MY198096A - Epoxy resin composition and electronic component device - Google Patents
Epoxy resin composition and electronic component deviceInfo
- Publication number
- MY198096A MY198096A MYPI2020001352A MYPI2020001352A MY198096A MY 198096 A MY198096 A MY 198096A MY PI2020001352 A MYPI2020001352 A MY PI2020001352A MY PI2020001352 A MYPI2020001352 A MY PI2020001352A MY 198096 A MY198096 A MY 198096A
- Authority
- MY
- Malaysia
- Prior art keywords
- epoxy resin
- resin composition
- electronic component
- component device
- bound
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 229910000077 silane Inorganic materials 0.000 abstract 1
- -1 silane compound Chemical class 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017178300 | 2017-09-15 | ||
| JP2017178299 | 2017-09-15 | ||
| PCT/JP2018/032497 WO2019054217A1 (ja) | 2017-09-15 | 2018-08-31 | エポキシ樹脂組成物、及び電子部品装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY198096A true MY198096A (en) | 2023-07-31 |
Family
ID=65722750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2020001352A MY198096A (en) | 2017-09-15 | 2018-08-31 | Epoxy resin composition and electronic component device |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP7375541B2 (zh) |
| CN (2) | CN116751438A (zh) |
| MY (1) | MY198096A (zh) |
| WO (1) | WO2019054217A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020063343A (ja) * | 2018-10-16 | 2020-04-23 | 日東シンコー株式会社 | 樹脂組成物 |
| JPWO2022050170A1 (zh) * | 2020-09-03 | 2022-03-10 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004292591A (ja) | 2003-03-26 | 2004-10-21 | Matsushita Electric Works Ltd | 光半導体用樹脂組成物及び光半導体装置 |
| US8084130B2 (en) * | 2006-10-02 | 2011-12-27 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing and electronic component device |
| TWI504662B (zh) * | 2009-01-23 | 2015-10-21 | Ajinomoto Kk | Resin composition |
| JP5520183B2 (ja) * | 2010-09-30 | 2014-06-11 | 積水化学工業株式会社 | 樹脂組成物、樹脂シート及び積層構造体 |
| CN103517948A (zh) * | 2011-05-13 | 2014-01-15 | 日立化成株式会社 | 密封用环氧树脂成形材料及电子部件装置 |
| JP6183061B2 (ja) * | 2013-08-27 | 2017-08-23 | 日立化成株式会社 | 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置 |
| JP6675155B2 (ja) | 2015-05-20 | 2020-04-01 | 京セラ株式会社 | 半導体用ダイアタッチペースト及び半導体装置 |
| JP6672630B2 (ja) * | 2015-08-07 | 2020-03-25 | 味の素株式会社 | 樹脂組成物 |
| WO2017191801A1 (ja) | 2016-05-06 | 2017-11-09 | Dic株式会社 | 樹脂組成物、成形体、積層体及び接着剤 |
-
2018
- 2018-08-31 CN CN202310717825.4A patent/CN116751438A/zh active Pending
- 2018-08-31 MY MYPI2020001352A patent/MY198096A/en unknown
- 2018-08-31 JP JP2019542000A patent/JP7375541B2/ja active Active
- 2018-08-31 CN CN201880059554.5A patent/CN111094450A/zh active Pending
- 2018-08-31 WO PCT/JP2018/032497 patent/WO2019054217A1/ja active Application Filing
-
2023
- 2023-10-26 JP JP2023184277A patent/JP2024012392A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019054217A1 (ja) | 2019-03-21 |
| JPWO2019054217A1 (ja) | 2020-10-29 |
| JP2024012392A (ja) | 2024-01-30 |
| CN116751438A (zh) | 2023-09-15 |
| CN111094450A (zh) | 2020-05-01 |
| JP7375541B2 (ja) | 2023-11-08 |
| TW201920450A (zh) | 2019-06-01 |
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