WO2018221261A1 - Dispositif d'imagerie à semi-conducteurs et appareil électronique - Google Patents

Dispositif d'imagerie à semi-conducteurs et appareil électronique Download PDF

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Publication number
WO2018221261A1
WO2018221261A1 PCT/JP2018/019231 JP2018019231W WO2018221261A1 WO 2018221261 A1 WO2018221261 A1 WO 2018221261A1 JP 2018019231 W JP2018019231 W JP 2018019231W WO 2018221261 A1 WO2018221261 A1 WO 2018221261A1
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Prior art keywords
pixel
solid
state imaging
imaging device
transistor
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PCT/JP2018/019231
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English (en)
Japanese (ja)
Inventor
滝沢　正明
頼人 坂野
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ソニーセミコンダクタソリューションズ株式会社
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Priority to US16/616,618 priority Critical patent/US11082649B2/en
Priority to CN202211499738.8A priority patent/CN115831992A/zh
Priority to CN201880033963.8A priority patent/CN110663248B/zh
Priority to JP2019522113A priority patent/JP7210441B2/ja
Priority to KR1020197033486A priority patent/KR102552755B1/ko
Priority to CN202311297888.5A priority patent/CN117577652A/zh
Publication of WO2018221261A1 publication Critical patent/WO2018221261A1/fr
Priority to JP2023002161A priority patent/JP2023033399A/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/57—Control of the dynamic range
    • H04N25/59—Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
    • H04N25/621—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for the control of blooming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

Definitions

  • the present disclosure relates to a solid-state imaging device and an electronic device, and particularly to a solid-state imaging device and an electronic device that can effectively suppress blooming.
  • CMOS Complementary Metal Oxide Semiconductor
  • Patent Document 1 As a technique for suppressing such blooming, for example, a technique disclosed in Patent Document 1 has been proposed.
  • a charge discharging unit is provided and a control pulse applied to the gate electrode is controlled to prevent the photodiode from saturating and overflowing charges.
  • the present disclosure has been made in view of such a situation, and is intended to effectively suppress blooming.
  • a solid-state imaging device includes a pixel array unit in which a plurality of pixels are two-dimensionally arranged, and the pixels are on the side opposite to a light incident surface of a photoelectric conversion element provided in a semiconductor substrate. And a solid-state imaging device in which a pixel internal capacitor is provided and a counter electrode of the pixel internal capacitor is provided in the semiconductor substrate.
  • An electronic apparatus includes a pixel array unit in which a plurality of pixels are arranged in a two-dimensional manner, and the pixels are disposed on a side opposite to a light incident surface of a photoelectric conversion element provided in a semiconductor substrate.
  • the electronic device includes a solid-state imaging device in which a pixel capacitance is provided and a counter electrode of the pixel capacitance is provided in the semiconductor substrate.
  • a pixel array unit in which a plurality of pixels are arranged in a two-dimensional manner is provided, and the pixels are provided in a semiconductor substrate.
  • a pixel internal capacitance is provided on the opposite side of the light incident surface of the photoelectric conversion element, and a counter electrode for the internal pixel capacitance is provided in the semiconductor substrate.
  • a solid-state imaging device includes a pixel array unit in which a plurality of pixels are two-dimensionally arranged, and the pixels are on the side opposite to a light incident surface of a photoelectric conversion element provided in a semiconductor substrate.
  • the solid-state imaging device is provided with a capacitor composed of a stacked first conductive layer and second conductive layer.
  • a pixel array unit in which a plurality of pixels are two-dimensionally arranged is provided, and the pixels have a light incident surface of a photoelectric conversion element provided in a semiconductor substrate.
  • a capacitor composed of the stacked first conductive layer and second conductive layer is provided.
  • blooming can be effectively suppressed.
  • FIG. 2 is a circuit diagram illustrating an example of a configuration of a pixel according to the first embodiment.
  • FIG. It is sectional drawing which shows the 1st example of the structure of the pixel of 1st Embodiment. It is sectional drawing which shows the 2nd example of the structure of the pixel of 1st Embodiment.
  • 3 is a timing chart for explaining an example of driving a pixel according to the first embodiment; It is sectional drawing which shows the 3rd example of the structure of the pixel of 1st Embodiment.
  • FIG. 12 is a cross-sectional view illustrating another configuration example of a stacked solid-state imaging device to which the technology according to the present disclosure can be applied.
  • an image captured by a vehicle-mounted camera can be shown to a driver or other passengers on a monitor screen in a vehicle cabin, or can be recorded on a drive recorder.
  • image processing such as image recognition is applied to the image captured by the in-vehicle camera to detect road white lines (lanes), traffic lights, road signs, oncoming vehicles, pedestrians around the vehicle, etc. Based on the detection result, driving support and visibility support can be performed.
  • LED flicker in which a blinking subject such as an LED (Light Emitting Diode) light source cannot be captured depending on the blinking timing, is highlighted.
  • This LED flicker occurs because the dynamic range of the image sensor is low and it is necessary to adjust the exposure time for each subject.
  • the readout speed is constant regardless of the exposure time
  • the exposure time is set in units shorter than the readout time
  • the light incident on the photodiode (PD: Photodiode) at times other than the exposure time is Although it becomes a charge by photoelectric conversion, it is discarded without being read by charge-voltage conversion.
  • LED flicker Even if the LED light source blinks during such an invalid period, it cannot be imaged. This is a phenomenon called LED flicker.
  • a so-called sluice transfer method is used to control the voltage applied to the transfer gate that transfers the charge accumulated in the photodiode and perform a read operation a plurality of times during the exposure period, thereby achieving a dynamic range.
  • a so-called sluice transfer method is used to control the voltage applied to the transfer gate that transfers the charge accumulated in the photodiode and perform a read operation a plurality of times during the exposure period, thereby achieving a dynamic range.
  • Patent Documents 3 and 4 techniques for expanding the dynamic range by applying the space division method are disclosed in Patent Documents 3 and 4, for example.
  • LOFIC Lateral Overflow Integration Capacitor
  • Patent Document 2 Japanese Patent Laid-Open No. 2008-99158 Patent Document 3: Japanese Patent Laid-Open No. 5-64083 Patent Document 4: Japanese Patent Laid-Open No. 2006-253876 Patent Document 5: Japanese Patent Laid-Open No. 2005-328493
  • the time division method can expand the dynamic range to 120 dB or more, which is equivalent to the human eye, by increasing the number of divisions, but it can not cope with LED flicker accordingly, Furthermore, moving subject artifacts are unavoidable.
  • blooming can be effectively suppressed in a solid-state imaging device such as a CMOS image sensor.
  • CMOS image sensor CMOS image sensor
  • the blooming is effectively suppressed, so that the dynamic range can be expanded to deal with LED flicker and moving subject artifacts.
  • FIG. 1 is a block diagram illustrating a configuration example of an embodiment of a solid-state imaging device to which the technology according to the present disclosure is applied.
  • the CMOS image sensor 10 in FIG. 1 is an example of a solid-state imaging device using CMOS.
  • the CMOS image sensor 10 takes in incident light (image light) from a subject via an optical lens system (not shown), and converts the amount of incident light imaged on the imaging surface into an electrical signal in units of pixels. Output as a pixel signal.
  • a CMOS image sensor 10 includes a pixel array unit 11, a vertical drive circuit 12, a column signal processing circuit 13, a horizontal drive circuit 14, an output circuit 15, a control circuit 16, and an input / output terminal 17. .
  • the pixel 100 includes a photodiode (PD) as a photoelectric conversion element and a plurality of pixel transistors.
  • the pixel transistor includes a transfer transistor, a reset transistor, an amplification transistor, and a selection transistor.
  • the pixel 200, the pixel 300, the pixel 400, the pixel 500, the pixel 600, or the pixel 700 can be arranged as the pixels arranged in the pixel array unit 11. It will be described later.
  • the vertical drive circuit 12 includes, for example, a shift register, selects a predetermined pixel drive line 21, supplies a drive signal (pulse) for driving the pixel 100 to the selected pixel drive line 21, and operates in units of rows. To drive the pixel 100. That is, the vertical drive circuit 12 selectively scans each pixel 100 of the pixel array unit 11 in the vertical direction sequentially in units of rows, and is based on the charge (signal charge) generated according to the amount of light received by the photodiode of each pixel 100. The pixel signal is supplied to the column signal processing circuit 13 through the vertical signal line 22.
  • the column signal processing circuit 13 is arranged for each column of the pixels 100, and performs signal processing such as noise removal on the signal output from the pixels 100 for one row for each pixel column.
  • the column signal processing circuit 13 performs correlated double sampling (CDS) or delta data sampling (DDS: Delta Data Sampling) and AD (Analog Digital) conversion to remove pixel-specific fixed pattern noise.
  • CDS correlated double sampling
  • DDS Delta Data Sampling
  • AD Analog Digital
  • the horizontal drive circuit 14 is constituted by, for example, a shift register, and sequentially outputs horizontal scanning pulses to sequentially select each of the column signal processing circuits 13, and outputs a pixel signal from each of the column signal processing circuits 13 to the horizontal signal line. 23 to output.
  • the output circuit 15 performs signal processing on the signals sequentially supplied from each of the column signal processing circuits 13 through the horizontal signal line 23 and outputs the signals.
  • the output circuit 15 may perform only buffering, for example, or may perform black level adjustment, column variation correction, various digital signal processing, and the like.
  • the control circuit 16 controls the operation of each part of the CMOS image sensor 10.
  • control circuit 16 controls the clock signal and control which are the reference for the operation of the vertical drive circuit 12, the column signal processing circuit 13, and the horizontal drive circuit 14 based on the vertical synchronization signal, the horizontal synchronization signal, and the master clock signal. Generate a signal.
  • the control circuit 16 outputs the generated clock signal and control signal to the vertical drive circuit 12, the column signal processing circuit 13, the horizontal drive circuit 14, and the like.
  • the input / output terminal 17 exchanges signals with the outside.
  • the CMOS image sensor 10 of FIG. 1 configured as described above is a CMOS image sensor called a column AD system in which column signal processing circuits 13 that perform CDS processing or DDS processing and AD conversion processing are arranged for each pixel column. It is said. Further, the CMOS image sensor 10 in FIG. 1 can be, for example, a back-illuminated CMOS image sensor.
  • FIG. 2 is a circuit diagram illustrating an example of a configuration of the pixel 100 according to the first embodiment.
  • a pixel 100 includes a photodiode (PD) 111, a transfer transistor 112, a reset transistor 113, an amplification transistor 114, and a selection transistor 115, as well as a junction transistor 116, a pixel capacitance (FC) 117, and an FC connection transistor. 118, a conversion efficiency switching transistor 119, and a floating diffusion region (FD) 131.
  • the photodiode 111 is, for example, a photoelectric conversion element configured as a PN junction photodiode (PD).
  • the photodiode 111 generates and accumulates charges (signal charges) corresponding to the received light quantity.
  • the anode is grounded, and the cathode is connected to the transfer transistor 112 and the junction transistor 116.
  • the transfer transistor 112 is connected between a node between the photodiode 111 and the junction transistor 116 and the floating diffusion region (FD) 131.
  • a drive signal TGL is applied to the gate of the transfer transistor 112.
  • the transfer gate of the transfer transistor 112 is turned on (on state), and the charge accumulated in the photodiode 111 causes the transfer transistor 112 to pass through.
  • the drain of the transfer transistor 112 is connected to the source of the conversion efficiency switching transistor 119 and the gate of the amplification transistor 114, and this connection point (node) constitutes a floating diffusion region (FD: Floating Diffusion) 131. ing.
  • the floating diffusion region 131 is a charge-voltage conversion unit, and converts the charge transferred thereto into a voltage.
  • the reset transistor 113 is connected between a node between the FC connection transistor 118 and the conversion efficiency switching transistor 119 and a power source that supplies a power source voltage to the counter electrode 120 of the pixel capacitance (FC) 117.
  • a drive signal RST is applied to the gate of the reset transistor 113. When the drive signal RST becomes H level, the reset transistor 113 becomes conductive, and the potential of the floating diffusion region (FD) 131 is reset via the conversion efficiency switching transistor 119.
  • the amplification transistor 114 has a gate connected to the floating diffusion region (FD) 131, a drain connected to the power supply VDD, and a readout circuit that reads a voltage signal held in the floating diffusion region (FD) 131, so-called It becomes the input part of the source follower circuit. That is, the amplifying transistor 114 has a source connected to the vertical signal line 22 (FIG. 1) via the selection transistor 115, whereby a constant current source 141 and a source follower circuit connected to one end of the vertical signal line 22 are connected. Configure.
  • the selection transistor 115 is connected between the amplification transistor 114 (the source thereof) and the vertical signal line 22.
  • a drive signal SEL is applied to the gate of the selection transistor 115.
  • the selection transistor 115 is turned on and the pixel 100 is selected.
  • the signal amplified by the amplification transistor 114 is output to the vertical signal line 22 (FIG. 1) via the selection transistor 115.
  • the junction transistor 116 is connected between a node between the photodiode 111 and the transfer transistor 112 and a node between the pixel capacitance (FC) 117 and the FC connection transistor 118.
  • the junction transistor 116 moves part of the electric charge accumulated in the photodiode 111 to the pixel internal capacitance (FC) 117.
  • the junction transistor 116 has a function of transferring the charge overflowing from the photodiode 111 to the pixel internal capacitance (FC) 117, and corresponds to an overflow path (for example, an overflow path 155 in FIG. 3) described later. ing.
  • the pixel internal capacitance (FC) 117 accumulates the charge transferred (overflow) from the photodiode 111 via the junction transistor 116.
  • the internal capacitance (FC) 117 is also referred to as a floating capacitor (FC) because of its function.
  • the FC connection transistor 118 is connected between a node between the junction transistor 116 and the pixel internal capacitance (FC) 117 and a node between the reset transistor 113 and the conversion efficiency switching transistor 119.
  • a drive signal FCG is applied to the gate of the FC connection transistor 118.
  • the transfer gate of the FC connection transistor 118 becomes conductive, and the floating diffusion region (FD) 131 and the pixel internal capacitance (FC) 117, that is, FD (charge voltage conversion capacitance). ) And the potential of FC (capacitance in the pixel) are combined.
  • the conversion efficiency switching transistor 119 is connected between the node between the reset transistor 113 and the FC connection transistor 118 and the floating diffusion region (FD) 131.
  • a drive signal FDG is applied to the gate of the conversion efficiency switching transistor 119.
  • the transfer gate of the conversion efficiency switching transistor 119 becomes conductive, the floating diffusion region (FD) 131, the reset transistor 113, the FC connection transistor 118, and the conversion efficiency switching transistor.
  • the node at the connection point of the transistor 119 that is, the FD (charge voltage conversion capacitor) and the potential of the capacitor at the node at the connection point are coupled.
  • FC connection transistor 118 and the conversion efficiency switching transistor 119 function as a transfer gate, and thus can be said to be transfer transistors.
  • the counter electrode 120 of the pixel internal capacity (FC) 117 is connected to a power supply that supplies a power supply voltage, and a power supply or a high voltage equivalent thereto is applied. However, the voltage applied to the counter electrode 120 is fixed at a constant voltage.
  • the gate of the transfer transistor 112, the gate of the reset transistor 113, the gate of the selection transistor 15, the gate of the FC connection transistor 118, and the gate of the conversion efficiency switching transistor 119 are connected to the pixel drive line 21 (TGL drive line, RST drive).
  • Line, SEL drive line, FCG drive line, and FDG drive line) are connected to the vertical drive circuit 12 (FIG. 1), respectively, and drive signals (drive signal TGL, drive signal RST, drive signal SEL, drive) Pulses as signal FCG and drive signal FDG) are respectively supplied.
  • the pixel 100 is configured as described above.
  • FIG. 3 is a cross-sectional view illustrating a first example of the structure of the pixel 100 according to the first embodiment.
  • FIG. 4 is a cross-sectional view illustrating a second example of the structure of the pixel 100 according to the first embodiment.
  • the surface on the light incident side is referred to as “light incident surface”, and the surface opposite to the light incident surface is referred to as “element surface”.
  • the depth direction of the silicon substrate (silicon layer) is also referred to as “longitudinal direction”.
  • the pixel 100 has a photodiode 111 as a photoelectric conversion element in a silicon substrate.
  • the photodiode 111 is formed, for example, by embedding an N-type layer 153 in a P-type well layer 151 and a P-type layer 152 on the element surface side in a silicon substrate.
  • the photodiode 111 photoelectrically converts light incident from the light incident surface side and accumulates electric charges obtained as a result.
  • the pixel 100 includes the transfer transistor 112 or the counter electrode 120 described above.
  • the counter electrode 120 are illustrated.
  • the transfer gate becomes conductive, and the charge accumulated in the photodiode 111 is transferred to the floating diffusion region (FD) 131.
  • the electric charge accumulated in the photodiode 111 can be transferred by controlling the potential state of the region formed under the gate electrode 112A based on the drive signal TGL.
  • the transfer transistor 112 may be configured as a vertical transistor. As described above, by using the transfer transistor 112 as a vertical transistor, the charge accumulated in the photodiode 111 can be directly read out.
  • the pixel internal capacitance (FC) 117 is provided on the element surface side with respect to the photodiode 111 provided in the silicon substrate.
  • the counter electrode 120 of the pixel capacitor (FC) 117 is provided in the silicon substrate as an N-type region (N +). A power source or a high voltage corresponding thereto is applied to the counter electrode 120.
  • the pixel internal capacity (FC) 117 is connected to the overflow path 155 via the contact 161.
  • the contact 161 is made of metal or the like, and electrically connects the pixel capacitance (FC) 117 and the overflow path 155.
  • the overflow path 155 is provided as an N-type region in the vertical direction between the photodiode 111 and the pixel internal capacitance (FC) 117 adjacent to the counter electrode 120 provided in the silicon substrate. Through the overflow path 155, a part of the electric charge accumulated in the photodiode 111 is moved to the pixel internal capacitance (FC) 117 via the contact 161.
  • the overflow path 155 corresponds to the junction transistor 116 of FIG.
  • the pixel capacitance (FC) 117 when the pixel capacitance (FC) 117 is provided, the pixel capacitance (FC) 117 is provided on the element surface side, and at the same time, the pixel capacitance (FC). 117 counter electrode 120 is provided in the silicon substrate.
  • an overflow path 155 is provided in the vertical direction between the photodiode 111 and the pixel internal capacitance (FC) 117 adjacent to the counter electrode 120 provided in the silicon substrate.
  • FC pixel internal capacitance
  • CMOS image sensor 10 (FIG. 1) is mounted on a vehicle-mounted camera, it is possible to expand the dynamic range by effectively suppressing blooming, resulting in LED flicker and motion. It is possible to deal with subject artifacts.
  • the charge overflowed from the photodiode 111 and the pixel capacitance (FC) 117 is absorbed (discharged) by the counter electrode 120 of the pixel capacitance (FC) 117.
  • FC pixel capacitance
  • the reset level at low conversion efficiency is expressed as “PD-LG RST”, and the reset level at high conversion efficiency is expressed as “PD-HG ⁇ RST ”.
  • the signal level at low conversion efficiency is expressed as “PD-LG-SIG”, and the signal level at high conversion efficiency is expressed as “PD-HG SIG”.
  • FC RST the reset level at the time of potential coupling of the FD and FC capacities
  • FC SIG the signal level at the potential coupling of the capacities of FD and FC
  • the drive signal RST and the drive signal FDG are set to the H level, the reset transistor 113 and the conversion efficiency switching transistor 119 become conductive, and are stored in the floating diffusion region (FD) 131. The charged charge is reset. Thereafter, the drive signal FDG and the drive signal RST are sequentially set to the L level, the conversion efficiency switching transistor 119 and the reset transistor 113 are sequentially turned off (off state), and then the drive signal FDG is again set to the H level. Then, the conversion efficiency switching transistor 119 becomes conductive.
  • the PD-LG RST period is entered, and the noise level (N2) at low conversion efficiency is read out.
  • the drive signal FDG is set to L level, and the conversion efficiency switching transistor 119 is turned off.
  • time t12 to time t13 is a PD-HG RST period, and the noise level (N1) at high conversion efficiency is read.
  • the drive signal TGL is set to H level, and the transfer transistor 112 is turned on, whereby the charge accumulated in the photodiode 111 is transferred to the floating diffusion region (FD) 131. Thereafter, the drive signal TGL is set to L level, and the transfer transistor 112 is turned off. At this time, the drive signal FDG is set to L level, and the conversion efficiency switching transistor 119 is in a non-conductive state.
  • the PD-HG SIG period is entered, and the signal level (S1) at high conversion efficiency is read.
  • the drive signal FDG is set to H level, and the conversion efficiency switching transistor 119 is turned on.
  • the PD-LG-SIG period is reached, and the signal level (S2) at the low conversion efficiency is read.
  • the drive signal FCG is set to H level, and the FC connection transistor 118 is turned on, whereby the floating diffusion region (FD) 131 and the pixel internal capacitance (FC) 117, that is, The FD (charge voltage conversion capacity) and FC (pixel capacity) capacity potentials are combined.
  • the signal level (S3) is read from time t15 to time t16 in the FC SIG period.
  • the drive signal RST is set to the H level, the reset transistor 113 is turned on, and the charges accumulated in the floating diffusion region (FD) 131 and the pixel internal capacitance (FC) 117 are reset. Thereafter, the drive signal RST is set to L level, and the reset transistor 113 is turned off.
  • the noise level at low conversion efficiency (N2) during the PD-LG RST period the noise level (N1) at high conversion efficiency during the PD-HG RST period, and the signal level at high conversion efficiency during the PD-HG RST period ( S1), signal level (S2) at low conversion efficiency during PD-LG-SIG, signal level (S3) during FC SIG, and noise level (N3) during FC RST.
  • the true signal component can be obtained by taking the difference (S2-N2) between the low conversion efficiency signal level (S2) and the low conversion efficiency noise level (N2). Since the noise level (N2) is read out earlier than S2), signal generation is performed by performing correlated double sampling (CDS), and a second image (S2-N2) is obtained.
  • S2-N2 the difference between the low conversion efficiency signal level (S2) and the low conversion efficiency noise level (N2). Since the noise level (N2) is read out earlier than S2), signal generation is performed by performing correlated double sampling (CDS), and a second image (S2-N2) is obtained.
  • CDS correlated double sampling
  • the low conversion efficiency noise level (N2) and the low conversion efficiency signal level (S2) are not read out continuously, the low conversion efficiency noise level (N2) read out first is stored in the line memory. It is necessary to hold temporarily.
  • the true signal component is obtained by taking the difference (S3-N3) between the signal level (S3) and the noise level (N3), but here the signal level (S3 ) Is read out first, delta data sampling (DDS) is performed, so that signal generation is performed and a third image (S3-N3) is obtained.
  • DDS delta data sampling
  • the drive signal SEL for the selection transistor 115 is set to the L level at time t16 between the FC SIG period and the FC RST period, but is set to the H level during the other periods.
  • the driving of the pixel 100 in the readout period has been described.
  • the driving signals SEL, FDG, and RST are set at a constant level, and the driving signal FCG is set between the FC SIG period and the FC RST.
  • the drive signal TGL is temporarily set to the H level only during the FC SIG period only during the period.
  • XHS represents a horizontal synchronization signal
  • the horizontal synchronization signal XHS is input at time t11 and time t17.
  • FIG. 6 is a cross-sectional view illustrating a third example of the structure of the pixel 100 according to the first embodiment.
  • the pixel 100 in FIG. 6 has a pixel capacitance (FC) 117 provided on the element surface side with respect to the photodiode 111 provided in the silicon substrate, and is opposed to the silicon substrate.
  • FC pixel capacitance
  • FIG. 6 is identical to the pixel 100 shown in FIG. 4 in that an overflow path 155 is provided in the vertical direction in the silicon substrate. However, the pixel 100 in FIG. The difference is that the counter electrode 120 of the pixel internal capacitance (FC) 117 is provided so as to surround it.
  • FC pixel internal capacitance
  • the overflow path 155 is connected via a contact 161 to a pixel internal capacitance (FC) 117 facing the counter electrode 120 surrounding the periphery. Due to the overflow path 155, part of the electric charge accumulated in the photodiode 111 is moved to the pixel internal capacitance (FC) 117 via the contact 161.
  • FC pixel internal capacitance
  • the charges overflowing from the photodiode 111 and the pixel capacitance (FC) 117 are absorbed (discharged) by the counter electrode 120 of the pixel capacitance (FC) 117, so that the other pixels It is possible to effectively suppress the blooming of charge to the (photodiode).
  • the first embodiment has been described above.
  • FIG. 7 is a circuit diagram illustrating an example of the configuration of the pixel 200 according to the second embodiment.
  • the pixel 200 includes a photodiode (PD) 211, a transfer transistor 212, a reset transistor 213, an amplification transistor 214, and a selection transistor 215, as well as a junction transistor 216, a pixel internal capacitance (FC) 217, and an FC connection transistor. 218, a conversion efficiency switching transistor 219, and a floating diffusion region (FD) 231.
  • PD photodiode
  • FC pixel internal capacitance
  • FC FC connection transistor
  • the pixel 200 in FIG. 7 is basically configured in the same manner as the pixel 100 illustrated in FIG. 2, except that the voltage (FCVDD) applied to the counter electrode 220 of the pixel capacitance (FC) 217 is variable. Is different. That is, in the pixel 100 of the first embodiment, the voltage applied to the counter electrode 120 of the pixel capacitance (FC) 117 is fixed at a constant voltage, but the pixel of the second embodiment. In 200, the voltage applied to the counter electrode 220 of the pixel internal capacitance (FC) 217 is variable.
  • FIG. 8 shows a timing chart of an example of driving the pixel 200 according to the second embodiment.
  • the driving timing chart of the pixel 200 is applied to the counter electrode 220 during the shutter period (SH row) and the readout period (RD row) as compared with the driving timing of the pixel 100 shown in FIG. The difference is that a timing chart of voltage FCVDD is added.
  • the voltage FCVDD applied to the counter electrode 220 is switched during the shutter period, the readout period, and the accumulation period (the period between the shutter period and the readout period).
  • the voltage FCVDD is set to the H level and the pixel internal capacity (FC) 217 is turned on.
  • the voltage FCVDD is set to the L level, so that the internal capacity (FC) of the pixel is set. 217 can be turned off.
  • the pixel 200 is driven according to the timing chart shown in FIG. 8, so that the noise level at the low conversion efficiency (N2) in the PD-LG RST period and the noise level at the high conversion efficiency in the PD-HG RST period.
  • N1 signal level at high conversion efficiency during PD-HG SIG period (S1), signal level at low conversion efficiency at PD-LG SIG period (S2), signal level at FC SIG period (S3), and FC RST period
  • the noise level (N3) is read in order.
  • FIG. 9 is a circuit diagram illustrating an example of the configuration of the pixel 300 according to the third embodiment.
  • a pixel 300 includes a photodiode transistor (PD) 311, a transfer transistor 312, a reset transistor 313, an amplification transistor 314, and a selection transistor 315, as well as a junction transistor 316, a pixel internal capacitance (FC) 317, and conversion efficiency switching.
  • PD photodiode transistor
  • FC pixel internal capacitance
  • FD floating diffusion region
  • the pixel 300 in FIG. 9 is not provided with an FC connection transistor, and the pixel internal capacitance (FC) 317 supplies the power supply voltage to the junction transistor 316 and the counter electrode 320.
  • FC pixel internal capacitance
  • junction transistor 316 corresponding to the overflow path is between a node between the photodiode 311 and the transfer transistor 312 and a node between the power source that supplies the power supply voltage to the pixel internal capacitance (FC) 317 and the counter electrode 320.
  • FC pixel internal capacitance
  • the overflow path 155 (junction transistor 116) is adjacent to the counter electrode 120 provided in the silicon substrate, and the photodiode 111 and the pixel capacitance (FC) 117.
  • a direct overflow path (junction transistor 316) is provided between the photodiode 311 and the counter electrode 320 in the vertical direction. I am trying to do it.
  • the transfer gate of the transfer transistor 312 and the conversion efficiency switching transistor 319 is in a semi-conducting state (in other words, a half-open state), so that the charge overflowing from the photodiode 311 is transferred to the transfer transistor 312 and the conversion efficiency switching.
  • the pixel capacitance (FC) 317 may be accumulated via the transistor 319. That is, in this case, the intra-pixel capacitance (FC) 317 is used as a storage node.
  • FIG. 10 is a cross-sectional view illustrating a first example of the structure of the pixel 300 according to the third embodiment.
  • FIG. 11 is a cross-sectional view illustrating a second example of the structure of the pixel 300 according to the third embodiment.
  • the pixel 300 has a photodiode 311 as a photoelectric conversion element in a silicon substrate.
  • the photodiode 311 is formed by, for example, embedding an N-type layer 353 in a P-type well layer 351 and a P-type layer 352 on the element surface side in a silicon substrate.
  • the pixel 300 includes the transfer transistor 312 or the counter electrode 320 described above in addition to the photodiode 311, but here, in particular, the gate electrode 312 ⁇ / b> A corresponding to the transfer transistor 312, the pixel internal capacitance (FC) 317. , And the counter electrode 320 are illustrated.
  • the transfer gate becomes conductive, and the charge accumulated in the photodiode 311 is transferred to the floating diffusion region (FD) 331.
  • the electric charge accumulated in the photodiode 311 can be transferred by controlling the potential state of the region formed under the gate electrode 312A based on the drive signal TGL.
  • the transfer transistor 312 may be configured as a vertical transistor.
  • the pixel internal capacitance (FC) 317 is provided on the element surface side with respect to the photodiode 311 provided in the silicon substrate. Further, the counter electrode 320 of the intra-pixel capacitor (FC) 317 is provided in the silicon substrate as an N-type region (N +). The counter electrode 320 is connected to a power source and is supplied with an arbitrary power source voltage.
  • the overflow path 355 is provided as an N-type region (N ⁇ ) in the vertical direction between the photodiode 311 and the counter electrode 320. Through the overflow path 355, part of the charge accumulated in the photodiode 311 is moved (discharged) to the counter electrode 320.
  • the pixel capacitance (FC) 317 when the pixel capacitance (FC) 317 is provided, the pixel capacitance (FC) 317 is provided on the element surface side, and at the same time, the pixel capacitance (FC).
  • the counter electrode 320 of 317 is provided in the silicon substrate.
  • an overflow path 355 is directly provided in the vertical direction between the photodiode 311 provided in the silicon substrate and the counter electrode 320, and the pixel internal capacitance (FC) 317 is provided.
  • FC pixel internal capacitance
  • CMOS image sensor 10 (FIG. 1) is mounted on a vehicle-mounted camera, it is possible to expand the dynamic range by effectively suppressing blooming, resulting in LED flicker and motion. It is possible to deal with subject artifacts.
  • FIG. 12 is a timing chart illustrating a first example of driving of the pixel 300 according to the third embodiment.
  • the drive signal RST and the drive signal FDG are set to the H level, the reset transistor 313 and the conversion efficiency switching transistor 319 become conductive, and are accumulated in the floating diffusion region (FD) 331.
  • the charged charge is reset.
  • the drive signal FDG and the drive signal RST are sequentially set to the L level, the conversion efficiency switching transistor 319 and the reset transistor 313 are sequentially turned off, and then the drive signal FDG is set to the H level again to convert the conversion efficiency.
  • the switching transistor 319 becomes conductive.
  • the PD-LG RST period is entered, and the noise level (N2) at the low conversion efficiency is read out.
  • the drive signal FDG is set to L level, and the conversion efficiency switching transistor 319 is turned off.
  • the noise level (N1) at high conversion efficiency is read.
  • the drive signal TGL is set to H level, and the transfer transistor 312 is turned on, whereby the charge accumulated in the photodiode 311 is transferred to the floating diffusion region (FD) 331. Thereafter, the drive signal TGL is set to L level, and the transfer transistor 312 is turned off. At this time, the drive signal FDG is at the L level, and the conversion efficiency switching transistor 319 is in a non-conductive state.
  • the PD-HG SIG period is entered, and the signal level (S1) at high conversion efficiency is read.
  • the drive signal FDG is set to H level, and the conversion efficiency switching transistor 319 is turned on.
  • the PD-LGIGSIG period is reached, and the signal level (S2) at the low conversion efficiency is read.
  • the noise level at low conversion efficiency (N2) during the PD-LG RST period, the noise level (N1) at high conversion efficiency during the PD-HG RST period, and the signal level at high conversion efficiency during the PD-HG RST period ( S1), the signal level (S2) at the low conversion efficiency is sequentially read in the PD-LG SIG period.
  • the true signal component can be obtained by taking the difference (S2-N2) between the low conversion efficiency signal level (S2) and the low conversion efficiency noise level (N2). Since the noise level (N2) is read out earlier than S2), signal generation is performed by performing correlated double sampling (CDS), and a second image (S2-N2) is obtained.
  • S2-N2 the difference between the low conversion efficiency signal level (S2) and the low conversion efficiency noise level (N2). Since the noise level (N2) is read out earlier than S2), signal generation is performed by performing correlated double sampling (CDS), and a second image (S2-N2) is obtained.
  • CDS correlated double sampling
  • the low conversion efficiency noise level (N2) and the low conversion efficiency signal level (S2) are not read out continuously, the low conversion efficiency noise level (N2) read out first is stored in the line memory. As described above, it is necessary to temporarily hold them.
  • two images of the first image (S1-N1) and the second image (S2-N2) can be obtained, and these images can be obtained by a subsequent image processing circuit (for example, the DSP circuit 1002 in FIG. 28).
  • a subsequent image processing circuit for example, the DSP circuit 1002 in FIG. 28.
  • the signal level (S1) and noise level (N1) with high conversion efficiency, and the signal level (S2) and noise level (N2) with low conversion efficiency. ) are continuously read out, but by controlling the drive signal FDG applied to the gate of the conversion efficiency switching transistor 319, the conduction and non-conduction of the conversion efficiency switching transistor 319 is switched to a high level. Only the signal level (S1) and noise level (N1) of conversion efficiency, or only the signal level (S2) and noise level (N2) of low conversion efficiency may be read out.
  • FIG. 13 is a timing chart illustrating a second example of driving the pixel 300 according to the third embodiment.
  • the drive signal FDG is changed from L level to H level, the conversion efficiency switching transistor 319 is once turned on, and then the drive signal FDG is set to L level again to convert the conversion efficiency switching transistor. 319 is turned off.
  • the noise level (N2) is read from time t31 to time t32 in the PD RST period.
  • the drive signal TGL is set to the H level, and the transfer transistor 312 is turned on, whereby the charge accumulated in the photodiode 311 is transferred to the floating diffusion region (FD) 331. Thereafter, the drive signal TGL is set to L level, and the transfer transistor 312 is turned off. At this time, the drive signal FDG is at the L level, and the conversion efficiency switching transistor 319 is in a non-conductive state.
  • the signal level (S2) is read from time t32 to time t33 in the PD SIG period.
  • the drive signal FDG is set to H level, and the conversion efficiency switching transistor 319 is turned on, so that the floating diffusion region (FD) 331 and the pixel internal capacitance (FC) 317, That is, the potential of the capacitance of FD (charge voltage conversion capacitance) and FC (capacitance in the pixel) is combined.
  • the signal level (S3) is read from time t33 to time t34 in the FC SIG period.
  • the drive signal RST is set to the H level and the reset transistor 313 is turned on, whereby the charge accumulated in the floating diffusion region (FD) 331 is reset. Thereafter, the drive signal RST is set to the L level, and the reset transistor 313 is in a non-conductive state.
  • the noise level (N2) is read during the PD RST period, the signal level (S2) during the PD SIG period, the signal level (S3) during the FC SIG period, and the noise level (N3) during the FC RST period.
  • the true signal component can be obtained by taking the difference (S3-N3) between the signal level (S3) and the noise level (N3), but here the signal level (S3 ) Is read out first, delta data sampling (DDS) is performed, so that signal generation is performed and a second image (S3-N3) is obtained.
  • DDS delta data sampling
  • two images of the first image (S2-N2) and the second image (S3-N3) can be obtained, and these images can be obtained by a subsequent image processing circuit (for example, the DSP circuit 1002 in FIG. 28).
  • a subsequent image processing circuit for example, the DSP circuit 1002 in FIG. 28.
  • the pixel 200 of the second embodiment described above As shown in the second example of driving the pixel 300 shown in FIG. 13, when the pixel internal capacitance (FC) 317 is used as an accumulation node, the pixel 200 of the second embodiment described above.
  • the voltage FCVDD applied to the counter electrode 320 of the pixel internal capacitance (FC) 317 may be made variable so that the voltage FCVDD is switched between the shutter period, the readout period, and the accumulation period. By doing so, it is possible to reduce the electric field of the charge storage node of the pixel capacitance (FC) 317 during the accumulation period, and thus it is possible to suppress the occurrence of dark current and white spots during the accumulation period.
  • the third embodiment has been described above.
  • FIG. 14 is a circuit diagram illustrating a configuration example of the pixel 400 according to the fourth embodiment.
  • a pixel 400 includes a first photodiode (LPD) 411-1, a second photodiode (SPD) 411-2, a first transfer transistor 412-1, a second transfer transistor 412-2, a reset transistor 413, It includes an amplifying transistor 414, a selection transistor 415, a junction transistor 416, a pixel internal capacity (FC) 417, an FC connection transistor 418, a conversion efficiency switching transistor 419, and a floating diffusion region (FD) 431.
  • LPD photodiode
  • SPD second photodiode
  • FC pixel internal capacity
  • FC FC connection transistor
  • FD floating diffusion region
  • the first photodiode 411-1 is a photoelectric conversion element made of, for example, a PN junction photodiode (PD).
  • the first photodiode 411-1 generates and accumulates charges corresponding to the received light quantity.
  • the second photodiode 411-2 is a photoelectric conversion element made of, for example, a PN junction photodiode (PD).
  • the second photodiode 411-2 generates and accumulates charges corresponding to the received light quantity.
  • the first photodiode 411-1 is more per unit illuminance per unit time than the second photodiode 411-2.
  • the total amount of charge (signal charge) generated in the battery increases.
  • the sensitivity of the first photodiode 411-1 is higher, and the sensitivity of the second photodiode 411-2 is lower. Therefore, it can be said that the first photodiode 411-1 is a high-sensitivity photodiode, and the second photodiode 411-2 is a low-sensitivity photodiode.
  • the first transfer transistor 412-1 is connected between a node between the first photodiode 411-1 and the junction transistor 416 and the floating diffusion region (FD) 431.
  • a drive signal TGL is applied to the gate of the first transfer transistor 412-1.
  • this drive signal TGL becomes H level
  • the transfer gate of the first transfer transistor 412-1 becomes conductive, and the charge accumulated in the first photodiode 411-1 passes through the first transfer transistor 412-1. It is transferred to the floating diffusion region (FD) 431.
  • the drain of the first transfer transistor 412-1 is connected to the source of the conversion efficiency switching transistor 419 and the gate of the amplification transistor 414, and this connection point (node) constitutes the floating diffusion region (FD) 431. is doing.
  • the floating diffusion region 431 is a charge-voltage conversion unit, and converts charges transferred thereto into a voltage.
  • the second transfer transistor 412-2 is connected between the second photodiode 411-2 and a node between the pixel internal capacitance (FC) 417 and the FC connection transistor 418.
  • a drive signal TGS is applied to the gate of the second transfer transistor 412-2.
  • this drive signal TGS becomes H level
  • the transfer gate of the second transfer transistor 412-2 becomes conductive, and the charge accumulated in the second photodiode 411-2 passes through the second transfer transistor 412-2.
  • the pixel capacitance (FC) 417 and the FC connection transistor 418 are transferred.
  • the reset transistor 413 is connected between a power supply that supplies a power supply voltage to the counter electrode 420 of the pixel capacitance (FC) 417 and a node between the FC connection transistor 418 and the conversion efficiency switching transistor 419.
  • a drive signal RST is applied to the gate of the reset transistor 413. When this drive signal RST becomes H level, the reset transistor 413 becomes conductive, and the potential of the floating diffusion region (FD) 431 is reset via the conversion efficiency switching transistor 419.
  • the amplification transistor 414 has a gate connected to the floating diffusion region (FD) 431, a drain connected to the power supply VDD, and a so-called readout circuit for reading out a voltage signal held in the floating diffusion region (FD) 431. It becomes the input part of the source follower circuit. That is, the amplification transistor 414 has a source connected to the vertical signal line 22 (FIG. 1) via the selection transistor 415, so that a constant current source 441 and a source follower circuit connected to one end of the vertical signal line 22 are connected. Configure.
  • the selection transistor 415 is connected between the amplification transistor 414 (the source thereof) and the vertical signal line 22.
  • a drive signal SEL is applied to the gate of the selection transistor 415.
  • the selection transistor 115 is turned on, and the pixel 400 is selected.
  • the signal amplified by the amplification transistor 414 is output to the vertical signal line 22 (FIG. 1) via the selection transistor 415.
  • the junction transistor 416 is connected between a node between the first photodiode 411-1 and the first transfer transistor 412-1 and a power supply that supplies a power supply voltage to the counter electrode 420 of the pixel capacitance (FC) 417.
  • the junction transistor 416 moves (discharges) a part of the charge accumulated in the first photodiode 411-1 to the counter electrode 420.
  • the junction transistor 416 functions to transfer (discharge) the electric charge overflowing from the first photodiode 411-1 to the counter electrode 420 of the pixel internal capacitance (FC) 417, and an overflow path described later. (For example, this corresponds to the overflow path 455 in FIGS. 16 to 19).
  • the pixel internal capacitance (FC) 417 is connected between a node between the second transfer transistor 412-2 and the FC connection transistor 418 and a power source for supplying a power source voltage to the counter electrode 420.
  • a power supply or a high voltage equivalent thereto is applied to the counter electrode 420 of the pixel internal capacitance (FC) 417.
  • the intra-pixel capacitor (FC) 417 accumulates charges transferred or overflowed from the second photodiode 411-2.
  • the FC connection transistor 418 is connected between a node between the reset transistor 413 and the conversion efficiency switching transistor 419 and a node between the second transfer transistor 412-2 and the pixel internal capacitance (FC) 417.
  • a drive signal FCG is applied to the gate of the FC connection transistor 418.
  • the transfer gate of the FC connection transistor 418 becomes conductive, and the floating diffusion region (FD) 431 and the pixel internal capacitance (FC) 417, that is, FD (charge voltage conversion capacitance). ) And the potential of FC (capacitance in the pixel) are combined.
  • the conversion efficiency switching transistor 419 is connected between a node between the reset transistor 413 and the FC connection transistor 418 and the floating diffusion region (FD) 431.
  • a drive signal FDG is applied to the gate of the conversion efficiency switching transistor 419.
  • the transfer gate of the conversion efficiency switching transistor 419 becomes conductive, the floating diffusion region (FD) 431, the reset transistor 413, the FC connection transistor 418, and the conversion efficiency switching transistor.
  • the node at the connection point of the transistor 419, that is, the FD (charge-voltage conversion capacitor) and the potential of the capacitor at the connection point are coupled.
  • the pixel 400 is configured as described above.
  • the drive signal FDG for the switching transistor 419, the drive signal RST for the reset transistor 413, the drive signal TGS for the second transfer transistor 412-2, the drive signal FCG for the FC connection transistor 418, and the first transfer transistor 412-1 6 shows a timing chart of a drive signal TGL for
  • the drive signal RST and the drive signal FDG are set to the H level, the reset transistor 413 and the conversion efficiency switching transistor 419 are turned on and accumulated in the floating diffusion region (FD) 431. The charged charge is reset.
  • the drive signal FDG and the drive signal RST are sequentially set to the L level, the conversion efficiency switching transistor 419 and the reset transistor 413 are sequentially turned off, and then the drive signal FDG is set to the H level again to convert the conversion efficiency.
  • the switching transistor 419 becomes conductive.
  • the PD-LG RST period is entered, and the noise level (N2) at the low conversion efficiency is read out.
  • the drive signal FDG is set to L level, and the conversion efficiency switching transistor 419 is turned off.
  • time t42 to time t43 is a PD-HG RST period, and the noise level (N1) at high conversion efficiency is read.
  • the drive signal TGL is set to H level, and the first transfer transistor 412-1 is turned on, so that the charge accumulated in the high-sensitivity first photodiode 411-1 is floating and diffused. It is transferred to the area (FD) 431. Thereafter, the drive signal TGL is set to L level, and the first transfer transistor 412-1 is turned off. At this time, the drive signal FDG is set to L level, and the conversion efficiency switching transistor 419 is in a non-conductive state.
  • the PD-HG SIG period is entered, and the signal level (S1) at high conversion efficiency is read.
  • the drive signal FDG is set to H level, and the conversion efficiency switching transistor 419 becomes conductive.
  • the PD-LG-SIG period is entered, and the signal level (S2) at the low conversion efficiency is read.
  • the drive signal RST is set to the H level, the reset transistor 413 is turned on, and the charge accumulated in the floating diffusion region (FD) 431 (the first photodiode 411 having high sensitivity). The charge transferred from 1) is reset.
  • the drive signal RST is set to L level
  • the reset transistor 413 is turned off
  • the drive signal FCG is set to H level
  • the FC connection transistor 418 is turned on, whereby the floating diffusion region (FD). 431 and the capacitance in the pixel (FC) 417, that is, the potential of the capacitance of FD (charge voltage conversion capacitance) and FC (capacitance in the pixel) are combined.
  • the drive signal TGS is set to the H level and the second transfer transistor 412-2 is turned on, so that the charge accumulated in the low-sensitivity second photodiode 411-2 is transferred to the floating diffusion region ( FD) 431. Thereafter, the drive signal TGS is set to L level, and the second transfer transistor 412-2 is turned off.
  • the signal level (S3) is read from time t45 to time t46 in the FC SIG period.
  • the drive signal RST is set to the H level, the reset transistor 413 is turned on, and the charge (low sensitivity) accumulated in the floating diffusion region (FD) 431 and the pixel internal capacitance (FC) 417 is obtained.
  • the charge transferred from the second photodiode 411-2) is reset.
  • the drive signal RST is set to L level, and the reset transistor 413 is turned off.
  • the noise level at low conversion efficiency (N2) during the PD-LG RST period the noise level (N1) at high conversion efficiency during the PD-HG RST period, and the signal level at high conversion efficiency during the PD-HG RST period ( S1), signal level (S2) at low conversion efficiency during PD-LG-SIG, signal level (S3) during FC SIG, and noise level (N3) during FC RST.
  • the true signal component can be obtained by taking the difference (S2-N2) between the low conversion efficiency signal level (S2) and the low conversion efficiency noise level (N2).
  • S2-N2 low conversion efficiency signal level
  • CDS sampling
  • the low conversion efficiency noise level (N2) and the low conversion efficiency signal level (S2) are not read out continuously, the low conversion efficiency noise level (N2) read out first is stored in the line memory. As described above, it is necessary to temporarily hold them.
  • the true signal component can be obtained by taking the difference (S3-N3) between the signal level (S3) and the noise level (N3), but here delta data sampling (DDS) is performed, Signal generation is performed, and a third image (S3-N3) is obtained.
  • DDS delta data sampling
  • FIG. 16 is a cross-sectional view illustrating a first example of the structure of the pixel 400 according to the fourth embodiment.
  • a pixel 400 has a high-sensitivity first photodiode 411-1 and a low-sensitivity second photodiode 411-2 as photoelectric conversion elements in a silicon substrate.
  • the first photodiode 411-1 and the second photodiode 411-2 are formed, for example, by embedding N-type layers 453-1 and 453-2 in a P-type well 451 in a silicon substrate.
  • the drive signal TGL is applied to the gate electrode 412A-1, photoelectrically converted by the first photodiode 411-1, and the charge accumulated therein is transferred to the floating diffusion region (FD) 431.
  • a drive signal TGS is applied to the gate electrode 412A-2, photoelectrically converted by the second photodiode 411-2, and electric charges accumulated therein are stored in the pixel internal capacitance (FC) 417 and the FC connection transistor 418. Forwarded to the node between.
  • FC pixel internal capacitance
  • the pixel internal capacitance (FC) 417 is provided on the element surface side with respect to the first photodiode 411-1 provided in the silicon substrate. Further, the counter electrode 420 of the intra-pixel capacitor (FC) 417 is provided in the silicon substrate as an N-type region (N +). The counter electrode 420 of the pixel internal capacitance (FC) 417 is connected to the power supply VDD and is supplied with an arbitrary power supply voltage.
  • the overflow path 455 is provided as a vertical N-type region (N ⁇ ) between the first photodiode 411-1 and the counter electrode 420. Due to the overflow path 455, a part of the charge accumulated in the first photodiode 411-1 is moved (discharged) to the counter electrode 420.
  • FIG. 17 is a cross-sectional view illustrating a second example of the structure of the pixel 400 according to the fourth embodiment.
  • the pixel capacitance (FC) 417 is provided on the element surface side with respect to the first photodiode 411-1 and the counter electrode 420 of the pixel capacitance (FC) 417 is provided. Is provided in the silicon substrate, an overflow path 455 can be provided in the vertical direction between the first photodiode 411-1 and the counter electrode 420.
  • FIG. 18 is a cross-sectional view illustrating a third example of the structure of the pixel 400 according to the fourth embodiment.
  • the transfer of charges accumulated in the second photodiode 411-2 can be performed without using the gate electrode 412A-2.
  • the difference is that the well 451 is connected via a contact 461 connected to an N-type region (N +) embedded in the second photodiode 411-2.
  • the pixel capacitance (FC) 417 is provided on the element surface side with respect to the first photodiode 411-1 and the counter electrode 420 of the pixel capacitance (FC) 417 is provided. Is provided in the silicon substrate, an overflow path 455 can be provided in the vertical direction between the first photodiode 411-1 and the counter electrode 420.
  • FIG. 19 is a cross-sectional view illustrating a fourth example of the structure of the pixel 400 according to the fourth embodiment.
  • the in-pixel capacitance (FC) 417 is provided on the element surface side with respect to the first photodiode 411-1 and the counter electrode 420 of the in-pixel capacitance (FC) 417 is provided. Is provided in the silicon substrate, an overflow path 455 can be provided in the vertical direction between the first photodiode 411-1 and the counter electrode 420.
  • the pixel capacitance (FC) 417 when the pixel capacitance (FC) 417 is provided, the pixel capacitance (FC) 417 is provided on the element surface side, and at the same time, the pixel capacitance (FC).
  • the counter electrode 420 of 417 is provided in the silicon substrate.
  • a direct overflow path 455 is provided in the vertical direction between the first photodiode 411-1 and the counter electrode 420, and the counter electrode of the pixel internal capacitance (FC) 417 is provided.
  • FC pixel internal capacitance
  • CMOS image sensor 10 (FIG. 1) is mounted on a vehicle-mounted camera, it is possible to expand the dynamic range by effectively suppressing blooming, resulting in LED flicker and motion. It is possible to deal with subject artifacts.
  • the fourth embodiment has been described above.
  • CMOS image sensor In a CMOS image sensor, generally, a readout operation for reading out charges (signal charges) accumulated in a photodiode is performed for each row of the pixel array unit. The charge accumulation is started again.
  • an all-pixel simultaneous electronic shutter of a CMOS image sensor has been developed in which the exposure period of each pixel is the same.
  • the all-pixel simultaneous electronic shutter is an operation in which exposure is started at the same time for all the pixels effective for imaging and the exposure is simultaneously ended, and is also called a global shutter system.
  • the global shutter system there are a mechanical system and an electrical system.
  • an openable / closable mechanical shutter that shields the front surface of the CMOS image sensor is used.
  • the mechanical shutter is opened and exposure is started for all pixels at the same time.
  • the mechanical shutter is closed and all pixels are shielded simultaneously. To do.
  • exposure is started by performing a charge discharging operation for emptying the accumulated charge of the photodiode at the same time for all pixels.
  • all the charges accumulated by driving the transfer gate at the same time are transferred to the floating diffusion region (FD), and the transfer gate is closed, so that a period in which charge is generated in the photodiode can be obtained. , All pixels match.
  • a pixel structure having a memory part all pixels simultaneously perform a charge discharging operation for emptying the accumulated charge of the photodiode, and exposure is started. At the end of the exposure period, the transfer gate is also driven simultaneously for all the pixels and accumulated charge. Are transferred to the memory unit and held. Then, after resetting the floating diffusion region (FD), the charge held in the memory portion is transferred to the floating diffusion region (FD), and the signal level is read out.
  • FD floating diffusion region
  • Patent Document 6 Japanese Unexamined Patent Application Publication No. 2009-268083
  • the internal pixel capacitance (FC) is reduced as in the above-described embodiment. Blooming can be effectively suppressed by providing the counter electrode of the pixel capacitance (FC) in the silicon substrate simultaneously with the provision on the element surface side.
  • FIG. 20 is a cross-sectional view illustrating an example of the structure of the pixel 500 according to the fifth embodiment.
  • a pixel 500 has a photodiode 511 as a photoelectric conversion element in a silicon substrate.
  • the photodiode 511 is formed by embedding an N-type layer 553 in a P-type well 551 in a silicon substrate.
  • the first transfer gate 521 transfers the charge stored in the photodiode 511 to the memory unit 522 in accordance with the drive signal TRX applied to the gate electrode 521A.
  • the memory unit 522 is a charge holding unit made of, for example, an N-type buried channel formed under the gate electrode 521A.
  • the memory unit 522 holds electric charges transferred from the photodiode 511 by the first transfer gate 521.
  • the second transfer gate 523 transfers the charge held in the memory unit 522 to the floating diffusion region (FD) 531 according to the drive signal TRG applied to the gate electrode 523A.
  • the floating diffusion region (FD) 531 is a charge-voltage conversion unit including an N-type region (N +), and converts the charge transferred from the memory unit 522 by the second transfer gate 523 into a voltage.
  • the pixel 500 is provided with a reset transistor, an amplification transistor, a selection transistor, a junction transistor, an FC connection transistor, and a conversion efficiency switching transistor, as in the pixel 100 described above. However, the description thereof will be omitted.
  • the pixel internal capacitance (FC) 517 is provided on the element surface side with respect to the photodiode 511 provided in the silicon substrate. Further, the counter electrode 520 of the intra-pixel capacitor (FC) 517 is provided as an N-type region (N +) in the silicon substrate. The counter electrode 520 of the pixel internal capacitance (FC) 517 is connected to a power source and is supplied with an arbitrary power source voltage.
  • an overflow path may be provided so that a part of the charge accumulated in the photodiode 511 is moved.
  • an overflow path 555 is provided as a vertical N-type region (N ⁇ ) between the photodiode 511 and the counter electrode 520.
  • the overflow path is provided as an N-type region in the vertical direction between the photodiode 511 and the pixel internal capacitance (FC) 517 adjacent to the counter electrode 520 provided in the silicon substrate. Also good.
  • the pixel internal capacitance (FC) 517 when the pixel internal capacitance (FC) 517 is provided, the pixel internal capacitance (FC) 517 is provided on the element surface side, and at the same time, the pixel internal capacitance (FC) 517 is provided.
  • the counter electrode 520 is provided in the silicon substrate.
  • an overflow path 555 is directly provided in the vertical direction between the photodiode 511 and the counter electrode 520, and a power source or a high voltage equivalent thereto is applied to the counter electrode 520.
  • a power source or a high voltage equivalent thereto is applied to the counter electrode 520.
  • an overflow path is formed in the vertical direction between the photodiode 511 and the pixel internal capacitance (FC) 517 adjacent to the counter electrode 520 provided in the silicon substrate. And by applying a power supply or a high voltage equivalent thereto to the counter electrode 520, the charge overflowing from the photodiode 511 and the pixel internal capacitance (FC) 517 is absorbed (discharged) by the counter electrode 520. be able to.
  • CMOS image sensor 10 (FIG. 1) is mounted on a vehicle-mounted camera, it is possible to expand the dynamic range by effectively suppressing blooming, resulting in LED flicker and motion. It is possible to deal with subject artifacts.
  • the fifth embodiment has been described above.
  • the dynamic range depends on the amount of charge that can be accumulated in the pixel. In order to increase the amount of charge, it is necessary to enlarge the pixel area or increase the amount of accumulated charge per unit area.
  • FIG. 21 is a cross-sectional view showing the structure of a conventional pixel 900. Note that the lower surface of the cross section shown in FIG. 21 is a light incident surface, and light is incident from the lower side in the drawing.
  • a MOS capacitor 917 (capacitor electrode 917A) is provided on the embedded photodiode 911 as a conversion efficiency switching capacitor.
  • the pixel 900 includes a photodiode 911, a transfer transistor 912, a reset transistor 913, an amplification transistor 914, a selection transistor 915, a MOS capacitor 917, a conversion efficiency switching transistor 919, and a floating diffusion region (FD) 931.
  • the MOS capacitor 917 is an electrode (capacitor electrode 917A) provided on the embedded photodiode 911 and connected to the conversion efficiency switching transistor 919.
  • the conversion efficiency switching transistor 919 is a conversion efficiency switching switch, and performs an on / off operation according to the drive signal FDG applied to the gate to switch the capacitance of the floating diffusion region (FD) 931.
  • the low conversion efficiency and the high conversion efficiency can be switched according to the illuminance of the subject.
  • FIG. 22 is a timing chart for explaining the driving of the conventional pixel 900.
  • the drive signal SEL for the selection transistor 915 the drive signal FDG for the conversion efficiency switching transistor 919, the drive signal RST for the reset transistor 913, the reset drain (RD: Reset Drain) of the reset transistor 913, and the transfer A timing chart of a drive signal TGL for the transistor 912 is shown.
  • the timing chart of FIG. 22 shows an example of driving the pixel 900 in the case of low conversion efficiency. That is, at time t91, the drive signal FDG is set to H level, and the MOS capacitor 917 is connected to the floating diffusion region (FD) 931, whereby the capacitance of the floating diffusion region (FD) 931 increases and the conversion efficiency decreases.
  • the drive signal SEL and the drive signal RST are set to the H level, the target pixel 900 is selected, and the potential of the floating diffusion region (FD) 931 is reset to the H level of the reset drain (RD). The Thereby, the reset level can be read.
  • the drive signal TGL is set to H level, and the charge accumulated in the photodiode 911 is transferred to the floating diffusion region (FD) 931 via the transfer transistor 912. Thereby, the signal level can be read out. Then, signal generation is performed by performing correlated double sampling (CDS) using the reset level and the signal level.
  • CDS correlated double sampling
  • the drive signal SEL is set to the L level, and the target pixel 900 is in a non-selected state. Further, at time t94, the drive signal RST becomes H level again, the reset transistor 913 becomes conductive, and in this state, the reset drain (RD) is set to L level, so that the potential of the capacitor electrode 917A is increased. Can be L level.
  • the drive signal FDG becomes L level and the conversion efficiency switching transistor 919 becomes non-conductive, so that the potential of the capacitor electrode 917A in the exposure period can be kept at L level.
  • the drive signal TGL becomes the H level at the time t96 and the transfer transistor 912 becomes conductive, so that the floating diffusion region (FD) 931 Further, injection of charge into the photodiode 911 (backflowing charge) can be prevented.
  • FIG. 23 is a timing chart for explaining another driving of the conventional pixel 900.
  • FIG. 23 shows a timing chart of the drive signal SEL, the drive signal FDG, the drive signal RST, the reset drain (RD), and the drive signal TGL, as in FIG. Further, in FIG. 23, the section corresponding to the high brightness is represented by a high brightness section A surrounded by a one-dot chain line in the figure, and the section corresponding to the low brightness is represented by a two-dot chain line in the figure. This is indicated by a luminance section B.
  • the drive signal SEL is set to the H level, and the target pixel 900 is selected.
  • the drive signal FDG is constant at the H level
  • the MOS capacitor 917 is connected to the floating diffusion region (FD) 931, and the conversion efficiency is lowered.
  • the charge overflowing from the photodiode 911 to the floating diffusion region (FD) 931 is read first, so that the signal level at low conversion efficiency can be read.
  • the drive signal RST is set to the H level, and the potential of the floating diffusion region (FD) 931 is reset to the H level of the reset drain (RD). Thereby, the noise level (reset level) at low conversion efficiency can be read.
  • a large amount of charge generated in the photodiode 911 during the exposure period overcomes the potential below the gate electrode 912A and is configured by the floating diffusion region (FD) 931 and the MOS capacitor 917. Accumulated in capacity. Then, the FD potential generated by this charge accumulation is input to the amplification transistor 914, and a signal corresponding thereto is output to the vertical signal line 22 (FIG. 1) via the selection transistor 915.
  • FD floating diffusion region
  • the drive signal FDG is set to the L level
  • the floating diffusion region (FD) 931 is disconnected from the MOS capacitor 917, and the conversion efficiency is increased.
  • the drive signal RST is set to the H level
  • the potential of the floating diffusion region (FD) 931 is reset to the H level of the reset drain (RD).
  • the drive signal TGL is set to H level, and the charge accumulated in the photodiode 911 is transferred to the floating diffusion region (FD) 931 via the transfer transistor 912. Thereby, the signal level in high conversion efficiency can be read.
  • the charge accumulated in the photodiode 911 during the exposure period is transferred to the floating diffusion region (FD) 931 by the transfer transistor 912 and accumulated. Then, the FD potential generated by the charge accumulation is input to the amplification transistor 914, and a corresponding signal is output to the vertical signal line 22 (FIG. 1) via the selection transistor 915.
  • FD floating diffusion region
  • the charge overflowing the floating diffusion region (FD) 931 is read out first during the exposure period by performing the driving in the dynamic range expansion operation shown in FIG. While the high luminance signal is obtained, the dynamic range is expanded by reading out the charges accumulated in the photodiode 911 and obtaining the low luminance signal.
  • the conventional pixel 900 employs a structure in which the MOS capacitor 917 is provided for the photodiode 911.
  • the MOS capacitor 917 is provided for the photodiode 911.
  • the accumulated charge amount per unit area can be further increased by adopting a stacked structure of a photodiode and a MOS capacitor.
  • FIG. 24 is a cross-sectional view illustrating an example of the structure of the pixel 600 according to the sixth embodiment. Note that the lower surface of the cross section shown in FIG. 24 is a light incident surface, and light is incident from the lower side in the drawing.
  • a pixel 600 has a photodiode 611 as a photoelectric conversion element in a silicon substrate.
  • the photodiode 611 is formed by embedding an N-type layer 653 in a P-type well 651 in a silicon substrate.
  • the photodiode 611 generates and accumulates charges corresponding to the received light amount.
  • a drive signal TGL is applied to the gate electrode 612A, the photoelectric conversion is performed by the photodiode 611, and the electric charge accumulated therein is transferred to the floating diffusion region (FD) 631.
  • the floating diffusion region (FD) 631 is a charge-voltage conversion unit, and converts the charge transferred thereto into a voltage.
  • the drive signal RST is applied to the gate of the reset transistor 613.
  • the reset transistor 613 becomes conductive, and the potential of the floating diffusion region (FD) 631 is reset to a level corresponding to the reset drain (RD).
  • the amplification transistor 614 has a gate connected to the floating diffusion region (FD) 631, a drain connected to the power supply VDD, and an input of a readout circuit that reads a voltage signal held in the floating diffusion region (FD) 631.
  • the amplification transistor 614 has a source connected to the vertical signal line 22 (FIG. 1) via the selection transistor 615, so that a constant current source and a source follower circuit connected to one end of the vertical signal line 22 are connected.
  • the selection transistor 615 is connected between the amplification transistor 614 and the vertical signal line 22.
  • a drive signal SEL is applied to the gate of the selection transistor 615.
  • the selection transistor 615 is turned on and the pixel 600 is selected.
  • the signal amplified by the amplification transistor 614 is output to the vertical signal line 22 (FIG. 1) via the selection transistor 615.
  • the first capacitor electrode 617A-1 is provided on the element surface side with respect to the photodiode 611 provided in the silicon substrate.
  • the first capacitor electrode 617A-1 is connected to a potential fixing unit (VC) for fixing the potential of one end of the capacitor.
  • VC potential fixing unit
  • the material of the first capacitor electrode 617A-1 for example, polycrystalline silicon (poly-Si), platinum silicide (ptSi), nickel silicide (NiSi), or the like can be used.
  • an insulating film and a second capacitor electrode 617A-2 are stacked as an upper layer of the first capacitor electrode 617A-1.
  • the second capacitor electrode 617A-2 by connecting the second capacitor electrode 617A-2 to the diffusion layer 620 constituting the first MOS capacitor 617-1, the first MOS capacitor 617-1 (CAP1), the second MOS capacitor 617-2 (CAP2), and Are connected in parallel.
  • the diffusion layer 620 is provided in the silicon substrate as an N-type region (N +), and corresponds to the counter electrode (the counter electrode of the first capacitor electrode 617A-1) in the above-described embodiment.
  • the second capacitor electrode 617A-2 is connected to the floating diffusion region (FD) 631 through the conversion efficiency switching transistor 619.
  • the conversion efficiency switching transistor 619 is a conversion efficiency switching switch, and performs an on / off operation according to the drive signal FDG applied to the gate thereof to switch the capacitance of the floating diffusion region (FD) 631.
  • the low conversion efficiency and the high conversion efficiency can be switched according to the illuminance of the subject.
  • an SCL wiring 626 including a signal line is disposed on the second capacitor electrode 617A-2, and a pulse driving circuit configured as a part of the pulse driving circuit (for example, the vertical driving circuit 12 (FIG. 1)). Circuit).
  • the second capacitor electrode 617A-2 and the SCL wiring 626 are capacitively coupled by a CLC capacitor 627.
  • the material of the second capacitor electrode 617A-2 for example, polycrystalline silicon (poly-Si), tungsten (W), titanium (Ti), tantalum (Ta), aluminum (Al), copper (Cu), And the compound which has them as a main component, and the laminated film which combined them can be used.
  • the second capacitor electrode 617A-2 by forming the second capacitor electrode 617A-2 from a metal or a compound containing the same, visible light and near infrared light incident from the back surface side (light incident surface side) are reflected with high reflectance. Thus, the optical path length in silicon can be extended, and the quantum efficiency of the photodiode 611 can be improved. Note that the second capacitor electrode 617A-2 can also be formed in the same process as the light shielding film and the local wiring (in-pixel wiring).
  • the first capacitor electrode 617A-1 as the first conductive layer is provided on the side opposite to the light incident surface (element surface side) of the photodiode 611 provided in the semiconductor substrate.
  • Capacitances (CAP1, CAP2) including the second capacitor electrode 617A-2 as the second conductive layer are provided.
  • the charge generated by the photodiode 611 can be stored in the capacitance formed by the floating diffusion region (FD) 631, the first MOS capacitor 617-1, and the second MOS capacitor 617-2.
  • the amount of accumulated charges per hit can be increased.
  • the drive signal SEL for the selection transistor 615, the drive signal FDG for the conversion efficiency switching transistor 619, the drive signal RST for the reset transistor 613, the reset drain (RD) of the reset transistor 613, and the first capacitor electrode A timing chart of the potential VC at one end of 617A-1, the pulse signal SCL applied to the SCL wiring 626, and the drive signal TGL for the transfer transistor 612 is shown.
  • the section corresponding to the high brightness is represented by the high brightness section A surrounded by the one-dot chain line in the figure, and the section corresponding to the low brightness is shown in the figure. This is indicated by a low luminance section B surrounded by a two-dot chain line.
  • the drive signal SEL is set to the H level, and the target pixel 600 is selected.
  • the drive signal FDG is constant at the H level
  • the second MOS capacitor 617-2 is connected to the floating diffusion region (FD) 631, and the conversion efficiency is lowered. Further, at this time, the signal level in the low conversion efficiency can be read by reading the charge overflowing from the photodiode 611 to the floating diffusion region (FD) 631 first during the exposure period.
  • the drive signal RST is set to H level, and the potential of the floating diffusion region (FD) 631 is reset to H level. Thereby, the noise level (reset level) at low conversion efficiency can be read.
  • a large amount of charge generated in the photodiode 611 during the exposure period overcomes the potential below the gate electrode 612A, and the floating diffusion region (FD) 631, the first MOS capacitor 617-1, It is stored in a capacitor constituted by the second MOS capacitor 617-2. Then, the FD potential generated by the charge accumulation is input to the amplification transistor 614, and a signal corresponding thereto is output to the vertical signal line 22 (FIG. 1) via the selection transistor 615.
  • the drive signal FDG is set to the L level, the floating diffusion region (FD) 631 is disconnected from the MOS capacitor 617, and the conversion efficiency is increased.
  • the drive signal RST and the drive signal FDG are set to the H level, and the charges accumulated in the floating diffusion region (FD) 631, the first MOS capacitor 617-1 and the second MOS capacitor 617-2 are reset. .
  • the conversion efficiency switching transistor 619 becomes conductive, so that a pulse signal is applied to the SCL wiring 626 and the pulse signal SCL is set to H level.
  • the potential VC is also at the H level.
  • the FD potential at the time of reading can be boosted and stabilized, so that an increase in the FD potential can be reinforced. In this way, the noise level at high conversion efficiency can be read out.
  • the drive signal TGL is set to the H level, and the charge accumulated in the photodiode 611 is transferred to the floating diffusion region (FD) 631 through the transfer transistor 612. Thereby, the signal level in high conversion efficiency can be read.
  • the charge accumulated in the photodiode 611 during the exposure period is transferred to the floating diffusion region (FD) 631 and accumulated by the transfer transistor 612. Then, the FD potential generated by the charge accumulation is input to the amplification transistor 614, and a corresponding signal is output to the vertical signal line 22 (FIG. 1) via the selection transistor 615.
  • FD floating diffusion region
  • the charge overflowing in the floating diffusion region (FD) 631 is first generated during the exposure period by performing the driving in the dynamic range expansion operation illustrated in FIG. In this way, a high luminance signal is obtained, and thereafter, the charge accumulated in the photodiode 611 is read out to obtain a low luminance signal, thereby expanding the dynamic range. ing.
  • capacitors (CAP1, CAP2) in which the first MOS capacitor 617-1 and the second MOS capacitor 617-2 are stacked are provided on the element surface side of the photodiode 611 provided in the silicon substrate. Compared to the conventional pixel 900, the amount of accumulated charge per unit area can be increased.
  • the boosted potential of the floating diffusion region (FD) 631 is lowered by the on-resistance of the reset transistor 613 and the resistance of the wiring connecting the reset drain (RD) to the power supply.
  • the boosting of the floating diffusion region (FD) 631 can be accelerated by the fluctuation of the potential of the SCL wiring 626 made of a signal line.
  • the pixel 600 has the above-described structure, so that the dynamic range is improved, LED blinking (signals, traffic signs, automobile display devices, etc.) different from vision is suppressed, or the pixel pitch is reduced.
  • LED blinking signals, traffic signs, automobile display devices, etc.
  • Each or at least two or more can be realized at the same time by increasing the number or reducing the size of the camera.
  • LEDs Light Emitting Diodes
  • LEDs Light Emitting Diodes
  • current solid-state image sensors turn off or blink.
  • images that repeat are obtained. This phenomenon occurs because the LED emits pulses with a short period that cannot be visually followed in order to increase the luminous efficiency of the LED.
  • CMOS image sensor 10 (FIG. 1) having the pixel array unit 11 in which the pixels 600 are arranged, it is possible to solve various problems that the current solid-state imaging device has. .
  • FIG. 26 is a cross-sectional view illustrating an example of the structure of the pixel 700 according to the seventh embodiment.
  • FIG. 27 is a plan view illustrating an example of the structure of the pixel 700 according to the seventh embodiment.
  • FIG. 26 shows a cross section taken along the line AA ′ of the pixel 700 shown in FIG.
  • a pixel 700 has a high-sensitivity first photodiode 711-1 and a low-sensitivity second photodiode 711-2 as photoelectric conversion elements in a silicon substrate.
  • the first photodiode 711-1 and the second photodiode 711-2 are formed, for example, by embedding N-type layers 753-1 and 753-2 in a P-type well 751 in the silicon substrate.
  • a drive signal TGL is applied to the gate electrode 712A-1, photoelectrically converted by the first photodiode 711-1, and the charge accumulated therein is transferred to the floating diffusion region (FD) 731.
  • a drive signal TGS is applied to the gate electrode 712A-2, photoelectric conversion is performed by the second photodiode 711-2, and electric charges accumulated therein are transferred to the floating diffusion region (FD) 731.
  • the floating diffusion region (FD) 731 is a charge-voltage converter, and converts the charge transferred thereto into a voltage.
  • the drive signal RST applied to the gate of the reset transistor 713 becomes H level, the potential of the floating diffusion region (FD) 731 is reset to a level corresponding to the reset drain (RD).
  • the amplification transistor 714 has a gate connected to the floating diffusion region (FD) 731, a drain connected to the power supply VDD, and a readout circuit (source for reading a voltage signal held in the floating diffusion region (FD) 731. This is the input part of the follower circuit.
  • the pixel 700 is selected.
  • the signal amplified by the amplification transistor 714 is output to the vertical signal line 22 (FIG. 1) via the selection transistor 715.
  • the first capacitor electrode 717A-1 is provided on the element surface side with respect to the first photodiode 711-1 provided in the silicon substrate.
  • the first capacitor electrode 717A-1 is connected to a potential fixing unit (VC) for fixing the potential of one end of the capacitor.
  • VC potential fixing unit
  • the material of the first capacitor electrode 617A-1 for example, polycrystalline silicon (poly-Si) can be used.
  • the insulating film and the second capacitor electrode 717A-2 are stacked as an upper layer of the first capacitor electrode 717A-1.
  • the second capacitor electrode 717A-2 by connecting the second capacitor electrode 717A-2 to the diffusion layer 720 constituting the first MOS capacitor 717-1, the first MOS capacitor 717-1 and the second MOS capacitor 717-2 are connected in parallel. Yes.
  • the second capacitor electrode 717A-2 is connected to the floating diffusion region (FD) 731 via the conversion efficiency switching transistor 719.
  • the conversion efficiency switching transistor 719 performs on / off operation according to the drive signal FDG applied to the gate thereof, and switches the capacitance of the floating diffusion region (FD) 731, thereby reducing the low conversion efficiency and the high conversion efficiency. Can be switched.
  • an SCL wiring 726 made of a signal line is disposed above the second capacitor electrode 717A-2 and connected to a pulse driving circuit.
  • the SCL wiring 726 is capacitively coupled to the second capacitor electrode 717A-2 by the CLC capacitor 727.
  • the material of the second capacitor electrode 717A-2 for example, polycrystalline silicon (poly-Si), tungsten (W), titanium (Ti), tantalum (Ta), aluminum (Al), copper (Cu), And the compound which has them as a main component, and the laminated film which combined them can be used.
  • Capacitors including a first capacitor electrode 717A-1 as a first conductive layer and a second capacitor electrode 717A-2 as a second conductive layer are provided on the element surface side. .
  • the saturation charge amount of the second photodiode 711-2 is stacked.
  • the capacitance can be increased by the first capacitor electrode 717A-1 and the second capacitor electrode 717A-2.
  • the boosting of the FD potential can be enhanced by applying a pulse signal to the SCL wiring 726 that is capacitively coupled to the second capacitor electrode 717A-2.
  • the seventh embodiment has been described above.
  • each may be established as a single embodiment, and may employ a form in which all or some of a plurality of embodiments are combined within a possible range.
  • the voltage applied to the counter electrode 320 (420, 520) can be varied by combining the second embodiment with the third to fifth embodiments described above, for example, The voltage FCVDD applied to the counter electrode 320 (420, 520) may be switched between the shutter period, the readout period, and the accumulation period.
  • the voltage applied to the counter electrode 320 (420, 520) is a constant voltage by combining the first embodiment with the third to fifth embodiments described above. You may make it fix with.
  • the present technology is not limited to application to a solid-state imaging device that detects the distribution of the amount of incident light of visible light and captures it as an image, but a solid-state that captures the distribution of the incident amount of infrared rays, X-rays, or particles as an image. Applicable to all imaging devices.
  • FIG. 28 is a block diagram illustrating a configuration example of an electronic apparatus having a solid-state imaging device to which the technology according to the present disclosure is applied.
  • the electronic device 1000 is an electronic device such as an imaging device such as a digital still camera or a video camera, or a mobile terminal device such as a smartphone or a tablet terminal.
  • an imaging device such as a digital still camera or a video camera
  • a mobile terminal device such as a smartphone or a tablet terminal.
  • the electronic device 1000 includes a solid-state imaging device 1001, a DSP circuit 1002, a frame memory 1003, a display unit 1004, a recording unit 1005, an operation unit 1006, and a power supply unit 1007.
  • the DSP circuit 1002, the frame memory 1003, the display unit 1004, the recording unit 1005, the operation unit 1006, and the power supply unit 1007 are connected to each other via a bus line 1008.
  • the solid-state imaging device 1001 corresponds to the above-described CMOS image sensor 10 (FIG. 1), and the first to fifth embodiments described above are used as pixels that are two-dimensionally arranged in the pixel array section. Any of the pixels 100 to 500 shown in the embodiment can be provided.
  • the DSP circuit 1002 is a camera signal processing circuit that processes a signal supplied from the solid-state imaging device 1001.
  • the DSP circuit 1002 outputs image data obtained by processing a signal from the solid-state imaging device 1001.
  • the frame memory 1003 temporarily holds the image data processed by the DSP circuit 1002 in units of frames.
  • the display unit 1004 includes, for example, a panel type display device such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and displays a moving image or a still image captured by the solid-state imaging device 1001.
  • the recording unit 1005 records moving image or still image data captured by the solid-state imaging device 1001 on a recording medium such as a semiconductor memory or a hard disk.
  • the operation unit 1006 outputs operation commands for various functions of the electronic device 1000 in accordance with user operations.
  • the power supply unit 1007 appropriately supplies various power sources serving as operation power sources for the DSP circuit 1002, the frame memory 1003, the display unit 1004, the recording unit 1005, and the operation unit 1006 to these supply targets.
  • the electronic device 1000 is configured as described above.
  • the present technology is applied to the solid-state imaging device 1001.
  • the CMOS image sensor 10 (FIG. 1) can be applied to the solid-state imaging device 1001.
  • the pixel capacitance is set on the side opposite to the light incident surface of the photoelectric conversion element provided in the silicon substrate with respect to the pixels arranged in a two-dimensional manner in the pixel array unit. Blooming can be effectively suppressed by providing the counter electrode having the intra-pixel capacitance in the silicon substrate.
  • FIG. 29 is a diagram illustrating a usage example of the solid-state imaging device to which the technology according to the present disclosure is applied.
  • the CMOS image sensor 10 (FIG. 1) can be used in various cases for sensing light such as visible light, infrared light, ultraviolet light, and X-ray as follows. That is, as shown in FIG. 29, not only in the field of appreciation for taking images for appreciation, but also in the field of transportation, the field of consumer electronics, the field of medical / healthcare, the field of security, The CMOS image sensor 10 can also be used in a device used in the field, the field of sports, the field of agriculture, or the like.
  • a device for taking an image provided for viewing such as a digital camera, a smartphone, or a mobile phone with a camera function (for example, the electronic device 1000 in FIG. 28).
  • the CMOS image sensor 10 can be used.
  • CMOS image sensor 10 can be used in a device used for traffic such as a surveillance camera and a distance measuring sensor for measuring distance between vehicles.
  • a CMOS image sensor 10 is a device used for home appliances such as a television receiver, a refrigerator, and an air conditioner in order to photograph a user's gesture and perform device operations in accordance with the gesture. Can be used. Further, in the medical / healthcare field, for example, the CMOS image sensor 10 is used in a device used for medical or health care such as an endoscope or a blood vessel photographing device by receiving infrared light. can do.
  • the CMOS image sensor 10 can be used in a security device such as a security camera or a personal authentication camera.
  • the CMOS image sensor 10 can be used in a device used for beauty, such as a skin measuring device for photographing skin and a microscope for photographing the scalp.
  • the CMOS image sensor 10 can be used in devices used for sports such as action cameras and wearable cameras for sports applications.
  • the CMOS image sensor 10 can be used in an apparatus provided for agriculture, such as a camera for monitoring the state of fields and crops.
  • FIG. 30 is a diagram illustrating an outline of a configuration example of a stacked solid-state imaging device to which the technology according to the present disclosure can be applied.
  • the solid-state imaging device 23010 includes a single die (semiconductor substrate) 23011 as illustrated in FIG.
  • the die 23011 is mounted with a pixel region 23012 in which pixels are arranged in an array, a control circuit 23013 for driving the pixel and other various controls, and a logic circuit 23014 for signal processing.
  • the solid-state imaging device 23020 is configured as a single semiconductor chip in which two dies, a sensor die 23021 and a logic die 23024, are stacked and electrically connected.
  • the sensor die 23021 has a pixel region 23012 and a control circuit 23013 mounted thereon, and the logic die 23024 has a logic circuit 23014 including a signal processing circuit for performing signal processing.
  • the pixel region 23012 is mounted on the sensor die 23021, and the control circuit 23013 and the logic circuit 23014 are mounted on the logic die 23024.
  • FIG. 31 is a cross-sectional view illustrating a first configuration example of a stacked solid-state imaging device 23020.
  • a PD photodiode
  • an FD floating diffusion
  • a Tr MOS FET
  • a Tr serving as a control circuit 23013 are formed.
  • a wiring layer 23101 having a plurality of layers, in this example, three layers of wirings 23110 is formed on the sensor die 23021.
  • the control circuit 23013 (being Tr) can be configured in the logic die 23024 instead of the sensor die 23021.
  • a Tr constituting the logic circuit 23014 is formed. Further, the logic die 23024 is formed with a wiring layer 23161 including a plurality of layers 23170 in this example. In addition, a connection hole 23171 having an insulating film 23172 formed on the inner wall surface is formed in the logic die 23024, and a connection conductor 23173 connected to the wiring 23170 and the like is embedded in the connection hole 23171.
  • the sensor die 23021 and the logic die 23024 are bonded together so that the wiring layers 23101 and 23161 face each other, thereby forming a stacked type solid-state imaging device 23020 in which the sensor die 23021 and the logic die 23024 are stacked.
  • a film 23191 such as a protective film is formed on a surface where the sensor die 23021 and the logic die 23024 are bonded.
  • connection hole 23111 is formed which penetrates the sensor die 23021 from the back surface side (side where light enters the PD) (upper side) of the sensor die 23021 and reaches the uppermost wiring 23170 of the logic die 23024.
  • a connection hole 23121 is formed in the sensor die 23021 in the vicinity of the connection hole 23111 so as to reach the first layer wiring 23110 from the back surface side of the sensor die 23021.
  • An insulating film 23112 is formed on the inner wall surface of the connection hole 23111, and an insulating film 23122 is formed on the inner wall surface of the connection hole 23121.
  • Connection conductors 23113 and 23123 are embedded in the connection holes 23111 and 23121, respectively.
  • connection conductor 23113 and the connection conductor 23123 are electrically connected on the back side of the sensor die 23021, whereby the sensor die 23021 and the logic die 23024 are connected to the wiring layer 23101, the connection hole 23121, the connection hole 23111, and the wiring layer. It is electrically connected through 23161.
  • FIG. 32 is a cross-sectional view illustrating a second configuration example of the stacked solid-state imaging device 23020.
  • the sensor die 23021 (the wiring layer 23101 (the wiring 23110)) and the logic die 23024 (the wiring layer 23161 (the wiring thereof) are formed by one connection hole 23211 formed in the sensor die 23021. 23170)) are electrically connected.
  • connection hole 23211 is formed so as to penetrate the sensor die 23021 from the back side of the sensor die 23021 to reach the uppermost layer wiring 23170 of the logic die 23024 and to reach the uppermost layer wiring 23110 of the sensor die 23021. Is done.
  • An insulating film 23212 is formed on the inner wall surface of the connection hole 23211, and a connection conductor 23213 is embedded in the connection hole 23211.
  • the sensor die 23021 and the logic die 23024 are electrically connected by the two connection holes 23111 and 23121.
  • the sensor die 23021 and the logic die 23024 are connected by the one connection hole 23211. Electrically connected.
  • FIG. 33 is a cross-sectional view showing a third configuration example of the stacked solid-state imaging device 23020.
  • the solid-state imaging device 23020 in FIG. 33 has a surface on which the sensor die 23021 and the logic die 23024 are bonded to each other in that a film 23191 such as a protective film is not formed on the surface on which the sensor die 23021 and the logic die 23024 are bonded. This is different from the case of FIG. 31 in which a film 23191 such as a protective film is formed.
  • the solid-state imaging device 23020 in FIG. 33 is configured by superimposing the sensor die 23021 and the logic die 23024 so that the wirings 23110 and 23170 are in direct contact with each other, heating them while applying a required weight, and directly joining the wirings 23110 and 23170. Composed.
  • FIG. 34 is a cross-sectional view illustrating another configuration example of the stacked solid-state imaging device to which the technology according to the present disclosure can be applied.
  • the solid-state imaging device 23401 has a three-layer stacked structure in which three dies of a sensor die 23411, a logic die 23412, and a memory die 23413 are stacked.
  • the memory die 23413 includes, for example, a memory circuit that stores data temporarily necessary for signal processing performed by the logic die 23412.
  • the logic die 23412 and the memory die 23413 are stacked in that order under the sensor die 23411. 23411 can be laminated.
  • the sensor die 23411 is formed with a PD serving as a photoelectric conversion unit of the pixel and a source / drain region of the pixel Tr.
  • a gate electrode is formed around the PD via a gate insulating film, and a pixel Tr 23421 and a pixel Tr 23422 are formed by a source / drain region paired with the gate electrode.
  • a pixel Tr 23421 adjacent to the PD is a transfer Tr, and one of a pair of source / drain regions constituting the pixel Tr 23421 is an FD.
  • an interlayer insulating film is formed in the sensor die 23411, and a connection hole is formed in the interlayer insulating film.
  • a connection hole is formed in the interlayer insulating film.
  • a wiring layer 23433 having a plurality of layers of wirings 23432 connected to the respective connection conductors 23431 is formed in the sensor die 23411.
  • an aluminum pad 23434 serving as an electrode for external connection is formed in the lowermost layer of the wiring layer 23433 of the sensor die 23411.
  • the aluminum pad 23434 is formed at a position closer to the bonding surface 23440 with the logic die 23412 than to the wiring 23432.
  • the aluminum pad 23434 is used as one end of wiring related to signal input / output with the outside.
  • a contact 23441 used for electrical connection with the logic die 23412 is formed on the sensor die 23411.
  • the contact 23441 is connected to the contact 23451 of the logic die 23412 and is also connected to the aluminum pad 23442 of the sensor die 23411.
  • a pad hole 23443 is formed so as to reach the aluminum pad 23442 from the back side (upper side) of the sensor die 23411.
  • the technology according to the present disclosure can be applied to the solid-state imaging device as described above.
  • the technology (this technology) according to the present disclosure can be applied to various products.
  • the technology according to the present disclosure is realized as a device that is mounted on any type of mobile body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, and a robot. May be.
  • FIG. 35 is a block diagram illustrating a schematic configuration example of a vehicle control system that is an example of a mobile control system to which the technology according to the present disclosure can be applied.
  • the vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001.
  • the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside information detection unit 12030, an in-vehicle information detection unit 12040, and an integrated control unit 12050.
  • a microcomputer 12051, a sound image output unit 12052, and an in-vehicle network I / F (Interface) 12053 are illustrated as a functional configuration of the integrated control unit 12050.
  • the drive system control unit 12010 controls the operation of the device related to the drive system of the vehicle according to various programs.
  • the drive system control unit 12010 includes a driving force generator for generating a driving force of a vehicle such as an internal combustion engine or a driving motor, a driving force transmission mechanism for transmitting the driving force to wheels, and a steering angle of the vehicle. It functions as a control device such as a steering mechanism that adjusts and a braking device that generates a braking force of the vehicle.
  • the body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs.
  • the body system control unit 12020 functions as a keyless entry system, a smart key system, a power window device, or a control device for various lamps such as a headlamp, a back lamp, a brake lamp, a blinker, or a fog lamp.
  • the body control unit 12020 can be input with radio waves transmitted from a portable device that substitutes for a key or signals from various switches.
  • the body system control unit 12020 receives input of these radio waves or signals, and controls a door lock device, a power window device, a lamp, and the like of the vehicle.
  • the vehicle outside information detection unit 12030 detects information outside the vehicle on which the vehicle control system 12000 is mounted.
  • the imaging unit 12031 is connected to the vehicle exterior information detection unit 12030.
  • the vehicle exterior information detection unit 12030 causes the imaging unit 12031 to capture an image outside the vehicle and receives the captured image.
  • the vehicle outside information detection unit 12030 may perform an object detection process or a distance detection process such as a person, a car, an obstacle, a sign, or a character on a road surface based on the received image.
  • the imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of received light.
  • the imaging unit 12031 can output an electrical signal as an image, or can output it as distance measurement information. Further, the light received by the imaging unit 12031 may be visible light or invisible light such as infrared rays.
  • the vehicle interior information detection unit 12040 detects vehicle interior information.
  • a driver state detection unit 12041 that detects a driver's state is connected to the in-vehicle information detection unit 12040.
  • the driver state detection unit 12041 includes, for example, a camera that images the driver, and the vehicle interior information detection unit 12040 determines the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041. It may be calculated or it may be determined whether the driver is asleep.
  • the microcomputer 12051 calculates a control target value of the driving force generator, the steering mechanism, or the braking device based on the information inside / outside the vehicle acquired by the vehicle outside information detection unit 12030 or the vehicle interior information detection unit 12040, and the drive system control unit A control command can be output to 12010.
  • the microcomputer 12051 realizes ADAS (Advanced Driver Assistance System) functions including vehicle collision avoidance or impact mitigation, following traveling based on inter-vehicle distance, vehicle speed maintenance traveling, vehicle collision warning, or vehicle lane departure warning. It is possible to perform cooperative control for the purpose.
  • ADAS Advanced Driver Assistance System
  • the microcomputer 12051 controls the driving force generator, the steering mechanism, the braking device, and the like based on the information around the vehicle acquired by the vehicle exterior information detection unit 12030 or the vehicle interior information detection unit 12040. It is possible to perform cooperative control for the purpose of automatic driving that autonomously travels without depending on the operation.
  • the microcomputer 12051 can output a control command to the body system control unit 12030 based on information outside the vehicle acquired by the vehicle outside information detection unit 12030.
  • the microcomputer 12051 controls the headlamp according to the position of the preceding vehicle or the oncoming vehicle detected by the outside information detection unit 12030, and performs cooperative control for the purpose of anti-glare, such as switching from a high beam to a low beam. It can be carried out.
  • the sound image output unit 12052 transmits an output signal of at least one of sound and image to an output device capable of visually or audibly notifying information to a vehicle occupant or the outside of the vehicle.
  • an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are illustrated as output devices.
  • the display unit 12062 may include at least one of an on-board display and a head-up display, for example.
  • FIG. 36 is a diagram illustrating an example of an installation position of the imaging unit 12031.
  • the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.
  • the imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as a front nose, a side mirror, a rear bumper, a back door, and an upper part of a windshield in the vehicle interior of the vehicle 12100.
  • the imaging unit 12101 provided in the front nose and the imaging unit 12105 provided in the upper part of the windshield in the vehicle interior mainly acquire an image in front of the vehicle 12100.
  • the imaging units 12102 and 12103 provided in the side mirror mainly acquire an image of the side of the vehicle 12100.
  • the imaging unit 12104 provided in the rear bumper or the back door mainly acquires an image behind the vehicle 12100.
  • the imaging unit 12105 provided on the upper part of the windshield in the passenger compartment is mainly used for detecting a preceding vehicle or a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, or the like.
  • FIG. 36 shows an example of the shooting range of the imaging units 12101 to 12104.
  • the imaging range 12111 indicates the imaging range of the imaging unit 12101 provided in the front nose
  • the imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided in the side mirrors, respectively
  • the imaging range 12114 The imaging range of the imaging part 12104 provided in the rear bumper or the back door is shown. For example, by superimposing the image data captured by the imaging units 12101 to 12104, an overhead image when the vehicle 12100 is viewed from above is obtained.
  • At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information.
  • at least one of the imaging units 12101 to 12104 may be a stereo camera including a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.
  • the microcomputer 12051 based on the distance information obtained from the imaging units 12101 to 12104, the distance to each three-dimensional object in the imaging range 12111 to 12114 and the temporal change in this distance (relative speed with respect to the vehicle 12100).
  • a solid object that travels at a predetermined speed (for example, 0 km / h or more) in the same direction as the vehicle 12100, particularly the closest three-dimensional object on the traveling path of the vehicle 12100. it can.
  • the microcomputer 12051 can set an inter-vehicle distance to be secured in advance before the preceding vehicle, and can perform automatic brake control (including follow-up stop control), automatic acceleration control (including follow-up start control), and the like.
  • automatic brake control including follow-up stop control
  • automatic acceleration control including follow-up start control
  • cooperative control for the purpose of autonomous driving or the like autonomously traveling without depending on the operation of the driver can be performed.
  • the microcomputer 12051 converts the three-dimensional object data related to the three-dimensional object to other three-dimensional objects such as a two-wheeled vehicle, a normal vehicle, a large vehicle, a pedestrian, and a utility pole based on the distance information obtained from the imaging units 12101 to 12104. It can be classified and extracted and used for automatic avoidance of obstacles.
  • the microcomputer 12051 identifies obstacles around the vehicle 12100 as obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see.
  • the microcomputer 12051 determines the collision risk indicating the risk of collision with each obstacle, and when the collision risk is equal to or higher than the set value and there is a possibility of collision, the microcomputer 12051 is connected via the audio speaker 12061 or the display unit 12062. By outputting an alarm to the driver and performing forced deceleration or avoidance steering via the drive system control unit 12010, driving assistance for collision avoidance can be performed.
  • At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays.
  • the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the captured images of the imaging units 12101 to 12104. Such pedestrian recognition is, for example, whether or not the user is a pedestrian by performing a pattern matching process on a sequence of feature points indicating the outline of an object and a procedure for extracting feature points in the captured images of the imaging units 12101 to 12104 as infrared cameras. It is carried out by the procedure for determining.
  • the audio image output unit 12052 When the microcomputer 12051 determines that there is a pedestrian in the captured images of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio image output unit 12052 has a rectangular contour line for emphasizing the recognized pedestrian.
  • the display unit 12062 is controlled so as to be superimposed and displayed.
  • voice image output part 12052 may control the display part 12062 so that the icon etc. which show a pedestrian may be displayed on a desired position.
  • the technology according to the present disclosure can be applied to the imaging unit 12031 among the configurations described above.
  • the CMOS image sensor 10 in FIG. 1 can be applied to the imaging unit 12031.
  • blooming can be effectively suppressed. For example, it is possible to deal with LED flicker by expanding the dynamic range.
  • the technology (this technology) according to the present disclosure can be applied to various products.
  • the technology according to the present disclosure may be applied to an endoscopic surgery system.
  • FIG. 37 is a block diagram illustrating an example of a schematic configuration of a patient in-vivo information acquisition system using a capsule endoscope to which the technology (present technology) according to the present disclosure can be applied.
  • the in-vivo information acquisition system 10001 includes a capsule endoscope 10100 and an external control device 10200.
  • the capsule endoscope 10100 is swallowed by the patient at the time of examination.
  • the capsule endoscope 10100 has an imaging function and a wireless communication function, and moves inside the organ such as the stomach and the intestine by peristaltic motion or the like until it is spontaneously discharged from the patient.
  • Images (hereinafter also referred to as in-vivo images) are sequentially captured at predetermined intervals, and information about the in-vivo images is sequentially wirelessly transmitted to the external control device 10200 outside the body.
  • the external control device 10200 comprehensively controls the operation of the in-vivo information acquisition system 10001. Further, the external control device 10200 receives information about the in-vivo image transmitted from the capsule endoscope 10100 and, based on the received information about the in-vivo image, displays the in-vivo image on the display device (not shown). The image data for displaying is generated.
  • an in-vivo image obtained by imaging the inside of the patient's body can be obtained at any time in this manner until the capsule endoscope 10100 is swallowed and discharged.
  • the capsule endoscope 10100 includes a capsule-type casing 10101.
  • a light source unit 10111 In the casing 10101, a light source unit 10111, an imaging unit 10112, an image processing unit 10113, a wireless communication unit 10114, a power supply unit 10115, and a power supply unit 10116 and the control unit 10117 are stored.
  • the light source unit 10111 is composed of a light source such as an LED (Light Emitting Diode), for example, and irradiates the imaging field of the imaging unit 10112 with light.
  • a light source such as an LED (Light Emitting Diode), for example, and irradiates the imaging field of the imaging unit 10112 with light.
  • the image capturing unit 10112 includes an image sensor and an optical system including a plurality of lenses provided in front of the image sensor. Reflected light (hereinafter referred to as observation light) of light irradiated on the body tissue to be observed is collected by the optical system and enters the image sensor. In the imaging unit 10112, in the imaging element, the observation light incident thereon is photoelectrically converted, and an image signal corresponding to the observation light is generated. The image signal generated by the imaging unit 10112 is provided to the image processing unit 10113.
  • the image processing unit 10113 is configured by a processor such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit), and performs various signal processing on the image signal generated by the imaging unit 10112.
  • the image processing unit 10113 provides the radio communication unit 10114 with the image signal subjected to signal processing as RAW data.
  • the wireless communication unit 10114 performs predetermined processing such as modulation processing on the image signal that has been subjected to signal processing by the image processing unit 10113, and transmits the image signal to the external control apparatus 10200 via the antenna 10114A.
  • the wireless communication unit 10114 receives a control signal related to drive control of the capsule endoscope 10100 from the external control device 10200 via the antenna 10114A.
  • the wireless communication unit 10114 provides a control signal received from the external control device 10200 to the control unit 10117.
  • the power feeding unit 10115 includes a power receiving antenna coil, a power regeneration circuit that regenerates power from a current generated in the antenna coil, a booster circuit, and the like. In the power feeding unit 10115, electric power is generated using a so-called non-contact charging principle.
  • the power supply unit 10116 is composed of a secondary battery, and stores the electric power generated by the power supply unit 10115.
  • FIG. 37 in order to avoid complication of the drawing, illustration of an arrow or the like indicating a power supply destination from the power supply unit 10116 is omitted, but power stored in the power supply unit 10116 is stored in the light source unit 10111.
  • the imaging unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the control unit 10117 can be used for driving them.
  • the control unit 10117 includes a processor such as a CPU, and a control signal transmitted from the external control device 10200 to drive the light source unit 10111, the imaging unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the power feeding unit 10115. Control accordingly.
  • a processor such as a CPU
  • the external control device 10200 is configured by a processor such as a CPU or GPU, or a microcomputer or a control board in which a processor and a storage element such as a memory are mounted.
  • the external control device 10200 controls the operation of the capsule endoscope 10100 by transmitting a control signal to the control unit 10117 of the capsule endoscope 10100 via the antenna 10200A.
  • the capsule endoscope 10100 for example, the light irradiation condition for the observation target in the light source unit 10111 can be changed by a control signal from the external control device 10200.
  • an imaging condition for example, a frame rate or an exposure value in the imaging unit 10112
  • a control signal from the external control device 10200 can be changed by a control signal from the external control device 10200.
  • the contents of processing in the image processing unit 10113 and the conditions (for example, the transmission interval, the number of transmission images, etc.) by which the wireless communication unit 10114 transmits an image signal may be changed by a control signal from the external control device 10200. .
  • the external control device 10200 performs various image processing on the image signal transmitted from the capsule endoscope 10100, and generates image data for displaying the captured in-vivo image on the display device.
  • image processing for example, development processing (demosaic processing), high image quality processing (band enhancement processing, super-resolution processing, NR (Noise reduction) processing and / or camera shake correction processing, etc.), and / or enlargement processing ( Various signal processing such as electronic zoom processing can be performed.
  • the external control device 10200 controls driving of the display device to display an in-vivo image captured based on the generated image data.
  • the external control device 10200 may cause the generated image data to be recorded on a recording device (not shown) or may be printed out on a printing device (not shown).
  • the technology according to the present disclosure can be applied to the imaging unit 10112 among the configurations described above.
  • the CMOS image sensor 10 in FIG. 1 can be applied to the imaging unit 10112. Since the blooming can be effectively suppressed by applying the technology according to the present disclosure to the imaging unit 10112, for example, a clearer surgical part image can be obtained by expanding the dynamic range. The accuracy can be improved.
  • the present technology can take the following configurations.
  • the solid-state imaging device wherein the pixel is provided with a pixel internal capacitance on a side opposite to a light incident surface of a photoelectric conversion element provided in the semiconductor substrate, and a counter electrode of the pixel internal capacitance is provided in the semiconductor substrate.
  • the solid-state imaging device described.
  • the solid-state imaging device according to any one of (1) to (3), wherein a constant voltage is applied to the counter electrode.
  • the counter electrode includes a first period that is a shutter driving period, a second period that is a period for reading out the charges generated by the photoelectric conversion elements, and a third period that is a period for accumulating the charges.
  • the solid-state imaging device wherein the voltage applied to is different.
  • the pixel is A first photoelectric conversion element; A second photoelectric conversion element different from the first photoelectric conversion element, The solid-state imaging device according to (3), wherein the overflow path is directly provided between one photoelectric conversion element and the counter electrode.
  • the first photoelectric conversion element is more sensitive than the second photoelectric conversion element, The solid-state imaging device according to (7), wherein the overflow path is directly provided between the first photoelectric conversion element and the counter electrode.
  • the pixel is A first transfer transistor for transferring a charge generated by the photoelectric conversion element in response to a first drive signal; A charge-voltage converter for converting charge into voltage; A reset transistor that resets the charge-voltage converter in response to a second drive signal; An amplification transistor for amplifying the signal converted by the charge-voltage conversion unit; A selection transistor for applying a signal from the amplification transistor to a vertical signal line in response to a third drive signal; In accordance with a fourth drive signal, a second transfer transistor that couples the charge-voltage converter and the potential of the pixel capacitance; A third transfer transistor connected between the second transfer transistor and the charge-voltage converter and driven in accordance with a fifth drive signal.
  • the method according to any one of (1) to (12).
  • Solid-state imaging device (14) The solid drive according to (13), wherein a signal for generating a plurality of images that are the basis of a composite image is obtained by controlling the driving of the transistor by the first driving signal to the fifth driving signal. Imaging device. (15) The solid-state imaging device according to any one of (1) to (14), wherein the solid-state imaging device is a backside illumination type CMOS (Complementary Metal Oxide Semiconductor) image sensor.
  • CMOS Complementary Metal Oxide Semiconductor
  • the pixel has a pixel internal capacitor on the side opposite to the light incident surface of the photoelectric conversion element provided in the semiconductor substrate, and a solid-state imaging device in which a counter electrode of the pixel internal capacitor is provided in the semiconductor substrate.
  • Electronic equipment 17.
  • the pixel includes a capacitor including a stacked first conductive layer and second conductive layer on a side opposite to a light incident surface of a photoelectric conversion element provided in a semiconductor substrate.
  • the second conductive layer is capacitively coupled to a signal line to which a pulse signal is applied,
  • the solid-state imaging device according to (17) wherein the boosting of the potential in the charge-voltage conversion unit that converts the charge generated by the photoelectric conversion element into a voltage is accelerated according to a change in the potential of the signal line.
  • the charge generated by the photoelectric conversion element is accumulated in a charge-voltage conversion unit that converts the charge into a voltage, and a capacitor that includes the first conductive layer and the second conductive layer (17) or ( The solid-state imaging device according to 18).
  • the pixel is A first photoelectric conversion element; A second photoelectric conversion element different from the first photoelectric conversion element,
  • the solid-state imaging device according to any one of (17) to (19), wherein a capacitor including the first conductive layer and the second conductive layer is provided for one photoelectric conversion element.
  • CMOS image sensor 10 CMOS image sensor, 11 pixel array section, 12 vertical drive circuit, 21 pixel drive line, 22 vertical signal line, 100 pixel, 111 photodiode (PD), 112 transfer transistor, 113 reset transistor, 114 amplification transistor, 115 selection transistor , 116 junction transistor, 117 internal capacitance (FC), 118 FC connection transistor, 119 conversion efficiency switching transistor, 120 counter electrode, 131 floating diffusion area (FD), 155 overflow path, 200 pixels, 217 internal capacitance ( FC), 220 counter electrode, 300 pixels, 316 junction transistor, 317 pixel internal capacitance (FC), 320 counter electrode, 355 Overflow path, 400 pixels, 411-1 first photodiode (LPD), 411-2 second photodiode (SPD), 412-1 first transfer transistor, 412-2 second transfer transistor, 417 pixel capacitance (FC ), 420 counter electrode, 455 overflow path, 500 pixels, 517 pixel internal capacitance (FC), 520 counter electrode, 522 memory unit, 600 pixels, 611

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Abstract

La présente invention concerne un dispositif d'imagerie à semi-conducteurs et un appareil électronique qui peuvent supprimer efficacement l'éblouissement. Ce dispositif d'imagerie à semi-conducteurs est pourvu d'une unité de réseau de pixels dans laquelle une pluralité de pixels sont agencés selon une forme bidimensionnelle, les pixels fournissant une capacité interne de pixel sur un côté inverse d'une surface d'incidence de lumière d'un élément de conversion photoélectrique disposé dans un substrat semi-conducteur, et fournissant également, dans le substrat semi-conducteur, une contre-électrode ayant la capacité interne de pixel. La présente invention est applicable, par exemple, à un capteur d'images CMOS de type à irradiation par l'arrière.
PCT/JP2018/019231 2017-06-02 2018-05-18 Dispositif d'imagerie à semi-conducteurs et appareil électronique WO2018221261A1 (fr)

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US16/616,618 US11082649B2 (en) 2017-06-02 2018-05-18 Solid-state imaging device with pixels having an in-pixel capacitance
CN202211499738.8A CN115831992A (zh) 2017-06-02 2018-05-18 摄像装置
CN201880033963.8A CN110663248B (zh) 2017-06-02 2018-05-18 固态摄像装置和电子设备
JP2019522113A JP7210441B2 (ja) 2017-06-02 2018-05-18 固体撮像装置
KR1020197033486A KR102552755B1 (ko) 2017-06-02 2018-05-18 고체 촬상 장치 및 전자 기기
CN202311297888.5A CN117577652A (zh) 2017-06-02 2018-05-18 固态摄像装置和电子设备
JP2023002161A JP2023033399A (ja) 2017-06-02 2023-01-11 固体撮像装置

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JP2017-110382 2017-06-02
JP2017-179824 2017-09-02
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WO2021145257A1 (fr) * 2020-01-15 2021-07-22 ソニーセミコンダクタソリューションズ株式会社 Dispositif d'imagerie et appareil électronique
WO2021153480A1 (fr) * 2020-01-29 2021-08-05 ソニーセミコンダクタソリューションズ株式会社 Élément d'imagerie, dispositif d'imagerie et dispositif de mesure de distance
WO2021153370A1 (fr) * 2020-01-29 2021-08-05 ソニーセミコンダクタソリューションズ株式会社 Dispositif d'imagerie à semi-conducteurs, procédé de commande de dispositif d'imagerie à semi-conducteurs, et appareil électronique
WO2021235101A1 (fr) * 2020-05-20 2021-11-25 ソニーセミコンダクタソリューションズ株式会社 Dispositif d'imagerie à semi-conducteurs
WO2022201898A1 (fr) * 2021-03-25 2022-09-29 ソニーセミコンダクタソリューションズ株式会社 Elément d'imagerie et dispositif d'imagerie
WO2022264939A1 (fr) * 2021-06-15 2022-12-22 ソニーセミコンダクタソリューションズ株式会社 Élément d'imagerie et dispositif électronique
WO2024062813A1 (fr) * 2022-09-22 2024-03-28 ソニーセミコンダクタソリューションズ株式会社 Dispositif d'imagerie et équipement électronique
WO2024075399A1 (fr) * 2022-10-07 2024-04-11 ソニーセミコンダクタソリューションズ株式会社 Dispositif d'imagerie

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