AU2001259331A1 - Non-contact seal using purge gas - Google Patents

Non-contact seal using purge gas

Info

Publication number
AU2001259331A1
AU2001259331A1 AU2001259331A AU5933101A AU2001259331A1 AU 2001259331 A1 AU2001259331 A1 AU 2001259331A1 AU 2001259331 A AU2001259331 A AU 2001259331A AU 5933101 A AU5933101 A AU 5933101A AU 2001259331 A1 AU2001259331 A1 AU 2001259331A1
Authority
AU
Australia
Prior art keywords
purge gas
contact seal
seal
contact
purge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001259331A
Inventor
Eric C. Hansell
Jose V. Herrera
Richard L. Huse
Jorge S. Ivaldi
Stephen G. Krehley
Thomas P. Shamaly
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML US Inc
Original Assignee
ASML US Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML US Inc filed Critical ASML US Inc
Publication of AU2001259331A1 publication Critical patent/AU2001259331A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00—Bearings for parts moving only linearly
    • F16C29/02—Sliding-contact bearings
    • F16C29/025—Hydrostatic or aerostatic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/06—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
    • F16C32/0603—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816—Bearings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
AU2001259331A 2000-05-03 2001-05-02 Non-contact seal using purge gas Abandoned AU2001259331A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20170400P 2000-05-03 2000-05-03
US60201704 2000-05-03
PCT/US2001/014067 WO2001084241A1 (en) 2000-05-03 2001-05-02 Non-contact seal using purge gas

Publications (1)

Publication Number Publication Date
AU2001259331A1 true AU2001259331A1 (en) 2001-11-12

Family

ID=22746949

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001259331A Abandoned AU2001259331A1 (en) 2000-05-03 2001-05-02 Non-contact seal using purge gas

Country Status (7)

Country Link
US (1) US6559922B2 (en)
EP (1) EP1279070B1 (en)
JP (1) JP4503906B2 (en)
KR (1) KR100833275B1 (en)
AU (1) AU2001259331A1 (en)
DE (1) DE60130754T2 (en)
WO (1) WO2001084241A1 (en)

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TWI233535B (en) 1999-04-19 2005-06-01 Asml Netherlands Bv Motion feed-through into a vacuum chamber and its application in lithographic projection apparatuses
KR100805142B1 (en) 1999-07-16 2008-02-21 가부시키가이샤 니콘 Exposure method and system
US6954255B2 (en) 2001-06-15 2005-10-11 Canon Kabushiki Kaisha Exposure apparatus
WO2003034153A2 (en) * 2001-10-12 2003-04-24 Koninklijke Philips Electronics N.V. Lithographic apparatus and device manufacturing method
EP1310828A1 (en) * 2001-11-09 2003-05-14 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US6934003B2 (en) 2002-01-07 2005-08-23 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
DE10239344A1 (en) 2002-08-28 2004-03-11 Carl Zeiss Smt Ag Device for sealing an optical projection unit flows noble gas or nitrogen around intermediate spaces to give contactless sealing
KR100588124B1 (en) 2002-11-12 2006-06-09 에이에스엠엘 네델란즈 비.브이. Lithographic Apparatus and Device Manufacturing Method
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN100470367C (en) 2002-11-12 2009-03-18 Asml荷兰有限公司 Lithographic apparatus and device manufacturing method
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6770895B2 (en) * 2002-11-21 2004-08-03 Asml Holding N.V. Method and apparatus for isolating light source gas from main chamber gas in a lithography tool
JP4035510B2 (en) * 2003-02-12 2008-01-23 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus including a gas cleaning system
EP1447715A3 (en) * 2003-02-12 2009-09-02 ASML Netherlands B.V. Lithographic apparatus and method to detect correct clamping of an object
TWI275913B (en) 2003-02-12 2007-03-11 Asml Netherlands Bv Lithographic apparatus and method to detect correct clamping of an object
JP2004259786A (en) * 2003-02-24 2004-09-16 Canon Inc Aligner
TWI621923B (en) 2003-02-26 2018-04-21 Nikon Corp Exposure apparatus, exposure method, and component manufacturing method
US6919573B2 (en) * 2003-03-20 2005-07-19 Asml Holding N.V Method and apparatus for recycling gases used in a lithography tool
KR101697896B1 (en) 2003-04-11 2017-01-18 가부시키가이샤 니콘 Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI540612B (en) 2003-06-19 2016-07-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
EP1498778A1 (en) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1491954A1 (en) 2003-06-27 2004-12-29 ASML Netherlands B.V. Sealing assembly, lithographic projection apparatus, and device manufacturing method
EP1494079B1 (en) * 2003-06-27 2008-01-02 ASML Netherlands B.V. Lithographic Apparatus
WO2005006418A1 (en) 2003-07-09 2005-01-20 Nikon Corporation Exposure apparatus and method for manufacturing device
EP1510867A1 (en) 2003-08-29 2005-03-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352433B2 (en) * 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005047979A2 (en) * 2003-11-06 2005-05-26 Carl Zeiss Smt Ag Optical system
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US7057702B2 (en) * 2004-06-23 2006-06-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG126120A1 (en) * 2005-03-29 2006-10-30 Asml Netherlands Bv Lithographic device, device manufacturing method and device manufactured thereby
US7502095B2 (en) 2005-03-29 2009-03-10 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US20070085984A1 (en) * 2005-10-18 2007-04-19 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing method and device manufactured thereby
US7719661B2 (en) * 2007-11-27 2010-05-18 Nikon Corporation Illumination optical apparatus, exposure apparatus, and method for producing device
JP5827827B2 (en) 2010-06-29 2015-12-02 エーエスエムエル ネザーランズ ビー．ブイ． Actuator
EP2423749B1 (en) * 2010-08-24 2013-09-11 ASML Netherlands BV A lithographic apparatus and device manufacturing method
NL2008954A (en) * 2011-07-08 2013-01-09 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US9513568B2 (en) 2012-07-06 2016-12-06 Asml Netherlands B.V. Lithographic apparatus
WO2016074876A1 (en) * 2014-11-13 2016-05-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL2016399A (en) * 2015-04-20 2016-10-24 Asml Netherlands Bv Lithographic Apparatus and Method in a Lithographic Process.
CN107783283B (en) * 2016-08-30 2020-01-24 上海微电子装备（集团）股份有限公司 Lens anti-pollution device and method
CN109283797B (en) 2017-07-21 2021-04-30 上海微电子装备（集团）股份有限公司 Objective lens protection device, objective lens system and lithographic apparatus
EP3620858B1 (en) * 2018-09-10 2023-11-01 Canon Kabushiki Kaisha Exposure apparatus and method of manufacturing article
CN114830463A (en) * 2019-12-20 2022-07-29 西默有限公司 Gas purging system for laser source
CN111736432A (en) * 2020-06-15 2020-10-02 上海集成电路研发中心有限公司 Device for blocking photoresist outgassing pollution

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US4185202A (en) * 1977-12-05 1980-01-22 Bell Telephone Laboratories, Incorporated X-ray lithography
KR940000696B1 (en) 1986-04-15 1994-01-27 햄프셔 인스트루 먼트스 인코포레이티드 X-ray lithography system
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EP1098225A3 (en) 1999-11-05 2002-04-10 Asm Lithography B.V. Lithographic projection apparatus with purge gas system and method using the same

Also Published As

Publication number Publication date
US6559922B2 (en) 2003-05-06
EP1279070A1 (en) 2003-01-29
JP2003532304A (en) 2003-10-28
JP4503906B2 (en) 2010-07-14
EP1279070B1 (en) 2007-10-03
DE60130754D1 (en) 2007-11-15
KR100833275B1 (en) 2008-05-28
US20010038442A1 (en) 2001-11-08
KR20020068492A (en) 2002-08-27
WO2001084241A1 (en) 2001-11-08
DE60130754T2 (en) 2008-01-24

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