WO2019033566A1 - 柔性基板剥离装置及剥离方法 - Google Patents
柔性基板剥离装置及剥离方法 Download PDFInfo
- Publication number
- WO2019033566A1 WO2019033566A1 PCT/CN2017/108690 CN2017108690W WO2019033566A1 WO 2019033566 A1 WO2019033566 A1 WO 2019033566A1 CN 2017108690 W CN2017108690 W CN 2017108690W WO 2019033566 A1 WO2019033566 A1 WO 2019033566A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tape
- wheel
- flexible substrate
- peeling
- adhesive tape
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 222
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000011521 glass Substances 0.000 claims abstract description 62
- 239000002390 adhesive tape Substances 0.000 claims abstract description 61
- 238000011084 recovery Methods 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 5
- 229920001621 AMOLED Polymers 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present invention relates to the field of flexible device manufacturing technologies, and in particular, to a flexible substrate stripping device and a peeling method.
- a flexible display As an example, it is a method for preparing a device on a substrate surface composed of a flexible material, such as a flexible active matrix organic light emitting diode or an active matrix organic light emitting diode (AMOLED).
- AMOLED active matrix organic light emitting diode
- the flexible substrate needs to be prepared or adsorbed on the surface of the hard substrate, and then the flexible substrate is peeled off from the hard substrate after the device is prepared. Therefore, how to effectively peel the flexible substrate from the rigid substrate is one of the key technologies for producing flexible devices.
- the mainstream flexible AMOLED stripping method is performed by laser ablation, that is, a high-intensity laser is applied at the interface between the polymer flexible substrate and the rigid glass substrate to ablate the polymer of the interface layer, thereby realizing the flexible substrate and the rigid glass substrate. Stripping.
- a high-intensity laser is applied at the interface between the polymer flexible substrate and the rigid glass substrate to ablate the polymer of the interface layer, thereby realizing the flexible substrate and the rigid glass substrate. Stripping.
- the polymer of the interface layer is laser ablated, there is a slight adhesion between the flexible substrate and the rigid glass substrate. Therefore, in order to ensure that the flexible substrate is not damaged, an additional peeling measure is required to achieve gentle and effective peeling of the flexible substrate and the rigid glass substrate.
- Embodiments of the present invention provide a flexible substrate peeling device and a peeling method, which can realize gentle and effective peeling of a flexible substrate and a glass substrate by pulling a tape, and improve a peeling process of the flexible substrate.
- the yield, and the flexible substrate stripping device has a simple structure, no additional cost, and low cost.
- an embodiment of the present invention provides a flexible substrate stripping device for peeling a flexible substrate from a glass substrate, the flexible substrate stripping device comprising a tape conveying wheel, a tape collecting wheel, a peeling roller and a tape,
- the tape transporting wheel is axially rotated to convey the tape, the tape comprising oppositely disposed first and second surfaces, the surface of the peeling roller being in contact with the second surface of the tape, the peeling roller being parallel Moving and pressing the flexible substrate in a direction of the glass substrate, such that the flexible substrate is adhered to the first surface of the adhesive tape, and the tape recovery wheel is axially rotated to drive the adhesive tape to adhere thereto.
- the flexible substrate on the first surface of the tape is peeled off from the glass substrate.
- the position between the tape conveying wheel and the peeling roller is provided with a first tape guiding wheel
- a position between the tape collecting wheel and the peeling roller is provided with a second tape guiding wheel
- the first The tape guiding wheel and the second tape guiding wheel are axially rotated to convey the tape
- the arrangement of the first tape guiding wheel and the second tape guiding wheel are further for ensuring that the flexible substrate is in close contact with the tape On the first surface.
- the conveying start end of the tape is connected to the tape conveying wheel, and the conveying end of the tape is connected to the tape collecting wheel, the tape conveying wheel, the first tape guiding wheel, the peeling roller, the The second tape guide wheel and the tape recovery wheel are disposed in order from right to left.
- the peeling roller moves to the right in a direction parallel to the glass substrate; the tape conveying wheel, the tape collecting wheel, the peeling roller, the first tape guiding wheel and the second tape
- the guide wheels rotate in a clockwise direction about their respective axes of rotation.
- the positions of the tape conveying wheel, the tape collecting wheel, the first tape guiding wheel and the second tape guiding wheel are not movable.
- the tape recovery wheel is axially rotated to recover the tape.
- a flexible device is prepared on the flexible substrate.
- the adhesive tape is an adhesive tape which can be degreased by ultraviolet light.
- the flexible substrate stripping device further comprises an ultraviolet light emitting device that emits ultraviolet light to illuminate the first surface of the adhesive tape such that the first surface of the adhesive tape loses viscosity, thereby causing the flexible substrate Peel off from the tape.
- an embodiment of the present invention further provides a peeling method for peeling a flexible substrate from a glass substrate, the peeling method comprising:
- a flexible substrate stripping device including a tape conveying wheel, a tape collecting wheel, a peeling roller, a tape, and an ultraviolet light emitting device;
- the tape recovery wheel is controlled to rotate at a third predetermined rotational speed to recover the tape.
- the flexible substrate stripping device and the stripping method of the present invention the flexible substrate is adhered to the adhesive surface of the tape which can be degreased by ultraviolet light, and the flexible substrate and the glass substrate are gently and effectively peeled off by the pulling of the tape, and then the ultraviolet light is used. Irradiating the adhesive surface of the adhesive tape, causing the adhesive surface of the adhesive tape to lose its viscosity, thereby peeling the flexible substrate from the adhesive tape, improving the yield of the flexible substrate peeling process, and the flexible substrate peeling device
- the structure is simple, no additional cost, and the cost is low.
- FIG. 1 is a schematic front structural view of a flexible substrate stripping device according to an embodiment of the present invention.
- FIG. 2 is a schematic view showing the operation direction of each component of the flexible substrate peeling device shown in FIG. 1.
- FIG. 3 is a flow chart showing a peeling method for peeling a flexible substrate from a glass substrate using the flexible substrate peeling device shown in FIG. 1.
- connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined.
- the ground connection, or the integral connection may be a mechanical connection; it may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
- the specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.
- Embodiments of the present invention provide a flexible substrate stripping device capable of achieving gentle and effective peeling of a flexible substrate and a glass substrate by tape pulling, thereby improving product yield.
- the flexible substrate stripping device has a simple structure, no additional cost, and low cost.
- the flexible substrate peeling device and the peeling method provided by the embodiments of the present invention are respectively described in detail below with reference to FIGS.
- FIG. 1 is a schematic front structural view of a flexible substrate stripping device according to an embodiment of the present invention.
- the flexible substrate peeling device 10 of the embodiment of the present invention is used to peel the flexible substrate 20 from the glass substrate 30.
- the flexible substrate 20 is disposed on the glass substrate 30, that is, the first surface (ie, the lower surface) of the flexible substrate 20 is covered on the glass substrate 30.
- a flexible device (not shown) is prepared on the second surface (ie, the upper surface) of the flexible substrate 20, in an embodiment of the present invention,
- the flexible device includes, but is not limited to, an Organic Light-Emitting Diode (OLED), a Thin Film Transistor (TFT), and the like.
- OLED Organic Light-Emitting Diode
- TFT Thin Film Transistor
- the flexible substrate peeling device 10 includes a tape conveying wheel 11, a tape collecting wheel 12, a peeling roller 13, a first tape guiding wheel 14, a second tape guiding wheel 15, and Tape 16.
- the tape conveying wheel 11 and the tape collecting wheel 12 can be axially rotated. Specifically, the tape carrying wheel 11 and the tape collecting wheel 12 can be rotated in a clockwise direction or in a counterclockwise direction about their rotation axis. However, the positions of the tape conveying wheel 11 and the tape collecting wheel 12 are not movable, that is, the positions of the tape conveying wheel 11 and the tape collecting wheel 12 in the flexible substrate peeling device 10 are fixed. Further, the tape conveying wheel 11 can be axially rotated to convey the tape 16, and the conveying start end of the tape 16 is connected to the tape conveying wheel 11, that is, the tape conveying wheel 11 is also used. The tape 16 is supplied; the tape recovery wheel 12 can be axially rotated to drive the tape, and the transfer end of the tape 16 is connected to the tape recovery wheel 12, that is, the tape recovery wheel 12 is also used to recover the tape 16.
- the tape 16 includes opposite first and second surfaces.
- the first surface (ie, the adhesive side) of the tape 16 is disposed downwardly and aligned with the flexible substrate 20, the second surface of the tape 16 being disposed upwardly.
- the peeling roller 13 can be rotated in the axial direction. Specifically, the peeling roller 13 can be rotated in the clockwise direction or in the counterclockwise direction about its rotation axis. Also, the position of the peeling roller 13 can be moved, that is, the position of the peeling roller 13 in the flexible substrate peeling device 10 can be changed. Wherein the peeling roller 13 is located between the tape conveying wheel 11 and the tape collecting wheel 12, and the surface of the peeling roller 13 is in contact with the second surface of the tape 16, the peeling roller 13 The axial direction is perpendicular to the conveying direction of the tape 16. Specifically, the peeling roller 13 may move in a vertical direction with respect to the flexible substrate 20 and be close to the flexible substrate 20. Further, the peeling roller 13 may also move and press the flexible substrate 20 in a direction parallel to the glass substrate 30 such that the flexible substrate 20 is adhered to the first surface of the tape 16.
- first tape guiding wheel 14 and the second tape guiding wheel 15 are axially rotatable. With Body, the first tape guide wheel 14 and the second tape guide wheel 15 can be rotated in a clockwise direction or in a counterclockwise direction about their rotation axis. However, the positions of the first tape guiding wheel 14 and the second tape guiding wheel 15 are immovable, that is, the first tape guiding wheel 14 and the second tape guiding wheel 15 are in the flexible substrate peeling device 10 The position in the middle is fixed. Further, the first tape guiding wheel 14 and the second tape guiding wheel 15 may be axially rotated to convey the tape 16.
- the first tape guiding wheel 14 is located between the tape conveying wheel 11 and the peeling roller 13, and the second tape guiding wheel 15 is located at the tape collecting wheel 12 and The position between the peeling rolls 13. Thereby, the arrangement of the first tape guiding wheel 14 and the second tape guiding wheel 15 can further ensure that the flexible substrate 20 is in close contact with the first surface of the tape 16.
- the tape recovery wheel 12 can be axially rotated to drive the tape 16 such that the flexible substrate 20 adhered to the first surface of the tape 16 is peeled off from the glass substrate 30. After the flexible substrate 20 is peeled off from the glass substrate 30, the glass substrate 30 may be discarded.
- the tape conveying wheel 11, the first tape guiding wheel 14, the peeling roller 13, the second tape guiding wheel 15, and the tape collecting wheel 12 are sequentially from right to left. Set, the center lines are connected to form a "U" shape.
- the roller 13, the first tape guide wheel 14, and the second tape guide wheel 15 both rotate in a clockwise direction about respective rotation axes.
- the peeling roller 13 moves to the right in a direction parallel to the glass substrate 30.
- the tape 16 is an adhesive tape that can be degreased by ultraviolet light.
- the adhesive film thickness of the tape 16 is 25 um.
- the strength of the tear-off form of the tape 16 was 1.2 kg/in2.
- the flexible substrate stripping device 10 further includes an ultraviolet light emitting device (not shown).
- the ultraviolet light emitting device may be The first surface of the tape 16 is emitted by ultraviolet light, and the first surface of the tape 16 loses its viscosity under the irradiation of the ultraviolet light. Thereby, the film on the first surface of the tape 16 falls off. It should be noted that when the tape 16 is degummed by ultraviolet light debonding, the phenomenon of residual film does not occur. Thereby, the flexible substrate 20 can be further peeled off from the tape 16. So far, the process of peeling off the flexible substrate 20 is finally completed.
- the ultraviolet light is emitted The emitting device emits the ultraviolet light to illuminate the first surface of the tape 16 for a duration of 10 s.
- the tape recovery wheel 12 can recover the used tape 16 after the flexible substrate 20 and the tape 16 are peeled off.
- the flexible substrate stripping device 10 further includes a mounting portion (not shown) for implementing mounting and fixing of the flexible substrate stripping device 10 and driving the tape.
- the wheel 11, the tape recovery wheel 12, the peeling roller 13, the first tape guide wheel 14, and the second tape guide wheel 15 rotate in a clockwise direction or in a counterclockwise direction about respective rotation axes,
- the peeling roller 13 may also be moved upward or downward in the vertical direction with respect to the flexible substrate 20, and the peeling roller 13 may be driven in a direction parallel to the flexible substrate 20 (or the glass substrate 30).
- the flexible substrate 20 can be peeled off from the glass substrate 30 by moving left or right.
- the mounting portion can also move the ultraviolet light emitting device relative to the flexible substrate 20, that is, the flexible substrate 20 can be peeled off from the tape 16.
- the flexible substrate stripping device 10 further includes a carrying portion (not shown) for carrying the flexible substrate 20 disposed on the glass substrate 30, the bearing The portion is also used to carry the flexible substrate 20 adhered to the first surface of the tape 16 that has been peeled off from the glass substrate 30.
- a laser peeling layer (not shown) is disposed between the flexible substrate 20 and the glass substrate 30.
- the material of the laser lift-off layer is a polymer containing an imide group (-CO-N-CO-) as a main chain (ie, polyimide (PI)).
- PI polyimide
- the material of the flexible substrate 20 and the laser lift-off layer are the same.
- the laser has an energy density of 270-300 mJ/cm 2 , an overlap ratio of the laser of 50%, and a wavelength of the laser of 308 nm or 343 nm.
- the flexible substrate 20 After ablation of the laser lift-off layer with the laser, there is a slight intermolecular force between the flexible substrate 20 and the glass substrate 30. Further, only a small amount of air exists between the laser peeling layer and the glass substrate 30, and a large negative pressure exists when the large-sized flexible substrate 20 is peeled off. Therefore, in mining After ablating the laser lift-off layer with the laser, there is a slight adhesion between the flexible substrate 20 and the glass substrate 30. At this time, the flexible substrate 20 is adhered to the adhesive tape 16 which can be degreased by ultraviolet light by using the flexible substrate peeling device 10 as shown in FIG. 1. First, the flexible substrate 20 can be damaged without being damaged by the pulling of the tape 16.
- the mild and effective peeling of the flexible substrate 20 and the glass substrate 30 is further realized, and then the peeling of the flexible substrate 20 and the adhesive tape 16 is realized by ultraviolet light debonding of the adhesive tape 16, thereby finally The process of peeling off the flexible substrate 20 is completed.
- FIG. 3 is a flow chart of a peeling method for peeling a flexible substrate from a glass substrate using the flexible substrate peeling device shown in FIG. 1.
- the stripping method of the embodiment of the invention comprises the following steps:
- S1 Control the tape conveying wheel to rotate at a first predetermined rotation speed to supply the tape.
- the tape transport wheel 11 is rotated in a clockwise direction at a first predetermined rotational speed to supply a new tape (i.e., the unused tape 16).
- a new tape i.e., the unused tape 16.
- S2 controlling the peeling roller to move in a direction parallel to the glass substrate and pressing the flexible substrate such that the flexible substrate is adhered to the first surface of the adhesive tape.
- the tape 16 includes opposite first and second surfaces.
- the glass roll 13 is in contact with the second surface of the tape 16.
- the first surface of the tape 16 is the adhesive side of the tape 16. That is, the flexible substrate 20 is adhered to the adhesive surface of the tape 16.
- the stripping method further includes controlling the glass roll 13 to move in a vertical direction relative to the glass substrate 30 and to be adjacent to the flexible substrate 20. Further, the peeling roller 13 moves from left to right in a direction parallel to the glass substrate 30 and presses the flexible substrate 20 such that the flexible substrate 20 is adhered to the first surface of the tape 16 on.
- first tape guiding wheel 14 is located between the tape conveying wheel 11 and the peeling roller 13
- second tape guiding wheel 15 is located at the tape collecting wheel 12 and the peeling roller 13 The location between.
- S3 controlling the tape recovery wheel to rotate at a second predetermined rotation speed to drive the tape, so that the flexible substrate adhered to the first surface of the tape is peeled off from the glass substrate.
- the tape recovery wheel 12 also rotates clockwise about its axis of rotation. Due to the The flexible substrate 20 is adhered to the first surface of the tape 16, so that when the tape recovery wheel 12 is rotated in a clockwise direction at a second predetermined rotation speed to drive the tape 16, the pulling by the tape 16 can be The flexible substrate 20 adhered to the first surface of the tape 16 is peeled off from the glass substrate 30.
- S4 controlling the ultraviolet light emitting device to emit ultraviolet light to illuminate the first surface of the adhesive tape, such that the first surface of the adhesive tape loses adhesiveness, thereby peeling off the flexible substrate from the adhesive tape.
- the flexible substrate 20 is peeled off from the glass substrate 30, the flexible substrate 20 is still adhered to the first surface of the tape 16.
- the adhesive tape 16 is an adhesive tape that can be degreased by ultraviolet light
- the ultraviolet light emitting device can be controlled to emit ultraviolet light to illuminate the first surface of the adhesive tape 16 such that the first surface of the adhesive tape 16 is in the ultraviolet light. Loss of viscosity under the illumination. Thereby, the film on the first surface of the tape 16 falls off, causing the flexible substrate 20 to peel off from the tape 16.
- the tape recovery wheel 12 is connected to the transfer end of the tape 16. Thus, the tape recovery wheel 12 can be rotated axially to recover waste tape (i.e., used tape 16). In an embodiment of the invention, after the flexible substrate 20 is peeled from the tape 16, the tape recovery wheel 12 is rotated in a clockwise direction at a third predetermined rotational speed to recover the tape 16.
- the flexible substrate stripping device and the stripping method thereof of the present invention after the first peeling of the flexible substrate and the glass substrate by using the laser stripping technology, the flexible substrate is adhered to the adhesive surface of the adhesive tape which can be degreased by ultraviolet light, and the adhesive tape is passed through the adhesive tape. Pulling further realizes gentle and effective peeling of the flexible substrate and the glass substrate, and then irradiating the adhesive surface of the adhesive tape with ultraviolet light, so that the adhesive surface of the adhesive tape loses adhesiveness, thereby peeling off the flexible substrate from the adhesive tape
- the yield of the flexible substrate stripping process is improved, and the flexible substrate stripping device has a simple structure, no additional cost, and low cost.
Abstract
提供一种柔性基板剥离装置（10），用于将柔性基板（20）从玻璃基板（30）上剥离，柔性基板剥离装置（10）包括胶带输送轮（11）、胶带回收轮（12）、剥离辊（13）和胶带（16），胶带输送轮（11）轴向转动以传送胶带（16），胶带（16）包括相对设置的第一表面和第二表面，剥离辊（13）的表面与胶带（16）的第二表面相接触，剥离辊（13）沿着平行于玻璃基板（30）的方向移动并压紧柔性基板（20），使得柔性基板（20）黏贴在胶带（16）的第一表面上，胶带回收轮（12）轴向转动以带动胶带（16），使得黏贴在胶带（16）的第一表面上的柔性基板（20）从玻璃基板（30）上剥离。该柔性基板剥离装置（10）能通过胶带（16）牵拉实现柔性基板（20）和玻璃基板（30）的温和有效剥离，提高了柔性基板剥离工艺的良率。还提供了一种剥离方法。
Description
本申请要求2017年08月17日递交的发明名称为“柔性基板剥离装置及剥离方法”的申请号为2017107086011的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
本发明涉及柔性器件制造技术领域，尤其涉及一种柔性基板剥离装置及一种剥离方法。
随着科技的不断更新与发展，采用柔性基板制成的可弯曲的柔性器件有望成为下一代光电子器件的主流设备，如显示器、芯片、电路、电源、传感器等柔性器件可以实现传统光电子器件所不能实现的功能或用户体验的优势。以柔性显示为例，它是一种在柔性材料构成的基板表面制备器件的方法，如柔性有源矩阵有机发光二极体或主动矩阵有机发光二极体(Active-Matrix Organic Light Emitting Diode，AMOLED)，需要在硬质基板表面先制备或吸附柔性基板，继而进行器件制备后再将柔性基板从硬质基板上剥离。因此，如何将柔性基板与硬质基板的有效剥离是生产柔性器件的关键技术之一。
目前主流的柔性AMOLED剥离方式是采用激光烧蚀的方式进行，即在聚合物柔性基板和刚性玻璃基板的界面施加高强度的激光，烧蚀界面层的聚合物，从而实现柔性基板和刚性玻璃基板的剥离。但是，在采用激光烧蚀界面层的聚合物之后，所述柔性基板和所述刚性玻璃基板之间还有轻微粘着力。因此，为了确保不损伤柔性基板，需要采取额外的剥离措施来实现柔性基板和刚性玻璃基板的温和有效剥离。
发明内容
本发明实施例提供一种柔性基板剥离装置及一种剥离方法，其能通过胶带的牵拉实现柔性基板和玻璃基板的温和有效剥离，提高了柔性基板剥离工艺的
良率，而且所述柔性基板剥离装置的结构简单，未额外增加费用，成本较低。
第一方面，本发明实施例提供了一种柔性基板剥离装置，用于将柔性基板从玻璃基板上剥离，所述柔性基板剥离装置包括胶带输送轮、胶带回收轮、剥离辊和胶带，所述胶带输送轮轴向转动以传送所述胶带，所述胶带包括相对设置的第一表面和第二表面，所述剥离辊的表面与所述胶带的第二表面相接触，所述剥离辊沿着平行于所述玻璃基板的方向移动并压紧所述柔性基板，使得所述柔性基板黏贴在所述胶带的第一表面上，所述胶带回收轮轴向转动以带动所述胶带使得黏贴在所述胶带的第一表面上的柔性基板从所述玻璃基板上剥离。
其中，所述胶带输送轮和所述剥离辊之间的位置设置有第一胶带导向轮，所述胶带回收轮和所述剥离辊之间的位置设置有第二胶带导向轮，所述第一胶带导向轮和所述第二胶带导向轮轴向转动以传送所述胶带，所述第一胶带导向轮和所述第二胶带导向轮的设置还用于确保所述柔性基板紧贴在所述胶带的第一表面上。
其中，所述胶带的传送始端与所述胶带输送轮相连，所述胶带的传送末端与所述胶带回收轮相连，所述胶带输送轮、所述第一胶带导向轮、所述剥离辊、所述第二胶带导向轮和所述胶带回收轮从右至左依次设置。
其中，所述剥离辊沿着平行于所述玻璃基板的方向向右移动；所述胶带输送轮、所述胶带回收轮、所述剥离辊、所述第一胶带导向轮和所述第二胶带导向轮均绕着各自的转轴沿顺时针方向转动。
其中，所述胶带输送轮、所述胶带回收轮、所述第一胶带导向轮和所述第二胶带导向轮的位置不可移动。
其中，所述胶带回收轮轴向转动以回收所述胶带。
其中，所述柔性基板上制备有柔性器件。
其中，所述胶带为可用紫外光照解胶的胶带。
其中，所述柔性基板剥离装置还包括紫外光发射装置，所述紫外光发射装置发射紫外光照射所述胶带的第一表面，使得所述胶带的第一表面失去粘性，从而使得所述柔性基板从所述胶带上剥离。
第二方面，本发明实施例还提供了一种剥离方法，其用于将柔性基板从玻璃基板上剥离，所述剥离方法包括：
提供一柔性基板剥离装置，包括胶带输送轮、胶带回收轮、剥离辊、胶带和紫外光发射装置；
控制所述胶带输送轮以第一预定转速转动以供应所述胶带；
控制所述剥离辊沿着平行于所述玻璃基板的方向移动并压紧所述柔性基板，使得将所述柔性基板黏贴在所述胶带的第一表面上；
控制所述胶带回收轮以第二预定转速转动以带动所述胶带，使得黏贴在所述胶带的第一表面上的所述柔性基板从所述玻璃基板上剥离；
控制所述紫外光发射装置发射紫外光照射所述胶带的第一表面，使得所述胶带的第一表面失去粘性，从而使得所述柔性基板从所述胶带上剥离；
控制所述胶带回收轮以第三预定转速转动以回收所述胶带。
本发明的柔性基板剥离装置及剥离方法，将柔性基板黏贴在可用紫外光照解胶的胶带的粘胶面上，通过胶带的牵拉实现柔性基板和玻璃基板的温和有效剥离，然后使用紫外光照射所述胶带的粘胶面，使得所述胶带的粘胶面失去粘性，从而使得所述柔性基板从所述胶带上剥离，提高了柔性基板剥离工艺的良率，而且该柔性基板剥离装置的结构简单，未额外增加费用，成本较低。
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的柔性基板剥离装置的正面结构示意图。
图2为图1所示柔性基板剥离装置各组成部分的运作方向示意图。
图3为使用图1所示柔性基板剥离装置将柔性基板从玻璃基板上剥离的剥离方法流程图。
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述。显然，所描述的实施方式是本发明的一部分实施方式，
而不是全部实施方式。在本发明中的实施方式，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施方式，都应属在本发明保护的范围。
此外，以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明中所提到的方向用语，例如，“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧面”等，仅是参考附加图式的方向，因此，使用的方向用语是为了更好、更清楚地说明及理解本发明，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸地连接，或者一体地连接；可以是机械连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
此外，在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。若本说明书中出现“工序”的用语，其不仅是指独立的工序，在与其他工序无法明确区别时，只要能实现所述工序所预期的作用则也包括在本用语中。另外，本说明书中用“～”表示的数值范围是指将“～”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中，结构相似或相同的单元用相同的标号表示。
本发明实施例提供了一种柔性基板剥离装置，其能通过胶带牵拉实现柔性基板和玻璃基板的温和有效剥离，提高了产品的良率。此外，该柔性基板剥离装置的结构简单，未额外增加费用，成本较低。以下结合图1-图3对本发明实施例提供的柔性基板剥离装置及剥离方法分别进行详细说明。
请参阅图1，图1为本发明实施例提供的柔性基板剥离装置的正面结构示意图。本发明实施例的柔性基板剥离装置10用于将柔性基板20从玻璃(Glass)基板30上剥离。其中，所述柔性基板20设置在所述玻璃基板30上，即所述柔性基板20的第一表面(即下表面)覆盖在所述玻璃基板30上。所述柔性基板20的第二表面(即上表面)上制备有柔性器件(图未示)，在本发明的实施例中，
所述柔性器件包括但不限于：有机发光二极管(Organic Light-Emitting Diode，OLED)、薄膜晶体管(Thin Film Transistor，TFT)等器件。具体地，在将所述柔性基板20从所述玻璃基板30上剥离时，所述柔性基板20与在其表面上制备的柔性器件作为一个整体从所述玻璃基板30上剥离。
在本发明的实施例中，如图1所示，所述柔性基板剥离装置10包括胶带输送轮11、胶带回收轮12、剥离辊13、第一胶带导向轮14、第二胶带导向轮15和胶带16。
其中，所述胶带输送轮11和所述胶带回收轮12可以轴向转动。具体地，所述胶带输送轮11和所述胶带回收轮12可以绕着其转轴沿顺时针方向转动或沿逆时针方向转动。但是，所述胶带输送轮11和所述胶带回收轮12的位置不可移动，即所述胶带输送轮11和所述胶带回收轮12在所述柔性基板剥离装置10中的位置是固定的。进一步地，所述胶带输送轮11可以轴向转动以传送所述胶带16，并且，所述胶带16的传送始端与所述胶带输送轮11相连，也就是说，所述胶带输送轮11还用于供应所述胶带16；所述胶带回收轮12可以轴向转动以带动所述胶带，并且，所述胶带16的传送末端与所述胶带回收轮12相连，也就是说，所述胶带回收轮12还用于回收所述胶带16。
其中，所述胶带16包括相对设置的第一表面和第二表面。在本发明的实施例中，所述胶带16的第一表面(即粘胶面)向下布置，并对准所述柔性基板20，所述胶带16的第二表面向上布置。
其中，所述剥离辊13可以轴向转动。具体地，所述剥离辊13可以绕着其转轴沿顺时针方向转动或沿逆时针方向转动。并且，所述剥离辊13的位置可以移动，即所述剥离辊13在所述柔性基板剥离装置10中的位置可以改变。其中，所述剥离辊13位于所述胶带输送轮11和所述胶带回收轮12之间的位置，所述剥离辊13的表面与所述胶带16的第二表面相接触，所述剥离辊13的轴向方向与所述胶带16的传送方向相垂直。具体地，所述剥离辊13可以相对于所述柔性基板20沿垂直方向移动并靠近所述柔性基板20。进一步地，所述剥离辊13还可以沿着平行于所述玻璃基板30的方向移动并压紧所述柔性基板20，使得所述柔性基板20黏贴在所述胶带16的第一表面上。
其中，所述第一胶带导向轮14和所述第二胶带导向轮15可以轴向转动。具
体地，所述第一胶带导向轮14和所述第二胶带导向轮15可以绕着其转轴沿顺时针方向转动或沿逆时针方向转动。但是，所述第一胶带导向轮14和所述第二胶带导向轮15的位置不可移动，即所述第一胶带导向轮14和所述第二胶带导向轮15在所述柔性基板剥离装置10中的位置是固定的。进一步地，所述第一胶带导向轮14和所述第二胶带导向轮15可以轴向转动以传送所述胶带16。在本发明的实施例中，所述第一胶带导向轮14位于所述胶带输送轮11和所述剥离辊13之间的位置，所述第二胶带导向轮15位于所述胶带回收轮12和所述剥离辊13之间的位置。从而，所述第一胶带导向轮14和所述第二胶带导向轮15的设置可以进一步确保所述柔性基板20紧贴在所述胶带16的第一表面上。
进一步地，所述胶带回收轮12可以轴向转动以带动所述胶带16使得黏贴在所述胶带16的第一表面上的所述柔性基板20从所述玻璃基板30上剥离。在将所述柔性基板20从所述玻璃基板30上剥离完成之后，所述玻璃基板30可以丢弃。
在本发明一实施方式中，所述胶带输送轮11、所述第一胶带导向轮14、所述剥离辊13、所述第二胶带导向轮15和所述胶带回收轮12从右至左依次设置，其中心线连起来形成“U”字形。
在本发明一实施方式中，在将所述柔性基板20从所述玻璃基板30上剥离的过程中，如图2所示，所述胶带输送轮11、所述胶带回收轮12、所述剥离辊13、所述第一胶带导向轮14和所述第二胶带导向轮15均绕着各自的转轴沿顺时针方向转动。同时，所述剥离辊13沿着平行于所述玻璃基板30的方向向右移动。
在本发明一实施方式中，所述胶带16为可用紫外光照解胶的胶带。其中，所述胶带16的胶膜涂布厚度为25um。此时，所述胶带16撕开形式的强度为1.2kg/in2。
在本发明一实施方式中，所述柔性基板剥离装置10还包括紫外光发射装置(图未示)，在所述柔性基板20和所述玻璃基板30剥离完成之后，所述紫外光发射装置可以发射紫外光所述胶带16的第一表面，所述胶带16的第一表面在所述紫外光的照射下失去粘性。从而，所述胶带16的第一表面上的胶膜脱落。需要说明的是，采用紫外光照解胶的方式对所述胶带16进行解胶时，不会出现残留胶膜的现象。从而，所述柔性基板20可以进一步从所述胶带16上剥离。至此，剥离所述柔性基板20的制程最终完成。在本发明一实施方式中，所述紫外光发
射装置发射所述紫外光照射所述胶带16的第一表面的时长为10s。
需要说明的是，在所述柔性基板20和所述胶带16剥离完成之后，所述胶带回收轮12可以回收已经使用过的所述胶带16。
在本发明一实施方式中，所述柔性基板剥离装置10还包括安装部(图未示)，所述安装部用于实现所述柔性基板剥离装置10的安装固定，并可带动所述胶带输送轮11、所述胶带回收轮12、所述剥离辊13、所述第一胶带导向轮14和所述第二胶带导向轮15绕着各自的转轴沿顺时针方向转动或沿逆时针方向转动，还可带动所述剥离辊13相对所述柔性基板20沿垂直方向向上或向下移动，以及带动所述剥离辊13沿着平行于所述柔性基板20(或者所述玻璃基板30)的方向向左或向右移动，即可将所述柔性基板20从所述玻璃基板30上剥离。所述安装部还可带动所述紫外光发射装置相对所述柔性基板20移动，即可将所述柔性基板20从所述胶带16上剥离。
在本发明一实施方式中，所述柔性基板剥离装置10还包括承载部(图未示)，所述承载部用于承载设置在所述玻璃基板30上的所述柔性基板20，所述承载部还用于承载已经从所述玻璃基板30上剥离的黏贴在所述胶带16的第一表面上的所述柔性基板20。
需要说明的是，所述柔性基板20和玻璃基板30之间设置有激光剥离层(图未示)。在本发明一实施方式中，所述激光剥离层的材质为主链含有酰亚胺基团(-CO-N-CO-)的聚合物(即聚酰亚胺(Polyimide，PI))。并且，所述柔性基板20和所述激光剥离层的材质相同。在采用如图1所示的柔性基板剥离装置10实现所述柔性基板20和所述玻璃基板30的剥离之前，可采用激光剥离(Laser Lift Off，LLO)技术，即采用镭射激光(Light Amplification Stimulated Emission Radiation，LASER)照射所述玻璃基板30的底面以烧蚀所述激光剥离层，从而实现所述柔性基板20和所述玻璃基板30的初次剥离。在本发明一实施方式中，所述激光的能量密度为270-300mJ/cm2，所述激光的重叠率为50％，所述激光的波长为308nm或343nm。
在采用所述激光烧蚀所述激光剥离层之后，所述柔性基板20和所述玻璃基板30之间还有轻微分子间作用力。并且，所述激光剥离层和所述玻璃基板30中间仅存在少量空气，在大尺寸柔性基板20剥离时存在较大负压。因此，在采
用所述激光烧蚀所述激光剥离层之后，所述柔性基板20和所述玻璃基板30之间还有轻微粘着力。此时，采用如图1所示的柔性基板剥离装置10将所述柔性基板20黏贴在可用紫外光照解胶的胶带16上，首先通过胶带16的牵拉可以在不损伤所述柔性基板20的前提下，进一步实现所述柔性基板20和所述玻璃基板30的温和有效剥离，然后通过对所述胶带16进行紫外光照解胶实现所述柔性基板20和所述胶带16的剥离，从而最终完成剥离所述柔性基板20的制程。
请一并参阅图3，图3为使用图1所示柔性基板剥离装置将柔性基板从玻璃基板上剥离的剥离方法流程图。本发明实施例的剥离方法包括以下步骤：
S1：控制所述胶带输送轮以第一预定转速转动以供应所述胶带。
在本发明一实施方式中，所述胶带输送轮11以第一预定转速沿顺时针方向转动以供应新胶带(即未使用的所述胶带16)。在所述胶带16的传送过程中，依次经过所述第一胶带导向轮14、所述剥离辊13、所述第二胶带导向轮15和所述胶带回收轮。
S2：控制所述剥离辊沿着平行于所述玻璃基板的方向移动并压紧所述柔性基板，使得所述柔性基板黏贴在所述胶带的第一表面上。
其中，所述胶带16包括相对设置的第一表面和第二表面。所述玻璃辊13与所述胶带16的第二表面相接触。所述胶带16的第一表面即为所述胶带16的粘胶面。也就是说，所述柔性基板20黏贴在所述胶带16的粘胶面。
在本发明的一实施方式中，所述剥离方法还包括控制所述玻璃辊13相对于所述玻璃基板30沿垂直方向移动并靠近所述柔性基板20。进一步地，所述剥离辊13沿着平行于所述玻璃基板30的方向从左至右移动并压紧所述柔性基板20，使得所述柔性基板20黏贴在所述胶带16的第一表面上。
其中，所述第一胶带导向轮14位于所述胶带输送轮11和所述剥离辊13之间的位置，所述第二胶带导向轮15位于所述胶带回收轮12和所述剥离辊13之间的位置。从而，所述第一胶带导向轮14和所述第二胶带导向轮15的设置可以进一步确保所述柔性基板20紧贴在所述胶带16的第一表面上。
S3：控制所述胶带回收轮以第二预定转速转动以带动所述胶带，使得黏贴在所述胶带的第一表面上的所述柔性基板从所述玻璃基板上剥离。
可以理解的是，所述胶带回收轮12也绕着其转轴沿顺时针转动。由于所述
柔性基板20黏贴在所述胶带16的第一表面上，从而当所述胶带回收轮12以第二预定转速沿顺时针方向转动带动所述胶带16时，通过所述胶带16的牵拉可以使得黏贴在所述胶带16的第一表面上的柔性基板20从所述玻璃基板30上剥离。
S4：控制所述紫外光发射装置发射紫外光照射所述胶带的第一表面，使得所述胶带的第一表面失去粘性，从而使得所述柔性基板从所述胶带上剥离。
在所述柔性基板20从所述玻璃基板30上剥离之后，所述柔性基板20仍然黏贴在所述胶带16的第一表面上。由于所述胶带16为可用紫外光照解胶的胶带，因此可以控制所述紫外光发射装置发射紫外光照射所述胶带16的第一表面以使所述胶带16的第一表面在所述紫外光的照射下失去粘性。从而，所述胶带16的第一表面上的胶膜脱落，使得所述柔性基板20从所述胶带16上剥离。
S5：控制所述胶带回收轮以第三预定转速转动以回收所述胶带。
其中，所述胶带回收轮12与所述胶带16的传送末端相连。从而，所述胶带回收轮12可以轴向转动以回收废胶带(即使用过的胶带16)。在本发明的实施例中，在所述柔性基板20从所述胶带16上剥离之后，所述胶带回收轮12以第三预定转速沿顺时针方向转动以回收所述胶带16。
本发明的柔性基板剥离装置及其剥离方法，在采用激光剥离技术实现柔性基板和玻璃基板的初次剥离之后，将柔性基板黏贴在可用紫外光照解胶的胶带的粘胶面上，通过胶带的牵拉进一步实现柔性基板和玻璃基板的温和有效剥离，然后使用紫外光照射所述胶带的粘胶面，使得所述胶带的粘胶面失去粘性，从而使得所述柔性基板从所述胶带上剥离，提高了柔性基板剥离工艺的良率，而且该柔性基板剥离装置的结构简单，未额外增加费用，成本较低。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含在本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上对本发明实施例所提供的柔性基板剥离装置及剥离方法进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实
施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。
Claims (20)
- 一种柔性基板剥离装置，用于将柔性基板从玻璃基板上剥离，其中，所述柔性基板剥离装置包括胶带输送轮、胶带回收轮、剥离辊和胶带，所述胶带输送轮轴向转动以传送所述胶带，所述胶带包括相对设置的第一表面和第二表面，所述剥离辊的表面与所述胶带的第二表面相接触，所述剥离辊沿着平行于所述玻璃基板的方向移动并压紧所述柔性基板，使得所述柔性基板黏贴在所述胶带的第一表面上，所述胶带回收轮轴向转动以带动所述胶带使得黏贴在所述胶带的第一表面上的所述柔性基板从所述玻璃基板上剥离。
- 如权利要求1所述的柔性基板剥离装置，其中，所述胶带输送轮和所述剥离辊之间的位置设置有第一胶带导向轮，所述胶带回收轮和所述剥离辊之间的位置设置有第二胶带导向轮，所述第一胶带导向轮和所述第二胶带导向轮轴向转动以传送所述胶带，所述第一胶带导向轮和所述第二胶带导向轮的设置还用于确保所述柔性基板紧贴在所述胶带的第一表面上。
- 如权利要求2所述的柔性基板剥离装置，其中，所述胶带的传送始端与所述胶带输送轮相连，所述胶带的传送末端与所述胶带回收轮相连，所述胶带输送轮、所述第一胶带导向轮、所述剥离辊、所述第二胶带导向轮和所述胶带回收轮从右至左依次设置。
- 如权利要求3所述的柔性基板剥离装置，其中，所述剥离辊沿着平行于所述玻璃基板的方向向右移动；所述胶带输送轮、所述胶带回收轮、所述剥离辊、所述第一胶带导向轮和所述第二胶带导向轮均绕着各自的转轴沿顺时针方向转动。
- 如权利要求2所述的柔性基板剥离装置，其中，所述胶带输送轮、所述胶带回收轮、所述第一胶带导向轮和所述第二胶带导向轮的位置不可移动。
- 如权利要求1所述的柔性基板剥离装置，其中，所述胶带回收轮轴向转动以回收所述胶带。
- 如权利要求1所述的柔性基板剥离装置，其中，所述柔性基板上制备有柔性器件。
- 如权利要求1所述的柔性基板剥离装置，其中，所述胶带为可用紫外光照解胶的胶带。
- 如权利要求2所述的柔性基板剥离装置，其中，所述胶带为可用紫外光照解胶的胶带。
- 如权利要求3所述的柔性基板剥离装置，其中，所述胶带为可用紫外光照解胶的胶带。
- 如权利要求4所述的柔性基板剥离装置，其中，所述胶带为可用紫外光照解胶的胶带。
- 如权利要求8所述的柔性基板剥离装置，其中，所述柔性基板剥离装置还包括紫外光发射装置，所述紫外光发射装置发射紫外光照射所述胶带的第一表面，使得所述胶带的第一表面失去粘性，从而使得所述柔性基板从所述胶带上剥离。
- 一种剥离方法，用于将柔性基板从玻璃基板上剥离，其中，所述剥离方法包括：提供一柔性基板剥离装置，包括胶带输送轮、胶带回收轮、剥离辊、胶带和紫外光发射装置；控制所述胶带输送轮以第一预定转速转动以供应所述胶带；控制所述剥离辊沿着平行于所述玻璃基板的方向移动并压紧所述柔性基 板，使得将所述柔性基板黏贴在所述胶带的第一表面上；控制所述胶带回收轮以第二预定转速转动以带动所述胶带，使得黏贴在所述胶带的第一表面上的所述柔性基板从所述玻璃基板上剥离；控制所述紫外光发射装置发射紫外光照射所述胶带的第一表面，使得所述胶带的第一表面失去粘性，从而使得所述柔性基板从所述胶带上剥离；控制所述胶带回收轮以第三预定转速转动以回收所述胶带。
- 如权利要求13所述的剥离方法，其中，所述胶带包括相对设置的第一表面和第二表面，所述剥离辊的表面与所述胶带的第二表面相接触。
- 如权利要求13所述的剥离方法，其中，所述胶带输送轮和所述剥离辊之间的位置设置有第一胶带导向轮，所述胶带回收轮和所述剥离辊之间的位置设置有第二胶带导向轮，所述第一胶带导向轮和所述第二胶带导向轮轴向转动以传送所述胶带，所述第一胶带导向轮和所述第二胶带导向轮的设置还用于确保所述柔性基板紧贴在所述胶带的第一表面上。
- 如权利要求15所述的剥离方法，其中，所述胶带的传送始端与所述胶带输送轮相连，所述胶带的传送末端与所述胶带回收轮相连，所述胶带输送轮、所述第一胶带导向轮、所述剥离辊、所述第二胶带导向轮和所述胶带回收轮从右至左依次设置。
- 如权利要求16所述的剥离方法，其中，所述剥离辊沿着平行于所述玻璃基板的方向向右移动；所述胶带输送轮、所述胶带回收轮、所述剥离辊、所述第一胶带导向轮和所述第二胶带导向轮均绕着各自的转轴沿顺时针方向转动。
- 如权利要求15所述的剥离方法，其中，所述胶带输送轮、所述胶带回收轮、所述第一胶带导向轮和所述第二胶带导向轮的位置不可移动。
- 如权利要求13所述的剥离方法，其中，所述柔性基板上制备有柔性器件。
- 如权利要求13所述的剥离方法，其中，所述胶带为可用紫外光照解胶的胶带。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/136,846 US10751985B2 (en) | 2017-08-17 | 2018-09-20 | Flexible substrate lifting device and method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710708601.1A CN107528009B (zh) | 2017-08-17 | 2017-08-17 | 柔性基板剥离装置及剥离方法 |
| CN201710708601.1 | 2017-08-17 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/136,846 Continuation US10751985B2 (en) | 2017-08-17 | 2018-09-20 | Flexible substrate lifting device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019033566A1 true WO2019033566A1 (zh) | 2019-02-21 |
Family
ID=60681447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2017/108690 WO2019033566A1 (zh) | 2017-08-17 | 2017-10-31 | 柔性基板剥离装置及剥离方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107528009B (zh) |
| WO (1) | WO2019033566A1 (zh) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10172929A (ja) * | 1996-12-16 | 1998-06-26 | Sony Corp | 保護テープ剥離装置 |
| CN103317824A (zh) * | 2013-06-19 | 2013-09-25 | 深圳市华星光电技术有限公司 | 离型纸剥离装置 |
| CN103786417A (zh) * | 2014-02-11 | 2014-05-14 | 京东方科技集团股份有限公司 | 一种剥离装置和方法 |
| CN105047598A (zh) * | 2015-06-23 | 2015-11-11 | 上海东煦电子科技有限公司 | 一种用于pcb基板切割工艺的贴膜方法 |
| JP2015231869A (ja) * | 2014-05-12 | 2015-12-24 | 株式会社石山製作所 | 貼付装置およびフィルム供給装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101254277B1 (ko) * | 2004-07-30 | 2013-04-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 라미네이팅 시스템, ｉｃ 시트, ｉｃ 시트 두루마리, 및ｉｃ 칩의 제조방법 |
| US8137417B2 (en) * | 2006-09-29 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| JP2011187641A (ja) * | 2010-03-08 | 2011-09-22 | Hitachi Cable Ltd | フレキシブル基板の製造方法 |
| CN104347449A (zh) * | 2013-07-24 | 2015-02-11 | 上海和辉光电有限公司 | 一种剥离装置及剥离方法 |
| JP6815096B2 (ja) * | 2015-05-27 | 2021-01-20 | 株式会社半導体エネルギー研究所 | 剥離装置 |
| CN106098965B (zh) * | 2016-06-15 | 2018-08-21 | 昆山国显光电有限公司 | 柔性基板剥离装置及柔性基板剥离方法 |
-
2017
- 2017-08-17 CN CN201710708601.1A patent/CN107528009B/zh active Active
- 2017-10-31 WO PCT/CN2017/108690 patent/WO2019033566A1/zh active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10172929A (ja) * | 1996-12-16 | 1998-06-26 | Sony Corp | 保護テープ剥離装置 |
| CN103317824A (zh) * | 2013-06-19 | 2013-09-25 | 深圳市华星光电技术有限公司 | 离型纸剥离装置 |
| CN103786417A (zh) * | 2014-02-11 | 2014-05-14 | 京东方科技集团股份有限公司 | 一种剥离装置和方法 |
| JP2015231869A (ja) * | 2014-05-12 | 2015-12-24 | 株式会社石山製作所 | 貼付装置およびフィルム供給装置 |
| CN105047598A (zh) * | 2015-06-23 | 2015-11-11 | 上海东煦电子科技有限公司 | 一种用于pcb基板切割工艺的贴膜方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107528009A (zh) | 2017-12-29 |
| CN107528009B (zh) | 2020-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101931336B1 (ko) | 평판 표시장치의 보호필름 부착용 전사필름 및 전사필름을 이용한 평판 표시장치의 제조 방법 | |
| KR101633118B1 (ko) | 유기발광소자의 실링방법 | |
| WO2019114072A1 (zh) | 柔性显示面板的制作方法 | |
| TWI520850B (zh) | 電子裝置及其製造方法 | |
| KR20150012189A (ko) | 박리 장치 및 박리 방법 | |
| JP2009194064A (ja) | 基板への接着フィルム貼付け装置及び貼付け方法 | |
| US20140020844A1 (en) | Film peeling apparatus | |
| WO2017115486A1 (ja) | 樹脂フィルムの剥離方法及び装置、電子デバイスの製造方法並びに有機ｅｌ表示装置の製造方法 | |
| KR20120107360A (ko) | 디스플레이 패널용 필름 부착 장치 및 이를 이용한 필름 부착 방법 | |
| JP4832780B2 (ja) | マスク形成方法と、マスク用材料と、これを用いたパターン膜形成システム | |
| JP4069640B2 (ja) | 電気光学装置、及び電子機器 | |
| JP4878228B2 (ja) | テープ剥離装置、塗布システムおよびテープ剥離方法 | |
| JP2010062526A (ja) | 薄膜素子の製造方法 | |
| JP2009246067A5 (zh) | ||
| TW201243994A (en) | Substrate chuck unit, substrate processing apparatus including the same, and substrate transferring method | |
| WO2019033566A1 (zh) | 柔性基板剥离装置及剥离方法 | |
| KR100615217B1 (ko) | 평판표시장치의 제조방법 | |
| KR101818647B1 (ko) | 유기 발광 표시장치의 제조방법 | |
| KR102195967B1 (ko) | 플렉서블 oled 디스플레이 기판용 논 레이저 리프트오프 장치 | |
| CN113224238B (zh) | 柔性显示面板及其制备方法 | |
| US10751985B2 (en) | Flexible substrate lifting device and method | |
| JP2016096218A (ja) | 積層基板の製造方法及び電子デバイスの製造方法 | |
| KR100669792B1 (ko) | 가공 기판의 제조방법, 이를 이용한 평판 표시장치의제조방법 및 플렉시블 기판 가접합 장치 | |
| JP5275433B2 (ja) | テープ貼付装置 | |
| JP2012182005A (ja) | 有機エレクトロルミネッセンス素子の製法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17921455 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 17921455 Country of ref document: EP Kind code of ref document: A1 |