 110 can be reduced, and the time required for forming the first conductive layers 152 and 154 can be shortened.
　第１密着層１５１，１５３および第１導電層１５２，１５４の成膜方法はスパッタリングに限定されるものではなく、ＰＶＤ（Ｐｈｙｓｉｃａｌ　Ｖａｐｏｒ　Ｄｅｐｏｓｉｔｉｏｎ）やＣＶＤ（Ｃｈｅｍｉｃａｌ　Ｖａｐｏｒ　Ｄｅｐｏｓｉｔｏｎ）などの乾式めっき、または電気めっきや無電解めっきなどの湿式めっきによって形成されてもよい。 The film forming method of the first adhesion layer 151, 153 and the first conductive layer 152, 154 is not limited to sputtering, and may be dry plating such as PVD (Physical Vapor Deposition) or CVD (Chemical Vapor Deposition), or electroplating. It may be formed by wet plating such as electroless plating.
　次に、フォトレジストを設ける（Ｓ１４）。フォトレジストは、第１導電層１５２，１５４の全面を覆うように形成される。まず、フォトレジスト溶液をスピンコート法、インジェクション法、グラビアコートなどの印刷法、などによって第１導電層１５２，１５４の全面に塗工する。次に、フォトレジスト溶液を乾燥させて溶媒を除去し、固化させることによって感光性樹脂からなるフォトレジストを形成する。 Next, a photoresist is provided (S14). The photoresist is formed to cover the entire surface of the first conductive layers 152 and 154. First, a photoresist solution is coated on the entire surface of the first conductive layers 152 and 154 by spin coating, injection, printing such as gravure coating, or the like. Next, the photoresist solution is dried to remove the solvent, and solidified to form a photoresist made of a photosensitive resin.
　次に、フォトレジストをパターニングする（Ｓ１５）。フォトレジストは、微細加工への適応性の観点から、露光された部分を溶解によって除去するポジ型の感光性樹脂が望ましい。ポジ型の感光性樹脂を使用する場合、中央部１１７に相当する領域をフォトマスクで遮光した状態でフォトレジストを露光する。その後、現像液によって露光された部分を洗い流す。この結果、フォトマスクの遮光領域の形状がフォトレジストに転写される。この結果、第１導電層１５２，１５４の上に残ったフォトレジストには、中央部１１７の外形がパターニングされる。なお、フォトレジストは、遮光された部分を溶解によって除去するネガ型の感光性樹脂であってもよい。 Next, the photoresist is patterned (S15). The photoresist is preferably a positive photosensitive resin that removes the exposed portion by dissolution from the viewpoint of adaptability to microfabrication. When a positive photosensitive resin is used, the photoresist is exposed in a state where the area corresponding to the central portion 117 is shielded by a photomask. Thereafter, the portion exposed by the developer is washed away. As a result, the shape of the light shielding area of the photomask is transferred to the photoresist. As a result, in the photoresist remaining on the first conductive layers 152 and 154, the outline of the central portion 117 is patterned. The photoresist may be a negative photosensitive resin that removes the light-shielded portion by dissolution.
　次に、第１導電層をエッチングする（Ｓ１６）。第１導電層１５２，１５４の除去加工は、ヨウ化カリウム水溶液を主成分とする第１エッチング液を用いたウェットエッチングによって実施される。ヨウ化カリウム水溶液は、Ａｕに対するエッチングレートが高くＣｒに対するエッチングレートが低いため、露出した第１導電層１５２，１５４をエッチングしつつ、下地に相当する第１密着層１５１，１５３を残留させることができる。 Next, the first conductive layer is etched (S16). The removal process of the first conductive layers 152 and 154 is performed by wet etching using a first etching solution containing a potassium iodide aqueous solution as a main component. Since the potassium iodide aqueous solution has a high etching rate to Au and a low etching rate to Cr, the exposed first conductive layers 152 and 154 may be etched while leaving the first adhesion layers 151 and 153 corresponding to the base. it can.
　次に、第１密着層をエッチングする（Ｓ１７）。第１密着層１５１，１５３の除去加工は、硝酸セリウムアンモニウム水溶液を主成分とする第２エッチング液を用いたウェットエッチングによって実施される。硝酸セリウムアンモニウム水溶液は、Ａｕに対するエッチングレートが低くＣｒに対するエッチングレートが高いため、パターニングされたフォトレジストに覆われて残留した第１導電層１５２，１５４の侵蝕を抑制しつつ、露出した第１密着層１５１，１５３をエッチングできる。 Next, the first adhesion layer is etched (S17). Removal processing of the first adhesion layers 151 and 153 is performed by wet etching using a second etching solution containing a cerium ammonium nitrate aqueous solution as a main component. The aqueous solution of cerium ammonium nitrate has a low etching rate to Au and a high etching rate to Cr, so that the first adhesion is exposed while suppressing the corrosion of the remaining first conductive layer 152, 154 covered with the patterned photoresist. The layers 151, 153 can be etched.
　このように、第１エッチング液および第２エッチング液は、それぞれ、第１密着層と第１導電層とに対するエッチングレートが異なるエッチング液を適宜選択する。エッチングされた第１導電層１５２および第１密着層１５１は第１励振電極１１４ａの外形を形成し、エッチングされた第１導電層１５４および第１密着層１５３は第２励振電極１１４ｂの外形を形成する。なお、第１励振電極１１４ａおよび第２励振電極１１４ｂの外形形成は、ウェットエッチングによるものに限定されず、ドライエッチングなどの他の除去加工によってなされてもよい。 Thus, the first etching solution and the second etching solution appropriately select etching solutions having different etching rates for the first adhesive layer and the first conductive layer, respectively. The etched first conductive layer 152 and the first adhesion layer 151 form the outer shape of the first excitation electrode 114a, and the etched first conductive layer 154 and the first adhesion layer 153 form the outer shape of the second excitation electrode 114b. Do. The outer shapes of the first excitation electrode 114a and the second excitation electrode 114b are not limited to those by wet etching, but may be formed by other removal processing such as dry etching.
　次に、水晶片をエッチングする（Ｓ１８）。ここでは、水晶片１１１の中央部１１７を保護するメタルマスクとして第１励振電極１１４ａおよび第２励振電極１１４ｂを用い、周縁部１１８および周縁部１１９を除去加工する。水晶片１１１の除去加工は、フッ酸によるウェットエッチングによって実施される。これによって、図６に示すように、中央部１１７と周縁部１１８との間に段差が生じ、中央部１１７の第１主面１１７ａと周縁部１１８の第１主面１１８ａとをつなぐ第１側面１１２ａが形成され、中央部１１７の第２主面１１７ｂと周縁部１１８の第２主面１１８ｂとをつなぐ第２側面１１２ｂが形成される。同様に、中央部１１７の第１主面１１７ａと周縁部１１９の第１主面１１９ａとをつなぐ第１側面１１３ａが形成され、中央部１１７の第２主面１１７ｂと周縁部１１９の第２主面１１９ｂとをつなぐ第２側面１１３ｂが形成される。すなわち、水晶片１１１は、平板状の部材から一部が除去されることによって、第１主面１１１ａと第２主面１１１ｂの両側にメサ型構造を有する凹凸状の部材となる。このとき、中央部１１７の第１主面１１７ａにはメタルマスクとして用いた第１励振電極１１４ａが残留し、中央部１１７の第２主面１１７ｂにはメタルマスクとして用いた第２励振電極１１４ｂが残留する。なお、水晶片１１１のメサ型構造の形成はウェットエッチングに限定されるものではなく、ドライエッチングなどの他の除去加工によってなされてもよい。但し、水晶片１１１の除去加工は、第１励振電極１１４ａおよび第２励振電極１１４ｂへのダメージを低減する観点から、ウェットエッチングによるものが望ましい。 Next, the quartz piece is etched (S18). Here, the first excitation electrode 114a and the second excitation electrode 114b are used as a metal mask to protect the central portion 117 of the quartz piece 111, and the peripheral portion 118 and the peripheral portion 119 are removed and processed. The removal process of the quartz piece 111 is implemented by wet etching with hydrofluoric acid. As a result, as shown in FIG. 6, a step is generated between the central portion 117 and the peripheral portion 118, and a first side surface connecting the first major surface 117a of the central portion 117 and the first major surface 118a of the peripheral portion 118. A second side surface 112 b connecting the second main surface 117 b of the central portion 117 and the second main surface 118 b of the peripheral portion 118 is formed. Similarly, a first side surface 113a connecting the first major surface 117a of the central portion 117 and the first major surface 119a of the peripheral portion 119 is formed, and a second major surface 117b of the central portion 117 and a second main of the peripheral portion 119 are formed. A second side surface 113b connecting to the surface 119b is formed. That is, the quartz crystal piece 111 becomes an uneven member having a mesa structure on both sides of the first major surface 111 a and the second major surface 111 b by removing a part of the flat plate-like member. At this time, the first excitation electrode 114a used as a metal mask remains on the first main surface 117a of the central portion 117, and the second excitation electrode 114b used as a metal mask is present on the second main surface 117b of the central portion 117. It remains. The formation of the mesa structure of the crystal piece 111 is not limited to wet etching, and may be performed by other removal processing such as dry etching. However, the removal process of the crystal piece 111 is preferably performed by wet etching from the viewpoint of reducing damage to the first excitation electrode 114a and the second excitation electrode 114b.
　水晶片にメサ型構造を形成した後に、水晶片の中央部に励振電極を設けようとすると、フォトレジスト溶液の表面張力などによって、フォトレジストの膜厚が不均一となる。例えば、フォトレジストは、段差の角部で薄くなり、平坦な領域で厚くなる。このため、フォトレジストのパターニング精度が低下し、段差の角部近傍でのフォトレジストのパターン形状が安定しない。そうすると、中央部の主面の縁まで均一な膜厚の励振電極を形成するのが困難となり、中央部の主面を平面視したときに励振電極の外縁が中央部の主面の内側に位置することとなる。上記したように、水晶片１１１にメサ型構造を形成するためのメタルマスクとして第１励振電極１１４ａを用いると、第１励振電極１１４ａを中央部１１７の第１主面１１７ａの縁、すなわち中央部１１７の第１側面１１２ａとの境界まで形成できる。中央部１１７の第１主面１１７ａと第１励振電極１１４ａの形状が一致することにより、第１励振電極１１４ａの形状の変動が抑制でき、水晶振動素子１１０の周波数特性の変動が抑制できる。同様に、第２励振電極１１４ｂも、中央部１１７の第２側面１１２ｂとの境界まで形成できる。 If an excitation electrode is provided in the center of the quartz piece after forming the mesa structure in the quartz piece, the film thickness of the photoresist becomes uneven due to the surface tension of the photoresist solution and the like. For example, the photoresist is thinner at the corners of the steps and thicker at flat areas. Therefore, the patterning accuracy of the photoresist is lowered, and the pattern shape of the photoresist in the vicinity of the corner of the step is not stable. Then, it becomes difficult to form the excitation electrode having a uniform film thickness up to the edge of the main surface of the central portion, and when the main surface of the central portion is planarly viewed, the outer edge of the excitation electrode is positioned inside the main surface of the central portion It will be done. As described above, when the first excitation electrode 114a is used as a metal mask for forming a mesa structure on the quartz piece 111, the first excitation electrode 114a is an edge of the first major surface 117a of the central portion 117, ie, the central portion It can be formed up to the boundary with the first side surface 112 a of 117. By matching the shapes of the first main surface 117a of the central portion 117 and the first excitation electrode 114a, the fluctuation of the shape of the first excitation electrode 114a can be suppressed, and the fluctuation of the frequency characteristic of the crystal vibrating element 110 can be suppressed. Similarly, the second excitation electrode 114 b can also be formed to the boundary with the second side surface 112 b of the central portion 117.
　次に、第２密着層を設ける（Ｓ２１）。図７に示すように、第１引出電極１１５ａの一部および図示しない第２引出電極の一部を構成することとなる第２密着層１５５は、水晶片１１１の周縁部１１８の表面、第１励振電極１１４ａの表面、および第２励振電極１１４ｂの表面を覆うように形成される。パターニングされる前の第２密着層１５５は、水晶片１１１、第１励振電極１１４ａ、および第２励振電極１１４ｂを包む一体的な一連の金属膜に相当する。第２密着層１５５は、第１密着層１５１，１５３と同様の構成となるように、第１密着層１５１，１５３と同様の手法によって形成できる。すなわち、第２密着層１５５はＣｒを含む金属材料をスパッタリングによって堆積させた金属膜であり、その厚さは１ｎｍ以上２０ｎｍ以下である。 Next, a second adhesion layer is provided (S21). As shown in FIG. 7, the second adhesion layer 155 which constitutes a part of the first lead electrode 115 a and a part of the second lead electrode (not shown) is a surface of the peripheral portion 118 of the crystal piece 111, the first It is formed to cover the surface of the excitation electrode 114a and the surface of the second excitation electrode 114b. The second adhesion layer 155 before being patterned corresponds to an integral series of metal films that wrap the crystal piece 111, the first excitation electrode 114a, and the second excitation electrode 114b. The second adhesive layer 155 can be formed by the same method as the first adhesive layers 151 and 153 so as to have the same configuration as the first adhesive layers 151 and 153. That is, the second adhesion layer 155 is a metal film in which a metal material containing Cr is deposited by sputtering, and the thickness thereof is 1 nm or more and 20 nm or less.
　次に、第２導電層を設ける（Ｓ２２）。図７に示すように、第１引出電極１１５ａの一部および図示しない第２引出電極の一部を構成することとなる第２導電層１５６は、第２密着層１５５を覆うように形成される。パターニングされる前の第２導電層１５６は、水晶片１１１を包む第２密着層１５５を包む一体的な一連の金属膜に相当する。第２導電層１５６は、第１導電層１５２，１５４と同様の手法によって同様の構成となるように形成できる。すなわち、第２導電層１５６はＡｕを含む金属材料をスパッタリングによって堆積させた金属膜であり、その厚さは１ｎｍ以上５００ｎｍ以下である。 Next, a second conductive layer is provided (S22). As shown in FIG. 7, the second conductive layer 156 that constitutes a part of the first lead electrode 115 a and a part of the second lead electrode (not shown) is formed so as to cover the second adhesion layer 155. . The second conductive layer 156 before being patterned corresponds to an integral series of metal films which wrap the second adhesion layer 155 which wraps the quartz piece 111. The second conductive layer 156 can be formed to have the same configuration by the same method as the first conductive layers 152 and 154. That is, the second conductive layer 156 is a metal film in which a metal material containing Au is deposited by sputtering, and the thickness thereof is 1 nm or more and 500 nm or less.
　次に、フォトレジストを設ける（Ｓ２３）。フォトレジスト１６１は、第２導電層１５６の全面を覆うように形成される。工程Ｓ２３において設けられるフォトレジスト１６１は、工程Ｓ１４において設けたフォトレジストと同様の手法によって同様の構成となるように形成できる。 Next, a photoresist is provided (S23). The photoresist 161 is formed to cover the entire surface of the second conductive layer 156. The photoresist 161 provided in step S23 can be formed to have the same configuration by the same method as the photoresist provided in step S14.
　次に、フォトレジストをパターニングする（Ｓ２４）。工程Ｓ２４におけるパターニングは、工程Ｓ１５と同様の手法によって実施される。図８に示すように、フォトレジスト１６１には、フォトリソグラフィ工法によって第１引出電極１１５ａおよび図示しない第２引出電極の外形がパターニングされる。 Next, the photoresist is patterned (S24). The patterning in step S24 is performed by the same method as step S15. As shown in FIG. 8, the outer shape of the first lead electrode 115a and the second lead electrode (not shown) is patterned on the photoresist 161 by photolithography.
　次に、第２導電層をエッチングする（Ｓ２５）。このとき、工程Ｓ１６で用いた第１エッチング液と同様のエッチング液を用いることで、露出した第２導電層１５６をエッチングしつつ、下地に相当する第２密着層１５５を残留させることができる。 Next, the second conductive layer is etched (S25). At this time, by using an etching solution similar to the first etching solution used in step S16, the exposed second conductive layer 156 can be etched while the second adhesion layer 155 corresponding to the base can be left.
　次に、第２密着層をエッチングする（Ｓ２６）。このとき、工程Ｓ１７で用いた第２エッチング液と同様のエッチング液を用いることで、パターニングされたフォトレジストに覆われて残留した第２導電層１５６の侵蝕を抑制しつつ、露出した第２密着層１５５をエッチングできる。図９に示すように、第２密着層１５５をエッチングすることで、第１励振電極１１４ａの第１導電層１５２および第２励振電極１１４ｂの第１導電層１５４が露出する。第２エッチング液は、Ａｕに対するエッチングレートが低いため、露出した第１励振電極１１４ａの第１導電層１５２および第２励振電極１１４ｂの第１導電層１５４へのエッチング液による侵蝕が抑制できる。 Next, the second adhesion layer is etched (S26). At this time, by using an etching solution similar to the second etching solution used in step S17, the exposed second adhesion is prevented while suppressing the corrosion of the remaining second conductive layer 156 covered by the patterned photoresist. Layer 155 can be etched. As shown in FIG. 9, by etching the second adhesion layer 155, the first conductive layer 152 of the first excitation electrode 114a and the first conductive layer 154 of the second excitation electrode 114b are exposed. Since the second etching solution has a low etching rate to Au, it is possible to suppress the corrosion of the exposed first excitation electrode 114 a by the etching solution on the first conductive layer 152 and the second excitation electrode 114 b by the etching solution.
　以上のように、励振電極および引出電極を２層構造とし、各層に対するエッチングレートの異なるエッチング液を用いてウェットエッチングすることによって、励振電極の損傷を抑制しつつ引出電極をパターニングできる。なお、引出電極の形成は、フォトリソグラフィ工法を利用したウェットエッチングに限定さるものではない。引出電極は、引出電極の形状がパターニングされたスパッタマスクを水晶片１１１の周囲に配置し、スパッタマスクを通して第２密着層１５５および第２導電層１５６をスパッタする手法によってパターニングされてもよい。 As described above, by forming the excitation electrode and the extraction electrode into a two-layer structure and performing wet etching using etching solutions having different etching rates for each layer, the extraction electrode can be patterned while suppressing damage to the excitation electrode. In addition, formation of a lead-out electrode is not limited to the wet etching which utilized the photolithographic method. The extraction electrode may be patterned by arranging a sputtering mask in which the shape of the extraction electrode is patterned around the quartz piece 111 and sputtering the second adhesion layer 155 and the second conductive layer 156 through the sputtering mask.
　次に、中央部の電極表面を削る（Ｓ２６）。図１０に示すように、中央部１１７の第１主面１１７ａと対向する第１励振電極１１４ａの表面および第１引出電極１１５ａの表面を、イオンミリングによって削る。これによって中央部１１７に形成された電極の厚さを低減し、水晶振動素子１１０の周波数特性を調整する。以上の工程を経て、所望の周波数特性を備えた水晶振動素子１１０が製造される。なお、工程Ｓ２６において表面を削るのは、中央部１１７の第１主面１１７ａ側および第２主面１１７ｂ側のうち少なくとも一方の電極でよく、両方の電極であってもよい。 Next, the electrode surface at the central portion is scraped (S26). As shown in FIG. 10, the surface of the first excitation electrode 114a facing the first main surface 117a of the central portion 117 and the surface of the first lead electrode 115a are scraped by ion milling. As a result, the thickness of the electrode formed in the central portion 117 is reduced, and the frequency characteristic of the quartz crystal vibrating element 110 is adjusted. Through the above steps, the quartz crystal vibrating element 110 having desired frequency characteristics is manufactured. The surface may be scraped in step S26 on at least one of the first main surface 117a and the second main surface 117b of the central portion 117, or both electrodes.
　以下に、他の実施形態について説明する。以下のそれぞれの実施形態では、上記の第１実施形態と共通の事柄については記述を省略し、異なる点についてのみ説明する。第１実施形態と同様の符号が付された構成は、第１実施形態における構成と同様の構成および機能を有するものとし、詳細な説明を省略する。同様の構成による同様の作用効果については言及しない。 Another embodiment will be described below. In each of the following embodiments, the description of matters common to the first embodiment described above will be omitted, and only different points will be described. The configurations given the same reference numerals as the first embodiment have the same configurations and functions as the configurations in the first embodiment, and the detailed description will be omitted. It does not mention about the same effect by the same composition.
　＜第２実施形態＞
　図１１を参照しつつ、第２実施形態にかかる水晶振動素子２１０の構成について説明する。図１１は、第２実施形態にかかる水晶振動子の構成を概略的に示す断面図である。 Second Embodiment
The configuration of the crystal vibrating element 210 according to the second embodiment will be described with reference to FIG. FIG. 11 is a cross-sectional view schematically showing a configuration of a crystal unit according to a second embodiment.
　水晶振動素子２１０は、水晶片２１１と、第１励振電極２１４ａと、第２励振電極２１４ｂと、第１引出電極２１５ａと、第１接続電極２１６ａとを備えている。水晶片２１１は、中央部２１７および周縁部２１８，２１９を備えている。水晶片２１１は、中央部２１７と周縁部２１８との間に、各々の第１主面２１７ａと第１主面２１８ａとをつなぐ第１側面２１２ａが形成され、各々の第２主面２１７ｂと第２主面２１８ｂとをつなぐ第２側面２１２ｂが形成されている。水晶片２１１は、中央部２１７と周縁部２１９との間に、各々の第１主面２１７ａと第１主面２１９ａとをつなぐ第１側面２１３ａが形成され、各々の第２主面２１７ｂと第２主面２１９ｂとをつなぐ第２側面２１３ｂが形成されている。第１励振電極２１４ａは第１密着層２５１および第１導電層２５２を備えている。第２励振電極２１４ｂは第１密着層２５３および第１導電層２５４を備えている。第１引出電極２１５ａは、第２密着層２５５および第２導電層２５６を備えている。 The quartz crystal vibrating element 210 includes a quartz piece 211, a first excitation electrode 214a, a second excitation electrode 214b, a first lead electrode 215a, and a first connection electrode 216a. The crystal piece 211 includes a central portion 217 and peripheral portions 218 and 219. The crystal piece 211 has a first side surface 212a connecting the first main surface 217a and the first main surface 218a between the central portion 217 and the peripheral portion 218, and the second main surface 217b and the second surface A second side surface 212b connecting to the two major surfaces 218b is formed. The crystal piece 211 has a first side surface 213a connecting the first main surface 217a and the first main surface 219a between the central portion 217 and the peripheral portion 219, and the second main surface 217b and the second side A second side surface 213b connecting the two main surfaces 219b is formed. The first excitation electrode 214 a includes a first adhesion layer 251 and a first conductive layer 252. The second excitation electrode 214 b includes a first contact layer 253 and a first conductive layer 254. The first lead electrode 215 a includes a second contact layer 255 and a second conductive layer 256.
　第１実施形態にかかる水晶振動素子１０との相違点は、水晶片２１１が逆メサ型構造である点である。すなわち、周縁部２１８，２１９の厚さは、中央部２１７の厚さよりも大きい。詳細には、第１主面２１７ａおよび第２主面２１７ｂの両方において、中央部２１７が周縁部２１８，２１９より薄い両面逆メサ型構造の水晶片２１１である。なお、第１主面２１７ａおよび第２主面２１７ｂの一方のみにおいて、中央部２１７が周縁部２１８，２１９より薄い片面逆メサ型構造の水晶片２１１であってもよい。 The difference from the crystal vibrating element 10 according to the first embodiment is that the crystal piece 211 has an inverted mesa structure. That is, the thickness of the peripheral portions 218 and 219 is larger than the thickness of the central portion 217. Specifically, in both the first main surface 217 a and the second main surface 217 b, the central portion 217 is a quartz piece 211 having a both-side reverse mesa structure thinner than the peripheral portions 218 and 219. The central portion 217 may be a quartz piece 211 having a single-sided reverse mesa structure thinner than the peripheral portions 218 and 219 in only one of the first main surface 217 a and the second main surface 217 b.
　このような水晶振動素子２１０においても、上記したのと同様の効果が得られる。 Also in such a quartz crystal vibrating element 210, the same effect as described above can be obtained.
　＜第３実施形態＞
　図１２および図１３を参照しつつ、第３実施形態にかかる水晶振動子９００の構成について説明する。図１２は、第３実施形態にかかる水晶振動子の構成を概略的に示す分解斜視図である。図１３は、第３実施形態にかかる水晶振動子の構成を概略的に示す断面図である。 Third Embodiment
The configuration of the crystal unit 900 according to the third embodiment will be described with reference to FIGS. 12 and 13. FIG. 12 is an exploded perspective view schematically showing the configuration of a crystal unit according to a third embodiment. FIG. 13 is a cross-sectional view schematically showing a configuration of a crystal unit according to a third embodiment.
　水晶振動子９００は、水晶振動素子９１０を第１蓋部材９２０ａと第２蓋部材９２０ｂとで挟む、いわゆるサンドイッチ構造である。水晶振動素子９１０は、水晶片９１１と、第１励振電極９１４ａと、第２励振電極９１４ｂと、第１引出電極９１５ａと、第２引出電極９１５ｂとを備えている。第１蓋部材９２０ａは、第１封止部材９３７ａを挟んで水晶片９１１の第１主面９１１ａに接合され、第２蓋部材９２０ｂは、第２封止部材９３７ｂを挟んで水晶片９１１の第２主面９１１ｂに接合されている。 The quartz crystal vibrator 900 has a so-called sandwich structure in which the quartz crystal vibrating element 910 is sandwiched between the first lid member 920a and the second lid member 920b. The crystal vibrating element 910 includes a quartz piece 911, a first excitation electrode 914 a, a second excitation electrode 914 b, a first lead electrode 915 a, and a second lead electrode 915 b. The first lid member 920a is joined to the first main surface 911a of the quartz crystal piece 911 with the first sealing member 937a interposed therebetween, and the second lid member 920b is attached to the first quartz crystal member 911 with the second sealing member 937b interposed therebetween. It is joined to 2 principal surfaces 911b.
　水晶片９１１の第１主面９１１ａを平面視したとき、水晶片９１１は、中央部９１７と、間隔を空けて中央部９１７を囲む周縁部９１９とを備えている。すなわち、中央部９１７と周縁部９１９との間にはスリットが形成されている。周縁部９１９の厚さは、中央部９１７の厚さよりも大きい。中央部９１７は、一対の支持部９１８によって周縁部９１９に支持されている。支持部９１８の厚さは中央部９１７の厚さよりも小さい。なお、支持部９１８は、周縁部の一部に相当する。支持部９１８と中央部９１７の間には、中央部９１７の第１主面９１７ａと支持部９１８の第１主面９１８ａとをつなぐ第１側面９１２ａが形成され、中央部９１７の第２主面９１７ｂと支持部９１８の第２主面９１８ｂとをつなぐ第２側面９１２ｂが形成されている。また、中央部９１７のスリット側の端部には、中央部９１７の第１主面９１７ａと第２主面９１７ｂとをつなぐ第３側面９１３が形成されている。第１蓋部材９２０ａは周縁部９１９の第１主面９１９ａに接合され、第２蓋部材９２０ｂは周縁部９１９の第２主面９１９ｂに接合されている。 When the first main surface 911 a of the crystal piece 911 is viewed in plan, the crystal piece 911 includes a central portion 917 and a peripheral portion 919 surrounding the central portion 917 with a space. That is, a slit is formed between the central portion 917 and the peripheral portion 919. The thickness of the peripheral portion 919 is greater than the thickness of the central portion 917. The central portion 917 is supported by the peripheral portion 919 by a pair of support portions 918. The thickness of the support portion 918 is smaller than the thickness of the central portion 917. The support portion 918 corresponds to a part of the peripheral portion. Between the support portion 918 and the central portion 917, a first side surface 912a connecting the first major surface 917a of the central portion 917 and the first major surface 918a of the support portion 918 is formed. A second side surface 912 b is formed connecting the 917 b and the second major surface 918 b of the support portion 918. Further, at the slit-side end of the central portion 917, a third side surface 913 connecting the first main surface 917a and the second main surface 917b of the central portion 917 is formed. The first lid member 920 a is joined to the first major surface 919 a of the peripheral portion 919, and the second lid member 920 b is joined to the second major surface 919 b of the peripheral portion 919.
　中央部９１７の第１主面９１７ａを平面視したとき、第１励振電極９１４ａの外縁は、中央部９１７における第１側面９１２ａとの境界および第３側面９１３との境界に至るまで延在している。中央部９１７の第２主面９１７ｂを平面視したとき、第２励振電極９１４ｂの外縁は、中央部９１７における第２側面９１２ｂとの境界および第３側面９１３との境界に至るまで延在している。第１引出電極９１５ａは、第１励振電極９１４ａの一部を覆い、第１側面９１２ａおよび一対の支持部９１８のうち一方を通って、周縁部９１９の第１主面９１９ａに引き回されている。第２引出電極９１５ｂは、第２励振電極９１４ｂの一部を覆い、第２側面９１２ｂおよび一対の支持部９１８のうち他方を通って、周縁部９１９の第２主面９１９ｂに引き回されている。 When the first main surface 917a of the central portion 917 is viewed in plan, the outer edge of the first excitation electrode 914a extends to the boundary with the first side surface 912a and the boundary with the third side surface 913 in the central portion 917 There is. When the second main surface 917 b of the central portion 917 is viewed in plan, the outer edge of the second excitation electrode 914 b extends to the boundary with the second side surface 912 b and the boundary with the third side surface 913 in the central portion 917 There is. The first lead-out electrode 915a covers a part of the first excitation electrode 914a, and is routed to the first main surface 919a of the peripheral portion 919 through one of the first side surface 912a and the pair of support portions 918. . The second lead-out electrode 915 b covers a part of the second excitation electrode 914 b and is routed to the second main surface 919 b of the peripheral portion 919 through the other of the second side surface 912 b and the pair of support portions 918. .
　このような水晶振動素子９１０においても、上記したのと同様の効果が得られる。 Also in such a quartz crystal vibrating element 910, the same effect as described above can be obtained.
　＜第４実施形態＞
　図１４を参照しつつ、第４実施形態にかかる水晶振動素子４１０の構成について説明する。図１４は、第４実施形態にかかる水晶振動素子の構成を概略的に示す斜視図である。 Fourth Embodiment
The configuration of the crystal vibrating element 410 according to the fourth embodiment will be described with reference to FIG. FIG. 14 is a perspective view schematically showing the configuration of a quartz crystal vibrating element according to a fourth embodiment.
　本実施形態と第１実施形態との相違点は、Ｚ´軸の正方向側で中央部４１７と隣り合う周縁部ＰＲ１と、Ｚ´軸の負方向側で中央部４１７と隣り合う周縁部ＰＲ２と、を備える点である。周縁部ＰＲ１は、周縁部４１８，４１９のそれぞれの一端を繋ぎ、周縁部ＰＲ２は、周縁部４１８，４１９のそれぞれの他端を繋いでいる。水晶片４１１の第１主面４１１ａを平面視したとき、周縁部４１８，４１９、ＰＲ１，ＰＲ２は矩形の枠状に設けられ、中央部４１７は周縁部４１８，４１９、ＰＲ１，ＰＲ２に囲まれた島状に設けられている。中央部４１７の第１主面４１７ａには全面に亘って第１励振電極４１４ａが設けられ、周縁部４１８には第１引出電極４１５ａ及び第１接続電極４１６ａが設けられている。なお、図示しない第２主面側においても、中央部４１７は周縁部４１８，４１９、ＰＲ１，ＰＲ２に囲まれた島状であり、中央部４１７の第２主面の全面に亘って第２励振電極が設けられている。このような水晶振動素子４１０においても、上記したのと同様の効果が得られる。 The difference between the present embodiment and the first embodiment is the peripheral portion PR1 adjacent to the central portion 417 on the positive direction side of the Z ′ axis and the peripheral portion PR2 adjacent to the central portion 417 on the negative direction side of the Z ′ axis. And a point. The peripheral portion PR1 connects one end of each of the peripheral portions 418 and 419, and the peripheral portion PR2 connects each other end of the peripheral portions 418 and 419. When the first main surface 411a of the crystal piece 411 is viewed in plan, the peripheral portions 418 and 419 and PR1 and PR2 are provided in a rectangular frame shape, and the central portion 417 is surrounded by the peripheral portions 418 and 419 and PR1 and PR2 It is provided in an island shape. A first excitation electrode 414 a is provided on the entire first surface 417 a of the central portion 417, and a first lead electrode 415 a and a first connection electrode 416 a are provided on the peripheral portion 418. In addition, also on the second main surface side (not shown), central portion 417 has an island shape surrounded by peripheral portions 418 and 419 and PR1 and PR2, and the second excitation is provided over the entire second main surface of central portion 417. An electrode is provided. Also in such a quartz crystal vibrating element 410, the same effect as described above can be obtained.
　このように、中央部の第１及び第２主面のそれぞれの全面に亘って第１及び第２励振電極が形成されているならば、中央部及び周縁部の形状は特に限定されるものでない。例えば、中央部の形状は、水晶片の第１主面を平面視したときに、円又は楕円形状であってもよく、四角形以外の多角形状であってもよい。 Thus, the shapes of the central portion and the peripheral portion are not particularly limited as long as the first and second excitation electrodes are formed over the entire surfaces of the first and second main surfaces of the central portion. . For example, the shape of the central portion may be a circle or an oval when the first main surface of the crystal piece is viewed in plan, or may be a polygon other than a square.
　周縁部と中央部との間に形成される段差に加えて、水晶片の第１主面側及び第２主面側にさらに段差が形成されてもよい。例えば、中央部には薄肉領域と厚肉領域とが形成され、中央部の薄肉領域が周縁部に隣接し、中央部の厚肉領域が薄肉領域の周縁部とは反対側に隣接する。中央部の薄肉領域は、水晶片のＺ´軸方向において対向する一端から他端の全幅に亘る帯状に形成されてもよい。このとき、中央部の厚肉領域は、中央部の薄肉領域と同様に水晶片の全幅に亘る帯状に形成されてもよく、中央部の薄肉領域に囲まれる島状に形成されてもよい。中央部の厚肉領域が帯状に形成される場合、中央部の厚肉領域は、Ｘ軸方向において中央部の薄肉領域に挟まれてもよく、Ｘ軸方向の正方向及び負方向のいずれか一方においてのみ中央部の薄肉領域と隣接してもよい。なお、中央部の薄肉領域及び厚肉領域の位置関係は逆であってもよい。すなわち、中央部の厚肉領域が周縁部に隣接し、中央部の薄肉領域が厚肉領域の周縁部とは反対側に隣接してもよい。 In addition to the step formed between the peripheral portion and the central portion, a step may be further formed on the first main surface side and the second main surface side of the crystal piece. For example, a thin area and a thick area are formed in the central part, the thin area in the central part is adjacent to the peripheral part, and the thick area in the central part is adjacent to the opposite side to the peripheral part of the thin area. The thin region at the central portion may be formed in a band shape extending from the opposite end to the other at the opposite end in the Z ′ axis direction of the crystal piece. At this time, the thick region at the central portion may be formed in a band shape across the entire width of the crystal piece as in the thin region at the central portion, or may be formed in an island shape surrounded by the thin region at the central portion. When the thick region at the central portion is formed in a band shape, the thick region at the central portion may be sandwiched by the thin region at the central portion in the X-axis direction, and either the positive direction or the negative direction of the X-axis direction It may be adjacent to the thin-walled area at the central portion only on one side. The positional relationship between the thin-walled area and the thick-walled area at the central portion may be reversed. That is, the thick region of the central portion may be adjacent to the peripheral portion, and the thin region of the central portion may be adjacent to the opposite side of the peripheral portion of the thick region.
　水晶片の第１主面側及び第２主面側にさらに段差が形成される構成として、例えば、周縁部には薄肉領域と厚肉領域とが形成され、周縁部の厚肉領域が中央部に隣接し、周縁部の薄肉領域が厚肉領域の中央部とは反対側に隣接する。周縁部の厚肉領域は、水晶片の全幅に亘る帯状に形成されてもよい。このとき、中央部は、周縁部の厚肉領域と同様に水晶片の全幅に亘る帯状に形成されてもよく、周縁部の厚肉領域に囲まれる島状に形成されてもよい。また、周縁部の厚肉領域が薄肉領域に囲まれる島状に形成されてもよい。このとき、中央部は、厚肉領域の全幅に亘る帯状に形成されてもよく、厚肉領域に囲まれる島状に形成されてもよい。なお、周縁部の厚肉領域及び薄肉領域の位置関係は逆であってもよい。すなわち、周縁部の薄肉領域が中央部に隣接し、周縁部の厚肉領域が薄肉領域の中央部とは反対側に隣接してもよい。 As a configuration in which a step is further formed on the first main surface side and the second main surface side of the crystal piece, for example, a thin region and a thick region are formed in the peripheral portion, and the thick region of the peripheral portion is a central portion And the thin-walled region of the peripheral portion is adjacent to the opposite side of the central portion of the thick-walled region. The thickened region of the peripheral portion may be formed in a band shape over the entire width of the crystal piece. At this time, the central portion may be formed in a band shape extending over the entire width of the crystal piece as in the thick region of the peripheral portion, or may be formed in an island shape surrounded by the thick region of the peripheral portion. In addition, the thick region of the peripheral portion may be formed in an island shape surrounded by the thin region. At this time, the central portion may be formed in a band shape extending over the entire width of the thick region, or may be formed in an island shape surrounded by the thick region. The positional relationship between the thick and thin regions of the peripheral portion may be reversed. That is, the thin region of the peripheral portion may be adjacent to the central portion, and the thick region of the peripheral portion may be adjacent to the opposite side of the central portion of the thin region.
　以上のように、本発明の一態様によれば、第１主面１１１ａと第１主面１１１ａに対向する第２主面１１１ｂを有し、第１主面１１１ａを平面視したときに中央側に位置する中央部１１７と中央部１１７の外側に位置する周縁部１１８とを有する、水晶片１１１を準備する工程と、水晶片１１１の第１主面１１１ａのうち、中央部１１７に第１励振電極１１４ａを設ける工程と、中央部１１７を保護するメタルマスクとして第１励振電極１１４ａを用いつつ周縁部１１８の一部を除去し、水晶片１１１の第１主面１１１ａ側において中央部１１７と周縁部１１８との間に第１側面１１２ａを形成する工程と、メタルマスクとして用いた第１励振電極１１４ａに接触するように、水晶片１１１の第１主面１１１ａ側において周縁部１１８に延在する第１引出電極１１５ａを設ける工程と、を含む、水晶振動素子１１０の製造方法が提供される。 As described above, according to one aspect of the present invention, the first main surface 111a and the second main surface 111b opposed to the first main surface 111a are provided, and the center side when the first main surface 111a is viewed in plan Preparing the quartz crystal piece 111 having the central portion 117 located on the outer side and the peripheral edge portion 118 located on the outer side of the central portion 117, and the first excitation on the central portion 117 of the first main surface 111a of the quartz crystal piece 111. In the step of providing the electrode 114a, the first excitation electrode 114a is used as a metal mask to protect the central portion 117, and a part of the peripheral portion 118 is removed, and the central portion 117 and the peripheral edge on the first main surface 111a side of the quartz piece 111 A step of forming a first side surface 112a between the first and second portions 118, and extending to a peripheral portion 118 on the first main surface 111a side of the crystal piece 111 so as to contact the first excitation electrode 114a used as a metal mask. And a step of providing a first lead electrode 115a to the manufacturing method of the quartz crystal vibrating element 110 is provided.
　上記態様によれば、第１励振電極を中央部の第１主面の縁、すなわち中央部の第１側面との境界まで形成できる。中央部の第１主面と第１励振電極の形状が一致することにより、第１励振電極の形状の変動が抑制でき、水晶振動素子の周波数特性の変動が抑制できる。中央部における励振に寄与する領域の利用効率が改善し、水晶振動素子が小型化できる。また、中央部において励振された振動の閉じ込め効率が改善できる。 According to the above aspect, the first excitation electrode can be formed to the edge of the first main surface of the central portion, that is, to the boundary with the first side surface of the central portion. By matching the shapes of the first main surface of the central portion and the first excitation electrode, it is possible to suppress the variation of the shape of the first excitation electrode and to suppress the variation of the frequency characteristic of the crystal vibrating element. The utilization efficiency of the area contributing to the excitation in the central portion is improved, and the crystal vibrating element can be miniaturized. In addition, the confinement efficiency of the vibration excited in the central portion can be improved.
　第１引出電極１１５ａは、第１側面１１２ａを通っていてもよい。 The first lead electrode 115a may pass through the first side surface 112a.
　第１引出電極１１５ａは、水晶片１１１の第１主面１１１ａを平面視したときに中央部１１７において第１励振電極１１４ａの少なくとも一部を覆っていてもよい。これによれば、第１励振電極と第１引出電極との接触面積が増加し、第１励振電極と第１引出電極との電気的接続が安定する。また、第１励振電極の損傷が抑制でき、水晶振動素子の周波数特性の劣化が抑制できる。 The first lead-out electrode 115 a may cover at least a part of the first excitation electrode 114 a at the central portion 117 when the first main surface 111 a of the crystal piece 111 is viewed in plan. According to this, the contact area between the first excitation electrode and the first extraction electrode is increased, and the electrical connection between the first excitation electrode and the first extraction electrode is stabilized. Moreover, damage to the first excitation electrode can be suppressed, and deterioration of the frequency characteristic of the quartz crystal vibrating element can be suppressed.
　第１励振電極１１４ａを設ける工程は、水晶片１１１の第１主面１１１ａ側に第１密着層１５１を設ける工程と、第１密着層１５１よりも高い導電性を有しており、水晶片１１１の第１主面１１１ａを平面視したときに第１密着層１５１を覆う第１導電層１５２を設ける工程とを含んでもよい。これによれば、下地に酸素との反応性が高い第１密着層を設けることで水晶片と第１励振電極との密着力が向上でき、表面に酸素との反応性が低い第１導電層を設けることで酸化による第１励振電極の劣化が抑制できる。すなわち、水晶振動素子の信頼性が改善できる。 The step of providing the first excitation electrode 114 a has the step of providing the first adhesion layer 151 on the side of the first major surface 111 a of the quartz piece 111 and the conductivity higher than that of the first adhesion layer 151. And a step of providing a first conductive layer 152 covering the first adhesive layer 151 when the first main surface 111a of the first main surface 111a is viewed in plan. According to this, by providing the first adhesion layer having high reactivity with oxygen on the base, the adhesion between the quartz piece and the first excitation electrode can be improved, and the first conductive layer has low reactivity with oxygen on the surface. Deterioration of the first excitation electrode due to oxidation can be suppressed by providing. That is, the reliability of the crystal vibrating element can be improved.
　第１引出電極１１５ａを設ける工程は、水晶片１１１の第１主面１１１ａ側に第２密着層１５５を設ける工程と、第２密着層１５５よりも高い導電性を有しており、水晶片１１１の第１主面１１１ａを平面視したときに第２密着層１５５を覆う第２導電層１５６を設ける工程とを含んでもよい。これによれば、下地に酸素との反応性が高い第２密着層を設けることで水晶片と第１引出電極との密着力が向上でき、表面に酸素との反応性が低い第２導電層を設けることで酸化による第１引出電極の劣化が抑制できる。すなわち、水晶振動素子の信頼性が改善できる。 The step of providing the first lead-out electrode 115 a has a step of providing the second adhesion layer 155 on the side of the first main surface 111 a of the quartz piece 111 and the conductivity higher than the second adhesion layer 155. And the step of providing a second conductive layer 156 covering the second adhesive layer 155 when the first main surface 111a of the second main surface 111a is viewed in plan. According to this, by providing the base with the second adhesion layer having high reactivity with oxygen, the adhesion between the quartz piece and the first lead electrode can be improved, and the surface with the reactivity with oxygen is low. Deterioration of the first lead-out electrode due to oxidation can be suppressed by providing. That is, the reliability of the crystal vibrating element can be improved.
　第１密着層１５１および第２密着層１５５は、それぞれ、クロムを含む金属材料からなり、第１導電層および第２導電層は、それぞれ、金を含む金属材料からなってもよい。これによれば、Ｃｒは水晶との密着性がＡｕよりも高く、ＡｕはＣｒよりも導電性が高く且つ化学的安定性が高い。したがって、上記した効果が得られる。 The first adhesion layer 151 and the second adhesion layer 155 may be made of a metal material containing chromium, and the first conductive layer and the second conductive layer may be made of a metal material containing gold. According to this, Cr has higher adhesion to quartz than Au, Au has higher conductivity and higher chemical stability than Cr. Therefore, the effects described above can be obtained.
　第１引出電極１１５ａを設ける工程は、金属膜１５５，１５６を設ける工程と、金属膜１５５，１５６を覆うフォトレジスト１６１を設ける工程と、フォトレジスト１６１を第１引出電極１１５ａの形状にパターニングする工程と、金属膜１５５，１５６をエッチングする工程とを含んでもよい。これによれば、第１励振電極と第１引出電極をフォトリソグラフィ工法によって同一工程で形成する場合と比較して、パターニングの要求精度が低いため、製造コストが抑制できる。 In the step of providing the first lead electrode 115a, the step of providing the metal films 155 and 156, the step of providing the photoresist 161 covering the metal films 155 and 156, and the step of patterning the photoresist 161 in the shape of the first lead electrode 115a. And etching the metal films 155 and 156. According to this, compared with the case where the first excitation electrode and the first lead-out electrode are formed in the same process by the photolithographic method, the required accuracy of patterning is lower, so that the manufacturing cost can be suppressed.
　第１引出電極を設ける工程は、水晶片の第１主面側に、第１金属膜と、第１金属膜を覆うように第２金属膜とを設ける工程と、第２金属膜を覆うフォトレジストを設ける工程と、フォトレジストを第１引出電極の形状にパターニングする工程と、第１の金属膜を露出させるように第１エッチング液を用いて第２金属膜をエッチングする工程と、第１エッチング液とはエッチングレートが異なる第２エッチング液を用いて、第１金属膜をエッチングする工程とを含んでもよい。これによれば、ウェットエッチングによって第１引出電極の外形を形成する際に、第１励振電極に与えるダメージが低減できるため、水晶振動素子の周波数特性の製造誤差が抑制できる。 In the step of providing the first lead electrode, a step of providing a first metal film and a second metal film so as to cover the first metal film on the first main surface side of the quartz piece, and a photo covering the second metal film A step of providing a resist, a step of patterning a photoresist in the shape of a first lead-out electrode, a step of etching a second metal film using a first etchant so as to expose a first metal film, a first step Etching the first metal film using a second etching solution different in etching rate from the etching solution. According to this, when forming the outer shape of the first lead-out electrode by wet etching, the damage given to the first excitation electrode can be reduced, so that the manufacturing error of the frequency characteristic of the crystal vibrating element can be suppressed.
　第１引出電極１１５ａを設ける工程は、第１引出電極１１５ａの形状がパターニングされたスパッタマスクを、水晶片１１１の第１主面１１１ａ側に配置する工程と、スパッタマスクを通して金属膜１５５，１５６をスパッタする工程とを含んでもよい。これによれば、フォトリソグラフィ工法によって第１引出電極の外形を形成する場合と比較して、工程数を少なくできる。 In the step of providing the first lead electrode 115a, the step of disposing the sputtering mask on which the shape of the first lead electrode 115a is patterned is disposed on the first main surface 111a side of the crystal piece 111, and the metal films 155 and 156 are passed through the sputtering mask. And sputtering may be included. According to this, the number of steps can be reduced compared to the case where the outer shape of the first lead electrode is formed by the photolithography method.
　中央部１１７に設けられた電極１１４ａ，１１５ａの厚さを低減して周波数を調整する工程をさらに含んでもよい。これによれば、水晶振動素子の周波数特性の製造誤差が抑制できる。 The method may further include the step of adjusting the frequency by reducing the thickness of the electrodes 114a and 115a provided in the central portion 117. According to this, the manufacturing error of the frequency characteristic of the crystal vibrating element can be suppressed.
　水晶片１１１の第２主面１１１ｂのうち、中央部１１７に第１励振電極１１４ａと対向する第２励振電極１１４ｂを設ける工程と、中央部１１７を保護するメタルマスクとして第２励振電極１１４ｂを用いつつ周縁部１１８，１１９の一部を除去し、水晶片１１１の第２主面１１１ｂ側において中央部１１７と周縁部１１８との間に第２側面１１２ｂ，１１３ｂを形成する工程と、メタルマスクとして用いた第２励振電極１１４ｂに接触するように、水晶片１１１の第２主面１１１ｂ側において周縁部１１８に延在する第２引出電極１１５ｂを設ける工程と、をさらに含んでもよい。これによれば、上記したのと同様の効果が得られる。 A step of providing a second excitation electrode 114b facing the first excitation electrode 114a in the central portion 117 of the second main surface 111b of the quartz piece 111, and using the second excitation electrode 114b as a metal mask for protecting the central portion 117 While removing a part of the peripheral edge portions 118 and 119, and forming the second side surfaces 112b and 113b between the central portion 117 and the peripheral edge portion 118 on the second main surface 111b side of the crystal piece 111; The method may further include the step of providing a second lead-out electrode 115b extending to the peripheral portion 118 on the second principal surface 111b side of the crystal piece 111 so as to contact the used second excitation electrode 114b. According to this, the same effect as described above can be obtained.
　本発明の他の一態様によれば、第１主面１１ａと第１主面１１ａに対向する第２主面１１ｂを有するとともに、第１主面１１ａを平面視したときに中央側に位置する中央部１７と中央部１７の外側に位置する周縁部１８，１９とを有し、第１主面１１ａおよび第２主面１１ｂのうち少なくとも第１主面１１ａ側において中央部１７と周縁部１８，１９との間に第１側面１２ａ，１３ａが形成された、水晶片１１と、水晶片１１の第１主面１１ａのうち、中央部１７に設けられた第１励振電極１４ａと、水晶片１１の第２主面１１ｂのうち、中央部１７に設けられ、第１励振電極１４ａと対向する第２励振電極１４ｂと、第１励振電極１４ａに電気的に接続された第１引出電極１５ａと、第２励振電極１４ｂに電気的に接続された第２引出電極１５ｂと、を備え、少なくとも第１引出電極１５ａは、水晶片１１の第１主面１１ａを平面視したときに第１励振電極１４ａの少なくとも一部を覆っており、中央部１７から周縁部１８に亘って延在する、水晶振動素子１０が提供される。 According to another aspect of the present invention, the first main surface 11a and the second main surface 11b opposite to the first main surface 11a are provided, and the first main surface 11a is located on the center side in plan view A central portion 17 and a peripheral portion 18 having a central portion 17 and peripheral portions 18 and 19 located outside the central portion 17 and at least the first main surface 11 a side of the first major surface 11 a and the second major surface 11 b , 19 between the crystal piece 11 and the first excitation electrode 14 a provided at the central portion 17 of the first major surface 11 a of the crystal piece 11, and the crystal piece Among the second main surfaces 11b of 11, the second excitation electrode 14b provided in the central portion 17 and facing the first excitation electrode 14a, and the first lead electrode 15a electrically connected to the first excitation electrode 14a , And a second extraction electrode electrically connected to the second excitation electrode 14b. 15b, and at least the first lead electrode 15a covers at least a portion of the first excitation electrode 14a when the first major surface 11a of the crystal piece 11 is viewed in plan, and the central portion 17 to the peripheral portion 18 A quartz crystal vibrating element 10 is provided, which extends across.
　上記態様によれば、第１励振電極を中央部の第１主面の縁、すなわち中央部における第１側面との境界まで形成することで、中央部における励振に寄与する領域の利用効率が改善し、水晶振動素子が小型化できる。また、中央部において励振された振動の閉じ込め効率が改善できる。第１引出電極が第１励振電極の一部を覆っているため、第１励振電極と第１引出電極との接触面積が増加し、第１励振電極と第１引出電極との電気的接続が安定する。また、第１励振電極の損傷が抑制でき、水晶振動素子の周波数特性の劣化が抑制できる。 According to the above aspect, by forming the first excitation electrode to the edge of the first main surface of the central portion, that is, the boundary with the first side surface in the central portion, the utilization efficiency of the region contributing to excitation in the central portion is improved And the crystal vibrating element can be miniaturized. In addition, the confinement efficiency of the vibration excited in the central portion can be improved. Since the first lead-out electrode covers a part of the first excitation electrode, the contact area between the first excitation electrode and the first lead-out electrode is increased, and the electrical connection between the first excitation electrode and the first lead-out electrode is Stabilize. Moreover, damage to the first excitation electrode can be suppressed, and deterioration of the frequency characteristic of the quartz crystal vibrating element can be suppressed.
　水晶片１１の第１主面１１ａを平面視したとき、第１励振電極１４ａの外縁は、中央部１７における第１側面１２ａとの境界に至るまで延在していてもよい。これによれば、中央部の第１主面と第１励振電極の形状が一致することにより、第１励振電極の形状の変動が抑制でき、水晶振動素子の周波数特性の変動が抑制できる。 When the first major surface 11 a of the crystal piece 11 is viewed in plan, the outer edge of the first excitation electrode 14 a may extend to the boundary of the central portion 17 with the first side surface 12 a. According to this, by matching the shapes of the first main surface in the central portion and the first excitation electrode, it is possible to suppress the fluctuation of the shape of the first excitation electrode and to suppress the fluctuation of the frequency characteristic of the crystal vibrating element.
　第１励振電極１４ａは、水晶片１１の第１主面１１ａ側に設けられた第１密着層５１と、第１密着層５１よりも高い導電性を有しており、水晶片１１の第１主面１１ａを平面視したときに第１密着層５１を覆う第１導電層５２とを備えていてもよい。これによれば、下地に酸素との反応性が高い第１密着層を設けることで水晶片と第１励振電極との密着力が向上でき、表面に酸素との反応性が低い第１導電層を設けることで酸化による第１励振電極の劣化が抑制できる。すなわち、水晶振動素子の信頼性が改善できる。 The first excitation electrode 14 a has higher conductivity than the first adhesion layer 51 provided on the side of the first major surface 11 a of the crystal piece 11 and the first adhesion layer 51. The first conductive layer 52 may be provided to cover the first adhesive layer 51 when the main surface 11 a is viewed in plan. According to this, by providing the first adhesion layer having high reactivity with oxygen on the base, the adhesion between the quartz piece and the first excitation electrode can be improved, and the first conductive layer has low reactivity with oxygen on the surface. Deterioration of the first excitation electrode due to oxidation can be suppressed by providing. That is, the reliability of the crystal vibrating element can be improved.
　第１引出電極１５ａは、水晶片１１の第１主面１１ａ側に設けられた第２密着層５５と、第２密着層５５よりも高い導電性を有しており、水晶片１１の第１主面１１ａを平面視したときに第２密着層５５を覆う第２導電層５６とを備えていてもよい。これによれば、下地に酸素との反応性が高い第２密着層を設けることで水晶片と第１引出電極との密着力が向上でき、表面に酸素との反応性が低い第２導電層を設けることで酸化による第１引出電極の劣化が抑制できる。すなわち、水晶振動素子の信頼性が改善できる。 The first lead-out electrode 15 a has higher conductivity than the second adhesion layer 55 provided on the side of the first main surface 11 a of the crystal piece 11 and the second adhesion layer 55. You may provide the 2nd conductive layer 56 which covers the 2nd contact layer 55, when the main surface 11a is planarly viewed. According to this, by providing the base with the second adhesion layer having high reactivity with oxygen, the adhesion between the quartz piece and the first lead electrode can be improved, and the surface with the reactivity with oxygen is low. Deterioration of the first lead-out electrode due to oxidation can be suppressed by providing. That is, the reliability of the crystal vibrating element can be improved.
　第１密着層５１および第２密着層５５は、それぞれ、クロムを含む金属材料からなり、第１導電層５２および第２導電層５６は、それぞれ、金を含む金属材料からなってもよい。これによれば、Ｃｒは水晶との密着性がＡｕよりも高く、ＡｕはＣｒよりも導電性が高く且つ化学的安定性が高い。したがって、上記した効果が得られる。 The first adhesion layer 51 and the second adhesion layer 55 may be made of a metal material containing chromium, and the first conductive layer 52 and the second conductive layer 56 may be made of a metal material containing gold. According to this, Cr has higher adhesion to quartz than Au, Au has higher conductivity and higher chemical stability than Cr. Therefore, the effects described above can be obtained.
　第１引出電極１５ａの中央部１７に設けられた部分の厚さＴ３は、第１引出電極１５ａの周縁部１８に設けられた部分の厚さＴ４よりも小さくてもよい。これによれば、中央部に設けられた電極の表面を削ることによって、水晶振動素子の周波数特性が調整できる。したがって、水晶振動素子の周波数特性の製造誤差が抑制できる。 The thickness T3 of the portion provided in the central portion 17 of the first lead electrode 15a may be smaller than the thickness T4 of the portion provided in the peripheral portion 18 of the first lead electrode 15a. According to this, the frequency characteristics of the crystal vibrating element can be adjusted by scraping the surface of the electrode provided in the central portion. Therefore, the manufacturing error of the frequency characteristic of the crystal vibrating element can be suppressed.
　中央部１７の厚さは、周縁部１８，１９の厚さよりも大きく、第１側面１２ａ，１３ａは、中央部１７と周縁部１８，１９とをつないでいてもよい。これによれば、いわゆる順メサ型構造によって形成される段差において、上記した効果が得られる。 The thickness of the central portion 17 is larger than the thickness of the peripheral portions 18 and 19, and the first side surfaces 12 a and 13 a may connect the central portion 17 and the peripheral portions 18 and 19. According to this, the above-described effect can be obtained in the step formed by the so-called forward mesa structure.
　中央部２１７の厚さは、周縁部２１８，２１９の厚さよりも小さく、第１側面２１２ａ，２１３ａは、中央部２１７と周縁部２１８，２１９とをつないでいてもよい。これによれば、いわゆる逆メサ型構造によって形成される段差において、上記した効果が得られる。 The thickness of the central portion 217 is smaller than the thickness of the peripheral portions 218 and 219, and the first side surfaces 212a and 213a may connect the central portion 217 and the peripheral portions 218 and 219. According to this, the above-described effect can be obtained in the step formed by the so-called reverse mesa structure.
　水晶片１１は、第２主面１１ｂ側において中央部１７と周縁部１８，１９との間に第２側面１２ｂ、１３ｂが形成されており、第２引出電極１５ｂは、水晶片１１の第２主面１１ｂを平面視したときに第２励振電極１４ｂの少なくとも一部を覆っており、水晶片１１の第２主面１１ｂ側において中央部１７から周縁部１８に亘って延在していてもよい。これによれば、上記したのと同様の効果が得られる。 The crystal piece 11 has second side surfaces 12 b and 13 b formed between the central portion 17 and the peripheral portions 18 and 19 on the second main surface 11 b side, and the second lead-out electrode 15 b is a second piece of the crystal piece 11. At least a part of the second excitation electrode 14b is covered when the main surface 11b is viewed in plan, and it extends from the central portion 17 to the peripheral portion 18 on the second main surface 11b side of the crystal piece 11 Good. According to this, the same effect as described above can be obtained.
　水晶片９１１は、中央部９１７と周縁部９１９の間にスリットが形成されていてもよい。このような構成においても、上記した効果が得られる。 The crystal piece 911 may have a slit formed between the central portion 917 and the peripheral portion 919. Even in such a configuration, the above-described effects can be obtained.
　以上説明したように、本発明の一態様によれば、振動特性の製造誤差を低減できる水晶振動素子およびその製造方法の提供が可能となる。 As described above, according to one aspect of the present invention, it is possible to provide a quartz crystal vibrating element capable of reducing a manufacturing error of vibration characteristics and a method of manufacturing the same.
　なお、以上説明した実施形態は、本発明の理解を容易にするためのものであり、本発明を限定して解釈するためのものではない。本発明は、その趣旨を逸脱することなく、変更／改良され得ると共に、本発明にはその等価物も含まれる。即ち、各実施形態に当業者が適宜設計変更を加えたものも、本発明の特徴を備えている限り、本発明の範囲に包含される。例えば、各実施形態が備える各要素およびその配置、材料、条件、形状、サイズなどは、例示したものに限定されるわけではなく適宜変更することができる。また、各実施形態が備える各要素は、技術的に可能な限りにおいて組み合わせることができ、これらを組み合わせたものも本発明の特徴を含む限り本発明の範囲に包含される。 The embodiments described above are for the purpose of facilitating the understanding of the present invention, and are not for the purpose of limiting and interpreting the present invention. The present invention can be modified / improved without departing from the gist thereof, and the present invention also includes the equivalents thereof. That is, those in which persons skilled in the art appropriately modify the design of each embodiment are also included in the scope of the present invention as long as they have the features of the present invention. For example, each element included in each embodiment and its arrangement, material, conditions, shape, size, and the like are not limited to those illustrated, and may be changed as appropriate. Further, the elements included in each embodiment can be combined as much as technically possible, and combinations of these are included in the scope of the present invention as long as they include the features of the present invention.
　１…水晶振動子
　１０…水晶振動素子
　１１…水晶片
　１７…中央部
　１８，１９…周縁部
　１１ａ，１７ａ，１８ａ，１９ａ…第１主面
　１１ｂ，１７ｂ，１８ｂ，１９ｂ…第２主面
　１２ａ，１３ａ…第１側面
　１２ｂ，１３ｂ…第２側面
　１４ａ…第１励振電極
　１４ｂ…第２励振電極
　１５ａ…第１引出電極
　１５ｂ…第２引出電極
　５１，５３…第１密着層
　５２，５４…第１導電層
　５５…第２密着層
　５６…第２導電層 DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator 10 ... Crystal vibrating element 11 ... Crystal piece 17 ... Central part 18, 19 ... Peripheral part 11a, 17a, 18a, 19a ... 1st main surface 11b, 17b, 18b, 19b ... 2nd main surface 12a, 13a: first side surface 12b, 13b: second side surface 14a: first excitation electrode 14b: second excitation electrode 15a: first extraction electrode 15b: second extraction electrode 51, 53: first adhesion layer 52, 54: first Conductive layer 55: second adhesion layer 56: second conductive layer

Claims (21)

  1. 　第１主面と前記第１主面に対向する第２主面を有し、前記第１主面を平面視したときに中央側に位置する中央部と前記中央部の外側に位置する周縁部とを有する、水晶片を準備する工程と、
    　前記水晶片の前記第１主面のうち、前記中央部に第１励振電極を設ける工程と、
    　前記中央部を保護するメタルマスクとして前記第１励振電極を用いつつ前記周縁部の一部を除去し、前記水晶片の前記第１主面側において前記中央部と前記周縁部との間に第１側面を形成する工程と、
    　前記メタルマスクとして用いた前記第１励振電極に接触するように、前記水晶片の前記第１主面側において前記周縁部に延在する第１引出電極を設ける工程と、
    を含む、水晶振動素子の製造方法。     A first main surface and a second main surface opposite to the first main surface, and a central portion located on the central side and a peripheral portion located outside the central portion when the first main surface is viewed in plan Preparing a quartz piece, and
    Providing a first excitation electrode at the central portion of the first main surface of the crystal piece;
    A portion of the peripheral portion is removed while using the first excitation electrode as a metal mask for protecting the central portion, and a portion between the central portion and the peripheral portion on the first main surface side of the crystal piece is removed Forming a side surface;
    Providing a first lead-out electrode extending to the peripheral portion on the first principal surface side of the crystal piece so as to contact the first excitation electrode used as the metal mask;
    A method of manufacturing a quartz crystal vibrating element, including:
  2. 　前記第１引出電極は、前記第１側面を通っている、
    　請求項１に記載の水晶振動素子の製造方法。     The first lead electrode passes through the first side surface,
    A method of manufacturing a crystal vibrating element according to claim 1.
  3. 　前記第１引出電極は、前記水晶片の前記第１主面を平面視したときに前記中央部において前記第１励振電極の少なくとも一部を覆っている、
    　請求項１または２に記載の水晶振動素子の製造方法。     The first lead-out electrode covers at least a portion of the first excitation electrode at the central portion when the first main surface of the crystal piece is viewed in plan.
    The manufacturing method of the crystal vibrating element according to claim 1 or 2.
  4. 　前記第１励振電極を設ける工程は、
    　前記水晶片の前記第１主面側に第１密着層を設ける工程と、
    　前記第１密着層よりも高い導電性を有しており、前記水晶片の前記第１主面を平面視したときに前記第１密着層を覆う第１導電層を設ける工程と
    を含む、
    　請求項１から３のいずれか１項に記載の水晶振動素子の製造方法。     In the step of providing the first excitation electrode,
    Providing a first adhesion layer on the first main surface side of the crystal piece;
    Providing a first conductive layer which has higher conductivity than the first adhesive layer, and covers the first adhesive layer when the first main surface of the crystal piece is viewed in plan.
    The manufacturing method of the quartz crystal vibrating element of any one of Claim 1 to 3.
  5. 　前記第１引出電極を設ける工程は、
    　前記水晶片の前記第１主面側に第２密着層を設ける工程と、
    　前記第２密着層よりも高い導電性を有しており、前記水晶片の前記第１主面を平面視したときに前記第２密着層を覆う第２導電層を設ける工程と
    を含む、
    　請求項４に記載の水晶振動素子の製造方法。     In the step of providing the first lead electrode,
    Providing a second adhesion layer on the first main surface side of the crystal piece;
    Providing a second conductive layer having conductivity higher than that of the second adhesive layer and covering the second adhesive layer when the first main surface of the crystal piece is viewed in plan.
    The manufacturing method of the quartz crystal vibrating element of Claim 4.
  6. 　前記第１密着層および前記第２密着層は、それぞれ、クロムを含む金属材料からなり、　前記第１導電層および前記第２導電層は、それぞれ、金を含む金属材料からなる、
    　請求項５に記載の水晶振動素子の製造方法。     The first adhesion layer and the second adhesion layer are each made of a metal material containing chromium, and the first conductive layer and the second conductive layer are each made of a metal material containing gold.
    The manufacturing method of the quartz crystal vibrating element of Claim 5.
  7. 　前記第１引出電極を設ける工程は、
    　金属膜を設ける工程と、
    　前記金属膜を覆うフォトレジストを設ける工程と、
    　前記フォトレジストを前記第１引出電極の形状にパターニングする工程と、
    　前記金属膜をエッチングする工程と
    を含む、
    　請求項１から６のいずれか１項に記載の水晶振動素子の製造方法。     In the step of providing the first lead electrode,
    Providing a metal film,
    Providing a photoresist covering the metal film;
    Patterning the photoresist into the shape of the first lead electrode;
    And etching the metal film.
    The manufacturing method of the quartz crystal vibrating element of any one of Claim 1 to 6.
  8. 　前記第１引出電極を設ける工程は、
    　前記水晶片の前記第１主面側に、第１金属膜と、前記第１金属膜を覆うように第２金属膜とを設ける工程と、
    　前記第２金属膜を覆うフォトレジストを設ける工程と、
    　前記フォトレジストを前記第１引出電極の形状にパターニングする工程と、
    　前記第１金属膜を露出させるように第１エッチング液を用いて前記第２金属膜をエッチングする工程と、
    　前記第１エッチング液とはエッチングレートが異なる第２エッチング液を用いて、前記第１金属膜をエッチングする工程と
    を含む、
    　請求項１から６のいずれか１項に記載の水晶振動素子の製造方法。     In the step of providing the first lead electrode,
    Providing a first metal film and a second metal film on the first principal surface side of the quartz crystal piece so as to cover the first metal film;
    Providing a photoresist covering the second metal film;
    Patterning the photoresist into the shape of the first lead electrode;
    Etching the second metal film using a first etchant to expose the first metal film;
    Etching the first metal film using a second etching solution different in etching rate from the first etching solution.
    The manufacturing method of the quartz crystal vibrating element of any one of Claim 1 to 6.
  9. 　前記第１引出電極を設ける工程は、
    　前記第１引出電極の形状がパターニングされたスパッタマスクを、前記水晶片の前記第１主面側に配置する工程と、
    　前記スパッタマスクを通して金属膜をスパッタする工程と
    を含む、
    　請求項１から６のいずれか１項に記載の水晶振動素子の製造方法。     In the step of providing the first lead electrode,
    Placing a sputtering mask, on which the shape of the first lead electrode is patterned, on the side of the first main surface of the crystal piece;
    Sputtering the metal film through the sputtering mask.
    The manufacturing method of the quartz crystal vibrating element of any one of Claim 1 to 6.
  10. 　前記中央部に設けられた電極の厚さを低減して周波数を調整する工程をさらに含む、
    　請求項１から９のいずれか１項に記載の水晶振動素子の製造方法。     The method may further include adjusting the frequency by reducing the thickness of the central electrode.
    The manufacturing method of the crystal vibrating element according to any one of claims 1 to 9.
  11. 　前記水晶片の前記第２主面のうち、前記中央部に前記第１励振電極と対向する第２励振電極を設ける工程と、
    　前記中央部を保護するメタルマスクとして前記第２励振電極を用いつつ前記周縁部の一部を除去し、前記水晶片の前記第２主面側において前記中央部と前記周縁部との間に第２側面を形成する工程と、
    　前記メタルマスクとして用いた前記第２励振電極に接触するように、前記水晶片の前記第２主面側において前記周縁部に延在する第２引出電極を設ける工程と、
    をさらに含む、
    　請求項１から１０のいずれか１項に記載の水晶振動素子の製造方法。     Providing a second excitation electrode facing the first excitation electrode at the central portion of the second principal surface of the crystal piece;
    A part of the peripheral portion is removed while using the second excitation electrode as a metal mask for protecting the central portion, and the second piece between the central portion and the peripheral portion on the second main surface side of the crystal piece Forming the two sides;
    Providing a second lead-out electrode extending to the peripheral portion on the second principal surface side of the crystal piece so as to contact the second excitation electrode used as the metal mask;
    Further include,
    The manufacturing method of the crystal vibrating element according to any one of claims 1 to 10.
  12. 　第１主面と前記第１主面に対向する第２主面を有するとともに、前記第１主面を平面視したときに中央側に位置する中央部と前記中央部の外側に位置する周縁部とを有し、前記第１主面および前記第２主面のうち少なくとも第１主面側において前記中央部と前記周縁部との間に第１側面が形成された、水晶片と、
    　前記水晶片の前記第１主面のうち、前記中央部に設けられた第１励振電極と、
    　前記水晶片の前記第２主面のうち、前記中央部に設けられ、前記第１励振電極と対向する第２励振電極と、
    　前記第１励振電極に電気的に接続された第１引出電極と、
    　前記第２励振電極に電気的に接続された第２引出電極と、
    を備え、
    　少なくとも前記第１引出電極は、前記水晶片の前記第１主面を平面視したときに前記第１励振電極の少なくとも一部を覆っており、前記中央部から前記周縁部に亘って延在する、水晶振動素子。     A first main surface and a second main surface opposite to the first main surface, and a central portion located on the center side and a peripheral portion located outside the central portion when the first main surface is viewed in plan A crystal piece having a first side surface formed between the central portion and the peripheral edge portion on at least the first main surface side of the first main surface and the second main surface,
    A first excitation electrode provided at the central portion of the first main surface of the crystal piece;
    A second excitation electrode provided at the central portion of the second main surface of the crystal piece and facing the first excitation electrode;
    A first extraction electrode electrically connected to the first excitation electrode;
    A second extraction electrode electrically connected to the second excitation electrode;
    Equipped with
    At least the first extraction electrode covers at least a portion of the first excitation electrode when the first main surface of the crystal piece is viewed in a plan view, and extends from the central portion to the peripheral portion , Crystal vibrating element.
  13. 　前記水晶片の前記第１主面を平面視したとき、前記第１励振電極の外縁は、前記中央部における前記第１側面との境界に至るまで延在している、
    　請求項１２に記載の水晶振動素子。     When the first main surface of the crystal piece is viewed in plan, the outer edge of the first excitation electrode extends to the boundary with the first side surface in the central portion,
    The crystal vibrating element according to claim 12.
  14. 　前記第１励振電極は、
    　前記水晶片の前記第１主面側に設けられた第１密着層と、
    　前記第１密着層よりも高い導電性を有しており、前記水晶片の前記第１主面を平面視したときに前記第１密着層を覆う第１導電層と
    を備えている、
    　請求項１２または１３に記載の水晶振動素子。     The first excitation electrode is
    A first adhesion layer provided on the first main surface side of the crystal piece;
    And a first conductive layer covering the first contact layer when the first main surface of the crystal piece is viewed in plan.
    The crystal vibrating element according to claim 12 or 13.
  15. 　前記第１引出電極は、
    　前記水晶片の前記第１主面側に設けられた第２密着層と、
    　前記第２密着層よりも高い導電性を有しており、前記水晶片の前記第１主面を平面視したときに前記第２密着層を覆う第２導電層と
    を備えている、
    　請求項１４に記載の水晶振動素子。     The first lead electrode is
    A second adhesion layer provided on the first main surface side of the crystal piece;
    And a second conductive layer which has higher conductivity than the second adhesive layer, and covers the second adhesive layer when the first main surface of the crystal piece is viewed in plan.
    The crystal vibrating element according to claim 14.
  16. 　前記第１密着層および前記第２密着層は、それぞれ、クロムを含む金属材料からなり、　前記第１導電層および前記第２導電層は、それぞれ、金を含む金属材料からなる、
    　請求項１５に記載の水晶振動素子。     The first adhesion layer and the second adhesion layer are each made of a metal material containing chromium, and the first conductive layer and the second conductive layer are each made of a metal material containing gold.
    The crystal vibrating element according to claim 15.
  17. 　前記第１引出電極の前記中央部に設けられた部分の厚さは、前記第１引出電極の前記周縁部に設けられた部分の厚さよりも小さい、
    　請求項１２から１６のいずれか１項に記載の水晶振動素子。     The thickness of the portion provided at the central portion of the first lead electrode is smaller than the thickness of the portion provided at the peripheral portion of the first lead electrode,
    The crystal vibrating element according to any one of claims 12 to 16.
  18. 　前記中央部の厚さは、前記周縁部の厚さよりも大きく、
    　前記第１側面は、前記中央部と前記周縁部とをつないでいる、
    　請求項１２から１７のいずれか１項に記載の水晶振動素子。     The thickness of the central portion is greater than the thickness of the peripheral portion,
    The first side surface connects the central portion and the peripheral portion.
    The crystal vibrating element according to any one of claims 12 to 17.
  19. 　前記中央部の厚さは、前記周縁部の厚さよりも小さく、
    　前記第１側面は、前記中央部と前記周縁部とをつないでいる、
    　請求項１２から１８のいずれか１項に記載の水晶振動素子。     The thickness of the central portion is smaller than the thickness of the peripheral portion,
    The first side surface connects the central portion and the peripheral portion.
    The crystal vibrating element according to any one of claims 12 to 18.
  20. 　前記水晶片は、前記第２主面側において前記中央部と前記周縁部との間に第２側面が形成されており、
    　前記第２引出電極は、前記水晶片の前記第２主面を平面視したときに前記第２励振電極の少なくとも一部を覆っており、前記水晶片の前記第２主面側において前記中央部から前記周縁部に亘って延在している、
    　請求項１２から１９のいずれか１項に記載の水晶振動素子。     The crystal piece has a second side surface formed between the central portion and the peripheral portion on the second main surface side,
    The second extraction electrode covers at least a portion of the second excitation electrode when the second main surface of the crystal piece is viewed in plan, and the central portion on the second main surface side of the crystal piece Extending from the end to the periphery,
    The crystal vibrating element according to any one of claims 12 to 19.
  21. 　前記水晶片は、前記中央部と前記周縁部の間にスリットが形成されている、
    　請求項１２から１７のいずれか１項に記載の水晶振動素子。     The crystal piece has a slit formed between the central portion and the peripheral portion.
    The crystal vibrating element according to any one of claims 12 to 17.
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