WO2018223937A1 - 一体式散热片、制造模具及其制造方法 - Google Patents

一体式散热片、制造模具及其制造方法 Download PDF

Info

Publication number
WO2018223937A1
WO2018223937A1 PCT/CN2018/089856 CN2018089856W WO2018223937A1 WO 2018223937 A1 WO2018223937 A1 WO 2018223937A1 CN 2018089856 W CN2018089856 W CN 2018089856W WO 2018223937 A1 WO2018223937 A1 WO 2018223937A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
heat
groove
integrated
soft
Prior art date
Application number
PCT/CN2018/089856
Other languages
English (en)
French (fr)
Inventor
谢佑楠
Original Assignee
深圳市鸿富诚屏蔽材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市鸿富诚屏蔽材料有限公司 filed Critical 深圳市鸿富诚屏蔽材料有限公司
Publication of WO2018223937A1 publication Critical patent/WO2018223937A1/zh

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22Component parts, details or accessories; Auxiliary operations
    • B29C39/26Moulds or cores

Definitions

  • the invention relates to the technical field of heat dissipation products, in particular to an integrated heat sink, a manufacturing mold and a manufacturing method thereof.
  • a soft thermal pad is disposed between the bottom of the heat dissipating substrate of the heat sink and the heat source device, and the soft thermal pad is added.
  • the cut soft thermal pad is manually attached to the bottom of the heat dissipating substrate of the heat sink, and then sealed with a protective film so as not to damage the soft thermal pad during storage and transportation.
  • the manual application of the soft thermal pad has the following problems: the fit is not strong enough, the production efficiency is low, and the manual bonding causes the soft thermal pad to have a contact gap with the bottom surface of the heat sink substrate of the heat sink, despite the gap. Tiny, unobservable to the naked eye, but to a certain extent affects heat transfer, because the transmission path is "broken" and the thermal resistance increases.
  • the invention provides an integrated heat sink, a manufacturing mold and a manufacturing method thereof to solve the above problems.
  • An integrated heat sink includes: a heat sink body having a heat dissipating fin and a heat dissipating substrate, wherein the bottom surface of the heat dissipating substrate is integrally formed with a soft thermal pad by a thermosetting method.
  • the soft thermal pad is made of thermally conductive silicone, thermal grease or thermal gel.
  • the heat dissipation substrate is made of a heat conductive resin or a heat resistant plastic.
  • the invention also provides a manufacturing mold for the integrated heat sink, comprising a mold having a receiving groove, wherein the receiving groove is provided with a separating plate, and the separating plate divides the receiving groove into a plurality of vertical and horizontal arranged for holding the liquid.
  • a separator that is in the state of a soft thermal pad material and that matches the contour of the heat sink substrate of the integrated heat sink.
  • the top opening of the separation groove is provided with a step groove having a diameter larger than the diameter of the separation groove and accommodating the fixed heat dissipation substrate.
  • the height of the stepped groove or the inclined groove is smaller than the thickness of the heat dissipation substrate.
  • the invention also provides a method for manufacturing an integrated heat sink, comprising the following steps:
  • the mold cavity is heated to form a soft thermal pad and the liquid crystal pad is integrally molded and solidified on the bottom of the heat dissipation substrate of the heat sink body.
  • the invention adopts a structure in which the soft thermal pad and the heat sink body are integrally formed, the manual bonding process is omitted, the production efficiency can be greatly improved, and the soft thermal pad and the heat dissipation are in terms of the product itself.
  • the body of the film is more tightly integrated, the heat conductive pad is not easily separated from the heat sink body, and the heat transfer path has no gap, which reduces the thermal resistance and improves the heat dissipation efficiency.
  • FIG. 1 is a front view showing the structure of a heat sink according to an embodiment of the present invention.
  • FIG. 2 is a schematic top plan view showing a manufacturing mold in an embodiment of the present invention.
  • FIG. 3 is a side cross-sectional view showing a stepped groove provided in a single dividing groove in an embodiment of the present invention
  • Figure 4 is a side cross-sectional view showing a bevel groove provided in a single dividing groove of the present embodiment.
  • the embodiment of the present invention provides an integrated heat sink.
  • the heat sink body 1 includes a heat sink fin 11 and a heat sink substrate 12 .
  • Thermal pad 2 2.
  • the flexible thermal pad is made of a thermally conductive silicone.
  • a thermal grease or a thermal conductive gel may be used.
  • the heat dissipation substrate may be made of a heat conductive resin or a heat resistant plastic.
  • the soft thermal conductive pad is integrally formed by thermosetting, so that after the heat sink is finished, the integrated soft thermal pad is provided, and only the heat source is needed at a later stage. It can be installed and used on the device. Compared with some heat sink products, the soft thermal pad is attached when installing, or the soft thermal adhesive is applied during installation. It has the characteristics of quick installation and higher bonding degree.
  • the raw material of the liquid state for forming the soft thermal pad is first poured into the mold cavity, that is, the thermal conductive silica gel is poured, and the thermal conductive silica gel is in a fluid state at normal temperature.
  • the depth of the thermal silica gel poured into the mold slot is determined by the thickness of the desired thermal thermal pad.
  • the formed heat sink body is placed on the liquid cushion to make the bottom surface of the heat sink substrate of the heat sink body adhere to the liquid cushion.
  • the mold slot can accommodate a plurality of heat sink bodies, so the heat sink body is a rule. It is arranged on the liquid cushion in the mold tank to realize mass production.
  • the mold is placed in a heating device to heat, and the mold cavity is heated to form a soft thermal pad and the liquid crystal pad is integrally molded and solidified on the bottom of the heat sink substrate of the heat sink body.
  • the heat sink body has been solidified with the soft thermal pad in the mold slot, and the entire soft thermal pad and the heat sink body thereon are taken out from the mold slot, and then the excess soft thermal pad is cut along the periphery of the heat sink to form
  • the complete and neat heat sink finished product, the step of cutting off the excess soft thermal pad can also be entered through a unified product size and handed over to the automated equipment for removal. After the heat sink is finished, you can choose to attach a protective film to the bottom of the heat sink.
  • the embodiment further provides a manufacturing mold for the integrated heat sink, as shown in FIG. 2 and FIG. 3, including a mold 3 having a receiving groove, which is accommodated in the groove.
  • a partitioning plate 31 is provided.
  • the partitioning plate 31 divides the accommodating groove into a plurality of vertical and horizontal partitioning grooves 32 for holding the fluid state soft thermal pad material and matching the heat dissipating substrate contour of the integrated heat sink.
  • the mold can be integrally formed by casting, stamping, etc., and is easy to process and produce, and in a mold, a large number of heat sinks can be solidified and processed by a large number of heat sinks, which has high production efficiency and saves labor cost.
  • a stepped groove 33 having a larger diameter than the diameter of the partitioning groove and accommodating the fixed heat dissipation substrate is disposed, and the inner wall of the partitioning groove forms a hole at the opening from bottom to top.
  • the step protruding toward the outside is called a step groove.
  • the diameter of the partition groove is slightly smaller than the profile width of the heat dissipation substrate of the heat sink, and the heat dissipation substrate of the heat sink can be accommodated and fixed in the step groove, and the heat dissipation The substrate does not sink into the separation groove, thereby avoiding the overflow of the liquid in the separation groove, which causes waste of raw materials, and can also facilitate the removal of the heat dissipation substrate and the soft thermal pad of the heat sink from the separation groove.
  • a bevel groove 34 having a diameter larger than the diameter of the partition groove and accommodating the fixed heat dissipation substrate is provided at the top opening of the partition groove 32.
  • the inner wall of the partition groove is inclined outwardly at the opening from bottom to top.
  • the inclined surface is called a bevel groove.
  • the inclined groove has the same effect as the step groove.
  • the heat sink can automatically fall on the correct position above the separation groove as long as it contacts the inclined surface. It helps the operator to quickly place the heat sink and improve production efficiency.
  • the height of the stepped groove or the inclined groove should not be greater than the thickness of the heat dissipation substrate, that is, the height of the stepped groove or the inclined groove is smaller or slightly smaller than the thickness of the heat dissipation substrate, so that the operator can smoothly and quickly take out the heat sink, even if there is a liquid liquid overflow liquid does not overflow. To the upper surface of the heat dissipation substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一体式散热片、制造模具及其制造方法,一体式散热片包括:具有散热鳍片(11)和散热基板(12)的散热片本体(1),散热基板(12)底部平面采用热固方式一体成型地固化有软质导热垫(2)。该一体式散热片采用软质导热垫(2)与散热片本体(1)一体成型的结构,省去人工贴合的工序,可大幅提升生产效率,软质导热垫(2)与散热片本体(1)结合更紧密,导热垫(2)不轻易脱离散热片本体(1),热量传输路径无间隙,减小了热阻,提升了散热效率。

Description

一体式散热片、制造模具及其制造方法 技术领域
本发明涉及散热产品技术领域,具体涉及一体式散热片、制造模具及其制造方法。
背景技术
现有散热片在使用时为了与热源紧密接触以到达热量传导效率高的效果,会在散热片的散热基板底部与热源器件之间设置一个软质导热垫,这种软质导热垫的增设,一般是将裁切好的软质导热垫以人工方式贴合在散热片的散热基板底部,然后用保护膜封闭以便于存储运输中不损坏该软质导热垫。事实上,以人工方式贴合软质导热垫会存在以下问题:贴合度不够牢固,生产效率较低,人工贴合使得软质导热垫与散热片的散热基板底部表面存在接触缝隙,尽管缝隙微小,肉眼无法观察,但在一定程度上会影响热量传输,因为该传输路径是存在“断裂”,热阻增加。
发明内容
本发明提供一种一体式散热片、制造模具及其制造方法,以解决上述问题。
本发明实施例提供的一种一体式散热片,包括:具有散热鳍片和散热基板的散热片本体,散热基板底部平面采用热固方式一体成型地固化有软质导热垫。
优选地,所述软质导热垫采用导热硅胶、导热硅脂或导热凝胶。
优选地,散热基板采用导热树脂或耐热塑料。
本发明还提供了一种一体式散热片的制造模具,包括具有容置槽的模具,容置槽内设有隔离板,隔离板将容置槽分隔成多个纵横排列的用于盛放流质状态软质导热垫原料且与一体式散热片的散热基板轮廓匹配的分隔槽。
优选地,分隔槽的顶部开口处设有口径大于分隔槽口径的、且用于容置固定散热基板的台阶槽。
优选地,台阶槽或斜面槽的高度小于散热基板的厚度。
本发明还提供了一种一体式散热片的制造方法,包括如下步骤:
在模具槽中倒入用于形成软质导热垫的流质状态的原料;
将软质导热垫的流质状态的原料刮涂成设定厚度的流质软垫;
将成型的散热片本体摆放在流质软垫上使散热片本体的散热基板底部表面 贴合该流质软垫;
加热模具槽使流质软垫形成软质导热垫且一体成型地固化在散热片本体的散热基板底部。
上述技术方案可以看出,由于本发明采用软质导热垫与散热片本体一体成型的结构,省去人工贴合的工序,可大幅提升生产效率,就产品本身而言,软质导热垫与散热片本体结合更紧密,导热垫不轻易脱离散热片本体,热量传输路径无间隙,减小了热阻,提升了散热效率。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图。
图1是本发明实施例中散热片的主视结构示意图;
图2是本发明实施例中制造模具的俯视结构示意图;
图3是本发明实施例中单个分隔槽上设有台阶槽的侧视剖面示意图;
图4是本发名字实施例单个分隔槽上设有斜面槽的侧视剖面示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
实施例:
本发明实施例提供一种一体式散热片,如图1所示,包括:具有散热鳍片11和散热基板12的散热片本体1,散热基板12底部平面采用热固方式一体成型地固化有软质导热垫2。
本实施例中软质导热垫采用导热硅胶,当然在其他实施例中采用导热硅脂或导热凝胶亦可。
为了使软质导热垫与散热片本体结合更加稳固,散热基板可以采用导热树脂或耐热塑料。
本实施例是在散热片产品完成后即以热固方式一体成型地固化上软质导热垫,从而在散热片成品完成后即带有了一体成型的软质导热垫,后期只需要直接在热源装置上安装使用即可,相比起有些散热片产品是在使用安装时再贴合软质导热垫、或者安装时在涂抹软质导热胶的方式,具有安装快,结合度更高的特点。
在制作过程中,首先在模具槽中倒入用于形成软质导热垫的流质状态的原料,即倒入导热硅胶,该导热硅胶常温下为流质状态。根据所需的软质导热垫的厚度决定倒入模具槽中导热硅胶的深度。
为了保证成型后的散热片与软质导热垫的结合更紧密,需要在模具槽中将软质导热垫的流质状态的原料(即导热硅胶)刮涂成设定厚度的流质软垫(即流质硅胶垫),此时该流质软垫的上表面会较为平滑。
然后,将成型的散热片本体摆放在流质软垫上使散热片本体的散热基板底部表面贴合该流质软垫,本实施例中模具槽能够容纳多数个散热片本体,因此散热片本体是规则的排列在模具槽内的流质软垫上,实现大批量的生产。
在摆放好散热片本体后,将模具放入到加热设备中加热,加热模具槽使流质软垫形成软质导热垫且一体成型地固化在散热片本体的散热基板底部,此时模具中的散热片本体已经与该模具槽内软质导热垫固化,从模具槽中取出整块软质导热垫及其上的散热片本体,然后沿着散热片周缘切除多余的软质导热垫,从而形成完整的、整齐的散热片成品,对于切除多余软质导热垫的步骤,也可以通过统一的产品尺寸录入,交给自动化设备切除。在散热片成品完成后,可以选择在散热片成品的底部贴上保护膜。
针对本实施例中的散热片成品的制作,本实施例还提供了一种一体式散热片的制造模具,如图2及图3所示,包括具有容置槽的模具3,容置槽内设有隔离板31,隔离板31将容置槽分隔成多个纵横排列的用于盛放流质状态软质导热垫原料且与一体式散热片的散热基板轮廓匹配的分隔槽32。本实施例中模具可以采用浇铸、冲压等方式一体成型的完成,易于加工生产,而且在一个模具中可以大批量地对大量散热片进行软质导热垫固化加工,生产效率高,节省人力成本。
如图3所示,本实施例中分隔槽32的顶部开口处设有口径大于分隔槽口径的、且用于容置固定散热基板的台阶槽33,分隔槽内壁由下至上在开口处形成一个向外侧突出的台阶,故而称为台阶槽,因此,可以理解的是,分隔槽的口径略微小于散热片的散热基板轮廓宽度,散热片的散热基板可以容置固定在该台阶槽内,而散热基板刚好不会沉入分隔槽内,进而避免分隔槽内的流质夜溢出,造成原料浪费,而且还能够便于散热片的散热基板与软质导热垫固化后顺利从分隔槽中取出。
如图4所示,是分隔槽32的顶部开口处设有口径大于分隔槽口径的、且用于容置固定散热基板的斜面槽34,分隔槽内壁由下至上在开口处形成一个向外侧倾斜的斜面,故而称为斜面槽,斜面槽具有与台阶槽同样的效果,而且由于斜面结构加上自重力的原因,散热片只要接触到斜面就能够自动落在分隔槽的上方正确位置上,更有利于操作人员快速摆放散热片,提高生产效率。
台阶槽或斜面槽的高度均不宜大于散热基板的厚度,即台阶槽或斜面槽的高度小于或略微小于散热基板的厚度,便于操作人员顺利快速取出散热片,即便存在流质液溢出液不会溢出到散热基板的上表面。
以上对本发明实施例所提供的一种一体式散热片及其制造方法进行了详细介绍,本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的核心思想;同时,对于本领域的一般技术人员,依据本发明的思想和方法,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本发明的限制。

Claims (7)

  1. 一体式散热片,其特征在于,包括:具有散热鳍片和散热基板的散热片本体,散热基板底部平面采用热固方式一体成型地固化有软质导热垫。
  2. 如权利要求1所述的一体式散热片,其特征在于,所述软质导热垫采用导热硅胶、导热硅脂或导热凝胶。
  3. 如权利要求1或2所述的一体式散热片,其特征在于,散热基板采用导热树脂或耐热塑料。
  4. 一体式散热片的制造模具,其特征在于,包括具有容置槽的模具,容置槽内设有隔离板,隔离板将容置槽分隔成多个纵横排列的用于盛放流质状态软质导热垫原料且与一体式散热片的散热基板轮廓匹配的分隔槽。
  5. 如权利要求4所述的一体式散热片的制造模具,其特征在于,分隔槽的顶部开口处设有口径大于分隔槽口径的、且用于容置固定散热基板的台阶槽或斜面槽。
  6. 如权利要求5所述的一体式散热片的制造模具,其特征在于,台阶槽或斜面槽的高度小于散热基板的厚度。
  7. 一体式散热片制造方法,其特征在于,包括如下步骤:
    在模具槽中倒入用于形成软质导热垫的流质状态的原料;
    将软质导热垫的流质状态的原料刮涂成设定厚度的流质软垫;
    将成型的散热片本体摆放在流质软垫上使散热片本体的散热基板底部表面贴合该流质软垫;
    加热模具槽使流质软垫形成软质导热垫且一体成型地固化在散热片本体的散热基板底部。
PCT/CN2018/089856 2017-06-05 2018-06-05 一体式散热片、制造模具及其制造方法 WO2018223937A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710414378.XA CN107167020B (zh) 2017-06-05 2017-06-05 一体式散热片的制造模具及制造方法
CN201710414378.X 2017-06-05

Publications (1)

Publication Number Publication Date
WO2018223937A1 true WO2018223937A1 (zh) 2018-12-13

Family

ID=59825654

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/089856 WO2018223937A1 (zh) 2017-06-05 2018-06-05 一体式散热片、制造模具及其制造方法

Country Status (2)

Country Link
CN (1) CN107167020B (zh)
WO (1) WO2018223937A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107278092B (zh) * 2017-06-05 2023-08-29 深圳市鸿富诚新材料股份有限公司 散热片及其制造方法
CN107167020B (zh) * 2017-06-05 2023-08-11 深圳市鸿富诚新材料股份有限公司 一体式散热片的制造模具及制造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01110914A (ja) * 1987-10-26 1989-04-27 Nishikawa Kasei Kk クッション材の製造方法
CN103369907A (zh) * 2012-03-26 2013-10-23 鸿富锦精密工业(深圳)有限公司 散热模组及其使用方法
CN103620752A (zh) * 2012-03-07 2014-03-05 东和株式会社 树脂封装电子元件的制造方法及树脂封装电子元件的制造装置
CN107036482A (zh) * 2017-06-05 2017-08-11 深圳市鸿富诚屏蔽材料有限公司 全包覆式散热片及其制造方法
CN107167020A (zh) * 2017-06-05 2017-09-15 深圳市鸿富诚屏蔽材料有限公司 一体式散热片、制造模具及其制造方法
CN107278092A (zh) * 2017-06-05 2017-10-20 深圳市鸿富诚屏蔽材料有限公司 散热片及其制造方法
CN207335516U (zh) * 2017-06-05 2018-05-08 深圳市鸿富诚屏蔽材料有限公司 全包覆式散热片
CN207340385U (zh) * 2017-06-05 2018-05-08 深圳市鸿富诚屏蔽材料有限公司 散热片
CN207600279U (zh) * 2017-06-05 2018-07-10 深圳市鸿富诚屏蔽材料有限公司 一体式散热片及制造模具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3605547B2 (ja) * 1999-06-11 2004-12-22 松下電器産業株式会社 放熱基板及びその製造方法
US20060275952A1 (en) * 2005-06-07 2006-12-07 General Electric Company Method for making electronic devices
US20120061716A1 (en) * 2009-04-10 2012-03-15 Nationstar Optoelectronics Co., Ltd. Manufacturing method for power led head-dissipating substrate and power led product and the products thereof
CN101965121A (zh) * 2010-10-09 2011-02-02 肖方一 一种发热元件的导热结构的制备方法及该导热结构
CN201820748U (zh) * 2010-10-09 2011-05-04 肖方一 一种发热元件的导热结构
CN203279435U (zh) * 2013-04-22 2013-11-06 青岛海信移动通信技术股份有限公司 便携式移动终端
CN105751415A (zh) * 2016-03-28 2016-07-13 上海卫星装备研究所 导热垫制作装置及方法
CN105825985B (zh) * 2016-05-27 2018-05-29 深圳市特普生传感有限公司 单端玻封ntc热敏电阻石墨模具及其使用方法
CN206196216U (zh) * 2016-09-07 2017-05-24 大唐移动通信设备有限公司 一种复合型导热垫片及通信设备的散热装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01110914A (ja) * 1987-10-26 1989-04-27 Nishikawa Kasei Kk クッション材の製造方法
CN103620752A (zh) * 2012-03-07 2014-03-05 东和株式会社 树脂封装电子元件的制造方法及树脂封装电子元件的制造装置
CN103369907A (zh) * 2012-03-26 2013-10-23 鸿富锦精密工业(深圳)有限公司 散热模组及其使用方法
CN107036482A (zh) * 2017-06-05 2017-08-11 深圳市鸿富诚屏蔽材料有限公司 全包覆式散热片及其制造方法
CN107167020A (zh) * 2017-06-05 2017-09-15 深圳市鸿富诚屏蔽材料有限公司 一体式散热片、制造模具及其制造方法
CN107278092A (zh) * 2017-06-05 2017-10-20 深圳市鸿富诚屏蔽材料有限公司 散热片及其制造方法
CN207335516U (zh) * 2017-06-05 2018-05-08 深圳市鸿富诚屏蔽材料有限公司 全包覆式散热片
CN207340385U (zh) * 2017-06-05 2018-05-08 深圳市鸿富诚屏蔽材料有限公司 散热片
CN207600279U (zh) * 2017-06-05 2018-07-10 深圳市鸿富诚屏蔽材料有限公司 一体式散热片及制造模具

Also Published As

Publication number Publication date
CN107167020B (zh) 2023-08-11
CN107167020A (zh) 2017-09-15

Similar Documents

Publication Publication Date Title
WO2018223937A1 (zh) 一体式散热片、制造模具及其制造方法
JP5569746B2 (ja) 端子台及びナット
EP2784810B1 (en) Chip packaging structure and chip packaging method
US9881849B2 (en) Method of forming an integrated circuit with heat-mitigating diamond-filled channels
WO2018223935A1 (zh) 全包覆式散热片及其制造方法
CN104505347A (zh) 一种在塑封过程中贴装石墨烯散热薄膜的方法
KR20170045812A (ko) 탄소 방열소재를 적용한 엘이디 조명모듈
EP2760052A1 (en) A fabrication method for solar cell assembly
CN212666535U (zh) 一种半导体器件压铸模具
KR102006641B1 (ko) 전기차량용 배터리의 냉각핀 및 그 제조방법
TWI432617B (zh) 長晶裝置
TWI700168B (zh) 預製構件模具
CN208213959U (zh) 一种防止粘铝的圆棒型材模具
US9754810B2 (en) Method for the production of a wafer with a carrier unit
CN207911959U (zh) 巧克力浇注成型设备
US2850413A (en) Process for making fused junction semiconductor devices
CN107507803B (zh) 封装方法
CN107382034B (zh) 一种光学透镜的高效生产设备
CN103151271A (zh) 一种散热盖粘结胶的分配方法
CN209971370U (zh) 用于改善智能功率半导体模块产品翘曲的模具
TWI541396B (zh) 用於晶碇鑄造爐的冷卻裝置及鑄造晶碇之方法
JP5957497B2 (ja) ウェハパッケージに応用する離型シート
TW201511195A (zh) 雙工器封裝結構及製造方法
CN101862946A (zh) 中空超薄散热片制造方法
TWI549240B (zh) 應用於晶圓封裝之離形元件

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18814167

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18814167

Country of ref document: EP

Kind code of ref document: A1