JP2019021670A - 積層セラミック基板及び積層セラミックパッケージ - Google Patents

積層セラミック基板及び積層セラミックパッケージ Download PDF

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Publication number
JP2019021670A
JP2019021670A JP2017136080A JP2017136080A JP2019021670A JP 2019021670 A JP2019021670 A JP 2019021670A JP 2017136080 A JP2017136080 A JP 2017136080A JP 2017136080 A JP2017136080 A JP 2017136080A JP 2019021670 A JP2019021670 A JP 2019021670A
Authority
JP
Japan
Prior art keywords
multilayer ceramic
wiring
ceramic substrate
height direction
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017136080A
Other languages
English (en)
Japanese (ja)
Inventor
芳夫 馬屋原
Yoshio Umayahara
芳夫 馬屋原
宏明 原
Hiroaki Hara
宏明 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP2017136080A priority Critical patent/JP2019021670A/ja
Priority to PCT/JP2018/017588 priority patent/WO2019012787A1/fr
Priority to TW107116037A priority patent/TW201909210A/zh
Publication of JP2019021670A publication Critical patent/JP2019021670A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2017136080A 2017-07-12 2017-07-12 積層セラミック基板及び積層セラミックパッケージ Pending JP2019021670A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017136080A JP2019021670A (ja) 2017-07-12 2017-07-12 積層セラミック基板及び積層セラミックパッケージ
PCT/JP2018/017588 WO2019012787A1 (fr) 2017-07-12 2018-05-07 Substrat et boîtier en céramique stratifiés
TW107116037A TW201909210A (zh) 2017-07-12 2018-05-11 積層陶瓷基板及積層陶瓷封裝

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017136080A JP2019021670A (ja) 2017-07-12 2017-07-12 積層セラミック基板及び積層セラミックパッケージ

Publications (1)

Publication Number Publication Date
JP2019021670A true JP2019021670A (ja) 2019-02-07

Family

ID=65002576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017136080A Pending JP2019021670A (ja) 2017-07-12 2017-07-12 積層セラミック基板及び積層セラミックパッケージ

Country Status (3)

Country Link
JP (1) JP2019021670A (fr)
TW (1) TW201909210A (fr)
WO (1) WO2019012787A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11333882B2 (en) 2019-01-30 2022-05-17 Hamamatsu Photonics K.K. Optical unit
US11372238B2 (en) 2019-01-30 2022-06-28 Hamamatsu Photonics K.K. Mirror unit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183900A (ja) * 2003-10-30 2005-07-07 Kyocera Corp 発光装置および照明装置
TW200709475A (en) * 2005-06-27 2007-03-01 Lamina Ceramics Inc Light emitting diode package and method for making same
JP5224802B2 (ja) * 2007-09-29 2013-07-03 京セラ株式会社 発光素子収納用パッケージ、発光装置ならびに発光素子収納用パッケージおよび発光装置の製造方法
JP2009164311A (ja) * 2007-12-28 2009-07-23 Sumitomo Metal Electronics Devices Inc 発光素子搭載用基板およびその製造方法およびそれを用いた発光装置
JP2009289841A (ja) * 2008-05-28 2009-12-10 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
DE102011115314B4 (de) * 2011-09-29 2019-04-25 Osram Opto Semiconductors Gmbh LED-Modul
JP6694153B2 (ja) * 2015-09-24 2020-05-13 東芝ライテック株式会社 発光装置、および照明装置

Also Published As

Publication number Publication date
WO2019012787A1 (fr) 2019-01-17
TW201909210A (zh) 2019-03-01

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