WO2018225760A1 - Film composite souple et film de circuit souple l'utilisant - Google Patents

Film composite souple et film de circuit souple l'utilisant Download PDF

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Publication number
WO2018225760A1
WO2018225760A1 PCT/JP2018/021648 JP2018021648W WO2018225760A1 WO 2018225760 A1 WO2018225760 A1 WO 2018225760A1 JP 2018021648 W JP2018021648 W JP 2018021648W WO 2018225760 A1 WO2018225760 A1 WO 2018225760A1
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WIPO (PCT)
Prior art keywords
film
flexible
circuit
resin film
flexible circuit
Prior art date
Application number
PCT/JP2018/021648
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English (en)
Japanese (ja)
Inventor
昌範 溝口
Original Assignee
株式会社旭電化研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社旭電化研究所 filed Critical 株式会社旭電化研究所
Priority to CN201880037523.XA priority Critical patent/CN110709239A/zh
Priority to JP2019523930A priority patent/JP7312419B2/ja
Priority to KR1020207000079A priority patent/KR20200016327A/ko
Publication of WO2018225760A1 publication Critical patent/WO2018225760A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention relates to a novel flexible composite film and a flexible circuit film using the same, and more specifically, a functional resin film having various special functions is used as a base material, and the surface thereof is subjected to copper plating.
  • the present invention relates to a flexible composite film in which a flat conductive film is formed, and a novel flexible circuit film obtained by converting the conductive film into a conductor circuit having a predetermined pattern using the flexible composite film as a starting material.
  • a circuit board on which a conductor circuit having a predetermined pattern is formed and various semiconductor elements mounted thereon are incorporated. Then, a predetermined electrical signal is transmitted to the conductor circuit of the circuit board to drive the mounted semiconductor element, thereby exhibiting the overall function of the device.
  • circuit board As a circuit board in that case, a rigid circuit board having a glass / epoxy resin composite plate as a base material and a copper conductor circuit formed on the surface has been used. With the recent expansion and diversification of IT and information technology application fields, various electronic devices and related components to be incorporated into them have been reduced in size and thickness, and high-density mounting of semiconductor elements on circuit boards. And multi-functionality are progressing. Correspondingly, with respect to circuit boards, which are also transmission paths for electrical signals to these devices, the transition from rigid board forms to flexible film forms has begun. Specifically, a flexible copper-clad laminated composite film made by sticking a copper foil to a thin insulating resin film, or a flexibility obtained by processing the copper foil of the composite film into a conductor circuit of a predetermined pattern Circuit films have been developed.
  • an insulating resin film to be used not only is it excellent in electrical insulation, it has heat resistance against the amount of heat generated during actual operation as a circuit film, it is difficult to cause thermal deformation, It is selected considering the mechanical strength that does not damage against external impacts.
  • a polyimide resin (PI) film is mainly used as an insulating resin film as a base material (see Patent Document 1).
  • the dielectric breakdown voltage of PI is as high as about 400 KV / mm, which is excellent in electrical insulation, the linear expansion coefficient is about 15 to 20 ppm / ° C., the amount of thermal deformation is small, and the glass transition temperature. This is because it has a high heat resistance of about 300 ° C., and has a large tensile strength and elastic modulus and excellent mechanical properties.
  • a method of manufacturing the above-described composite film using this PI film as a base material for example, a method of applying a PI varnish to a commercially available copper foil to form a two-layer composite film, a PI film with an epoxy adhesive on the copper foil
  • Methods are known. In this way, a flexible composite film is produced in which a flat copper foil is stuck or laminated on the surface of the PI film.
  • a conductor circuit having a predetermined pattern is formed on the surface of the PI film, and a flexible circuit film is manufactured.
  • the base PI film has excellent heat resistance, for example, a semiconductor element can be directly mounted on the conductor circuit by soldering or wire bonding, or a connection terminal can be formed. Therefore, this flexible circuit film can exhibit a mother board function for driving the device.
  • the flexible circuit film based on this PI film has the following problems.
  • the water absorption rate of PI is about 1.6%, which is higher than that of other insulating resins. Therefore, when this circuit film is used in a hot and humid environment, dimensional change is likely to occur. This can also cause a malfunction of the circuit film.
  • PI also has a dielectric constant of about 3.5 to 4.0 and is not particularly small. PI film polarization may occur depending on the electric field condition applied during use.
  • the flexible composite film which is the starting material has a layer structure in which a commercially available copper foil and a PI film are basically directly bonded as described above. Yes.
  • the surface of the copper foil is roughened in order to improve the adhesion to the film, and usually there are minute irregularities on the order of nm. Therefore, even in the case of a flexible circuit film manufactured using the same as a starting material, the same micro unevenness exists at the interface between the conductor circuit formed by processing the copper foil and the PI film as the base material.
  • PVDF polyvinylidene fluoride resin
  • a pressure sensor that converts a pressure change (change in physical quantity) from the external environment into an electric signal
  • a non-contact temperature sensor that converts a temperature change in the external environment such as a human body into an electric signal
  • the PVDF film is coated with, for example, silver ink on both sides or sputtered to form a flat electrode such as a thin silver coating on both sides, and an input / output terminal is attached to this electrode. It is used by connecting to a power supply via a lead wire.
  • the present invention has been made in view of the above situation, and is a novel flexible composite film in which the surfaces of various functional resin films are plated and the surfaces are covered with a conductive film such as copper.
  • the purpose is to provide.
  • Another object of the present invention is to provide a novel flexible circuit film in which a conductive film made of plating is converted into a conductor circuit having a predetermined pattern using the flexible composite film as a starting material.
  • a flexible composite comprising a functional resin film as a base material and a conductive film made of plating formed on at least one surface of the base material. A film is provided.
  • the functional resin film is Polyetheretherketone resin (PEEK) film, polyvinylidene fluoride resin (PVDF) film, perfluoroalkoxy fluororesin (PFA) film, cycloolefin polymer resin (COP) film, polytetrafluoroethylene (PTFE) film, polyethylene terephthalate (PET) ) It is preferable to use a film, a thermoplastic elastomer (TPE) film, a transparent functional resin film, or a composite resin film containing a magnetic material.
  • PEEK Polyetheretherketone resin
  • PVDF polyvinylidene fluoride resin
  • PFA perfluoroalkoxy fluororesin
  • COP cycloolefin polymer resin
  • PTFE polytetrafluoroethylene
  • PET polyethylene terephthalate
  • a flexible circuit film characterized in that a conductor circuit having a predetermined pattern formed by processing the conductive film of the flexible composite film.
  • the flexible circuit film in which the conductor circuit is formed on the flexible composite film based on a polyether ether ketone resin film or a polyethylene terephthalate film is provided on a diaphragm of an acoustic device. It is suitable for use.
  • the flexible circuit film in which the conductor circuit is formed on the flexible composite film based on a perfluoroalkoxy fluorine resin film or a cycloolefin polymer resin film is a flexible circuit board for high-speed transmission and a flexible antenna cable. It is suitable for use by being incorporated into a circuit board or a flexible circuit board for semiconductors.
  • the flexible circuit film in which the conductor circuit is formed on the flexible composite film having a polyvinylidene fluoride resin film as a base material is suitable for use as an actuator.
  • the flexible circuit film in which the conductive circuit is formed on the flexible composite film having the transparent functional resin film as a base material is suitable for use on a transparent body.
  • a transparent body it is suitable for being incorporated into a contact lens or a spectacle lens.
  • the conductive coating or conductor circuit formed on the surface functions as a transmission path of an electric signal, and at the same time, a predetermined substrate which is a base material by the electric signal.
  • the functional resin film can exhibit a special function imparted to itself.
  • changes in physical quantities from the external environment for example, volume changes, pressure changes, temperature changes, etc.
  • the functional resin film as the base material and converted into electrical signals, and the electrical signals are converted into conductive films or conductors.
  • a circuit can be transmitted to the sensing system.
  • a functional resin film having a piezoelectric function as a base material, it is possible to perform mutual conversion between volume and electrical signal, mutual conversion between pressure and electrical signal, and mutual conversion between temperature and electrical signal. , Pressure sensors, non-contact temperature sensors, and the like.
  • a functional resin film having a low dielectric constant or dielectric loss tangent is used as the base material, high frequency characteristics can be improved, and if a functional resin film having excellent surface smoothness is used, a minute amount at the interface between the conductive film and the conductor circuit can be obtained. Concavities and convexities are reduced, and signal loss can be reduced even when a high-frequency signal is transmitted.
  • a functional resin film having high heat resistance and low water absorption is used as a base material, it is suitable for applications in which, for example, dimensional change hardly occurs and high dimensional accuracy is required.
  • a transparent functional resin film having a circuit formed thereon for example, by laminating it on the transparent body, various electrical signals can be exchanged while maintaining the transparency of the transparent body.
  • FIG. 2 is a cross-sectional view taken along the line II-II in FIG. It is sectional drawing which shows example B of the flexible circuit film of this invention.
  • FIG. 4 is a sectional view taken along line IV-IV in FIG. 3.
  • film A a flexible composite film
  • film B a flexible circuit film
  • FIG. 1 is a perspective view showing an example of the film A
  • FIG. 2 is a cross-sectional view taken along II-II in FIG.
  • the film A is an integral structure composite film composed of a functional resin film 1 as a base material and a flat conductive film 2 covering the surface thereof.
  • the conductive coating 2 is a copper plating coating formed by applying a copper plating method.
  • FIG. 3 is a perspective view showing an example of the film B, and FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG.
  • This film B is an integrated circuit film composed of the same functional resin film 1 as the film A and a conductor circuit 3 having a predetermined pattern formed on the surface thereof.
  • the conductor circuit 3 is formed by applying, for example, photolithography and etching techniques to the conductive coating (copper plating coating) 2 of the film A.
  • the film-forming location of the copper plating film 2 is not limited to this, A function The both surfaces of the conductive resin film 1 may be sufficient.
  • the copper plating film 2 it is not limited to the aspect which coat
  • the functional resin film 1 will be described. Although it does not specifically limit as the functional resin film 1, Basically, it selects from the viewpoint of what kind of function the film A and the film B to manufacture are made to exhibit suitably.
  • the PEEK film has a linear expansion coefficient that is about twice as large as that of the above-described PI film, and has a low tensile strength, but has a glass transition temperature higher than that of the PI film and excellent in heat resistance. And the water absorption rate is small, and it is difficult to cause dimensional change even in a high temperature and high humidity environment.
  • Film A and Film B manufactured using PEEK film as a base material are suitable for use as an electric circuit that is directly attached to the surface of a diaphragm of an acoustic device such as a sound collecting microphone or speaker. It has characteristics. For example, in a speaker of an audio device, conventionally, since a current is passed through a voice coil that vibrates a diaphragm, it is necessary to wire a lead wire, and a wiring space is required, and a breakage or the like is caused at a connection portion of the lead wire due to vibration. There is also a risk.
  • the conductor circuit 3 is formed on the functional resin film 1 itself, the wiring space can be made extremely small by directly attaching the conductor circuit 3 to the diaphragm. Since it vibrates with it, the possibility of disconnection at the wiring connection portion is reduced and the durability is excellent.
  • a PET film has high heat resistance and hardly undergoes a dimensional change, it is suitable to be used by being attached to a diaphragm like the PEEK film.
  • the film A and the film B manufactured using the PVDF film as a base material can be used as various actuators using a piezoelectric function.
  • the film A and the film B manufactured using the PVDF film as a base material can be used as various actuators using a piezoelectric function.
  • it can also be used for a diaphragm of an acoustic device such as a sound collecting microphone or a speaker that converts a volume (air vibration) into an electric signal by using a piezoelectric function.
  • the PFA film is the same fluorine type as the PVDF film, but the main difference between the PFA film and the PVDF film is that the former has a smaller dielectric constant and dielectric loss tangent than the latter. Therefore, Film A and Film B manufactured using this PFA film as a base material are excellent in high frequency characteristics, and are suitable for devices that transmit high frequency signals, for example, as a flexible circuit board for high-speed transmission and a flexible circuit board for antenna cables. is there.
  • the COP film is inferior in tensile strength and heat resistance to the PI film, but the water absorption and dielectric loss tangent are almost the same as the PFA film described above and small. Moreover, this film is excellent in surface smoothness, and has a large total light transmittance and excellent transparency. For this reason, the film A and the film B manufactured using the COP film as a base material have excellent high frequency characteristics and a small signal loss at the time of transmitting a high frequency signal. It can be incorporated as a flexible circuit board for transmission and a flexible circuit board for antenna cables. Since it is difficult to cause a dimensional change, it can be used for a flexible circuit board for a semiconductor that requires high dimensional accuracy.
  • the transparent functional resin film having a predetermined transparency on which the conductor circuit 3 is formed includes various transparent bodies, for example, windshields, rear glasses, window glasses of vehicles such as automobiles, By providing it on transparent covers of instruments, window glass of buildings, etc., it is possible to exchange various electric signals while maintaining the characteristics of transparent bodies.
  • a film B on which a conductive circuit 3 is formed using a transparent PFA film or COP film having excellent high-frequency characteristics as a base material it is simply pasted to various types of transparent glass to obtain a predetermined transparent
  • the wireless communication between the conductor circuit 3 (such as a circuit for wireless communication connected to a temperature sensor or the like for detecting temperature) and various control devices that transmit and receive the information can be enabled.
  • a transparent functional resin film it is preferable that it is a thing more than the transparency of the said transparent body so that the transparency of the transparent body of the attachment object attached by lamination
  • the transparent functional resin film can be provided on a transparent body such as a contact lens or a spectacle lens.
  • a thin wireless chip, blood glucose sensor, antenna circuit, and LED light are sandwiched between the two films that make up the soft contact lens material, and the glucose component of tears is sensed to detect changes in blood glucose levels externally.
  • the wireless chip, the blood glucose level sensor, the antenna circuit, etc. need to be sandwiched between two films as thin as possible in order to reduce the discomfort of the wearer. Since the extremely thin conductor circuit 3 is integrally formed by plating, it is suitable for forming these thin sensors and circuits.
  • a contact lens can be photographed by incorporating a micro camera, an image sensor, a wireless communication circuit, a pressure sensor, etc. and blinking.
  • Such an electric circuit and sensor circuit can also be formed thinly and integrally by plating according to the film B of the present embodiment, which is suitable for these applications.
  • various sensors, wireless communication circuits, and the like are also incorporated into glasses (including sunglasses, goggles, etc.) to take out electrical signals and capture peripheral information, acquire wearer's biological information, and the like.
  • Technology is also known.
  • the film B having the conductor circuit 3 formed by plating according to the present embodiment can be suitably used.
  • the transparent functional resin film constituting the film B has transparency that does not impair the transparency of the contact lens or the spectacle lens itself. What you have is used.
  • the transparent functional resin film used for the above-mentioned various transparent bodies especially transparent bodies that require high transparency such as contact lenses and eyeglass lenses, those having a total light transmittance of 80% or more are preferable. Those having a light transmittance of 85% or more are more preferred, and those having a total light transmittance of 90% or more are more preferred.
  • a PI film and a COP film are suitable.
  • the production of the film A and the film B will be sequentially described.
  • copper plating is applied to the surface of the functional resin film 1 as a base material.
  • physical surface roughening treatment performed by general resin plating is not performed. Therefore, in this embodiment, micro unevenness
  • the skin effect of the conductor circuit 3 is suppressed, There is an effect that the signal loss is reduced.
  • the surface of the functional resin film 1 is given conductivity by electroless copper plating or electroless nickel plating, and then electrolytic copper plating or electroless copper plating is performed thereon to form a copper plating film. 2 is formed.
  • the copper plating film 2 may be formed only by the first electroless copper plating.
  • the surface of the functional resin film 1 may be modified before the copper plating.
  • the functional resin film 1 PEEK film, PVDF film, PET film, PFA film, COP film, etc.
  • it is suitable by combining a plurality of types of ultraviolet irradiation treatment, plasma treatment, and chemical treatment.
  • the surface can be modified.
  • the film thickness of the copper plating film 2 to be formed can be adjusted by adjusting the plating time.
  • the film A in which the surface of the functional resin film (base material) 1 is coated with the flat copper plating film 2 having a desired film thickness is manufactured.
  • film B is produced using this film A as a starting material. Specifically, after a predetermined circuit pattern is printed on the surface of the copper plating film 2 of the film A using a photoresist, the resist pattern is photocured, and then the photoresist is not printed using an etching solution. The portion of the copper plating film 2 may be removed by etching.
  • the copper plating film 2 of the film A is converted into a conductor circuit 3 having a predetermined pattern, and the copper conductor circuit 3 is formed on the surface of the functional resin film 1 as shown in FIGS. Film B is manufactured
  • the film thickness of the copper plating film 2 in the film A is set to be extremely thin (for example, 2 to 5 ⁇ m)
  • the width and height of the conductor circuit 3 formed on the film B can be refined. Therefore, the film B can be made into a circuit film having a fine circuit pattern.
  • the copper plating film 2 is merely an example. Of course, other metal plating films such as nickel plating, gold plating, and silver plating can be used instead of the copper plating film 2 depending on the application. is there.
  • the functional resin film serving as the base material polytetrafluoroethylene (PTFE), a urethane-based thermoplastic elastomer film, a composite resin film containing a magnetic material, or the like can also be used.
  • PTFE polytetrafluoroethylene
  • a composite resin film containing a magnetic material is excellent in electromagnetic wave shielding properties and is therefore suitable for forming a circuit for high-frequency high-speed transmission. Moreover, it is suitable for weight reduction compared with the conventional electromagnetic wave shielding material.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un nouveau film composite souple et un film de circuit souple qui utilise celui-ci comme matériau de départ. Le film composite flexible est formé par placage au cuivre d'une surface supérieure d'un film de résine fonctionnelle (1) auquel une fonction spéciale a été ajoutée, pour former sur celui-ci un film de placage au cuivre (2). Le film de circuit souple a formé sur celui-ci un circuit conducteur formé par traitement du film de placage au cuivre (2). Le film composite souple et le film de circuit souple fonctionnent non seulement tous deux comme des éléments conducteurs, mais présentent également simultanément la fonction spéciale qui est conférée au film de résine fonctionnelle (1).
PCT/JP2018/021648 2017-06-07 2018-06-06 Film composite souple et film de circuit souple l'utilisant WO2018225760A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201880037523.XA CN110709239A (zh) 2017-06-07 2018-06-06 可挠性复合膜、利用其的可挠性电路膜
JP2019523930A JP7312419B2 (ja) 2017-06-07 2018-06-06 可撓性回路フィルムの製造方法
KR1020207000079A KR20200016327A (ko) 2017-06-07 2018-06-06 가요성 복합 필름, 그것을 이용한 가요성 회로 필름

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-113035 2017-06-07
JP2017113035 2017-06-07

Publications (1)

Publication Number Publication Date
WO2018225760A1 true WO2018225760A1 (fr) 2018-12-13

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PCT/JP2018/021648 WO2018225760A1 (fr) 2017-06-07 2018-06-06 Film composite souple et film de circuit souple l'utilisant

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JP (1) JP7312419B2 (fr)
KR (1) KR20200016327A (fr)
CN (1) CN110709239A (fr)
WO (1) WO2018225760A1 (fr)

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