WO2018235436A1 - Stratifié comprenant une couche en plastique industriel thermoplastique et procédé de production d'une tel stratifié - Google Patents
Stratifié comprenant une couche en plastique industriel thermoplastique et procédé de production d'une tel stratifié Download PDFInfo
- Publication number
- WO2018235436A1 WO2018235436A1 PCT/JP2018/017691 JP2018017691W WO2018235436A1 WO 2018235436 A1 WO2018235436 A1 WO 2018235436A1 JP 2018017691 W JP2018017691 W JP 2018017691W WO 2018235436 A1 WO2018235436 A1 WO 2018235436A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- engineering plastic
- less
- release film
- laminate
- Prior art date
Links
- 229920006351 engineering plastic Polymers 0.000 title claims abstract description 96
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 44
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000002985 plastic film Substances 0.000 claims abstract description 51
- 239000010408 film Substances 0.000 claims description 155
- 239000010409 thin film Substances 0.000 claims description 41
- 229920000642 polymer Polymers 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 19
- 230000009477 glass transition Effects 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 17
- -1 polypropylene Polymers 0.000 claims description 16
- 230000014759 maintenance of location Effects 0.000 claims description 14
- 239000004695 Polyether sulfone Substances 0.000 claims description 12
- 229920006393 polyether sulfone Polymers 0.000 claims description 12
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 11
- 229920002530 polyetherether ketone Polymers 0.000 claims description 11
- 238000010894 electron beam technology Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000004952 Polyamide Substances 0.000 claims description 9
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 9
- 229920002647 polyamide Polymers 0.000 claims description 9
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 229920002492 poly(sulfone) Polymers 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229920012287 polyphenylene sulfone Polymers 0.000 claims description 6
- 230000001954 sterilising effect Effects 0.000 claims description 6
- 238000004659 sterilization and disinfection Methods 0.000 claims description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 5
- 229930182556 Polyacetal Natural products 0.000 claims description 5
- 239000004962 Polyamide-imide Substances 0.000 claims description 5
- 239000004693 Polybenzimidazole Substances 0.000 claims description 5
- 239000004697 Polyetherimide Substances 0.000 claims description 5
- 230000005251 gamma ray Effects 0.000 claims description 5
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 5
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 5
- 229920002312 polyamide-imide Polymers 0.000 claims description 5
- 229920001230 polyarylate Polymers 0.000 claims description 5
- 229920002480 polybenzimidazole Polymers 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 229920001601 polyetherimide Polymers 0.000 claims description 5
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 5
- 229920006324 polyoxymethylene Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 238000007765 extrusion coating Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- 239000010410 layer Substances 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 229920000491 Polyphenylsulfone Polymers 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- 150000003457 sulfones Chemical class 0.000 description 10
- 230000037303 wrinkles Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
- 238000004804 winding Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 238000009864 tensile test Methods 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 238000010411 cooking Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920006233 biaxially oriented polyamide Polymers 0.000 description 3
- 238000004299 exfoliation Methods 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229920005603 alternating copolymer Polymers 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 150000001925 cycloalkenes Chemical class 0.000 description 2
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000005026 oriented polypropylene Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000000807 solvent casting Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 229940124543 ultraviolet light absorber Drugs 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
Definitions
- the present invention relates to a laminate having a layer of thermoplastic engineering plastic and a method of manufacturing the same, and more particularly to a thin film engineering plastic film excellent in thickness uniformity and surface smoothness and a method of manufacturing the same.
- thermoplastic engineering plastic film As a method of producing a thermoplastic engineering plastic film, it is common practice to sandwich a melt-extruded resin with a nip roll or produce a film by bringing it into close contact with a large diameter cooling drum.
- the present invention relates to a laminate having a thermoplastic engineering plastic layer of 250 ⁇ m or less and a method of manufacturing the same, and particularly provides a thin film engineering plastic film excellent in thickness uniformity and surface smoothness.
- the inventors of the present invention extrusion-coat the engineering plastic melt on one surface of the release film, and peel off the release film after molding the laminate.
- the inventors have found that an engineering plastic film that has been overcome can be obtained, and have completed the present invention.
- thermoplastic engineering plastic having a thickness of 250 ⁇ m or less and a thickness accuracy of 15% or less is laminated on one side of a release film having a tensile breaking strength of 115 MPa or more and a tensile breaking elongation of 190% or less Stacks.
- the layer of the engineering plastic is polyetheretherketone, polycarbonate, polyarylate, polyacetal, polyphenylene sulfide, polyethersulfone, polysulfone, polyphenylene sulfone, polyphenylene sulfone, polyetherimide, polyamide imide, polyether ketone, polybenzimidazole, cycloolefin
- the polymer according to the above (1) which comprises at least one polymer selected from the group consisting of a polymer, a liquid crystal polymer and a modified product thereof, or a mixture of two or more polymers selected from the above group. Stack.
- the release film is made of one or more polymers selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate, and polyamide, or a mixture of two or more polymers selected from the above group
- the laminated body as described in said (1) or (2).
- the arithmetic mean surface roughness of the surface of the layer of the engineering plastic in contact with the release film is 1.0 ⁇ m or less, any one of the above items (1) to (3)
- a thin film comprising the layer of the engineering plastic of the laminate according to any one of (1) to (4).
- the thin film as described in said (5) which is a film for film capacitors.
- the thin film as described in (5) above which is a film for a speaker diaphragm.
- the thin film as described in (5) above which is a film for a circuit board.
- the thin film according to (5) which is a film for a heater insulating material.
- the thin film as described in (5) above which is a film for protecting glass.
- thermoplastic engineering plastic melt is extruded on one side of a release film having a tensile breaking strength of 115 MPa or more and a tensile breaking elongation of 190% or less in the production direction, and a heat of 250 ⁇ m or less in thickness and 15% or less in thickness accuracy
- Tx glass transition temperature of the exfoliation film
- Tg1 glass transition temperature of the exfoliation film
- the layer of the engineering plastic is polyetheretherketone, polycarbonate, polyarylate, polyacetal, polyphenylene sulfide, polyethersulfone, polysulfone, polyphenylenesulfone, polyetherimide, polyamideimide, polyetherketone, polybenzimidazole, cycloolefin
- the polymer according to the above (11) which comprises at least one polymer selected from the group consisting of a polymer, a liquid crystal polymer and a modified product thereof, or a mixture of two or more polymers selected from the above group.
- the manufacturing method of the said laminated body is cycloolefin
- the release film is made of one or more polymers selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate and polyamide, or a mixture of two or more polymers selected from the above group
- the arithmetic mean surface roughness of at least the surface of the layer of the engineering plastic in contact with the release film is 1.0 ⁇ m or less, any one of the above (11) to (13)
- the laminate film is obtained by the method for producing a laminate according to any one of (11) to (14), and then the release film is peeled and removed from the laminate. How to make thin film engineering plastic films.
- the thin film as described in (5) which has been treated with any of hot water, chemicals, sterilization and ozone.
- the thin film according to (5) which has a tensile elongation retention of 35% or more before and after a pressure cooker test for 96 hours under an environment of 120 ° C. ⁇ 100% RH under pressure cooker conditions.
- the thin film as described in (5) which has been subjected to any of electron beam irradiation and gamma ray irradiation.
- the thin film as described in (5) which is a film for household appliance members.
- the thin film as described in (5) which is a film for automobile parts.
- the thin film engineering plastic film of the present invention is as thin as 250 ⁇ m or less, it has excellent uniformity of thickness of 15% or less in thickness unevenness (thickness accuracy).
- Such thin film engineering plastic films having excellent uniformity in thickness are useful for applications requiring high accuracy, such as film capacitors, speaker diaphragms, and circuit board materials.
- the laminate in which the thin film engineering plastic film is laminated in the present invention is a laminate obtained by extrusion-coating a thermoplastic engineering plastic melt on a release film. Further, the thin film engineering plastic film in the present invention is characterized by being a thin film engineering plastic film obtained by peeling a peeling film from a laminate.
- the invention is illustrated in more detail by the following examples, without being limited thereto.
- thermoplastic resin constituting the thermoplastic engineering plastic film may be either crystalline or noncrystalline, such as polyetheretherketone, polycarbonate, polyarylate, polyacetal, polyphenylene sulfide, polyethersulfone, polysulfone, polyphenylene sulfone, poly Ether imide, polyamide imide, polyether ketone, polybenzimidazole, cycloolefin polymer, liquid crystal polymer and one or more polymers selected from the group consisting of liquid crystal polymers and modified products thereof or two or more polymers selected from the above group Mixtures of these can be suitably used.
- polyetheretherketone polycarbonate, polyarylate, polyacetal
- polyphenylene sulfide polyethersulfone
- polysulfone polysulfone
- polyphenylene sulfone poly Ether imide
- polyamide imide polyamide imide
- polyether ketone polybenzimidazole
- cycloolefin polymer liquid crystal polymer
- the tensile breaking strength in the production direction of the release film is preferably 115 MPa or more, more preferably 120 MPa or more, still more preferably 130 MPa or more, in particular, in order to prevent breakage of the laminate after extrusion coating. It is 140 MPa or more, and most preferably 150 MPa or more.
- the tensile elongation at break in the production direction of the release film is preferably 190% or less, more preferably 170% or less, and still more preferably 160% or less, in order to prevent the elongation of the laminate after extrusion coating. Particularly preferably, it is 150% or less, and most preferably 100 or more and less than 110%.
- the thickness of the release film is not particularly limited. However, if the film is too thin, the tensile breaking strength in the production direction may decrease, the tensile elongation at break may increase, and wrinkles may easily occur during winding. If the film is too thick, the peelable film may peel from the laminate due to the elasticity of the film itself at the time of winding. And it will not be possible to take up the winding itself, which will increase costs. Therefore, the thickness of the release film is preferably 12 ⁇ m to 100 ⁇ m, more preferably 12 ⁇ m to 80 ⁇ m, still more preferably 13 ⁇ m to 70 ⁇ m, particularly preferably 14 ⁇ m to 60 ⁇ m, and most preferably It is 15 micrometers or more and 50 micrometers or less.
- the material of the release film at least one polymer selected from polypropylene, polyethylene terephthalate, polyethylene naphthalate, and polyamide, or a mixture of two or more polymers selected from the above group can be suitably used.
- a uniaxially stretched or biaxially stretched film in the production direction it is more preferable to use a uniaxially stretched or biaxially stretched film in the production direction.
- the release film surface may be subjected to well-known ease such as corona treatment, plasma treatment, ozone treatment, flame treatment, alkali treatment, evaporation treatment, and primer treatment. Adhesive treatment can be applied.
- a known release treatment such as coating a release agent on the surface of the release film can be performed.
- Thermoplastic engineering plastics and release films contain additives such as antioxidants, ultraviolet light absorbers, light stabilizers, lubricants, antistatic agents, inorganic fillers, colorants, crystal nucleating agents, flame retardants, and plasticizers. May be The content of these additives is preferably 40% by mass or less, more preferably 30% by mass or less, and still more preferably 30% by mass with respect to 100% by mass of the thermoplastic engineering plastic or the resin component constituting the release film. It is at most mass%, particularly preferably at most 20 mass%, most preferably at most 10 mass%. When the additive amount of the additive exceeds 40% by mass, the appearance and the formability of the film may be significantly reduced.
- additives such as antioxidants, ultraviolet light absorbers, light stabilizers, lubricants, antistatic agents, inorganic fillers, colorants, crystal nucleating agents, flame retardants, and plasticizers. May be The content of these additives is preferably 40% by mass or less, more preferably 30% by mass or less, and still more preferably 30%
- thermoplastic engineering plastic film of the present invention preferably has a thickness of 250 ⁇ m or less, more preferably 150 ⁇ m or less, still more preferably 50 ⁇ m or less, particularly preferably 30 ⁇ m or less, most preferably, after peeling off the release film. Is 20 ⁇ m or less.
- the thickness accuracy after peeling off the release film is preferably 15% or less, more preferably 12% or less, still more preferably 10% or less, particularly preferably 7% It is characterized by the following, most preferably 5% or less.
- the thickness accuracy is an index indicating an error of the thickness, and the lower the numerical value, the higher the accuracy of the thickness.
- the thermoplastic engineering plastic film of the present invention preferably has an arithmetic average surface roughness of at least 1.0 ⁇ m, more preferably 0.8 ⁇ m or less, and still more preferably 0.6 ⁇ m or less at least in contact with the release film. Or less, particularly preferably 0.5 ⁇ m or less, and most preferably 0.2 ⁇ m or less.
- the arithmetic average surface roughness is larger than 1.0 ⁇ m, the capacity and the withstand voltage are significantly reduced, and it becomes difficult to obtain sufficient performance when used as a film capacitor .
- thermoplastic engineering plastic film of the present invention As a method of forming the thermoplastic engineering plastic film of the present invention, an extrusion coating method is preferably used. Peeling the resin or resin composition constituting the thermoplastic engineering plastic melt from individual single screw extruders or twin screw extruders in the state of being laminated in two or more layers by a single layer or multi manifold die or feed block system
- the thermoplastic engineering plastic film of a thin film can be obtained by extruding on a film, forming a laminate, and peeling off the release film.
- the temperature (Tx (° C)) at which the extruded thermoplastic engineering plastic melt contacts the release film is relative to the glass transition temperature (Tg1 (° C)) and the melting point (Tm (° C)) of the release film.
- Tg1 ⁇ Tx ⁇ Tg1 + 180 ° C.Tm Preferably Tg1 + 5 ° C. ⁇ Tx ⁇ Tg1 + 180 ° C.Tm, still more preferably Tg1 + 10 ° C. ⁇ Tx ⁇ Tg1 + 180 ° C.Tm, particularly preferably Tg1 + 15 ° C.
- Tx 20 ° C. ⁇ Tx ⁇ Tg1 + 180 ° C.Tm
- Tx 20 ° C. ⁇ Tx ⁇ Tg1 + 180 ° C. ⁇ Tm
- the temperature (Ty (° C.)) of the metal roll is preferably Tg 2 -120 ° C. ⁇ Ty ⁇ Tg 2 + 20 ° C., more preferably Tg 2-115, with respect to the glass transition temperature (Tg 2 (° C.)) of the thermoplastic engineering plastic.
- ° C ⁇ Ty ⁇ Tg2 + 15 ° C. more preferably Tg2-110 ° C. ⁇ Ty ⁇ Tg2 + 12 ° C., particularly preferably Tg2-110 ° C. ⁇ Ty ⁇ Tg2 + 10 ° C., most preferably Tg2-100 ° C. ⁇ Ty ⁇ Tg2 It is preferable to satisfy the relationship of + 5 ° C.
- thermoplastic engineering plastic film When Ty is lower than Tg2-120 ° C, it is difficult to obtain good adhesive strength between the thermoplastic engineering plastic film and the release film, and when Ty exceeds Tg + 20 ° C, the thermoplastic engineering plastic film is a metal roll. And it becomes difficult to peel the film smoothly from the metal roll, and the appearance of the film is apt to deteriorate.
- the peel strength of the peelable film in the laminate is preferably 3 g / cm or more and 1000 g / cm or less.
- the peel strength of the peelable film in the laminate is preferably 3 g / cm or more and less than 10 g / cm, or 100 g / cm or more and 1000 g / cm or less, and most preferably 10 g / cm or more and less than 100 g / cm . If the peel strength is less than 3 g / cm, the film peels off in the process leading to winding, causing breakage, elongation, and wrinkles. On the other hand, if the peel strength is greater than 1000 g / cm, the peel film may not be peeled off and the material may be broken.
- the application of the thin film engineering plastic film of the present invention includes a film capacitor, a speaker diaphragm, a circuit board, a heater insulating material, a glass protective film, a home appliance member, and an automobile part member.
- the film of the present invention acts as a dielectric, and a conductor layer is laminated to the engineering plastic film.
- the conductor layer is formed, for example, by vapor deposition, sputtering, or lamination with a metal foil.
- the thickness of the dielectric and its accuracy greatly affect the capacity and the withstand voltage, so a thin film of 10 ⁇ m or less and a thickness accuracy of 15% or less are required, but the thin film engineering plastic film of the present invention should satisfy these. Can.
- the film of the present invention functions as a diaphragm, and it is required that the engineering plastic film has less natural vibration due to split vibration and resonance and high conversion efficiency. For this reason, the film is required to have high thickness accuracy in addition to high Young's modulus, but the thin film engineering plastic film of the present invention can be suitably used for this application because it has a thickness accuracy of 15% or less. .
- the film of the present invention functions as a base film of a laminate, and a metal layer, a ceramic layer, a resin layer and the like are laminated.
- a metal layer for wiring is formed on the surface of a base film by a dry lamination method, a plating method, a vapor deposition method, a sputtering method or the like. Since the resin and resin composition of the engineering plastic film of the present invention are excellent in heat distortion resistance, heat dimensional stability and heat resistance toughness, the laminate using the film of the present invention as a base film is sufficiently inhibited from warping. It is difficult to cause peeling of the laminated metal layer or the like, and cracking or breakage due to the decrease in flexibility is also difficult to occur. In addition, since the thickness accuracy is high, the uniformity of the withstand voltage characteristics in the plane of the laminate is excellent.
- the film of the present invention functions as a substrate film. Since the film of the present invention has high thickness accuracy, it is excellent in the homogeneity of the withstand voltage characteristics in the plane of the laminate.
- the film of the present invention functions as a base film, and an adhesive layer containing acrylic or silicone as a main component is laminated.
- an adhesive layer containing acrylic or silicone as a main component is laminated.
- the sulfone-based resin film of the present invention functions as a member for use in an environment near 200 ° C., such as an engine peripheral member and a transmission member. Furthermore, since the amount of outgas generation at the time of heating is small, the influence on other electronic devices is small, which is useful.
- thermoplastic engineering plastics in particular, resin compositions containing sulfone-based resins are used in applications such as food packaging members and cooking equipment members.
- a sulfone-based resin film is applied as a member of a portion used in a sterilization / sterilization process, and hot water, chemicals, high pressure steam, circulating steam, dry heat, ultraviolet irradiation, gamma irradiation, electron beam irradiation, ethylene oxide gas
- the sulfone-based resin film of the present invention can satisfy this, so for example, food packaging bags (pouches etc.), household use It can be suitably used as a member such as a cooking device (microwave cooking device etc.), a commercial cooking device, a vending machine, a water purifier and the like.
- thermoplastic engineering plastic film of the present invention can also be applied as a molded article.
- a sulfone resin film can cope with general molding.
- a molding method in addition to insert molding and in-mold molding, as a general vacuum molding, pressure molding and the application thereof, the resin sheet is heated and softened in a vacuum state and released under atmospheric pressure.
- the method of overlaying (molding) on the molded article surface, etc. are mentioned, it is not limited to these.
- a known sheet heating method such as radiation heating by an infrared heater or the like which is noncontact heating can be applied.
- the resin sheet is heated to a surface temperature of 60 ° C. to 310 ° C. for 20 seconds to 480 seconds and then formed into the surface of an existing molded article, and 1.05 to It can be stretched 2.50 times.
- ⁇ Sulfone-based resin composition A resin composition containing 80% by mass or more of one or more selected from the group consisting of polysulfone, polyethersulfone, polyphenylsulfone, and modified products thereof as a sulfone resin composition constituting a sulfone resin film Is preferred.
- the sulfone-based resin is not particularly limited, but polyphenylsulfone having a repeating unit represented by Formula (1) or polyethersulfone having a repeating unit represented by Formula (2) is preferable.
- polyphenylsulfone and / or polyethersulfone can be selected and used.
- the polyphenyl sulfone may be a homopolymer consisting only of the chemical structure of the formula (1), or may contain one or more chemical structures selected from the formulas (2) to (10). good. However, since the higher the ratio of the chemical structure of Formula (1) in the polyphenyl sulfone is, the more excellent in film strength, heat resistance and molding processability, 100 mol% in total of units of Formulas (1) to (10)
- the unit of the formula (1) is preferably 50 mol% or more, more preferably 60 mol% or more, still more preferably 70 mol% or more, and particularly preferably 75 mol% or more. And 80% mol% or more.
- the copolymerization form may be any of a block copolymer, a random copolymer and an alternating copolymer.
- the terminal modified body which has another chemical structure only in the polymer terminal may be sufficient.
- polyphenyl sulfone brand name made from Solvay Specialty Polymers: Radel R series, brand name made by BASF: Ultrazone P series can be mentioned.
- the polyether sulfone may be a homopolymer consisting only of the chemical structure of the formula (2) or may contain one or more chemical structures selected from (1) and (3) to (10). It may be.
- the ratio of the chemical structure of the formula (2) in the polyethersulfone is a formula with respect to 100 mol% in total of the units of the formulas (1) to (10) because the film strength, heat resistance and molding processability are excellent
- the unit of (2) is preferably 50 mol% or more, more preferably 60 mol% or more, still more preferably 70 mol% or more, and particularly preferably 75 mol% or more. It is most preferable that it is% mol% or more.
- the copolymer form is a block copolymer, random It may be either a copolymer or an alternating copolymer.
- the terminal modified body which has another chemical structure only in the polymer terminal may be sufficient.
- polyether sulfone trade name by Sumitomo Chemical Co., Ltd .: Sumika Excel PES series, trade name by BASF Corp .: Ultra Zone E series, and Veradel R series by SOLVAY SPECIALTY POLYMERS.
- thermoplastic engineering plastic In Examples and Comparative Examples, the following were used as the thermoplastic engineering plastic and the release film.
- Polyether ether ketone manufactured by Daicel Evonik, glass transition temperature 140 ° C., melting point 345 ° C.
- Polyphenylene sulfide PPS
- Toray Industries, Ltd. glass transition temperature 90 ° C., melting point 280 ° C.
- Polyether sulfone manufactured by BASF, glass transition temperature 225 ° C., no melting point polyphenylsulfone (PPSU): manufactured by BASF, glass transition temperature 220 ° C., melting point no polysulfone (PSU): manufactured by BASF, glass transition point 187 ° C, no melting point
- the glass transition temperature and melting point of the thermoplastic engineering plastic and the release film are DSC (differential scanning) from room temperature to 370 ° C. at a heating rate of 10 ° C./min in a nitrogen atmosphere using a differential scanning calorimeter “DSC 3100 SA” manufactured by Bruker.
- DSC differential scanning calorimeter
- Example 1 The thermoplastic engineering plastic polyetheretherketone (PEEK) is extruded from a single screw extruder with a diameter of 40 mm, and the temperature of the die is 175 ° C. with respect to the biaxially stretched polyamide film (O-Ny). The temperature, the resin discharge amount, the line speed, and the distance between the die opening and the roll were adjusted, and the temperature of the metal roll was controlled to 90 ° C. to obtain a laminate. The biaxially stretched polyamide film was peeled off from the laminate to prepare an engineering plastic film having a thickness of 50 ⁇ m.
- PEEK thermoplastic engineering plastic polyetheretherketone
- Examples 2 to 12, Comparative Examples 1 to 8, Comparative Example 11, Comparative Examples 13 to 15, Comparative Examples 17 and 18 The type of release film, the type and thickness of the thermoplastic engineering plastic, the temperature at which the extruded molten resin contacts the release film, and the metal roll temperature for cooling the laminate are changed as described in Tables 1 and 3.
- An engineering plastic film was produced in the same manner as in Example 1.
- Example 13 The temperature of the die is extruded so that the thermoplastic engineering plastic polyphenylsulfone (PPSU) is extruded from a single screw extruder with a diameter of 40 mm, and the temperature of contact with the biaxially oriented polyamide film (O-Ny) is 190 ° C.
- the resin discharge amount, the line speed, and the distance between the die opening and the roll were adjusted, and the temperature of the metal roll was controlled to 115 ° C. to obtain a laminate.
- the biaxially stretched polyamide film was peeled off from this laminate to prepare an engineering plastic film having a thickness of 25 ⁇ m.
- Example 14 to 23 Implementation except the type of release film, the type and thickness of thermoplastic engineering plastic, the temperature at which the extruded molten resin contacts the release film, and the metal roll temperature for cooling the laminate as described in Table 2
- An engineering plastic film was produced in the same manner as in Example 1.
- Thickness accuracy (%) ((d max-d min) / d ave) x 100
- Test pieces (long axis 100 mm ⁇ short axis 10 mm) were cut out from the laminate in the production direction, and were obtained from the force at the time of peeling at a peeling angle of 180 degrees using a peeling tester manufactured by Vanguard Systems.
- the peel strength at this time is “excellent” for 10 g or more and less than 100 g / cm, “good” for 3 g or more and less than 10 g or 100 g or more and 1000 g / cm or less, or 0 g or more and less than 3 g / cm or more than 1000 g / cm As "bad".
- ⁇ Surface temperature of metal roll> The surface temperature of the metal roll was measured at three points in the width direction of the metal roll using a contact-type thermometer manufactured by Rika Kogyo Co., Ltd., and the average value was calculated.
- thermoplastic engineering plastic film obtained by peeling a release film from a laminate
- sulfuric acid 20% concentration
- the laminates obtained in Examples 1 to 12 are free from generation of wrinkles and breakage during winding and are excellent in formability (film film forming property), and a thin film obtained by peeling a release film from the laminate.
- the engineering plastic film was a film excellent in thickness accuracy and surface smoothness.
- the thin film engineering plastic films of Examples 6, 10 and 12 satisfy the conditions that the temperature Tx (° C.) of the contact point between the engineering plastic melt and the release film, the metal roll temperature Ty (° C.), and the total thickness most preferably Accuracy and surface smoothness were excellent.
- the laminates obtained in Examples 13 to 23 are free from generation of wrinkles and breakage during winding and are excellent in formability (film film forming property), and a thin film obtained by peeling a release film from the laminate.
- the engineering plastic (sulfone-based resin) film was a film excellent in thickness accuracy and surface smoothness.
- the thin film engineering plastic films of Examples 14 to 17 satisfy the conditions that the temperature Tx (° C.) of the contact point between the engineering plastic melt and the release film, the metal roll temperature Ty (° C.), and the total thickness most preferably.
- the surface smoothness was excellent. Furthermore, they are excellent in hydrolysis resistance, hot water resistance, chemical resistance, electron beam resistance, and gamma ray resistance, and can be applied, for example, in uses for sterilization and sterilization.
- the thin film engineering plastic film of the present invention is a thin film and excellent in thickness accuracy, for example, a film capacitor requiring high accuracy, a speaker diaphragm, a circuit board, a heater insulating material, a glass protective film, for household appliance members, automobile members It can also be applied to applications as a film.
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- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Laminated Bodies (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Le problème décrit par la présente invention concerne un stratifié qui comprend une couche en plastique industriel thermoplastique ayant une épaisseur inférieure ou égale à 250 µm et un procédé de production de ce stratifié ; et la présente invention concerne précisément un film plastique industriel mince qui présente une excellente uniformité d'épaisseur et un excellent lissé de surface. La solution de la présente invention porte sur un film plastique industriel mince ayant une épaisseur inférieure ou égale à 250 µm et une précision d'épaisseur inférieure ou égale à 15 % obtenu par application d'un revêtement par extrusion sur une surface d'un film antiadhésif, qui a une résistance à la rupture supérieure ou égale à 115 MPa et une résistance à l'allongement à la rupture inférieure ou égale à 190 % dans la direction de production, associé à un matériau plastique industriel fondu, et en retirant le film antiadhésif après la formation d'un stratifié.
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KR20200133103A (ko) * | 2019-05-17 | 2020-11-26 | (주) 진양이피에스 | 폴리카보네이트를 포함하는 다층 필름 및 그 제조방법 |
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JP2022164735A (ja) * | 2017-06-22 | 2022-10-27 | デンカ株式会社 | 熱可塑性エンジニアリングプラスチックの層を備えた積層体及びその製造方法 |
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