JP7456604B2 - スクライブ加工方法及びスクライブ加工装置 - Google Patents
スクライブ加工方法及びスクライブ加工装置 Download PDFInfo
- Publication number
- JP7456604B2 JP7456604B2 JP2019509179A JP2019509179A JP7456604B2 JP 7456604 B2 JP7456604 B2 JP 7456604B2 JP 2019509179 A JP2019509179 A JP 2019509179A JP 2019509179 A JP2019509179 A JP 2019509179A JP 7456604 B2 JP7456604 B2 JP 7456604B2
- Authority
- JP
- Japan
- Prior art keywords
- scribe line
- glass substrate
- forming step
- scribe
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 40
- 239000000758 substrate Substances 0.000 claims description 52
- 239000011521 glass Substances 0.000 claims description 51
- 238000003672 processing method Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000003754 machining Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017071342 | 2017-03-31 | ||
JP2017072757 | 2017-03-31 | ||
JP2017072757 | 2017-03-31 | ||
JP2017071342 | 2017-03-31 | ||
PCT/JP2018/009450 WO2018180417A1 (fr) | 2017-03-31 | 2018-03-12 | Procédé et dispositif de traçage |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018180417A1 JPWO2018180417A1 (ja) | 2020-03-05 |
JP7456604B2 true JP7456604B2 (ja) | 2024-03-27 |
Family
ID=63677422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019509179A Active JP7456604B2 (ja) | 2017-03-31 | 2018-03-12 | スクライブ加工方法及びスクライブ加工装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7456604B2 (fr) |
KR (1) | KR20190129914A (fr) |
CN (1) | CN110475754B (fr) |
TW (1) | TW201841840A (fr) |
WO (1) | WO2018180417A1 (fr) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6420678B1 (en) | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
CN103771694A (zh) | 2014-01-08 | 2014-05-07 | 合肥鑫晟光电科技有限公司 | 激光切割方法及激光切割系统 |
JP2015506902A (ja) | 2012-02-01 | 2015-03-05 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 非金属材料を分離するためのシステム及び方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007185664A (ja) * | 2006-01-11 | 2007-07-26 | Seiko Epson Corp | レーザ内部スクライブ方法 |
KR100876502B1 (ko) * | 2007-09-21 | 2008-12-31 | 한국정보통신대학교 산학협력단 | 초단파 레이저 빔을 이용한 기판 절단장치 및 그 절단방법 |
WO2010139841A1 (fr) * | 2009-06-04 | 2010-12-09 | Corelase Oy | Procédé et appareil de traitement de substrats |
RU2013102422A (ru) | 2010-07-12 | 2014-08-20 | ФАЙЛЭЙСЕР ЮЭс-Эй ЭлЭлСи | Способ обработки материалов с использованием филаментации |
JP5887928B2 (ja) * | 2011-12-28 | 2016-03-16 | 三星ダイヤモンド工業株式会社 | 被加工物の分断方法および光学素子パターン付き基板の分断方法 |
JP5991860B2 (ja) * | 2012-06-19 | 2016-09-14 | 三星ダイヤモンド工業株式会社 | ガラス基板の加工方法 |
AT13206U1 (de) * | 2012-07-17 | 2013-08-15 | Lisec Maschb Gmbh | Verfahren und Anordnung zum Teilen von Flachglas |
CN102898013A (zh) * | 2012-09-07 | 2013-01-30 | 东莞光谷茂和激光技术有限公司 | 一种紫外激光切割玻璃基板的方法 |
EP2781296B1 (fr) * | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Dispositif et procédé de découpe de contours à partir de substrats plats au moyen d'un laser |
US9776906B2 (en) * | 2014-03-28 | 2017-10-03 | Electro Scientific Industries, Inc. | Laser machining strengthened glass |
-
2018
- 2018-03-12 CN CN201880022170.6A patent/CN110475754B/zh active Active
- 2018-03-12 JP JP2019509179A patent/JP7456604B2/ja active Active
- 2018-03-12 WO PCT/JP2018/009450 patent/WO2018180417A1/fr active Application Filing
- 2018-03-12 KR KR1020197029366A patent/KR20190129914A/ko not_active Application Discontinuation
- 2018-03-28 TW TW107110638A patent/TW201841840A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6420678B1 (en) | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
JP2015506902A (ja) | 2012-02-01 | 2015-03-05 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 非金属材料を分離するためのシステム及び方法 |
CN103771694A (zh) | 2014-01-08 | 2014-05-07 | 合肥鑫晟光电科技有限公司 | 激光切割方法及激光切割系统 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2018180417A1 (ja) | 2020-03-05 |
TW201841840A (zh) | 2018-12-01 |
CN110475754B (zh) | 2022-07-15 |
WO2018180417A1 (fr) | 2018-10-04 |
KR20190129914A (ko) | 2019-11-20 |
CN110475754A (zh) | 2019-11-19 |
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