WO2018180417A1 - Procédé et dispositif de traçage - Google Patents

Procédé et dispositif de traçage Download PDF

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Publication number
WO2018180417A1
WO2018180417A1 PCT/JP2018/009450 JP2018009450W WO2018180417A1 WO 2018180417 A1 WO2018180417 A1 WO 2018180417A1 JP 2018009450 W JP2018009450 W JP 2018009450W WO 2018180417 A1 WO2018180417 A1 WO 2018180417A1
Authority
WO
WIPO (PCT)
Prior art keywords
scribe line
glass substrate
line
laser
forming step
Prior art date
Application number
PCT/JP2018/009450
Other languages
English (en)
Japanese (ja)
Inventor
弘義 林
郁祥 中谷
Original Assignee
三星ダイヤモンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星ダイヤモンド工業株式会社 filed Critical 三星ダイヤモンド工業株式会社
Priority to KR1020197029366A priority Critical patent/KR20190129914A/ko
Priority to JP2019509179A priority patent/JP7456604B2/ja
Priority to CN201880022170.6A priority patent/CN110475754B/zh
Publication of WO2018180417A1 publication Critical patent/WO2018180417A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Abstract

Le but de la présente invention est de réaliser, lors de la formation d'une ligne de traçage sur un substrat en verre par traitement laser, le traitement de façon à faciliter une séparation ultérieure. Le procédé de traçage est un procédé de traçage d'un substrat de verre G et comprend les étapes suivantes. Une étape de formation de ligne de traçage pour former une ligne de traçage 31 par exécution intermittente d'un traitement interne pulsé sur le substrat de verre G dans la direction planaire à l'aide d'un dispositif laser 3. Une étape de formation de ligne de rupture pour former une ligne de rupture 33 le long de la ligne de traçage 31 par exécution intermittente d'un traitement interne pulsé sur le substrat de verre G dans la direction planaire à l'aide du dispositif laser 3.
PCT/JP2018/009450 2017-03-31 2018-03-12 Procédé et dispositif de traçage WO2018180417A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020197029366A KR20190129914A (ko) 2017-03-31 2018-03-12 스크라이브 가공 방법 및 스크라이브 가공 장치
JP2019509179A JP7456604B2 (ja) 2017-03-31 2018-03-12 スクライブ加工方法及びスクライブ加工装置
CN201880022170.6A CN110475754B (zh) 2017-03-31 2018-03-12 刻划加工方法和刻划加工装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-071342 2017-03-31
JP2017072757 2017-03-31
JP2017-072757 2017-03-31
JP2017071342 2017-03-31

Publications (1)

Publication Number Publication Date
WO2018180417A1 true WO2018180417A1 (fr) 2018-10-04

Family

ID=63677422

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/009450 WO2018180417A1 (fr) 2017-03-31 2018-03-12 Procédé et dispositif de traçage

Country Status (5)

Country Link
JP (1) JP7456604B2 (fr)
KR (1) KR20190129914A (fr)
CN (1) CN110475754B (fr)
TW (1) TW201841840A (fr)
WO (1) WO2018180417A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009072829A (ja) * 2007-09-21 2009-04-09 Icu Research & Industrial Cooperation Group 超短パルスレーザービームを利用した基板切断装置及びその切断方法
JP2015506902A (ja) * 2012-02-01 2015-03-05 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 非金属材料を分離するためのシステム及び方法

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
US6420678B1 (en) 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
JP2007185664A (ja) * 2006-01-11 2007-07-26 Seiko Epson Corp レーザ内部スクライブ方法
US9701581B2 (en) * 2009-06-04 2017-07-11 Corelase Oy Method and apparatus for processing substrates using a laser
AU2011279374A1 (en) 2010-07-12 2013-02-07 Filaser Usa Llc Method of material processing by laser filamentation
JP5887928B2 (ja) * 2011-12-28 2016-03-16 三星ダイヤモンド工業株式会社 被加工物の分断方法および光学素子パターン付き基板の分断方法
JP5991860B2 (ja) * 2012-06-19 2016-09-14 三星ダイヤモンド工業株式会社 ガラス基板の加工方法
AT13206U1 (de) * 2012-07-17 2013-08-15 Lisec Maschb Gmbh Verfahren und Anordnung zum Teilen von Flachglas
CN102898013A (zh) * 2012-09-07 2013-01-30 东莞光谷茂和激光技术有限公司 一种紫外激光切割玻璃基板的方法
EP2781296B1 (fr) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Dispositif et procédé de découpe de contours à partir de substrats plats au moyen d'un laser
CN103771694B (zh) 2014-01-08 2017-03-08 合肥鑫晟光电科技有限公司 激光切割方法及激光切割系统
US9776906B2 (en) * 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009072829A (ja) * 2007-09-21 2009-04-09 Icu Research & Industrial Cooperation Group 超短パルスレーザービームを利用した基板切断装置及びその切断方法
JP2015506902A (ja) * 2012-02-01 2015-03-05 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 非金属材料を分離するためのシステム及び方法

Also Published As

Publication number Publication date
KR20190129914A (ko) 2019-11-20
JPWO2018180417A1 (ja) 2020-03-05
CN110475754A (zh) 2019-11-19
CN110475754B (zh) 2022-07-15
JP7456604B2 (ja) 2024-03-27
TW201841840A (zh) 2018-12-01

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