WO2018207354A1 - 部品挿入機およびリード切断方法 - Google Patents
部品挿入機およびリード切断方法 Download PDFInfo
- Publication number
- WO2018207354A1 WO2018207354A1 PCT/JP2017/018044 JP2017018044W WO2018207354A1 WO 2018207354 A1 WO2018207354 A1 WO 2018207354A1 JP 2017018044 W JP2017018044 W JP 2017018044W WO 2018207354 A1 WO2018207354 A1 WO 2018207354A1
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- WIPO (PCT)
- Prior art keywords
- lead
- component
- cutting
- fixed blade
- head
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0421—Feeding with belts or tapes with treatment of the terminal leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0439—Feeding one by one by other means than belts incorporating means for treating the terminal leads only before insertion
Definitions
- the present invention relates to a component insertion machine that inserts a lead extending into a substrate into a through-hole provided in the substrate, and a method for cutting the lead.
- component mounting machines for mounting electronic components are called component insertion machines.
- a component insertion machine a component in which a lead extends (hereinafter sometimes referred to as “component with lead”) is used.
- component with lead a component in which the lead extends
- a lead cutting device is provided in order to trim the lengths of the leads.
- the lead cutting device is, for example, as shown in Patent Document 1 below.
- the lead cutting device described in the above-mentioned patent document it is not certain which mechanism is used to cut the lead. However, when the lead is cut by two blades while holding the component main body, these two blades are used. Depending on the operation, the lead may be bent.
- the present invention has been made in view of such circumstances, and a component insertion machine capable of suppressing or preventing the bending of the lead when the lead is cut by the lead cutting device, and suppressing the bending of the lead. Another object is to provide a lead cutting method that can be prevented.
- the component insertion machine of the present invention is A component insertion machine for inserting into a through-hole provided in a component substrate with leads, A component supply device for supplying the leaded component; A component holding head for picking up and holding the leaded component from the component supply device; A head moving device for moving the component holding head;
- the head moving device includes a lead cutting device that causes a lead of the leaded component to approach or abut a fixed blade and cuts a part of the lead by a movable blade facing the fixed blade.
- the lead cutting method of the present invention includes: Hold the leaded parts, Move the held lead-attached component so that the lead of the lead-attached component approaches or contacts the fixed blade, A part of the lead is cut by a movable blade facing the fixed blade.
- the movable blade when the lead is cut by the lead cutting device, the movable blade operates and cuts in a state where the lead is close to or in contact with the fixed blade, so that the bending of the lead is effectively suppressed or It is possible to prevent.
- FIG. 1 is a perspective view showing an overall configuration of a component mounting machine (hereinafter, also referred to as “component mounting machine of an embodiment”) as a component insertion machine that is an embodiment of the present invention. It is a perspective view which shows the mounting head which the component mounting machine of an Example has from the viewpoint opposite to FIG. It is a flowchart for demonstrating the component mounting operation
- a component mounting machine 10 (a main body 12 and a base material arranged on the main body 12 are shown).
- the holding device 14, the component supply device 16 attached to the main body 12, and the three lead cutting devices 20a, 20b, and 20c mounted on the table 18 attached to the main body 12 (when it is not necessary to distinguish three) May be referred to as “lead cutting device 20”), two mounting heads 22 each of which is a component holding head, and head movement that is supported by the main body 12 and moves the mounting head 22 in the XY directions shown in the figure.
- the apparatus 24 is comprised including the control apparatus 26 which controls each apparatus (it is a concept also including a mounting head).
- maintenance apparatus 14 is provided with the conveyor 28, has the function to carry in and carry out the base material S which is a board
- the component supply device 16 is a general tray-type component supply device, and is configured to supply a plurality of components in a state in which they are accommodated in a tray, although not clearly shown in the figure. Has been.
- the component mounting machine 10 handles a lead-attached component in which a lead extends from the component main body, so that the component supply device 16 receives the lead-attached component (hereinafter simply referred to as “component”). Is sometimes supplied).
- Each of the three lead cutting devices 20 has a function of aligning the lead of the component, and is aligned in the X direction on the table 18 by using a plurality of slots provided on the table 18. .
- the component mounting machine 10 of the present embodiment as will be described later, three types of leaded components are mounted, and three lead cutting devices 20 are arranged corresponding to these three types of components. It has been done. The configuration of the lead cutting device 20 will be described in detail later.
- each mounting head 22 is provided with a head main body 32 and a component chuck (“component clamp”) as a component holding device that is provided at the lower portion of the head main body 32 and holds the component in a gripping manner. 34).
- the mounting head 22 picks up and holds the component by the component chuck 34.
- a chuck lifting / lowering device that moves the component chuck 34 in the Z direction, that is, the vertical direction, and a chuck rotating device that rotates around an axis extending in the Z direction are provided.
- the head moving device 24 is a so-called XY robot type moving device, and is supported by the main body 12 so as to be aligned in the X direction, that is, the width direction of the component mounting machine 10, and two guide rails each extending in the Y direction. 36, a beam 38 disposed in a posture extending in the X direction across the guide rails 36, a beam moving device (not shown) for moving the beam 38 along the Y direction to the guide rails 36, and a beam 38 , And a slide moving device (not shown) that individually moves the two slides 40 in the X direction.
- One of the two mounting heads 22 is attached to one of the two slides 40, and the other is attached to the other via a head lifting device 42 that lifts and lowers a corresponding one of the two mounting heads 22, respectively. .
- the chuck moving device that moves the component chuck 34 includes the above-described chuck lifting device, chuck rotating device, head lifting device 42, and head moving device 24.
- the chuck moving device functions as a device moving device that moves the component chuck 34 as a component holding device across the substrate holding device 14, the component supply device 16, and the lead cutting device 20. ing.
- the control device 26 includes a computer as a main component, and controls the component mounting machine 10. Specifically, each device such as the substrate holding device 14, the component supply device 16, the lead cutting device 20, the mounting head 22, the head moving device 24, and the head lifting device 42 is controlled.
- step 1 (hereinafter abbreviated as “S1”. Other steps are also the same), initial processing is required. If the initial process is necessary, the initial process is executed in S2. This initial process will be described later.
- FIG. 4 shows a state in which a part P (specifically, a part Pa described later) is mounted on the substrate S.
- the part chuck 34 connects the part P to the lead Le.
- the component main body PB is held and held in a posture that extends downward.
- the main component that moves and lifts the component chuck 34, that is, the component P is the head moving device 24, the chuck lifting device, and the head lifting device 42.
- the component chuck 34 that has been lifted while holding the component P is moved to the lead cutting device 20, and is lowered to the set position.
- the lead Le of the held leaded part P is cut. Specifically, the tip portion of the lead Le is cut so that the lead Le having a set length remains. That is, the lead Le is trimmed.
- the configuration of the lead cutting device 20 and the cutting of the lead Le by that will be described in detail later.
- the component chuck 34 holding the leaded component P from which the lead Le has been cut is located above the base material holding device 14, that is, to the position where the component P above the base material S is mounted. Then, the lead Le of the component P is lowered so as to be inserted into a hole (through hole) H (see also FIG. 1) drilled in the base material S, and is lowered by the component chuck 34. The holding of the part P is released, and the one part P is mounted.
- the three lead cutting devices 20a, 20b, and 20c cut the leads Le of different types of components P, respectively.
- the parts Pa in which the leads Le are cut by the lead cutting device 20a are parts in which six leads Le are arranged in a straight line.
- the parts Pb and Pc extending from the main body part PB and having the lead Le cut by the lead cutting devices 20b and 20c are different in size, shape, position of the lead Le, etc., but the four leads Le are rectangular. Are extended from the component main body PB so as to be positioned at the four apexes.
- Removable attachment plates 50a, 50b, and 50c are attached to the upper portions of the lead cutting devices 20a, 20b, and 20c, respectively.
- 50c are provided with through holes 52 according to the parts Pa, Pb, Pc, that is, according to the arrangement positions of the leads Le.
- the lead Le is cut in a state where the lead Le is passed through the through hole 52.
- the lead cutting device 20a for cutting the lead Le of the component Pa one long through hole 52 into which the six leads Le can be inserted is provided in the plate 50a, and the lead of the components Pb and Pc is provided.
- the plates 50b and 50c are provided with four through holes 52 into which four leads Le can be respectively inserted.
- the plate 50 when it is not necessary to distinguish between the plates 50a, 50b, and 50c, they are collectively referred to as the plate 50.
- FIG. 6A which is a cross-sectional view of the main part
- FIG. 20a is provided with a rocking bar 54 that rocks the lower side of the plate 50a around one end.
- a roller 56 is supported at the other end of the swing bar 54, and a wedge block 58 is provided so as to engage with the roller 56.
- the swing bar 54 is urged by a spring (not shown) in the direction of swinging counterclockwise in FIG. 6B, and swings when the wedge block 58 is advanced and retracted.
- the edge on the left side functions as the fixed blade 60
- the upper left edge functions as the movable blade 62.
- the state shown in FIG. 6 is a state in which the fixed blade 60 and the movable blade 62 are open to each other.
- the swinging bar 54, that is, the movable blade 62 is moved to the state shown in FIG. Oscillates with respect to the through hole 52, that is, the fixed blade 60.
- the lead Le of the component Pa is inserted into the through hole 52 in a posture in which the plate 50a and the component main body portion PB face each other. Then, the swing bar 64 is swung so that the movable blade 62 is closed with respect to the fixed blade 60, whereby the lead Le is cut so as to be sheared. Incidentally, the cut portion of the lead Le is received in a cutting lead storage box (not shown) attached to the inside of the lead cutting device 20a.
- the lead cutting devices 20b and 20c cut the lead Le in the same manner.
- the lead cutting devices 20 b and 20 c are provided with a plurality of through holes 52 into which one lead Le is inserted, and the edge of each through hole 52 functions as the fixed blade 60. Therefore, in the lead cutting devices 20b and 20c, the plurality of leads Le are cut by operating one movable blade 62 with respect to the plurality of fixed blades 60.
- the lead cutting device 20a and the lead cutting device 20b are the same except for the plate 50. That is, the lead cutting device 20 can cope with various components P by changing the plate 50, that is, the fixed blade 60 to correspond to the component P.
- a two-dimensional code 64 is attached to the plate 50 (see FIG. 5), and the two-dimensional code 64 is imaged by an imaging device (camera) 66 attached to the slide 40 of the head moving device 24.
- the control device 26 is made to know what plate 50 is attached to which lead cutting device 20 by the information obtained by the above.
- the lead Le is inserted into the through hole 52 provided in the plate 50 as described above. And cut.
- conventional cutting that is, as shown in FIG. 7, a case is considered in which cutting is performed with the lead Le positioned at the center of the through hole 52, specifically, the center in the X direction.
- the plate 50 forming the fixed blade 60 is positioned on the side close to the component main body portion PB, and the swing bar 54 forming the movable blade 62 is positioned on the side far from the component main body portion PB.
- the component P is positioned at a position where the lead Le is positioned at the center of the through hole 52, and from that position, as shown in FIG. 8B.
- the component P is moved to a position where the lead Le approaches or contacts the fixed blade 60, and the lead Le is cut at that position.
- the lead Le is moved by a movement distance ⁇ X from the first position where the lead Le is separated from the fixed blade 60 by a set distance to the second position where the lead Le is close to or in contact with the fixed blade 60. Then, a part of the lead Le is cut.
- the method for cutting the lead Le is one aspect of the lead cutting method according to the embodiment of the present invention.
- the first position and the second position are determined in the initial process S2 of the component mounting work described above.
- the control device 26 itself has an information storage that has a control program of the component mounting machine for component mounting work, that is, a component mounting program in which what component P is mounted on which location of the base material S is specified. Stored in the department.
- the information storage unit stores information about the specifications of the component P, and the information includes the number of leads Le, lead position information that is information about the position of the lead Le in the component P, and the like. It is. Further, the information storage unit stores information on the specifications of the lead cutting device 20, specifically, the number of through holes 52 of the plate 50 and the position of the through holes 52 in the lead cutting device 20, that is, the fixed blade 60.
- the fixed blade position information which is information related to the position in the lead cutting device 20, is also stored.
- an initial process is executed.
- the lead cutting device 20 cuts the lead Le of the part P based on the lead position information and the fixed blade position information.
- the movement distance ⁇ X that is, the second position is determined.
- the control device 26 also has a function of finely adjusting the movement distance ⁇ X, that is, the second position. Specifically, the control device 26 is configured to accept an input of a correction amount ⁇ X (see FIG. 8) for the movement distance ⁇ X by an operator of the component mounting machine 10, and the correction input by the operator. The movement distance ⁇ X is corrected based on the amount ⁇ X. That is, in the component mounting machine 10, the second position can be adjusted by an operator's operation.
- control device 26 has a functional configuration as shown in the functional block diagram of FIG. Specifically, the control device 26 controls each device such as the base material holding device 14, the component supply device 16, the lead cutting device 20, the mounting head 22, the head moving device 24, the head lifting / lowering device 42, etc.
- a component mounting work execution unit 70 that performs mounting work is provided, and the component mounting work execution unit 70 includes a lead cutting execution unit 72 that causes the lead cutting device 20 to cut the lead Le by the above-described method. Yes.
- control device 26 includes an information storage unit 74 that stores the lead position information, the fixed blade position information, and the like, and the lead cutting execution unit 72 includes lead position information stored in the information storage unit 74, The first position and the second position (movement distance ⁇ X) are determined based on the fixed blade position information. Further, the control device 26 includes a correction amount receiving unit 76 that receives an input by the operator of the correction amount ⁇ X described above, and the lead cutting execution unit 72 is based on the correction amount ⁇ X received by the correction amount receiving unit 76. The second position (movement distance ⁇ X) is corrected.
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
Description
リード付き部品基板に設けられた貫通孔に挿入させる部品挿入機であって、
前記リード付き部品を供給する部品供給装置と、
前記部品供給装置から前記リード付き部品をピックアップし、保持する部品保持ヘッドと、
前記部品保持ヘッドを移動させるヘッド移動装置と、
前記ヘッド移動装置によって、前記リード付き部品のリードを固定刃に近接若しくは当接させ、前記固定刃と対向する可動刃により、前記リードの一部を切断するリード切断装置を備えたことを特徴とし、
また、本発明のリード切断方法は、
リード付部品を保持し、
その保持したリード付部品を移動させて、そのリード付部品のリードを固定刃に近接若しくは当接させ、
前記固定刃と対向する可動刃により、前記リードの一部を切断することを特徴とする。
図1に示すように、実施例の部品挿入機としての部品装着機10(は、本体12と、本体12に配置された基材保持装置14と、本体12に付設された部品供給装置16と、本体12に付設されたテーブル18に載置された3つのリード切断装置20a,20b,20c(3つを区別する必要がない場合は、「リード切断装置20」と言う場合がある)と、それぞれが部品保持ヘッドである2つの装着ヘッド22と、本体12に支持されて装着ヘッド22を図に示すXY方向に移動させるヘッド移動装置24と、それら各装置(装着ヘッドをも含む概念である)を制御する制御装置26とを含んで構成される。
図5に示すように、3つのリード切断装置20a,20b,20cは、それぞれ、異なる種類の部品PのリードLeを切断する。便宜的に、それらの部品Pを、部品Pa,部品Pb,部品Pcと呼べば、リード切断装置20aによってリードLeが切断される部品Paは、6本のリードLeが一列に真っ直ぐに並んで部品本体部PBから延び出しており、リード切断装置20b,20cによってリードLeが切断される部品Pb,Pcは、大きさ,形状,リードLeの位置等が異なるものの、4本のリードLeが、長方形の4つの頂点に位置するようにして部品本体部PBから延び出している。
リード切断装置20によって部品PのリードLeを切断するときには、先に説明したように、リードLeを、プレート50に設けられた貫通穴52に挿入して切断する。従来における切断の場合、つまり、図7に示すように、貫通穴52の中心、詳しく言えば、X方向における中心にリードLeを位置させて切断する場合を考える。切断の際、固定刃60を形成するプレート50が、部品本体部PBに近い側に、可動刃62を形成する揺動バー54が、部品本体部PBから遠い側に位置している。
以上説明した制御装置26の機能から、制御装置26は、図9の機能ブロック図が示すような機能構成を有していると考えることができる。具体的には、制御装置26は、基材保持装置14,部品供給装置16,リード切断装置20,装着ヘッド22,ヘッド移動装置24,ヘッド昇降装置42等の各装置を制御して上述の部品装着作業を実行する部品装着作業実行部70を備えており、その部品装着作業実行部70は、上述の手法によるリードLeの切断をリード切断装置20に行わせるリード切断実行部72を有している。
Claims (3)
- リード付き部品基板に設けられた貫通孔に挿入させる部品挿入機であって、
前記リード付き部品を供給する部品供給装置と、
前記部品供給装置から前記リード付き部品をピックアップし、保持する部品保持ヘッドと、
前記部品保持ヘッドを移動させるヘッド移動装置と、
前記ヘッド移動装置によって、前記リード付き部品のリードを固定刃に近接若しくは当接させ、前記固定刃と対向する可動刃により、前記リードの一部を切断するリード切断装置を備えたことを特徴とする部品挿入機。 - 前記リード切断装置が、前記固定刃を、前記リード付き部品に応じたものに交換可能に構成された請求項1に記載の部品挿入機。
- リード付部品を保持し、
その保持したリード付部品を移動させて、そのリード付部品のリードを固定刃に近接若しくは当接させ、
前記固定刃と対向する可動刃により、前記リードの一部を切断するリード切断方法。
Priority Applications (5)
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US16/609,035 US11412649B2 (en) | 2017-05-12 | 2017-05-12 | Component insertion machine and lead cutting method |
PCT/JP2017/018044 WO2018207354A1 (ja) | 2017-05-12 | 2017-05-12 | 部品挿入機およびリード切断方法 |
JP2019516853A JP6826194B2 (ja) | 2017-05-12 | 2017-05-12 | 部品挿入機 |
CN201780090373.4A CN110603910B (zh) | 2017-05-12 | 2017-05-12 | 元件插入机以及引脚切断方法 |
EP17908949.5A EP3624577A4 (en) | 2017-05-12 | 2017-05-12 | COMPONENT INSERTION MACHINE AND METHOD FOR CUTTING CABLES |
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PCT/JP2017/018044 WO2018207354A1 (ja) | 2017-05-12 | 2017-05-12 | 部品挿入機およびリード切断方法 |
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Publication number | Publication date |
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EP3624577A4 (en) | 2020-05-06 |
JPWO2018207354A1 (ja) | 2020-03-12 |
US20200100409A1 (en) | 2020-03-26 |
US11412649B2 (en) | 2022-08-09 |
JP6826194B2 (ja) | 2021-02-03 |
CN110603910A (zh) | 2019-12-20 |
CN110603910B (zh) | 2021-08-13 |
EP3624577A1 (en) | 2020-03-18 |
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