CN110475754B - 刻划加工方法和刻划加工装置 - Google Patents

刻划加工方法和刻划加工装置 Download PDF

Info

Publication number
CN110475754B
CN110475754B CN201880022170.6A CN201880022170A CN110475754B CN 110475754 B CN110475754 B CN 110475754B CN 201880022170 A CN201880022170 A CN 201880022170A CN 110475754 B CN110475754 B CN 110475754B
Authority
CN
China
Prior art keywords
line
forming step
scribe line
scribing
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880022170.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN110475754A (zh
Inventor
林弘义
中谷郁祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN110475754A publication Critical patent/CN110475754A/zh
Application granted granted Critical
Publication of CN110475754B publication Critical patent/CN110475754B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN201880022170.6A 2017-03-31 2018-03-12 刻划加工方法和刻划加工装置 Active CN110475754B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017-071342 2017-03-31
JP2017-072757 2017-03-31
JP2017072757 2017-03-31
JP2017071342 2017-03-31
PCT/JP2018/009450 WO2018180417A1 (fr) 2017-03-31 2018-03-12 Procédé et dispositif de traçage

Publications (2)

Publication Number Publication Date
CN110475754A CN110475754A (zh) 2019-11-19
CN110475754B true CN110475754B (zh) 2022-07-15

Family

ID=63677422

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880022170.6A Active CN110475754B (zh) 2017-03-31 2018-03-12 刻划加工方法和刻划加工装置

Country Status (5)

Country Link
JP (1) JP7456604B2 (fr)
KR (1) KR20190129914A (fr)
CN (1) CN110475754B (fr)
TW (1) TW201841840A (fr)
WO (1) WO2018180417A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007185664A (ja) * 2006-01-11 2007-07-26 Seiko Epson Corp レーザ内部スクライブ方法
CN101391860A (zh) * 2007-09-21 2009-03-25 韩国情报通信大学校产学协力团 利用超短脉冲激光束的基板切割装置及其切割方法
EP2258512A1 (fr) * 2009-06-04 2010-12-08 Corelase OY Procédé et appareil pour le traitement d'un substrat au moyen de laser focalisé sur la surface ou à l'intérieur du substrat pour créer une ligne de rupture pour le découpage
CN102898013A (zh) * 2012-09-07 2013-01-30 东莞光谷茂和激光技术有限公司 一种紫外激光切割玻璃基板的方法
CN103182602A (zh) * 2011-12-28 2013-07-03 三星钻石工业股份有限公司 被加工物的分断方法及具光学元件图案的基板的分断方法
CN103508666A (zh) * 2012-06-19 2014-01-15 三星钻石工业股份有限公司 玻璃基板的加工方法
CN103771694A (zh) * 2014-01-08 2014-05-07 合肥鑫晟光电科技有限公司 激光切割方法及激光切割系统
CN104114317A (zh) * 2012-02-01 2014-10-22 伊雷克托科学工业股份有限公司 用于分离非金属材料的系统与方法
CN104944756A (zh) * 2014-03-28 2015-09-30 伊雷克托科学工业股份有限公司 激光加工强化玻璃

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6420678B1 (en) 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
RU2013102422A (ru) 2010-07-12 2014-08-20 ФАЙЛЭЙСЕР ЮЭс-Эй ЭлЭлСи Способ обработки материалов с использованием филаментации
AT13206U1 (de) * 2012-07-17 2013-08-15 Lisec Maschb Gmbh Verfahren und Anordnung zum Teilen von Flachglas
EP2781296B1 (fr) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Dispositif et procédé de découpe de contours à partir de substrats plats au moyen d'un laser

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007185664A (ja) * 2006-01-11 2007-07-26 Seiko Epson Corp レーザ内部スクライブ方法
CN101391860A (zh) * 2007-09-21 2009-03-25 韩国情报通信大学校产学协力团 利用超短脉冲激光束的基板切割装置及其切割方法
EP2258512A1 (fr) * 2009-06-04 2010-12-08 Corelase OY Procédé et appareil pour le traitement d'un substrat au moyen de laser focalisé sur la surface ou à l'intérieur du substrat pour créer une ligne de rupture pour le découpage
CN103182602A (zh) * 2011-12-28 2013-07-03 三星钻石工业股份有限公司 被加工物的分断方法及具光学元件图案的基板的分断方法
CN104114317A (zh) * 2012-02-01 2014-10-22 伊雷克托科学工业股份有限公司 用于分离非金属材料的系统与方法
CN103508666A (zh) * 2012-06-19 2014-01-15 三星钻石工业股份有限公司 玻璃基板的加工方法
CN102898013A (zh) * 2012-09-07 2013-01-30 东莞光谷茂和激光技术有限公司 一种紫外激光切割玻璃基板的方法
CN103771694A (zh) * 2014-01-08 2014-05-07 合肥鑫晟光电科技有限公司 激光切割方法及激光切割系统
CN104944756A (zh) * 2014-03-28 2015-09-30 伊雷克托科学工业股份有限公司 激光加工强化玻璃

Also Published As

Publication number Publication date
JPWO2018180417A1 (ja) 2020-03-05
TW201841840A (zh) 2018-12-01
WO2018180417A1 (fr) 2018-10-04
KR20190129914A (ko) 2019-11-20
JP7456604B2 (ja) 2024-03-27
CN110475754A (zh) 2019-11-19

Similar Documents

Publication Publication Date Title
JP4692717B2 (ja) 脆性材料の割断装置
KR102292611B1 (ko) 사파이어 기판을 레이저로써 레이저 절단하는 방법 및 일련의 결함을 갖는 엣지가 형성된 사파이어를 포함한 물품
JP4322881B2 (ja) レーザ加工方法及びレーザ加工装置
JP2009072829A (ja) 超短パルスレーザービームを利用した基板切断装置及びその切断方法
JPWO2003076120A1 (ja) レーザ加工方法
KR20110124207A (ko) 가공대상물 절단방법
JP2007021514A (ja) スクライブ形成方法、分割予定線付き基板
CN104944756A (zh) 激光加工强化玻璃
TW201902607A (zh) 附樹脂層之脆性材料基板之分斷方法及分斷裝置
JP2010026041A (ja) 表示パネルの製造方法
CN110475754B (zh) 刻划加工方法和刻划加工装置
JP2003001458A (ja) レーザ加工方法
CN104646834A (zh) 激光划片的方法及系统
JP2003001457A (ja) レーザ加工方法
CN103846554B (zh) 激光加工方法及激光加工装置
JP2003039184A (ja) レーザ加工方法
JP2006248075A (ja) レーザ光を用いた基板の加工方法および加工装置
JP2007014975A (ja) スクライブ形成方法、分割予定線付き基板
JP2003033887A (ja) レーザ加工方法
CN115041815A (zh) 一种脆性材料的激光加工系统及加工方法
JP2003025080A (ja) レーザ加工方法
JP5678816B2 (ja) ガラス基板の割断方法および割断装置
TW202120447A (zh) 基板之加工方法及加工裝置
JP2010037140A (ja) ガラス板の切断方法及び装置
JP2003019583A (ja) レーザ加工方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant