WO2019015687A1 - 物镜保护装置、物镜系统以及光刻设备 - Google Patents

物镜保护装置、物镜系统以及光刻设备 Download PDF

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Publication number
WO2019015687A1
WO2019015687A1 PCT/CN2018/096594 CN2018096594W WO2019015687A1 WO 2019015687 A1 WO2019015687 A1 WO 2019015687A1 CN 2018096594 W CN2018096594 W CN 2018096594W WO 2019015687 A1 WO2019015687 A1 WO 2019015687A1
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WIPO (PCT)
Prior art keywords
objective lens
air supply
protection device
pumping
air
Prior art date
Application number
PCT/CN2018/096594
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English (en)
French (fr)
Inventor
李先明
郝保同
Original Assignee
上海微电子装备（集团）股份有限公司
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Application filed by 上海微电子装备（集团）股份有限公司 filed Critical 上海微电子装备（集团）股份有限公司
Priority to KR1020207003414A priority Critical patent/KR102370165B1/ko
Priority to JP2020502598A priority patent/JP6909919B2/ja
Priority to US16/632,812 priority patent/US10983448B2/en
Priority to SG11202000513SA priority patent/SG11202000513SA/en
Publication of WO2019015687A1 publication Critical patent/WO2019015687A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants

Definitions

  • the present invention relates to the field of semiconductor and optical technologies, and in particular, to an objective lens protection device, an objective lens system, and a lithographic apparatus.
  • the objective lens directly determines the image quality of the product.
  • the distance between the lens of the objective lens and the silicon wafer is very small (about 40mm).
  • the photoresist coated on the surface of the silicon wafer contains an organic solvent, which will continue to slowly volatilize under exposure.
  • the volatilized organic solvent adheres to the lower surface of the objective lens, forming an organic solvent-contaminated film on the lower surface of the underlying lens.
  • the pollution film seriously affects the transmittance of light in the objective lens, and reduces the imaging effect of the silicon wafer, which is not conducive to product quality.
  • the current main treatment methods are:
  • the surface of the bottom lens is periodically wiped to remove the adhesive organic solvent, but careful cleaning will also affect the coating of the lens, causing irreversible damage to the lens.
  • the contact type of treatment should not be used frequently.
  • the direct wiping is affected by factors such as the proficiency of the operator, and different results may occur, and the uniformity control of the product is difficult.
  • the protective film is transmitted by light, and the light has energy, which leads to shortening of the service life of the protective film.
  • the extremely thin protective film is difficult to install and operate on the one hand, and is easily affected by external air pressure, which is very easy to break (the damage rate is as high as 15%); on the other hand, according to the energy of the transmitted light, The image quality requirements, the protective film can only be maintained for 30-60 days, which affects the continuous and efficient operation of the equipment and increases the user's use cost.
  • an object of the present invention is to provide an objective lens protection device, an objective lens system, and a lithographic apparatus to solve the problem that the objective lens is easily contaminated.
  • the present invention provides an objective lens protection device including a main body structure having oppositely disposed air supply units and a first evacuation unit, the air supply unit for outputting gas, the first The pumping unit is configured to pump the gas outputted by the air supply unit to form at least one air curtain between the air supply unit and the first pumping unit.
  • the air supply unit has a gas supply surface, the air supply surface is perpendicular to a gas supply direction of the air supply unit, and the air supply surface is provided with a plurality of air supply ports;
  • the first pumping unit has a first air pumping And a plurality of first air suction ports are disposed on the first air suction surface, and the plurality of air supply ports are corresponding to the plurality of first air suction ports and are disposed opposite to each other.
  • the air supply surface and the first air extraction surface are stepped.
  • the air supply surface and the first air extraction surface are axially symmetrically distributed.
  • the air supply surface includes a plurality of sub-gas supply surfaces that are not in a plane, and the plurality of sub-aeration surfaces are distributed in parallel.
  • the air supply unit is further provided with a plurality of non-aeration surfaces, each non-aeration surface is used for connecting two adjacent air supply surfaces, and the air supply port is not provided on the non-air supply surface, and the non-air supply surface is not provided.
  • the air supply surface is at an angle of between 85 and 95 degrees from the sub-air supply surface.
  • the first pumping surface includes a plurality of first sub-exhaust surfaces that are not in a plane, and the plurality of first sub-exhaust surfaces are distributed in parallel.
  • the first pumping unit is further provided with a non-exhaust surface, each non-exhaust surface is used for connecting two adjacent sub-exhaust surfaces, and the non-exhaust surface is not provided with the first An air suction port, the non-exhausting surface and the first pumping surface are at an angle of 85° to 95°.
  • the air supply unit further has an air inlet, wherein the air inlet is connected to the plurality of air outlets;
  • the first pumping unit further has an air outlet, the exhaust port and the plurality of air outlets The first suction ports are connected.
  • the main body structure further includes a second pumping unit, the second pumping unit has an annular second pumping surface, and the second pumping surface is located at a lower surface of the body structure.
  • the second pumping surface is provided with a plurality of second air suction holes.
  • the pumping direction of the second pumping surface is not parallel to the air supply direction of the air supply unit.
  • the pumping direction of the second pumping surface is perpendicular to the air supply direction of the air supply unit.
  • the second pumping unit is provided with a second pumping chamber, and the second pumping surface draws gas to the second pumping chamber.
  • the first pumping unit includes a first pumping chamber, the exhaust port is in communication with the first pumping chamber, and gas enters the first pumping row from the plurality of first pumping ports a cavity is exhausted by the exhaust port; the first pumping chamber and the second pumping chamber are in communication with each other.
  • the main body structure further has a connecting portion for connecting with the objective lens, and the connecting portion is located at one side of the main body structure.
  • the connecting portion is a threaded port.
  • the physical protection layer is further connected to the main structure and located between the protected objective lens and the at least one layer of air curtain.
  • the physical protection layer is made of glass or resin.
  • a seal is further included for sealing a gap between the physical protective layer and the body structure, the seal being located between the physical protective layer and the body structure.
  • the main body structure is an integrally formed structure.
  • another aspect of the present invention provides an objective lens system including the above objective lens protection device.
  • the present invention further provides a lithographic apparatus comprising the above objective lens system.
  • the air curtain is formed by the air supply unit and the pumping unit.
  • the air flow velocity can be effectively controlled under the action of the laterally fine and uniform air supply port, and the wind is controlled in the laminar flow state to ensure the flow of the air curtain.
  • the field is uniform, and at the same time, under the action of the first air suction port, a wind curtain covering the entire lens is formed, which can effectively block the organic matter volatilized from the bottom up, eliminate the opportunity of direct contact with the lens, and prevent the objective lens from receiving light. Volatile organic matter volatilized to ensure the imaging quality of the objective lens;
  • the vertical second suction port can extract volatile dirt and reduce dirt pollution to other components.
  • the fine and uniform structure of the second suction port can also effectively control the flow field of the exhaust gas flow, and the volatile matter is pumped out of the machine without disturbing the air curtain;
  • the physical protective layer forms a second heavy physical protection to ensure that volatile contaminants cannot contact the lens
  • the air supply port, the first air suction port and the second air suction port are all circular and evenly distributed circular through holes, which can effectively control the flow rate of the wind and the exhaust air, and control it in the laminar flow state to ensure the air curtain Stable to ensure the air curtain's blocking effect and sufficient drainage;
  • the main structure is integrally formed, the device is more compact, and the occupied space is small.
  • FIG. 1 is a perspective view of an objective lens protection device according to an embodiment of the present invention.
  • Figure 2a is a plan view of an objective lens protection device in accordance with an embodiment of the present invention.
  • FIGS. 2b and 2c are top views of an objective lens protection device according to another embodiment of the present invention.
  • Figure 3 is a cross-sectional view A-A of Figure 2a;
  • Figure 4 is a cross-sectional view B-B of Figure 2a;
  • Figure 5 is a front elevational view of the objective lens protection device in accordance with an embodiment of the present invention.
  • Figure 6 is a cross-sectional view C-C of Figure 5.
  • 10 main structure; 11 - air supply unit; 111 - air inlet; 112 - air supply port; 12 - first pumping unit; 121 - exhaust port; 122 - first pumping port; 123 - second pumping Port; 13-joint; 14-gas passage; 20-physical protective layer; 30-seal; A-gas supply surface; B-non-air supply surface; C-first suction surface; D-non-exhaust surface.
  • This embodiment introduces an objective lens protection device by taking a lithography machine as an example.
  • the device is not limited to the application of the lithography machine, and can also be applied to similar types of devices having similar anti-pollution requirements.
  • the objective lens protection device provided in this embodiment includes a main body structure 10 having a gas supply unit 11 and a first pumping unit 12 , a gas supply unit 11 and a first pumping unit 12 . There is a space between them for forming at least one layer of air curtain.
  • the inventor has found that the air curtain acts as a kind of flowing airflow to protect the insulation.
  • the device is placed under the objective lens. When the lithography machine etches the silicon wafer, the organic solvent on the surface of the silicon wafer evaporates upward. The air curtain blocks the volatile organic solvent from entering the surface of the objective lens.
  • the air curtain formed therein may be parallel to the surface of the objective lens or may be slightly inclined to the surface of the objective lens, and the inclination angle may range from 1° to 5°.
  • the structural size of the main structure 10 can be designed according to the specific working environment, so that the structural size of the main structure 10 can be specifically designed according to the specific working environment, as long as the structural relationship of the objective lens and/or other devices is not affected. This is not specifically limited.
  • the air supply unit 11 has an air supply surface A
  • the first pumping unit 12 has a first pumping surface C
  • the at least one air curtain is formed between the air supply surface A and the first air extraction surface C.
  • the air supply surface A and the first air extraction surface C are disposed opposite to each other to make the formed air curtain uniform.
  • the air supply unit 11 has an air inlet 111 (see FIG. 4) and a plurality of air supply ports 112 for connecting an external air source, and the plurality of air supply ports 112 are evenly distributed on the air supply surface A, and both The intake port 111 is in communication.
  • the first pumping unit 12 has an exhaust port 121 (see FIG. 3 ) and a plurality of first air extracting ports 122 .
  • the plurality of first air extracting ports 122 are evenly distributed on the first pumping surface C and are both connected to the exhaust port 121 .
  • the exhaust port 121 is configured to be connected to the pumping device, and the plurality of first air extracting ports 122 located on the first pumping surface C are disposed opposite to the plurality of air outlets 112, and are in one-to-one correspondence or configured to maintain the air curtain. Other corresponding forms.
  • the plurality of first air suction ports 122 are evenly distributed laterally for absorbing the airflow sent by the air supply port 112 to form a stable air curtain on the surface of the objective lens, thereby ensuring uniformity and coverage of the air curtain, and forming a stable wind.
  • the curtain can be parallel to the surface of the objective lens, and can form a certain angle with the surface of the objective lens, which can be selected by a person skilled in the art according to actual conditions.
  • the first air suction port 122 and the air supply port 112 are circular through holes having a diameter ranging from 0.5 mm to 1 mm; preferably, the plurality of air supply ports 112 are evenly distributed, and the plurality of first air suction ports 122 are evenly distributed.
  • the first pumping unit 12 includes a first pumping chamber (not shown), the exhaust port 121 is in communication with the first pumping chamber, and gas enters the first pumping port from the first air extracting port 122 The cavity is discharged by the exhaust port 121.
  • the air supply surface A and/or the first air extraction surface C structure may be stepped, and the air supply surface A may include a plurality of sub air supply surfaces that are not in one plane, and the plurality of sub air supply surfaces are arranged in parallel.
  • the air supply surface A and/or the first air extraction surface C may be disposed not only in the horizontal step type as shown in FIGS.
  • the plurality of sub air supply surfaces have the same vertical direction, and at least two sub air supply surfaces are parallel to
  • the horizontal direction of the air supply direction has different positions; it may also be a vertical step type, that is, at least two sub-aeration surfaces have different positions in the vertical direction, and at least two sub-aeration surfaces have a horizontal axis parallel to the air supply direction.
  • Different locations The above-mentioned same position and different positions are only based on the coordinates in the direction, and those skilled in the art can change the above-mentioned scheme according to actual needs.
  • the air supply unit is further provided with a non-aeration surface B.
  • the air supply port is not provided on the non-aeration surface B, and the angle between the non-aeration surface B and the air supply surface A ranges from 85° to 95°, preferably 90°.
  • the angle is of course not limited to the 90° angle, and other angles are also implementable.
  • the air supply surface A and/or the first air extraction surface C are symmetrically distributed (for example, axisymmetric), and the air supply surface A is perpendicular to the air supply direction of the air supply unit 11.
  • the first pumping unit 12 has a first pumping surface C, and the first pumping surface is provided with a first pumping port 122, which is perpendicular to the air supply direction of the air supply unit 11.
  • the first pumping surface C includes a plurality of first sub-exhaust surfaces not in one plane, and a plurality of first sub-exhaust surfaces are arranged in parallel, and the first pumping unit 12 is further provided with a non-exhausting surface D, which is not pumped.
  • the first air extraction port 122 is not disposed on the air surface D, and the angle between the non-exhausting surface D and the first pumping surface C is in the range of 85° to 95°, preferably 90°, and the application is not limited thereto. An angle of 90°, other angles are also an implementable solution.
  • the main structure 10 further has a second pumping unit (not shown), the second pumping unit is provided with a second pumping surface, the second pumping surface can be parallel to the horizontal plane and is annular, and the second pumping unit
  • the air surface is located on the lower surface of the main structure 10, and a plurality of second air suction ports 123 are uniformly arranged thereon, and the plurality of second air extraction ports 123 on the second air suction surface are connected to the air outlet 121, and the plurality of Two suction ports 123 are distributed around the formed air curtain on the second suction surface.
  • the pumping direction of the second pumping surface is not parallel to the air supply direction of the air supply unit. In another embodiment of the invention, the pumping direction of the second pumping surface is perpendicular to the air supply direction of the air supply unit.
  • the opening direction of the second air suction port 123 faces away from the objective lens for sucking the airflow around the silicon wafer with the volatile matter, thereby completely removing the volatile substances, and effectively avoiding contamination of the lens and other structural components by the pollutants.
  • the second pumping unit has a second pumping chamber, and the gas is pumped by the second pumping port to the second pumping chamber and finally discharged to the outside of the device.
  • the second pumping chamber may be disposed separately from the first pumping chamber or may be combined into the same pumping chamber.
  • the main body structure 10 is a hollow structure having a gas passage 14 in the main body structure 10 (that is, the second The gas passage 14 communicates all of the second suction ports 123 with the first pumping unit 12.
  • the second air suction port 123 is a circular through hole having a diameter of 0.5 mm to 1 mm, and all the second air suction ports 123 are uniformly distributed in the main body structure 10.
  • the main structure 10 is in the shape of an annular cylinder, and all of the vertically distributed second air suction ports 123 are distributed around the ring main body structure so that the second air suction port 123 surrounds the air curtain. Prevent volatile gases from entering the objective lens on the upper side of the air curtain.
  • the air supply unit 11 and the first pumping unit 12 are located inside the main body structure 10 and are disposed opposite to each other.
  • the air supply surface of the air supply unit 11 has a stepped surface to accommodate the main structure 10 of the annular cylinder, and all the air supply ports 112 are distributed on the step surface.
  • the first pumping surface of the first pumping unit 12 has a stepped step surface, and all of the first air extracting ports 122 are distributed on the step surface. The air supply surface and the first pumping surface do not intersect with the working area of the objective lens (beam path).
  • the main body structure 10 further has a connecting portion 13 for connecting with the objective lens, and the connecting portion 13 is located at one side of the main body structure 10.
  • the connecting portion 13 is a threaded port.
  • the main structure 10 provided in this embodiment is an integrally formed structure and can be manufactured by 3D printing. Compared with mechanical assembly, the volume of the device can be effectively reduced, and the weight and size can be reduced.
  • the objective lens protection device provided in this embodiment further includes a physical protection layer 20, and the physical protection layer 20 is connected to the main structure 10 and covers at least one layer of the air curtain formed.
  • one side of the main body structure 10 has an annular groove corresponding to the physical protection layer 20, and the physical protection layer 20 is installed in the annular groove.
  • the physical protection layer 20 is made of glass material or resin material, and specifically may be a circular protective glass.
  • a seal 30 is provided between the physical protective layer 20 and the main structure 10 for sealing the gap between the physical protective layer 20 and the main structure 10.
  • the application method of the objective lens protection device provided in this embodiment is as follows: before the lithography machine starts the exposure, the external air source and the extraction device corresponding to the main structure 10 are started in advance; meanwhile, in order to protect the lens and the components in the device during the shutdown. Without being polluted, the blower equipment and the pumping equipment corresponding to the main structure 10 should be finally shut down or continuously operated for a period of time, preferably about 12 hours.
  • the invention also provides an objective lens system, wherein the objective lens system is provided with the above objective lens protection device, and the objective lens protection device is disposed at one end of the objective lens system, and the two are connected.
  • the present invention also provides a lithographic apparatus, each sub-system of the lithographic apparatus is well known in the art and will not be described again.
  • the lithographic apparatus comprises an objective lens system equipped with the objective lens protection device, and the objective lens protection device is located between the objective lens system and the workpiece table system of the lithographic apparatus to protect the objective lens system from the workpiece stage during the exposure process and the non-exposure process. Contamination of gases or droplets or other forms of contaminants emitted by the workpiece.
  • the objective lens protection device provided by the present invention has the following beneficial effects:
  • the air curtain is formed by the air supply unit and the pumping unit.
  • the air flow velocity can be effectively controlled under the action of the laterally fine and uniform air supply port, and the air outlet is controlled in the laminar flow state to ensure the air curtain.
  • the flow field is uniform, and at the same time, under the action of the first suction port, a wind curtain covering the entire lens is formed, which can effectively block the organic matter volatilized from the bottom up, eliminate the opportunity of direct contact with the lens, and prevent the objective lens from being exposed.
  • the organic matter of the photoresist is volatilized to ensure the imaging quality of the objective lens;
  • the vertical second suction port can extract volatile dirt and reduce dirt pollution to other components.
  • the fine and uniform structure of the second suction port can also effectively control the flow field of the exhaust gas flow, and the volatile matter is pumped out of the machine without disturbing the air curtain;
  • the physical protective layer forms a second heavy physical protection to ensure that volatile contaminants cannot contact the lens
  • the air supply port, the first air suction port and the second air suction port are all circular and evenly distributed circular through holes, which can effectively control the flow rate of the wind and the exhaust air, and control it in the laminar flow state to ensure the air curtain Stable to ensure the air curtain's blocking effect and sufficient drainage;
  • the main structure is integrally formed, the device is more compact, and the occupied space is small.

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Abstract

一种物镜保护装置、物镜系统以及光刻设备，物镜保护装置包括一主体结构（10），主体结构（10）具有相对设置的送气单元（11）和抽排单元（12），送气单元（11）用于输出气体，抽排单元（12）用于对送气单元（11）输出的气体进行抽排，从而在送气单元（11）和抽排单元（12）之间形成至少一层风幕。物镜保护装置可以有效控制出风流速，将风控制在层流状态，保证风幕的流场均匀，同时，可以有效将由下而上挥发的有机物阻挡，消除其与镜片直接接触的机会，防止物镜镜片受到光刻胶的有机物挥发污染，保证物镜的成像质量。

Description

物镜保护装置、物镜系统以及光刻设备 技术领域
本发明涉及半导体及光学技术领域，特别涉及一种物镜保护装置、物镜系统以及光刻设备。
背景技术
物镜作为光刻机的核心组件，直接决定着产品的成像质量。物镜底层镜片与硅片距离很小(约40mm)，光刻机在曝光过程中，硅片表面涂有的光刻胶中含有有机溶剂，在曝光作用下会持续缓慢的挥发。随着光刻机的持续运行，挥发的有机溶剂会粘附在物镜的下表面，在底层镜片下表面形成有机溶剂污染膜。该污染膜严重影响物镜中光的透过率，降低硅片的成像效果，不利于产品质量。
针对上述问题，目前的主要处理办法有：
1.为了保证成像质量，对底层镜片表面定期擦拭去除黏着的有机溶剂，但再小心的擦拭，也会对镜片的镀膜有影响，造成镜片不可逆损坏，该接触式的处理方式不宜频繁使用。同时，直接擦拭受到操作人员熟练度等因素的影响会出现不同的结果，产品的均一性控制困难。
2.在物镜的底层镜片下面设置镜座，安装一层极薄的物镜保护膜来防止有机溶剂附着在镜片表面。该方法虽可以有效防止镜片污染，但保护膜受到光的透射，光是具有能量的，会导致保护膜的使用寿命缩短。同时，受到目前技术的限制，极薄的保护膜一方面安装操作难度大，且会受外界气压影响，十分容易破裂(损坏率高达15％)；另一方面，根据透射光的能量大小不同和成像质量的要求，保护膜只能维持30-60天必须更换，影响设备的持续高效运行，增加了用户的使用成本。
因此寻求一种持续高效，稳定可靠的防止镜片污染的处理方法。
发明内容
有鉴于此，本发明的目的在于提供一种物镜保护装置、物镜系统以及光刻设备，以解决物镜容易受到污染的问题。
为解决上述技术问题，本发明提供一种物镜保护装置，包括一主体结构，所述主体结构具有相对设置的送气单元和第一抽排单元，所述送气单元用于输出气体，所述第一抽排单元用于对所述送气单元输出的气体进行抽排，从而在所述送气单元和所述第一抽排单元之间形成至少一层风幕。
可选的，所述送气单元具有送气面，所述送气面垂直于所述送气单元的送气方向，所述送气面上设有多个送气口；所述第一抽排单元具有第一抽气面，所述第一抽气面上设有多个第一抽气口，所述多个送气口与所述多个第一抽气口一一对应且对向设置。
可选的，所述送气面和所述第一抽气面为阶梯型。
可选的，所述送气面和所述第一抽气面呈轴对称分布。
可选的，所述送气面包括多个不在一个平面的子送气面，所述多个子送气面之间平行分布。
可选的，所述送气单元还设有多个非送气面，每个非送气面用于连接相邻的两个子送气面，所述非送气面上不设有所述送气口，所述非送气面与所述子送气面呈85°～95°的夹角。
可选的，所述第一抽气面包括不在一个平面的多个第一子抽气面，所述多个第一子抽气面之间平行分布。
可选的，所述第一抽排单元还设有非抽气面，每个非抽气面用于连接相邻的两个子抽气面，所述非抽气面上不设有所述第一抽气口，所述非抽气面与所述第一抽气面呈85°～95°的夹角。
可选的，所述送气单元还具有一进气口，所述进气口与多个送气口均连通；所述第一抽排单元还具有一排气口，所述排气口与多个第一抽气口均连 通。
可选的，所述主体结构还包括第二抽排单元，所述第二抽排单元具有环形的第二抽气面，所述第二抽气面位于所述主体结构的下表面。
可选的，所述第二抽气面设有多个第二抽气孔。
可选的，所述第二抽气面的抽气方向不平行于所述送气单元的送气方向。
可选的，所述第二抽气面的抽气方向垂直于所述送气单元的送气方向。
可选的，所述第二抽排单元设有第二抽排腔，所述第二抽气面将气体抽至所述第二抽排腔。
可选的，所述第一抽排单元包括第一抽排腔，所述排气口与所述第一抽排腔连通，气体从所述多个第一抽气口进入所述第一抽排腔，由所述排气口排出；所述第一抽排腔和所述第二抽排腔相互连通。
可选的，所述主体结构还具有一连接部，用于与物镜连接，所述连接部位于所述主体结构的一侧。
可选的，所述连接部为一螺纹端口。
可选的，还包括物理保护层，所述物理保护层与所述主体结构连接，并位于被保护物镜与所述至少一层风幕之间。
可选的，所述物理保护层采用玻璃材质或树脂材质。
可选的，还包括密封件，用于密封所述物理保护层和所述主体结构之间的间隙，所述密封件位于所述物理保护层和所述主体结构之间。
可选的，所述主体结构为一体成型结构。
为了解决上述问题，本发明另一方面提供一种物镜系统，包括上述的物镜保护装置。
为了解决上述问题，本发明又提供一种光刻设备，包括上述的物镜系统。
本发明提供的物镜保护装置具有以下有益效果：
(1)，利用送气单元和抽排单元形成风幕，当装置运行时，在横向细密均匀的送气口作用下，可以有效控制出风流速，将风控制在层流状态，保证 风幕的流场均匀，同时，在第一抽气口的作用下，形成了一层覆盖整个镜片的风幕，可以有效将由下而上挥发的有机物阻挡，消除其与镜片直接接触的机会，防止物镜镜片受到光刻胶的有机物挥发污染，保证物镜的成像质量；
(2)，竖向的第二抽气口可抽取挥发的污物，减小了污物污染其他部件。第二抽气口细密均匀的构造同样可以有效控制抽排气流的流场，在不扰乱风幕的条件下，将挥发物质抽排出机器内部；
(3)，物理保护层形成第二重物理防护，可以确保挥发污染物无法接触镜片；
(4)，送气口、第一抽气口以及第二抽气口均为细密均匀分布的圆形通孔，可以有效控制出风和抽排风的流速，将其控制在层流状态，确保风幕的稳定，保证风幕的阻挡效果和抽排的充分；
(5)，主体结构一体成型，装置更加紧凑，占用空间小。
附图说明
图1是本发明一实施例中物镜保护装置的立体示意图；
图2a是本发明一实施例中物镜保护装置的俯视图；
图2b、图2c是本发明另一实施例中物镜保护装置的俯视图；
图3是图2a的剖面视图A-A；
图4是图2a的剖面视图B-B；
图5是本发明一实施例中物镜保护装置的主视图；
图6是图5的剖面视图C-C。
图中：10-主体结构；11-送气单元；111-进气口；112-送气口；12-第一抽排单元；121-排气口；122-第一抽气口；123-第二抽气口；13-连接部；14-气体通道；20-物理保护层；30-密封件；A-送气面；B-非送气面；C-第一抽气面；D-非抽气面。
具体实施方式
以下结合附图和具体实施例对本发明提出的物镜保护装置、物镜系统以及光刻设备作进一步详细说明。根据权利要求书和下面说明，本发明的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
本实施例以光刻机为例介绍一种物镜保护装置，当然该装置并不限于光刻机的应用，还可以应用于类似的具有相似防污染要求的不同类型的设备上。
参阅图1～图6，本实施例提供的物镜保护装置包括一主体结构10，所述主体结构10具有一送气单元11和第一抽排单元12，送气单元11和第一抽排单元12之间具有一定空间，用于形成至少一层风幕。发明人研究发现风幕做为一种流动的气流可起到隔离保护的作用，该装置设置在物镜的下方，在光刻机刻蚀硅片的过程中，当硅片表面的有机溶剂向上挥发时，风幕可阻挡住挥发的有机溶剂进入物镜表面。其中所形成的风幕可平行于物镜表面，也可以略微倾斜于物镜表面，其倾斜角度范围可在1°～5°之间。所述主体结构10的结构尺寸只要不影响物镜和/或其他装置的装配关系和正常工作即可，本领域技术人员可根据具体的工作环境来具体设计主体结构10的结构尺寸，所以本申请并不对此做具体限定。
进一步的，参考图2，送气单元11具有送气面A，第一抽排单元12具有第一抽气面C，在送气面A与第一抽气面C之间形成所述至少一层风幕，其中，送气面A和第一抽气面C对向设置，以使所形成的风幕均匀性更好。送气单元11具有进气口111(参见图4)和多个送气口112，所述进气口111用于连接外部气源，多个送气口112均匀地分布于送气面A上，并均与进气口111连通。第一抽排单元12具有排气口121(参见图3)和多个第一抽气口122，多个第一抽气口122均匀分布于第一抽气面C上，并均与排气口121连通；排气口121用于连接抽排设备，位于第一抽气面C的多个第一抽气口122与多个送气口112相对设置，且一一对应，或配置为能够维持风幕的其他对 应形式。多个第一抽气口122均匀的横向分布，用于吸收送气口112送出的气流，以在物镜表面一侧形成稳定的风幕，从而保证风幕的均匀性和覆盖面积，所形成的稳定风幕可平行于物镜表面，也可与物镜表面形成一定夹角，可由本领域技术人员根据实际情况进行选择。具体的，第一抽气口122和送气口112均为直径范围为0.5mm～1mm的圆形通孔；较佳的，多个送气口112均匀分布，多个第一抽气口122也均匀分布。
所述第一抽排单元12包括第一抽排腔(未图式)，所述排气口121与所述第一抽排腔连通，气体从第一抽气口122进入所述第一抽排腔，由所述排气口121排出。
参阅图2a-2c，其中，送气面A和/或第一抽气面C结构可以是阶梯型，送气面A可包括多个不在一个平面的子送气面，多个子送气面之间平行分布。送气面A和/或第一抽气面C不仅可以设置成如图2a-2c所示的水平向的阶梯型，即多个子送气面具有相同的垂向，且至少两个子送气面在平行于送气方向的水平轴上具有不同的位置；还可以是垂向的阶梯型，即至少两个子送气面在垂向上具有不同的位置，且至少两个子送气面在平行于送气方向的水平轴上具有不同的位置。上述的相同位置和不同位置仅以该方向上坐标为依据，本领域技术人员可以根据实际需要对上述方案进行变动。
送气单元还设有非送气面B，所述非送气面B上不设有所述送气口，非送气面B与所述送气面A的夹角范围为85°～95°，优选为90°夹角，当然本申请并不局限于90°夹角，其他角度也是可实施的方案。
送气面A和/或所述第一抽气面C成对称分布(例如轴对称)，送气面A垂直于送气单元11的送气方向。第一抽排单元12具有第一抽气面C，所述第一抽气面设有第一抽气口122，所述第一抽气面C垂直于送气单元11的送气方向。第一抽气面C包括不在一个平面的多个第一子抽气面，多个第一子抽气面之间平行分布，第一抽排单元12还设有非抽气面D，非抽气面D上不设有第一抽气口122，非抽气面D与第一抽气面C的夹角范围为85°～95°， 优选为90°夹角，当然本申请并不局限于90°夹角，其他角度也是可实施的方案。
进一步的，主体结构10还具有第二抽排单元(未图式)，第二抽排单元设有第二抽气面，第二抽气面可平行于水平面且为环形，所述第二抽气面位于所述主体结构10的下表面，其上均匀布置有多个第二抽气口123，第二抽气面上的多个第二抽气口123均与排气口121连通，多个第二抽气口123围绕所形成的风幕分布在所述第二抽气面上。所述第二抽气面的抽气方向不平行于所述送气单元的送气方向。在本发明的另一实施例中，所述第二抽气面的抽气方向垂直于所述送气单元的送气方向。
第二抽气口123的开口方向背向所述物镜，用于抽吸硅片周围夹杂挥发物质的气流，从而彻底的将挥发物质排除，有效的避免污染物质对镜片及其他结构组件的污染。第二抽排单元具有第二抽排腔，气体被第二抽气口抽至第二抽排腔，并最终排至设备外。第二抽排腔可以和第一抽排腔分开设置，也可以合并为同一个抽排腔，具体的，主体结构10为中空结构，在主体结构10中具有一气体通道14(也就是第二抽排腔)，气体通道14将所有第二抽气口123与第一抽排单元12连通。
具体的，第二抽气口123为直径0.5mm～1mm的圆形通孔，所有的第二抽气口123在主体结构10均匀分布。根据图1所示，主体结构10的形状为环状柱体，所有竖向分布的第二抽气口123绕环主体结构一周分布，以使所述的第二抽气口123将风幕围住，防止挥发气体进入风幕上侧的物镜。送气单元11和第一抽排单元12位于主体结构10的内侧，且相对设置。
进一步的，所述送气单元11的送气面为具有呈阶梯状的阶梯面，以适应环状柱体的主体结构10，所有的送气口112分布在所述阶梯面上。相对应的，第一抽排单元12的第一抽气面具有呈阶梯状的阶梯面，所有的第一抽气口122分布在所述阶梯面上。送气面与第一抽气面不与物镜工作区域(光束通路)产生交集。
如图3所示，为了便于物镜保护装置与物镜的连接，主体结构10还具有一连接部13，用于与物镜连接，连接部13位于主体结构10的一侧。可选的，连接部13为一螺纹端口。
本实施例提供的主体结构10为一体成型结构，可采用3D打印的方式制造。相比机械组装，可以有效减小该装置的体积，实现轻量化，小型化。
进一步的，本实施例提供的物镜保护装置还包括物理保护层20，物理保护层20与主体结构10连接，并覆盖所形成的至少一层风幕。具体的，主体结构10的一侧具有一环形凹槽，其尺寸与物理保护层20相对应，物理保护层20安装在环形凹槽中。较佳的，物理保护层20采用玻璃材质或树脂材质，具体的可以是一圆形的保护玻璃。
进一步，如图3及图4所示，在物理保护层20和主体结构10之间还设置有密封件30，用于密封物理保护层20和主体结构10之间的间隙。
本实施例提供的物镜保护装置的应用方法如下：在光刻机启动曝光之前，该主体结构10对应的外部气源和抽排设备提前启动；同时，停机时，为了保护镜片及设备内零部件不受污染，主体结构10对应的鼓风设备和抽排设备应最后停机或持续运行一段时间，以12小时左右为宜。
本发明还提供一种物镜系统，物镜系统装有上述物镜保护装置，物镜保护装置设置于物镜系统一端，且二者相连。
本发明还提供一种光刻设备，光刻设备各个分系统属本领域公知，不再赘述。其中，光刻设备包括的物镜系统装配有上述物镜保护装置，物镜保护装置位于物镜系统和光刻设备的工件台系统之间，在曝光过程及非曝光过程中保护物镜系统免受来自工件台及工件所散出的气体或液滴或其他形式的污染物的污染。
综上所述，本发明提供的物镜保护装置具有以下有益效果：
(1)，利用送气单元和抽排单元形成风幕，当装置运行时，在横向细密均匀的送气口作用下，可以有效控制出风流速，将出风控制在层流状态，保 证风幕的流场均匀，同时，在第一抽气口的作用下，形成了一层覆盖整个镜片的风幕，可以有效将由下而上挥发的有机物阻挡，消除其与镜片直接接触的机会，防止物镜镜片受到光刻胶的有机物挥发污染，保证物镜的成像质量；
(2)，竖向的第二抽气口可抽取挥发的污物，减小了污物污染其他部件。第二抽气口细密均匀的构造同样可以有效控制抽排气流的流场，在不扰乱风幕的条件下，将挥发物质抽排出机器内部；
(3)，物理保护层形成第二重物理防护，可以确保挥发污染物无法接触镜片；
(4)，送气口、第一抽气口以及第二抽气口均为细密均匀分布的圆形通孔，可以有效控制出风和抽排风的流速，将其控制在层流状态，确保风幕的稳定，保证风幕的阻挡效果和抽排的充分；
(5)，主体结构一体成型，装置更加紧凑，占用空间小。
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。对于实施例公开的系统而言，由于与实施例公开的方法相对应，所以描述的比较简单，相关之处参见方法部分说明即可。
上述描述仅是对本发明较佳实施例的描述，并非对本发明范围的任何限定，本发明领域的普通技术人员根据上述揭示内容做的任何变更、修饰，均属于权利要求书的保护范围。

Claims (23)

  1. 一种物镜保护装置，其特征在于，包括一主体结构，所述主体结构具有相对设置的送气单元和第一抽排单元，所述送气单元用于输出气体，所述第一抽排单元用于对所述送气单元输出的气体进行抽排，从而在所述送气单元和所述第一抽排单元之间形成至少一层风幕。
  2. 如权利要求1所述的物镜保护装置，其特征在于，所述送气单元具有送气面，所述送气面垂直于所述送气单元的送气方向，所述送气面上设有多个送气口；所述第一抽排单元具有第一抽气面，所述第一抽气面上设有多个第一抽气口，所述多个送气口与所述多个第一抽气口一一对应且对向设置。
  3. 如权利要求2所述的物镜保护装置，其特征在于，所述送气面和所述第一抽气面为阶梯型。
  4. 如权利要求2所述的物镜保护装置，其特征在于，所述送气面和所述第一抽气面呈轴对称分布。
  5. 如权利要求2所述的物镜保护装置，其特征在于，所述送气面包括多个不在一个平面的子送气面，所述多个子送气面之间平行分布。
  6. 如权利要求5所述的物镜保护装置，其特征在于，所述送气单元还设有多个非送气面，每个非送气面用于连接相邻的两个子送气面，所述非送气面上不设有所述送气口，所述非送气面与所述子送气面呈85°～95°的夹角。
  7. 如权利要求2所述的物镜保护装置，其特征在于，所述第一抽气面包括不在一个平面的多个第一子抽气面，所述多个第一子抽气面之间平行分布。
  8. 如权利要求7所述的物镜保护装置，其特征在于，所述第一抽排单元还设有非抽气面，每个非抽气面用于连接相邻的两个子抽气面，所述非抽气面上不设有所述第一抽气口，所述非抽气面与所述第一抽气面呈85°～95°的夹角。
  9. 如权利要求2所述的物镜保护装置，其特征在于，所述送气单元还具 有一进气口，所述进气口与多个送气口均连通；所述第一抽排单元还具有一排气口，所述排气口与多个第一抽气口均连通。
  10. 如权利要求2所述的物镜保护装置，其特征在于，所述主体结构还包括第二抽排单元，所述第二抽排单元具有环形的第二抽气面，所述第二抽气面位于所述主体结构的下表面。
  11. 如权利要求10所述的物镜保护装置，其特征在于，所述第二抽气面设有多个第二抽气孔。
  12. 如权利要求10所述的物镜保护装置，其特征在于，所述第二抽气面的抽气方向不平行于所述送气单元的送气方向。
  13. 如权利要求10所述的物镜保护装置，其特征在于，所述第二抽气面的抽气方向垂直于所述送气单元的送气方向。
  14. 如权利要求10所述的物镜保护装置，其特征在于，所述第二抽排单元设有第二抽排腔，所述第二抽气面将气体抽至所述第二抽排腔。
  15. 如权利要求14所述的物镜保护装置，其特征在于，所述第一抽排单元包括第一抽排腔，所述排气口与所述第一抽排腔连通，气体从所述多个第一抽气口进入所述第一抽排腔，由所述排气口排出；所述第一抽排腔和所述第二抽排腔相互连通。
  16. 如权利要求1所述的物镜保护装置，其特征在于，所述主体结构还具有一连接部，用于与物镜连接，所述连接部位于所述主体结构的一侧。
  17. 如权利要求16所述的物镜保护装置，其特征在于，所述连接部为一螺纹端口。
  18. 如权利要求1所述的物镜保护装置，其特征在于，还包括物理保护层，所述物理保护层与所述主体结构连接，并位于被保护物镜与所述至少一层风幕之间。
  19. 如权利要求18所述的物镜保护装置，其特征在于，所述物理保护层采用玻璃材质或树脂材质。
  20. 如权利要求18所述的物镜保护装置，其特征在于，还包括密封件，用于密封所述物理保护层和所述主体结构之间的间隙，所述密封件位于所述物理保护层和所述主体结构之间。
  21. 如权利要求1所述的物镜保护装置，其特征在于，所述主体结构为一体成型结构。
  22. 一种物镜系统，其特征在于，包括如权利要求1-21所述的物镜保护装置。
  23. 一种光刻设备，其特征在于，包括如权利要求22所述的物镜系统。
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