Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/541—Silicon-containing compounds containing oxygen
  • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
  • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/541—Silicon-containing compounds containing oxygen
  • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/541—Silicon-containing compounds containing oxygen
  • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
  • H01L23/293—Organic, e.g. plastic
  • H01L23/295—Organic, e.g. plastic containing a filler
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2203/00—Applications
  • C08L2203/20—Applications use in electrical or conductive gadgets
  • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Definitions

• the present disclosure relates to an epoxy resin composition and an electronic component device.
• a compression molding method and the like can be mentioned in addition to a transfer molding method which is usually used (for example, see Patent Document 1).
• the powdery particulate resin composition is supplied to be opposed to the object to be sealed (such as a substrate provided with an electronic element such as a semiconductor chip) held in a mold, and the object to be sealed is It is the method of resin-sealing by compressing with a granular resin composition.
• the wire to be incorporated is thinned along with the multifunctionalization of the package, it is an issue to suppress the generation of the wire flow and the like in the transfer molding generally used as a sealing method. On the other hand, it is also desired to suppress the viscosity from the viewpoint of the filling property and the like even by the compression molding method.
• the amount of heat generation tends to increase with the miniaturization and densification of electronic component devices, and how to dissipate heat is an important issue. Therefore, the heat conductivity is enhanced by mixing an inorganic filler having a high heat conductivity with the sealing material.
• the viscosity of the sealing material increases as the amount thereof increases, and the flowability may decrease, which may cause problems such as filling failure and wire flow.
• liquidity of a sealing material is proposed by using a specific phosphorus compound as a hardening accelerator (for example, refer patent document 2).
• JP 2008-279599 A Japanese Patent Laid-Open No. 9-157497
• a resin composition which can be used as a sealing material in which an increase in viscosity is suppressed while maintaining thermal conductivity at a higher level. Is desired.
• the first embodiment of the present disclosure has an object to provide an electronic component device including an epoxy resin composition having a low viscosity and an element sealed by the epoxy resin composition.
• a second embodiment of the present disclosure is to provide an epoxy resin composition having high thermal conductivity and suppressing an increase in viscosity, and an electronic component device provided with a device sealed therewith. It will be an issue.
• Embodiments of the present disclosure include the following aspects.
• ⁇ 2> The epoxy resin composition according to ⁇ 1>, wherein the linear hydrocarbon group has at least one functional group selected from a (meth) acryloyl group, an epoxy group, and an alkoxy group.
• ⁇ 3> The epoxy resin composition according to ⁇ 1> or ⁇ 2>, wherein the linear hydrocarbon group has a (meth) acryloyl group.
• ⁇ 4> The epoxy resin composition according to any one of ⁇ 1> to ⁇ 3>, wherein the content of the inorganic filler is 30% by volume to 99% by volume.
• ⁇ 5> The epoxy resin composition according to any one of ⁇ 1> to ⁇ 4>, wherein the thermal conductivity of the inorganic filler is 20 W / (m ⁇ K) or more.
• the inorganic filler having a thermal conductivity of 20 W / (m ⁇ K) or more is at least one selected from the group consisting of alumina, silicon nitride, boron nitride, aluminum nitride, magnesium oxide, and silicon carbide
• the epoxy resin composition as described in ⁇ 5> containing.
• ⁇ 7> An electronic component device comprising an element sealed with the epoxy resin composition according to any one of ⁇ 1> to ⁇ 6>.
• an electronic component device comprising a low viscosity epoxy resin composition and a device sealed with the epoxy resin composition.
• an epoxy resin composition having high thermal conductivity and suppressing an increase in viscosity, and an electronic component device provided with a device sealed therewith. Ru.
• a numerical range indicated by using “to” indicates a range including numerical values described before and after “to” as the minimum value and the maximum value, respectively.
• the upper limit value or the lower limit value described in one numerical value range may be replaced with the upper limit value or the lower limit value of the other stepwise description numerical value range in the numerical value range described stepwise in the present disclosure. .
• each component may contain a plurality of corresponding substances.
• the content or content of each component is the total content or content of the plurality of substances present in the composition unless otherwise specified.
• particles corresponding to each component may contain a plurality of types.
• the particle diameter of each component means the value for the mixture of the plurality of particles present in the composition unless otherwise specified.
• the (meth) acryloyl group means at least one of an acryloyl group and a methacryloyl group.
• the epoxy resin composition according to the first embodiment contains an epoxy resin, a curing agent, an inorganic filler, and a silane compound having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom. Do.
• a silane compound having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom is also referred to as a “specific silane compound”.
• the epoxy resin composition according to the first embodiment may contain other components as needed.
• the epoxy resin composition according to the first embodiment contains an epoxy resin.
• the type of epoxy resin is not particularly limited as long as it has an epoxy group in the molecule.
• the epoxy resin is at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcine, catechol, bisphenol A, bisphenol F and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene.
• Novolak type epoxy resin (phenol novolac type epoxy resin) which is obtained by epoxidizing a novolac resin obtained by condensation or cocondensation of a phenolic compound of the type with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde or propionaldehyde under acidic catalyst Epoxy resin, ortho cresol novolac epoxy resin, etc.); condensation of the above-mentioned phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst Is a triphenylmethane type epoxy resin obtained by epoxidizing a triphenylmethane type phenol resin obtained by cocondensation; a novolak obtained by cocondensing the above-mentioned phenol compound and naphthol compound with an aldehyde compound under an acidic catalyst Copolymer-type epoxy resin which is obtained by epoxidizing resin; diphenyl
• the epoxy equivalent (molecular weight / epoxy group number) of the epoxy resin is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance and electrical reliability, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.
• the temperature is preferably 40 ° C. to 180 ° C. from the viewpoint of moldability and reflow resistance, and more preferably 50 ° C. to 130 ° C. from the viewpoint of handleability in preparation of the epoxy resin composition.
• the melting point of the epoxy resin is a value measured by differential scanning calorimetry (DSC), and the softening point of the epoxy resin is a value measured by a method (ring and ball method) according to JIS K 7234: 1986.
• the content of the epoxy resin in the epoxy resin composition is preferably 0.5% by mass to 50% by mass, and preferably 2% by mass to 30% by mass, in view of strength, fluidity, heat resistance, moldability, etc.
• the content is more preferably 2% by mass to 20% by mass.
• the epoxy resin composition according to the first embodiment contains a curing agent.
• the type of curing agent is not particularly limited, and can be selected according to the type of resin, the desired properties of the epoxy resin composition, and the like.
• a curing agent a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polymercaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, a blocked isocyanate curing agent and the like can be mentioned.
• the curing agent is preferably one having a phenolic hydroxyl group in the molecule (phenol curing agent).
• phenolic curing agents polyhydric phenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols; phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol And at least one phenolic compound selected from the group consisting of phenol compounds such as aminophenol and naphthol compounds such as .alpha.-naphthol, .beta.-naphthol, dihydroxynaphthalene and aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde
• phenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols
• phenol curing agents may be used alone or in combination of two or more.
• the functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent) is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, electrical reliability, etc., 70 g / eq to 1000 g / eq is preferable, and 80 g / eq to 500 g / eq is more preferable.
• the functional group equivalent of the curing agent is a value measured by a method according to JIS K 0070: 1992.
• the temperature is preferably 40 ° C. to 180 ° C., and from the viewpoint of handleability at the time of production of the epoxy resin composition, it is more preferably 50 ° C. to 130 ° C.
• the melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.
• the equivalent ratio of the epoxy resin to the curing agent is not particularly limited.
• the ratio is preferably in the range of 0.5 to 2.0, and more preferably in the range of 0.6 to 1.3. It is more preferable to set in the range of 0.8 to 1.2 from the viewpoint of moldability and reflow resistance.
• the epoxy resin composition according to the first embodiment contains an inorganic filler.
• the material of the inorganic filler is not particularly limited. Specifically as the material of the inorganic filler, fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon silicate, silicon nitride, aluminum nitride, boron nitride, magnesium oxide, silicon carbide, beryllia, zirconia And inorganic materials such as zircon, forsterite, steatite, spinel, mullite, titania, talc, clay and mica. You may use the inorganic filler which has a flame-retardant effect.
• Examples of the inorganic filler having a flame retardant effect include composite metal hydroxides such as aluminum hydroxide, magnesium hydroxide, a composite hydroxide of magnesium and zinc, zinc borate and the like.
• silica such as fused silica is preferable from the viewpoint of reducing the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity.
• the shape of the inorganic filler is not particularly limited, and is preferably spherical in terms of the filling property and the mold abradability.
• the inorganic filler may be used alone or in combination of two or more.
• two or more types of inorganic fillers are used in combination
• two inorganic fillers having the same average particle size but different components are used.
• the case where it uses more than a kind and the case where two or more kinds of inorganic fillers from which an average particle diameter and a kind differ differ are mentioned.
• the content of the inorganic filler in the epoxy resin composition according to the first embodiment is not particularly limited. From the viewpoint of further improving the properties such as the thermal expansion coefficient, thermal conductivity, and elastic modulus of the cured product, the content of the inorganic filler is preferably 30% by volume or more of the entire epoxy resin composition, and 35% by volume The above is more preferable, 40% by volume or more is further preferable, 45% by volume or more is particularly preferable, and 50% by volume or more is extremely preferable.
• the content of the inorganic filler is preferably 99% by volume or less, preferably 98% by volume or less, of the entire epoxy resin composition, and 97% by volume It is more preferable that
• the content of the inorganic filler may be 70% by volume to 99% by volume of the entire epoxy resin composition, and 80% by volume to 99% by volume. It may be 83% by volume to 99% by volume, or 85% by volume to 99% by volume.
• the content of the inorganic filler in the epoxy resin composition is measured as follows. First, the total mass of the cured product (epoxy resin molded product) of the epoxy resin composition is measured, and the epoxy resin molded product is calcined at 400 ° C. for 2 hours and then at 700 ° C. for 3 hours to evaporate the resin component and leave it Measure the mass of the inorganic filler. The volume is calculated from each mass obtained and each specific gravity, and the ratio of the volume of the inorganic filler to the total volume of the epoxy resin molded product is obtained as the content of the inorganic filler.
• the inorganic filler When the inorganic filler is particulate, its average particle size is not particularly limited.
• the volume average particle diameter of the whole inorganic filler is preferably 80 ⁇ m or less, may be 50 ⁇ m or less, may be 40 ⁇ m or less, may be 30 ⁇ m or less, or 25 ⁇ m or less. It may be 20 ⁇ m or less, or 15 ⁇ m.
• the volume average particle diameter of the entire inorganic filler is preferably 0.1 ⁇ m or more, more preferably 0.2 ⁇ m or more, and still more preferably 0.3 ⁇ m or more. When the volume average particle diameter of the inorganic filler is 0.1 ⁇ m or more, the increase in the viscosity of the epoxy resin composition tends to be further suppressed.
• the volume average particle size of the inorganic filler should be measured as the particle size (D50) at which the accumulation from the small diameter side becomes 50% in the volume-based particle size distribution measured by the laser scattering diffraction particle size distribution measuring apparatus. Can.
• the maximum particle diameter (cut point) of the inorganic filler is controlled from the viewpoint of the improvement of the filling property in the narrow gap when the epoxy resin composition is used for a mold underfill or the like.
• the maximum particle size of the inorganic filler may be appropriately adjusted, and from the viewpoint of the filling property is preferably 105 ⁇ m or less, more preferably 75 ⁇ m or less, and may be 60 ⁇ m or less, 40 ⁇ m or less May be
• the maximum particle diameter can be measured by a laser diffraction particle size distribution analyzer (manufactured by Horiba, Ltd., trade name: LA920).
• the epoxy resin composition according to the first embodiment contains a specific silane compound.
• the specific silane compound has a structure in which a chain hydrocarbon group having 6 or more carbon atoms (hereinafter, a chain hydrocarbon group having 6 or more carbon atoms is also simply referred to as a chain hydrocarbon group) is bonded to a silicon atom.
• the chain hydrocarbon group may be branched or may have a substituent.
• the number of carbon atoms of the chain hydrocarbon group means the number of carbon atoms of branched or substituted carbon atoms.
• the chain hydrocarbon group may or may not contain unsaturated bonds, and preferably does not contain unsaturated bonds.
• the specific silane compound is considered to function as a coupling agent of the inorganic filler in the epoxy resin composition.
• the number of chain hydrocarbon groups bonded to a silicon atom may be 1 to 4, preferably 1 to 3, more preferably 1 or 2, and 1 Is more preferred.
• the atoms or atom groups other than chain hydrocarbon groups bonded to a silicon atom are not particularly limited, and are independent of each other.
• one or more alkoxy is preferably bonded in addition to the chain hydrocarbon group, and one chain hydrocarbon group and three alkoxy groups are bonded to a silicon atom. More preferable.
• the carbon number of the chain hydrocarbon group in the specific silane compound is 6 or more, preferably 7 or more, and more preferably 8 or more, from the viewpoint of suppressing the viscosity.
• the substituent is not particularly limited.
• the substituent may be present at the end of the chain hydrocarbon group, or may be present at the side chain of the chain hydrocarbon group.
• the chain hydrocarbon group preferably has at least one functional group (hereinafter also referred to as a specific functional group) selected from (meth) acryloyl group, epoxy group and alkoxy group, and (meth) acryloyl group and epoxy It is more preferable to have at least one functional group selected from groups, and it is further preferable to have a (meth) acryloyl group.
• the specific functional group may be present at the end of the chain hydrocarbon group, or may be present at the side chain of the chain hydrocarbon group. From the viewpoint of suppressing the viscosity, the specific functional group is preferably present at the end of the chain hydrocarbon group.
• the viscosity of the epoxy resin composition tends to further decrease. Although this reason is not necessarily clear, when the chain hydrocarbon group of the specific silane compound has the specific functional group, the compatibility between the specific functional group and the epoxy resin is enhanced, and the dispersibility of the epoxy resin and the inorganic filler is improved. It is presumed that it is to do.
• the (meth) acryloyl group may be directly bonded to the chain hydrocarbon group, or may be bonded via another atom or atomic group .
• the chain hydrocarbon group may have a (meth) acryloyloxy group.
• the chain hydrocarbon group preferably has a methacryloyloxy group.
• the chain hydrocarbon group has an epoxy group
• the epoxy group may be directly bonded to the chain hydrocarbon group, or may be bonded via another atom or atomic group.
• the chain hydrocarbon group may have a glycidyloxy group, an alicyclic epoxy group, and the like.
• the chain hydrocarbon group preferably has a glycidyloxy group.
• the alkoxy group may be directly bonded to the chain hydrocarbon group, or may be bonded via another atom or atomic group, and the chain hydrocarbon group Preferably it is directly attached to
• the alkoxy group is not particularly limited, and may be a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group or the like. Among them, from the viewpoint of easy availability, it is preferable that the chain hydrocarbon group has a methoxy group.
• the equivalent (molecular weight / number of functional groups) of at least one functional group selected from the (meth) acryloyl group, the epoxy group, and the alkoxy group in the specific silane compound is not particularly limited. From the viewpoint of lowering the viscosity of the epoxy resin composition, it is preferably 200 g / eq to 420 g / eq, more preferably 210 g / eq to 405 g / eq, and 230 g / eq to 390 g / eq. More preferable.
• silane compounds include hexyltrimethoxysilane, heptyltrimethoxysilane, octyltrimethoxysilane, hexyltriethoxysilane, heptyltriethoxysilane, octyltriethoxysilane, 6-glycidoxyhexyltrimethoxysilane, 7-glycid Xiheptyl trimethoxysilane, 8-glycidoxyoctyl trimethoxysilane, 6- (meth) acryloxyhexyl trimethoxysilane, 7- (meth) acryloxy heptyl trimethoxysilane, 8- (meth) acryloxyoctyl trimethoxy Silane, decyltrimethoxysilane and the like can be mentioned.
• 8-glycidoxyoctyltrimethoxysilane and 8-methacryloxyoctyltrimethoxysilane are preferable from the viewpoint of lowering the viscosity of the epoxy resin composition.
• the specific silane compounds may be used alone or in combination of two or more.
• the specific silane compounds may be synthesized or those commercially available.
• Specific silane compounds commercially available include Shin-Etsu Chemical Co., Ltd. KBM-3063 (Hexyltrimethoxysilane), KBE-3063 (Hexyltriethoxysilane), KBE-3083 (Octyltriethoxysilane), KBM-4803 8-glycidoxyoctyltrimethoxysilane), KBM-5803 (8-methacryloxyoctyltrimethoxysilane), KBM-3103C (decyltrimethoxysilane), and the like.
• the content of the specific silane compound in the epoxy resin composition according to the first embodiment is not particularly limited.
• the content of the specific silane compound may be 0.01 parts by mass or more, and may be 0.02 parts by mass or more with respect to 100 parts by mass of the inorganic filler. Further, the content of the specific silane compound is preferably 5 parts by mass or less, and more preferably 2.5 parts by mass or less with respect to 100 parts by mass of the inorganic filler.
• the content of the specific silane compound is 0.01 parts by mass or more based on 100 parts by mass of the inorganic filler, a composition having a low viscosity tends to be obtained.
• the content of the specific silane compound is 5 parts by mass or less with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
• the epoxy resin composition according to the first embodiment may further contain another coupling agent in addition to the specific silane compound.
• Other coupling agents are not particularly limited as long as they are generally used in epoxy resin compositions.
• Other coupling agents include silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane (except for specific silane compounds), titanium compounds, aluminum chelate compounds, aluminum / zirconium compounds, etc.
• Known coupling agents may be used alone or in combination of two or more.
• the total content of the specific silane compound and the other coupling agent is 100 parts by mass of the inorganic filler. It may be 0.01 parts by mass or more, and may be 0.02 parts by mass or more.
• the total content of the specific silane compound and the other coupling agent is preferably 5 parts by mass or less, and more preferably 2.5 parts by mass or less with respect to 100 parts by mass of the inorganic filler.
• the total content of the specific silane compound and the other coupling agent is 0.01 parts by mass or more with respect to 100 parts by mass of the inorganic filler, a composition having a low viscosity tends to be obtained.
• the total content of the specific silane compound and the other coupling agent is 5 parts by mass or less with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
• the epoxy resin composition according to the first embodiment contains another coupling agent other than the specific silane compound, the specific silane compound and the other coupling agent from the viewpoint of exhibiting the function of the specific silane compound well.
• the content of the other coupling agent to the total amount is preferably 90% by mass or less, more preferably 70% by mass or less, and still more preferably 50% by mass or less.
• the epoxy resin composition according to the first embodiment may contain a curing accelerator.
• the type of curing accelerator is not particularly limited, and can be selected according to the type of epoxy resin, the desired properties of the epoxy resin composition, and the like.
• diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonene-5 (DBN), 1,8-diazabicyclo [5.4.0] undecene-7 (DBU), etc.
• Cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or derivatives thereof; Of maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1 , 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1, Compounds having an intramolecular polarization formed by addition of compounds having a ⁇ bond such as quinone compounds such as -benzoquinone and diazophenylmethane; tetraphenyl borate salts of DBU, tetraphen
• tertiary amine compounds tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexyl benzoate
• Ammonium salt compounds such as ammonium sulfate and tetrapropylammonium hydroxide; triphenylphosphine, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, tris (alkyl alkoxyphenyl) phosphine, tris (Dialkylphenyl) phosphine, tris (trialkylphenyl) phosphine, tris (tetraalkylphenyl) phosphine, tris (dialkoxyphenyl)
• Sphin compounds Sphin compounds; said tertiary phosphine or said phosphine compound and maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2, Quinone compounds such as 3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and compounds having a ⁇ bond such as diazophenylmethane
• a compound having an internal polarization obtained through the step of dehydrohalogenation tetra-substituted phosphonium such as tetraphenyl phosphonium; tetra-substituted phosphonium having no phenyl group bonded to a boron atom such as tetra-p-tolylborate Tetrasubstituted borates; salts of tetraphenylphosphonium with a phenol compound and the like can be mentioned.
• the curing accelerator may be used alone or in combination of two or more.
• the amount is 0.1 parts by mass to 30 parts by mass with respect to 100 parts by mass of the resin component (that is, the total of the resin and the curing agent). It is preferably part, and more preferably 1 part by mass to 15 parts by mass. If the amount of the curing accelerator is 0.1 parts by mass or more with respect to 100 parts by mass of the resin component, it tends to be cured well in a short time. If the amount of the curing accelerator is 30 parts by mass or less with respect to 100 parts by mass of the resin component, the curing rate tends to be too fast to obtain a good molded product.
• the epoxy resin composition according to the first embodiment contains various additives such as an ion exchanger, a mold release agent, a flame retardant, a colorant, and a stress relaxation agent, which are exemplified below, in addition to the components described above. It is also good.
• the epoxy resin composition according to the first embodiment may contain various additives well known in the art, as needed, in addition to the additives exemplified below.
• the epoxy resin composition according to the first embodiment may contain an ion exchanger.
• ion exchange is performed from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of the electronic component device provided with the element to be sealed. It is preferable to contain a body.
• the ion exchanger is not particularly limited, and conventionally known ones can be used. Specific examples thereof include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium and bismuth.
• the ion exchangers may be used alone or in combination of two or more. Among them, hydrotalcite represented by the following general formula (A) is preferable.
• the content thereof is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions.
• the amount is preferably 0.1 parts by mass to 30 parts by mass, and more preferably 1 part by mass to 10 parts by mass with respect to 100 parts by mass of the resin component.
• the epoxy resin composition according to the first embodiment may contain a release agent from the viewpoint of obtaining good releasability with the mold at the time of molding.
• the release agent is not particularly limited, and conventionally known ones can be used. Specific examples thereof include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene.
• the mold release agent may be used alone or in combination of two or more.
• the amount thereof is preferably 0.01 parts by mass to 10 parts by mass with respect to 100 parts by mass of the resin component, and 0.1 parts by mass to 5 parts The parts by mass are more preferred.
• the amount of the release agent is 0.01 parts by mass or more based on 100 parts by mass of the resin component, the releasability tends to be sufficiently obtained. If it is 10 parts by mass or less, better adhesion and curability tend to be obtained.
• the epoxy resin composition according to the first embodiment may contain a flame retardant.
• the flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specifically, organic or inorganic compounds containing a halogen atom, an antimony atom, a nitrogen atom or a phosphorus atom, metal hydroxides and the like can be mentioned.
• the flame retardant may be used alone or in combination of two or more.
• the amount thereof is not particularly limited as long as it is an amount sufficient to obtain a desired flame retardant effect.
• the amount is preferably 1 part by mass to 30 parts by mass, and more preferably 2 parts by mass to 20 parts by mass with respect to 100 parts by mass of the resin component.
• the epoxy resin composition according to the first embodiment may further contain a colorant.
• colorants include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, red iron oxide and the like.
• the content of the coloring agent can be appropriately selected according to the purpose and the like.
• the colorants may be used alone or in combination of two or more.
• the epoxy resin composition according to the first embodiment may contain a stress relaxation agent such as silicone oil or silicone rubber particles. By containing a stress relaxation agent, warpage of the package and occurrence of package cracks can be further reduced.
• the stress relieving agent includes known stress relieving agents (flexible agents) generally used.
• thermoplastic elastomers such as silicone, styrene, olefin, urethane, polyester, polyether, polyamide, and polybutadiene, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic Core particles such as rubber particles such as rubber, urethane rubber and silicone powder, methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer and methyl methacrylate-butyl acrylate copolymer
• MBS methyl methacrylate-styrene-butadiene copolymer
• MVS methyl methacrylate-silicone copolymer
• methyl methacrylate-butyl acrylate copolymer The rubber particle etc. which have a structure are mentioned.
• the stress relaxation agents may be used alone or in combination of two or more.
• the epoxy resin composition according to the second embodiment includes an epoxy resin, a curing agent, an inorganic filler having a thermal conductivity of 20 W / (m ⁇ K) or more, and a chain hydrocarbon group having 6 or more carbon atoms. And a silane compound (specific silane compound) having a structure bonded to a silicon atom.
• the thermal conductivity of the inorganic filler in the present disclosure is the thermal conductivity at room temperature (25 ° C.).
• the epoxy resin composition according to the second embodiment may contain other components as needed.
• the epoxy resin composition according to the second embodiment exhibits the above effect is not necessarily clear, but is presumed as follows.
• a low molecular weight coupling agent such as a silane compound having a propyl group is used in the sealing resin composition to improve the dispersibility of the inorganic filler.
• a silane compound having a longer chain hydrocarbon group is used, the compatibility of the inorganic filler with the resin is improved, and it is considered that the frictional resistance between the inorganic fillers is reduced.
• Epoxy resin The epoxy resin composition according to the second embodiment contains an epoxy resin.
• the details of the epoxy resin are the same as the details of the epoxy resin used in the epoxy resin composition according to the first embodiment.
• the epoxy resin composition according to the second embodiment contains a curing agent.
• the details of the curing agent are the same as the details of the curing agent used in the epoxy resin composition according to the first embodiment.
• the epoxy resin composition according to the second embodiment contains an inorganic filler having a thermal conductivity of 20 W / (m ⁇ K) or more.
• the material of the inorganic filler is not particularly limited as long as it has the above-described thermal conductivity.
• an inorganic filler having a thermal conductivity of 20 W / (m ⁇ K) or more is an inorganic filler composed of a material having a thermal conductivity of 20 W / (m ⁇ K) or more at room temperature (25 ° C.).
• the thermal conductivity of the inorganic filler can be obtained by measuring the thermal conductivity of the material constituting the inorganic filler by the xenon flash (Xe-flash) method or the heat ray method.
• the thermal conductivity of the inorganic filler is 20 W / (m ⁇ K) or more, and preferably 25 W / (m ⁇ K) or more from the viewpoint of heat radiation when it is a cured product.
• the upper limit of the thermal conductivity of the inorganic filler is not particularly limited, and may be 500 W / (m ⁇ K) or less, and may be 300 W / (m ⁇ K) or less.
• the material of the inorganic filler having the thermal conductivity include alumina, silicon nitride, boron nitride, aluminum nitride, magnesium oxide and silicon carbide.
• alumina is preferable from the viewpoints of sphericity, moisture resistance and the like.
• the shape of the inorganic filler is not particularly limited, and is preferably spherical in terms of the filling property and the mold abradability.
• the inorganic filler may be used alone or in combination of two or more.
• two or more types of inorganic fillers are used in combination
• two inorganic fillers having the same average particle size but different components are used.
• the case where it uses more than a kind and the case where two or more kinds of inorganic fillers from which an average particle diameter and a kind differ differ are mentioned.
• the content of the inorganic filler in the epoxy resin composition according to the second embodiment is not particularly limited. From the viewpoint of further improving the properties such as the thermal expansion coefficient, thermal conductivity, and elastic modulus of the cured product, the content of the inorganic filler is preferably 30% by volume or more of the entire epoxy resin composition, and 35% by volume The above is more preferable, 40% by volume or more is further preferable, 45% by volume or more is particularly preferable, and 50% by volume or more is extremely preferable.
• the content of the inorganic filler is preferably 99% by volume or less, preferably 98% by volume or less, of the entire epoxy resin composition, and 97% by volume It is more preferable that The content of the inorganic filler in the epoxy resin composition according to the second embodiment is preferably 30% by volume to 99% by volume, more preferably 35% by volume to 99% by volume, and 40% by volume It is more preferably ⁇ 98 volume%, particularly preferably 45 volume% to 97 volume%, and most preferably 50 volume% to 97 volume%.
• the content of the inorganic filler in the epoxy resin composition is measured as follows. First, the total mass of the cured product (epoxy resin molded product) of the epoxy resin composition is measured, and the epoxy resin molded product is calcined at 400 ° C. for 2 hours and then at 700 ° C. for 3 hours to evaporate the resin component and leave it Measure the mass of the inorganic filler. The volume is calculated from each mass obtained and each specific gravity, and the ratio of the volume of the inorganic filler to the total volume of the epoxy resin molded product is obtained to be the content of the inorganic filler.
• the inorganic filler When the inorganic filler is particulate, its average particle size is not particularly limited.
• the volume average particle diameter of the whole inorganic filler is preferably 80 ⁇ m or less, may be 50 ⁇ m or less, may be 40 ⁇ m or less, may be 30 ⁇ m or less, or 25 ⁇ m or less. It may be 20 ⁇ m or less, or 15 ⁇ m.
• the volume average particle diameter of the entire inorganic filler is preferably 0.1 ⁇ m or more, more preferably 0.2 ⁇ m or more, and still more preferably 0.3 ⁇ m or more. When the volume average particle diameter of the inorganic filler is 0.1 ⁇ m or more, the increase in the viscosity of the epoxy resin composition tends to be further suppressed.
• the volume average particle size of the inorganic filler should be measured as the particle size (D50) at which the accumulation from the small diameter side becomes 50% in the volume-based particle size distribution measured by the laser scattering diffraction particle size distribution measuring apparatus. Can.
• the maximum particle diameter (cut point) of the inorganic filler is controlled from the viewpoint of the improvement of the filling property in the narrow gap when the epoxy resin composition is used for a mold underfill or the like.
• the maximum particle size of the inorganic filler may be appropriately adjusted, and from the viewpoint of the filling property is preferably 105 ⁇ m or less, more preferably 75 ⁇ m or less, and may be 60 ⁇ m or less, 40 ⁇ m or less May be
• the maximum particle diameter can be measured by a laser diffraction particle size distribution analyzer (manufactured by Horiba, Ltd., trade name: LA920).
• the epoxy resin composition according to the second embodiment contains a specific silane compound.
• the specific silane compound has a structure in which a chain hydrocarbon group having 6 or more carbon atoms (hereinafter, a chain hydrocarbon group having 6 or more carbon atoms is also simply referred to as a chain hydrocarbon group) is bonded to a silicon atom.
• the chain hydrocarbon group may be branched or may have a substituent.
• the number of carbon atoms of the chain hydrocarbon group means the number of carbon atoms of branched or substituted carbon atoms.
• the chain hydrocarbon group may or may not contain unsaturated bonds, and preferably does not contain unsaturated bonds.
• the specific silane compound is considered to function as a coupling agent of the inorganic filler in the epoxy resin composition.
• the atom or atomic group other than the chain hydrocarbon group which is bonded to the silicon atom is not particularly limited, and each of them is independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group, an aryl group, an aryloxy group or the like It may be. Among them, one or more alkoxy groups are preferably bonded in addition to a chain hydrocarbon group, and one chain hydrocarbon group and three alkoxy groups are bonded to a silicon atom. Is more preferred.
• the carbon number of the chain hydrocarbon group in the specific silane compound is 6 or more, preferably 7 or more, and more preferably 8 or more, from the viewpoint of suppressing the viscosity.
• the substituent is not particularly limited.
• the substituent may be present at the end of the chain hydrocarbon group, or may be present at the side chain of the chain hydrocarbon group.
• the chain hydrocarbon group preferably has at least one functional group (hereinafter also referred to as a specific functional group) selected from (meth) acryloyl group, epoxy group and alkoxy group, and (meth) acryloyl group and epoxy It is more preferable to have at least one functional group selected from groups, and it is further preferable to have a (meth) acryloyl group.
• the specific functional group may be present at the end of the chain hydrocarbon group, or may be present at the side chain of the chain hydrocarbon group. From the viewpoint of suppressing the viscosity, the specific functional group is preferably present at the end of the chain hydrocarbon group.
• the viscosity of the epoxy resin composition tends to further decrease. Although this reason is not necessarily clear, when the chain hydrocarbon group of the specific silane compound has the specific functional group, the compatibility between the specific functional group and the epoxy resin is enhanced, and the dispersibility of the epoxy resin and the inorganic filler is improved. It is presumed that it is to do.
• the (meth) acryloyl group may be directly bonded to the chain hydrocarbon group, or may be bonded via another atom or atomic group .
• the chain hydrocarbon group may have a (meth) acryloyloxy group.
• the chain hydrocarbon group preferably has a methacryloyloxy group.
• the chain hydrocarbon group has an epoxy group
• the epoxy group may be directly bonded to the chain hydrocarbon group, or may be bonded via another atom or atomic group.
• the chain hydrocarbon group may have a glycidyloxy group, an alicyclic epoxy group, and the like.
• the chain hydrocarbon group preferably has a glycidyloxy group.
• the alkoxy group may be directly bonded to the chain hydrocarbon group, or may be bonded via another atom or atomic group, and the chain hydrocarbon group Preferably it is directly attached to
• the alkoxy group is not particularly limited, and may be a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group or the like. Among them, from the viewpoint of easy availability, it is preferable that the chain hydrocarbon group has a methoxy group.
• the equivalent (molecular weight / number of functional groups) of at least one functional group selected from the (meth) acryloyl group, the epoxy group, and the alkoxy group in the specific silane compound is not particularly limited. From the viewpoint of lowering the viscosity of the epoxy resin composition, it is preferably 200 g / eq to 420 g / eq, more preferably 210 g / eq to 405 g / eq, and 230 g / eq to 390 g / eq. More preferable.
• silane compounds include hexyltrimethoxysilane, heptyltrimethoxysilane, octyltrimethoxysilane, hexyltriethoxysilane, heptyltriethoxysilane, octyltriethoxysilane, 6-glycidoxyhexyltrimethoxysilane, 7-glycid Xiheptyl trimethoxysilane, 8-glycidoxyoctyl trimethoxysilane, 6- (meth) acryloxyhexyl trimethoxysilane, 7- (meth) acryloxy heptyl trimethoxysilane, 8- (meth) acryloxyoctyl trimethoxy Silane, decyltrimethoxysilane and the like can be mentioned.
• 8-glycidoxyoctyltrimethoxysilane and 8-methacryloxyoctyltrimethoxysilane are preferable from the viewpoint of lowering the viscosity of the epoxy resin composition.
• the specific silane compounds may be used alone or in combination of two or more.
• the specific silane compounds may be synthesized or those commercially available.
• Specific silane compounds commercially available include Shin-Etsu Chemical Co., Ltd. KBM-3063 (Hexyltrimethoxysilane), KBE-3063 (Hexyltriethoxysilane), KBE-3083 (Octyltriethoxysilane), KBM-4803 8-glycidoxyoctyltrimethoxysilane), KBM-5803 (8-methacryloxyoctyltrimethoxysilane), KBM-3103C (decyltrimethoxysilane), and the like.
• the content of the specific silane compound in the epoxy resin composition according to the second embodiment is not particularly limited.
• the content of the specific silane compound may be 0.01 parts by mass or more, and may be 0.02 parts by mass or more with respect to 100 parts by mass of the inorganic filler. Further, the content of the specific silane compound is preferably 5 parts by mass or less, and more preferably 2.5 parts by mass or less with respect to 100 parts by mass of the inorganic filler.
• the content of the specific silane compound is 0.01 parts by mass or more based on 100 parts by mass of the inorganic filler, a composition having a low viscosity tends to be obtained.
• the content of the specific silane compound is 5 parts by mass or less with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
• the epoxy resin composition according to the second embodiment may further contain another coupling agent in addition to the specific silane compound.
• Other coupling agents are not particularly limited as long as they are generally used in epoxy resin compositions.
• Other coupling agents include silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane (except for specific silane compounds), titanium compounds, aluminum chelate compounds, aluminum / zirconium compounds, etc.
• Known coupling agents may be used alone or in combination of two or more.
• the total content of the specific silane compound and the other coupling agent is 100 parts by mass of the inorganic filler. It may be 0.01 parts by mass or more, and may be 0.02 parts by mass or more.
• the total content of the specific silane compound and the other coupling agent is preferably 5 parts by mass or less, and more preferably 2.5 parts by mass or less with respect to 100 parts by mass of the inorganic filler.
• the total content of the specific silane compound and the other coupling agent is 0.01 parts by mass or more with respect to 100 parts by mass of the inorganic filler, a composition having a low viscosity tends to be obtained.
• the total content of the specific silane compound and the other coupling agent is 5 parts by mass or less with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
• the epoxy resin composition according to the second embodiment contains another coupling agent other than the specific silane compound, the specific silane compound and the other coupling agent from the viewpoint of exerting the function of the specific silane compound well.
• the content of the other coupling agent to the total amount is preferably 90% by mass or less, more preferably 70% by mass or less, and still more preferably 50% by mass or less.
• the epoxy resin composition according to the second embodiment may contain a curing accelerator.
• the details of the curing accelerator are the same as the details of the curing accelerator used in the epoxy resin composition according to the first embodiment.
• the epoxy resin composition according to the second embodiment may contain, in addition to the components described above, various additives such as an ion exchanger, a mold release agent, a flame retardant, a colorant, and a stress relaxation agent.
• various additives such as an ion exchanger, a mold release agent, a flame retardant, a colorant, and a stress relaxation agent.
• the details of the various additives are the same as the details of the various additives used in the epoxy resin composition according to the first embodiment.
• the viscosity of the epoxy resin composition is not particularly limited. Since the likelihood of wire flow during molding varies depending on the molding method, the composition of the epoxy resin composition, and the like, it is preferable to adjust the viscosity to a desired viscosity according to the molding method, the composition of the epoxy resin composition, and the like. For example, in the case of molding an epoxy resin composition by a compression molding method, it is preferably 200 Pa ⁇ s or less at 175 ° C., more preferably 150 Pa ⁇ s or less, from the viewpoint of reducing wire flow, and 100 Pa ⁇ s.
• the following is more preferable, 50 Pa ⁇ s or less is particularly preferable, 16 Pa ⁇ s or less, and 10 Pa ⁇ s or less.
• the lower limit value of the viscosity is not particularly limited, and may be, for example, 5 Pa ⁇ s or more.
• it is preferably 200 Pa ⁇ s or less at 175 ° C., more preferably 150 Pa ⁇ s or less, and 100 Pa -It is further preferable that it is s or less, 68 Pa-s or less may be sufficient, and 54 Pa-s or less may be sufficient.
• the lower limit value of the viscosity is not particularly limited, and may be, for example, 5 Pa ⁇ s or more.
• the viscosity of the epoxy resin composition can be measured by using a Koka flow tester (manufactured by Shimadzu Corporation).
• the thermal conductivity of the epoxy resin composition as a cured product is not particularly limited. From the viewpoint of obtaining the desired heat dissipation, it may be 3.0 W / (m ⁇ K) or more, 4.0 W / (m ⁇ K) or more at room temperature (25 ° C.), or 5 .0 W / (m ⁇ K) or more, 6.0 W / (m ⁇ K) or more, 7.0 W / (m ⁇ K) or more, 8.0 W It may be / (m ⁇ K) or more.
• the upper limit of the thermal conductivity is not particularly limited, and may be 9.0 W / (m ⁇ K).
• the thermal conductivity of the cured product can be measured by a xenon flash (Xe-flash) method (manufactured by NETZSCH, trade name LFA 467 Hyper Flash device).
• the method for preparing the epoxy resin composition according to the first embodiment and the second embodiment is not particularly limited.
• a general method there is a method in which the respective components are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder or the like, cooled, and pulverized. More specifically, there can be mentioned, for example, a method of stirring and mixing the above-mentioned components, kneading with a kneader, roll, extruder or the like which has been heated to 70 ° C. to 140 ° C. in advance, cooling and grinding. .
• the epoxy resin composition may be solid or liquid at normal temperature and normal pressure (for example, 25 ° C., atmospheric pressure), and is preferably solid.
• the shape in the case where the epoxy resin composition is solid is not particularly limited, and examples thereof include powder, granules, tablets and the like. It is preferable from the viewpoint of handleability that the dimensions and mass when the epoxy resin composition is in the form of a tablet be such that the dimensions and mass meet the molding conditions of the package.
• An electronic component device includes a device sealed by the epoxy resin composition according to the first and second embodiments described above.
• a support member such as a lead frame, a wired tape carrier, a wiring board, glass, a silicon wafer, an organic substrate or the like, an element (an active element such as a semiconductor chip, a transistor, a diode or a thyristor, a capacitor, a resistor)
• an element part obtained by mounting a passive element such as a coil, etc. is sealed with an epoxy resin composition.
• the element is fixed on a lead frame, and the terminal portion and the lead portion of the element such as a bonding pad are connected by wire bonding, bumps or the like, and then sealed by transfer molding using an epoxy resin composition.
• Inlined Package DIP
• Plastic Leaded Chip Carrier PLCC
• Quad Flat Package QFP
• Small Outline Package SOP
• Small Outline J-lead package SOJ
• Thin Small Outline Package TSOP
• General resin-sealed type IC such as TQFP (Thin Quad Flat Package)
• a TCP (Tape Carrier Package) having a structure sealed with a resin composition; a device connected by wire bonding, flip chip bonding, solder or the like to a wiring formed on a support member is sealed with an epoxy resin composition Chip-on-board (COB) modules, hybrid ICs, multi-chip modules, etc.
• COB Chip-on-board
• a BGA All Grid Array
• CSP Chip Size Package
• MCP Multi Chip Package
• an epoxy resin composition can be used suitably also in a printed wiring board.
• H1 H-4 (trade name) manufactured by Meiwa Kasei Co., Ltd.
• H2 Harddener 2 (H2)] SN-485 (trade name) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.
• H3 Harddener 3 (H3)] MEH-8151 SS (trade name) manufactured by Meiwa Chemical Co., Ltd.
• Table 1 and Table 2 were blended in the amounts shown in the same table (unit: mass parts), thoroughly mixed by a mixer, and then melt-kneaded at 100 ° C. for 2 minutes using a twin-screw kneader. Next, the melt was cooled, and then solidified to obtain a powdery epoxy resin composition by grinding into a powder.
• the blank indicates that the component is not blended, and "-" indicates that the evaluation has not been performed.
• the produced epoxy resin composition was evaluated by the various tests shown below. The evaluation results are shown in Tables 1 and 2.
• molding of the epoxy resin composition as described in Examples A-1 to A-7 and Comparative Examples A-1 to A-3 uses a compression molding machine, and Examples A-8 to A-17 and Comparative Example A are used.
• a transfer molding machine was used for the molding of -4 to A-5.
• the molding temperature is 175 ° C. by a transfer molding machine (manual press Y-1 manufactured by TOWA Co., Ltd.)
• the package was sealed under a molding condition of 120 seconds and post-cured at 175 ° C. for 5 hours to obtain a semiconductor device.
• This semiconductor device is a ball grid array (BGA) package (resin-encapsulated portion size: 50 mm ⁇ 50 mm ⁇ thickness 0.7 mm), and the chip size is 7.5 mm ⁇ 7.5 mm.
• BGA ball grid array
• the wire has a gold wire diameter of 22 ⁇ m and an average gold wire length of 3 mm. Then, using the soft X-ray analyzer, the produced package was observed for the deformed state of the gold wire, and the presence or absence of the deformation was examined.
• the flip chip bump size is 60 ⁇ m which is a total of 45 ⁇ m of Cu pillars and 15 ⁇ m of solder bumps.
• a material having a good filling property is A
• a material having an unfilled portion such as a void is C.
• the epoxy resin composition of the example containing a silane compound having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom has a lower viscosity than the comparative example. It was found that the incidence of wire flow was reduced.
• the epoxy resin composition of the example containing a silane compound having a structure in which a chain hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom has a filling property when it is used for a mold underfill by a compression molding method. It turned out that it is excellent. Further, in particular, when the carbon number of the chain hydrocarbon group is 8 or more, the heat conductivity of the cured product tends to be excellent.
• Example according to the second embodiment >> ⁇ Production of Resin Composition> First, each component shown below was prepared.
• the thermal conductivity of the inorganic fillers 1 to 3 is all 20 W / (m ⁇ K) or more.
• Table 3 and Table 4 were blended in the amounts shown in the same table (unit: mass parts), sufficiently mixed by a mixer, and then melt-kneaded at 100 ° C. for 2 minutes using a twin-screw kneader. Next, the melt was cooled, and then solidified to obtain a powdery epoxy resin composition by grinding into a powder.
• the blank indicates that the component is not blended, and "-" indicates that the evaluation has not been performed.
• the produced epoxy resin composition was evaluated by the various tests shown below. The evaluation results are shown in Tables 3 and 4.
• a transfer molding machine was used for molding of Examples B-1 to B-10 and Comparative Examples B-1 to B-2.
• the package is sealed with a transfer molding machine (manual press Y-1 manufactured by TOWA Co., Ltd.) at a molding temperature of 175 ° C. and a molding time of 120 seconds, 175 ° C.
• the semiconductor device was obtained by post-curing for 5 hours.
• This semiconductor device is a ball grid array (BGA) package (resin-encapsulated portion size: 50 mm ⁇ 50 mm ⁇ thickness 0.7 mm), and the chip size is 7.5 mm ⁇ 7.5 mm.
• the wire has a gold wire diameter of 22 ⁇ m and an average gold wire length of 3 mm. Then, using the soft X-ray analyzer, the produced package was observed for the deformed state of the gold wire, and the presence or absence of the deformation was examined.
• the epoxy resin composition of the examples containing alumina and a silane compound having a structure in which a linear hydrocarbon group having 6 or more carbon atoms is bonded to a silicon atom has a low viscosity and a cured product. It was found that the thermal conductivity was excellent when In particular, when the carbon number of the chain hydrocarbon group is 8 or more, the thermal conductivity of the cured product is improved.

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