WO2012063348A1 - Procédé et dispositif de traitement au laser - Google Patents

Procédé et dispositif de traitement au laser Download PDF

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Publication number
WO2012063348A1
WO2012063348A1 PCT/JP2010/070130 JP2010070130W WO2012063348A1 WO 2012063348 A1 WO2012063348 A1 WO 2012063348A1 JP 2010070130 W JP2010070130 W JP 2010070130W WO 2012063348 A1 WO2012063348 A1 WO 2012063348A1
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Prior art keywords
laser
laser beam
workpiece
laser light
region
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PCT/JP2010/070130
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English (en)
Japanese (ja)
Inventor
望月　学
浩義 廣田
能一 坂口
Original Assignee
パイオニア株式会社
株式会社パイオニアＦａ
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Application filed by パイオニア株式会社, 株式会社パイオニアＦａ filed Critical パイオニア株式会社
Priority to JP2011543744A priority Critical patent/JPWO2012063348A1/ja
Priority to PCT/JP2010/070130 priority patent/WO2012063348A1/fr
Publication of WO2012063348A1 publication Critical patent/WO2012063348A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a technical field of a laser processing method and apparatus for performing processing such as cutting on an object to be processed by irradiation with laser light.
  • the prior art document also describes a method of forming a notch for cutting on the outer periphery of a rod-like brittle workpiece by laser irradiation, and dividing by adding a side pressure to the notch.
  • Such division of the processing object is used, for example, when forming an electronic component such as a chip.
  • Various improvements are made to improve processing accuracy, such as improvement of flatness of a section of the processing object. Has been.
  • a line or the like serving as a starting point of division is formed, and cleaving along the line.
  • the workpiece is divided.
  • a process of forming a starting line by laser light irradiation and a process of cleaving along the line are required, and facilities and mechanisms for realizing each process are required.
  • the line formed by the modified region is only a part of the dividing surface, the dividing surface cannot be defined at the time of cleaving, and the flatness of the dividing surface cannot be managed. There is a technical problem with.
  • the present invention has been made in view of, for example, the above-described problems.
  • the flatness of a divided section is improved and the number of steps is reduced. It is an object of the present invention to provide a laser processing method and apparatus capable of realizing processing.
  • the laser processing method of the present invention forms a modified region by multiphoton absorption inside the processing object by irradiating the processing object with a laser beam with a condensing part inside.
  • a cutting step of forming a plurality of the modified regions are examples of the modified regions.
  • the laser processing apparatus of the present invention irradiates a laser beam by aligning a condensing portion inside a workpiece, and forms a modified region by multiphoton absorption inside the workpiece. And a crack region formed around the modified region so as to continue from the surface opposite to the laser light incident surface side of the workpiece to the surface on the laser light incident surface side.
  • FIG. 1 It is a figure which shows the example of processing operation by irradiation of a laser beam. It is a flowchart which shows the flow of the processing operation by irradiation of a laser beam. It is a block diagram which shows the structural example of a laser processing apparatus.
  • An embodiment of the laser processing method of the present invention includes an irradiation step of irradiating a laser beam with a condensing part inside a processing target, and forming a modified region by multiphoton absorption inside the processing target;
  • the modified region is formed such that a crack region formed around the modified region is continuous from the surface opposite to the laser light incident surface side of the workpiece to the surface on the laser light incident surface side.
  • the processing target is irradiated with laser light, and the laser light is condensed on the surface or inside of the processing target.
  • modification by multiphoton absorption occurs in the vicinity of the light condensing part, and a modified region is formed.
  • the modified region is brittle compared to the region where no modification has occurred.
  • region is the meaning which shows the area
  • Such cracks are assumed to be caused by the action of stress due to thermal expansion due to excess energy accumulated in a region in the vicinity of the laser beam condensing portion inside the workpiece.
  • each of the modified region and the crack region formed inside the object to be processed depends on the irradiation conditions such as the output and wavelength of the laser beam, the degree of light absorption according to the material of the object to be processed, etc. Change.
  • the modified region and the crack region have a three-dimensional shape such as a spherical shape, an ellipsoidal shape, or a cylindrical shape centering on the condensing portion of the laser beam.
  • the ellipsoidal or cylindrical modified region and the crack region have their long axes in the optical axis direction of the laser light.
  • the inside of the workpiece is irradiated with a pulsed laser beam having a wavelength that can pass through the inside of the workpiece to at least the region that forms the modified region.
  • a laser light source capable of irradiating laser light and a condensing lens for condensing the irradiated laser light inside the object to be processed are used.
  • Other laser light irradiation conditions will be described later.
  • the laser beam condensing part is processed so that the crack region is continuously formed from the surface opposite to the laser beam incident surface side of the workpiece to the surface on the laser beam incident side.
  • the movement at this time may be relative, for example, one that fixes one and moves the other, or both that move simultaneously.
  • a lens unit that moves the condenser lens along the optical axis direction of the laser light by moving the condenser lens along the optical axis direction of the laser light, and a direction orthogonal to the optical axis direction of the laser light
  • a stage provided with an actuator for moving the workpiece is used.
  • a continuous crack region is formed from the surface opposite to the incident side to the surface on the incident side of the laser beam.
  • a small scratch or crack is formed from the surface opposite to the laser beam incident side to the surface on the laser beam incident side on the planned split surface,
  • a workpiece to be cut after cleaving is placed on a stretchable adhesive sheet, and easily separated by a so-called separation step by stretching the adhesive sheet. It becomes possible.
  • the workpiece is divided along the crack region that is continuously formed in this way, so that the flatness of the section after the division can be controlled.
  • the modified region and the crack region formed inside the object to be processed are Get smaller. Therefore, according to the embodiment of the laser processing method of the present invention, it is possible to narrow the width of the planned cutting surface along the modified region and the crack region formed in the modified region, and the plane of the cut surface after dividing. The degree can be kept good.
  • the total irradiation time for forming a continuous crack region in the planned cutting plane is longer than in the case of using a short pulse laser such as a nanosecond laser. It is predicted.
  • a short pulse laser such as a nanosecond laser.
  • rapid processing is required for many processing objects.
  • the above-described ultrashort pulse laser is not suitable for processing when cutting a substrate or the like by laser light irradiation.
  • processing using an ultrashort pulse laser requires a processing apparatus capable of accurately irradiating the ultrashort pulse laser, and there is a problem in industrial applicability due to an increase in installation cost.
  • the laser processing method of the present invention it can be carried out if there is equipment that can irradiate laser light having a pulse width of nanosecond order, which is generally used at a relatively low installation cost. Further, the processing accuracy of the cut surface generally required for a substrate such as glass, crystal, silicon, or the like, which is a processing target, is about 20 to 50 ⁇ m in flatness. For this reason, the laser processing method of the present invention that satisfies the required processing accuracy and can be processed at a high speed also has the advantage of being excellent in industrial applicability.
  • a continuous crack region is formed from one end portion to the other end portion in the direction orthogonal to the optical axis on the planned cutting surface inside the workpiece. . That is, it is preferable that a crack region is formed over the entire parting planned surface inside the workpiece.
  • the laser beam condensing unit or the laser beam so as to continuously form the crack region in a direction orthogonal to the optical axis of the laser beam.
  • a first step of moving at least one of the workpieces and a second step of moving the laser beam condensing portion in the optical axis direction of the laser beam by a predetermined distance according to the size of the crack region are repeated.
  • the first step and the second step are repeatedly performed, so that the laser beam is incident from the surface opposite to the laser beam incident surface side on the planned split surface inside the workpiece.
  • a continuous crack region can be formed up to the surface on the side.
  • the laser beam is collected in a direction orthogonal to the optical axis of the laser beam by moving the object to be processed while being irradiated with the laser beam.
  • the optical part is scanned to form a continuous crack region line on the scanning path in the planned cutting plane.
  • the lens unit moves the laser beam condensing part in the optical axis direction according to the size of the crack region.
  • the crack region is continuously formed according to the size of the crack region that changes according to the irradiation condition of the laser light, the optical property of the workpiece, etc. (in other words, The moving distance is set so that the range covered by the crack region formed by the scan of the laser light after movement and at least the modified region formed by the scan before movement are in contact with each other.
  • this aspect it is preferable to easily obtain a continuous crack region from the surface opposite to the laser light incident side to the surface on the laser light incident side, preferably within the planned split surface inside the workpiece. I can do it. For this reason, it is possible to eliminate the deficiency of the division due to the portion where the crack region is not formed on the planned division surface inside the object to be processed, and it is possible to increase the flatness of the cross section after the division.
  • a continuous reforming region line may be formed. It is known that further condensing part inside the reforming region leads to the formation of further reforming region and crack region, but as long as other conditions of this embodiment can be satisfied, the reforming region is continuous. It may be formed automatically.
  • the laser beam irradiation conditions and the moving speed of the object to be processed that are preferable in carrying out this aspect will be described in detail later.
  • a plurality of the modified regions are formed at intervals of 10 ⁇ m to 90 ⁇ m in the optical axis direction of the laser light inside the processing object. .
  • the irradiation step is performed under conditions that satisfy a condition that a pulse width is 5 ns to 20 ns, a repetition frequency is 15 kHz to 50 kHz, and an average output is 0.05 W to 0.2 W.
  • the laser beam condensing part is located inside the workpiece under the condition that the relative speed between the laser beam and the workpiece is 5 mm / s to 300 mm / s. At least one of the laser beam condensing unit or the workpiece is moved so as to move in a direction perpendicular to the optical axis of the laser beam.
  • the emission condition of the pulsed laser beam it is possible to appropriately set the emission condition of the pulsed laser beam.
  • the size of the modified region formed by multiphoton absorption inside the processing target and the surrounding crack region is also relatively small. For this reason, it is possible to obtain a continuous crack region on the planned dividing surface by forming a plurality of modified regions inside the workpiece and in the optical axis direction of the laser beam. For this reason, it is possible to eliminate the deficiency of the division due to the portion where the crack region is not formed on the planned division surface inside the object to be processed, and it is possible to increase the flatness of the cross section after the division.
  • the laser beam having a wavelength of 355 nm is irradiated.
  • the wavelength of the laser for laser processing is relatively short, it is possible to form a laser beam condensing part in a relatively small region.
  • a modified region by multiphoton absorption can be formed inside a relatively small region in the condensing unit, and the influence of heat generated by laser light irradiation on the region other than the condensing unit can be reduced.
  • the object to be processed has transparency to the laser light.
  • the object to be processed is a laminate of a plurality of substrates.
  • the object to be processed in which a plurality of substrates are bonded in this aspect is a so-called bonded glass or the like by bonding a plurality of substrates such as glass or quartz with an adhesive or the like.
  • a crack region is continuously formed from the surface opposite to the laser beam incident side of the workpiece to the laser light incident side surface, a plurality of substrates are bonded together. Even if it is a processed object, a continuous crack region is formed on each substrate. For this reason, it becomes possible to easily divide the object to be processed having a continuous crack region as a section.
  • An embodiment of the laser processing apparatus of the present invention includes an irradiation unit that irradiates a laser beam with a condensing unit inside a processing target, and forms a modified region by multiphoton absorption inside the processing target;
  • the modified region is formed such that a crack region formed around the modified region is continuous from the surface opposite to the laser light incident surface side of the workpiece to the surface on the laser light incident surface side.
  • Embodiment of the laser processing apparatus of this invention is an apparatus for implement
  • the laser processing apparatus includes, as irradiation means, for example, a laser light source that irradiates laser light of a predetermined condition, and a condensing lens that condenses the laser light inside the object to be processed to form a condensing unit.
  • the laser processing apparatus includes, as cutting means, for example, a lens unit capable of driving a condenser lens as described above, and a stage provided with an actuator.
  • the embodiment of the laser processing apparatus may also adopt various aspects.
  • the embodiment of the laser processing method of the present invention includes a condensing step and a cutting step.
  • An embodiment of the laser processing apparatus of the present invention includes a light collecting means and a cutting means.
  • the laser processing method of the present invention condenses laser light so as to form a condensing part inside a workpiece, and modifies the condensing part by multiphoton absorption. A region and a crack region are formed.
  • the formed modified region and the crack region are used to divide the workpiece using the modified region and the crack region by utilizing the fact that the modified region and the crack region are embrittled compared with the region where the modification is not generated. A method will be described.
  • FIG. 1 is a cross-sectional view taken along a direction orthogonal to the optical axis of a laser beam L1 for processing a workpiece 1 to be laser processed.
  • Processing object 1 is a substrate made of glass or quartz.
  • the workpiece 1 is capable of transmitting the laser beam L1 used for laser processing (that is, optically transparent), and has an optical property that multiphoton absorption occurs when the intensity of the laser beam L1 is high.
  • the condensing part F1 of the laser beam L1 When the condensing part F1 of the laser beam L1 is formed inside the workpiece 1 and the condition for multiphoton absorption is satisfied in the condensing part F1, modification by multiphoton absorption is performed in the vicinity of the condensing part F1. And a modified region R is formed. Further, a crack region C in which cracks such as fine cracks are generated due to the action of internal stress accompanying the modification is formed outside the modified region.
  • the modified region R and the crack region C are typically regions that are substantially similar to each other, and are an ellipsoid having a major axis in the optical axis direction of the laser light L1, and a cylinder having the axial direction in the direction. Or spherical shape. This is because more multiphoton absorption of the laser light L1 occurs in the optical axis direction in the vicinity of the condensing part F1.
  • the laser beam L1 has a wavelength of 355 nm, a pulse width of 5 to 20 ns, a repetition frequency of 15 to 50 kHz, and an average output of 0.05 to 0.05, with the condensing unit F1 inside the workpiece 1. Irradiation is performed under the condition of 0.2W.
  • the laser light source that irradiates the laser beam L1 irradiates the pulsed laser beam L1 in accordance with the trigger signal shown in FIG.
  • the trigger signal is a signal input from a control device or the like for controlling the laser light source, and is a pulse signal having a repetition frequency of 15 to 50 kHz described above (in other words, a repetition cycle based on the repetition frequency).
  • the laser light source receives the trigger signal and irradiates the laser light L1 under the above-described conditions of wavelength, pulse width, and average output.
  • the pulse width is, for example, the half width of one pulse of the laser light L1, and is defined in the form of a time length.
  • the average output is obtained by averaging the output of the laser beam L1 within one cycle of the trigger signal repetition cycle.
  • the modified region R and the crack region C are formed by multiphoton absorption occurring in the light collecting portion F1, while the surface 1a on the incident side of the laser beam L1 of the workpiece 1 is, for example, Further, there is no modification or melting due to absorption of the laser beam L1.
  • FIG. 4 is a table showing an example of the length of the modified region R in the optical axis direction of the laser beam L1 under the above conditions.
  • the table shown in FIG. 4 shows that the laser light L1 has a wavelength of 355 nm, an aperture NA of the condensing lens used for condensing NA0.5, a diameter of the condensing part F1 of about 900 nm, and an average output of 0.1 W.
  • the length in the optical axis direction of the laser beam L1 of the modified region R formed when the processing unit 1 is irradiated with the condensing part F1 is shown.
  • a modified region R having a length of 20 to 60 ⁇ m is formed in the optical axis direction of the laser beam L1
  • a modified region R having a length of 20 to 50 ⁇ m is formed in the optical axis direction of the laser beam L1.
  • the laser processing method according to the present embodiment divides the workpiece 1 by continuously forming the modified region R and the crack region C in the planned dividing surface.
  • FIG. 2 is a perspective view of the workpiece 1.
  • the laser beam L1 is set so that the planned division surface 2 is virtually set on the workpiece 1, and the modified region R and the crack region C are formed along the planned division surface 2. Irradiation and condensing.
  • FIG. 5 to FIG. 7 are cross-sectional views along the scheduled cutting surface 2 (XZ plane) of the workpiece 1 to be laser processed, and explain the processing procedure.
  • the condensing part F1 is aligned at a position separated from the surface 1b facing the surface 1a of the workpiece 1 by a predetermined distance d, a wavelength of 355 nm, a pulse width of 5 to 20 ns, a repetition frequency of 15 to 50 kHz,
  • the laser beam L1 is irradiated under the condition that the average output is 0.05 to 0.2W.
  • the distance d is a distance at which the surface 1b is not crushed by the influence of the modified region R and the crack region C formed by the irradiation of the laser beam L1, and the distance at which the crack region C reaches the surface 1b. Is set. For this reason, it is preferable that the distance d is appropriately set according to the irradiation condition of the laser light L1 and the material of the workpiece 1 (more specifically, properties related to light absorption such as a band gap).
  • the term “crushing” means not only that the crack region reaches the surface but also a state in which the surface is actually divided into pieces. When crushing occurs in this way, it leads to deterioration of flatness in the planned dividing surface 2 and is not preferable because it causes unevenness in the divided section when the workpiece 1 is divided.
  • the distance d is 0.5 times the size of the modified region R in the optical axis direction (that is, the modified region R). It has been reported that crushing occurs on the surface when the length from the center to one end) +15 ⁇ m. On the other hand, when the distance d is 0.5 times the size of the modified region R in the optical axis direction (that is, the length from the center of the modified region R to one end) +20 ⁇ m, the surface is crushed. In addition, it has been reported that the crack region reaches the surface.
  • the laser beam L1 is scanned in the direction perpendicular to the optical axis of the laser beam L1 inside the object 1 to be processed. Move in the direction.
  • the laser beam L1 may be scanned by moving the workpiece 1 in the opposite direction (for example, the ⁇ X direction) in which scanning is performed while the irradiation of the laser beam L1 is maintained. .
  • the scan is performed under the condition that the relative speed (in other words, the scan speed) between the laser beam L1 and the workpiece 1 is 5 to 300 mm / s.
  • An apparatus configuration for performing such scanning may be arbitrary, and an example will be described later.
  • the laser beam L1 is scanned at a speed of 5 to 300 mm / s.
  • the workpiece 1 is moved in the opposite direction in which scanning is performed under the above-described conditions.
  • the modified region R can be continuously (for example, see FIG. 6B) or discontinuously (for example, see FIG. 6A) on and near the movement path of the light collecting portion F1. Is formed.
  • the distance between adjacent reformed regions R formed discontinuously is defined as dR. Is described.
  • the case where the modified region R is continuously formed is a case where the distance dR is sufficiently small.
  • a crack region C is continuously formed in the vicinity of the modified region R.
  • the laser beam L1 is scanned so that the crack region C extends from one end portion in the direction orthogonal to the optical axis in the planned splitting surface 2 to the other end portion.
  • the laser beam condensing part F ⁇ b> 1 is moved to the optical axis direction incident side (Z direction in FIG. 7) by a predetermined distance p.
  • the distance p is defined as 10 to 90 ⁇ m.
  • the scan shown in FIG. 6A or 6B is performed in a state where the position of the light collecting portion F1 in the optical axis direction (in other words, the depth in the workpiece 1) is maintained.
  • the surface 1a on the incident side of the laser beam L1 of the workpiece 1 is described above.
  • the laser beam L1 is scanned by aligning the condensing unit F1 at positions separated by a distance d.
  • a crack region C continuously formed along the planned dividing surface 2 reaches from the surface 1b to the surface 1a.
  • the irradiation of the laser beam L1 on the planned split surface 2 is completed.
  • the scan position does not necessarily have to be the distance d, and may preferably be a distance shorter than the distance d as long as the above-described crushing does not occur.
  • processing conditions are set within the above-described range in accordance with the material or the like of the processing object 1 (step S101). Specifically, with respect to the irradiation condition of the laser beam L1, the pulse width is determined within the range of 5 to 20 ns, the repetition frequency is 15 to 50 kHz, and the average output is within the range of 0.05 to 0.2 W.
  • the distance d of the condensing portion F1 from the surface 1b when condensing the laser light L1 for the first time, the moving distance p of the condensing portion F1 after scanning, the laser light L1 during scanning and the object to be processed A scanning speed that is relative to 1 is determined. Specifically, the distance d is determined according to the material of the workpiece 1, the thickness in the optical axis direction, the size of the modified region R and the crack region C formed by irradiation with the laser light L 1, and the like. p is determined from the range of 10 to 90 ⁇ m. Further, the relative speed between the laser beam L1 and the workpiece 1 during scanning is determined within a range of 5 to 300 mm / s.
  • the laser beam L1 irradiated under the conditions set in step S101 is placed at a distance d from the surface 1b opposite to the laser beam L1 incident side of the workpiece 1 using a condenser lens or the like.
  • Condensing light step S102.
  • the laser beam L1 is scanned by moving the workpiece 1 in a direction orthogonal to the optical axis (step S103).
  • the condensing part F1 of the laser light L1 is moved by a distance p in the optical axis direction and in the surface 1a direction by moving the condensing lens (step S104).
  • Steps S ⁇ b> 103 and S ⁇ b> 104 are repeated until the condensing unit F ⁇ b> 1 is at a distance d or less from the surface 1 a of the workpiece 1.
  • step S105: Yes the condensing unit F1 is at or below the distance d from the surface 1a of the workpiece 1 (step S105: Yes)
  • the machining operation is terminated after the laser beam L1 is scanned at the position (step S106).
  • the crack region is continuously formed from the surface 1b to the surface 1a along the planned dividing surface 2 inside the object 1 to be processed. Because of such a continuous crack region, for example, without performing a process such as cleaving, by performing a process for separating the processing object performed after the cleaving process in a general laser dicing method, the processing object can be divided. It becomes possible. This is because small scratches and cracks are continuous from the surface 1a to 1b inside the planned split surface where the crack region is continuously formed, and therefore can be easily separated without applying a large force.
  • the relatively small crack region is continuously formed under the laser light irradiation conditions and the processing conditions described above, the size of the crack region extending in the direction perpendicular to the planned cutting surface is also compared inside the object to be processed. Small. Therefore, when the separation is performed along the planned dividing surface, the dividing surface can be controlled while maintaining the flatness of the dividing surface with relatively high accuracy. For example, a flatness of about 20 ⁇ m can be realized for glass, quartz, etc., and a flatness of about 50 ⁇ m can be realized for a laminated glass obtained by bonding a plurality of substrates with an adhesive. Since such a highly accurate cross section can be obtained, the polishing of the cross section after the division may be omitted.
  • the same effect can be obtained when a laminated glass or the like obtained by bonding a plurality of substrates such as glass or crystal with an adhesive is used as the workpiece 1. Further, under the processing conditions described in the present embodiment, the influence of the laser light L1 on the adhesive of the laminated glass can be suppressed, and further, the deterioration of the adhesive can be suppressed because there is little absorption of the 355 nm laser light. . Generally, in the prior art, when trying to cut the laminated glass as described above, the portion of the adhesive is altered by the laser beam, and the influence is great.
  • the optical path of the laser beam L1 passes outside the end of the workpiece 1 in an end portion parallel to the optical axis in a direction perpendicular to the optical axis on the planned cutting surface of the workpiece 1. Can be suppressed.
  • the crack region C is continuously formed from one end portion to the other end portion even in the end portion parallel to the optical axis in the direction perpendicular to the optical axis on the planned cutting surface of the workpiece 1.
  • the crack region C can be formed over the entire parting planned surface 2. Thereby, division
  • the interval dR between the modified regions R formed by scanning varies depending on the repetition frequency of the laser beam L1 and the scan speed.
  • the flatness of the divided section after the division is affected.
  • the result of experiment of the inventors about the case where favorable processing is observed like the above-mentioned thing is demonstrated.
  • the relationship dR ( ⁇ m) scanning speed (mm / s) / repetition frequency (kHz) is established with respect to the interval dR between the modified regions R to be formed.
  • the interval dR is 0.7 ⁇ m when the scanning speed is 10 mm / s
  • the interval dR is 6.7 ⁇ m when the scanning speed is 100 mm / s
  • the interval is when the scanning speed is 200 mm / s.
  • dR was 13.3 ⁇ m, and good processing was observed in all cases.
  • the scanning speed was 300 mm / s
  • the interval dR was 20.0 ⁇ m, and good results were not observed.
  • the spacing dR is 0.3 ⁇ m when the scanning speed is 5 mm / s, and the spacing dR is 5.0 ⁇ m when the scanning speed is 100 mm / s, and good processing is observed in both cases. It was.
  • the spacing dR is 2.0 ⁇ m when the scanning speed is 100 mm / s, and the spacing dR is 4.0 ⁇ m when the scanning speed is 200 mm / s, and good processing is observed in both cases. It was.
  • FIG. 10 is a diagram showing a device configuration of the laser processing device 3.
  • the laser processing apparatus 3 includes a control unit 10, a laser power source 11, a laser light source 12, a mirror 13, a half-wave plate 14, a mirror 15, and a beam expander 16.
  • the laser processing apparatus 3 includes a guide laser diode (LD) 21 and a guide optical system 22.
  • LD guide laser diode
  • the control unit 10 is an example of a control unit of the present invention, and includes a CPU that controls the operation of each unit of the laser processing apparatus 3.
  • the control unit 10 controls the operations of the laser power source 11 and the laser light source 12 so as to emit laser light L1 that is pulse-like and satisfies emission conditions such as a predetermined repetition frequency, average output, and pulse peak output.
  • the control part 10 controls operation
  • the control part 10 performs control which moves the stage 40 which mounts the workpiece 1 in the surface orthogonal to the optical axis direction of the laser beam L1, etc. with the emission of the laser beam L1.
  • the laser power source 11 includes a power source for supplying power for driving the laser light source 12 and a pulse control device.
  • the laser power source 11 receives an instruction input by a user and supplies current to the laser light source in a desired manner. Do and drive.
  • the laser light source 12 includes a laser generator, a crystal element, a phase modulator, a resonator, and the like, generates a laser beam L1 according to a current supplied from the laser power source 11, and emits the laser beam L1 toward the mirror 13.
  • the laser light source 12 is preferably a light source excellent in pulse control and output control.
  • the laser light L 1 emitted from the laser light source 12 is adjusted in phase difference or polarization state in the half-wavelength plate 14 through the mirror 13 and then enters the beam expander 16 through the mirror 15.
  • the beam expander 16 is a mechanism that expands the beam diameter of the laser light L1 that is incident in the form of parallel light. Specifically, the beam expander 16 adjusts so that the beam diameter of the condensing part F1 in the processing target 1 of the laser light L1 is within a predetermined range, together with condensing by the condensing lens 19 described later. . The expansion ratio of the beam diameter by the beam expander 16 is set according to the aperture of the condenser lens 19 described later.
  • the beam combiner 17 is a half mirror or the like that combines the laser beam L1 on the same optical path by transmitting the laser beam L1 and reflecting the laser beam L2 for guide.
  • the guide laser beam L2 is a laser beam emitted from the guide LD 21, and is incorporated in the same optical path as the laser beam L1 by the beam combiner 17, and is condensed on the workpiece 1 by the condenser lens 19. Laser light for distance measurement or servo drive.
  • a guide optical system 22 corresponding to the application such as a beam shaping lens, a condensing lens, or a cylindrical lens, is disposed.
  • the lens block 18 is a lens unit that holds the condenser lens 19 and includes a slide mechanism that moves the condenser lens 19 in the optical axis direction of the laser light L1.
  • the condensing lens 19 is a lens that mainly condenses the laser light L1 on the surface or inside of the workpiece 1 and typically forms a condensing part F1 at the focal position.
  • the aperture of the condenser lens 19 is preferably set in accordance with the beam diameter of the condenser part F1.
  • the lens block 18 moves the condensing lens 19 in the optical axis direction of the laser light L1 in accordance with a control signal from the control unit 10, thereby condensing the lens block 18 at a desired position on the surface of the workpiece 1 or inside. Move part F1.
  • the stage 40 is a mounting table on which the workpiece 1 is mounted. Further, the stage 40 may include a mechanism capable of moving the workpiece 1 in a plane orthogonal to the optical axis direction of the laser light L1. In the case of including such a mechanism, the stage 40 moves the workpiece 1 at a speed according to the control signal supplied from the controller 10, thereby moving the workpiece 1 to the condensing unit F ⁇ b> 1 for the laser light L ⁇ b> 1. It is possible to move relative to it.
  • the laser processing apparatus 3 may be provided with the mechanism which can move relatively the other workpiece 1 and the condensing part F1 of the laser beam L1.

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Un procédé de traitement au laser comprend une étape d'application destinée à placer une pièce de concentration de lumière dans un objet à traiter et à appliquer une lumière laser pour former une région reformée en raison de l'absorption multiphotonique dans l'objet à traiter, et une étape de découpe destinée à former une pluralité des régions reformées de sorte que les régions de fissure formées chacune autour de la région reformée soient continues depuis la surface située sur le côté opposé au de côté surface d'incidence de lumière laser de l'objet à traiter jusqu'à la surface située sur le côté surface d'incidence de lumière laser.
PCT/JP2010/070130 2010-11-11 2010-11-11 Procédé et dispositif de traitement au laser WO2012063348A1 (fr)

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JP2011543744A JPWO2012063348A1 (ja) 2010-11-11 2010-11-11 レーザ加工方法及び装置
PCT/JP2010/070130 WO2012063348A1 (fr) 2010-11-11 2010-11-11 Procédé et dispositif de traitement au laser

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WO2013039012A1 (fr) * 2011-09-16 2013-03-21 浜松ホトニクス株式会社 Procédé et dispositif d'usinage au laser
WO2017068819A1 (fr) * 2015-10-20 2017-04-27 日本電気硝子株式会社 Procédé de coupe et dispositif de coupe de verre pour tubes, et procédé de fabrication de produit en verre pour tubes
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JP2019046862A (ja) * 2017-08-30 2019-03-22 日亜化学工業株式会社 発光素子の製造方法
JP2020010051A (ja) * 2019-08-28 2020-01-16 日亜化学工業株式会社 発光素子の製造方法
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JP2017077991A (ja) * 2015-10-20 2017-04-27 日本電気硝子株式会社 管ガラスの切断方法及び切断装置、並びに管ガラス製品の製造方法
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WO2021100477A1 (fr) * 2019-11-21 2021-05-27 Ａｇｃ株式会社 Procédé de traitement de feuille de verre et feuille de verre
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