WO2019017515A1 - 프로브 카드용 박막 저항기 - Google Patents

프로브 카드용 박막 저항기 Download PDF

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Publication number
WO2019017515A1
WO2019017515A1 PCT/KR2017/007904 KR2017007904W WO2019017515A1 WO 2019017515 A1 WO2019017515 A1 WO 2019017515A1 KR 2017007904 W KR2017007904 W KR 2017007904W WO 2019017515 A1 WO2019017515 A1 WO 2019017515A1
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WO
WIPO (PCT)
Prior art keywords
elastic
thin film
film resistor
resistance
probe card
Prior art date
Application number
PCT/KR2017/007904
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
이재환
이정미
김영우
Original Assignee
주식회사 기가레인
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 기가레인 filed Critical 주식회사 기가레인
Priority to CN201780091212.7A priority Critical patent/CN110662972B/zh
Publication of WO2019017515A1 publication Critical patent/WO2019017515A1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Definitions

  • the present invention relates to a thin film resistor for a probe card, and more particularly, to a thin film resistor for a probe card which prevents a thin film resistor from cracking while repeatedly expanding and contracting by heat.
  • a thin film resistor is a resistor formed by depositing metal on a substrate by a method such as vapor deposition.
  • a probe card is used to check whether or not a wafer is abnormal in a wafer stage, which is a stage before a package for manufacturing a semiconductor.
  • the probe card includes a probe pin that receives signals from the wafer, a PCB that receives signals from the probe pins and transmits signals to the tester, and a space transformer that transfers signals between the probe pins and the PCB. .
  • This spatial converter is comprised of multiple layers and includes wiring lines interfacing signals between the probe pins and the PCB.
  • the wiring line has a structure in which wiring lines connected to the PCB are branched into two or more and connected to the probe pins, respectively.
  • the thin film resistor has a problem that cracks are generated in the resistance line 200 as shown in FIG. 1 because the space converter repeats expansion and contraction by heat as the wafer undergoes a thermal test when inspecting the wafer.
  • the space converter is composed of a plurality of polyimide layers based on ceramics instead of a plurality of ceramic layers
  • a thin film resistor in which a thermal expansion coefficient is higher than that of a ceramic is installed on a polyimide layer, and the expansion and contraction of the thin film resistor are repeated to increase the frequency of occurrence of cracks.
  • Patent Document 0001 Korean Patent No. 10-0978233
  • Patent Document 0002 Korean Patent No. 10-1545815
  • Patent Document 3 Korean Patent Publication No. 10-2010-0062041
  • the present invention has been made to solve the above-mentioned problems occurring in the prior art.
  • a thin film resistor for a probe card which is connected to a wiring line for interfacing a signal formed in a space transformer for transmitting signals between a probe pin and a PCB
  • a thin film resistor wherein the thin film resistor comprises: a pair of electrode pads connected to a wiring line; A resistance line connected to the pair of electrode pads to provide a resistance to a signal path; An elastic part formed by bypassing the resistance line; An elastic gap portion formed in the elastic portion; And an elastic restricting portion that is connected to the elastic portion at one end and the other end across the elastic air gap portion to restrict expansion and contraction of the elastic portion; .
  • the elastic restricting portion is formed to have a width smaller than the width of the elastic portion.
  • the elastic restricting portion is formed to cross the elastic supply portion within a range not exceeding half the depth of the elastic air gap portion.
  • the elastic restricting portions are formed in an X-shape crossing each other.
  • a thin film resistor for a probe card which is connected to a wiring line for interfacing a signal formed in a space transformer for transmitting signals between a probe pin and a PCB
  • a thin film resistor wherein the thin film resistor comprises: a pair of electrode pads connected to a wiring line; A resistance line connected to the pair of electrode pads to provide a resistance to a signal path; An elastic portion formed by bypassing the resistance line; And an elastic void portion that is a space formed by being contained in the elastic portion; .
  • the outer shape of the elastic air gap portion is formed in a shape corresponding to the outer shape of the elastic portion.
  • the outer shape of the elastic hollow portion and the elastic portion is formed in a square or circular shape.
  • An elastic restricting portion that is connected to the elastic portion at one end and the other end across the elastic air gap portion to restrict expansion and contraction of the elastic portion; .
  • a thin film resistor for a probe card which is connected to a wiring line for interfacing a signal formed in a space transformer for transmitting signals between a probe pin and a PCB
  • a thin film resistor wherein the thin film resistor comprises: a pair of electrode pads connected to a wiring line; A resistance line connected to the pair of electrode pads to provide a resistance to a signal path; An elastic part formed by bypassing the resistance line; An elastic void portion which is a space formed by being contained in the elastic portion; And an elastic groove formed at an edge of the elastic portion in contact with the elastic air gap portion, the elastic groove being formed in a slit shape when the elastic portion is inflated; .
  • a thin film resistor for a probe card which is connected to a wiring line for interfacing a signal formed in a space transformer for transmitting signals between a probe pin and a PCB
  • a thin film resistor wherein the thin film resistor comprises: a pair of electrode pads connected to a wiring line; A resistance line connected to the pair of electrode pads to provide a resistance to a signal path; An elastic part formed by bypassing the resistance line; An elastic gap portion formed in the elastic portion; And an elastic restricting portion that is connected to the elastic portion at one end and the other end by bypassing the elastic air gap portion to restrict expansion and contraction of the elastic portion; .
  • the present invention as described above has an effect of preventing cracks from occurring as the thin film resistor for a probe card repeatedly expands and contracts due to heat.
  • FIG. 1A and 1B are views for explaining an example in which a conventional thin film resistor for a probe card generates a crack after expansion before expansion
  • FIG. 2 is a view for explaining a thin film resistor for a probe card according to an embodiment of the present invention
  • FIGS. 3A and 3B are views for explaining the reason why a resilient restricting portion is required in a thin film resistor for a probe card according to an embodiment of the present invention
  • 4A and 4B illustrate a thin film resistor for a probe card according to an embodiment of the present invention.
  • FIGS. 5A, 5B and 5C are views for explaining a thin film resistor for a probe card according to an embodiment of the present invention.
  • FIG. 6 is a view for explaining a thin film resistor for a probe card according to an embodiment of the present invention
  • FIG. 7 is a view for explaining a thin film resistor for a probe card according to an embodiment of the present invention.
  • FIG. 8A and 8B illustrate a thin film resistor for a probe card according to an embodiment of the present invention.
  • FIG. 9 is a view for explaining a thin film resistor for a probe card according to an embodiment of the present invention.
  • FIGS. 10A and 10B are views for explaining a thin film resistor for a probe card according to an embodiment of the present invention.
  • 11A and 11B are views for explaining a thin film resistor for a probe card according to an embodiment of the present invention.
  • a thin film resistor for a probe card includes a pair of electrode pads 100 connected to a wiring line and a pair of electrode pads 100, A resilient part 300 formed by bypassing the resistive line 200, an elastic clearance part 400 formed as a space enclosed in the elastic part 300, and an elastic clearance part 400, And an elastic restricting part 500 connected to the elastic part 300 at one end and the other end to limit the expansion and contraction of the elastic part 300.
  • the electrode pad 100 is generally formed of gold, and the resistance line 200 is formed of a nickel-chromium alloy or tantalum.
  • the elastic portion 300 is a portion formed by artificially concentrating the expansion and contraction of the thin film resistor for a probe card.
  • the elastic restricting part 500 is formed to prevent the elastic part 300 from being excessively expanded and contracted to prevent a crack from occurring in the elastic part 310 of the elastic part.
  • the elastic restricting part 500 may extend from the elastic part 300 and may be formed of the same material as the resistance line 200 and may be formed to be coupled to the elastic part 300 through a separate forming process.
  • the width of the elastic restricting part 500 increases, the amount of providing the resistance increases. Therefore, it is preferable that the width is smaller than the width of the elastic part 300 in order to minimize the resistance.
  • the elastic restricting part 500 restricts excessive expansion and contraction of the elastic part 300
  • the position where the elastic restricting part 500 is formed in the elastic clearance part 400 is half of the elastic restricting part depth D
  • the effect of restricting expansion and contraction is lowered so that it is preferably formed to cross the elastic feeding part 400 within a range not exceeding half the depth D of the elastic restricting part.
  • the elastic portion 300 and the elastic air gap portion 400 may be formed in various shapes.
  • the elastic portion 300 and the elastic air gap portion 400 may be formed of two or more pieces, and may be arranged to be vertically symmetrical as shown in FIGS. 5A and 5B, .
  • two or more elastic restricting portions 500 may be formed.
  • the elastic restricting portion 500 may be formed in an X-shape crossing as shown in FIG.
  • a thin film resistor for a probe card includes a pair of electrode pads 100 connected to a wiring line and a pair of electrode pads 100, And a resilient part 300 formed by bypassing the resistive line 200.
  • the resilient cavity 300 includes a resilient cavity 400 formed in the resilient part 300.
  • the outer shape of the elastic air gap part 400 may be formed in a shape corresponding to the outer shape of the elastic part 300, but is not limited thereto.
  • the outer shape of the elastic part 300 may be formed in a rectangular shape and the outer shape of the elastic air gap part 400 may be formed in a circular shape.
  • the elastic portion 300 and the elastic air gap portion 400 may be formed of two or more as shown in FIG.
  • the elastic restricting part 500 may further include an elastic restricting part 500 that is connected to the elastic part 300 at one end and the other end across the elastic clearance part 400 to limit the expansion and contraction of the elastic part 300.
  • a thin film resistor for a probe card includes a pair of electrode pads 100 connected to a wiring line, a pair of electrode pads 100, A resilient part 300 formed by bypassing the resistive line 200, an elastic clearance part 400 formed as a space enclosed in the elastic part 300, and an elastic clearance part 400, And an elastic groove 350 formed at a corner of the elastic part 300 in contact with the elastic part 300, the elastic part 300 being formed in a slit shape to expand when the elastic part 300 expands.
  • a circular hole 355 is formed at the other end of the elastic groove 350, so that the elastic groove 350 can be more easily opened.
  • the thin film resistor is connected to a pair of electrode pads 100 connected to a wiring line and a pair of electrode pads 100
  • a resistance line 200 for providing a resistance to the signal path an elastic portion formed by bypassing the resistance line 200, an elastic gap portion 400 formed in the elastic portion, and an elastic gap portion 400
  • an elastic restricting part 500 connected to the elastic part 300 at the other end to limit the expansion and contraction of the elastic part 300.
  • the elastic restricting portion 500 bypasses the elastic air gap portion 400 in the direction opposite to the direction in which the elastic portion 300 is bypassed.
  • the present invention provides a thin film resistor for a probe card which prevents a thin film resistor from cracking while repeatedly expanding and contracting by heat.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
PCT/KR2017/007904 2017-07-21 2017-07-21 프로브 카드용 박막 저항기 WO2019017515A1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201780091212.7A CN110662972B (zh) 2017-07-21 2017-07-21 探针卡用薄膜电阻器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170092872A KR102279465B1 (ko) 2017-07-21 2017-07-21 프로브 카드용 박막 저항기
KR10-2017-0092872 2017-07-21

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WO2019017515A1 true WO2019017515A1 (ko) 2019-01-24

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Application Number Title Priority Date Filing Date
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Country Status (3)

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KR (1) KR102279465B1 (zh)
CN (1) CN110662972B (zh)
WO (1) WO2019017515A1 (zh)

Citations (5)

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JPH11126816A (ja) * 1997-10-23 1999-05-11 Dainippon Screen Mfg Co Ltd ウェハ上の対象点座標の補正方法および対象点座標の決定方法
JP2007086044A (ja) * 2005-09-19 2007-04-05 Isao Kimoto プローバ装置及びこれに用いるプローブ組立体
KR100978233B1 (ko) * 2008-05-19 2010-08-26 티에스씨멤시스(주) 전기 검사 장치 그리고 이의 제조 방법, 이의 전기 신호인터페이싱 어셈블리, 및 이의 전기 신호 인터페이싱 방법
US20110254578A1 (en) * 2008-09-30 2011-10-20 Min Soo Kim Space transformer comprising an isolation resistor for a probe card, and method for manufacturing same
JP2012054298A (ja) * 2010-08-31 2012-03-15 Kyocera Corp プローブカード用セラミック配線基板

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JP2002071719A (ja) 2000-09-01 2002-03-12 Kobe Steel Ltd プローブカード及びその製造方法
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JP6092572B2 (ja) * 2012-10-30 2017-03-08 株式会社日本マイクロニクス 多層配線基板及びこれを用いたプローブカード
KR101490366B1 (ko) * 2013-05-30 2015-02-05 주식회사 코리아 인스트루먼트 전기 신호 인터페이싱 어셈블리 및 이를 포함하는 전기 검사 장치
KR101545815B1 (ko) 2014-04-23 2015-08-20 주식회사 코리아 인스트루먼트 검사 공정 시 손상된 박막 저항 교체가 가능한 프로브 카드 및 박막 저항 교체 방법
JP6466128B2 (ja) * 2014-10-08 2019-02-06 株式会社日本マイクロニクス プローブカード
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11126816A (ja) * 1997-10-23 1999-05-11 Dainippon Screen Mfg Co Ltd ウェハ上の対象点座標の補正方法および対象点座標の決定方法
JP2007086044A (ja) * 2005-09-19 2007-04-05 Isao Kimoto プローバ装置及びこれに用いるプローブ組立体
KR100978233B1 (ko) * 2008-05-19 2010-08-26 티에스씨멤시스(주) 전기 검사 장치 그리고 이의 제조 방법, 이의 전기 신호인터페이싱 어셈블리, 및 이의 전기 신호 인터페이싱 방법
US20110254578A1 (en) * 2008-09-30 2011-10-20 Min Soo Kim Space transformer comprising an isolation resistor for a probe card, and method for manufacturing same
JP2012054298A (ja) * 2010-08-31 2012-03-15 Kyocera Corp プローブカード用セラミック配線基板

Also Published As

Publication number Publication date
CN110662972A (zh) 2020-01-07
CN110662972B (zh) 2021-12-14
KR20190010286A (ko) 2019-01-30
KR102279465B1 (ko) 2021-07-21

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