JP7375541B2 - エポキシ樹脂組成物、及び電子部品装置 - Google Patents

エポキシ樹脂組成物、及び電子部品装置 Download PDF

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Publication number
JP7375541B2
JP7375541B2 JP2019542000A JP2019542000A JP7375541B2 JP 7375541 B2 JP7375541 B2 JP 7375541B2 JP 2019542000 A JP2019542000 A JP 2019542000A JP 2019542000 A JP2019542000 A JP 2019542000A JP 7375541 B2 JP7375541 B2 JP 7375541B2
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JP
Japan
Prior art keywords
epoxy resin
resin composition
group
inorganic filler
chain hydrocarbon
Prior art date
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Active
Application number
JP2019542000A
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English (en)
Japanese (ja)
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JPWO2019054217A1 (ja
Inventor
東哲 姜
光昭 襖田
泰典 川端
賢一 山中
静花 柴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2019054217A1 publication Critical patent/JPWO2019054217A1/ja
Priority to JP2023184277A priority Critical patent/JP2024012392A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
JP2019542000A 2017-09-15 2018-08-31 エポキシ樹脂組成物、及び電子部品装置 Active JP7375541B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023184277A JP2024012392A (ja) 2017-09-15 2023-10-26 エポキシ樹脂組成物、及び電子部品装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017178300 2017-09-15
JP2017178299 2017-09-15
JP2017178299 2017-09-15
JP2017178300 2017-09-15
PCT/JP2018/032497 WO2019054217A1 (ja) 2017-09-15 2018-08-31 エポキシ樹脂組成物、及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023184277A Division JP2024012392A (ja) 2017-09-15 2023-10-26 エポキシ樹脂組成物、及び電子部品装置

Publications (2)

Publication Number Publication Date
JPWO2019054217A1 JPWO2019054217A1 (ja) 2020-10-29
JP7375541B2 true JP7375541B2 (ja) 2023-11-08

Family

ID=65722750

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JP2019542000A Active JP7375541B2 (ja) 2017-09-15 2018-08-31 エポキシ樹脂組成物、及び電子部品装置
JP2023184277A Pending JP2024012392A (ja) 2017-09-15 2023-10-26 エポキシ樹脂組成物、及び電子部品装置

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JP2023184277A Pending JP2024012392A (ja) 2017-09-15 2023-10-26 エポキシ樹脂組成物、及び電子部品装置

Country Status (5)

Country Link
JP (2) JP7375541B2 (zh)
CN (2) CN116751438A (zh)
MY (1) MY198096A (zh)
TW (1) TWI839335B (zh)
WO (1) WO2019054217A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020063343A (ja) * 2018-10-16 2020-04-23 日東シンコー株式会社 樹脂組成物
JP2020117625A (ja) 2019-01-24 2020-08-06 株式会社Adeka 組成物及び硬化物
KR20230061411A (ko) * 2020-09-03 2023-05-08 가부시끼가이샤 레조낙 콤파운드, 성형체, 및 콤파운드의 경화물
JP7552161B2 (ja) 2020-09-03 2024-09-18 株式会社レゾナック コンパウンド、成形体、及びコンパウンドの硬化物
TWI772106B (zh) * 2021-07-14 2022-07-21 福思材料股份有限公司 導熱材料

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004292591A (ja) 2003-03-26 2004-10-21 Matsushita Electric Works Ltd 光半導体用樹脂組成物及び光半導体装置
WO2010084939A1 (ja) 2009-01-23 2010-07-29 味の素株式会社 樹脂組成物
JP2012077172A (ja) 2010-09-30 2012-04-19 Sekisui Chem Co Ltd 樹脂組成物、樹脂シート及び積層構造体
JP2015044898A (ja) 2013-08-27 2015-03-12 日立化成株式会社 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JP2016219600A (ja) 2015-05-20 2016-12-22 京セラ株式会社 半導体用ダイアタッチペースト及び半導体装置
JP2017036377A (ja) 2015-08-07 2017-02-16 味の素株式会社 樹脂組成物
WO2017191801A1 (ja) 2016-05-06 2017-11-09 Dic株式会社 樹脂組成物、成形体、積層体及び接着剤

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101090654B1 (ko) * 2006-10-02 2011-12-07 히다치 가세고교 가부시끼가이샤 밀봉용 에폭시 수지 성형 재료 및 전자 부품 장치
CN103517948A (zh) * 2011-05-13 2014-01-15 日立化成株式会社 密封用环氧树脂成形材料及电子部件装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004292591A (ja) 2003-03-26 2004-10-21 Matsushita Electric Works Ltd 光半導体用樹脂組成物及び光半導体装置
WO2010084939A1 (ja) 2009-01-23 2010-07-29 味の素株式会社 樹脂組成物
JP2012077172A (ja) 2010-09-30 2012-04-19 Sekisui Chem Co Ltd 樹脂組成物、樹脂シート及び積層構造体
JP2015044898A (ja) 2013-08-27 2015-03-12 日立化成株式会社 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JP2016219600A (ja) 2015-05-20 2016-12-22 京セラ株式会社 半導体用ダイアタッチペースト及び半導体装置
JP2017036377A (ja) 2015-08-07 2017-02-16 味の素株式会社 樹脂組成物
WO2017191801A1 (ja) 2016-05-06 2017-11-09 Dic株式会社 樹脂組成物、成形体、積層体及び接着剤

Also Published As

Publication number Publication date
CN111094450A (zh) 2020-05-01
WO2019054217A1 (ja) 2019-03-21
TWI839335B (zh) 2024-04-21
MY198096A (en) 2023-07-31
TW201920450A (zh) 2019-06-01
JP2024012392A (ja) 2024-01-30
JPWO2019054217A1 (ja) 2020-10-29
CN116751438A (zh) 2023-09-15

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