TWI828371B - Piezoelectric vibration element - Google Patents

Abstract

A piezoelectric vibration element includes a quartz substrate, a first oscillating electrode, a second oscillating electrode, a first external electrode and a second external electrode. The first oscillating electrode is arranged on the first surface of the quartz substrate. The second oscillating electrode is arranged on the second surface of the quartz substrate. The first external electrode is disposed on the first surface, the side surface and the second surface of the quartz substrate and is electrically connected to the first oscillation electrode, wherein the first external electrode is in direct contact with the second surface. The second external electrode is disposed on the second surface and is electrically connected to the second oscillating electrode.

Description

Piezoelectric vibration element

The present invention relates to a piezoelectric element, and in particular to a piezoelectric vibration element.

Piezoelectric vibration elements (such as quartz oscillators) will use stacked metal layer groups on both surfaces (front and back) of the quartz substrate to make side electrodes at the same time, so that current can flow between the two surfaces. However, in this way, when the charge flows, it will pass through at least two metal stack interfaces (each of the two surfaces has at least one metal stack interface), thereby causing an increase in the series resistance value and affecting the piezoelectric performance of the piezoelectric vibration element. Therefore, how to effectively improve the piezoelectric performance of piezoelectric vibration elements is actually a challenge.

The present invention provides a piezoelectric vibration element, which can reduce the series resistance value and thus has better piezoelectric performance.

A piezoelectric vibration element of the present invention includes a quartz substrate, a first oscillation electrode, a second oscillation electrode, a first external electrode and a second external electrode. The first oscillation electrode is disposed on the first surface of the quartz substrate. The second oscillation electrode is disposed on the second surface of the quartz substrate. The first external electrode is disposed on the first surface, side surface and second surface of the quartz substrate and is electrically connected to the first oscillation electrode, wherein the first external electrode is in direct contact with the second surface. The second external electrode is disposed on the second surface and electrically connected to the second oscillation electrode.

In an embodiment of the present invention, the above-mentioned first external electrode includes a first part and a second part. The first part is disposed on the first surface and connected to the first oscillation electrode through metal wiring, and the second part is connected to the first part and extends along the side surface to the second surface.

In an embodiment of the present invention, the above-mentioned first part includes at least two metal layer groups, and each metal layer group includes at least two metal layers. The first part is a lower metal layer set of at least two sets of metal layer sets and is in contact with the metal wiring, and the second part extends from an upper metal layer set of at least two sets of metal layer sets.

In an embodiment of the present invention, the orthogonal projected areas of the at least two metal layer groups on the quartz substrate partially overlap.

In an embodiment of the present invention, the above-mentioned at least two groups of metal layers are stacked in a stepped manner.

In an embodiment of the present invention, the above-mentioned first external electrode has a first thickness on the first surface, the first external electrode has a second thickness on the second surface, and the first thickness is different from the second thickness.

In an embodiment of the present invention, the above-mentioned first thickness is greater than the second thickness.

In an embodiment of the present invention, the above-mentioned first external electrode is in direct contact with the first surface.

In an embodiment of the present invention, the first external electrode has a third thickness on the first surface, the first external electrode has a fourth thickness on the second surface, and the third thickness is the same as the fourth thickness.

In an embodiment of the present invention, the first external electrode does not have a metal stack interface.

Based on the above, the present invention improves the electrode design of the piezoelectric vibration element, and directly contacts the first external electrode of the piezoelectric vibration element with the second surface of the quartz substrate. In this way, when the charge flows, at least on the second surface There is no metal stack interface, which means that the resistance value generated by passing through the metal stack interface can be reduced at least once, so the series resistance value can be reduced, thereby achieving better piezoelectric performance.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings.

Directional terms used herein (eg, up, down, right, left, front, back, top, bottom) are used only with reference to the drawings and are not intended to imply absolute orientation.

Unless expressly stated otherwise, any method described herein is in no way intended to be construed as requiring that its steps be performed in a particular order.

The present invention will be described more fully with reference to the drawings of this embodiment. However, the present invention may also be embodied in various forms and should not be limited to the embodiments described herein. The thickness, size, or dimensions of layers or regions in the drawings may be exaggerated for clarity. The same or similar reference numbers indicate the same or similar components, and will not be repeated one by one in the following paragraphs.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

1A is a partial long-side side view of a piezoelectric vibration element according to an embodiment of the present invention. FIG. 1B is a partial short-side side view of a piezoelectric vibration element according to an embodiment of the present invention. 1C is a schematic top view of part of the first surface of a piezoelectric vibration element according to an embodiment of the present invention. 1D is a schematic top view of part of the second surface of a piezoelectric vibration element according to an embodiment of the present invention.

Referring to FIGS. 1A to 1D , in this embodiment, the piezoelectric vibration element 100 includes a quartz substrate 110 , a first oscillation electrode 120 , a second oscillation electrode 130 , a first external electrode 140 and a second external electrode 150 , wherein the quartz The substrate is cut from a quartz wafer, for example. Furthermore, the quartz substrate 110 has a first surface 111, a second surface 112 and a side surface 113 connecting the first surface 111 and the second surface 112. The first oscillation electrode 120 is disposed on the first surface 111, and the second oscillation electrode 130 is disposed on the second surface 112 . Here, the materials of the first oscillation electrode 120 and the second oscillation electrode 130 are, for example, gold (Au), chromium (Cr), titanium (Ti) or other suitable electrode materials, and by comparing the first oscillation electrode 120 and the second oscillation electrode 130 Applying AC voltage to the two oscillation electrodes 130 can cause the piezoelectric vibration element 100 to generate cyclic wafer oscillation.

In addition, the first external electrode 140 is disposed on the first surface 111, the side surface 113 and the second surface 112 and is electrically connected to the first oscillation electrode 120, while the second external electrode 150 is disposed on the second surface 112 and is electrically connected. Connected to the second oscillation electrode 130, in which the first external electrode 140 is in direct contact with the second surface 112. Accordingly, this embodiment improves the electrode design of the piezoelectric vibration element 100, and the first external electrode of the piezoelectric vibration element 100 is 140 is in direct contact with the second surface 112 of the quartz substrate 110. In this way, when the charge flows, there will be no metal stack interface at least on the second surface 112, which means that the interface generated by passing through the metal stack once can be at least reduced. The resistance value can therefore reduce the series resistance value, thereby achieving better piezoelectric performance.

In some embodiments, the first external electrode 140 includes a first part and a second part, where the first part is disposed on the first surface 111 and connected to the first oscillation electrode 120 through the first metal wiring 160 , and the second part is The first part is connected to and extends along the side surface 113 to the second surface 112. In other words, one end of the first external electrode 140 can be connected to the first oscillation electrode 120 through the first metal wiring 160, and the first external electrode 140 The other end of can extend to the second surface 112, but the present invention is not limited thereto.

Furthermore, in this embodiment, the first part includes at least two sets of metal layer groups (such as the lead-out part 141 and the connecting part 142), wherein the first part is the lower metal layer group of the at least two sets of metal layer groups (such as the lead-out part 141 , only a single metal layer is shown for clarity). And in contact with the first metal wiring 160, and the second part extends from the upper metal layer group of at least two groups of metal layers (such as the connection portion 142, only a single metal layer is shown for clarity), so in this configuration At least one metal stacked interface IF will be formed on the first surface 111 of the quartz substrate 110, but the present invention is not limited thereto. In other embodiments, the first external electrode 140 may have different shapes. Here, the material of the lead-out part 141 is, for example, Au, Cr, and Ti, and the material of the connection part 142 is, for example, Au, Cr, and Ti, and the material of the lead-out part 141 and the material of the connection part 142 may be the same or different.

In some embodiments, the orthographic projected areas of at least two sets of metal layers on the quartz substrate 110 partially overlap and may be stacked in a ladder-like manner. For example, as shown in FIG. 1C , the lead-out portion 141 and the connecting portion 142 are at The orthographic projection area on the quartz substrate 110 partially overlaps, and a portion of the lead-out portion 141 is exposed. Therefore, the lead-out portion 141 and the connecting portion 142 can be stacked in a stepped manner, but the invention is not limited thereto.

In this embodiment, the first external electrode 140 has a first thickness T1 on the first surface 111, the first external electrode 140 has a second thickness T2 on the second surface 112, and the first thickness T1 is different from the second thickness. T2. For example, the first thickness T1 is greater than the second thickness T2. In other words, since the first external electrode 140 has the stacked lead portion 141 and the connecting portion 142 on the first surface 111, it may have a thicker thickness. However, this invention The invention is not limited to this.

In some embodiments, the second external electrode 150 and the second oscillation electrode 130 are connected through the second metal wiring 170, but the invention is not limited thereto. Here, the first metal wiring 160 and the second metal wiring 170 can be any suitable metal material, which is not limited by the present invention.

In some embodiments, the piezoelectric vibration element 100 of this embodiment can be first produced by first manufacturing the first oscillation electrode 120, the second oscillation electrode 130, the metal wiring 160, the metal wiring 170, the lead-out portion 141 and the second external electrode 150 ( can be called electrode feet), wherein the aforementioned components can be formed by a photolithography process or other suitable processes. Next, the connection portion 142 may be formed using a metal mask deposition process or other suitable processes. It should be noted that although the connection portion 142 schematically illustrated in FIG. 1C and FIG. 1D has regular edges, it may have slightly irregular edges when fabricated using a metal mask deposition process, but the invention is not limited thereto.

It must be noted here that the following embodiments follow the component numbers and part of the content of the above embodiments, where the same or similar numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. Regarding the description of the omitted parts Reference may be made to the foregoing embodiments, and details will not be repeated in the following embodiments.

FIG. 2A is a partial long-side side view of a piezoelectric vibration element according to another embodiment of the present invention. FIG. 2B is a partial short-side side view of a piezoelectric vibration element according to another embodiment of the present invention. FIG. 2C is a schematic top view of part of the first surface of a piezoelectric vibration element according to another embodiment of the present invention. FIG. 2D is a schematic top view of part of the second surface of a piezoelectric vibration element according to another embodiment of the present invention. Please refer to FIGS. 2A to 2D . Compared with the piezoelectric vibration element 100 , the first external electrode 240 of the piezoelectric vibration element 200 of this embodiment is in direct contact with the first surface 111 , that is, there is no surface on the first surface 111 . Since there is no metal stacked interface, the series resistance value can be further reduced, resulting in better piezoelectric performance, but the invention is not limited thereto.

Furthermore, the first external electrode 240 has an integrally formed first part and a second part, and the second part continuously extends from the first part. In other words, the first external electrode 240 is a single metal layer group passing through the first surface 111 Side surface 113 extends to second surface 112 . In addition, the first external electrode 240 has a third thickness T3 on the first surface 111, the first external electrode 240 has a fourth thickness T4 on the second surface 112, the third thickness T3 is the same as the fourth thickness T4, and the first external electrode 240 has a third thickness T3 on the second surface 112. The external electrode 240 does not have a metal stack interface, but the present invention is not limited thereto.

In some embodiments, the piezoelectric vibration element 200 of this embodiment may first produce the first oscillation electrode 120, the second oscillation electrode 130, the first metal wiring 160, the metal wiring 170 and the second external electrode 150 (which can be called (electrode pins), wherein the aforementioned components can be formed by a photolithography process or other suitable processes. Next, the first external electrode 240 may be formed using a metal mask deposition process or other appropriate processes. Therefore, in this embodiment, there is no lead-out portion 141 as in the previous embodiment, and the first external electrode 240 is directly connected to the first The portions on the surface 111 serve as electrode pins that are in contact with the first metal wiring 160, but the present invention is not limited thereto.

3A is a partial long-side side view of a packaging structure of a piezoelectric vibration element according to another embodiment of the present invention. 3B is a partial short-side side view of a packaging structure of a piezoelectric vibration element according to another embodiment of the present invention. Referring to FIGS. 3A and 3B , the packaging structure PKG of the piezoelectric vibration element 200 in this embodiment can be that the piezoelectric vibration element 200 is disposed on a ceramic leadless chip carrier (CLCC) 10 , wherein the ceramic leads The chip carrier 10 may include a driver chip and pins or other suitable components (not shown). Furthermore, the first external electrode 240 can be connected to the first welding pad 12 on the ceramic lead chip carrier 10 through the first connection terminal 20 , and the second external electrode 150 can be connected to the ceramic lead through the second connection terminal 30 The second soldering pad 14 on the wafer carrier 10 is connected, in which the first connection terminal 20 and the second connection terminal 30 are, for example, solder balls, but the invention is not limited thereto. It should be noted that the piezoelectric vibration element 100 can also form a packaging structure similar to the packaging structure PKG.

To sum up, the present invention improves the electrode design of the piezoelectric vibration element, and directly contacts the first external electrode of the piezoelectric vibration element with the second surface of the quartz substrate. In this way, when the charge flows, at least on the second surface There will be no metal stacked interface, which means that the resistance value generated by at least one metal stacked interface can be reduced, so the series resistance value can be reduced, thereby achieving better piezoelectric performance.

Although the present invention has been disclosed above through embodiments, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the appended patent application scope.

10:Ceramic lead chip carrier 12: First soldering pad 14: Second soldering pad 20: First connection terminal 30: Second connection terminal 100, 200: Piezoelectric vibration element 110:Quartz substrate 111: First surface 112: Second surface 113:Side surface 120: First oscillation electrode 130: Second oscillation electrode 140, 240: first external electrode 141:Leading Department 142:Connection part 150: Second external electrode 160:First metal wiring 170: Second metal wiring IF:Interface PKG: packaging structure T1: first thickness T2: second thickness T3: The third thickness T4: The fourth thickness

1A is a partial long-side side view of a piezoelectric vibration element according to an embodiment of the present invention. FIG. 1B is a partial short-side side view of a piezoelectric vibration element according to an embodiment of the present invention. 1C is a schematic top view of part of the first surface of a piezoelectric vibration element according to an embodiment of the present invention. 1D is a schematic top view of part of the second surface of a piezoelectric vibration element according to an embodiment of the present invention. FIG. 2A is a partial long-side side view of a piezoelectric vibration element according to another embodiment of the present invention. FIG. 2B is a partial short-side side view of a piezoelectric vibration element according to another embodiment of the present invention. FIG. 2C is a schematic top view of part of the first surface of a piezoelectric vibration element according to another embodiment of the present invention. FIG. 2D is a schematic top view of part of the second surface of a piezoelectric vibration element according to another embodiment of the present invention. 3A is a partial long-side side view of a packaging structure of a piezoelectric vibration element according to another embodiment of the present invention. 3B is a partial short-side side view of a packaging structure of a piezoelectric vibration element according to another embodiment of the present invention.

100: Piezoelectric vibration element

110:Quartz substrate

111: First surface

112: Second surface

113:Side surface

120: First oscillation electrode

130: Second oscillation electrode

140: First external electrode

141:Leading Department

142:Connection part

IF:interface

T1: first thickness

T2: second thickness

Claims (6)

A piezoelectric vibration element includes: a quartz substrate having a first surface, a second surface and a side surface, wherein the side surface connects the first surface and the second surface; a first oscillation electrode is provided on the on the first surface; a second oscillation electrode disposed on the second surface; a first external electrode disposed on the first surface, the side surface and the second surface and electrically connected to the a first oscillating electrode, wherein the first external electrode is in direct contact with the second surface; and a second external electrode is disposed on the second surface and electrically connected to the second oscillating electrode, wherein the The first external electrode has a first thickness on the first surface, the first external electrode has a second thickness on the second surface, and the first thickness is greater than the second thickness. The piezoelectric vibration element according to claim 1, wherein the first external electrode includes a first part and a second part, the first part is disposed on the first surface and communicates with the first oscillation electrode through a metal The wiring is connected, and the second part is connected to the first part and extends along the side surface to the second surface. The piezoelectric vibration element according to claim 2, wherein the first part includes at least two groups of metal layers, each group of metal layers includes at least two groups of metal layers, and the first part is the at least two groups of metal layers. The lower metal layer group is in contact with the metal wiring, and the second portion extends from the upper metal layer group of the at least two groups of metal layer groups. The piezoelectric vibration element according to claim 3, wherein the orthographic projection areas of the at least two groups of metal layers on the quartz substrate partially overlap. The piezoelectric vibration element according to claim 3, wherein the at least two metal layer groups are stacked in a ladder-like manner. The piezoelectric vibration element according to claim 1, wherein the first external electrode is in direct contact with the first surface.

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