WO2019012787A1 - Substrat et boîtier en céramique stratifiés - Google Patents

Substrat et boîtier en céramique stratifiés Download PDF

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Publication number
WO2019012787A1
WO2019012787A1 PCT/JP2018/017588 JP2018017588W WO2019012787A1 WO 2019012787 A1 WO2019012787 A1 WO 2019012787A1 JP 2018017588 W JP2018017588 W JP 2018017588W WO 2019012787 A1 WO2019012787 A1 WO 2019012787A1
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WIPO (PCT)
Prior art keywords
laminated ceramic
ceramic
wiring
ceramic substrate
laminated
Prior art date
Application number
PCT/JP2018/017588
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English (en)
Japanese (ja)
Inventor
宏明 原
芳夫 馬屋原
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日本電気硝子株式会社
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Publication of WO2019012787A1 publication Critical patent/WO2019012787A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Definitions

  • the present invention relates to a laminated ceramic substrate and a laminated ceramic package for mounting a device.
  • a light emitting element mounting substrate is used.
  • An LED (Light Emitting Diode) as an example of a light emitting element mounted on a light emitting element mounting substrate is a compact light source with low power consumption.
  • white LEDs are attracting attention as an alternative to incandescent bulbs and fluorescent lamps.
  • ultraviolet LEDs have attracted attention as ultraviolet light sources in applications such as sterilization, air washing, cancer treatment, and resin curing.
  • Patent Document 1 discloses a light-emitting element mounting substrate in which a light reflection layer is provided on an aluminum nitride substrate.
  • a filled via is provided in an aluminum nitride substrate. The filled via connects the front side electrode and the back side electrode.
  • Patent Document 1 discloses a light emitting device in which a light emitting element is mounted on the light emitting element mounting substrate. The light emitting element is connected to the surface side electrode.
  • resin is provided so that the said light emitting element may be covered, and the light emitting element is sealed by it.
  • the light emitting element is electrically connected to another element through the back surface side electrode of the light emitting element mounting substrate. Therefore, since it is necessary to mount a light emitting element mounting substrate on another mounting substrate on which another element is mounted, it is difficult to reduce the overall height of the device.
  • An object of the present invention is to provide a laminated ceramic substrate and a laminated ceramic package which can exhibit high airtightness and can be reduced in height when the element is mounted and sealed.
  • the multilayer ceramic substrate of the present invention has a main surface, and is provided on the main surface so as to surround a bottom portion formed by laminating a plurality of first ceramic layers and a partial region of the bottom portion.
  • the first ceramic layer at the bottom and the second ceramic layer at the partition are made of the same ceramic material.
  • the stacking direction of the first ceramic layer and the second ceramic layer is the height direction
  • the position in the height direction of the first end of the wiring and the position in the height direction of the second end May be the same.
  • the position in the height direction of the first end of the wiring is from the position in the height direction of the second end It may be high.
  • the position in the height direction of the first end of the wiring is from the position in the height direction of the second end It may be low.
  • the wiring penetrates at least one ceramic layer of the bottom portion in the stacking direction inside the partition wall portion, and at the outside of the partition wall portion, at least one ceramic layer of the bottom portion in the stacking direction It is preferable to have the 2nd penetration part which penetrates, and the connection part which passes through the inside of a bottom part and which connects the 1st penetration part and the 2nd penetration part.
  • a plurality of wirings be provided, and connection portions of at least two of the plurality of wirings be provided in mutually different first ceramic layers.
  • a plurality of wires are provided in the direction orthogonal to the direction in which the connecting portions extend, and the connecting portions of adjacent wires in the direction orthogonal to the direction in which the connecting portions extend are provided in different first ceramic layers.
  • the connecting portion When the length along the direction perpendicular to the laminating direction of the first ceramic layer and the direction in which the connecting portion extends is a width, the connecting portion has a width of the first through portion and the second through portion. It is preferable to be wider than the width.
  • a multilayer ceramic package according to the present invention is characterized by comprising the above-described multilayer ceramic substrate and a glass lid provided on a partition.
  • the present invention it is possible to provide a laminated ceramic substrate and a laminated ceramic package which can exhibit high airtightness and can be reduced in height when the element is mounted and sealed.
  • FIG. 1 is a schematic cross-sectional view showing a laminated ceramic package according to a first embodiment of the present invention.
  • FIG. 2 is a schematic plan view showing the laminated ceramic package of the first embodiment of the present invention.
  • FIG. 3 is a schematic plan view showing a laminated ceramic substrate according to a modification of the first embodiment of the present invention.
  • FIGS. 4 (a) to 4 (d) are schematic cross-sectional views for explaining the method of manufacturing the laminated ceramic package of the first embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing a laminated ceramic package according to a second embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view showing a laminated ceramic package according to a third embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view showing a laminated ceramic package according to a first embodiment of the present invention.
  • FIG. 2 is a schematic plan view showing the laminated ceramic package of the first embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view showing a laminated ceramic package according to a fourth embodiment of the present invention.
  • FIG. 8 is a schematic plan view showing a laminated ceramic substrate according to a fifth embodiment of the present invention.
  • FIG. 9 is a cross-sectional view taken along the line II in FIG.
  • FIG. 10 is a schematic cross-sectional view of a laminated ceramic substrate according to a modification of the fifth embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view showing a laminated ceramic package according to a first embodiment of the present invention.
  • FIG. 2 is a schematic plan view showing the laminated ceramic package of the first embodiment.
  • cover, sealing material layer, a wire etc. which are mentioned later are abbreviate
  • the laminated ceramic package 1 includes a laminated ceramic substrate 2 according to an embodiment of the present invention and a glass lid 7.
  • An element 10 is mounted on the laminated ceramic substrate 2.
  • Examples of the element 10 include light emitting elements such as LEDs for visible light and deep ultraviolet LEDs, and reflection type video devices.
  • the laminated ceramic substrate 2 includes a bottom 3 having a main surface 3 a and a partition 4 provided on the main surface 3 a so as to surround a partial region of the bottom 3.
  • the bottom 3 has an inner area and an outer area of the partition 4.
  • the element 10 is disposed in the region on the inner side of the partition wall 4 on the main surface 3 a of the bottom 3.
  • the bottom 3 is formed by laminating a plurality of first ceramic layers 3b.
  • the partition 4 is formed by laminating a plurality of second ceramic layers 4 b made of the same ceramic material as the first ceramic layer 3 b of the bottom 3.
  • the laminated ceramic substrate 2 is a laminated ceramic substrate in which the bottom 3 and the partition 4 are integrally provided.
  • the first ceramic layer 3b and the second ceramic layer 4b may be made of different ceramic materials.
  • the glass lid 7 is provided on the partition wall 4 of the laminated ceramic substrate 2.
  • the glass lid 7 is bonded to the partition 4 by the sealing material layer 6.
  • the element 10 is sealed by the laminated ceramic substrate 2 and the glass lid 7.
  • the laminated ceramic substrate 2 is provided with the wiring 5 passing through the bottom 3. More specifically, the wiring 5 has a first through portion 5 b which penetrates at least one first ceramic layer 3 b of the bottom portion 3 in the stacking direction z inside the partition 4.
  • the first penetrating portion 5 b includes a first end 5 a exposed to the inside of the partition wall 4 on the main surface 3 a of the bottom 3.
  • the wiring 5 has a second penetrating portion 5 d which penetrates at least one first ceramic layer 3 b in the stacking direction z outside the partition wall 4.
  • the second penetrating portion 5 d includes a second end 5 e exposed to the outside of the partition wall 4 in the main surface 3 a.
  • the wiring 5 has a connection portion 5c which passes through the bottom portion 3 and connects the first through portion 5b and the second through portion 5d.
  • connection portion 5c is provided in one of the plurality of first ceramic layers 3b. Another first ceramic layer 3b is laminated on the surface of the first ceramic layer 3b on which the connection portion 5c is provided.
  • the height direction z of the first end 5 a of the wiring 5 is The position and the position in the height direction z of the second end 5e are the same.
  • the position in the height direction z of the glass lid 7 is higher than the position in the height direction z of the bottom 3.
  • the element 10 is electrically connected to the wiring 5 by the wire 8.
  • the element 10 is electrically connected to another element or the like through the wire 8 and the wiring 5.
  • the wiring 5 and the wire 8 are made of an appropriate metal.
  • the wire 8 is made of Au.
  • a feature of the present embodiment is that the bottom 3 and the partition 4 are a laminate of a plurality of ceramic layers, and the wiring 5 exposed through the bottom 3 inside and outside of the partition 4 on the main surface 3a is It is to have.
  • the second ceramic layer 4b of the partition 4 contacts the first ceramic layer 3b of the bottom 3 over the entire surface, so the bottom 3 and the partition 4 can be integrally provided. Therefore, the sealing property of the laminated ceramic package 1 can be effectively improved.
  • the wiring 5 is exposed to the outside of the partition 4 on the main surface 3a, the element 10 shown in FIG. 1 is electrically connected with other elements etc. without mounting the laminated ceramic package 1 on the mounting substrate. It can be connected. Thus, the overall height of the device including elements other than the element 10 can be reduced.
  • a direction in which the connecting portion 5c extends is taken as a direction x
  • a direction orthogonal to the direction x and the stacking direction z is taken as a direction y.
  • a plurality of wirings 5 are provided in the direction y.
  • a plurality of wires 5 are provided in the direction x. More specifically, as shown in FIG. 1, the connection parts 5c of the plurality of wires 5 are provided on the mutually different first ceramic layers 3b.
  • the second through portion 5 d is also arranged closer to the partition 4.
  • the laminated ceramic substrate 2 and the laminated ceramic package 1 can be miniaturized.
  • the arrangement of the wires 5 is not limited to the above.
  • first ceramic layers 3 b be provided on the outer layer side of the first ceramic layer 3 b in which the connection portion 5 c is provided. Thereby, the strength of the laminated ceramic substrate 2 can be enhanced, and the wires 5 are less likely to be broken.
  • the first ceramic layer 3 b and the second ceramic layer 4 b are preferably made of the same ceramic material as in the present embodiment. Thereby, the adhesion between the bottom 3 and the partition 4 can be effectively enhanced, and the hermeticity of the laminated ceramic package 1 can be effectively enhanced. Furthermore, since the thermal expansion coefficients of the material of the bottom 3 and the material of the partition 4 are the same, the sealing property can be stably enhanced even when the temperature changes, and the reliability can be enhanced.
  • the position in the height direction z of the first end 5a of the wiring 5 and the position in the height direction z of the second end 5e are the same. Therefore, the uniformity of the thickness of the bottom portion 3 is high, and a complicated deformation due to a temperature change hardly occurs. Therefore, the sealing performance can be further enhanced even when the temperature changes, and the reliability can be further enhanced.
  • connection portions 5c of at least two of the plurality of wires 5 be provided on the mutually different first ceramic layers 3b.
  • the wirings 5 can be arranged intensively, and the laminated ceramic substrate 2 and the laminated ceramic package 1 can be miniaturized.
  • FIG. 3 is a schematic plan view showing a laminated ceramic substrate in a modification of the first embodiment.
  • the laminated ceramic substrate 22 of the present modification example has a plurality of heat dissipation members 28 penetrating in the direction z in the portion of the bottom 23 where the element 10 is disposed. Thereby, the heat generated from the element 10 can be effectively dissipated.
  • the heat dissipating member 28 is not particularly limited, but is preferably made of metal such as Ag having high thermal conductivity.
  • the heat dissipation member 28 may be made of a material having a thermal conductivity higher than that of the material of the bottom portion 23.
  • LTCC low temperature co-fired ceramics
  • SiO 2 -B 2 O 3 -RO (R is Mg, Ca, Sr or Ba) based glass
  • SiO 2 -B 2 O 3 -R '2 O (R 'Is Li, Na or Ka) glass
  • SiO 2 -B 2 O 3 -RO-R' 2 O (R 'is Li, Na or K) glass and the like.
  • the sealing material for forming the sealing material layer 6 is a low melting point sealing such as Bi 2 O 3 based glass powder, SnO-P 2 O 5 based glass powder, V 2 O 5 -TeO 2 based glass powder, etc. It is preferable to contain glass. In particular, in the case of sealing by laser irradiation, bismuth glass having a low softening point is used as the sealing glass from the viewpoint of the need to soften the sealing material by heating for a further shorter time and further enhancing the bonding strength. It is more preferable to use a powder. Further, the sealing material may contain a low expansion refractory filler, a laser absorbing material, and the like.
  • low expansion refractory fillers examples include cordierite, willemite, alumina, zirconium phosphate compounds, zircon, zirconia, tin oxide, quartz glass, ⁇ -quartz solid solution, ⁇ -eucryptite, and ⁇ -spodumene.
  • compounds, such as an oxide containing at least 1 sort (s) of metal selected from Fe, Mn, Cu etc., or this metal, are mentioned, for example.
  • FIGS. 4 (a) to 4 (d) are schematic cross-sectional views for explaining the method of manufacturing the laminated ceramic package of the first embodiment of the present invention.
  • the first green sheet 83 b shown in FIG. 4A is prepared. More specifically, a slurry is prepared by adding and kneading a resin binder, a plasticizer and a solvent to ceramic powder. Next, the prepared slurry is coated on a substrate such as PET (polyethylene terephthalate) with a doctor blade or the like and then dried to prepare a first green sheet 83b. Next, a plurality of holes 85a are provided in the first green sheet 83b.
  • the method of forming the holes 85a is not particularly limited, and the holes 85a can be formed, for example, by mechanical processing using punching or a drill, laser processing, or the like.
  • the holes 85a are filled with the metal paste 85b, and then the metal paste 85c is applied onto the first green sheet 83b by printing or the like.
  • the metal paste 85c is a metal paste for forming the connection portion 5c of the wiring 5 shown in FIG.
  • a plurality of first green sheets 83b are produced by the same method.
  • a plurality of second green sheets are produced by punching out a green sheet produced in the same manner as the first green sheet 83b into a frame shape.
  • the metal paste 85c is not exposed to the outside, and the plurality of metal pastes 85b filled in the holes 85a of the first green sheets 83b overlap each other.
  • the first green sheet 83b is laminated and crimped.
  • stack so that the 1st green sheet 83b in which the metal paste 85c is not formed becomes the outermost layer of the direction which does not mount the said element 10. FIG. As a result, the strength of the bottom 3 can be increased, and the wires 5 are less likely to be broken.
  • the plurality of second green sheets 84b are stacked on the stacked body of the plurality of first green sheets 83b.
  • the second green sheet 84b is laminated so as to have 85b (holes 85a).
  • the plurality of first green sheets 83b and the plurality of second green sheets 84b are pressure-bonded using a warm water laminator or the like.
  • firing is performed, for example, at a temperature of 800 ° C. or more and 900 ° C. or less to obtain the laminated ceramic substrate 2 shown in FIG.
  • the sealing material 86 is disposed on the partition 4 or below the glass lid 7.
  • the placement of the sealing material 86 can be performed, for example, by printing a paste in which the sealing material 86 and a suitable organic binder are mixed.
  • firing is performed, for example, at a temperature of 400 ° C. or more and 600 ° C. or less.
  • the element 10 is disposed on the major surface 3 a of the bottom 3 of the laminated ceramic substrate 2.
  • the element 10 and the first end 5 a of the wiring 5 are connected by the wire 8.
  • a metal film such as an Au film is formed on the first end 5 a of the wiring 5 before the element 10 is disposed on the laminated ceramic substrate 2.
  • the metal film can be formed by, for example, an electroless plating method or an electrolytic plating method.
  • the glass lid 7 is disposed on the partition 4.
  • the sealing material 86 is irradiated with the laser light L from the glass lid 7 side.
  • the sealing material 86 is softened and the glass lid 7 and the partition 4 are joined.
  • the laser light L for example, laser light having a wavelength of 600 nm or more and 1600 nm or less can be used.
  • the inside is hermetically sealed to obtain the laminated ceramic package 1 shown in FIG.
  • FIG. 5 is a schematic cross-sectional view showing a laminated ceramic package according to a second embodiment of the present invention.
  • the present embodiment differs from the first embodiment in that a recess 33 c is provided in the region of the bottom 33 inside the partition 4.
  • the main surface 33a of the bottom portion 33 has a step due to the provision of the recess 33c.
  • the length along the height direction z of the first through portion 5b of the wiring 35 is shorter than the length along the height direction z of the second through portion 35d.
  • the position in the height direction z of the first end 5a is lower than the position in the height direction z of the second end 35e.
  • the thickness of the outer region is thicker than the thickness of the inner region of the partition wall 4, so that the strength of the outer side of the laminated ceramic substrate 32 can be enhanced. Thus, when an impact or the like is applied from the outside, it is difficult to be damaged.
  • the bottom portion 33 and the partition portion 4 can be integrally provided, and the sealing property of the laminated ceramic package can be effectively enhanced.
  • the wiring 35 is exposed to the outside of the partition wall 4 in the main surface 33a, reduction in height can be achieved as a whole device including elements other than the element 10 as in the first embodiment. it can.
  • FIG. 6 is a schematic cross-sectional view showing a laminated ceramic package according to a third embodiment of the present invention.
  • the point where the recess 43c does not reach the position where the wiring 45 is provided and the thickness outside the partition 4 at the bottom 43 are the thickness at the portion where the recess 43c is provided. It differs from the second embodiment in that it is the same.
  • the length along the height direction z of the first through portion 45b of the wiring 45 is longer than the length along the height direction z of the second through portion 5d.
  • the position in the height direction z of the first end 45a is higher than the position in the height direction z of the second end 5e.
  • the position in the height direction z of the first end 45 a can be made close to the position in the height direction z of the portion connected to the wire 8 of the element 10. Therefore, the element 10 and the wiring 45 can be easily connected, and the productivity can be improved.
  • the position in the height direction z of the first end 45 a be substantially the same as the position in the height direction z of the portion connected to the wire 8 of the element 10. Thereby, the element 10 and the wiring 45 can be more easily connected, and the productivity can be further enhanced.
  • the thickness of the bottom portion 43 at the outer side of the partition wall 4 is thinner than the thickness at the portion where the first through portion 45 a of the wiring 45 is provided. Thereby, the amount of ceramic material used for the bottom 43 can be reduced, and the productivity can be enhanced.
  • the bottom portion 43 and the partition portion 4 can be integrally provided, and the sealing property of the laminated ceramic package can be effectively enhanced.
  • the wiring 45 is exposed to the outside of the partition wall 4 on the main surface, the overall height of the device including elements other than the element 10 can be reduced as in the second embodiment.
  • FIG. 7 is a schematic cross-sectional view showing a laminated ceramic package according to a fourth embodiment of the present invention.
  • the present embodiment is different from the second embodiment in that in the laminated ceramic substrate 52, the recess 43c does not reach the position where the wiring 5 is provided.
  • the position in the height direction z of the first end 5a of the wiring 5 and the position in the height direction z of the second end 5e are the same. Also in this case, as in the third embodiment, by providing the recess 43 c, the position of the first end 5 a in the height direction z and the portion of the portion connected to the wire 8 of the element 10 The position in the height direction z can be made closer. Therefore, the element 10 and the wiring 5 can be easily connected, and the productivity can be improved. In addition, in the bottom portion 53, since the thickness of the region outside the partition 4 is thicker than the thickness of the portion where the recess 43c is provided, the strength of the outer side of the laminated ceramic substrate 52 can be enhanced.
  • the bottom portion 53 and the partition portion 4 can be integrally provided, and the sealing property of the laminated ceramic package can be effectively enhanced.
  • the wiring 5 is exposed to the outside of the partition wall 4 on the main surface, the overall height of the device including elements other than the element 10 can be reduced as in the second embodiment.
  • FIG. 8 is a schematic plan view showing a laminated ceramic substrate according to a fifth embodiment of the present invention.
  • FIG. 9 is a cross-sectional view taken along the line II in FIG.
  • the laminated ceramic substrate 62 of this embodiment differs from the first embodiment in the configuration of the wiring 65.
  • a plurality of wirings 65 are provided at equal pitches in the direction y.
  • the pitch in the direction y of the wiring 65 is D.
  • the positions in the direction x of the respective first ends 5a of the wires 65 adjacent in the direction y are different from each other. As a result, even when the positional deviation of the first end 5 a occurs, the adjacent wires 65 are unlikely to be short circuited. Therefore, the pitch can be narrowed without causing a short circuit between the wires 65, and the wires 65 can be arranged intensively.
  • connection portions 65c of the wirings 65 adjacent in the direction y are provided on the mutually different first ceramic layers 3b.
  • the width of the connection portion 65c is wider than the width of the first through portion 5b and the second through portion.
  • the electrical resistance of the wiring 65 can be reduced.
  • the bottom portion 63 and the partition portion 4 can be integrally provided, and the sealing property of the laminated ceramic package can be effectively enhanced.
  • the wiring 65 is exposed to the outside of the partition wall 4 on the main surface, the overall height of the device including elements and the like other than the element 10 can be reduced as in the first embodiment.
  • connection portions 65c are provided to the three first ceramic layers 3b.
  • the interconnections 65 are provided in the same first ceramic layer 3 b for every third wiring 65 in the direction y. Therefore, the pitch of the wiring 65 provided in the same first ceramic layer 3 b is 3D. In this case, the width of the connection portion 65c may be less than 3D which is the pitch of the wiring 65 provided in the same first ceramic layer 3b.
  • FIG. 10 is a schematic cross-sectional view of a laminated ceramic substrate according to a modification of the fifth embodiment.
  • FIG. 10 shows a cross section of a modification corresponding to the cross section shown in FIG.
  • connection portions 75c are provided to the six first ceramic layers 3b.
  • the width of the connection portion 75c can be wider than 3D, and the electrical resistance of the wiring 75 can be further lowered.
  • the width of the connection portion 75c may be increased by increasing the number of the first ceramic layers 3b.
  • the minimum number of layers of the first ceramic layer 3b is four. Can be effectively reduced in height.

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  • Ceramic Engineering (AREA)
  • Led Device Packages (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

L'invention concerne un substrat et un boîtier en céramique stratifiés qui peuvent, lorsqu'un élément est monté sur ceux-ci et est scellé, présenter une étanchéité à l'air et une réduction de hauteur élevées. La présente invention fait appel à : une partie de base 3 qui comporte une surface principale 3a et qui est formée par stratification d'une pluralité de premières couches de céramique 3b ; une partie de paroi de séparation 4 qui est disposée sur la surface principale 3a de façon à entourer une région partielle de la partie de base 3 et qui est formée par stratification d'une pluralité de secondes couches de céramique 4b ; et une ligne de câblage 5 dont une première extrémité 5a est exposée à l'intérieur de la partie de paroi de séparation 4 sur la surface principale 3a et dont une seconde extrémité 5e est exposée à l'extérieur de la partie de paroi de séparation 4 sur la surface principale 3a, et qui traverse la partie inférieure 3.
PCT/JP2018/017588 2017-07-12 2018-05-07 Substrat et boîtier en céramique stratifiés WO2019012787A1 (fr)

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JP2017136080A JP2019021670A (ja) 2017-07-12 2017-07-12 積層セラミック基板及び積層セラミックパッケージ
JP2017-136080 2017-07-12

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US11782267B2 (en) 2019-01-30 2023-10-10 Hamamatsu Photonics K.K. Mirror unit
US11874458B2 (en) 2019-01-30 2024-01-16 Hamamatsu Photonics K.K. Mirror unit

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JP2009502024A (ja) * 2005-06-27 2009-01-22 ラミナ ライティング インコーポレーテッド 発光ダイオードパッケージ及びその製造方法
JP2009099923A (ja) * 2007-09-29 2009-05-07 Kyocera Corp 発光素子収納用パッケージ、発光装置ならびに発光素子収納用パッケージおよび発光装置の製造方法
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US11782267B2 (en) 2019-01-30 2023-10-10 Hamamatsu Photonics K.K. Mirror unit
US11835716B2 (en) 2019-01-30 2023-12-05 Hamamatsu Photonics K.K. Mirror unit
US11874458B2 (en) 2019-01-30 2024-01-16 Hamamatsu Photonics K.K. Mirror unit
JP7438767B2 (ja) 2019-01-30 2024-02-27 浜松ホトニクス株式会社 ミラーユニット
US11977223B2 (en) 2019-01-30 2024-05-07 Hamamatsu Photonics K.K. Optical unit

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