WO2018181209A1 - 感光性エレメント及び感光性エレメントロール - Google Patents
感光性エレメント及び感光性エレメントロール Download PDFInfo
- Publication number
- WO2018181209A1 WO2018181209A1 PCT/JP2018/012196 JP2018012196W WO2018181209A1 WO 2018181209 A1 WO2018181209 A1 WO 2018181209A1 JP 2018012196 W JP2018012196 W JP 2018012196W WO 2018181209 A1 WO2018181209 A1 WO 2018181209A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photosensitive element
- bubble breakage
- mark
- support film
- diameter
- Prior art date
Links
- 229920005989 resin Polymers 0.000 claims abstract description 104
- 239000011347 resin Substances 0.000 claims abstract description 104
- 239000010410 layer Substances 0.000 claims description 121
- 230000001681 protective effect Effects 0.000 claims description 87
- 238000007373 indentation Methods 0.000 claims description 45
- 239000012792 core layer Substances 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 description 43
- -1 methacryloyl group Chemical group 0.000 description 37
- 239000000758 substrate Substances 0.000 description 37
- 229940048053 acrylate Drugs 0.000 description 30
- 239000002245 particle Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 18
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 15
- 239000000243 solution Substances 0.000 description 14
- 239000000178 monomer Substances 0.000 description 13
- 239000011342 resin composition Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 230000007423 decrease Effects 0.000 description 12
- 230000007547 defect Effects 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 9
- 229920002554 vinyl polymer Polymers 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 5
- 230000009172 bursting Effects 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 229940059574 pentaerithrityl Drugs 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000004448 titration Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229940114077 acrylic acid Drugs 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- WNILQWYHQCFQDH-UHFFFAOYSA-N (2-oxooctylideneamino) 1-(4-phenylsulfanylphenyl)cyclohexa-2,4-diene-1-carboxylate Chemical compound C=1C=C(SC=2C=CC=CC=2)C=CC=1C1(C(=O)ON=CC(=O)CCCCCC)CC=CC=C1 WNILQWYHQCFQDH-UHFFFAOYSA-N 0.000 description 1
- LMGYOBQJBQAZKC-UHFFFAOYSA-N 1-(2-ethylphenyl)-2-hydroxy-2-phenylethanone Chemical compound CCC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 LMGYOBQJBQAZKC-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- VZMLJEYQUZKERO-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 VZMLJEYQUZKERO-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- AXYQEGMSGMXGGK-UHFFFAOYSA-N 2-phenoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)OC1=CC=CC=C1 AXYQEGMSGMXGGK-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 description 1
- MTRFEWTWIPAXLG-UHFFFAOYSA-N 9-phenylacridine Chemical compound C1=CC=CC=C1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 MTRFEWTWIPAXLG-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- SEEVRZDUPHZSOX-WPWMEQJKSA-N [(e)-1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(\C)=N\OC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-WPWMEQJKSA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- ARNIZPSLPHFDED-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-(4-methoxyphenyl)methanone Chemical compound C1=CC(OC)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 ARNIZPSLPHFDED-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 150000001251 acridines Chemical class 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000005529 alkyleneoxy group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229940027998 antiseptic and disinfectant acridine derivative Drugs 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- YDMWUMUNUXUYKT-UHFFFAOYSA-N ethyl [(1-oxo-1-phenylpropan-2-ylidene)amino] carbonate Chemical compound CCOC(=O)ON=C(C)C(=O)C1=CC=CC=C1 YDMWUMUNUXUYKT-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000007760 metering rod coating Methods 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 229920005787 opaque polymer Polymers 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005026 oriented polypropylene Substances 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Definitions
- One aspect of the present invention relates to a photosensitive element and a photosensitive element roll.
- Touch panels are used in large electronic devices such as personal computers and televisions, small electronic devices such as car navigation systems, mobile phones, portable music players and electronic dictionaries, and display devices such as OA / FA devices.
- a touch panel is arrange
- the touch panel is disposed on a touch input surface (sensing area) and includes an electrode for detecting a touch position.
- This electrode is formed of a transparent conductive electrode material such as ITO (Indium-Tin-Oxide) so as not to lower the visibility of the image displayed by the display device.
- ITO Indium-Tin-Oxide
- the touch panel has a metal wiring for transmitting a touch position detection signal to the driving circuit.
- the metal wiring is arranged in a region (frame region) around the sensing region, and is generally formed of a metal such as copper having high conductivity.
- a touch panel corrosive components such as moisture and salt may enter the inside of the touch panel from a fingertip that contacts the touch panel.
- the metal wiring may corrode, and the electrical resistance between the electrode in the sensing region and the driving circuit may increase, or the metal wiring may be disconnected.
- Patent Documents 1 and 2 disclose a protective film for a touch panel electrode. This protective film is provided in a required location by exposing and developing the photosensitive resin layer.
- Patent Documents 3 to 5 disclose a photosensitive element including a support film and a photosensitive resin layer formed on the support film. According to this photosensitive element, the photosensitive resin layer can be disposed on a predetermined substrate by thermocompression bonding.
- JP 2010-27033 A Japanese Patent Application Laid-Open No. 2011-232585 JP-A-7-253666 JP 2005-99647 A Japanese Patent Laid-Open No. 11-133617
- Protective films for touch panel electrodes may be provided not only in the frame area but also in the sensing area. Therefore, it is preferable that the protective film of the touch panel electrode does not hinder the visibility of the image displayed by the display device, similarly to the electrode arranged in the sensing region.
- touch panels mounted on smartphones and tablet terminals are required not to impair visibility at a higher level than before.
- defects may occur in the manufacturing process. For this reason, it is desired to suppress a reduction in image visibility due to the presence of defects.
- An aspect of the present invention provides a photosensitive element and a photosensitive element roll that can suppress a decrease in image visibility when applied to a protective film of a touch panel electrode.
- a photosensitive element includes a support film, a photosensitive resin layer provided on one side of the support film, and a protective film provided on the opposite side of the support film in the photosensitive resin layer. And the other surface of the support film has a density of broken bubbles of 30 pieces / 0.25 m 2 or less and a diameter of broken bubbles of 40 ⁇ m or more and 100 ⁇ m or less.
- the bubble breakage mark on the other side of the support film becomes a factor that forms an indentation on the surface of the photosensitive resin layer provided with the protective film. Then, when a protective film using a photosensitive element in which an indentation is formed is applied to the protective film of an electrode for a touch panel, a concave portion corresponding to the indentation is formed in the protective film, and the concave portion that can be identified by the naked eye has an image visibility. May lead to decline.
- the probability that a bubble breakage mark will form a recessed part which finally affects visibility through an indentation in a protective film is about 1/5 from an empirical rule.
- the number of the recessed parts per display apparatus of the existing typical size is easy to be suppressed to less than 1 because the density of a bubble breakage mark satisfy
- the diameter of the broken bubble mark may be the long diameter of the broken bubble mark or the diameter of the circumscribed circle of the broken bubble mark.
- the density of the bubble breakage mark may be 1 piece / 0.25 m 2 or more. In this case, the yield can be improved.
- the support film may contain a resin
- the bubble breakage mark may be a mark due to the burst of bubbles in the resin.
- the influence of the transfer mark on the visibility can be more reliably suppressed.
- the support film has a core layer and a skin layer provided on the core layer, and the bubble breakage mark may be a mark due to the burst of bubbles in the skin layer.
- the bubble breakage mark may be a mark due to the burst of bubbles in the skin layer.
- the photosensitive element may be used for forming a protective film for a touch panel electrode. In this case, a reduction in image visibility can be suppressed.
- the density of the bubble breakage marks may be 6 pieces / 0.25 m 2 or less, and the diameter of the bubble breakage marks may be 40 ⁇ m or more and 100 ⁇ m or less.
- Foam marks on one side of the support film cause transfer marks on the photosensitive resin layer provided on the one side.
- the transfer mark that can be identified by the naked eye may lead to a decrease in image visibility.
- the existing representative size display It is easy to suppress the number of transfer marks per apparatus to less than 1.
- the number of recesses and transfer marks per display device having an existing representative size can be easily suppressed to less than one.
- the influence of the transfer trace with respect to visibility can be suppressed because the diameter of the bubble-break trace in one surface satisfy
- the photosensitive element roll which concerns on one side of this invention is equipped with the winding body of the said photosensitive element, and the density of the impression by the pressure of a bubble breakage is 30 pieces / of the opposite surface of the support film in a photosensitive resin layer.
- the diameter of the indentation is not less than 0.25 m 2 and not less than 100 ⁇ m and not more than 1200 ⁇ m.
- the photosensitive element roll since the photosensitive element is provided, the number of concave portions per display device having an existing representative size is suppressed to less than one. Therefore, in this photosensitive element roll, when applying to the protective film of the electrode for touch panels, the fall of the visibility of an image can be suppressed.
- the indentation diameter may be the major axis of the indentation or the diameter of the circumscribed circle of the indentation.
- the density of the indentation may be 6 pieces / 0.25 m 2 or more. In this case, the yield can be improved.
- (meth) acrylic acid means acrylic acid or methacrylic acid
- (meth) acrylate means acrylate or the corresponding methacrylate
- (meth) acryloyl group means acryloyl.
- process is not limited to an independent process, and is included in the term if the intended action of the process is achieved even when it cannot be clearly distinguished from other processes. .
- a numerical range indicated using “to” indicates a range including the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
- each component in the composition is the total amount of the plurality of substances present in the composition unless there is a specific notice when there are a plurality of substances corresponding to each component in the composition. means.
- FIG. 1 is a plan view showing an example of a touch panel.
- a touch panel 100 shown in FIG. 1 is a capacitive touch panel.
- the capacitive touch panel detects a touch position by detecting a change in capacitance when a fingertip (conductor) is in contact with the touch panel.
- the touch panel 100 includes a transparent substrate (substrate) 101.
- the transparent substrate 101 include substrates such as glass plates, plastic plates (for example, polyethylene terephthalate film), and ceramic plates that are generally used for touch panels.
- the transparent substrate 101 may include these substrates and, for example, an insulating layer or an optical adjustment layer (index matching layer) (not shown) provided on the surfaces of these substrates.
- the optical adjustment layer is, for example, a cured resin film obtained by curing a resin composition containing metal particles such as ZrO 2 , TiO 2 , and SiO 2 , and suppresses a difference in optical characteristics depending on the presence or absence of the transparent electrodes 103 and 104. To do. Therefore, according to the optical adjustment layer, it is possible to further suppress a decrease in image visibility.
- the touch panel 100 includes a sensing area (touch input surface) 102, a plurality of transparent electrodes 103, and a plurality of transparent electrodes 104.
- the sensing area 102 is an area for detecting a touch position by detecting a change in capacitance, and is provided on the one surface 101 a side of the transparent substrate 101.
- the transparent electrodes 103 and 104 are provided on the transparent substrate 101.
- the transparent electrode 103 is disposed in the sensing area 102.
- the transparent electrode 103 is an X electrode that detects a change in capacitance and uses it as an X position coordinate.
- the transparent electrode 104 is disposed in the sensing region 102 so as to be orthogonal to the transparent electrode 103.
- the transparent electrode 104 is a Y electrode that detects a change in capacitance and uses it as a Y position coordinate.
- the transparent electrodes 103 and 104 are made of a transparent conductive electrode material such as ITO (Indium-Tin-Oxide).
- ITO Indium-Tin-Oxide
- the transparent electrodes 103 and 104 are disposed on the insulating layer.
- the transparent electrodes 103 and 104 are referred to as touch panel electrodes.
- the touch panel 100 includes a frame area 105, a plurality of metal wirings 106, a plurality of connection electrodes 107, and a plurality of connection terminals 108.
- the frame area 105 is an area provided on the one surface 101 a side of the transparent substrate 101 and surrounding the sensing area 102.
- the metal wiring 106 is disposed in the frame area 105 and transmits a touch position detection signal from the transparent electrodes 103 and 104 to an external driving circuit (not shown).
- the connection electrode 107 is provided on one end of the transparent electrodes 103 and 104, and connects the transparent electrodes 103 and 104 and the metal wiring 106.
- the connection terminal 108 is disposed in the frame area 105.
- connection terminal 108 is provided at the end of the metal wiring 106 opposite to the connection electrode 107 and is connected to an external drive circuit.
- the metal wiring 106, the connection electrode 107, and the connection terminal 108 are made of, for example, a metal such as silver or copper.
- the touch panel 100 includes the protective film 200 that protects the touch panel electrode.
- the protective film 200 is a cured resin film formed by curing a photosensitive resin layer 20 (see FIG. 2) of the photosensitive element 1 described later.
- the protective film 200 is provided at least in the sensing region 102 and covers the transparent electrodes 103 and 104.
- the protective film 200 in the present embodiment is provided on the entire surface of the sensing region 102 and covers the entire transparent electrodes 103 and 104. That is, the protective film 200 is provided on the transparent electrodes 103 and 104 to protect the transparent electrodes 103 and 104 as a whole.
- the protective film 200 may be provided in a part of the sensing region 102 and partially cover the transparent electrodes 103 and 104.
- the protective film 200 may partially protect the transparent electrodes 103 and 104.
- the protective film 200 in this embodiment is provided not only in the sensing area 102 but also in the frame area 105, and covers the metal wiring 106, the connection electrode 107, and the connection terminal 108 on the metal wiring 106 side, and protects them. ing. Since the protective film 200 has low moisture permeability, it is possible to improve the rust prevention property of the metal constituting the metal wiring 106, the connection electrode 107, and the connection terminal 108.
- FIG. 2 is a schematic cross-sectional view showing a photosensitive element according to an embodiment.
- the photosensitive element 1 shown in FIG. 2 is used to form a protective film 200 (see FIG. 1) for a touch panel electrode.
- the photosensitive element 1 includes a support film 10, a photosensitive resin layer 20, and a protective film 30.
- the support film 10 has a first surface 10 a and a second surface 10 b that face in opposite directions in the thickness direction of the photosensitive element 1.
- the photosensitive resin layer 20 has one surface 20 a and the other surface 20 b that face in opposite directions in the thickness direction of the photosensitive element 1.
- the one surface 20 a is an opposite surface located on the opposite side to the support film 10.
- the other surface 20b is a facing surface that faces the one surface 10a.
- the photosensitive resin layer 20 is provided on the one surface 10a with the other surface 20b facing the one surface 10a.
- the protective film 30 has one surface 30 a and the other surface 30 b that face in opposite directions in the thickness direction of the photosensitive element 1.
- the one surface 30a is located on the opposite side to the support film 10.
- the other surface 30b faces the one surface 20a.
- the protective film 30 is provided on the one surface 20a with the other surface 30b opposed to the one surface 20a.
- a polymer film can be used as the support film 10.
- the polymer film include a film containing at least one resin material selected from the group consisting of polyethylene terephthalate, polypropylene, polyimide, and polyamide.
- the thickness of the support film 10 is preferably 5 to 100 ⁇ m from the viewpoint of ensuring coverage and suppressing a reduction in resolution when irradiating an actinic ray described later through the support film 10. Is more preferably 15 to 40 ⁇ m, and particularly preferably 20 to 35 ⁇ m.
- the thickness of the support film 10 can be set to 16 ⁇ m, for example.
- FIG. 3 is a schematic cross-sectional view for explaining an example of the support film.
- the support film 10 shown in FIG. 3 has a core layer 11 and a pair of skin layers 12 and 12.
- the core layer 11 is a biaxially oriented polyester film, for example.
- the thickness of the core layer 11 is, for example, 5 to 100 ⁇ m.
- the skin layer 12 is provided on the core layer 11 so as to cover the surface of the core layer 11 and constitutes the outermost layer of the support film 10.
- the thickness of the skin layer 12 is, for example, 0.1 to 3 ⁇ m.
- the skin layer 12 contains particles that function as a lubricant.
- the average particle diameter of the particles is, for example, 0.1 to 1.0 ⁇ m.
- the average particle diameter of the particles is, for example, 0.5 ⁇ m.
- the particles are contained in the skin layer 12 in an amount of 0.01 to 50% by mass.
- the particles include inorganic particles such as silicon dioxide particles (aggregated silica and the like), calcium carbonate particles, alumina particles, titanium oxide particles and barium sulfate particles, organic particles such as crosslinked polystyrene particles, acrylic particles and imide particles, and various nuclei. Particles, agglomerates, and mixtures thereof produced during polymerization with an agent can be used.
- the resin used as the base of the skin layer 12 is the same as that of the core layer 11, for example.
- the support film 10 is formed, for example, by injection molding the core layer 11 and the pair of skin layers 12 at the same time.
- the support film 10 is composed of four or more layers, and may have another layer between the core layer 11 and the skin layer 12, or composed of two layers, with one side of the core layer 11 being exposed. It may be composed of a single layer, and both surfaces of the core layer 11 may be exposed.
- the core layer 11 may contain particle
- FIG. 4 is a perspective view showing an example of bubble breakage marks.
- the bubble breakage mark 13 has a crater shape, for example, and has a protruding portion 14 and a circular portion 15.
- the protruding portion 14 is a portion protruding in an annular shape from the one surface 10a or the other surface 10b.
- the protrusion part 14 may form the continuous annular ring, and may form the discontinuous annular ring interrupted on the way.
- the circular portion 15 is a circular portion surrounded by the protruding portion 14.
- the circular portion 15 may have an elliptical shape or a substantially circular shape.
- the circular portion 15 may be flush with the one surface 10a or the other surface 10b, may be recessed inward of the support film 10 from the one surface 10a or the other surface 10b, or the one surface 10a or the other surface. It may be located outside the support film 10 from 10b.
- One or a plurality of bubble breakage marks 13 may be further formed in the circular portion 15 of the bubble breakage mark 13.
- the plurality of bubble breakage marks 13 formed so as to overlap with each other are collectively handled as one bubble breakage mark 13.
- the diameter of the bubble breakage mark 13 is, for example, 40 ⁇ m or more and 100 ⁇ m or less.
- the diameter of the bubble breakage trace 13 is, for example, the long diameter of the bubble breakage trace 13 or the diameter of the circumscribed circle of the bubble breakage trace 13.
- the major axis of the bubble breakage mark 13 is defined as the maximum length from the top 14a to the top 14a of the protrusion 14.
- the major axis of the bubble breakage mark 13 is defined as the maximum length from the top 14a to the top 14a of the protrusion 14 at a continuous portion.
- the major axis of 13 is treated as the major axis of the one bubble breakage mark 13.
- the major axis of the bubble breakage mark 13 is the diameter of the bubble breakage mark 13.
- the circumscribed circle of the broken bubble mark 13 is defined as the smallest circle that completely includes the broken bubble mark 13 (minimum inclusion circle).
- FIG. 5 is a photograph showing an example of bubble breakage marks.
- FIG. 6 is a diagram showing a cross-sectional observation result of the bubble breakage trace shown in FIG.
- the diameter is 70 ⁇ m
- the height of the protruding portion 14 (the maximum height from the one surface 10 a or the other surface 10 b on which the bubble breakage trace 13 is formed). It was observed that the depth of the recess of the circular portion 15 was 0.14 ⁇ m (the maximum depth from the one surface 10a or the other surface 10b where the bubble breakage marks 13 were formed) was 0.45 ⁇ m.
- the bubble breakage marks 13 in FIGS. 5 and 6 were observed using a shape measurement laser microscope (VK-X200, manufactured by KEYENCE Corporation).
- the density of the bubble breakage marks 13 is 6 pieces / 0.25 m 2 or less, preferably 4 pieces / 0.25 m 2 or less, and more preferably 2 pieces / 0.25 m 2. 2 or less.
- the density of the bubble breakage marks 13 is 30 pieces / 0.25 m 2 or less, preferably 20 pieces / 0.25 m 2 or less, more preferably 10 pieces / 0.25 m 2 or less. .
- the density of the bubble breakage marks 13 on the one surface 10a tends to be lower than the density of the bubble breakage marks 13 on the other surface 10b.
- the density of the bubble breakage marks 13 on the one surface 10a is lower than the density of the bubble breakage marks 13 on the other surface 10b, but the density of the bubble breakage marks 13 on the one surface 10a is lower than that of the bubble breakage marks 13 on the other surface 10b. It may be greater than the density of the marks 13.
- the number and diameter of the bubble breakage marks 13 on the one surface 10a are measured by, for example, using an optical microscope or a laser microscope, focusing on the one surface 10a and observing.
- the number and diameter of the bubble breakage marks 13 on the other surface 10b are measured by, for example, using an optical microscope or a laser microscope, focusing on the other surface 10b and observing.
- the density of the bubble breakage marks 13 can be controlled by controlling the degree of vacuum (pressure) in the cylinder.
- the degree of vacuum pressure
- the density of the bubble breakage marks 13 can be reduced.
- the resin may be dissolved in a state where the pressure in the cylinder is set to 460 mmHg or less, for example.
- the pressure in the cylinder is more preferably 260 mmHg or less, and still more preferably 60 mmHg or less.
- the density of the bubble breakage marks 13 is preferably 1 piece / 0.25 m 2 or more on the one surface 10a of the support film 10, and the other surface 10b. Is preferably 1 piece / 0.25 m 2 or more, more preferably 3 pieces / 0.25 m 2 or more, and further preferably 6 pieces / 0.25 m 2 or more. Thereby, the yield of the support film 10 can be improved.
- the reason why the density of the bubble breakage marks 13 on the one surface 10a and the other surface 10b is different is presumed as follows. After the support film 10 is pushed out of the cylinder, it is brought into close contact with a rotating cooling drum and cooled and solidified. At this time, it is presumed that the generation of bubbles is suppressed on the one surface 10a in contact with the cooling drum, and the generation of bubble breakage marks 13 is suppressed compared to the other surface 10b.
- the photosensitive resin layer 20 is formed of a photosensitive resin composition.
- the photosensitive resin composition includes a binder polymer (hereinafter also referred to as component (A)), a photopolymerizable compound (hereinafter also referred to as component (B)), and a photopolymerization initiator (hereinafter also referred to as component (C). And).
- the component (A) is preferably a copolymer containing structural units derived from (a) (meth) acrylic acid and (b) (meth) acrylic acid alkyl ester.
- Examples of the (meth) acrylic acid alkyl ester include (meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester, (meth) acrylic acid butyl ester, (meth) acrylic acid 2-ethylhexyl ester, and (meth) acrylic acid ester. ) Acrylic acid hydroxyl ethyl ester.
- the copolymer may further contain other monomer that can be copolymerized with the component (a) and / or the component (b) as a constituent unit.
- Examples of the other monomer that can be copolymerized with the component (a) and / or the component (b) include (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, and (meth) acrylic.
- Acid diethylaminoethyl ester (meth) acrylic acid glycidyl ester, (meth) acrylic acid benzyl ester, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate , (Meth) acrylamide, (meth) acrylonitrile, diacetone (meth) acrylamide, styrene, and vinyltoluene.
- the above monomers may be used alone or in combination of two or more.
- the weight average molecular weight of the binder polymer as component (A) is the resolution and rust resistance of the protective film 200 formed. From the viewpoint, it is preferably 10,000 to 200,000, more preferably 15,000 to 150,000, still more preferably 30,000 to 150,000, and 30,000 to 100,000. Is particularly preferably 40,000 to 100,000.
- the acid value of the binder polymer as the component (A) is preferably 75 to 200 mgKOH / g, more preferably 75 to 150 mgKOH / g, and 75 to 120 mgKOH / g in terms of excellent patternability. More preferably.
- Photopolymerizable compound As the photopolymerizable compound as component (B), a photopolymerizable compound having an ethylenically unsaturated group can be used.
- Examples of the photopolymerizable compound having an ethylenically unsaturated group include a monofunctional vinyl monomer, a bifunctional vinyl monomer, and a polyfunctional vinyl monomer having at least three polymerizable ethylenically unsaturated groups.
- Examples of the photopolymerizable compound having an ethylenically unsaturated group include a monofunctional vinyl monomer having one polymerizable ethylenically unsaturated group in the molecule and two polymerizable ethylenically unsaturated groups in the molecule.
- Bifunctional vinyl monomers or polyfunctional vinyl monomers having at least three polymerizable ethylenically unsaturated groups in the molecule can be mentioned.
- (meth) acrylic acid used for the synthesis of a copolymer which is a suitable example of the component (A)
- (meth) acrylic-acid alkylester is mentioned.
- bifunctional vinyl monomer having two polymerizable ethylenically unsaturated groups in the molecule examples include polyethylene glycol di (meth) acrylate, trimethylolpropane di (meth) acrylate, polypropylene glycol di (meth) acrylate, 2 , 2-bis (4- (meth) acryloxypolyethoxypolypropoxyphenyl) propane, bisphenol A diglycidyl ether di (meth) acrylate, and the like.
- a (meth) acrylate compound having a skeleton derived from pentaerythritol, a (meth) acrylate compound having a skeleton derived from dipentaerythritol, a (meth) acrylate compound having a skeleton derived from trimethylolpropane, or ditrimethylolpropane It is preferable to include a (meth) acrylate compound having a skeleton derived from, and a (meth) acrylate compound having a skeleton derived from dipentaerythritol, a (meth) acrylate compound having a skeleton derived from trimethylolpropane, or a skeleton derived from ditrimethylolpropane It is more preferable that a (meth) acrylate compound having a skeleton is included, and it is further preferable that a (meth) acrylate compound having a skeleton derived from ditrimethylolpropan
- (meth) acrylate compound having a skeleton derived from will be described by taking a (meth) acrylate compound having a skeleton derived from ditrimethylolpropane as an example.
- (Meth) acrylate having a skeleton derived from ditrimethylolpropane means an esterified product of ditrimethylolpropane and (meth) acrylic acid, and the esterified product includes a compound modified with an alkyleneoxy group.
- the content of the component (A) and the component (B) is preferably 35 to 85 parts by mass of the component (A) with respect to 100 parts by mass of the total amount of the components (A) and (B).
- the amount is more preferably 80 parts by mass, still more preferably 50 to 70 parts by mass, and particularly preferably 55 to 65 parts by mass.
- the component (A) is preferably 35 parts by mass or more with respect to 100 parts by mass of the total amount of the component (A) and the component (B) in terms of maintaining the pattern formability and transparency of the cured film. 40 parts by mass or more, more preferably 50 parts by mass or more, and particularly preferably 55 parts by mass or more.
- the photosensitive resin composition of this embodiment contains an oxime ester compound and / or a phosphine oxide compound as a photoinitiator which is (C) component.
- the photosensitive resin layer 20 can be formed on the support film 10 with sufficient resolution even when the thickness is 10 ⁇ m or less. Furthermore, the photosensitive resin layer 20 excellent in transparency can also be formed.
- Examples of the oxime ester compound include 1,2-octanedione-1- [4- (phenylthio) phenyl] -2- (O-benzoyloxime) (trade name: IRGACURE-OXE-01, manufactured by BASF), 1 -[9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] ethanone 1- (O-acetyloxime) (trade name: IRGACURE-OXE-02, manufactured by BASF), 1-phenyl -1,2-propanedione-2- [O- (ethoxycarbonyl) oxime] (trade name: Quantacure-PDO, manufactured by Nippon Kayaku Co., Ltd.). These are used alone or in combination of two or more.
- 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (trade name: LUCIRIN TPO, from the transparency of the formed protective film and the pattern forming ability when the thickness is 10 ⁇ m or less. BASF) is preferred.
- the component (C) can be used in combination with a photopolymerization initiator other than the oxime ester compound and the phosphine oxide compound.
- a photopolymerization initiator other than oxime ester compounds and phosphine oxide compound include benzophenone, 4-methoxy-4′-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone.
- benzoin ether compounds such as benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, benzoin, Benzoin compounds such as methylbenzoin and ethylbenzoin; benzyl derivatives such as benzyldimethyl ketal; acridine derivatives such as 9-phenylacridine and 1,7-bis (9,9′-acridinyl) heptane; N-phenylglycine, N Phenylglycine derivatives; coumarin compounds; oxazole-based compounds.
- the content of the photopolymerization initiator as component (C) is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B), and 1 to 10 parts by mass. More preferably, the amount is 2 to 5 parts by mass.
- the content of the component (C) is preferably 0.1 parts by mass or more from the viewpoint of excellent photosensitivity and resolution, and 20 parts by mass or less from the viewpoint of excellent transmittance (visible light transmittance) at 400 to 700 nm. It is preferable that
- an adhesion imparting agent such as a rust inhibitor, an ultraviolet absorber, a silane coupling agent, a leveling agent, a plasticizer, a filler, an antifoaming agent.
- Flame retardants, stabilizers, antioxidants, fragrances, thermal crosslinking agents, polymerization inhibitors, etc. each containing about 0.01 to 20 parts by mass with respect to 100 parts by mass of the total amount of component (A) and component (B) Can be made. These can be used alone or in combination of two or more.
- the photosensitive resin composition of the present embodiment is preferably formed into a film and used like the photosensitive resin layer 20 of the photosensitive element 1.
- a roll-to-roll process can be easily realized, a solvent drying process can be shortened, and the manufacturing process can be greatly shortened and costs can be greatly reduced.
- the photosensitive resin layer 20 of the photosensitive element 1 can be formed by preparing a coating liquid containing the photosensitive resin composition of the present embodiment, and applying and drying the coating liquid on the support film 10.
- the coating solution can be obtained by uniformly dissolving or dispersing each component constituting the photosensitive resin composition of the present embodiment described above in a solvent.
- solvent ketone, aromatic hydrocarbon, alcohol, glycol ether, glycol alkyl ether, glycol alkyl ether acetate, ester, or diethylene glycol is used from the viewpoint of solubility of each component, ease of film formation, etc. Can do.
- solvents may be used alone or as a mixed solvent composed of two or more solvents.
- Application methods include, for example, doctor blade coating method, Meyer bar coating method, roll coating method, screen coating method, spinner coating method, inkjet coating method, spray coating method, dip coating method, gravure coating method, curtain coating method, die coating A coating method is mentioned.
- the drying conditions are not particularly limited, but the drying temperature is preferably 60 to 130 ° C., and the drying time is preferably 0.5 to 30 minutes.
- the thickness of the photosensitive resin layer 20 exerts a sufficient effect as the protective film 200 of the touch panel electrode, and is generated on the surface of the touch panel 100 that is generated when the protective film 200 partially protects the transparent electrodes 103 and 104.
- the thickness after drying is preferably 1 ⁇ m to 9 ⁇ m, and preferably 1 ⁇ m to 8 ⁇ m. More preferably, it is 2 ⁇ m or more and 8 ⁇ m or less, particularly preferably 3 ⁇ m or more and 8 ⁇ m or less, and particularly preferably 6 ⁇ m or more and 8 ⁇ m or less.
- the thickness of the protective film 200 which is a resin cured film formed by curing the photosensitive resin layer 20 is in the above range.
- the thickness of the protective film 200 satisfies the above range, the rust preventive property of the metal wiring 106 disposed in the frame region 105 can be improved.
- the photosensitive element 1 may further include other layers appropriately selected within a range where the effects of the present embodiment can be obtained. Other layers are not particularly limited and may be appropriately selected depending on the purpose. Examples of the other layer include a refractive index adjusting layer, a cushion layer, an oxygen shielding layer, a release layer, and an adhesive layer.
- the photosensitive element 1 may include one layer or two or more layers. When the photosensitive element 1 is provided with two or more other layers, the types of the other layers may be one or two or more.
- the photosensitive element 1 contains, for example, metal oxide particles such as titanium oxide and zirconium oxide on one surface 20a of the photosensitive resin layer 20 (the surface opposite to the support film 10 in the photosensitive resin layer 20). A resin layer (refractive index adjusting layer) may be further provided. When having the illustrated configuration, a phenomenon (so-called bone appearance phenomenon) in which the transparent electrode of the touch panel is visually recognized can be suppressed.
- the protective film 30 examples include polyethylene, polypropylene, polyethylene terephthalate, polycarbonate, polyethylene-vinyl acetate copolymer, and a film made of a laminated film of polyethylene-vinyl acetate copolymer and polyethylene.
- the protective film 30 can be made of, for example, biaxially oriented polypropylene (OPP).
- the thickness of the protective film 30 is preferably about 5 to 100 ⁇ m, but is preferably 70 ⁇ m or less, more preferably 60 ⁇ m or less, and further preferably 50 ⁇ m or less from the viewpoint of being wound in a roll. It is preferably 40 ⁇ m or less.
- the thickness of the protective film 30 can be set to 30 ⁇ m, for example.
- FIG. 7 is a perspective view showing a photosensitive element roll according to an embodiment.
- a photosensitive element roll 300 shown in FIG. 7 includes a winding core 301 and a wound body of the photosensitive element 1 wound around the winding core 301.
- the photosensitive element 1 may be stored (stored) in any form, but may be stored in the form of a photosensitive element roll 300 in which the photosensitive element 1 is wound into a roll.
- the winding core 301 has a cylindrical shape, for example.
- the material of the core 301 is not particularly limited as long as it is conventionally used.
- the photosensitive element 1 is preferably wound so that the support film 10 is on the outermost side.
- FIG. 8 is a schematic cross-sectional view for explaining a transfer mark.
- FIG. 9 is a schematic cross-sectional view for explaining the indentation.
- FIG. 8A when the bubble breakage trace 13 is formed on the one surface 10a of the support film 10, the other surface 20b of the photosensitive resin layer 20 (the surface facing the one surface 10a) is supported.
- a transfer mark 21 may be formed by transferring the bubble breakage mark 13 on the one surface 10a of the film 10.
- a protective film 30 (see FIG. 8A) is formed from one surface 20a of the photosensitive resin layer 20 using the photosensitive element 1 in which the transfer mark 21 is formed on the photosensitive resin layer 20. )) Is removed, the photosensitive resin layer 20 is provided on the transparent substrate 101 so that the one surface 20a is in contact with the transparent substrate 101.
- the support film 10 is provided on the other surface 20b of the photosensitive resin layer 20.
- the support film 10 is removed after the photosensitive resin layer 20 is provided on the transparent substrate 101.
- a transfer mark 21 or a surface defect caused by the transfer mark 21 is formed on the surface opposite to the transparent substrate 101 in the protective film 200 obtained from the photosensitive resin layer 20, a transfer mark 21 or a surface defect caused by the transfer mark 21 is formed.
- the transfer mark 21 has a shape in which the bubble break mark 13 is inverted. That is, the transfer mark 21 includes an annular recess 22 that is recessed from the other surface 20 b toward the transparent substrate 101, and a circular circular portion 23 that is surrounded by the recess 22.
- the recess 22 may have a continuous annular shape or a discontinuous annular shape that is interrupted in the middle.
- the recess 22 may have a substantially annular shape or an elliptical shape.
- the circular portion 23 may be flush with the other surface 20b.
- the circular portion 23 may protrude from the other surface 20b to the opposite side of the transparent substrate 101 to form a circular convex portion.
- the circular portion 23 may be recessed from the other surface 20b toward the transparent substrate 101 to form a circular recess.
- the circular portion 23 may have a substantially circular shape or an elliptical shape.
- illustration of the electrode for touchscreens is abbreviate
- an indentation 25 that is recessed in a circular shape from the one surface 20a may be formed.
- the photosensitive resin layer 20 is thinner than the other portions. For this reason, after removing the protective film 30 from the one surface 20 a of the photosensitive resin layer 20 using the photosensitive element 1 in which the indentation 25 is formed, the transparent substrate 101 is in contact with the transparent substrate 101.
- a photosensitive resin layer 20 is provided thereon.
- the support film 10 is provided on the other surface 20b of the photosensitive resin layer 20.
- the support film 10 is removed after the photosensitive resin layer 20 is provided on the transparent substrate 101.
- a circular recess 26 that is recessed from the other surface 20 b toward the transparent substrate 101 is formed in the portion of the photosensitive resin layer 20 where the indentation 25 is formed, corresponding to the indentation 25. Is done.
- the recess 26 may have a substantially circular shape or an elliptical shape. Thereby, the surface defect resulting from the recessed part 26 or the recessed part 26 is formed in the surface opposite to the transparent substrate 101 in the protective film 200 obtained from the photosensitive resin layer 20.
- illustration of the electrode for touchscreens is abbreviate
- the number of transfer marks 21 is equal to the number of bubble break marks 13 on the one surface 10a. Therefore, the density of the transfer marks 21 on the other surface 20b of the photosensitive resin layer 20 is 6 pieces / 0.25 m 2 or less, preferably 4 pieces / 0.25 m 2 or less, more preferably 2 pieces / 0. .25 m 2 or less. The density of the transfer marks 21 is preferably 1 piece / 0.25 m 2 or more. In this case, the yield of the support film 10 can be improved. As a result, the yield of the photosensitive element 1 can be improved.
- the number of transfer marks 21 may be a bubble breakage on the one surface 10a.
- the number is less than the number of the marks 13.
- the number of recesses 22 is equal to the number of transfer marks 21. Therefore, on the surface of the protective film 200 opposite to the transparent substrate 101, the density of the recesses 22 is 6 pieces / 0.25 m 2 or less, preferably 4 pieces / 0.25 m 2 or less, more preferably 2 pieces. Pieces / 0.25 m 2 or less. Moreover, it is preferable that the density of the recessed part 22 is 1 piece / 0.25m ⁇ 2 > or more. In this case, the yield of the support film 10 can be improved. As a result, the yield of the photosensitive element 1 can be improved.
- the number of indentations 25 is equal to or less than the number of bubble breakage marks 13 on the other surface 10b.
- the number of the indentations 25 may decrease as the protective film 30 becomes thicker, and may increase as the radial position of the photosensitive element roll 300 approaches the core 301.
- the density of the indentations 25 due to the pressing of the bubble breakage marks 13 is 30 pieces / 0.25 m 2 or less, preferably 20 pieces / 0.25 m 2 or less, more preferably 10 pieces / 0. 25 m 2 or less.
- the density of the indentation 25 is preferably 1 piece / 0.25 m 2 or more, more preferably 3 pieces / 0.25 m 2 or more, and further 6 pieces / 0.25 m 2 or more. preferable.
- the yield of the support film 10 can be improved.
- the yield of the photosensitive element 1 can be improved.
- the recess 26 is difficult to be formed in the protective film 200, so that a reduction in visibility can be suppressed.
- the probability that the bubble breakage trace 13 forms the recess 26 in the protective film 200 that finally affects the visibility through the impression 25 is about 1/5 from an empirical rule. That is, the ratio of the number of recesses 26 in the protective film 200 to the number of bubble breakage marks 13 on the other surface 10b is about 1/5 from an empirical rule. Therefore, on the surface of the protective film 200 opposite to the transparent substrate 101, the density of the recesses 26 is 6 pieces / 0.25 m 2 or less, preferably 4 pieces / 0.25 m 2 or less, more preferably 2 pieces.
- the density of the recessed part 26 is 1 piece / 0.25m ⁇ 2 > or more.
- the yield of the support film 10 can be improved.
- the yield of the photosensitive element 1 can be improved.
- the density of the bubble breakage marks 13 on the one surface 10a tends to be lower than the density of the bubble breakage marks 13 on the other surface 10b.
- the density of the transfer marks 21 is less than the density of the impressions 25.
- the number and diameter of the transfer marks 21 can be measured by, for example, laser microscope observation or optical microscope observation, similarly to the number and diameter of the bubble break marks 13.
- the number and diameter of the indentations 25 can be measured by, for example, laser microscope observation or optical microscope observation, similarly to the number and diameter of the bubble breakage marks 13.
- the diameter of the transfer mark 21 is, for example, 40 ⁇ m or more and 100 ⁇ m or less.
- the diameter of the transfer mark 21 is, for example, the long diameter of the transfer mark 21 or the diameter of the circumscribed circle of the transfer mark 21.
- the major axis of the transfer mark 21 is defined as the maximum length from the bottom to the bottom of the recess 22.
- the circumscribed circle of the transfer mark 21 is defined as the smallest circle that completely includes the transfer mark 21 (minimum inclusion circle).
- the major axis of the recess 22 is equal to the major axis of the transfer mark 21. That is, the major axis of the recess 22 is defined as the maximum length from the bottom to the bottom of the recess 22 and is, for example, 40 ⁇ m or more and 100 ⁇ m or less.
- the diameter of the indentation 25 is, for example, 100 ⁇ m or more and 1200 ⁇ m or less.
- the diameter of the indentation 25 is, for example, the major axis of the indentation 25 or the diameter of the circumscribed circle of the indentation 25.
- the major axis of the indentation 25 is defined as the maximum length from edge to edge of a circular recess.
- the circumscribed circle of the indentation 25 is defined as the smallest circle that completely includes the indentation 25 (minimum inclusion circle).
- the diameter of the recessed part 26 is 100 micrometers or more and 1200 micrometers or less, for example.
- the diameter of the recess 26 is, for example, the major axis of the recess 26 or the diameter of the circumscribed circle of the recess 26.
- the major axis of the recess 26 is defined as the maximum length from edge to edge of the circular recess.
- the circumscribed circle of the concave portion 26 is defined as the smallest circle (the minimum inclusive circle) that completely includes the concave portion 26.
- a polyimide film has a crater formed by dissolving and removing lubricant particles near the film surface by acid treatment of the film surface.
- This crater is caused by the lubricant particles and has a diameter of 10 to 500 nm. Therefore, even if the photosensitive element using this polyimide film as a support film is used for forming the protective film of the touch panel, the surface defect of the protective film due to the crater hardly affects the visibility of the image.
- the bubble breakage mark 13 has a diameter of 40 ⁇ m or more and 100 ⁇ m or less, and the surface defect of the protective film due to the bubble breakage mark is highly likely to affect the visibility of the image.
- the method for forming the protective film 200 includes, for example, a first step of providing the photosensitive resin layer 20 on the transparent substrate 101, a second step of exposing the photosensitive resin layer 20 by irradiating actinic rays, and exposure after exposure. And developing a photosensitive resin layer 20 to form a protective film 200 made of a cured film pattern of the photosensitive resin composition.
- the transparent electrodes 103 and 104 are sequentially formed on the one surface 101 a of the transparent substrate 101.
- the transparent electrode 103 and the transparent electrode 104 can be formed by, for example, a method of etching a transparent electrode layer formed on the one surface 101a.
- the metal wiring 106, the connection electrode 107 and the connection terminal 108 are formed on the one surface 101 a of the transparent substrate 101.
- the metal wiring 106, the connection electrode 107, and the connection terminal 108 may be formed after the formation of the transparent electrodes 103 and 104, or may be formed simultaneously with the formation of the transparent electrodes 103 and 104.
- the metal wiring 106 can be formed at the same time as the connection electrode 107 is formed by screen printing using a conductive paste material containing flaky silver, for example.
- the photosensitive element 1 includes a photosensitive resin layer 20 made of a photosensitive resin composition.
- the photosensitive resin layer is covered so as to cover the electrode for the touch panel provided on the one surface 101 a while heating the support film 10 and the photosensitive resin layer 20. 20 is pressure-bonded, and the photosensitive resin layer 20 is laminated on the one surface 101a and the touch panel electrode.
- Crimping means includes a crimping roll.
- the pressure roll may be provided with a heating means so that it can be heat-pressure bonded.
- the heating temperature in the case of thermocompression bonding is such that the adhesiveness between the photosensitive resin layer 20 and the transparent substrate 101 and the adhesiveness between the photosensitive resin layer 20 and the touch panel electrode are sufficiently ensured.
- the temperature is preferably 10 to 180 ° C., more preferably 20 to 160 ° C., and still more preferably 30 to 150 ° C. so that the constituent components are not easily cured or thermally decomposed.
- the pressure during thermocompression bonding is 50 to 1 ⁇ 10 5 N / m in terms of linear pressure from the viewpoint of suppressing deformation of the transparent substrate 101 while ensuring sufficient adhesion between the photosensitive resin layer 20 and the transparent substrate 101.
- it is 2.5 ⁇ 10 2 to 5 ⁇ 10 4 N / m, more preferably 5 ⁇ 10 2 to 4 ⁇ 10 4 N / m.
- the preheating temperature at this time is preferably 30 to 180 ° C.
- a predetermined portion of the photosensitive resin layer 20 is irradiated with actinic rays including ultraviolet rays in a pattern via a photomask.
- a transparent polymer film is used as the support film 10 on the photosensitive resin layer 20 when irradiating with actinic rays, it is activated through the support film 10 with the support film 10 remaining on the photosensitive resin layer 20. After irradiation with light, the support film 10 is peeled from the photosensitive resin layer 20. From the viewpoint of protecting the photosensitive resin layer 20, it is preferable to use a transparent polymer film as the support film 10.
- an opaque polymer film is used as the support film 10
- the support film 10 is peeled from the photosensitive resin layer 20, and then the photosensitive resin layer 20 is irradiated with actinic rays.
- the support film 10 is generally peeled by hand, but can be efficiently processed by using some kind of jig or machine.
- a known active light source can be used, and examples thereof include a carbon arc lamp, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a xenon lamp, and the like, and are not particularly limited as long as they emit ultraviolet rays effectively.
- the irradiation amount of actinic rays is usually 1 ⁇ 10 2 to 1 ⁇ 10 4 J / m 2 , and heating can be accompanied during irradiation. If the irradiation amount of actinic rays is less than 1 ⁇ 10 2 J / m 2 , the photocuring effect tends to be insufficient, and if it exceeds 1 ⁇ 10 4 J / m 2 , the photosensitive resin layer 20 changes color. Tend to.
- the photosensitive resin layer 20 after irradiation with actinic rays is developed with a developer to remove portions not irradiated with actinic rays (that is, other than the predetermined portions of the photosensitive resin layer 20).
- a protective film 200 having a thickness of 10 ⁇ m or less and formed of a cured film pattern of the conductive resin composition is formed.
- the protective film 200 has a predetermined pattern and covers the touch panel electrode. Thereby, the touch panel 100 provided with the protective film 200 is obtained.
- development is performed by a known method such as spraying, showering, rocking dipping, brushing, scraping, etc., using a known developing solution such as an alkaline aqueous solution, an aqueous developer, or an organic solvent, and unnecessary portions are removed. And the like.
- a known developing solution such as an alkaline aqueous solution, an aqueous developer, or an organic solvent, and unnecessary portions are removed. And the like.
- alkaline water is preferable from the viewpoint of environment and safety.
- the method for forming the protective film 200 further includes a step of further curing the cured film pattern of the photosensitive resin composition to form the protective film 200 by irradiating the developed photosensitive resin layer 20 with actinic rays. But you can.
- the density of the bubble breakage marks 13 on the other surface 10b of the support film 10 is 30 pieces / 0.25 m 2 or less, and the diameter of the bubble breakage marks 13 is 40 ⁇ m or more and 100 ⁇ m. It is as follows.
- the bubble breakage mark 13 on the other surface 10b of the support film 10 becomes a factor for forming the indentation 25 in the photosensitive resin layer 20.
- a concave portion 26 corresponding to the indentation 25 is formed in the protective film 200 and can be identified by the naked eye. 26 may lead to a decrease in image visibility.
- the probability that the bubble destruction mark 13 forms the recess 26 in the protective film 200 that finally affects the visibility through the indentation 25 is about 1/5 from an empirical rule. Therefore, in the photosensitive element 1, when the density of the bubble breakage marks 13 satisfies the above range, the number of the recesses 26 per display device having an existing representative size can be easily suppressed to less than one.
- the influence of the recessed part 26 with respect to visibility can be suppressed because the diameter of the bubble breakage trace 13 satisfy
- the bubble breakage mark 13 is a mark due to the burst of bubbles in the skin layer 12. Therefore, by defining the density and diameter of the bubble breakage marks 13 due to the bursting of the bubbles in the skin layer 12, the influence of the recesses 26 on the visibility can be more reliably suppressed.
- the photosensitive element 1 includes a protective film 30.
- the photosensitive resin layer 20 can be protected by the protective film 30, it can suppress that defects, such as a crack, arise in the photosensitive resin layer 20. FIG. Therefore, it is possible to more reliably suppress a decrease in image visibility.
- the density of the bubble breakage marks 13 on the one surface 10a of the support film 10 is 6 pieces / 0.25 m 2 or less, and the diameter of the bubble breakage mark 13 is not less than 40 ⁇ m and not more than 100 ⁇ m.
- the bubble-break marks 13 on the one surface 10 a of the support film 10 cause the transfer marks 21 in the photosensitive resin layer 20.
- the transfer mark 21 that can be identified by the naked eye may lead to a decrease in image visibility. .
- this photosensitive element roll 300 when applying the electrode for touch panels to the protective film 200, it is possible to suppress a decrease in the visibility of an image derived from the defects on both the one surface 10a and the other surface 10b of the support film 10.
- the photosensitive element roll 300 includes the wound body of the photosensitive element 1, the number of the concave portions 26 per display device having an existing representative size is suppressed to less than one. Therefore, in this photosensitive element roll 300, when applying the touch panel electrode to the protective film 200, it is possible to suppress a decrease in the visibility of the image.
- binder polymer solution (A1) A flask equipped with a stirrer, reflux condenser, inert gas inlet and thermometer was charged with (1) shown in Table 1, heated to 80 ° C. in a nitrogen gas atmosphere, and the reaction temperature was increased to 80 ° C. ⁇ While maintaining at 2 ° C., (2) shown in Table 1 was uniformly added dropwise over 4 hours. After dropping (2), stirring was continued at 80 ° C. ⁇ 2 ° C. for 6 hours, and a binder polymer solution (solid content 45% by mass) (A1) having a weight average molecular weight of about 65,000 and an acid value of 78 mgKOH / g was obtained. Obtained.
- the weight average molecular weight (Mw) was derived by converting the value measured by gel permeation chromatography (GPC) using a standard polystyrene calibration curve.
- GPC gel permeation chromatography
- the GPC conditions are shown below. ⁇ GPC conditions> Pump: L-6000 (product name, manufactured by Hitachi, Ltd.) Column: Gelpack GL-R420, Gelpack GL-R430, Gelpack GL-R440 (product name, manufactured by Hitachi Chemical Co., Ltd.) Eluent: Tetrahydrofuran Measurement temperature: 40 ° C Flow rate: 2.05 mL / min Detector: L-3300 (RI detector, manufactured by Hitachi, Ltd., product name)
- the acid value was measured by a neutralization titration method based on JIS K0070 as shown below.
- the solid solution was obtained by heating the binder polymer solution at 130 ° C. for 1 hour to remove volatile components.
- 30 g of acetone was added to the binder polymer, and this was uniformly dissolved to obtain a resin solution.
- an appropriate amount of an indicator, phenolphthalein was added to the resin solution, and neutralization titration was performed using a 0.1 mol / L potassium hydroxide aqueous solution.
- the acid value was computed by following Formula.
- Acid value 0.1 ⁇ V ⁇ f 1 ⁇ 56.1 / (Wp ⁇ I / 100)
- V is a titration amount (mL) of a 0.1 mol / L potassium hydroxide aqueous solution used for the titration
- f 1 is a factor (concentration conversion factor) of the 0.1 mol / L potassium hydroxide aqueous solution
- Wp is The mass (g) and I of the measured resin solution indicate the proportion (mass%) of the non-volatile content in the measured resin solution.
- T-1420 ditrimethylolpropane tetraacrylate (manufactured by Nippon Kayaku Co., Ltd., product name)
- C Component IRGACURE OXE 01: 1,2-octanedione, 1-[(4-phenylthio) phenyl-, 2- (O-benzoyloxime)] (manufactured by BASF Corporation, product name)
- HAT 5-amino-1H-tetrazole (product name, manufactured by Toyobo Co., Ltd.)
- PM-21 Phosphate ester containing ethylenically unsaturated group (product name) manufactured by Nippon Kayaku Co., Ltd.
- Antage W-500 (AW-500): 2,2′-methylene-bis (4-ethyl-6-tert-butylphenol) (product name, manufactured by Kawaguchi Chemical Co., Ltd.) SH-30: Octamethylcyclotetrasiloxane (manufactured by Toray Dow Corning Co., Ltd., product name)
- Example 1 After a polyethylene terephthalate film having a thickness of 16 ⁇ m was formed as a support film, a coating solution for forming the photosensitive resin layer prepared above was uniformly applied on the support film using a comma coater. Subsequently, the solvent was removed by drying for 3 minutes with a hot air convection dryer at 100 ° C. to form a photosensitive resin layer having a thickness of 8 ⁇ m.
- a 30 ⁇ m-thick polypropylene film (manufactured by Oji F-Tex Co., Ltd., product name: E-201F) is further bonded as a protective film on the obtained photosensitive resin layer to produce a photosensitive element.
- the photosensitive element is wound around a cylindrical core (width 500 mm, outer diameter 84 mm, inner diameter 76 mm) with a tension of 90 N / m so that the support film is arranged on the outermost side. A roll was produced.
- Example 2 A photosensitive element roll was produced after producing a photosensitive element in the same manner as in Example 1 except that the degree of vacuum when forming the supporting film was changed and a supporting film having a different density of bubble breakage was formed. did.
- the density of bubble breakage marks having a diameter of 40 ⁇ m or more and 100 ⁇ m or less on one side of the support film is 6 / 0.25 m 2 or less, and the diameter of the other side of the support film is 40 ⁇ m.
- the density of broken bubble marks of 100 ⁇ m or less is 30 / 0.25 m 2 or less. Therefore, according to the photosensitive element and photosensitive element roll of each Example, it has been confirmed that a decrease in the visibility of the image can be suppressed when the touch panel electrode is applied to the protective film.
- SYMBOLS 1 ... Photosensitive element, 10 ... Support film, 10a ... One side, 10b ... The other side, 11 ... Core layer, 12 ... Skin layer, 13 ... Foam mark, 14 ... Projection part, 15 ... Circular part, 20 ... Photosensitivity 20a ... one side, 20b ... the other side, 21 ... transfer mark, 22 ... concave part, 23 ... circular part, 25 ... impression, 26 ... concave part, 30 ... protective film, 100 ... touch panel (electrode structure), DESCRIPTION OF SYMBOLS 101 ... Transparent substrate (board
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Human Computer Interaction (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
Abstract
Description
まず、図1を参照して、本実施形態に係る感光性エレメント1(図2参照)を用いて形成された保護膜200を備えるタッチパネル(電極構造体)100について説明する。図1は、タッチパネルの一例を示す平面図である。図1に示されるタッチパネル100は、静電容量方式のタッチパネルである。静電容量方式のタッチパネルは、指先(導電体)が接触したときの静電容量の変化を検出することにより、タッチ位置を検出する。
図2は、一実施形態に係る感光性エレメントを示す模式断面図である。図2に示される感光性エレメント1は、タッチパネル用電極の保護膜200(図1参照)の形成に用いられる。
支持フィルム10としては、重合体フィルムを用いることができる。重合体フィルムとしては、例えば、ポリエチレンテレフタレート、ポリプロピレン、ポリイミド、及びポリアミドからなる群より選ばれる少なくとも1種以上の樹脂材料を含むフィルムが挙げられる。
感光性樹脂層20は、感光性樹脂組成物により形成される。感光性樹脂組成物は、バインダーポリマー(以下、(A)成分ともいう)と、光重合性化合物(以下、(B)成分ともいう)と、光重合開始剤(以下、(C)成分ともいう)と、を含有する。
本実施形態において、(A)成分は、(a)(メタ)アクリル酸、及び(b)(メタ)アクリル酸アルキルエステルに由来する構成単位を含有する共重合体が好適である。
(B)成分である光重合性化合物としては、エチレン性不飽和基を有する光重合性化合物を用いることができる。
本実施形態の感光性樹脂組成物は、(C)成分である光重合開始剤として、オキシムエステル化合物及び/又はホスフィンオキサイド化合物を含むことが好ましい。オキシムエステル化合物及び/又はホスフィンオキサイド化合物を含むことにより、支持フィルム10上に、厚さが10μm以下の薄膜であっても充分な解像度で感光性樹脂層20を形成することができる。更に、透明性にも優れた感光性樹脂層20を形成することもできる。
本実施形態の感光性樹脂組成物には、その他、必要に応じて、防錆剤、紫外線吸収剤、シランカップリング剤等の密着性付与剤、レベリング剤、可塑剤、充填剤、消泡剤、難燃剤、安定剤、酸化防止剤、香料、熱架橋剤、重合禁止剤などを(A)成分及び(B)成分の合計量100質量部に対し、各々0.01~20質量部程度含有させることができる。これらは、単独で又は2種類以上を組み合わせて使用できる。
保護フィルム30の厚さは、5~100μm程度が好ましいが、ロール状に巻いて保管する観点から、70μm以下であることが好ましく、60μm以下であることがより好ましく、50μm以下であることが更に好ましく、40μm以下であることが特に好ましい。保護フィルム30の厚さは、例えば、30μmとすることができる。
図7は、一実施形態に係る感光性エレメントロールを示す斜視図である。図7に示される感光性エレメントロール300は、巻芯301と、巻芯301に巻回された感光性エレメント1の巻回体と、を備えている。感光性エレメント1は、どのような形態で保存(貯蔵)してもよいが、感光性エレメント1がロール状に巻き取られてなる感光性エレメントロール300の形態で保存することができる。
次に、図1及び図2を参照して、一実施形態に係る感光性エレメント1を用いて、保護膜200を形成する方法の一例について説明する。
撹拌機、還流冷却器、不活性ガス導入口及び温度計を備えたフラスコに、表1に示される(1)を仕込み、窒素ガス雰囲気下で80℃に昇温し、反応温度を80℃±2℃に保ちながら、表1に示される(2)を4時間かけて均一に滴下した。(2)の滴下後、80℃±2℃で6時間撹拌を続け、重量平均分子量が約65,000、酸価が78mgKOH/gのバインダーポリマーの溶液(固形分45質量%)(A1)を得た。
ゲルパーミエーションクロマトグラフィー法(GPC)により測定された値を、標準ポリスチレンの検量線を用いて換算することにより、重量平均分子量(Mw)を導出した。GPCの条件を以下に示す。
<GPC条件>
ポンプ:L-6000(株式会社日立製作所製、製品名)
カラム:Gelpack GL-R420、Gelpack GL-R430、Gelpack GL-R440(以上、日立化成株式会社製、製品名)
溶離液:テトラヒドロフラン
測定温度:40℃
流量:2.05mL/分
検出器:L-3300(RI検出器、株式会社日立製作所製、製品名)
下記に示されるようなJIS K0070に基づいた中和滴定法により、酸価を測定した。まず、バインダーポリマーの溶液を130℃で1時間加熱し、揮発分を除去することにより固形分を得た。次いで、上記固形分のバインダーポリマー1gを精秤した後、このバインダーポリマーにアセトンを30g添加し、これを均一に溶解することにより、樹脂溶液を得た。次いで、指示薬であるフェノールフタレインをその樹脂溶液に適量添加して、0.1mol/Lの水酸化カリウム水溶液を用いて中和滴定を行った。そして、次式により酸価を算出した。
酸価=0.1×V×f1×56.1/(Wp×I/100)
上記式中、Vは滴定に用いた0.1mol/Lの水酸化カリウム水溶液の滴定量(mL)、f1は0.1mol/Lの水酸化カリウム水溶液のファクター(濃度換算係数)、Wpは測定した樹脂溶液の質量(g)、Iは測定した上記樹脂溶液中の不揮発分の割合(質量%)を示す。
・(A)成分
A1:モノマー配合比(メタクリル酸/メタクリル酸メチル/アクリル酸エチル/2,2’-アゾビス(イソブチロニトリル)=12/58/30/1.5(質量比))である共重合体のプロピレングリコールモノメチルエーテル/トルエン溶液、重量平均分子量65,000、酸価78mgKOH/g、水酸基価2mgKOH/g、ガラス転移温度60℃
・(B)成分
T-1420(T):ジトリメチロールプロパンテトラアクリレート(日本化薬株式会社製、製品名)
・(C)成分
IRGACURE OXE 01:1,2-オクタンジオン,1-[(4-フェニルチオ)フェニル-,2-(O-ベンゾイルオキシム)](BASF株式会社製、製品名)
・その他の成分
HAT:5-アミノ-1H-テトラゾール(東洋紡績株式会社製、製品名)
PM-21:エチレン性不飽和基を含むリン酸エステル(日本化薬株式会社製、製品名)
Antage W-500(AW-500):2,2’-メチレン-ビス(4-エチル-6-tert-ブチルフェノール)(川口化学株式会社製、製品名)
SH-30:オクタメチルシクロテトラシロキサン(東レ・ダウコーニング株式会社製、製品名)
(実施例1)
厚さ16μmのポリエチレンテレフタレートフィルムを支持フィルムとして形成した後、上記で作製した感光性樹脂層を形成するための塗布液を支持フィルム上にコンマコーターを用いて均一に塗布した。続いて、100℃の熱風対流式乾燥機で3分間乾燥して溶剤を除去し、厚さ8μmの感光性樹脂層を形成した。
支持フィルムを形成する際の真空度を変更し、破泡痕の密度が異なる支持フィルムを形成した以外は、実施例1と同様にして、感光性エレメントを作製した後、感光性エレメントロールを作製した。
作製した各実施例の感光性エレメントロールから、0.5m四方の感光性エレメントの試料片を切り出した。続いて、試料片から保護フィルムを剥離した後、支持フィルムが下方を向くと共に、感光性樹脂層が上方を向くように、試料片を試料台に配置した。次に、光学顕微鏡を用いて、支持フィルムの一方面、及び他方面にピントを合わせ、それぞれの面における径が40μm以上100μm以下である破泡痕の数を測定し、密度(個/0.25m2)に換算した。一方面及び他方面における径40μm以上100μm以下の破泡痕の密度(個/0.25m2)を表3に示す。
Claims (12)
- 支持フィルムと、
前記支持フィルムの一方面に設けられた感光性樹脂層と、
前記感光性樹脂層における前記支持フィルムの反対面に設けられた保護フィルムと、を備え、
前記支持フィルムの他方面において、破泡痕の密度は、30個/0.25m2以下であり、かつ、前記破泡痕の径は、40μm以上100μm以下である、感光性エレメント。 - 前記破泡痕の径は、前記破泡痕の長径である、請求項1に記載の感光性エレメント。
- 前記破泡痕の径は、前記破泡痕の外接円の直径である、請求項1に記載の感光性エレメント。
- 前記破泡痕の密度は、1個/0.25m2以上である、請求項1~3のいずれか一項に記載の感光性エレメント。
- 前記支持フィルムは、樹脂を含み、
前記破泡痕は、前記樹脂中の気泡の破裂による痕である、請求項1~4のいずれか一項に記載の感光性エレメント。 - 前記支持フィルムは、コア層と、前記コア層上に設けられたスキン層と、を有し、
前記破泡痕は、前記スキン層中の気泡の破裂による痕である、請求項1~5のいずれか一項に記載の感光性エレメント。 - タッチパネル用電極の保護膜の形成に用いられる、請求項1~6のいずれか一項に記載の感光性エレメント。
- 前記一方面において、前記樹脂中の気泡の破裂による破泡痕の密度は、6個/0.25m2以下であり、かつ、前記破泡痕の径は、40μm以上100μm以下である、請求項1~7のいずれか一項に記載の感光性エレメント。
- 請求項1~8のいずれか一項に記載の感光性エレメントの巻回体を備え、
前記感光性樹脂層における前記支持フィルムの反対面において、前記破泡痕の押圧による圧痕の密度は、30個/0.25m2以下であり、かつ、前記圧痕の径は、100μm以上1200μm以下である、感光性エレメントロール。 - 前記圧痕の径は、前記圧痕の長径である、請求項9に記載の感光性エレメントロール。
- 前記圧痕の径は、前記圧痕の外接円の直径である、請求項9に記載の感光性エレメントロール。
- 前記圧痕の密度は、6個/0.25m2以上である、請求項9~11のいずれか一項に記載の感光性エレメントロール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201880021374.8A CN110462518A (zh) | 2017-03-31 | 2018-03-26 | 感光性元件及感光性元件卷 |
KR1020197028603A KR20190133009A (ko) | 2017-03-31 | 2018-03-26 | 감광성 엘리먼트 및 감광성 엘리먼트 롤 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPPCT/JP2017/013698 | 2017-03-31 | ||
PCT/JP2017/013698 WO2018179370A1 (ja) | 2017-03-31 | 2017-03-31 | 感光性エレメント及び感光性エレメントロール |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018181209A1 true WO2018181209A1 (ja) | 2018-10-04 |
Family
ID=61756507
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/013698 WO2018179370A1 (ja) | 2017-03-31 | 2017-03-31 | 感光性エレメント及び感光性エレメントロール |
PCT/JP2018/012196 WO2018181209A1 (ja) | 2017-03-31 | 2018-03-26 | 感光性エレメント及び感光性エレメントロール |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/013698 WO2018179370A1 (ja) | 2017-03-31 | 2017-03-31 | 感光性エレメント及び感光性エレメントロール |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6299940B1 (ja) |
KR (1) | KR20190133009A (ja) |
CN (1) | CN110462518A (ja) |
WO (2) | WO2018179370A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020012651A1 (ja) * | 2018-07-13 | 2020-01-16 | 日立化成株式会社 | センシングデバイス用感光性フィルムロールの製造方法及びセンシングデバイス用感光性フィルムロール |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62284716A (ja) * | 1986-06-04 | 1987-12-10 | Toray Ind Inc | ポリエステルの成形方法 |
WO2006059534A1 (ja) * | 2004-12-01 | 2006-06-08 | Fujifilm Corporation | パターン形成材料及びパターン形成方法 |
JP2015172674A (ja) * | 2014-03-12 | 2015-10-01 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、硬化膜付き透明基板の製造方法及び硬化膜付き透明基板 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3380616B2 (ja) | 1994-03-16 | 2003-02-24 | 日立化成工業株式会社 | カバーレイ形成用感光性樹脂組成物、感光性フィルム、カバーレイの製造方法及びカバーレイ |
JPH11133617A (ja) | 1997-10-28 | 1999-05-21 | Hitachi Chem Co Ltd | ケミカルミーリング用感光性樹脂組成物及びこれを用いた感光性フィルム |
JPH11147246A (ja) * | 1997-11-17 | 1999-06-02 | Sekisui Chem Co Ltd | 超高分子量ポリエチレンシートの製造方法 |
JP3406544B2 (ja) * | 1999-03-18 | 2003-05-12 | 日立化成工業株式会社 | 感光性エレメント、これを用いたレジストパターンの製造法、プリント配線板の製造法及びリードフレームの製造法 |
JP3788429B2 (ja) * | 1999-03-18 | 2006-06-21 | 日立化成工業株式会社 | レジストパターンの製造法、プリント配線板の製造法及びリードフレームの製造法 |
JP4178506B2 (ja) * | 2002-09-30 | 2008-11-12 | 日立化成工業株式会社 | 反射下地感光性エレメント |
JP2004191877A (ja) * | 2002-12-13 | 2004-07-08 | Asahi Kasei Chemicals Corp | フレキソ印刷用感光性構成体 |
JP4323185B2 (ja) * | 2003-02-27 | 2009-09-02 | 旭化成イーマテリアルズ株式会社 | 印刷版用円筒状クッション構成体 |
JP4449402B2 (ja) | 2003-08-25 | 2010-04-14 | 日立化成工業株式会社 | 永久レジスト用感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板 |
JP2006106287A (ja) * | 2004-10-04 | 2006-04-20 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法 |
JP5201066B2 (ja) | 2008-06-19 | 2013-06-05 | Jsr株式会社 | タッチパネルの保護膜形成用感放射線性樹脂組成物とその形成方法 |
JP5617329B2 (ja) | 2010-04-28 | 2014-11-05 | 東洋インキScホールディングス株式会社 | 感光性樹脂組成物およびタッチパネル用絶縁膜 |
CN104364079B (zh) * | 2012-06-29 | 2017-12-12 | 圣戈班性能塑料帕姆普斯有限公司 | 包含底漆体系作为粘附促进剂的滑动轴承 |
WO2014175274A1 (ja) * | 2013-04-24 | 2014-10-30 | 日立化成株式会社 | 感光性エレメント、感光性エレメントロール、レジストパターンの製造方法及び電子部品 |
-
2017
- 2017-03-31 JP JP2017566044A patent/JP6299940B1/ja active Active
- 2017-03-31 WO PCT/JP2017/013698 patent/WO2018179370A1/ja active Application Filing
-
2018
- 2018-03-26 KR KR1020197028603A patent/KR20190133009A/ko unknown
- 2018-03-26 WO PCT/JP2018/012196 patent/WO2018181209A1/ja active Application Filing
- 2018-03-26 CN CN201880021374.8A patent/CN110462518A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62284716A (ja) * | 1986-06-04 | 1987-12-10 | Toray Ind Inc | ポリエステルの成形方法 |
WO2006059534A1 (ja) * | 2004-12-01 | 2006-06-08 | Fujifilm Corporation | パターン形成材料及びパターン形成方法 |
JP2015172674A (ja) * | 2014-03-12 | 2015-10-01 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、硬化膜付き透明基板の製造方法及び硬化膜付き透明基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20190133009A (ko) | 2019-11-29 |
JP6299940B1 (ja) | 2018-03-28 |
WO2018179370A1 (ja) | 2018-10-04 |
CN110462518A (zh) | 2019-11-15 |
JPWO2018179370A1 (ja) | 2019-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6589953B2 (ja) | 感光性エレメント | |
CN104122755B (zh) | 感光性元件、感光性元件卷、抗蚀图案的制造方法以及电子部件 | |
WO2013151052A1 (ja) | 導電パターンの形成方法及び導電パターン基板 | |
JP2013200577A (ja) | 樹脂硬化膜パターンの形成方法、感光性樹脂組成物、感光性エレメント、タッチパネルの製造方法及び樹脂硬化膜 | |
JP2015014783A (ja) | 硬化膜付き透明基材の製造方法、感光性樹脂組成物、感光性エレメント、及び電子部品 | |
JP6551277B2 (ja) | 硬化膜付きタッチパネル用基材の製造方法、それに用いる感光性樹脂組成物、感光性エレメント及びタッチパネル | |
JP6206028B2 (ja) | 導電パターンの製造方法、その方法により製造された導電パターンを備える導電パターン基板、その導電パターン基板を含むタッチパネルセンサ、及び感光性導電フィルム | |
JP6299940B1 (ja) | 感光性エレメント及び感光性エレメントロール | |
JP6332577B1 (ja) | 感光性エレメント | |
JP2017009702A (ja) | 感光性樹脂組成物及び感光性エレメント | |
JP2018173773A (ja) | 電極構造体及びタッチパネル | |
JP2018173774A (ja) | 電極構造体及びタッチパネル | |
JP2015146038A (ja) | 樹脂硬化膜パターンの形成方法、感光性樹脂組成物、感光性エレメント、タッチパネルの製造方法及び樹脂硬化膜 | |
JP6399175B2 (ja) | 導電パターンの製造方法、その方法により製造された導電パターンを備える導電パターン基板、その導電パターン基板を含むタッチパネルセンサ、及び感光性導電フィルム | |
JP2018005186A (ja) | 感光性樹脂組成物、感光性樹脂積層体、樹脂パターンの製造方法、硬化膜及び表示装置 | |
WO2020054075A1 (ja) | 転写型感光性フィルム、樹脂硬化膜の形成方法及び樹脂硬化膜付センサ基板の製造方法 | |
JP2017198878A (ja) | 感光性導電フィルム及びそれを用いた導電パターン、導電パターン基板、タッチパネルセンサの製造方法 | |
WO2018008697A1 (ja) | 感光性樹脂組成物、感光性エレメント、タッチパネル電極の保護膜、タッチパネル、及びタッチパネル電極の保護膜の製造方法 | |
WO2018181722A1 (ja) | タッチパネル電極の保護膜及びタッチパネル | |
WO2018134883A1 (ja) | 感光性樹脂組成物、感光性エレメント、タッチパネル電極の保護膜及びタッチパネル | |
WO2018008599A1 (ja) | 感光性導電フィルム、導電パターンの製造方法、導電パターン基板及びタッチパネルセンサ | |
JP2019191492A (ja) | 感光性フィルムロール及びそれを用いたタッチパネル用電極の保護膜形成用感光性フィルムロール | |
JP2019046499A (ja) | 硬化膜付きタッチパネル用基材の製造方法、それに用いる感光性樹脂組成物、感光性エレメント及びタッチパネル | |
WO2018138879A1 (ja) | 感光性導電フィルム、導電パターンの形成方法、導電パターン基材の製造方法、導電パターン基材、タッチパネルセンサ | |
JPWO2013084872A1 (ja) | 樹脂硬化膜パターンの形成方法、感光性樹脂組成物、感光性エレメント、タッチパネルの製造方法及び樹脂硬化膜 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18776126 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20197028603 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18776126 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |