WO2019000853A1 - 芯片、墨盒及墨盒取出的方法 - Google Patents

芯片、墨盒及墨盒取出的方法 Download PDF

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Publication number
WO2019000853A1
WO2019000853A1 PCT/CN2017/116264 CN2017116264W WO2019000853A1 WO 2019000853 A1 WO2019000853 A1 WO 2019000853A1 CN 2017116264 W CN2017116264 W CN 2017116264W WO 2019000853 A1 WO2019000853 A1 WO 2019000853A1
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WO
WIPO (PCT)
Prior art keywords
chip
contact
stylus
ink cartridge
terminal
Prior art date
Application number
PCT/CN2017/116264
Other languages
English (en)
French (fr)
Inventor
邱涌群
陈伟健
Original Assignee
珠海纳思达企业管理有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201720765829.XU external-priority patent/CN206983530U/zh
Priority claimed from CN201710510439.2A external-priority patent/CN109130512B/zh
Application filed by 珠海纳思达企业管理有限公司 filed Critical 珠海纳思达企业管理有限公司
Priority to JP2019546848A priority Critical patent/JP6779385B2/ja
Priority to EP17916060.1A priority patent/EP3613595B1/en
Publication of WO2019000853A1 publication Critical patent/WO2019000853A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17543—Cartridge presence detection or type identification
    • B41J2/17546—Cartridge presence detection or type identification electronically

Definitions

  • the present invention relates to the field of print imaging technology, and in particular, to a chip, an ink cartridge, and a method for taking out an ink cartridge.
  • the chips for printers are used to store information such as manufacturer information, ink amount information, cartridge type information, ink color, etc.
  • the chips for inkjet printers play a decisive role in the normal operation of inkjet printers.
  • the chip 4 includes five lower row of chip contacts 41 and four.
  • the upper row of chip contacts 42 when the ink cartridge chip 4 is in contact with the ink cartridge chip stylus of the stylus structure 5, the lower row of chip contacts 41 includes a contact portion 411 at the end thereof, the contact portion 411 and the lower row of the ink cartridge chip stylus
  • the raised portions 511 of 51 are adjacent, and the upper row of chip contacts 42 includes a contact portion 421 at an end thereof, the contact portion 421 being adjacent to the raised portion 521 of the upper row of ink cartridge chip contacts 52.
  • the prior art has the following drawbacks: since the contact portion for contacting the stylus 51 is a pointed convex structure, the pointed convex structure is difficult to manufacture, and the precision is difficult to control. In addition, during the installation process, when the chip is in contact with the upper row of the stylus, it will be subjected to the lateral force given by the stylus, and the chip is easy to shake, which may easily cause chip contact misalignment and affect the normal use of the chip. .
  • the invention provides a method for taking out chips, ink cartridges and ink cartridges, which can effectively solve the problems in the prior art that the processing and manufacturing are difficult, the chip contacts are easily misaligned, and the normal use of the chips is affected.
  • An aspect of the present invention is to provide a chip for electrically connecting to a stylus in a printer holding portion, the chip including a first chip portion and a second chip portion, and the first chip portion is provided with a plurality of a terminal, the first terminal including a first contact portion in contact with the stylus,
  • the second chip portion is provided with a plurality of second terminals, the second terminal includes a second contact portion in contact with the stylus, and the first chip portion includes a first face and a second oppositely disposed
  • the second chip portion is connected to the first chip portion, and the first chip portion is provided with a plurality of first through grooves for accommodating the stylus, and the first through groove is penetrated by The first side and the second side, at least one portion of the first through groove is covered by at least a portion of the second contact portion.
  • Yet another aspect of the present invention is to provide a chip for electrically connecting to a stylus in a printer holding portion, the stylus including a first set of styluses and a second set of styli having different heights and staggered with each other,
  • the chip includes a first chip portion and a second chip portion, the first chip portion is provided with a plurality of first terminals, and the first terminal includes a first contact portion that is in contact with the first group of styli pins,
  • the second chip portion is provided with a plurality of second terminals, and the second terminal includes a second contact portion that is in contact with the second group of styli,
  • the first chip portion includes a first surface that is oppositely disposed
  • the second chip the second chip portion is connected to the first chip portion, and the first chip portion is provided with a plurality of first through grooves for accommodating the second group of styli,
  • the first through groove extends through the first surface and the second surface, and a portion of the at least one of the first through grooves is covered by at
  • Another aspect of the present invention is to provide an ink cartridge for detachably mounting on a holding portion of a printer, including the above-described chip.
  • a method of removing an ink cartridge wherein the ink cartridge includes the above-described chip, and the ink cartridge includes a housing and a chip holder disposed at a side of the housing, the chip holder and the mounting The chips are connected; the method includes:
  • a further aspect of the present invention provides a method for removing an ink cartridge, wherein the ink cartridge is mounted with the chip, and the first chip portion of the chip is movably connected to the second chip portion; the method includes:
  • the second chip portion is separated from the first chip portion; the second chip portion is separated from the second group of styli; and the ink cartridge is taken out.
  • the method for removing the chip, the ink cartridge and the ink cartridge provided by the invention eliminates the terminal structure of the pointed protrusion, thereby reducing the difficulty in manufacturing and processing; and connecting the first chip portion and the second chip portion to form a chip as a whole, so that at least a portion of a first through slot is at least a portion of the second contact portion Covered, so that during the installation process, the first through slot can guide the stylus during the installation process, avoiding the occurrence of chip contact misalignment, ensuring better contact between the chip and the stylus, and also ensuring The normal use effect of the chip, thereby improving the practicality of the chip, is conducive to the promotion and application of the market.
  • FIG. 1 is a schematic structural view 1 of an ink cartridge given in the prior art
  • FIG. 2 is a schematic structural view 2 of the ink cartridge given in the prior art
  • FIG. 3a is a schematic structural diagram 1 of a first chip portion in a chip according to an embodiment of the present invention.
  • 3a is a schematic structural view 2 of a first chip portion in a chip according to an embodiment of the present invention
  • FIG. 3b is a schematic structural diagram 1 of a second chip portion in a chip according to an embodiment of the present invention.
  • FIG. 3b is a second schematic structural diagram of a second chip portion in a chip according to an embodiment of the present invention.
  • FIG. 3c1 is a schematic structural diagram 1 of a chip according to an embodiment of the present invention.
  • FIG. 3c is a schematic structural diagram 2 of a chip according to an embodiment of the present invention.
  • 4a is a schematic structural view 1 of another chip according to an embodiment of the present invention.
  • FIG. 4b is a second schematic structural diagram of another chip according to an embodiment of the present invention.
  • FIG. 5a is a schematic structural view 1 of a stylus according to an embodiment of the present invention.
  • FIG. 5b is a second schematic structural diagram of a stylus according to an embodiment of the present invention.
  • 6a is a schematic structural view 1 of a chip in contact with a stylus according to an embodiment of the present invention
  • 6b is a second schematic structural view of a chip in contact with a stylus according to an embodiment of the present invention.
  • 6c is a schematic structural view 3 of a chip in contact with a stylus according to an embodiment of the present invention.
  • FIG. 7a is a schematic cross-sectional view of a chip according to an embodiment of the present invention.
  • Figure 7a1 is a partial enlarged view of Figure 7a
  • FIG. 7b is a schematic cross-sectional view of a chip according to an embodiment of the present invention.
  • Figure 7b1 is a partial enlarged view of Figure 7b;
  • 7c is a third schematic cross-sectional view of a chip according to an embodiment of the present invention.
  • Figure 7c1 is a partial enlarged view of Figure 7c
  • FIG. 8a is a schematic structural diagram 1 of another first chip portion according to an embodiment of the present invention.
  • FIG. 8b is a second schematic structural diagram of a first chip portion according to an embodiment of the present invention.
  • FIG. 8c is a schematic structural diagram 1 of still another chip according to an embodiment of the present invention.
  • FIG. 8 is a second schematic structural diagram of a chip according to an embodiment of the present invention.
  • FIG. 9 is a fourth structural diagram of a chip in contact with a stylus according to an embodiment of the present invention.
  • FIG. 10a is a schematic structural diagram 1 of still another chip according to an embodiment of the present invention.
  • FIG. 10b is a second schematic structural diagram of another chip according to an embodiment of the present invention.
  • FIG. 11 is a schematic structural view 5 of a chip in contact with a stylus according to an embodiment of the present invention.
  • FIG. 12 is a schematic structural diagram 3 of a chip according to an embodiment of the present invention.
  • 13a is a schematic structural view 1 of a first chip portion connected to a second chip portion through a connecting portion according to an embodiment of the present invention
  • FIG. 13b is a second schematic structural diagram of a first chip portion connected to a second chip portion through a connecting portion according to an embodiment of the present invention
  • 13c is a schematic exploded view showing a first chip portion connected to a second chip portion through a connection portion according to an embodiment of the present invention
  • 14a is a schematic structural view 5 of a chip in contact with a stylus according to an embodiment of the present invention.
  • 14b is a schematic structural view 6 of a chip in contact with a stylus according to an embodiment of the present invention.
  • FIG. 15 is a schematic structural diagram of a chip carrier according to an embodiment of the present invention.
  • 16a is a schematic diagram 1 of a separate structure of an ink cartridge and a chip according to an embodiment of the present invention
  • 16b is a first schematic structural view showing an installation structure of an ink cartridge and a chip according to an embodiment of the present invention
  • Figure 17 is a schematic structural view 1 of a holding portion according to an embodiment of the present invention.
  • FIG. 18 is a second schematic structural diagram of an installation structure of an ink cartridge and a chip according to an embodiment of the present invention.
  • 19a is a schematic structural view of an ink cartridge according to an embodiment of the present invention.
  • FIG. 19b is a second schematic diagram of a separate structure of an ink cartridge and a chip according to an embodiment of the present invention.
  • 20 is a schematic structural view 2 of a holding portion according to an embodiment of the present invention.
  • 21 is a schematic structural view 3 of a holding portion according to an embodiment of the present invention.
  • FIG. 22 is a schematic structural view of an ink cartridge according to an embodiment of the present invention.
  • FIG. 23 is a third schematic diagram of a split structure of an ink cartridge and a chip according to an embodiment of the present invention.
  • 24 is a view showing a positional relationship between a chip and a stylus when the chip is detached from the ink cartridge according to an embodiment of the present invention
  • FIG. 25 is a schematic structural diagram of a chip mounted on a chip carrier according to an embodiment of the present invention.
  • 26a is a schematic structural view 1 of a chip holder and a contact pin according to an embodiment of the present invention
  • FIG. 26b is a second schematic structural view of the chip holder in contact with the stylus according to the embodiment of the present invention.
  • FIG. 27 is a schematic flow chart of a method for taking out an ink cartridge according to an embodiment of the present invention.
  • FIG. 28 is a schematic flow chart of another method for taking out an ink cartridge according to an embodiment of the present invention.
  • connection may be a fixed connection, a detachable connection, or an integral connection.
  • connecting may be a fixed connection, a detachable connection, or an integral connection.
  • the present embodiment provides a chip 1 for electrically connecting to a stylus 4 in a printer holding portion, including a first chip portion 100 and a second chip portion 200, a first chip.
  • the portion 100 is provided with a plurality of first terminals 106
  • the first terminal 106 includes a first contact portion 1061 in contact with the stylus 4
  • the second chip portion 200 is provided with a plurality of second terminals 206
  • the second terminal 206 includes
  • the second chip portion 100 includes a first surface 101 and a second surface 102 opposite to each other, and the second chip portion 200 is connected to the first chip portion 100, and the first chip portion is connected to the first chip portion 100.
  • a plurality of first through grooves 105 for accommodating the stylus 4 are disposed on the first through groove 105.
  • the first through groove 105 penetrates the first surface 101 and the second surface 102, and a portion of the at least one first through groove 105 is at least a portion of the second contact. Covered by part 2061.
  • the first chip portion 100 has a rectangular parallelepiped shape.
  • the first surface 101 is opposite to the second surface 102, the third surface 103 is opposite to the fourth surface 110, and the fifth surface is opposite to the sixth surface, and may include
  • the first substrate 104 is configured to carry electrical components such as the first through slot 105, the first terminal 106, the first contact portion 1061, and the positioning portion 107, wherein the first contact portion 1061 is the first terminal 106 At least part.
  • the first through groove 105, the first terminal 106, and the positioning portion 107 may be disposed on the first substrate 104.
  • the positioning unit 107 is configured to position the first chip portion 100/chip 1.
  • the positioning portion 107 may be a hole (as shown in FIG. 3a1).
  • the positioning portion 107 can be engaged with the positioning post on the ink cartridge/chip holder to fix the first chip portion 100 on the ink cartridge/chip holder; the positioning portion 107 can also be any surface of the first surface 101 to the sixth surface.
  • the upper part of the upper chip portion 100 can be fixed on the chip holder/ink cartridge through the surface as the positioning portion 107.
  • the positioning portion 107 can also be used to realize the positioning connection between the first chip portion 100 and the second chip portion 200. . It can be understood that the number of the positioning portions 107 can be one or more.
  • the number of the first through grooves 105 is plural, and as shown in FIG. 3a1, the number of the first through grooves 105 is four. It can be understood that the number of the first through grooves 105 can also be 2, 3, 5, and the like.
  • the shape of the first through groove 105 may be a circular shape, an elliptical shape, a U-shaped hole (as shown in FIG. 3a1), an irregular hole or the like, and the first through groove 105 is for accommodating the stylus 4, and has a accommodating pin 4 The space, however, it should be noted that there is no contact portion in the first through groove 105, and therefore, the first through groove 105 is not electrically connected to the stylus 4.
  • the number of the first terminals 106 in this embodiment is plural, and may be two, three, four, or five (as shown in FIG. 3a1).
  • the first terminal 106 is formed by plating copper on the first substrate 104.
  • the first terminal 106 has a first contact portion 1061 that is in contact with the stylus 4 on the holding portion.
  • the number of the first contact portions 1061 may correspond one-to-one with the number of the first terminals 106, or may not correspond to the number of the first terminals 106.
  • the two first terminals 106 can be in contact with the stylus 4 in one holding portion. At this time, the two first terminals 106 have one first contact portion 1061; or, one first terminal 106 and The stylus 4 in the two holding portions are in contact with each other. At this time, the two first contacts 106 are provided in one first terminal 106.
  • the second chip portion 200 in this embodiment may have a rectangular parallelepiped structure, have a first surface 201 to a sixth surface (not shown), and may also include a second substrate 204.
  • the second substrate 204 is used to carry the electrical components such as the positioning portion 207, the memory 208, the second through groove 205, the second terminal 206, and the second contact portion 2061; wherein, in the embodiment, the second chip portion 200 and the second chip
  • the specific shape structure, function, and number of the positioning portion 207, the second terminal 206, and the second contact portion 2061 on the portion 200 may be different from the first chip portion 100, the positioning portion 107 on the first chip portion 100, and the first terminal.
  • the specific shape structure, function, and number of the first contact portion 1061 are similar to each other. For details, refer to the above description, and details are not described herein again.
  • the entire chip 1 can be formed.
  • the second chip portion 200 is in contact with the first chip portion 100.
  • the first surface 101 of the first chip portion 100 may abut the second surface 202 of the second chip portion 200, and the achievable connection manner may include any one of the following: the first chip portion 100 and the second chip portion 200 are soldered.
  • the first chip portion 100 and the second chip portion 200 are combined together by a connecting member such as a positioning buckle and a positioning post and a positioning hole; the first chip portion 100 and the second chip portion 200 are pasted by an adhesive to together.
  • a connecting member such as a positioning buckle and a positioning post and a positioning hole
  • the first chip portion 100 and the second chip portion 200 are pasted by an adhesive to together.
  • the first contact portion 1061 and the second contact portion 2061 may be spaced apart.
  • the first contact portion 1061 and the second contact portion 2061 may be a structure that is spaced apart by one another; further, referring to FIGS.
  • a portion of at least one of the first through grooves 105 in the first chip portion 100 may be covered by at least a portion of the second contact portion 2061, specifically, if The direction perpendicular to the first surface 101 and the second surface 102 of the first chip portion 100 is defined as the Z direction, and the direction in which the second chip portion 200 is directed to the first chip portion 100 is the +Z axis direction, and the second contact portion 2061 is located on the -Z axis side of the first through groove 105, and the position of the second contact portion 2061 in the +Z direction corresponds to the position of all the first through grooves 105, thereby realizing that the second contact portion 2061 can cover the first through groove Part of 105.
  • the position of the second contact portion 2061 in the +Z direction may be set to correspond to the position of not all the first through grooves 105, which may correspond to the position of the portion of the first through grooves 105.
  • the second contact portion 2061 on the second terminal 206 can cover a portion of the at least one first through groove 105, so that the chip 1 and the stylus 4 can be better contacted.
  • the chip 1 provided in this embodiment discards the pointed convex structure in the background art, which reduces the difficulty in manufacturing and processing; by connecting the first chip portion 100 and the second chip portion 200 in combination to form the chip 1 as a whole,
  • a portion of the at least one first through groove 105 is covered by at least a portion of the second contact portion 2061, so that the first through groove 105 can guide the stylus 4 during installation during installation.
  • the function avoids the occurrence of contact misalignment of the chip 1, ensures that the chip 1 and the stylus 4 can be in better contact, and also ensures the normal use effect of the chip 1, thereby improving the practicability of the chip 1, and is beneficial to the market. Promotion and application.
  • the first chip portion 100 is provided with a first contact portion 1061 and a first through groove 105.
  • the first contact portion of the present embodiment is provided.
  • the specific positional relationship between the 1061 and the first through slots 105 is not limited, and can be set by a person skilled in the art according to specific design requirements.
  • the first chip portion 100 can further include the first surface 101 and the second surface 102.
  • the first chip portion 100 is viewed from a direction perpendicular to the third surface 103.
  • the first contact portion 1061 is spaced apart from the first through groove 105.
  • the first contact portion 1061 and the first pass The slots 105 can be arranged one by one.
  • the specific positional relationship between the first terminal 106 and the first through slot 105 is not limited, and those skilled in the art may set according to specific design requirements, and more preferably, from the third surface 103.
  • the first terminal 106 is spaced apart from the first through slot 105.
  • the first terminal 106 and the first through slot 105 may be spaced apart one by one, as shown in FIG. 3a1-3a2.
  • the number of the first terminals 106 is one greater than the number of the first through grooves 105.
  • first terminal 106 and the first through groove 105 can also set the positional relationship between the first terminal 106 and the first through groove 105, the first contact portion 1061 and the first through groove 105 by using other arrangements, for example, evenly spaced settings can be adopted.
  • the number of the first terminals 106 and the number of the first through grooves 105 may be the same or different, and the number of the first contact portions 1061 and the number of the first through grooves 105 may be the same or different.
  • the first terminal 106 on the first chip portion 100 can be made The interval between the two becomes larger, so that not only the designable space of the first contact portion 1061 is large, but also the manufacturing difficulty and the process difficulty are reduced, and at the same time, during the mounting process of the chip 1 and the stylus 4, the first through groove 105 is made During the installation process, the stylus 4 can be guided to avoid the occurrence of contact misalignment of the chip 1, further ensuring better contact between the chip 1 and the stylus 4, and improving the practicability of the chip 1.
  • the first chip portion 100 further has a fourth surface 110 disposed opposite to the third surface 103 when the first contact portion 1061 is specifically disposed.
  • the first contact portion 1061 is closer to the third surface 103 than the fourth surface 110.
  • the first contact portion 1061 may be disposed near the first chip portion.
  • the end of the third face 103 of 100 is on.
  • the first contact portion 1061 is closer to the end of the third surface 103 than the fourth surface 110.
  • the first contact portion 1061 may be disposed on the first surface 101, the second surface 102, and the first surface.
  • the first contact portion 1061 may be disposed on the first face 101 and the second face 102 Or the first contact portion 1061 is disposed on the first surface 101 and the third surface 103; or the first contact portion 1061 may be disposed on the first surface 101, the second surface 102, and the third surface 103, Preferably, the first contact portion 1061 may be located only on the first face 101.
  • the first terminal 106 may be located only in any one of the first face 101, the second face 102, and the third face 103 for the first terminal 106.
  • the first surface 101 and the second surface 102 may be located on the first surface 101 or the second surface 103, or may be located on the first surface 101 or the third surface 103, as shown in FIG. 3a1. It may also be located on the first side 101, the second side 102, and the third side 103 (as shown in FIG. 4b), wherein, preferably, the first terminal 106 may be located only on the first side 101.
  • the first contact portion 1061 when the first contact portion 1061 is disposed, the first contact portion 1061 is closer to the third surface 103 than the fourth surface 110 of the first chip portion 100, specifically, the first contact The portion 1061 can be disposed on the end of the ink cartridge near the third surface 103.
  • the first contact portion 1061 is closer to the stylus 4, and the structure can further ensure that the chip 1 can better contact the stylus 4, thereby improving the chip. 1 stable reliability of use.
  • the second chip portion 200 may include first surfaces 201 to sixth surfaces (not shown), wherein The first surface 201 is disposed opposite to the second surface 202, the third surface 203 is disposed opposite to the fourth surface 210, the fifth surface is disposed opposite to the sixth surface, and the third surface 203 is opposite to the first surface 201, the second surface
  • the surface 202 is intersected; at this time, the second chip portion 200 may be provided with a plurality of second through grooves 205 for accommodating the stylus 4, and the second through grooves 205 extend through the first surface 201 and the second surface 202, at least one A portion of the two-way groove 205 is covered by at least a portion of the first contact portion 1061.
  • the second chip portion 200 is viewed from a direction perpendicular to the third surface 203.
  • the second contact portion 2061 is spaced apart from the second through groove 205.
  • the second contact portion 2061 and the second through groove 205 may be An interval setting.
  • the second chip portion 200 is viewed from a direction perpendicular to the third surface 203.
  • the second terminal 206 is spaced apart from the second through slot 205.
  • the second terminal 206 and the second through slot 205 can be one by one. Interval setting.
  • the specific setting position of the second contact portion 2061 is not limited in this embodiment, and those skilled in the art may set according to specific design requirements, and the second chip portion 200 further includes There is a fourth surface 210 disposed opposite to the third surface 203.
  • the second contact portion 2061 is closer to the third surface 203 than the fourth surface 210. More preferably, the second contact portion 2061 may be disposed adjacent to the second chip.
  • the second contact portion 2061 is disposed on any one of the first surface 201, the second surface 202, and the third surface 203; or the second contact portion 2061 is disposed on the first surface 201 and the second surface 202.
  • the second contact portion 2061 is disposed on the first surface 201 and the third surface 203; or the second contact portion 2061 is disposed on the first surface 201, the second surface 202, and the third surface 203, and more preferably, The second contact portion 2061 may be disposed only on the second surface 202.
  • the second terminal 206 may be located only in any one of the first surface 201, the second surface 202, and the third surface 203 for the second terminal 206.
  • the surface (as shown in FIG. 3b2, the second terminal 206 is disposed on the first surface 201) may be located on the first surface 201 and the second surface 202, or may be located on the first surface 201 or the third surface 203. It may also be located on the first surface 201, the second surface 202, and the third surface 203, wherein, more preferably, the second terminal 206 may be located only on the second surface 202.
  • the specific shape, arrangement, and functional effects of the second through slot 205, the second contact portion 2061, and the second terminal 206 are the same as the first through slot 105 and the first contact in the foregoing embodiment.
  • the specific shape structure, the setting manner, and the functional effects of the portion 1061 and the first terminal 106 are similar. For details, refer to the above description, and details are not described herein again.
  • the first chip portion 100 and the second chip portion 200 can be abutted.
  • the second chip portion 200 is The two sides 202 can abut the first surface 101 of the first chip portion 100, and the number of the first through grooves 105 is four, the number of the first contact portions 1061 is five; the number of the second contact portions 2061 is 4, the number of the second through grooves 205 is five, at this time, for the chip 1 as a whole, at least a part of the second contact portion 2061 can cover a part of the at least one first through groove 105, at least a part of the first contact portion 1061 A portion of the at least one second through groove 205 may be covered, thereby effectively guiding the mounting of the stylus 4, and ensuring the contact effect of the stylus 4 with the chip 1.
  • the second contact portion 2061 When the second contact portion 2061 is disposed, the second contact portion 2061 is closer to the third surface 203 than the fourth surface 210 of the second chip portion 200, specifically, the second connection The contact portion 2061 can be disposed on the end of the ink cartridge near the third surface 203, and the second contact portion 2061 is closer to the contact pin 4, so that the structure can further ensure that the chip 1 can better contact the stylus 4, thereby improving the The stable reliability of the chip 1 used.
  • the present embodiment provides another chip 1 for electrically connecting with a stylus 4 in a printer holder, the stylus 4 including a first group of styli having different heights and staggered with each other.
  • the chip 1 includes a first chip portion 100 and a second chip portion 200, the first chip portion 100 is provided with a plurality of first terminals 106, and the first terminal 106 includes a first group contact
  • the first contact portion 1061 is in contact with the pin 401
  • the second chip portion 200 is provided with a plurality of second terminals 206
  • the second terminal 206 includes a second contact portion 2061 contacting the second group of contact pins 402,
  • the portion 100 includes a first surface 101 and a second surface 102 that are oppositely disposed.
  • the second chip portion 200 is coupled to the first chip portion 100.
  • the first chip portion 100 is provided with a plurality of accommodating pins 402 for receiving the second group of contacts 402.
  • the first through groove 105 penetrates the first surface 101 and the second surface 102, and a portion of the at least one first through groove 105 is covered by at least a portion of the second contact portion 2061.
  • the second chip portion 200 includes a first surface 201 and a second surface 202 disposed opposite to each other, and the second chip portion 200 is provided with a plurality of second through grooves 205 for receiving the first group of contact pins 401.
  • the second through groove 205 penetrates the first surface 201 and the second surface 202, and a portion of the at least one second through groove 205 is covered by at least a portion of the first contact portion 1061.
  • the chip structure in this embodiment is the same as the chip structure corresponding to the above-mentioned FIG. 3a1-3c2, 4a-4b. For details, refer to the above description, and details are not described herein again.
  • the stylus 4 may include a first set of stylus 401 and a second set of stylus 402 staggered in a vertical and Z-axis direction, In the Z-axis direction, the first set of contact pins 401 and the second set of contact pins 402 are located at different heights; and the first set of contact pins 401 and the second set of contact pins 402 may each include: a rod portion 404 located at the rod The lateral portion 403 of the upper end of the portion 404 and the head portion 405 at the lower end of the rod portion 404, the head portion 405 and the lateral portion 403 are connected by the rod portion 404, and the head portion 405 and the rod portion 404 are rotatable about the lateral portion 403.
  • the stylus 4 has a certain elasticity, and when pressure is applied to the head 405 or the stem 404 of the stylus 4, the stylus 4 will rotate accordingly.
  • the first contact portion 1061 is in contact with the first group of contact pins 401
  • the second contact portion 2061 is in contact with the second group of contact pins 402.
  • the first through slot 105 is for receiving the second set of contact pins 402
  • the second through slot 205 is for receiving the first set of contact pins 401.
  • the first substrate 104 and the second substrate 204 may be made of the same material, or may be made of different materials.
  • the first chip portion 100 can be a hard plate, and the hard plate portion can be made of FR-4 material, and the force is not deformed on the hard plate portion, and the shape and size are not fixed.
  • the deformation of the second chip portion 200 may be a soft board chip, and the flexible board portion may be made of a flexible circuit board FPC material, having a flexible feature and being easily bent and deformed.
  • the second contact portion 2061 when the second contact portion 2061 is in contact with the second group of contact pins 402, the second contact portion 2061 may be deformed by the contact force of the stylus 4 to the second chip portion 200.
  • the second chip portion 200 it may be a soft board chip when the second chip portion 200 is in a direction perpendicular to the third surface 203 of the second chip portion 200. Observing the chip 1, the deformed second contact portion 2061 and the first contact portion 1061 are arranged in a row; or, after the second contact portion 2061 is deformed, the second terminal 206 and the first terminal 106 are arranged in a row. Settings.
  • the second set of stylus 402 is engaged with the second chip portion 200 because the stylus 4 generates a force on the second contact portion 2061 on the second chip portion 200. , causing a certain deformation of the second contact portion 2061 portion downward (T direction), so that the second terminal 206 also produces a certain deformation downward (T direction); as shown in FIGS.
  • the deformed position of the second terminal 206 is arranged in a row with the first terminal 106, that is, the second terminal 206 and the first terminal 106 are arranged on the L1;
  • the position at which the two contact portions 2061 are deformed is arranged in a row with the first contact portion 1061, that is, the second contact portion 2061 and the first contact portion 1061 are arranged on the horizontal straight line L1.
  • the second contact portion 2061 may be disposed directly below the first through groove 105 (in the direction of the -Z axis).
  • the second chip portion 200 in this embodiment is a hard chip chip, and the material may be different from the embodiment corresponding to FIG. 7a-7a1.
  • FR-4 material in general, the hard chip can be defaulted to not deform.
  • the terminals 106 are arranged in two rows, that is, the first terminals 106 are arranged on the horizontal straight line L2, and the second terminals 206 are arranged on the horizontal straight line L3.
  • the first terminal 106 and the first substrate 104 are respectively disposed on the first substrate 104 and the second substrate 204.
  • the two terminals 206 may be formed by plating copper on the substrate. Therefore, after the chip 1 is in contact with the stylus 4 in the mounting direction T, the position of the second terminal 206 is arranged in two rows with the first terminal 106, and the second contact The position of the portion 2061 is arranged in two rows with the first contact portion 1061. Further, the second contact portion 2061 may be disposed inside the first through groove 105.
  • the first chip portion 100 and the second chip in this embodiment are different from the embodiments corresponding to FIGS. 7a-7a1 and 7b-7b1.
  • the portion 200 is connected by the intermediate portion 5; wherein the intermediate portion 5 may be a separately provided connection structure, which may be disposed on the first chip portion 100 or the second chip portion 200, and the first chip portion 100 and the second chip portion 200 pass After the intermediate portions 5 are connected, a gap is formed between the first chip portion 100 and the second chip portion 200, and the first terminal 106 and the second terminal 206 are disposed in the gap.
  • the intermediate portion 5 is disposed between the first chip portion 100 and the second chip portion 200, and the first chip portion 100 further includes a third portion that intersects the first surface 101 and the second surface 102.
  • the face 103 is viewed in a direction perpendicular to the third face 103 of the first chip portion 100, the height of the intermediate portion 5 being the sum of the copper plating thickness of the first terminal 106 and the copper plating thickness of the second terminal 206.
  • the chip 1 is viewed in a direction perpendicular to the third surface 103 of the first chip portion 100.
  • the intermediate portion 5, the first terminal 106 and the second terminal 206 are arranged in a row, that is, the intermediate portion 5,
  • a terminal 106 and a second terminal 206 are arranged in a row on a horizontal line L4; or, the first contact portion 1061 and the second contact portion 2061 are arranged in a row, that is, the first contact portion 1061 and the first portion
  • the two contact portions 2061 are arranged in a row on the horizontal straight line L4.
  • the first surface 101 of the first chip portion 100 is disposed opposite to the second surface 202 of the second chip portion 200, and the intermediate portion 5 and the intermediate portion 5 are disposed between the first chip portion 100 and the second chip portion 200.
  • the length in the direction T is the sum of the copper plating thicknesses of the first terminal 106 and the second terminal 206, and therefore, due to the presence of the intermediate portion 5, the intermediate portion 5, the first terminal 106, and the The two terminals 206 may be arranged in a row. Since the first contact portion 1061 is at least a portion of the first terminal 106, the second contact portion 2061 is at least a portion of the second terminal 206.
  • the first contact portion 1061 and the second contact portion The 2061 may also be arranged in a row in the direction T. Further, the second contact portion 2061 is disposed directly below the first through groove 105 (in the direction of the -Z axis). With such a structure, the intermediate portion 5 is disposed between the first chip portion 100 and the second chip portion 200 such that the first chip portion 100 and the second chip portion 200 are not in direct contact with each other. This structure can avoid the first chip portion 100. The uneven contact between the first face 201 and the second surface 202 of the second chip portion 200 and the rigid contact therebetween cause damage to the chip.
  • the first chip portion 100 and the second chip portion 200 in this embodiment may be abutted or connected through the intermediate portion 5, and the first chip portion 100 and the second chip portion 200 may be of the same material or different materials, and are effective.
  • the achievable manner of the structure of the chip 1 is expanded, so that the structure of the chip 1 is flexible and diverse, and the user can set the corresponding chip 1 structure according to specific design requirements, thereby expanding the applicable range of the chip 1.
  • the first chip portion 100 and the second chip portion 200 may be combined and connected in other manners.
  • the second chip portion 200 may include a joint portion. 6.
  • the second terminal 206 is connected to one end of the joint portion 6, and the second chip portion 200 is connected to the first chip portion 100 via the joint portion 6.
  • the joint portion 6 may be an engagement mechanism provided between the first chip portion 100 and the second chip portion 200, or may be an engagement mechanism provided between the respective second terminals 206.
  • the second terminal 206 may be a copper piece, and the second terminal 206 may communicate with the first chip part 100 through the joint portion 6 . As shown in FIGS. 10a-10b, the second terminal 206 is suspended on the joint portion 6, so that the second terminal 206 has a certain movable space with respect to the joint portion 6, since the second contact portion 2061 is the second terminal.
  • the second contact portion 2061 also has a certain amount of active space relative to the joint portion 6, so that when the chip 1 is in contact with the stylus 4, the second set of stylus 402 will be on the second chip
  • the portion 201 is given a certain contact force, and the second chip portion 200 is moved by the contact force.
  • the second chip portion 200 is movable relative to the first chip portion 100.
  • the chip 1 is viewed in a direction perpendicular to the third surface 203 of the second chip portion 200, and the moved second contact portion 2061 and the first contact portion 1061 may be arranged in a row; or, in the second contact After the portion 2061 is moved, the second terminal 206 and the first terminal 106 may be arranged in a row.
  • FIG. 11 which is a schematic diagram of the chip 1 contacting the stylus 4
  • the second terminal 206 is at the second set of stylus 402 Under the force, moving in the -T direction / -Z axis direction
  • the second contact portion 2061 also moves in the -T direction / -Z axis direction under the force of the second group of stylus 402, thereby achieving
  • a contact portion 1061 has an effect of arranging in a row in the direction T.
  • the second chip portion 200 in the present embodiment not only ensures the stable reliability of the connection between the first chip portion 100 and the second chip portion 200 through the joint portion 6 and the first chip portion 100, but also expands the first chip portion 100.
  • the connection with the second chip portion 200 facilitates the processing of the chip 1.
  • the first chip portion 100 and the second chip portion 200 in the present embodiment pass through the joint portion, which is different from the embodiment corresponding to the above-mentioned FIGS. 10a-10b.
  • the first chip portion 100 and the second chip portion 200 are hinged by the joint portion 6.
  • the second chip portion 200 is opposite to the first chip portion 200.
  • the chip unit 100 moves (including rotation, rotation, movement, etc.).
  • the first chip portion 100 may not be opposite to the second chip portion 200.
  • the second chip portion 200 can be rotated or moved relative to the first chip portion 100, for example, adjusting an angle formed between the second chip portion 200 and the first chip portion 100, so that the first chip The portion 100 is perpendicular to, intersects, or parallel with the second chip portion 200.
  • the plurality of abutting portions 109 and the second chip portion 200 disposed on the first chip portion 100 The plurality of abutted portions 209 provided on the top are connected touch.
  • the first chip portion 100 and the second chip portion 200 are movably connected by the connecting portion 7, and more preferably, the first chip portion 100 and the second chip portion. 200 is hinged by the connecting portion 7, and one end of the connecting portion 7 is connected to the end of the first chip portion 100, and the other end is connected to the end portion of the second chip portion 200, thereby being realized in the first chip portion.
  • the first chip portion 100 and the second chip portion 200 can be relatively moved (including a moving manner such as rotation, rotation, movement, etc.), and at this time, for the first chip portion 100 and the second chip portion 200, the first chip portion 100 may move or rotate relative to the second chip portion 200, and the second chip portion 200 may also rotate or move relative to the first chip portion 100.
  • the chip 1 is connected by the first chip portion 100, the second chip portion 200, and Part 7 is made up of a combination.
  • the connecting portion 7 has a flexible feature that is susceptible to bending and deformation, for example, the connecting portion 7 is fabricated from a flexible circuit board FPC material.
  • a folding line may be provided on the connecting portion 7, and the first chip portion 100 and the second chip portion 200 are folded into the chip 1 through the connecting portion 7.
  • the chip 1 can be produced in a folded manner, that is, the first chip portion 100 and the second chip portion 200 are folded by a folding line provided on the connecting portion 7, thereby forming the above-described chip 1.
  • this method is complicated in production process, and a folding line is provided at a position where the connecting portion 7 is folded, which may cause the folding trace to be offset from the preset folding line when the chip 1 is folded, resulting in between the terminals. There is a misplacement.
  • the chip line may be disconnected due to the folding method.
  • the chip 1 in a non-folding manner, by using the chip 1 produced by the unfolding method, but using the welding or the positioning buckle and the positioning hole or the positioning post to be adhered to the positioning hole or the adhesive.
  • the method is not easy to cause a misalignment between the terminals, and does not cause the chip line to be disconnected.
  • the chip 1 in this embodiment can be in contact with the stylus 4.
  • the chip 1 can be mounted on the chip holder, wherein the structure of the chip holder can be as shown in the figure.
  • the chip holder is mounted on the ink cartridge so that the chip 1 and the stylus 4 are electrically connected.
  • the chip carrier since the second chip portion 200 is movable relative to the first chip portion 100, the chip 1 is mounted on the chip carrier with respect to the connection structure in which the first chip portion 100 and the second chip portion 200 are not movable relative to each other. After that, the chip carrier also rotates with the chip 1.
  • the present embodiment sets the second chip portion 200 and the first chip portion 100.
  • the structure is relatively movable, which facilitates the mounting and dismounting between the chip 1 and the chip holder, and does not require the entire rotation of the chip 1. Therefore, the structure is simple, the space is small, and the miniaturization of the ink cartridge and the printer is easy.
  • the chip 1 in this embodiment is further provided with a third terminal 3 that is not in contact with the stylus 4; wherein the third terminal 3 is disposed on the first chip portion. 100; or, the third terminal 3 is disposed on the second chip portion 200; or the third terminal 3 is disposed on the first chip portion 100 and the second chip portion 200.
  • the third terminal 3 can be used to detect whether there is a short circuit between the first terminals 106 or between the second terminals 206 or between the first terminals 106 and the second terminals 206; the third terminal 3 can also be used for detecting Whether the surface of the chip 1 has water stains or ink stains or water drops; the third terminal 3 can also be used for detecting other.
  • the third terminal 3 is located on the first chip portion 100.
  • the setting position of the third terminal 3 is the same as the setting position of the first terminal 106. For details, refer to the above description, and details are not described herein again. If the third terminal 3 is located on the second chip portion 200, the setting position of the third terminal 3 is the same as the setting position of the second terminal 206.
  • the connection state of the first terminal 106 and the second terminal 206 on the first chip portion 100 and the second chip portion 200 can be effectively detected, thereby further improving the safety and reliability of the chip 1 used. .
  • the first chip portion 100 in this embodiment may further be provided with a third through slot 108, and the third through slot 108 extends through the first surface and the second surface.
  • the first contact portion 1061 may be disposed in the third through slot 108 for the first contact portion 1061; or the first contact portion 1061 may be disposed on the first surface on the edge of the third through slot 108.
  • the first contact portion 1061 may be disposed on the first surface and the second surface on the edge of the third through groove 108; or the first contact portion 1061 may be disposed on the first surface and the second surface The surface and the third through groove 108.
  • the first set of contact pins 401 are in contact with the first contact portion 1061 disposed in the third through slot 108, and the second set of contact pins 402 In contact with the second contact portion 2061, the first contact portion 1061 can be effectively protected by the provision of the third through groove 108, the first contact portion 1061 is prevented from being easily damaged, and the chip 1 and the stylus 4 are phased.
  • the stylus 4 can also be guided to ensure the contact between the chip 1 and the contact portion, thereby further improving the stability and reliability of the use of the chip 1.
  • the present embodiment provides an ink cartridge 8 for detachably mounting on a holding portion 10 of a printer, wherein the ink cartridge 8 is provided with The chip 1 in any of the above embodiments.
  • the ink cartridge 8 provided in this embodiment is provided with the chip 1 in the above embodiment, so that the terminal in the chip 1 discards the pointed convex structure in the background art, which reduces the difficulty in manufacturing and processing;
  • the first chip portion and the second chip portion are combined and combined to form the whole of the chip 1 such that a portion of the at least one first through groove is covered by at least a portion of the second contact portion, so that the first through groove can be used for the stylus during the mounting process.
  • the guiding function avoids the occurrence of the contact dislocation of the chip 1, which ensures that the chip 1 and the stylus can be in better contact, and also ensures the normal use effect of the ink cartridge 8, thereby improving the practicability of the ink cartridge 8. Conducive to the promotion and application of the market.
  • the ink cartridge 8 in this embodiment is used for mounting on the holding portion 10, which is the holding portion 10 shown in FIG.
  • the direction T is the direction in which the chip 1 / the ink cartridge 8 is attached to the holding portion 10.
  • the holding portion 10 can simultaneously mount a plurality of ink cartridges 8.
  • the plurality of ink cartridges 8 can be ink cartridges 8 of different colors or different widths.
  • the holding portion 10 has four mounting positions 1002, and the ink cartridge 8 can be mounted on the above. 4 mounting positions are on 1002.
  • the holding portion 10 further includes a restricted portion 1004, a stylus holder 1003, a stylus, and an ink needle 1001.
  • the restricted portion 1004 is for restricting the ink cartridge 8, and prevents the ink cartridge 8 from moving away from the holding portion in the -T direction. 10.
  • a stylus is disposed on the stylus holder 1003, and the stylus holder 1003 can fix the stylus. The stylus can be in contact with the terminals on the chip 1 (including the first terminal 106 and the second terminal 206) to establish electrical transmission between the ink cartridge 8 and the holder 10.
  • the ink cartridge 8 may include an ink outlet 803, a first housing 8011, and a second housing 8012 connected to the first housing 8011.
  • the ink outlet 803 may be disposed at a lower end of the first housing 8011, and the second housing
  • the side portion of the 8012 is provided with a mounting portion 804 on which the chip 1 is mounted, and the chip holder 9 is mounted in the mounting portion 804 by an elastic member 806.
  • the side end of the mounting portion 804 may be provided with a track hole 805, and the chip frame 9 is provided with a rotating shaft 902 and a supporting portion 903 for rotating along the track hole 805; when the chip frame 9 is mounted on the mounting In the portion 804, the support portion 903 abuts against the elastic member 806.
  • the ink cartridge 8 in this embodiment may further include a plurality of housings 801, and is not limited to the first housing 8011 and the second housing 8012 described above.
  • the chip carrier 9 may include a lower bracket 905 to which the upper bracket 904 and the upper bracket 904 are movably connected.
  • the first chip portion is fixed on the upper bracket 904, and the second chip The portion is fixed to the lower bracket 905, wherein the upper bracket 904 can move with the movement of the first chip portion, and the lower bracket 905 can move with the movement of the second chip portion.
  • the chip holder 9 can be provided with a positioning post 901, a rotating shaft 902, and a supporting portion 903.
  • the positioning post 901 cooperates with the positioning portion on the chip 1, and the chip 1 can be fixed to the chip carrier 9.
  • the chip 1 can follow The movement of the chip carrier 9 moves.
  • the rotating shaft 209 can move or rotate along the track hole 805 on the housing 801.
  • the support portion 903 is a portion that abuts on the elastic body, and the chip When the frame 9 is subjected to an external force, it can be moved and rotated along the track hole 805 while pressing the elastic member 806, as shown in Fig. 16b, when the ink cartridge 8 is mounted on the mounting portion 804 in the mounting direction T, the ink outlet The 803 is engaged with the ink tube 1005, and the chip 1 is engaged with the stylus, thereby realizing mounting of the chip 1 to the ink cartridge 8.
  • the ink cartridge 8 may include a housing 801, a housing The side of the 801 is provided with a chip holder 807, the chip holder 807 is connected to the chip 1, and the chip 1 is mounted on the housing 801 through the chip holder 807. An elastic member is disposed between the chip holder 807 and the housing 801. The side end of the housing 801 is provided with a track hole 805. The chip holder 807 is provided with an operation portion 8071, and the chip holder 807 is mounted on the housing 801 via a rotating shaft 808 for moving along the track hole 805.
  • the ink cartridge 8 may further include a casing 801 and an ink outlet 803 disposed at a lower end of the casing 801.
  • the chip 1 is connected to the chip carrier 807, unlike the embodiment corresponding to the above-mentioned FIGS. 16a-16b. (It may be a direct connection or a connection via the chip carrier 9 or an intermediate component), and the movement/rotation of the chip carrier 807 can drive the chip 1 to move/rotate.
  • the ink cartridge 8 is mounted on the holding portion 10 in the mounting direction T, the operator's finger presses the operating portion 8071 of the chip holder 807, and the rotating shaft 808 of the chip holder 807 moves or rotates in the tracking hole 805 to drive the chip 1 to move.
  • the position of the chip 1 may change before, and the chip 1 will move toward the inside of the ink cartridge 8 with the chip holder 807, and then the ink cartridge 8 is mounted in the holding portion 10.
  • the ink cartridge 8 is taken out from the mounting portion 804 in the direction -T opposite to the mounting direction T, the operator's finger presses the operating portion 8071 of the chip holder 807, and the rotating shaft 808 of the chip holder 807 moves or rotates in the tracking hole 805 to drive the chip.
  • the ink cartridge 8 is taken out from the holding portion 10; through the above process, the ink cartridge 8 is
  • the mounting and dismounting process of the chip 1 is simple and easy to implement, thereby improving the practicality of the ink cartridge 8.
  • the structure of the ink cartridge 8 as shown in FIG. 22-23 can be installed in the holding portion, specifically
  • the holding portion 10 may include a restricted portion 1004, a card hole 1007, an ink tube 1005, a stylus,
  • the structure of the ink cartridge 8 suitable for being mounted in the holding portion 10 is as shown in FIG. 22-23. Specifically, A first card position 809 and a second card position 810 are disposed on both sides of the ink cartridge 8. When the ink cartridge 8 is mounted on the holding portion 10, the restricted portion 1004 and the first card position 809, the card hole 1007 and the second card position, respectively The 810 is joined, and the ink tube 1005 is joined to the ink outlet 803.
  • the ink cartridge 8 in the above-mentioned Figs. 16a-16b, 18, 19a-19b is used for mounting in the holding portion 10 corresponding to Fig. 17, when the above-described ink cartridge 8 needs to be detached from the holding portion 10, referring to Fig. 27
  • the present embodiment provides a method for removing an ink cartridge, wherein the ink cartridge is mounted with the chip of any one of the above embodiments, and the ink cartridge comprises a housing and a chip holder disposed at a side of the housing, and the chip holder is connected to the chip.
  • the methods include:
  • S101 moving the chip carrier in a direction crossing the mounting direction; wherein the direction crossing the mounting direction may be a direction inclined or perpendicular to the mounting direction; specifically, the chip holder is moved by applying pressure to the operating portion.
  • the method for taking out the ink cartridge provided by the embodiment has a simple operation method and is easy to implement, and is convenient for the user to perform timely replacement and maintenance operations on the ink cartridge, thereby improving the practicability of the method for taking out the ink cartridge.
  • the ink cartridge 8 in the above-mentioned FIGS. 22-23 is used for mounting in the holding portion 10 corresponding to FIGS. 20-21.
  • the present embodiment can be seen with reference to FIG.
  • Another method for removing the ink cartridge is provided.
  • the ink cartridge is mounted on the chip in any one of the above embodiments, and the first chip portion of the chip is movably connected to the second chip portion.
  • the method includes:
  • the positional relationship between the chip 1 and the stylus 4 is as shown in FIG. 22.
  • the chip 1 is rotated and moved, the second terminal will pass over the second set of stylus 402.
  • the ink cartridge can be removed from the retaining portion.
  • the second group of stylus 402 since the first chip portion and the second chip portion are movably connected, the second group of stylus 402 is located on the upstream side of the direction -T, therefore, the second group The stylus 402 will block the second chip portion from continuing to move in the direction -T; as the ink cartridge continues to move in the direction -T, the first chip portion is separated from the second chip portion, that is, the upper bracket 904 and the lower bracket in the drawing. The 905 phase is separated, and the chip and the chip carrier 9 are moved and rotated along the trajectory of the track hole under the double force of the take-out force and the force applied by the stylus to the second chip portion, as shown in Fig. 26b.
  • the stylus does not exert a force on the chip 1, and at this time, the ink cartridge can be taken out from the holding portion.
  • the method for taking out the ink cartridge provided by the embodiment has a simple operation method and is easy to implement, and is convenient for the user to perform timely replacement and maintenance operations on the ink cartridge, thereby improving the practicability of the method for taking out the ink cartridge.

Abstract

一种芯片（1）、墨盒（8）及墨盒（8）取出的方法，芯片（1）用于与打印机保持部内的触针（4）电连接，包括第一芯片部（100）和第二芯片部（200），第一芯片部（100）上设置有多个第一端子（106），第一端子（106）包括与触针（4）相接触的第一接触部（1061），第二芯片部（200）上设置有多个第二端子（206），第二端子（206）包括与触针（4）相接触的第二接触部（2061），第一芯片部（100）包括相对设置的第一面（101）和第二面（102），第二芯片部（200）与第一芯片部（100）相连接，第一芯片部（100）上设置有多个用于容纳触针（4）的第一通槽（105），第一通槽（105）贯穿第一面（101）和第二面（102），至少一个第一通槽（105）的一部分被至少一部分第二接触部（2061）所覆盖。该芯片（1）上的第一通槽（105）在安装过程中可以对触针（4）起到引导作用，避免了芯片（1）接触错位情况的发生，保证了芯片（1）与触针（4）可以更好的接触，进而提高了芯片（1）的实用性。

Description

芯片、墨盒及墨盒取出的方法 技术领域
本发明涉及打印成像技术领域，具体涉及一种芯片、墨盒及墨盒取出的方法。
背景技术
打印机用芯片有很多种，打印机用芯片用于存储生产厂信息、墨水量信息、墨盒类别信息、墨水颜色等信息，喷墨打印机用芯片对于喷墨打印机的正常工作起到决定性作用。
其中，第201320875786.2号的中国专利公开了一种墨盒芯片、墨盒和喷墨打印机，参考附图1-2可知，在现有技术中，芯片4上包括五个下排芯片触点41和四个上排芯片触点42，在墨盒芯片4与触针结构5的墨盒芯片触针接触时，下排芯片触点41包括在其端部的接触部411，接触部411与下排墨盒芯片触针51的凸起部511邻接，上排芯片触点42包括在其端部的接触部421，接触部421与上排墨盒芯片触针52的凸起部521邻接。
然而，在实施本技术方案的过程中，现有技术中存在以下缺陷：由于用于与触针51向接触的接触部为尖形凸起结构，而尖形凸起结构制造困难，精度难以控制，加工制造难度大；此外，在安装过程中，当芯片与触针上排接触的时候，会受到触针给予的横向力，芯片容易晃动，进而会容易引起芯片接触错位，影响芯片的正常使用。
发明内容
本发明提供一种芯片、墨盒及墨盒取出的方法，可以有效地解决现有技术中存在的加工制造难度大、容易引起芯片接触错位，影响芯片的正常使用的问题。
本发明的一方面是为了提供一种芯片，用于与打印机保持部内的触针电连接，所述芯片包括第一芯片部和第二芯片部，所述第一芯片部上设置有多个第一端子，所述第一端子包括与所述触针相接触的第一接触部， 所述第二芯片部上设置有多个第二端子，所述第二端子包括与所述触针相接触的第二接触部，所述第一芯片部包括相对设置的第一面和第二面，所述第二芯片部与所述第一芯片部相连接，所述第一芯片部上设置有多个用于容纳所述触针的第一通槽，所述第一通槽贯穿所述第一面和第二面，至少一个所述第一通槽的一部分被至少一部分第二接触部所覆盖。
本发明的又一方面是为了提供一种芯片，用于与打印机保持部内的触针电连接，所述触针包括高度不同且彼此交错设置的第一组触针和第二组触针，所述芯片包括第一芯片部和第二芯片部，所述第一芯片部上设置有多个第一端子，所述第一端子包括与所述第一组触针相接触的第一接触部，所述第二芯片部上设置有多个第二端子，所述第二端子包括与所述第二组触针相接触的第二接触部，所述第一芯片部包括相对设置的第一面和第二面，所述第二芯片部与所述第一芯片部相连接，所述第一芯片部上设置有多个用于容纳所述第二组触针的第一通槽，所述第一通槽贯穿所述第一面和第二面，至少一个所述第一通槽的一部分被至少一部分第二接触部所覆盖。
本发明的另一方面是为了提供一种墨盒，用于可拆卸地安装在打印机的保持部上，包括上述的芯片。
本发明的又一方面提供了一种墨盒取出的方法，所述墨盒上安装有上述的芯片，所述墨盒包括壳体和设置在所述壳体侧部的芯片架，所述芯片架与所述芯片相连接；所述方法包括：
沿与安装方向相交叉的方向移动所述芯片架；所述芯片随所述芯片架的移动与触针相脱离；取出墨盒。
本发明的再一方面提供了一种墨盒取出的方法，所述墨盒上安装有上述的芯片，所述芯片中的第一芯片部与第二芯片部活动连接；所述方法包括：
所述第一芯片部经过第二组触针时，所述第二芯片部与所述第一芯片部相分离；所述第二芯片部与所述第二组触针相脱离；取出墨盒。
本发明提供的芯片、墨盒及墨盒取出的方法，摒弃了尖形凸起的端子结构，降低了制造和加工的困难；通过将第一芯片部与第二芯片部连接组合呈芯片整体，使得至少一个第一通槽的一部分被至少一部分第二接触部 所覆盖，这样在安装过程中，第一通槽在安装过程中可以对触针起到引导作用，避免了芯片接触错位情况的发生，保证了芯片与触针可以更好的接触，同时也保证了芯片的正常使用效果，进而提高了芯片的实用性，有利于市场的推广与应用。
附图说明
图1为现有技术中所给出的墨盒的结构示意图一；
图2为现有技术中所给出的墨盒的结构示意图二；
图3a1为本发明实施例的芯片中第一芯片部的结构示意图一；
图3a2为本发明实施例的芯片中第一芯片部的结构示意图二；
图3b1为本发明实施例的芯片中第二芯片部的结构示意图一；
图3b2为本发明实施例的芯片中第二芯片部的结构示意图二；
图3c1为本发明实施例的一种芯片的结构示意图一；
图3c2为本发明实施例的一种芯片的结构示意图二；
图4a为本发明实施例的另一种芯片的结构示意图一；
图4b为本发明实施例的另一种芯片的结构示意图二；
图5a为本发明实施例的一种触针的结构示意图一；
图5b为本发明实施例的一种触针的结构示意图二；
图6a为本发明实施例的芯片与触针相接触的结构示意图一；
图6b为本发明实施例的芯片与触针相接触的结构示意图二；
图6c为本发明实施例的芯片与触针相接触的结构示意图三；
图7a为本发明实施例的芯片的剖面结构示意图一；
图7a1为图7a的局部放大示意图；
图7b为本发明实施例的芯片的剖面结构示意图二；
图7b1为图7b的局部放大示意图；
图7c为本发明实施例的芯片的剖面结构示意图三；
图7c1为图7c的局部放大示意图；
图8a为本发明实施例的另一种第一芯片部的结构示意图一；
图8b为本发明实施例的另一种第一芯片部的结构示意图二；
图8c为本发明实施例的又一种芯片的结构示意图一；
图8d为本发明实施例的又一种芯片的结构示意图二；
图9为本发明实施例的芯片与触针相接触的结构示意图四；
图10a为本发明实施例的再一种芯片的结构示意图一；
图10b为本发明实施例的再一种芯片的结构示意图二；
图11为本发明实施例的芯片与触针相接触的结构示意图五；
图12为本发明实施例的一种芯片的结构示意图三；
图13a为本发明实施例的第一芯片部通过连接部与第二芯片部连接的结构示意图一；
图13b为本发明实施例的第一芯片部通过连接部与第二芯片部连接的结构示意图二；
图13c为本发明实施例的第一芯片部通过连接部与第二芯片部连接的展开结构示意图；
图14a为本发明实施例的芯片与触针相接触的结构示意图五；
图14b为本发明实施例的芯片与触针相接触的结构示意图六；
图15为本发明实施例的一种芯片架的结构示意图；
图16a为本发明实施例的一种墨盒与芯片的分体结构示意图一；
图16b为本发明实施例的一种墨盒与芯片的安装结构示意图一；
图17为本发明实施例的一种保持部的结构示意图一；
图18为本发明实施例的一种墨盒与芯片的安装结构示意图二；
图19a为本发明实施例的一种墨盒的结构示意图；
图19b为本发明实施例的一种墨盒与芯片的分体结构示意图二；
图20为本发明实施例的一种保持部的结构示意图二；
图21为本发明实施例的一种保持部的结构示意图三；
图22为本发明实施例的一种墨盒的结构示意图；
图23为本发明实施例的一种墨盒与芯片的分体结构示意图三；
图24为本发明实施例的当芯片与墨盒脱离时，芯片与触针的位置关系图；
图25为本发明实施例的一种芯片安装在芯片架上的结构示意图；
图26a为本发明实施例的芯片架与触针接触的结构示意图一；
图26b为本发明实施例的芯片架与触针接触的结构示意图二。
图27为本发明实施例的一种墨盒取出的方法的流程示意图；
图28为本发明实施例的另一种墨盒取出的方法的流程示意图。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实例用于说明本发明，但不用来限制本发明的范围。
在本技术方案中，术语“第一”、“第二”仅仅用于描述的目的，而不能理解为指示或暗示相对重要性；除非另有明确的规定和限定；并且术语“安装”、“连接”、“固定”等术语均应广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
参考附图3a1-3c2可知，本实施例提供了一种芯片1，该芯片1用于与打印机保持部内的触针4电连接，包括第一芯片部100和第二芯片部200，第一芯片部100上设置有多个第一端子106，第一端子106包括与触针4相接触的第一接触部1061，第二芯片部200上设置有多个第二端子206，第二端子206包括与触针4相接触的第二接触部2061，第一芯片部100包括相对设置的第一面101和第二面102，第二芯片部200与第一芯片部100相连接，第一芯片部100上设置有多个用于容纳触针4的第一通槽105，第一通槽105贯穿第一面101和第二面102，至少一个第一通槽105的一部分被至少一部分第二接触部2061所覆盖。
其中，第一芯片部100的结构如图3a1-3a2所示，该第一芯片部100可以呈长方体形状，当然的，在具体应用时，还可以将第一芯片部100设置呈正方体结构，其具有第一面101-第六面(图中未示出)，第一面101与第二面102相对，第三面103与第四面110相对，第五面与第六面相对，可以包括第一基板104，该第一基板104用于承载第一通槽105、第一端子106、第一接触部1061以及定位部107等电器元件，其中，第一接触部1061为第一端子106的至少一部分。第一通槽105、第一端子106、定位部107可以设置在第一基板104上。定位部107用于对第一芯片部100/芯片1进行定位，例如：定位部107可以是孔(如图3a1所示)，此时， 定位部107可以与墨盒/芯片架上的定位柱之间相接合，将第一芯片部100固定在墨盒/芯片架上；定位部107也可是第一面101至第六面的任几个面上的一部分，通过面作为定位部107，可以将第一芯片部100固定在芯片架/墨盒上；定位部107也可以用于实现第一芯片部100与第二芯片部200之间的定位连接。可以理解的是，定位部107的数量可以为一个或多个。
另外，本实施例中第一通槽105的数量是多个，如图3a1所示，第一通槽105的数量是4个。可以理解的是，第一通槽105的数量也可以是2个、3个、5个等等。第一通槽105的形状可以是圆形、椭圆形、U形孔(如图3a1所示)、不规则孔等等，第一通槽105用于容纳触针4，具有可容纳触针4的空间，但是，需要注意的是，在第一通槽105内并无接触部，因此，第一通槽105不与触针4相电连接。此外，本实施例中的第一端子106的数量是多个，可以是2个、3个、4个、5个(如图3a1所示)。一般情况下，第一端子106是在第一基板104上镀铜而形成的。第一端子106上具有与保持部上的触针4相接触的第一接触部1061。第一接触部1061的数量可以与第一端子106的数量一一对应，也可以是不与第一端子106的数量相对应。其中，2个第一端子106可以与1个保持部中的触针4相接触，此时，2个第一端子106上具有1个第一接触部1061；或者，1个第一端子106和2个保持部中的触针4相接触，此时，在1个第一端子106上则具有2个第一接触部1061。
如图3b1-3b2所示，本实施例中的第二芯片部200可以呈长方体结构，具有第一表面201至第六表面(图中未示出)，并且，也可以包括第二基板204，该第二基板204用于承载定位部207、存储器208、第二通槽205、第二端子206、第二接触部2061等电器部件；其中，本实施例中第二芯片部200、第二芯片部200上的定位部207、第二端子206以及第二接触部2061的具体形状结构、功能作用、设置数量可以与第一芯片部100、第一芯片部100上的定位部107、第一端子106以及第一接触部1061的具体形状结构、功能作用、设置数量相类似，具体可参考上述陈述内容，在此不再赘述。
此外，当第一芯片部100与第二芯片部200相连接时可以构成芯片1的整体，具体的，第二芯片部200与第一芯片部100相抵接，进一步的， 第一芯片部100的第一面101可以与第二芯片部200的第二表面202相抵接，其可实现的连接方式可以包括以下任意一种：第一芯片部100与第二芯片部200焊接到一起；第一芯片部100与第二芯片部200通过定位扣、定位柱等连接件与定位孔的方式组合到一起；第一芯片部100与第二芯片部200通过粘结剂黏贴到一起。当然的，本领域技术人员还可以采用其他的连接方式，只要能够保证第一芯片部100与第二芯片部200稳定、有效地连接即可，在此不再赘述。
当第一芯片部100与第二芯片部200组成构成芯片1整体时，第一接触部1061与第二接触部2061可以为间隔设置，具体的，第一接触部1061与第二接触部2061可以为一一间隔设置的结构；此外，参考附图3c1-3c2可知，第一芯片部100中的至少一个第一通槽105的一部分可以被至少一部分第二接触部2061所覆盖，具体的，如果定义垂直于第一芯片部100的第一面101和第二面102的方向为Z方向，并且，以第二芯片部200指向第一芯片部100的方向为+Z轴方向，第二接触部2061在第一通槽105的-Z轴侧，第二接触部2061的+Z方向位置与所有的第一通槽105的位置相对应，从而实现了第二接触部2061可以覆盖第一通槽105的一部分。当然的，在具体设置时，可以将第二接触部2061的+Z方向位置设置为与不与所有的第一通槽105的位置相对应，其可以与部分第一通槽105的位置相对应，进一步实现了第二端子206上的第二接触部2061可以覆盖至少一个第一通槽105的一部分，这样可以更加保证芯片1与触针4可以更好的接触。
本实施例所提供的芯片1，摒弃了背景技术中的尖形凸起结构，降低了制造和加工的困难；通过将第一芯片部100与第二芯片部200连接组合呈芯片1整体，在构成芯片1整体时，使得至少一个第一通槽105的一部分被至少一部分第二接触部2061所覆盖，这样在安装过程中，第一通槽105在安装过程中可以对触针4起到引导作用，避免了芯片1接触错位情况的发生，保证了芯片1与触针4可以更好的接触，同时也保证了芯片1的正常使用效果，进而提高了芯片1的实用性，有利于市场的推广与应用。
在上述实施例的基础上，继续参考附图3a1-3c2可知，第一芯片部100上设置有第一接触部1061以及第一通槽105，本实施例对于第一接触部 1061与第一通槽105的具体位置关系不做限定，本领域技术人员可以根据具体的设计需求进行设置，较为优选的，第一芯片部100还可以包括与第一面101和第二面102相交的第三面103，从垂直于第三面103的方向上观察第一芯片部100，第一接触部1061与第一通槽105间隔设置，具体的，第一接触部1061与第一通槽105可以为一一间隔设置。
相类似的，本实施例对于第一端子106与第一通槽105的具体位置关系不做限定，本领域技术人员可以根据具体的设计需求进行设置，较为优选的，从垂直于第三面103的方向上观察第一芯片部100，第一端子106与第一通槽105间隔设置，具体的，参考附图3a1-3a2可知，第一端子106与第一通槽105可以一一间隔设置，此时，第一端子106的数量比第一通槽105的数量大1。当然的，本领域技术人员还可以采用其他的设置方式来设置第一端子106与第一通槽105、第一接触部1061与第一通槽105的位置关系，例如，可以采用均匀间隔的设置方式，此时，第一端子106的数量与第一通槽105的数量可以相同或不同，第一接触部1061的数量与第一通槽105的数量可以相同或不同。
通过将第一芯片部100中的第一端子106与第一通槽105间隔设置、第一接触部1061与第一通槽105间隔设置，可以使得第一芯片部100上的第一端子106之间的间隔变大，从而可以不仅使得第一接触部1061的可设计空间较大，降低了制造难度和工艺难度，同时在芯片1与触针4的安装过程中，使得第一通槽105在安装过程中可以对触针4形成引导作用，避免了芯片1接触错位情况的发生，进一步保证了芯片1与触针4可以更好的接触，提高了芯片1的实用性。
在上述实施例的基础上，继续参考附图3a1-3c2、4b可知，在对第一接触部1061进行具体设置时，第一芯片部100还具有与第三面103相对设置的第四面110，第一接触部1061相对于第四面110来说更靠近第三面103；此时，对于第一接触部1061而言，较为优选的，第一接触部1061可以设置于靠近第一芯片部100的第三面103的端部上。具体的，在第一接触部1061相对于第四面110而言，更靠近第三面103的端部，此时，第一接触部1061可以设置于第一面101、第二面102和第三面103中的任意一个面上；或者，第一接触部1061可以设置于第一面101和第二面102 上；或者，第一接触部1061利用设置于第一面101和第三面103上；或者，第一接触部1061可以设置于第一面101、第二面102和第三面103上，较为优选的，第一接触部1061可以仅仅位于第一面101上。
由于第一接触部1061为第一端子106的至少一部分，因此，对于第一端子106而言，第一端子106可以仅仅位于第一面101、第二面102和第三面103中的任意一个面上(如图3a1所示，第一端子106设置于第一面101上)，也可以位于第一面101和第二面102上，也可以位于第一面101或者第三面103上，也可以位于第一面101、第二面102和第三面103上(如图4b所示)，其中，较为优选的，第一端子106可以仅仅位于第一面101上。
本实施例中，在对第一接触部1061进行设置时，将第一接触部1061相对于第一芯片部100的第四面110而言，更靠近第三面103，具体的，第一接触部1061可以设置在墨盒的靠近第三面103的端部上，第一接触部1061更靠近触针4，如此结构可以进一步保证芯片1可以更好的与触针4相接触，提高了该芯片1使用的稳定可靠性。
在上述实施例的基础上，继续参考附图3a1-3c2，对于第二芯片部200而言，该第二芯片部200可以包括第一表面201至第六表面(图中未示出)，其中，第一表面201与第二表面202相对设置，第三表面203与第四表面210相对设置，第五表面与第六表面相对设置，并且，第三表面203可以与第一表面201、第二表面202相交；此时，第二芯片部200上可以设置有多个用于容纳触针4的第二通槽205，第二通槽205贯穿第一表面201和第二表面202，至少一个第二通槽205的一部分被至少一部分第一接触部1061所覆盖。
进一步的，从垂直于第三表面203的方向上观察第二芯片部200，第二接触部2061与第二通槽205间隔设置，具体的，第二接触部2061与第二通槽205可以一一间隔设置。相类似的，从垂直于第三表面203的方向上观察第二芯片部200，第二端子206与第二通槽205间隔设置，具体的，第二端子206与第二通槽205可以一一间隔设置。
此外，本实施例对于第二接触部2061的具体设置位置不做限定，本领域技术人员可以根据具体的设计需求进行设置，在第二芯片部200还具 有与第三表面203相对设置的第四表面210，第二接触部2061相对于第四表面210来说更靠近第三表面203；较为优选的，第二接触部2061可以设置于靠近第二芯片部200的第三表面203的端部上。具体的，第二接触部2061设置于第一表面201、第二表面202和第三表面203中的任意一个面上；或者，第二接触部2061设置于第一表面201和第二表面202上；或者，第二接触部2061设置于第一表面201和第三表面203上；或者，第二接触部2061设置于第一表面201、第二表面202和第三表面203上，较为优选的，第二接触部2061可以只设置在第二表面202上。
由于第二接触部2061为第二端子206的至少一部分，因此，对于第二端子206而言，第二端子206可以仅仅位于第一表面201、第二表面202和第三表面203中的任意一个面上(如图3b2所示，第二端子206设置于第一表面201上)，也可以位于第一表面201和第二表面202上，也可以位于第一表面201或者第三表面203上，也可以位于第一表面201、第二表面202和第三表面203上，其中，较为优选的，第二端子206可以仅仅位于第二表面202上。
需要说明的是，本实施例中第二通槽205、第二接触部2061、第二端子206的具体形状结构、设置方式以及功能效果与上述实施例中的第一通槽105、第一接触部1061、第一端子106的具体形状结构、设置方式以及功能效果相类似，具体可参考上述陈述内容，在此不再赘述。
在将第一芯片部100和第二芯片部200组合连接后，第一芯片部100与第二芯片部200可以相抵接，具体的，如图3c1-3c2所示，第二芯片部200的第二面202与第一芯片部100的第一面101可以相抵接，并且，第一通槽105的数量为4个，第一接触部1061的数量是5个；第二接触部2061的数量是4个，第二通槽205的数量为5个，此时，对于芯片1整体而言，至少一部分第二接触部2061可覆盖至少一个第一通槽105的一部分，至少一部分第一接触部1061可覆盖至少一个第二通槽205的一部分，从而有效地对触针4的安装起到了引导作用，保证了触针4与芯片1的接触效果。
通过在对第二接触部2061进行设置时，将第二接触部2061相对于第二芯片部200的第四表面210而言，更靠近第三面203，具体的，第二接 触部2061可以设置在墨盒的靠近第三表面203的端部上，第二接触部2061更靠近触针4，如此结构可以进一步保证芯片1可以更好的与触针4相接触，提高了该芯片1使用的稳定可靠性。
进一步的，结合附图5a-5b，本实施例提供了另一种芯片1，用于与打印机保持部内的触针4电连接，触针4包括高度不同且彼此交错设置的第一组触针401和第二组触针402，该芯片1包括第一芯片部100和第二芯片部200，第一芯片部100上设置有多个第一端子106，第一端子106包括与第一组触针401相接触的第一接触部1061，第二芯片部200上设置有多个第二端子206，第二端子206包括与第二组触针402相接触的第二接触部2061，第一芯片部100包括相对设置的第一面101和第二面102，第二芯片部200与第一芯片部100相连接，第一芯片部100上设置有多个用于容纳第二组触针402的第一通槽105，第一通槽105贯穿第一面101和第二面102，至少一个第一通槽105的一部分被至少一部分第二接触部2061所覆盖。
进一步的，第二芯片部200包括相对设置的第一表面201和第二表面202，第二芯片部200上设置有多个用于容纳所述第一组触针401的第二通槽205，第二通槽205贯穿第一表面201和第二表面202，至少一个第二通槽205的一部分被至少一部分第一接触部1061所覆盖。
其中，本实施例中的芯片结构与上述附图3a1-3c2、4a-4b所对应的芯片结构相同，具体可参考上述陈述内容，在此不再赘述。
另外，对于触针4的结构而言，参考附图5a-5b可知，该触针4可以包括在垂直与Z轴方向上交错设置的第一组触针401和第二组触针402，在Z轴方向上，第一组触针401与第二组触针402位于高度不同的位置上；并且，第一组触针401和第二组触针402可以均包括：杆部404、位于杆部404上端的横部403以及位于杆部404下端的头部405，头部405与横部403通过杆部404相连接，并且，头部405和杆部404可围绕横部403转动，此时，触针4具有一定的弹性，当对触针4的头部405或者杆部404施加压力时，触针4会进行相应的转动。
继续参考附图6a-6c可知，当芯片1与触针4相接触时，第一接触部1061与第一组触针401相接触，第二接触部2061与第二组触针402相接 触，第一通槽105用于容纳第二组触针402，第二通槽205用于容纳第一组触针401。
其中，在对第一芯片部100和第二芯片部200进行设置时，可以将第一基板104和第二基板204选用相同材质构成，或者，也可以选用不同材质构成。具体的，一种可实现的方式为：第一芯片部100可以是硬板，硬板部分可以采用FR-4材料，在硬板部分上施加力不会产生形变，具有形状和大小固定不会产生形变的特征；第二芯片部200可以是软板芯片，软板部分可以采用柔性电路板FPC材料，具有柔性特征，易于弯曲和变形。此时，当第二接触部2061与第二组触针402相接触时，第二接触部2061在触针4给予第二芯片部200的接触力的作用下可以产生形变。具体的，参考附图7a-7a1所示，对于第二芯片部200而言，其可以为软板芯片，当第二芯片部200沿垂直于第二芯片部200的第三表面203的方向上观察芯片1，产生形变后的第二接触部2061与第一接触部1061呈一排排列设置；或者，在第二接触部2061产生形变后，第二端子206与第一端子106呈一排排列设置。
具体的，当芯片1与触针4接合后，第二组触针402与第二芯片部200相接合，因为触针4会对第二芯片部200上的第二接触部2061产生一个作用力，导致第二接触部2061部分向下(T方向)产生一定的形变，从而使得第二端子206也会向下(T方向)产生一定的形变；如图7a-7a1所示，在安装方向T上，芯片1与触针4接触后，第二端子206产生形变后的位置与第一端子106呈一排排列，也即，第二端子206与第一端子106均在L1上排列设置；第二接触部2061产生形变后的位置与第一接触部1061呈一排排列，也即，第二接触部2061与第一接触部1061均在水平直线L1上排列设置。此时，第二接触部2061可以设置在第一通槽105的正下方(-Z轴的方向上)。
在上述实施例的基础上，继续参考附图7b-7b1可知，与附图7a-7a1所对应的实施例不同的是，本实施例中的第二芯片部200是硬板芯片，材质可以为FR-4材料，一般情况下，硬板芯片可以默认为不会产生形变。此时，在第一芯片部100与第二芯片部200相连接时，沿垂直于第二芯片部200的第三表面203的方向上观察芯片1，产生形变后的第二接触部2061 与第一接触部1061呈两排排列设置，也即，第一接触部1061在水平直线L2上排列设置，第二接触部2061在水平直线L3上排列设置；或者，第二端子206与第一端子106呈两排排列设置，也即，第一端子106在水平直线L2上排列设置，，第二端子206在水平直线L3上排列设置。
具体的，在第一芯片部100的第二面102与第二芯片部200的第二面202相抵接时，由于分别设置在第一基板104、第二基板204上的第一端子106和第二端子206可以是在基板上镀铜而形成的，因此，在安装方向T上，芯片1与触针4接触后，第二端子206的位置与第一端子106呈两排排列，第二接触部2061的位置与第一接触部1061呈两排排列。进一步的，第二接触部2061可以设置在第一通槽105的内部。
在上述实施例的基础上，继续参考附图7c-7c1可知，与附图7a-7a1和7b-7b1所对应的实施例不同的是，本实施例中的第一芯片部100与第二芯片部200通过中间部分5相连接；其中，中间部分5可以为单独设置的连接结构，可以设置在第一芯片部100或者第二芯片部200上，第一芯片部100与第二芯片部200通过中间部分5相连接之后，使得第一芯片部100与第二芯片部200之间形成有空隙，在该空隙中设置有第一端子106和第二端子206。此时，对于中间部分5而言，中间部分5设置在第一芯片部100与第二芯片部200之间，第一芯片部100还包括与第一面101和第二面102相交的第三面103，沿垂直于第一芯片部100的第三面103的方向上观察芯片1，中间部分5的高度为第一端子106的镀铜厚度与第二端子206的镀铜厚度之和。进一步的，沿垂直于第一芯片部100的第三面103的方向上观察芯片1，中间部分5、第一端子106和第二端子206呈一排排列设置，也即，中间部分5、第一端子106和第二端子206在水平直线L4上呈一排排列设置；或者，第一接触部1061子和第二接触部2061呈一排排列设置，也即，第一接触部1061子和第二接触部2061在水平直线L4上呈一排排列设置。
具体的，第一芯片部100的第一面101与第二芯片部200的第二面202相对设置，并且，第一芯片部100与第二芯片部200之间有中间部分5，中间部分5在方向T上的长度是第一端子106和第二端子206镀铜厚度之和，因此，由于中间部分5的存在，使得中间部分5、第一端子106和第 二端子206可以呈一排排列，由于第一接触部1061为第一端子106的至少一部分，第二接触部2061为第二端子206的至少一部分，因此，第一接触部1061和第二接触部2061在方向T上也可以呈一排排列，进一步的，第二接触部2061设置在第一通槽105的正下方(-Z轴的方向上)。如此结构，第一芯片部100与第二芯片部200之间设置有中间部分5，使得第一芯片部100与第二芯片部200之间并非直接接触，此结构可避免因第一芯片部100的第一面201与第二芯片部200的第二表面202的凹凸不平和两者之间的刚性接触造成对芯片的损坏。
本实施例中的第一芯片部100与第二芯片部200可以相抵接，或者通过中间部分5相连接，并且，第一芯片部100和第二芯片部200可以为相同材质或者不同材质，有效地扩展了芯片1结构的可实现方式，使得芯片1结构灵活多样，便于用户根据具体的设计需求设置相应的芯片1结构，进而拓展了芯片1的适用范围。
在上述实施例的基础上，继续参考附图10a-10b可知，还可以采用其他方式对第一芯片部100与第二芯片部200进行组合连接，具体的，第二芯片部200可以包括接合部6，第二端子206与接合部6的一侧端相连接，第二芯片部200通过接合部6与第一芯片部100相连接。
其中，上述的接合部6上可以为设置在第一芯片部100与第二芯片部200之间的接合机构，也可以为设置在各个第二端子206之间的接合机构。其中，第二端子206可以是铜片，该第二端子206可以通过接合部6与第一芯片部100来连通。如图10a-10b所示，第二端子206是悬空设置在接合部6上的，因此，第二端子206相对于接合部6是具有一定活动空间的，由于第二接触部2061为第二端子206的至少一部分，因此，第二接触部2061相对于接合部6而言也具有一定的活动空间，因此，当芯片1与触针4相接触时，第二组触针402会对第二芯片部201给予一定的接触力，第二芯片部200在接触力的作用下发生移动，具体的，该第二芯片部200可相对于第一芯片部100进行移动。并且，沿垂直于第二芯片部200的第三表面203的方向上看芯片1，发生移动后的第二接触部2061与第一接触部1061可以呈一排排列设置；或者，在第二接触部2061发生移动后，第二端子206与第一端子106可以呈一排排列设置。
具体的，如图11所示，为芯片1与触针4相接触的示意图，当第二组触针402与第二端子206接合的时候，第二端子206会在第二组触针402的作用力下，向-T方向/-Z轴方向移动，第二接触部2061也会在第二组触针402的作用力下，向-T方向/-Z轴方向移动，从而可以达到与第一接触部1061在方向T上呈一排排列的效果。
本实施例中的第二芯片部200通过接合部6与第一芯片部100，不仅保证了第一芯片部100与第二芯片部200连接的稳定可靠性，同时也拓展了第一芯片部100与第二芯片部200的连接方式，便于对芯片1进行加工制作。
在上述实施例的基础上，继续参考附图12可知，与上述附图10a-10b所对应的实施例不同的是，本实施例中的第一芯片部100与第二芯片部200通过接合部6活动连接，较为优选的，第一芯片部100与第二芯片部200通过接合部6相铰接，在第一芯片部100与第二芯片部200连接后，第二芯片部200可相对于第一芯片部100进行移动(包括转动、旋转、移动等活动方式)，此时，对于第一芯片部100和第二芯片部200而言，第一芯片部100不可以相对于第二芯片部200而进行移动或转动，而第二芯片部200可以相对于第一芯片部100进行旋转或移动，例如，调整第二芯片部200与第一芯片部100之间所形成的角度，使得第一芯片部100与第二芯片部200垂直、相交或者平行，当第一芯片部100与第二芯片部200相平行时，第一芯片部100上设置的多个抵接部109与第二芯片部200上设置的多个被抵接部209相接触。
另一种可实现的方式为：参考附图13a-13c所示，第一芯片部100与第二芯片部200通过连接部7活动连接，较为优选的，第一芯片部100与第二芯片部200通过连接部7相铰接，并且，连接部7的一端与第一芯片部100的端部相连接，另一端与第二芯片部200的端部相连接，进而可以实现，在第一芯片部100与第二芯片部200连接后，第一芯片部100和第二芯片部200可相对移动(包括转动、旋转、移动等活动方式)，此时，对于第一芯片部100和第二芯片部200而言，第一芯片部100可以相对于第二芯片部200而移动或转动，而第二芯片部200也可以相对于第一芯片部100旋转或移动。芯片1是由第一芯片部100、第二芯片部200、连接 部7组合而成的。可以理解的是，连接部7具有柔性特征，易于弯曲和变形，例如，连接部7是由柔性电路板FPC材料制造而成。进一步地，在连接部7上可以设置折叠线，将第一芯片部100与第二芯片部200通过连接部7折叠成芯片1。此时，对于芯片1而言，可以采用折叠的方式生产芯片1，即通过设置于连接部7上的折叠线将第一芯片部100与第二芯片部200进行折叠，从而形成上述的芯片1。但是，此方式生产工艺复杂，并且，在连接部7相折叠的地方设置折叠线，此方式可能会使得在芯片1折叠时，折叠痕迹可能与预设的折叠线有偏移，导致端子之间有错位情况。另外，还可能会因折叠方式造成芯片线路的断开。因此，较为优选的，采用不折叠的方式来生产芯片1，通过采用不折叠方式生产的芯片1，而是采用焊接或者定位扣与定位孔或者定位柱与定位孔或者粘结剂黏贴的生产方式不易造成端子之间错位情况出现，且不会造成芯片线路的断开。
在具体应用时，参考附图14a-14b可知，本实施例中的芯片1可以与触针4相接触，具体的，可以将芯片1安装在芯片架上，其中，芯片架的结构可以如图15所示，并将芯片架安装在墨盒上，从而使得芯片1与触针4实现电连接。其中，由于第二芯片部200可相对于第一芯片部100进行移动，相对于上述第一芯片部100与第二芯片部200不可相对活动的连接结构而言，当芯片1安装在芯片架上之后，芯片架也要随着芯片1而旋转，对于需要安装芯片架的墨盒而言，比较占据空间，并且结构复杂；因此，本实施例通过将第二芯片部200与第一芯片部100设置为可相对活动的结构，便于将芯片1与芯片架之间的安装与拆卸，并且，不需要芯片1整体旋转，因此结构简单、占据空间小，易于实现墨盒和打印机的小型化。
在上述实施例的基础上，继续参考附图4a可知，本实施例中的芯片1还设置有不与触针4相接触的第三端子3；其中，第三端子3设置于第一芯片部100上；或者，第三端子3设置于第二芯片部200上；或者，第三端子3设置于第一芯片部100和第二芯片部200上。
具体的，第三端子3可以用于检测第一端子106之间或者第二端子206之间或者第一端子106与第二端子206之间是否有短路情况；第三端子3也可以用于检测芯片1表面是否有水渍或者墨水渍或者水珠；第三端子3也可以用于检测其他。如图4a所示，第三端子3位于第一芯片部100上 时，第三端子3的设置位置与第一端子106的设置位置相同，具体可参考上述陈述内容，在此不再赘述。如果第三端子3位于第二芯片部200上时，第三端子3的设置位置同第二端子206的设置位置相同，具体可参考上述陈述内容，在此不再赘述。通过设置的第三端子3，可以有效地对第一芯片部100与第二芯片部200上的第一端子106和第二端子206的连接状态进行检测，进一步提高了芯片1使用的安全可靠性。
在上述实施例的基础上，继续参考附图8a-8d可知，本实施例中的第一芯片部100上还可以设置有第三通槽108，第三通槽108贯穿第一面和第二面；此时，对于第一接触部1061而言，第一接触部1061可以设置于第三通槽108内；或者，第一接触部1061可以设置于第三通槽108边缘上的第一面上或者第二面上；或者，第一接触部1061可以设置于第三通槽108边缘上的第一面和第二面上；或者，第一接触部1061可以设置于第一面、第二面和第三通槽108内。
此时，当芯片1与触针4相接触时，如图9所示，第一组触针401与设置于第三通槽108内的第一接触部1061相接触，第二组触针402与第二接触部2061相接触，通过设置的第三通槽108，可以有效地对第一接触部1061形成保护，避免了第一接触部1061容易受到损坏，并且在芯片1与触针4相接触时，还可以对触针4形成引导作用，保证了芯片1与接触部相接触的效果，进一步提高了芯片1使用的稳定可靠性。
参考附图16a-16b、18、19a-19b可知，本实施例提供了一种墨盒8，该墨盒8用于可拆卸地安装在打印机的保持部10上，其中，在该墨盒8上设置有上述任意一个实施例中的芯片1。
本实施例所提供的墨盒8，通过设置上述实施例中的芯片1，使得芯片1中的端子摒弃了背景技术中的尖形凸起结构，降低了制造和加工的困难；具体的，通过将第一芯片部与第二芯片部连接组合呈芯片1整体，使得至少一个第一通槽的一部分被至少一部分第二接触部所覆盖，这样在安装过程中，第一通槽可以对触针起到引导作用，避免了容易引起芯片1接触错位情况的产生，保证了芯片1与触针可以更好的接触，同时也保证了墨盒8的正常使用效果，进而提高了墨盒8的实用性，有利于市场的推广与应用。
在上述实施例的基础上，继续参考附图16a-16b所示，本实施例中的墨盒8用于安装在保持部10上，该保持部10为附图17所示的保持部10，具体的，对于保持部10的具体结构而言，方向T是芯片1/墨盒8安装到保持部10上的方向。保持部10可同时安装多个墨盒8，多个墨盒8可以是不同颜色或者不同宽度的墨盒8，如图17所示，该保持部10具有4个安装位1002，墨盒8可以安装在上述的4个安装位1002上。此外，该保持部10还具有：被限制部1004、触针架1003、触针、墨针1001，其中，被限制部1004用于限制墨盒8，防止墨盒8朝向-T方向移动而脱离保持部10。触针架1003上设置有触针，触针架1003可以固定触针。触针可以与芯片1上的端子(包括第一端子106和第二端子206)相接触从而为墨盒8和保持部10之间建立电传输。
此外，本实施例芯片1安装在墨盒8上的具体实现方式不做限定，本领域技术人员可以根据具体的设计需求进行设置，其中，一种可实现的方式为，如图16a-16b所示，墨盒8可以包括出墨口803、第一壳体8011和与第一壳体8011相连接的第二壳体8012，出墨口803可以设置于第一壳体8011的下端，第二壳体8012的侧部设置有安装部804，芯片1安装在芯片架9上，芯片架9通过一弹性件806安装在安装部804中。具体的，安装部804的侧端可以设置有轨迹孔805，芯片架9上设置有旋转轴902和支撑部903，旋转轴902用于沿着轨迹孔805进行运动；当芯片架9安装在安装部804中时，支撑部903与弹性件806相抵接。可以理解的是，本实施例中的墨盒8还可以包括多个壳体801配合而言，并不限于上述的第一壳体8011和第二壳体8012。
此外，对于芯片架9而言，参考附图15、25可知，芯片架9可以包括上支架904与上支架904活动连接的下支架905，第一芯片部固定在上支架904上，第二芯片部固定在下支架905上，其中，上支架904可随着第一芯片部的活动而活动，下支架905可以随着第二芯片部的活动而活动。具体的，芯片架9上可以设置有定位柱901、旋转轴902、支撑部903，定位柱901与芯片1上的定位部配合，可以将芯片1固定到芯片架9上，芯片1可以随着芯片架9的移动而移动。旋转轴209可以沿着壳体801上的轨迹孔805而移动或者旋转。支撑部903是与弹性体相抵接的部分，芯片 架9在受到外力的情况下，可以沿着轨迹孔805而移动和旋转同时挤压弹性件806，如图16b所示，墨盒8沿着安装方向T安装到安装部804上时，出墨口803与墨管1005相接合，芯片1与触针相接合，从而实现了将芯片1安装到墨盒8上。
对于墨盒8的具体结构而言，参考附图18所示，其中，该墨盒8用于安装在如图17所示的保持部10上，具体的，该墨盒8可以包括壳体801，壳体801的侧部设置有芯片架807，芯片架807与芯片1相连接，芯片1通过芯片架807安装在壳体801上。芯片架807与壳体801之间会设置有弹性部件。壳体801的侧端设置有轨迹孔805，芯片架807上设置有操作部8071，并且芯片架807通过一旋转轴808安装在壳体801上，旋转轴808用于沿着轨迹孔805进行运动(移动或转动)；在对操作部8071施加压力时，旋转轴808沿轨迹孔805进行运动(移动或转动)，芯片1随着芯片架807的运动(移动或转动)而安装在壳体801上。
具体的，该墨盒8还可以包括一壳体801和设置于壳体801下端的出墨口803，与上述附图16a-16b所对应的实施例不同的是，芯片1与芯片架807相连接(可以是直接连接，也可以是通过芯片架9或者中间元件连接)，芯片架807的移动/转动可以带动芯片1进行移动/转动。当墨盒8沿与安装方向T将墨盒8安装到保持部10上时，操作者手指按压芯片架807的操作部8071，芯片架807的旋转轴808在轨迹孔805中移动或者旋转，带动芯片1移动或者旋转，从而，芯片1的位置与之前会发生变化，芯片1会随着芯片架807向墨盒8内部移动，然后将墨盒8安装到保持部10中。当墨盒8沿与安装方向T相反的方向-T从安装部804中取出时，操作者手指按压芯片架807的操作部8071，芯片架807的旋转轴808在轨迹孔805中移动或者旋转，带动芯片1反向移动或者旋转，从而，芯片1的位置与之前会发生变化，芯片1随活动件移动，脱离触针，然后，从保持部10中取出墨盒8；通过上述过程可知，该墨盒8与芯片1的安装与拆卸过程简单，容易实现，进而提高了墨盒8的实用性。
进一步的，对于保持部10的结构而言，还存在另一种结构，具体参考附图20-21所示，该保持部中可以安装如图22-23中所示的墨盒8结构，具体的，保持部10可以包括被限制部1004、卡孔1007、墨管1005、触针、 杠杆1006，其中，被限制部1004可以有2个，一个是凹陷结构、一个设置在杠杆1006上，适用于安装在该保持部10中的墨盒8结构如图22-23所示，具体的，墨盒8的两侧设置有第一卡位809和第二卡位810，当墨盒8安装到保持部10上时，被限制部1004分别与第一卡位809，卡孔1007与第二卡位810相接合，墨管1005与出墨口803相接合。
上述附图16a-16b、18、19a-19b中的墨盒8用于安装到附图17所对应的保持部10中，当上述的墨盒8需要从保持部10中进行拆卸时,参考附图27可知，本实施例提供了一种墨盒取出的方法，其中，墨盒上安装有上述任意一个实施例中的芯片，墨盒包括壳体和设置在壳体侧部的芯片架，芯片架与芯片相连接；方法包括：
S101：沿与安装方向相交叉的方向移动芯片架；其中，与安装方向相交叉的方向可以是与安装方向相倾斜或者相垂直的方向；具体是通过对操作部施加压力来移动芯片架。
S102：芯片随芯片架的移动与触针相脱离；由于芯片与芯片架相连接，因此，芯片架的移动会带动芯片进行移动，从而使得芯片与触针相脱离，此时，芯片与触针的位置如图24所示。
S103：取出墨盒。
本实施例中墨盒取出的实现过程与上述图18所对应的实施例的具体实现过程相同，具体可参考上述陈述内容，在此不再赘述。
本实施例所提供的墨盒取出的方法，操作方法简单，容易实现，便于用户对墨盒进行及时的更换与维护操作，进而提高了该墨盒取出的方法的实用性。
上述附图22-23中的墨盒8用于安装到附图20-21所对应的保持部10中，当上述的墨盒8需要从保持部10中进行拆卸时,参考附图28可知，本实施例提供了另一种墨盒取出的方法，该墨盒上安装有上述任意一个实施例中的芯片，芯片中的第一芯片部与第二芯片部活动连接；方法包括：
S201：第一芯片部经过第二组触针时，第二芯片部与第一芯片部相分离；
S202：第二芯片部与第二组触针相脱离；
S203：取出墨盒。
具体的，当墨盒沿着-T方向取出时，芯片1与触针4的位置关系如图22所示，当芯片1旋转和移动的时候，第二端子会越过第二组触针402，当第二端子越过第二组触针402的时候，墨盒可以从保持部中取出。当墨盒从保持部中取出的时候，如图26a所示，由于第一芯片部与第二芯片部是活动连接的，第二组触针402位于方向-T的上游侧，因此，第二组触针402会阻挡第二芯片部继续沿方向-T移动；随着墨盒继续沿方向-T移动，第一芯片部与第二芯片部相分离，即为附图中的上支架904与下支架905相分离，同时芯片和芯片架9在取出作用力和触针给予第二芯片部的作用力的双重作用力下沿着轨迹孔的轨迹移动和旋转，如图26b所示。当第二端子越过第二组触针402的时候，触针不在对芯片1产生作用力，此时，可以从保持部中取出墨盒。
本实施例所提供的墨盒取出的方法，操作方法简单，容易实现，便于用户对墨盒进行及时的更换与维护操作，进而提高了该墨盒取出的方法的实用性。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (15)

  1. 一种芯片，用于与打印机保持部内的触针电连接，其特征在于，所述芯片包括第一芯片部和第二芯片部，所述第一芯片部上设置有多个第一端子，所述第一端子包括与所述触针相接触的第一接触部，所述第二芯片部上设置有多个第二端子，所述第二端子包括与所述触针相接触的第二接触部，所述第一芯片部包括相对设置的第一面和第二面，所述第二芯片部与所述第一芯片部相连接，所述第一芯片部上设置有多个用于容纳所述触针的第一通槽，所述第一通槽贯穿所述第一面和第二面，至少一个所述第一通槽的一部分被至少一部分第二接触部所覆盖。
  2. 根据权利要求1所述的芯片，其特征在于，所述第一芯片部还包括与所述第一面和第二面相交的第三面，从垂直于所述第三面的方向上观察所述第一芯片部，所述第一接触部与所述第一通槽间隔设置。
  3. 根据权利要求2所述的芯片，其特征在于，所述第一芯片部还具有与所述第三面相对设置的第四面，所述第一接触部相对于所述第四面来说更靠近所述第三面；所述第一接触部设置于靠近所述第一芯片部的第三面的端部上。
  4. 根据权利要求1所述的芯片，其特征在于，所述第二芯片部包括相对设置的第一表面和第二表面，所述第二芯片部上设置有多个用于容纳所述触针的第二通槽，所述第二通槽贯穿所述第一表面和第二表面，至少一个所述第二通槽的一部分被至少一部分第一接触部所覆盖。
  5. 根据权利要求4所述的芯片，其特征在于，所述第二芯片部还包括与所述第一表面和第二表面相交的第三表面，从垂直于所述第三表面的方向上观察所述第二芯片部，所述第二接触部与所述第二通槽间隔设置。
  6. 根据权利要求1所述的芯片，其特征在于，所述第一芯片部与所述第二芯片部相抵接。
  7. 一种芯片，用于与打印机保持部内的触针电连接，所述触针包括高度不同且彼此交错设置的第一组触针和第二组触针，其特征在于，所述芯片包括第一芯片部和第二芯片部，所述第一芯片部上设置有多个第一端子，所述第一端子包括与所述第一组触针相接触的第一接触部，所述第二芯片部上设置有多个第二端子，所述第二端子包括与所述第二组触针相接 触的第二接触部，所述第一芯片部包括相对设置的第一面和第二面，所述第二芯片部与所述第一芯片部相连接，所述第一芯片部上设置有多个用于容纳所述第二组触针的第一通槽，所述第一通槽贯穿所述第一面和第二面，至少一个所述第一通槽的一部分被至少一部分第二接触部所覆盖。
  8. 根据权利要求7所述的芯片，其特征在于，所述第二芯片部包括相对设置的第一表面和第二表面，所述第二芯片部上设置有多个用于容纳所述第一组触针的第二通槽，所述第二通槽贯穿所述第一表面和第二表面，至少一个所述第二通槽的一部分被至少一部分第一接触部所覆盖。
  9. 根据权利要求8所述的芯片，其特征在于，所述第一通槽用于容纳所述第二组触针，所述第二通槽用于容纳所述第一组触针。
  10. 根据权利要求9所述的芯片，其特征在于，当所述第二接触部与所述第二组触针相接触时，所述第二接触部在所述触针给予所述第二芯片部的接触力的作用下产生形变。
  11. 根据权利要求9所述的芯片，其特征在于，所述第二芯片部为硬板芯片，沿垂直于所述第二芯片部的第三表面的方向上观察所述芯片，
    当芯片与触针相接触后，所述第二接触部与所述第一接触部呈两排排列设置，并且所述第二接触部设置于所述第一通槽内。
  12. 根据权利要求7-11中任意一项所述的芯片，其特征在于，在所述第一芯片部与所述第二芯片部连接后，在垂直于所述第一芯片部的第三面的方向上观察所述芯片，所述第一接触部与所述第二接触部间隔设置。
  13. 一种墨盒，用于可拆卸地安装在打印机的保持部上，其特征在于，包括权利要求1-12中任意一项所述的芯片。
  14. 根据权利要求13所述的墨盒，其特征在于，所述墨盒包括壳体，所述壳体的侧部设置有安装部，所述芯片安装在芯片架上；所述安装部可安装至少一部分的所述芯片和所述芯片架。
  15. 根据权利要求14所述的墨盒，其特征在于，所述芯片架与所述壳体之间设置有一弹性件；所述安装部的侧端设置有轨迹孔，所述芯片架上设置有旋转轴和支撑部，所述旋转轴可沿着所述轨迹孔运动；当所述芯片架安装在所述墨盒中时，所述支撑部与所述弹性件相抵接。
PCT/CN2017/116264 2017-06-28 2017-12-14 芯片、墨盒及墨盒取出的方法 WO2019000853A1 (zh)

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