JP7293037B2 - Crystal elements, crystal devices and electronic equipment - Google Patents

Description

The present disclosure relates to a crystal element, a crystal device including the crystal element, and an electronic device including the crystal device. Crystal devices include, for example, crystal resonators and crystal oscillators.

A thickness-shear vibration mode crystal element is an AT-cut crystal piece on which excitation electrodes made of metal film patterns are formed on both main surfaces (for example, see FIG. 3 of Patent Document 1). Also, the crystal device generates a specific oscillation frequency using the piezoelectric effect and the inverse piezoelectric effect of the crystal element. A general crystal device has a structure in which a crystal element is housed in a package and hermetically sealed with a lid (for example, see FIG. 1 of Patent Document 1).

As shown in FIG. 8, the equivalent circuit of the crystal element is a series circuit of a series resistor R1, a series inductance L1, and a series capacitor C1, and a parallel capacitor C0 connected in parallel. The series resistance R1 is a resistance value that maximizes the conductance in the admittance circle diagram, and serves as a loss resistance when the crystal element vibrates. Therefore, in general, the smaller the series resistance R1, the better the crystal element. The larger the series inductance L1, the higher the Q value and the more stable the oscillation. A parallel capacitance C0 is a capacitance between the excitation electrodes of the crystal element, and is determined by the thickness of the crystal piece and the area of the excitation electrodes.

The smaller the series capacitance C1 is, the higher the Q value is. Therefore, the series capacitance C1 is designed to be small for a highly stable oscillator. In addition, when it is desired to increase the change in frequency as in a VCXO (voltage controlled crystal oscillator), the series capacitance C1 is designed to be large.

JP 2015-211362 A

The equivalent constants of the crystal element (series resistance R1, series inductance L1, series capacitance C1 and parallel capacitance C0) depend on the external shape of the crystal blank and the position, external shape and size of the excitation electrodes. Therefore, in order to change only the series capacitance C1 while leaving the oscillation frequency and the series resistance R1 unchanged, it was necessary to redesign the entire crystal element.

Therefore, an object of the present disclosure is to provide a crystal element that can easily adjust the series capacitance C1 without changing the oscillation frequency and the series resistance R1.

The crystal element according to the present disclosure is
a crystal piece having two principal surfaces facing each other;
an excitation electrode positioned in the center of the main surface;
connection electrodes located on the periphery of the main surface;
a wiring electrode that connects the connection electrode and the excitation electrode;
an adjusting electrode located in a portion of one of the principal surfaces that does not overlap the excitation electrode located on the other principal surface in plan perspective view, and having the same potential as the excitation electrode located on one of the principal surfaces;
A crystal element comprising
The crystal piece has a substantially rectangular shape with long sides and short sides when viewed from above, and further has a side surface sandwiched between the two main surfaces, and the side surface including the long side extends along the long side. including the m-plane, which is a crystal plane extending along the
The adjustment electrode is provided at a position straddling the boundary between the other main surface and the m-plane when the crystal element is viewed through the plane.

A crystal device according to the present disclosure includes the crystal element according to the present disclosure, and an electronic device according to the present disclosure includes the crystal device according to the present disclosure.

According to the crystal element according to the present disclosure, one main surface is positioned in a portion that does not overlap with the excitation electrode positioned on the other main surface in plan perspective view, and has the same potential as the excitation electrode positioned on the one main surface. By providing the adjusting electrode, the series capacitance C1 can be easily adjusted without changing the oscillation frequency and the series resistance R1. In other words, the series capacitance C1 can be adjusted without changing the oscillation frequency and series resistance R1 of the existing crystal element simply by attaching a specific adjustment electrode to the excitation electrode of the existing crystal element.

1[A] is a perspective view showing the crystal element of Embodiment 1, and FIG. 1[B] is an enlarged sectional view taken along the line Ib-Ib in FIG. 1[A]. 2A is a plan view showing the front side of the crystal element of Embodiment 1, and FIG. 2B is a plan perspective view showing the back side of the crystal element of Embodiment 1. FIG. 3A is a plan view showing the front side of the crystal element of Embodiment 2, and FIG. 3B is a plan perspective view showing the back side of the crystal element of Embodiment 2. FIG. 4A is a plan view showing the front side of the crystal element of Embodiment 3, and FIG. 4B is a plan perspective view showing the back side of the crystal element of Embodiment 3. FIG. 5A is a plan view showing the front side of the crystal element of Embodiment 4, and FIG. 5B is a plan perspective view showing the back side of the crystal element of Embodiment 5. FIG. 6[A] is a perspective view showing the crystal device of Embodiment 5, and FIG. 6[B] is a cross-sectional view taken along line VIb-VIb in FIG. 6[A]. FIG. 7A is a front view showing a first example of the electronic device of Embodiment 6, and FIG. 7B is a front view showing a second example of the electronic device of Embodiment 6. FIG. 1 is an equivalent circuit diagram of a general crystal element; FIG.

EMBODIMENT OF THE INVENTION Hereinafter, the form (henceforth "embodiment") for implementing this indication is demonstrated, referring an accompanying drawing. In addition, in the present specification and drawings, substantially the same components are denoted by the same reference numerals, and the description thereof is omitted as appropriate. The shapes depicted in the drawings are drawn so that those skilled in the art can easily understand them, so they do not necessarily match the actual dimensions and proportions. The plan perspective view shows a state in which the crystal piece is seen through from the front side and the electrodes on the back side are seen.

<Embodiment 1>
As shown in FIGS. 1 and 2, the crystal element 10 of the first embodiment includes a crystal piece 12 having two main surfaces 13e and 13f facing each other, an excitation electrode 14e located in the center of the main surfaces 13e and 13f, and an excitation electrode 14e. 14f, connection electrodes 14a and 14b located on the periphery of the main surfaces 13e and 13f, wiring electrodes 14g and 14h connecting the connection electrodes 14a and 14b and the excitation electrodes 14e and 14f, and an adjustment electrode 15e. . The adjustment electrode 15e is located in a portion of the main surface 13e that does not overlap with the excitation electrode 14f located on the main surface 13f in plan view, and has the same potential as the excitation electrode 14e located on the main surface 13e.

The adjustment electrode 15e is directly connected to the excitation electrode 14e, but may be connected to the excitation electrode 14e via the connection electrode 14a or the wiring electrode 14g. Although the adjustment electrode 15e is provided only on the main surface 13e in Embodiment 1, it may be provided only on the main surface 13f, or may be provided on both of the main surfaces 13e and 13f. When the adjustment electrodes are provided on both the main surfaces 13e and 13f, the adjustment electrodes are arranged so as not to overlap with each other when viewed through the plane.

The crystal piece 12 has a substantially rectangular shape with long sides 11a and 11b and short sides 11c and 11d in plan view, and has two main surfaces 13e and 13f facing each other and side surfaces sandwiched between the two main surfaces 13e and 13f. 13a, 13b, 13c and 13d. The excitation electrodes 14e and 14f are located at the centers of the main surfaces 13e and 13f. The connection electrodes 14a, 14b are located on the peripheral edges of the main surfaces 13e, 13f. The wiring electrodes 14g, 14h electrically connect the connection electrodes 14a, 14b and the excitation electrodes 14e, 14f. Adjustment electrode 15e extends along long side 11b on main surface 13e.

The adjustment electrode 15e is made of the same metal film as the excitation electrodes 14e, 14f, etc., and is formed at the same time as the excitation electrodes 14e, 14f, etc. are formed. The adjustment electrode 15e may be configured as follows. The formation position is not limited to the long side 11b side of the main surface 13e, and may be the long side 11a side of the main surface 13e or the short side 11d side of the main surface 13e. The planar shape is not limited to a linear shape along the side surface 13b, but may be a V shape along the side surfaces 13a and 13b, or an L shape along the side surfaces 13b and 13d or the side surfaces 13a and 13d. Alternatively, it may be U-shaped along the side surfaces 13a, 13b, and 13d.

Two side surfaces 13a and 13b including the long sides 11a and 11b are m-planes 16a and 16b that are oblique to the thickness direction (Y′-axis direction) of the crystal piece 12 and vertical surfaces that are substantially parallel to the thickness direction of the crystal piece 12. It has surfaces 17a and 17b. The m-planes 16a and 16b are m-planes of crystal planes, and the vertical planes 17a and 17b include planes perpendicular to the R-planes of crystal planes. In other words, the m-planes 16a and 16b are oblique to the main surfaces 13e and 13f, and the vertical planes 17a and 17b are substantially perpendicular to the main surfaces 13e and 13f.

Next, the crystal element 10 will be described in more detail.

The crystal blank 12 is an AT-cut crystal plate. That is, in crystal, the orthogonal coordinate system XYZ consisting of the X-axis (electrical axis), Y-axis (mechanical axis), and Z-axis (optical axis) is 30° or more and 50° or less (for example, 35° 15') When an orthogonal coordinate system XY'Z' is defined by rotation, a wafer cut out parallel to the XZ' plane becomes the raw material of the crystal blank 12. The long sides 11a and 11b are parallel to the X-axis, the short sides 11c and 11d are parallel to the Z'-axis, and the thickness direction is parallel to the Y'-axis. As an example of the outer dimensions of the crystal piece 12, the long sides 11a and 11b are 650 to 920 μm, the short sides 11c and 11d are 550 to 690 μm, and the thickness varies depending on the oscillation frequency. For example, when the oscillation frequency is 100 MHz or more, the thickness of the crystal blank 12 at the portions where the excitation electrodes 14e and 14f are located is 17 μm or less.

The pair of excitation electrodes 14e and 14f are substantially rectangular in plan view, and are provided substantially at the centers of the main surfaces 13e and 13f, respectively. Wiring electrodes 14g and 14h that do not contribute to excitation extend from the excitation electrodes 14e and 14f to the connection electrodes 14a and 14b on the short side 11c along the long sides 11a and 11b. That is, the connection electrode 14a is electrically connected to the excitation electrode 14e via the wiring electrode 14g, and the connection electrode 14b is electrically connected to the excitation electrode 14f via the wiring electrode 14h. The excitation electrodes 14e and 14f are not limited to substantially rectangular shapes, and may be substantially circular or substantially elliptical, for example.

The excitation electrodes 14e and 14f form a laminate of, for example, a base layer made of chromium (Cr) and a conductor layer made of gold (Au). That is, the base layer is positioned on the crystal piece 12, and the conductor layer is positioned on the base layer. The underlayer mainly plays a role of obtaining adhesion to the crystal piece 12 . The conductor layer mainly plays the role of obtaining electrical continuity. The connection electrodes 14a, 14b and the wiring electrodes 14g, 14h may also be a laminate of a base layer and a conductor layer, like the excitation electrodes 14e, 14f.

As the manufacturing process of the excitation electrodes 14e, 14f, etc., there is a method of forming a photoresist pattern on the crystal piece 12 and then etching it, a method of forming a photoresist pattern on the crystal piece 12 and then forming a film and then lifting off the film, or A method of forming a film by covering the crystal piece 12 with a metal mask can be used. Sputtering, vapor deposition, or the like is used for film formation.

For the m-planes 16a and 16b and the vertical planes 17a and 17b, the mask (corrosion-resistant film) on the main surface 13e and the mask (corrosion-resistant film) on the main surface 13f are slightly shifted in the Z'-axis direction during wet etching (outer shape processing step). obtained by

The crystal element 10 can be manufactured as follows using, for example, photolithography technology and etching technology.

First, a corrosion-resistant film is provided on the entire surface of an AT-cut crystal wafer, and a photoresist is provided thereon. Subsequently, a mask having a pattern of the crystal piece 12 is superimposed on the photoresist, exposed and developed to partially expose the corrosion resistant film, and wet etching is performed on the corrosion resistant film in this state. Thereafter, using the remaining corrosion-resistant film as a mask, the crystal wafer is wet-etched to form the outer shape of the crystal piece 12 (outer shape processing step).

After that, the remaining corrosion-resistant film is removed from the crystal wafer, and a metal film, which becomes the excitation electrodes 14e, 14f, etc., is provided on the entire surface of the crystal wafer. Subsequently, a photoresist mask having a pattern of the excitation electrodes 14e, 14f, etc. is formed on the metal film, and the unnecessary metal film is removed by etching, thereby forming the excitation electrodes 14e, 14f, etc. composed of the base layer and the conductor layer. Form. Thereafter, by removing unnecessary photoresist, a plurality of crystal elements 10 are formed on the crystal wafer. Finally, the individual crystal elements 10 are obtained by singulating the crystal wafer into individual crystal elements 10 .

The operation of crystal element 10 is as follows. An alternating voltage is applied to the crystal piece 12 via the excitation electrodes 14e and 14f. Then, the crystal piece 12 causes thickness-shear vibration so that both principal surfaces 13e and 13f are displaced from each other, and generates a specific oscillation frequency. Thus, the crystal element 10 operates to output a signal with a constant oscillation frequency using the piezoelectric effect and the inverse piezoelectric effect of the crystal element 12 . At this time, the thinner the plate thickness of the crystal piece 12 between the excitation electrodes 14e and 14f, the higher the oscillation frequency.

Next, the action and effect of the crystal element 10 will be described.

According to the crystal element 10, the oscillation frequency and the series resistance R1 are adjusted by providing the adjustment electrode 15e which is located in a portion not overlapping with the excitation electrode 14f in plan perspective view on the main surface 13e and has the same potential as the excitation electrode 14e. The series capacitance C1 can be easily adjusted without changing it. In other words, simply by attaching the adjustment electrode 15e to the excitation electrode 14e of the existing crystal element, the series capacitance C1 can be adjusted without changing the oscillation frequency and the series resistance R1 of the existing crystal element. The present disclosure is based on findings experimentally obtained by the inventors.

If the series resistance R1, the series inductance L1, and the series capacitance C1 are replaced by mechanical vibrations, the explanation is as follows. The series resistance R1 corresponds to loss components of vibration energy such as internal friction during vibration and mechanical loss of the support system of the crystal element 12 . Series inductance L1 corresponds to the mass of the vibrating portion. The series capacitance C<b>1 corresponds to compliance, which is a physical quantity that quantifies the stretchability and plasticity of the crystal piece 12 , and changes depending on the stress and strain applied to the crystal piece 12 . A parallel capacitance C0 is a capacitance between the excitation electrodes 14e and 14f including floating capacitance.

Under such a premise, the reason why the crystal element 10 exhibits the above effects is considered as follows. In the crystal element 10, since the adjustment electrode 15e was attached to the main surface 13e, new stress and strain were applied to the crystal blank 12, and as a result, the series capacitance C1 changed. At this time, the series inductance L1 changed so as to satisfy (1/2π)(1/√(L1·C1))=constant, so the oscillation frequency did not change.

In addition, since the adjustment electrode 15e is positioned in a portion that does not overlap the excitation electrode 14f in plan perspective view, it does not contribute to thickness-shear vibration. Furthermore, since the adjustment electrode 15e is at the same potential as the excitation electrode 14e, it is less likely to become a floating capacitance, so that the parallel capacitance C0 is less likely to be affected. Since the areas of the excitation electrodes 14e and 14f do not change before and after the adjustment electrode 15e is attached, the series resistance R1 and the parallel capacitance C0 also do not change.

After the adjustment electrode 15e is formed, the series capacitance C1 may be adjusted while the adjustment electrode 15e is shaved by an ion beam or a laser beam.

Two side surfaces 13a and 13b including the long sides 11a and 11b are substantially parallel to the thickness direction of the crystal piece 12 and the m-planes 16a and 16b that are oblique to the thickness direction (Y'-axis direction) of the crystal piece 12. In other words, it has m-planes 16a and 16b that are m-planes of crystal planes and vertical planes 17a and 17b that include planes perpendicular to the R-planes of crystal planes. As a result, both ends (both side surfaces 13a and 13b) are substantially thinned. Therefore, since the vibration displacement at both ends (both side surfaces 13a and 13b) is greatly attenuated, the CI (crystal impedance) value can be reduced by the confinement effect of vibration energy. This effect is maximized when the thickness of the m-planes 16a and 16b and the thickness of the vertical planes 17a and 17b are equal in the thickness direction (Y'-axis direction) of the crystal piece 12. FIG. At this time, as shown in FIG. 1B, the left and right sides of the crystal piece 12 are symmetrical with respect to the center of gravity of the crystal piece 12, so that the upper half and the lower half of the crystal piece 12 vibrate in the same state. Vibration balance can be improved.

<Embodiment 2>
As shown in FIG. 3, the crystal element 20 of Embodiment 2 has the following features. The crystal piece 12 has a substantially rectangular shape with long sides 11a and 11b and short sides 11c and 11d in plan view. The connection electrodes 14a and 14b are positioned on the short side 11c side (or the short side 11d side) on at least one peripheral edge of the main surfaces 13e and 13f. The adjustment electrode 25e has a portion located between the excitation electrode 14e and the connection electrode 14b and linearly extending along the short side 11c.

Although the adjustment electrode 25e is provided only on the main surface 13e in the second embodiment, it may be provided only on the main surface 13f, or may be provided on both the main surfaces 13e and 13f. When the adjustment electrodes are provided on both the main surfaces 13e and 13f, it is preferable that the adjustment electrodes are arranged so as not to overlap with each other when viewed through the plane.

According to the crystal element 20, since the adjustment electrode 25e is positioned between the excitation electrode 14e and the connection electrode 14b in plan view, the adjustment electrode 25e functions as a weight, so that the connection electrode 14b is adhered or joined. It is possible to reduce the influence on the excitation electrode 14e when the voltage is applied. A perspective view and a cross-sectional view of the crystal element 20 conform to FIG. Other configurations, actions and effects of the second embodiment are the same as those of the first embodiment.

<Embodiment 3>
As shown in FIG. 4, the crystal element 30 of Embodiment 3 has the following features. The crystal piece 12 has a substantially rectangular shape with long sides 11a, 11b and short sides 11c, 11d in plan view, and further has side surfaces 13a, 13b, 13c, 13d sandwiched between two main surfaces 13e, 13f. The side surfaces 13a and 13b including the long sides 11a and 11b include m-planes 16a and 16b, which are crystal planes extending along the long sides 11a and 11b. The adjustment electrode 35e is positioned on at least one of the main surface 13e adjacent to the m-plane 16a and the m-plane 16a, and has a portion extending linearly along the long side 11a. The adjustment electrode 35e is positioned only on the side of the main surface 13e close to the m-plane 16a in Embodiment 3, but may be positioned only on the m-plane 16a or on the side of the main surface 13e close to the m-plane 16a. and m-plane 16a.

Although the adjustment electrode 35e is provided only on the main surface 13e in Embodiment 3, it may be provided only on the main surface 13f, or may be provided on both of the main surfaces 13e and 13f. When the adjustment electrodes are provided on both the main surfaces 13e and 13f, the adjustment electrodes are arranged so as not to overlap with each other when viewed through the plane.

The connection electrodes 34a and 34b are positioned on the short side 11c side at the peripheral edges of the main surfaces 13e and 13f. A portion of the wiring electrode 34g is positioned on at least one of the m-plane 16a and the m-plane 16a of the main surface 13e, extends from the connection electrode 34a along the long side 11a, and is connected to the adjustment electrode 35e.

The vibration reflected by the m-plane 16a is attenuated by the nearby adjustment electrode 35e serving as a weight. Therefore, it is possible to prevent the vibrations reflected by the m-plane 16a from reaching the excitation electrodes 14e and 14f and interfering with or coupling with the main vibration. As a result, it is possible to reduce the equivalent series resistance value and improve the frequency temperature characteristics.

In the third embodiment, the connection electrode 34a, the wiring electrode 34g, and the adjustment electrode 35e are integrated without gaps, and are positioned on at least one of the side of the main surface 13e in contact with the m-plane 16a and the m-plane 16a. there is Therefore, according to the crystal element 30, the adjusting electrode 35e is positioned on at least one of the main surface 13e and the m-plane 16a and extends along the long side 11a. can be suppressed, so the electrical characteristics can be improved. A perspective view and a cross-sectional view of the crystal element 30 conform to FIG. Other configurations, actions and effects of the third embodiment are the same as those of the first embodiment.

<Embodiment 4>
As shown in FIG. 5, the crystal element 40 of Embodiment 4 differs from Embodiment 1 in the following points. The adjustment electrode 45e is located in a portion of the main surface 13e that does not overlap with the excitation electrode 14f located on the main surface 13f (not the main surface 13e), and has the same potential as the excitation electrode 14f located on the main surface 13f (not the main surface 13e). Become.

Although the adjustment electrode 45e is provided only on the main surface 13e in Embodiment 4, it may be provided only on the main surface 13f, or may be provided on both of the main surfaces 13e and 13f. When the adjustment electrodes are provided on both the main surfaces 13e and 13f, the adjustment electrodes are arranged so as not to overlap with each other when viewed through the plane.

In the first embodiment, the adjustment electrodes have the same potential as the excitation electrodes on the same main surface, whereas in the fourth embodiment, the adjustment electrodes 45e have the same potential as the excitation electrodes 14f on the opposite main surface 13f. When a voltage is applied to the excitation electrodes 14e and 14f, an electric field perpendicular to the Y'-axis direction is generated on the surface of the crystal blank 12 between the adjustment electrode 45e and the excitation electrode 14e. At this time, since an electric field is generated on the surface of the crystal element 12 rather than inside it, thickness-shear vibration due to this electric field does not occur.

According to the crystal element 40, the oscillation frequency and the series resistance R1 can be adjusted by providing the adjustment electrode 45e which is located in a portion not overlapping the excitation electrode 14f in plan perspective view on the main surface 13e and has the same potential as the excitation electrode 14f. The series capacitance C1 can be easily adjusted without changing it. A perspective view and a cross-sectional view of the crystal element 40 conform to FIG. Other configurations, actions and effects of the fourth embodiment are the same as those of the first embodiment.

<Embodiment 5>
As shown in FIG. 6, the crystal device 60 of the fifth embodiment includes the crystal element 10 of the first embodiment, a base 61 on which the crystal element 10 is positioned, and a lid body 62 hermetically sealing the crystal element 10 together with the base 61. and have. The base 61 is also called a package and consists of a substrate 61a and a frame 61b. A space surrounded by the upper surface of the substrate 61 a , the inner surface of the frame 61 b , and the lower surface of the lid 62 serves as the housing portion 63 for the crystal element 10 . The crystal element 10 outputs, for example, a reference signal used in electronic equipment and the like.

In other words, the crystal device 60 includes a substrate 61a having a pair of electrode pads 61d on the upper surface and four external terminals 61c on the lower surface, a frame 61b positioned along the outer periphery of the upper surface of the substrate 61a, and a pair of electrode pads. A crystal element 10 is mounted on 61d via a conductive adhesive 61e, and a lid 62 hermetically seals the crystal element 10 together with the frame 61b.

The substrate 61a and the frame 61b are made of a ceramic material such as alumina ceramics or glass ceramics, and integrally formed to form the base 61. As shown in FIG. The base 61 and the lid 62 are generally rectangular in plan view. The external terminal 61c, the electrode pad 61d, and the lid 62 are electrically connected via a conductor formed inside or on the side surface of the base 61. As shown in FIG. Specifically, the external terminals 61c are positioned at the four corners of the lower surface of the substrate 61a. Two of these external terminals 61 c are electrically connected to the crystal element 10 , and the remaining two external terminals 61 c are electrically connected to the lid 62 . The external terminal 61c is used for mounting on a printed wiring board of an electronic device or the like.

Crystal element 10 has crystal element 12, excitation electrode 14e formed on the upper surface of crystal element 12, and excitation electrode 14f formed on the lower surface of crystal element 12, as described above. The crystal element 10 is bonded onto the electrode pad 61d via a conductive adhesive 61e, and plays a role of oscillating a reference signal for electronic equipment or the like by stable mechanical vibration and piezoelectric effect.

The electrode pads 61d are for mounting the crystal element 10 on the substrate 61, and a pair of electrode pads are positioned adjacent to each other along one side of the substrate 61a. The pair of electrode pads 61d connects the connection electrodes 14a and 14b, respectively, and has one end of the crystal element 10 as a fixed end, and the other end of the crystal element 10 as a free end separated from the upper surface of the substrate 61a. The crystal element 10 is fixed on the substrate 61a with a cantilever support structure.

The conductive adhesive 61e is, for example, a binder such as silicone resin containing conductive powder as a conductive filler. The lid body 62 is made of an alloy containing at least one of iron, nickel, and cobalt, for example, and is joined to the frame body 61b by seam welding or the like, so that the housing part 63 is in a vacuum state or filled with nitrogen gas or the like. hermetically sealed.

According to the crystal device 60, by including the crystal element 10, stable electrical characteristics can be exhibited. Note that the crystal device 60 is not limited to the crystal element 10 of the first embodiment, and may include crystal elements of other embodiments.

<Embodiment 6>
As shown in FIG. 7, electronic devices 71 and 72 of Embodiment 6 each include a crystal device 60 . The electronic device 71 illustrated in FIG. 7A is a smart phone, and the electronic device 72 illustrated in FIG. 7B is a personal computer.

In the crystal device 60 configured as shown in FIG. 6, the electronic devices 71 and 72 are connected by fixing the bottom surface of the external terminals 61c to the printed circuit board by soldering, gold (Au) bumps, conductive adhesive, or the like. It is mounted on the surface of the constituent printed circuit board. The crystal device 60 is used as an oscillation source in various electronic devices such as smartphones, personal computers, clocks, game machines, communication devices, and in-vehicle devices such as car navigation systems.

According to the electronic devices 71 and 72, by including the crystal device 60, high-performance and highly reliable operation based on stable electrical characteristics can be realized.

<Others>
Although the present disclosure has been described with reference to the above embodiments, the present disclosure is not limited to these. Various changes that can be understood by those skilled in the art can be added to the configuration and details of the present disclosure. In addition, the present disclosure also includes appropriate combinations of part or all of the configurations of the above-described embodiments.

10, 20, 30, 40 crystal element 11a, 11b long side 11c, 11d short side 12 crystal piece 13e, 13f main surface 13a, 13b, 13c, 13d side surface 14a, 14b, 34a, 34b connection electrode 14e, 14f excitation electrode 14g , 14h, 34g, 34h wiring electrodes 15e, 25e, 35e, 45e adjustment electrodes 16a, 16b m-planes 17a, 17b vertical planes 60 crystal device 61 substrate 61a substrate 61b frame 61c external terminal 61d electrode pad 61e conductive adhesive 62 lid Body 63 Housing 71, 72 Electronic equipment C0 Parallel capacitance C1 Series capacitance L1 Series inductance R1 Series resistance

Claims (4)

a crystal piece having two principal surfaces facing each other;
an excitation electrode positioned in the center of the main surface;
connection electrodes located on the periphery of the main surface;
a wiring electrode that connects the connection electrode and the excitation electrode;
an adjusting electrode located in a portion of one of the principal surfaces that does not overlap the excitation electrode located on the other principal surface in plan perspective view, and having the same potential as the excitation electrode located on one of the principal surfaces;
A crystal element comprising
The crystal piece has a substantially rectangular shape with long sides and short sides when viewed from above, and further has a side surface sandwiched between the two main surfaces, and the side surface including the long side extends along the long side. including the m-plane, which is a crystal plane extending along the
The adjustment electrode is provided at a position straddling a boundary portion between the other main surface and the m-plane when the crystal element is viewed through the plane. a crystal piece having two principal surfaces facing each other;
an excitation electrode positioned in the center of the main surface;
connection electrodes located on the periphery of the main surface;
a wiring electrode that connects the connection electrode and the excitation electrode;
an adjustment electrode located in a portion of one of the principal surfaces that does not overlap the excitation electrode located on the other principal surface in plan perspective view, and having the same potential as the excitation electrode located on the other principal surface;
A crystal element comprising
The crystal piece has a substantially rectangular shape with long sides and short sides when viewed from above, and further has a side surface sandwiched between the two main surfaces, and the side surface including the long side extends along the long side. including the m-plane, which is a crystal plane extending along the
The adjustment electrode is provided at a position straddling a boundary portion between the other main surface and the m-plane when the crystal element is viewed through the plane. A crystal element according to claim 1 or 2 ;
a base on which the crystal element is located;
a lid that hermetically seals the crystal element together with the base;
A crystal device with An electronic device comprising the crystal device according to claim 3 .

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