JP6603554B2 - 導電性フィルム - Google Patents
導電性フィルム Download PDFInfo
- Publication number
- JP6603554B2 JP6603554B2 JP2015222972A JP2015222972A JP6603554B2 JP 6603554 B2 JP6603554 B2 JP 6603554B2 JP 2015222972 A JP2015222972 A JP 2015222972A JP 2015222972 A JP2015222972 A JP 2015222972A JP 6603554 B2 JP6603554 B2 JP 6603554B2
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- JP
- Japan
- Prior art keywords
- conductive
- film
- layer
- material layer
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C08J2400/26—Elastomers
-
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Description
図1ないし図3に示すように、本発明を実施した導電性フィルム10は、メッシュ状に形成されており、網目としての開口が面状(二次元)に複数並んでいる。導電性フィルム10は、フィルム基材11と、導電材料層12とを備える。導電材料層12は、フィルム基材11の一方のフィルム基材面(以下、第1基材面と称する)11aに層状に設けられて一方のフィルム面を成し、導電材料で形成された部材である。なお、図1には、導電性フィルム10の導電材料層12側を図示しており、図2,図3では、フィルム基材11の厚みに対して導電材料層12の厚みを誇張して描いてある。導電性フィルム10を貼り付け対象物に対して貼り付ける場合には、フィルム基材11が貼り付け対象物に接し、導電材料層12が外側に露呈するように、導電性フィルム10を配する。なお、導電性フィルム10の厚みは、フィルム基材11の厚みT11と導電材料層12の厚みT12との和であり、図2及び図3においては符号T10を付す。
図17Aに示す導電性フィルム70は、フィルム基材71と、導電材料層80とを備える。導電材料層80は、フィルム基材71の第1基材面a上に、層状に重ねて設けられている。この導電性フィルム70にも導電性フィルム10と同様に、フィルム基材71と導電材料層80とを、厚み方向に貫通する貫通孔75(図17B参照)が形成されているが、図17Aにおいては貫通孔75の図示を略してある。なお、図17Aは、導電性フィルム70を模式的に示すものであり、各フィルム面を便宜的に平坦に描いてある。
図18を参照しながら、第3実施形態である導電性フィルム90について説明する。なお、図18においては、図1に示す部材と同じものには、図1と同じ符号を付し、説明を略す。また、図の煩雑化を避けるため、貫通孔13については図示を略してある。導電性フィルム90は、フィルム基材11と、導電材料層12と、ゲル層91とを備える。ゲル層91はフィルム基材11の第2基材面11bに配されている。ゲル層91は、第2基材面11bに形成されている基材開口部11c(図示無し)を閉塞するように第2基材面11bを覆っている。
11,71 フィルム基材
12,80 導電材料層
13,75 貫通孔
16 隔壁
21a,21b,21c,・・・ 層開口部
91 ゲル層
96 エラストマー層
Claims (11)
- フィルム基材と前記フィルム基材の一方のフィルム基材面に配された導電材料層とを備え、前記フィルム基材及び前記導電材料層を厚み方向に貫通した複数の貫通孔が形成されている導電性フィルムであって、
前記導電材料層は、互いに隣り合う開口部の各間に導電部を有し、前記導電部の個数が1mm2当たり少なくとも400個であり、前記導電材料層の開口率が少なくとも40%であり、
前記フィルム基材は疎水性ポリマーを含み、
前記疎水性ポリマーは、ポリブタジエン、ポリイソプレン、ポリジメチルシロキサン誘導体、またはポリイソブチレンのいずれかを含む導電性フィルム。 - フィルム基材と前記フィルム基材の一方のフィルム基材面に配された導電材料層とを備え、前記フィルム基材及び前記導電材料層を厚み方向に貫通した複数の貫通孔が形成されている導電性フィルムであって、
前記導電材料層は、互いに隣り合う開口部の各間に導電部を有し、前記導電部の個数が1mm2当たり少なくとも400個であり、前記導電材料層の開口率が少なくとも40%であり、
前記フィルム基材の他方のフィルム基材面に、ゲル層またはエラストマー層を備える導電性フィルム。 - 前記フィルム基材は疎水性ポリマーを含む請求項2に記載の導電性フィルム。
- 前記疎水性ポリマーは、ポリブタジエン、ポリイソプレン、ポリジメチルシロキサン誘導体、またはポリイソブチレンのいずれかを含む請求項3に記載の導電性フィルム。
- 前記フィルム基材の厚みが0.2μm以上20μm以下の範囲内である請求項1ないし4のいずれか1項に記載の導電性フィルム。
- 前記複数の貫通孔は、前記一方のフィルム基材面に沿って規則的に配列されている請求項1ないし5のいずれか1項に記載の導電性フィルム。
- 前記フィルム基材は、前記一方のフィルム基材面の垂直方向からみたときにハニカム状の構造とされている請求項6に記載の導電性フィルム。
- 隣り合う前記貫通孔の間の隔壁は、前記フィルム基材の厚み方向における中央に向かって厚みが漸減している請求項7に記載の導電性フィルム。
- 前記隔壁は前記フィルム基材の厚み方向における中央に隔壁開口部を有する請求項8に記載の導電性フィルム。
- 前記導電材料層は金で形成されており、前記導電材料層の厚みが10nm以上50nm以下の範囲内である請求項1ないし9のいずれか1項に記載の導電性フィルム。
- 前記導電材料層は、スパッタリング法により形成された部材である請求項1ないし10のいずれか1項に記載の導電性フィルム。
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