WO2018177086A1 - 智能卡制卡组件及智能卡制造工艺 - Google Patents

智能卡制卡组件及智能卡制造工艺 Download PDF

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Publication number
WO2018177086A1
WO2018177086A1 PCT/CN2018/078137 CN2018078137W WO2018177086A1 WO 2018177086 A1 WO2018177086 A1 WO 2018177086A1 CN 2018078137 W CN2018078137 W CN 2018078137W WO 2018177086 A1 WO2018177086 A1 WO 2018177086A1
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WO
WIPO (PCT)
Prior art keywords
middle frame
upper substrate
smart card
substrate
glue
Prior art date
Application number
PCT/CN2018/078137
Other languages
English (en)
French (fr)
Inventor
陈柳章
Original Assignee
深圳市文鼎创数据科技有限公司
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Publication date
Application filed by 深圳市文鼎创数据科技有限公司 filed Critical 深圳市文鼎创数据科技有限公司
Publication of WO2018177086A1 publication Critical patent/WO2018177086A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier

Definitions

  • the invention belongs to the field of smart cards, and particularly relates to a smart card manufacturing component and a smart card manufacturing process.
  • the smart card has a large capacity and its working principle is similar to that of a microcomputer. It can realize a variety of functions and is widely used in data statistics storage, access security control, mobile payment, and entry and exit control.
  • the general smart card includes user information and a small amount of security control information.
  • These smart cards are composed of a multi-layer structure, and internal components such as a circuit board and a display are wrapped between the multi-layer structures, and the multi-layer structure provides the hardness and protection required for the internal components. Multilayer structures are generally combined by lamination.
  • existing smart cards have the following problems:
  • the display cannot be positioned in the middle frame, which causes the display screen to tilt and shift after the smart card is glued;
  • Bubbles are formed in the smart card, which causes the card surface to be uneven; in particular, bubbles are easily generated in the display area of the card, resulting in poor display effect.
  • One technical problem to be solved by the present invention is to provide a smart card manufacturing card assembly that meets the requirements for card thickness specifications and high product yield.
  • Another technical problem to be solved by the present invention is to provide a smart card manufacturing process that meets the requirements of the card thickness specification and has a high product qualification rate.
  • the technical solution adopted by the present invention is to provide a smart card manufacturing card assembly, comprising: an upper substrate, a middle frame and a lower substrate which are sequentially disposed, and a hollow cavity body is formed between the upper substrate, the middle frame and the lower substrate, The hollow cavity is used for filling the upper substrate, the middle frame and the lower substrate, and the middle frame is provided with an overflow tank, and one end of the overflow tank communicates with the hollow cavity.
  • the invention provides a smart card manufacturing process based on the foregoing smart card manufacturing component, comprising the following steps:
  • the upper substrate, the middle frame and the lower substrate are laminated such that air and/or excess glue in the hollow cavity is squeezed into the overflow tank and the glue is solidified.
  • the smart card manufacturing component provided by the invention has the beneficial effects that: the overflow tank connecting the hollow body is arranged on the middle frame, and the air in the hollow cavity can be filled in the cavity and formed into the potting layer in the hollow cavity. And/or the excess glue can be squeezed into the overflow tank, so as to avoid the formation of bubbles in the potting layer formed by the curing of the glue or the thickness and unevenness of the potting layer, the smart card does not conform to the thickness specification. And the problem of poor surface flatness, thereby enhancing the adhesion of the potting layer to the upper substrate and the lower substrate, avoiding delamination, ensuring that the smart card meets the requirements of the card thickness specification, and improving the surface flatness, structural stability and product yield of the smart card. To extend the life of the smart card.
  • the smart card manufacturing process provided by the present invention has the beneficial effects that the smart card manufacturing process is: when the glue is poured into the hollow cavity and laminated, the air in the hollow cavity, excess glue, etc. are squeezed into the overflow tank, In this way, it is possible to avoid the formation of air bubbles in the potting layer formed by the curing of the glue or the problem that the smart card does not conform to the thickness specification and the surface flatness due to the excessive thickness and unevenness of the potting layer, thereby enhancing the potting layer.
  • the adhesion between the substrate and the lower substrate avoids delamination, ensures that the smart card meets the requirements of the card thickness specification, improves the surface flatness, structural stability and product qualification rate of the smart card, and prolongs the service life of the smart card.
  • FIG. 1 is a schematic structural diagram of an upper substrate of a smart card manufacturing component according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of the fixed display screen and the flexible circuit board of FIG. 1;
  • FIG. 3 is a schematic structural diagram of a middle frame of a smart card manufacturing component according to an embodiment of the present invention.
  • Figure 4 is a cross-sectional view taken along line A-A of Figure 3;
  • FIG. 5 is a schematic structural view of the middle frame of FIG. 3 fixed to the upper substrate of FIG. 2;
  • FIG. 6 is a schematic structural view of the middle frame of FIG. 5 after the lower substrate is fixed;
  • FIG. 7 is a schematic structural view of a smart card formed after punching in FIG. 6;
  • Figure 8 is a cross-sectional view taken along line B-B of Figure 7;
  • 1-upper substrate 11-first indicator, 12-second indicator, 2-middle frame, 21- hollow cavity, 22-overfill tank, 23-storage tank, 24-through hole, 3 - lower substrate, 31 - third indicator, 32 - transparent area, 4-display, 5-flex circuit board, 6-filler layer, 7-display window, 8-printing area.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • the smart card manufacturing component comprises an upper substrate 1, a middle frame 2 and a lower substrate 3 which are sequentially disposed, and a hollow cavity is formed between the upper substrate 1, the middle frame 2 and the lower substrate 3.
  • the hollow body 21 is used for filling the upper substrate 1, the middle frame 2 and the lower substrate 3, and the middle frame 2 is provided with an overflow tank 22, and one end of the overflow tank 22 communicates with the hollow body 21.
  • the middle frame 2 is provided with an overflow tank 22 that communicates with the hollow cavity 21, and is packaged in the hollow cavity 21 (such as a flexible circuit board 5 to be described later) or even a display member (such as the display screen 4 described later).
  • the integrated substrate 1, the middle frame 2 and the lower substrate 3 are laminated, and the air and/or excess glue in the hollow body 21 can be squeezed into the overflow tank 22 Therefore, it is possible to avoid the formation of bubbles in the potting layer 6 formed by the curing of the glue or the problem that the smart card does not conform to the thickness specification and the surface flatness due to the excessive thickness and unevenness of the potting layer 6, thereby enhancing the potting.
  • the adhesion of the adhesive layer 6 to the upper substrate 1 and the lower substrate 3 avoids delamination, ensures that the smart card meets the requirements of the card thickness specification, improves the surface flatness, structural stability and product qualification rate of the smart card, and prolongs the service life of the smart card.
  • the middle frame 2 is provided with a glue storage tank 23, and the glue storage tank 23 communicates with the hollow body 21 through the overflow tank 22;
  • the glue and air can be discharged to the glue storage tank 23 through the overflow tank 22, and the glue storage tank 23 has a large accommodation space to ensure the storage capacity of excess glue and air, and can be reduced after the glue storage tank 23 is disposed.
  • the flow path length of the overflow tank 22 prevents the glue from hardening and blocks the overflow tank 22, so that the air and excess glue in the hollow body 21 are not completely discharged.
  • the depth of the glue storage tank 23 is greater than the depth of the overflow tank 22, so that when the upper substrate 1, the middle frame 2 and the lower substrate 3 are laminated, the air in the hollow cavity 21, excess glue (if air or air is present) The excess glue is squeezed into the glue storage tank 23 through the overflow tank 22, and the air and excess glue in the hollow body 21 are discharged more thoroughly, thereby improving the surface flatness, structural stability and product qualification rate of the smart card, and prolonging The life of the smart card.
  • the number of the glue overflow tank 22 and the glue storage tank 23 may be one or more, and the glue overflow tank 22 and the glue storage tank 23 may correspond one-to-one, or one glue storage tank 23 may correspond to one or more overflow glues.
  • the glue storage tank 23 may be a blind hole or a through hole, and is preferably a through hole in this embodiment.
  • the middle frame 2 is provided with a glue storage tank 23, and each of the oil storage tanks 23 corresponds to at least one overflow tank 22. It can reduce the excess glue and the flow of air through the overflow tank 22 to the glue storage tank 23 during the filling and laminating process, and it is easy to discharge the glue and air, so as to avoid the viscosity of the glue being too large and causing the glue to block the glue.
  • the groove 22 causes the glue to be discharged, avoids the air bubble in the glue when the viscosity is too large, and the air bubble is generated, thereby ensuring that the thickness of the smart card component meets the thickness requirement of the card, and the components of the smart card component are improved.
  • the connection reliability between the layer structures improves the display performance of the smart card manufacturing component, is easy to process, improves production efficiency, and effectively increases the product qualification rate.
  • the overflow tank 22 is located on the side of the middle frame 2 adjacent to the upper substrate 1.
  • the overflow tank 22 is close to the lower substrate 3, and can discharge air from the overflow tank 22 at the upper end of the hollow body 21 during the filling, so as to prevent the air from migrating to the top of the glue and stay in the hollow body 21, which is better.
  • the ability to prevent bubbles is generated, the connection reliability between the layers of the smart card manufacturing component is improved, the display performance of the smart card manufacturing component is improved, and the product qualification rate is effectively increased.
  • a flexible circuit board 5 and a display screen 4 disposed in the hollow cavity 21 are further included, and the flexible circuit board 5 is electrically connected to the display screen 4.
  • the flexible circuit board 5 has good flexing performance, preventing the control circuit from being damaged when the smart card is bent, and the setting of the display screen 4 can display information intuitively and is more convenient to use.
  • the upper substrate 1 is provided with a first indication bit 11 for indicating the placement position of the display screen 4, and the display screen 4 is bonded to the first indication position 11 On the substrate 1.
  • the display screen 4 is adhered to the upper substrate 1 to avoid the phenomenon that the display screen 4 is tilted and offset during the filling, thereby improving the display performance of the smart card manufacturing component and ensuring the yield of the product.
  • the first indicator bit 11 can be disposed on the upper substrate 1 by printing.
  • the shape of the first indicator bit 11 can be the same as the contour of the display screen 4.
  • the first indicator bit 11 is the same size as the display screen 4.
  • the printed wire frame, of course, the first indicator bit 11 can also be an indicator groove provided on the upper substrate 1.
  • the middle frame 2 is provided with a through hole 24, and the lower surface of the upper substrate 1 is provided with a second indicating position 12 corresponding to the through hole 24.
  • the operation is simple, and the through hole 24 and the second indicator bit 12 face each other, and the upper substrate 1 and the middle frame 2 can be accurately positioned, so that the smart card card assembly is easier to process and the production efficiency is higher.
  • the through hole 24 can be a circular hole, a square hole, a triangular hole or other shaped hole, and the second indicating position 12 conforms to the shape of the through hole 24, which is more advantageous for the alignment of the through hole 24 and the second indicating position 12.
  • the second indicator bit 12 and the through hole 24 are at least two, and each of the through holes 24 is respectively opposite to the corresponding second indicator bit 12; thus, at least two positions can be formed between the upper substrate 1 and the middle frame 2, so that the upper portion The substrate 1 and the middle frame 2 can be positioned more quickly and accurately.
  • the middle frame 2 is provided with a through hole 24, and the upper surface of the lower substrate 3 is provided with a third indicating position 31 corresponding to the through hole 24.
  • the structure is simple, and the third indicator bit 31 is opposite to the through hole 24 to realize positioning between the lower substrate 3 and the middle frame 2.
  • the positioning capability is fast and accurate, and the positioning operation is simpler, which makes the smart card manufacturing component easier. Processing will help improve the production efficiency and pass rate of smart cards.
  • the through hole 24 can be a circular hole, a square hole, a triangular hole or a hole of other shapes, and the third indicating position 31 conforms to the shape of the through hole 24, which is more advantageous for the alignment of the through hole 24 and the third indicating position 31.
  • the second indicator bit 12 and the third indicator bit 31 can also be set at the same time.
  • the upper end of the through hole 24 opened in the middle frame 2 corresponds to the second indicator bit 12, and the lower end corresponds to the third indicator bit 31.
  • the positioning of the upper substrate 1, the middle frame 2 and the lower substrate 3 can be achieved by the through holes 24 corresponding to the second indicator bit 12 and the third indicator bit 31, and the structure is simple, and the opening of the middle frame 2 is avoided.
  • the through hole 24 affects the stability of the middle frame 2.
  • the second indicator bit 12 , the third indicator bit 31 and the through hole 24 are both set to four, and two of the through holes 24 are respectively The ends are for the respective second indicator bit 12 and third indicator bit 31, respectively. It is easier to accurately position the upper substrate 1, the middle frame 2, and the lower substrate 3, and the production efficiency is high.
  • the second indicator bit 12 and the third indicator bit 31 can be correspondingly disposed on the upper substrate 1 and the lower substrate 3 by printing, and the shapes of the second indicator bit 12 and the third indicator bit 31 can be the same as the through hole 24 The contours are the same.
  • the second indicator bit 12 and the third indicator bit 31 are printed circular frames, and the second indicator bit 12 and the third indicator bit 31 may also be respectively disposed on the upper substrate 1 and The through hole 24 or the indicating protrusion on the lower substrate 3 is indicated.
  • the lower substrate 3 portion of the third indicator position 31 is printed to be transparent for assembly, the positioning of the third indicator bit 31 and the through hole 24 is seen from the lower surface of the lower substrate.
  • the lower surface of the lower substrate 3 is provided with a printing area 8 and a non-printing area
  • the upper surface of the upper substrate 1 may also be provided with a printing area and a non-printing area, and custom printing can be performed on the printing area 8 according to customer requirements.
  • the portion of the lower substrate 3 corresponding to the non-printing area is a transparent area 32, and when the third indicator position 31 is printed on the corresponding transparent area 32, it can be seen from the lower surface of the lower substrate 3 to facilitate positioning.
  • the smart card manufacturing process provided by the embodiment of the present invention may be based on any of the foregoing embodiments, and includes the following steps:
  • the lower substrate 3 is fixed on the lower surface of the middle frame 2;
  • the glue is poured into the hollow cavity 21 and laminated, and the air in the hollow cavity 21 and the excess glue are squeezed into the overflow tank 22, so that the glue can be prevented from solidifying. Bubbles are formed in the sealant layer 6 or the smart card does not conform to the thickness specification and the surface flatness is poor due to the excessive thickness and unevenness of the potting layer 6, thereby enhancing the potting layer 6 to the upper substrate 1 and the lower substrate 3. Adhesion, avoid delamination, ensure that the smart card meets the requirements of the card thickness specification, improve the surface flatness, structural stability and product qualification rate of the smart card, and extend the service life of the smart card. In order to better bond the upper substrate 1, the middle frame 2 and the lower substrate 3, it is preferable to inject a slight excess of the glue into the hollow cavity 21.
  • the glue storage tank 23 is disposed on the middle frame 2 when the middle frame 2 is prepared in step S1; In the middle frame 2 and the lower substrate 3, the air in the hollow cavity 21, the excess glue (if air or excess glue is present) is squeezed into the overflow tank 22, and when the air or excess glue is more, the air The excess glue can also be squeezed into the glue storage tank 23 through the overflow tank 22.
  • the manufacturing process can produce a smart card that meets the thickness requirement through simple operation, and the produced smart card has high qualification rate and high production efficiency.
  • step S2 is performed between step S1 and step S3, and step S2 includes: fixing the flexible circuit board 5 and the display screen 4 to the upper side. The lower surface of the substrate 1. After the smart card manufacturing process is performed, the display screen 4 and the flexible circuit board 5 are fixed on the upper substrate 1, and then the glue is applied to prevent the display screen 4 from being tilted and offset, and the display screen 4 is in the positive position to improve the display performance.
  • the first indicator bit 11 is set on the upper substrate 1 when the upper substrate 1 is prepared in step S1, specifically, can be printed on the lower surface of the upper substrate 1.
  • the first indicating position 11 for indicating the position of the display screen 4 is positioned by the printed first indicating position 11. The process is simpler, and the flatness of the lower surface of the upper substrate 1 is maintained, which is advantageous for reducing the positioning deviation. The stability of the upper substrate 1 is increased.
  • the step of fixing the flexible circuit board 5 and the display screen 4 on the upper substrate 1 in the step S2 comprises: brushing the lower surface of the upper substrate 1, and the flexible circuit board 5 and the display screen 4 is attached to the lower surface of the upper substrate 1, and the display screen 4 is located at the first indication position 11; the display screen 4 is positioned by the first indication bit 11, and the position of the flexible circuit board 5 is constrained by the display screen 4, thus achieving After the display screen 4 and the flexible circuit board 5 are positioned, the glue is applied to avoid tilting and shifting of the display screen 4, and the display screen 4 is in a positive position to improve display performance.
  • the through hole 24 and the second indicator bit 12 are provided, the through hole 24 is set to the middle frame 2 when the middle frame 2 and the upper substrate 1 are prepared in step S1, specifically in the middle frame A through hole 24 is formed in the second surface, and a second indication bit 12 corresponding to the through hole 24 is printed on the lower surface of the upper substrate 1.
  • the second indicator bit 12 and the through hole 24 are correspondingly positioned for printing, and the process is simpler. It is advantageous to maintain the flatness of the lower surface of the upper substrate 1 to reduce the positioning deviation and increase the stability of the upper substrate 1.
  • the step of fixing the middle frame 2 on the upper substrate 1 preferably includes: brushing the lower surface of the upper substrate 1 to align the through hole 24 with the second indicating position 12.
  • the middle frame 2 is bonded to the lower surface of the upper substrate 1.
  • the lower surface of the upper substrate 1 has been brushed, and the middle frame 2 is placed on the upper substrate 1 when the through holes 24 and the second indicator 12 are aligned, so that the middle frame 2 and the upper substrate 1 can be quickly and accurately positioned and positioned.
  • the operation is simpler, which is beneficial to improve the qualification rate of the smart card, and is beneficial to improving the production efficiency, so that the smart card manufacturing component is easier to process and the production efficiency is higher.
  • the display screen 4, the flexible circuit board 5 and the middle frame 2 are fixed on the upper substrate 1 by bonding, the operation is simple, the assembly efficiency is high, the processing time of the smart card is shortened, the production efficiency is higher, and the upper substrate is provided. 1 is bonded to the middle frame 2, and the upper substrate 1 and the middle frame 2 can be initially fixed to avoid ectopicity between the two when laminating, and the glue can be prevented from seeping between the upper substrate 1 and the middle frame 2 during the filling. The positioning of the upper substrate 1 and the middle frame 2 is ensured.
  • the positioning between the upper substrate 1 and the middle frame 2 is realized by the through hole 24 and the second indicating position 12, and the positioning capability is fast and accurate, and the positioning operation is performed. It is more convenient, which is conducive to improving the qualification rate of smart cards and improving production efficiency.
  • the through hole 24 and the third indicator bit 31 are provided, the through hole 24 is set to the middle frame 2 when the middle frame 2 and the lower substrate 3 are prepared in step S1, and the third indication is The bit 31 is disposed on the lower substrate 3, specifically, the through hole 24 is formed in the middle frame 2, and the third indication bit 31 corresponding to the through hole 24 is printed on the upper surface of the lower substrate 3; the third indicator bit 31 and the through hole are printed.
  • the positioning of 24 corresponds to the process, and the process is simpler, which is advantageous for maintaining the flatness of the upper surface of the lower substrate 3, which is advantageous for reducing the positioning deviation and increasing the stability of the lower substrate 3.
  • the step of fixing the lower substrate 3 to the middle frame 2 preferably includes: brushing the upper surface of the lower substrate 3 to align the third indicating position 31 with the through hole 24, The lower substrate 3 is bonded to the lower surface of the middle frame 2. The upper surface of the lower substrate 3 has been brushed, and the lower substrate 3 is placed on the middle frame 2 when the through holes 24 and the third indicating position 31 are aligned, so that the positioning and bonding of the middle frame 2 and the lower substrate 3 can be realized. Smart card-making components are easier to machine and more productive.
  • the lower substrate 3 is bonded to the middle frame 2, and the lower substrate 3 and the middle frame 2 can be initially fixed to avoid eccentricity during lamination, and the glue can be prevented from being connected between the connection faces of the lower substrate 3 and the middle frame 2 Exudation ensures the positioning of the lower substrate 3 and the middle frame 2.
  • step S7 includes: blanking off the edge region.
  • the smart card obtained by removing the edge area of the card can prevent the positioning hole and the hollow structure at the glue storage groove 23 from affecting the stability of the edge area of the smart card, that is, the smart card punched off the edge area has better structural stability.
  • the upper substrate 1 is first placed in the reverse direction such that the inner side (ie, the lower surface of the upper substrate 1) faces upward, and the first indicator bit 11 on the upper substrate 1 can be seen in FIG. Four second indicator bits 12;
  • the glue is first applied on the inner side of the upper substrate 1, and then the display screen 4 and the flexible circuit board 5 are bonded to the upper substrate 1, and the display screen 4 corresponds to the first indicator position 11;
  • the indication bit 11 indicates the position of the display screen 4, and the display screen 4 in turn limits the fixed position of the flexible circuit board 5; the display screen 4 selects the liquid crystal screen; the first indication bit 11 is a printed wire frame;
  • the middle frame 2 is bonded to the upper substrate 1, and the through holes 24 of the middle frame 2 are aligned with the second indicating position 12 on the upper substrate 1.
  • the middle frame 2 has a hollow cavity 21, four overflow tanks 22, four glue storage slots 23 and four through holes 24;
  • the second indicator 12 is a printed circular frame, through holes 24 is a printed circular frame;
  • the upper surface of the lower substrate 3 has four third indication bits 31; the third indication position 31 is a printed circular frame;
  • liquid crystal screen is accurately positioned by the printed wire frame on the upper substrate 1, and the operation is simple and the production efficiency is high.
  • the upper substrate 1, the middle frame 2, and the lower substrate 3 are accurately positioned by the circular holes and the printed circular frame.
  • the middle frame 2 is designed to cover the glue tank 22 and the glue storage tank 23. After the smart card is laminated, the thickness of the card conforms to the specification of the card, and the colloid in the display area of the card is not easy to generate bubbles.

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Abstract

智能卡制卡组件，包括顺序设置的上基板(1)、中框(2)和下基板(3)，上基板(1)、中框(2)和下基板(3)之间形成中空腔体(21)，中空腔体(21)用于灌胶连接上基板(1)、中框(2)和下基板(3)，中框(2)上设有溢胶槽(22)，溢胶槽(22)的一端连通中空腔体(21)；智能卡制造工艺，包括将中框(2)固定在上基板(1)的下表面、向中空腔体(21)内灌入胶液、将下基板(3)固定在中框(2)的下表面及层压上基板(1)、中框(2)和下基板(3)，使中空腔体(21)内的空气和/或多余胶液被挤压到溢胶槽(22)内，并固化胶液；层压时中空腔体(21)内的空气、多余的胶液被挤压到溢胶槽(22)，增强灌封胶层(6)对上基板(1)、中框(2)和下基板(3)的粘接力，保证智能卡符合卡片厚度规范要求，提高智能卡表面平整度、结构稳定性和产品合格率。

Description

智能卡制卡组件及智能卡制造工艺 技术领域
本发明属于智能卡领域，具体涉及智能卡制卡组件及智能卡制造工艺。
 背景技术
智能卡容量大、其工作原理类似于微型计算机，能够实现多种功能，广泛应用在数据统计存储、访问安全控制、移动支付、出入境控制等领域。一般智能卡包括用户信息和少量的安全控制信息，这些智能卡都由多层结构组成，电路板、显示器等内部组件包裹于多层结构间，通过这些多层结构提供内部组件所需要的硬度和保护，多层结构一般都是通过层压的方法组合在一起的。但现有智能卡存在如下问题：
1）显示屏在中框里无法定位，导致智能卡灌胶成型后显示屏发生倾斜和偏移的现象；
2）上基板、中框和下基板之间无法定位，生产比较困难，产品不良率高；
3）中框内的灌胶量难以把握，胶液过少则不能有效粘接上基板、中框和下基板，胶液过多则智能卡的厚度不符合规范要求；
4）智能卡内形成气泡，导致卡面不平整；尤其卡的显示区域内容易产生气泡，导致显示效果较差。
 技术问题
本发明所要解决的一个技术问题在于提供一种符合卡片厚度规范要求、产品良率高的智能卡制卡组件。
本发明所要解决的另一个技术问题在于提供一种符合卡片厚度规范要求、产品合格率高的智能卡制造工艺。
 技术解决方案
本发明采用的技术方案是：提供一种智能卡制卡组件，包括顺序设置的上基板、中框和下基板，所述上基板、所述中框和所述下基板之间形成中空腔体，所述中空腔体用于灌胶连接所述上基板、所述中框和所述下基板，所述中框上设有溢胶槽，所述溢胶槽的一端连通所述中空腔体。
本发明提供一种基于前述智能卡制卡组件的智能卡制造工艺，包括如下步骤：
将所述中框固定在所述上基板的下表面；
向所述中空腔体内灌入胶液；
将所述下基板固定在所述中框的下表面；
层压所述上基板、所述中框和所述下基板，使所述中空腔体内的空气和/或多余胶液被挤压到所述溢胶槽内，并固化胶液。
 有益效果
本发明提供的智能卡制卡组件的有益效果在于：中框上设置连通中空腔体的溢胶槽，能够在中空腔体内灌胶、层压形成灌封胶层的过程中，中空腔体内的空气和/或多余的胶液能挤压到溢胶槽内，如此能够避免胶液固化而成的灌封胶层内形成气泡或因灌封胶层过厚和凹凸不平而导致智能卡不符合厚度规范以及表面平整度差的问题，从而增强灌封胶层对上基板和下基板的粘接力，避免分层，保证智能卡符合卡片厚度规范要求，提高智能卡表面平整度、结构稳定性和产品合格率，延长智能卡的使用寿命。
本发明提供的智能卡制造工艺的有益效果在于：该智能卡制造工艺，向中空腔体内灌入胶液并层压时将中空腔体内的空气、多余的胶液等被挤压到溢胶槽内，如此能够避免胶液固化而成的灌封胶层内形成气泡或因灌封胶层过厚和凹凸不平而导致智能卡不符合厚度规范以及表面平整度差的问题，从而增强灌封胶层对上基板和下基板的粘接力，避免分层，保证智能卡符合卡片厚度规范要求，提高智能卡表面平整度、结构稳定性和产品合格率，延长智能卡的使用寿命。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的智能卡制卡组件的上基板的结构示意图；
图2为图1固定显示屏和柔性电路板后的结构示意图；
图3为本发明实施例提供的智能卡制卡组件的中框的结构示意图；
图4为图3的A-A剖面图；
图5为图3的中框固定到图2的上基板后的结构示意图；
图6为图5的中框上固定下基板后的结构示意图；
图7为图6冲裁后形成的智能卡的结构示意图；
图8为图7的B-B剖面图；
其中：1-上基板、11-第一指示位、12-第二指示位、2-中框、21-中空腔体、22-溢胶槽、23-储胶槽、24-通孔、3-下基板、31-第三指示位、32-透明区域、4-显示屏、5-柔性电路板、6-灌封胶层、7-显示窗、8-印刷区域。
 本发明的实施方式
为了使本发明所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。
需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
如图2、图5和图6所示，智能卡制卡组件，包括顺序设置的上基板1、中框2和下基板3，上基板1、中框2和下基板3之间形成中空腔体21，中空腔体21用于灌胶连接上基板1、中框2和下基板3，中框2上设有溢胶槽22，溢胶槽22的一端连通中空腔体21。中框2上设置连通中空腔体21的溢胶槽22，在中空腔体21内封装控制（如后述的柔性电路板5）、甚至显示部件（如后述的显示屏4）时对中空腔体21进行灌胶后，层压上基板1、中框2和下基板3粘接成的整体，能将中空腔体21内的空气和/或多余的胶液挤压到溢胶槽22内，如此能够避免胶液固化而成的灌封胶层6内形成气泡或因灌封胶层6过厚和凹凸不平而导致智能卡不符合厚度规范以及表面平整度差的问题，从而增强灌封胶层6对上基板1和下基板3的粘接力，避免分层，保证智能卡符合卡片厚度规范要求，提高智能卡表面平整度、结构稳定性和产品合格率，延长智能卡的使用寿命。
进一步地，如图3所示，在本发明实施例中，中框2上设有储胶槽23，储胶槽23通过溢胶槽22与中空腔体21连通；中空腔体21内的多余胶液、空气能够经溢胶槽22排至储胶槽23，储胶槽23具有较大的容纳空间，保证对多余胶液和空气的收纳能力，而且设置储胶槽23后，可减小溢胶槽22的流道长度，避免胶液硬化堵死溢胶槽22而导致中空腔体21内的空气和多余胶液排出不彻底。优选地，储胶槽23的深度大于溢胶槽22的深度，便于层压上基板1、中框2和下基板3时，中空腔体21中的空气、多余的胶液（若存在空气或多余的胶液）经溢胶槽22被挤压到储胶槽23内，中空腔体21内的空气和多余胶液排出更彻底，提高智能卡表面平整度、结构稳定性和产品合格率，延长智能卡的使用寿命。具体地，溢胶槽22和储胶槽23的数量均可为一个或多个，溢胶槽22和储胶槽23可一一对应，也可一个储胶槽23对应一个或多个溢胶槽22。储胶槽23可以为盲孔或通孔，在本实施例中优选为通孔。
更进一步地，如图3所示，在本发明实施例中，中框2的四周均设有储胶槽23，各储胶槽23对应有至少一个溢胶槽22。能够在灌胶、层压过程中减少多余胶液、空气通过溢胶槽22排到储胶槽23的行程，易于排出胶液、空气，避免胶液粘度过大而导致胶液堵死溢胶槽22导致胶液无法排出，避免随着胶液固化而粘度过大时将空气包裹在胶液内导致气泡产生，从而保证智能卡制卡组件厚度符合制卡厚度要求，提高智能卡制卡组件的各层结构之间的连接可靠性，提高智能卡制卡组件的显示性能，易于加工，提高生产效率，有效增加产品合格率。
进一步地，如图4和图8所示，溢胶槽22位于中框2靠近上基板1的一侧。溢胶槽22靠近下基板3，能够在灌胶时将空气从中空腔体21上端的溢胶槽22排出，避免空气迁移到胶液的顶部时滞留在中空腔体21内，具有更好的防止产生气泡的能力，提高智能卡制卡组件的各层结构之间的连接可靠性，提高智能卡制卡组件的显示性能，有效增加产品合格率。
进一步地，如图2和图8所示，在本发明实施例中，还包括设于中空腔体21内的柔性电路板5和显示屏4，柔性电路板5与显示屏4电连接。柔性电路板5挠曲性能良好，防止智能卡弯折时导致控制电路损坏，显示屏4的设置，能够直观的显示信息，使用更加方便。
进一步地，如图1所示，在本发明实施例中，上基板1上设有用于指示显示屏4的安放位置的第一指示位11，显示屏4对应第一指示位11粘接在上基板1上。显示屏4粘接在上基板1上，能够避免灌胶时显示屏4发生倾斜和偏移的现象，提高智能卡制卡组件的显示性能，保证产品的合格率。具体地，第一指示位11可通过印刷的方式设置在上基板1上，第一指示位11的形状可与显示屏4的轮廓相同，如第一指示位11为与显示屏4大小一致的印刷线框，当然第一指示位11也可以是设置在上基板1上的指示凹槽。
进一步地，如图1和图4所示，在本发明实施例中，中框2上设有通孔24，上基板1的下表面设有与通孔24对应的第二指示位12。操作简单，通过通孔24和第二指示位12正对，能够对上基板1和中框2进行精准定位，使得智能卡制卡组件更加易于加工，生产效率更高。具体地，通孔24可为圆孔、方孔、三角孔或其它形状的孔，第二指示位12与通孔24的形状一致，更加利于通孔24与第二指示位12的对准。优选第二指示位12和通孔24均至少为两个，各通孔24分别正对于相应的第二指示位12；这样上基板1与中框2之间能够至少形成两处定位，使得上基板1和中框2之间能够更为快速、精准的定位。
或者，中框2上设有通孔24，下基板3的上表面设有与通孔24对应的第三指示位31。结构简单，通过第三指示位31与通孔24正对，实现下基板3与中框2之间的定位，具有快速、精准的定位能力，定位操作更为简便，使得智能卡制卡组件更加易于加工，利于提高智能卡的生产效率和合格率。具体地，通孔24可为圆孔、方孔、三角孔或其它形状的孔，第三指示位31与通孔24的形状一致，更加利于通孔24与第三指示位31的对准。
当然，也可同时设置第二指示位12和第三指示位31，中框2上开设的通孔24上端对应第二指示位12，下端对应第三指示位31。如此，通过同时对应第二指示位12和第三指示位31的通孔24，即可实现上基板1、中框2和下基板3的定位，结构简单，避免在中框2上开设过多的通孔24而影响中框2的稳定性。
更进一步地，如图1、图4和图6所示，在本发明实施例中，第二指示位12、第三指示位31和通孔24均设为四个，各通孔24的两端分别正对于相应的第二指示位12和第三指示位31。更加易于对上基板1、中框2和下基板3进行精准定位，生产效率高。具体地，第二指示位12和第三指示位31可通过印刷的方式相应的设置在上基板1和下基板3上，第二指示位12和第三指示位31的形状可与通孔24的轮廓相同，如通孔24为圆孔时，第二指示位12和第三指示位31为印刷圆框，第二指示位12和第三指示位31也可以是分别设置在上基板1和下基板3上的指示通孔24或指示凸起。印刷第三指示位31的下基板3部位透明以便装配时，从下基板的下表面看到第三指示位31和通孔24的定位情况。
具体地，下基板3的下表面设有印刷区域8和非印刷区域，上基板1的上表面也可设置印刷区域和非印刷区域，可根据客户需求在印刷区域8进行定制印刷。非印刷区域对应的下基板3部分为透明区域32，第三指示位31印刷在相应的透明区域32时，能够从下基板3的下表面透视，方便定位。
本发明实施例提供的智能卡制造工艺，可基于前述任一实施例智能卡制卡组件，包括如下步骤：
S1、准备上基板1、中框2和下基板3；
S3、使上基板1的下表面在上，将中框2固定在上基板1的下表面；
S4、向中空腔体21内灌入胶液；
S5、将下基板3固定在中框2的下表面；
S6、层压上基板1、中框2和下基板3，且层压上基板1、中框2和下基板3时中空腔体21内的空气和/或多余胶液被挤压到溢胶槽22内，并固化胶液。
该智能卡制造工艺，向中空腔体21内灌入胶液并层压将中空腔体21内的空气、多余的胶液挤压到溢胶槽22内，如此能够避免胶液固化而成的灌封胶层6内形成气泡或因灌封胶层6过厚和凹凸不平而导致智能卡不符合厚度规范以及表面平整度差的问题，从而增强灌封胶层6对上基板1和下基板3的粘接力，避免分层，保证智能卡符合卡片厚度规范要求，提高智能卡表面平整度、结构稳定性和产品合格率，延长智能卡的使用寿命。为了更好的粘接上基板1、中框2和下基板3，优选向中空腔体21内灌入略微过量的胶液。
进一步地，在本发明实施例中，若在中框2上设置储胶槽23，则在步骤S1准备中框2时将储胶槽23设置到中框2上；如此层压上基板1、中框2和下基板3时，中空腔体21内的空气、多余胶液（若存在空气或多余胶液）被挤压到溢胶槽22内，而当空气或多余胶液较多，空气、多余胶液还能经溢胶槽22被挤压到储胶槽23内。如此能够避免固化时在灌封胶层6内形成气泡，而且增强灌封胶层6对上基板1和下基板3的粘接力，避免分层，保证智能卡的结构稳定性和使用寿命；该制造工艺通过简单的操作，即可生产出符合厚度要求的智能卡，生产的智能卡合格率高，生产效率高。
进一步地，在本发明实施例中，若设置柔性电路板5和显示屏4，则在步骤S1和步骤S3之间进行步骤S2，步骤S2包括：将柔性电路板5和显示屏4固定在上基板1的下表面。将该智能卡制造工艺，将显示屏4和柔性电路板5固定在上基板1后，再进行灌胶，能够避免显示屏4发生倾斜和偏移，保证显示屏4处于正位，提高显示性能。
进一步地，在本发明实施例中，若设置第一指示位11，则在步骤S1准备上基板1时将第一指示位11设置到上基板1上，具体可在上基板1的下表面印刷用于指示显示屏4的安放位置的第一指示位11，通过印刷的第一指示位11来定位，工艺更为简单，有利于保持上基板1下表面的平整度，有利于减少定位偏差，增加上基板1的稳定性。
设有第一指示位11时，优选步骤S2中将柔性电路板5和显示屏4固定在上基板1上的步骤包括：在上基板1的下表面刷胶，将柔性电路板5和显示屏4粘贴于上基板1的下表面，且显示屏4位于第一指示位11处；通过第一指示位11来定位显示屏4，而柔性电路板5的位置则受显示屏4约束，这样实现显示屏4和柔性电路板5定位后，再进行灌胶，能够避免显示屏4发生倾斜和偏移，保证显示屏4处于正位，提高显示性能。
进一步地，在本发明实施例中，若设置通孔24和第二指示位12，则在步骤S1准备中框2和上基板1时将通孔24设置到中框2上，具体在中框2上开设通孔24，在上基板1的下表面印刷与通孔24对应的第二指示位12；通过印刷的第二指示位12和通孔24的对应来定位，工艺更为简单，有利于保持上基板1下表面的平整度，有利于减少定位偏差，增加上基板1的稳定性。
设有通孔24和第二指示位12时，优选将中框2固定在上基板1上的步骤包括：在上基板1的下表面刷胶，将通孔24与第二指示位12对准，将中框2粘接于上基板1的下表面。上基板1的下表面已经刷胶，在通孔24和第二指示位12对准时将中框2放置到上基板1上，即可实现中框2和上基板1的快速、精准定位，定位操作更为简便，利于提高智能卡的合格率，利于提高生产效率，使得智能卡制卡组件更加易于加工，生产效率更高。
通过粘接的方式将显示屏4、柔性电路板5和中框2固定在上基板1上，操作简便，装配效率高，有利于缩短智能卡的加工时间，具有更高的生产效率，而且上基板1与中框2粘接，能够初步的固定上基板1和中框2，避免层压时两者发生异位，还能够避免灌胶时胶液从上基板1与中框2之间渗出，保证上基板1和中框2的定位。当设有第二指示位12和通孔24时，通过通孔24与第二指示位12正对，实现上基板1与中框2之间的定位，具有快速、精准的定位能力，定位操作更为简便，利于提高智能卡的合格率，利于提高生产效率。
进一步地，在本发明实施例中，若设置通孔24和第三指示位31，则在步骤S1准备中框2和下基板3时将通孔24设置到中框2上，将第三指示位31设置到下基板3上，具体在中框2上开设通孔24，在下基板3的上表面印刷与通孔24对应的第三指示位31；通过印刷的第三指示位31和通孔24的对应来定位，工艺更为简单，有利于保持下基板3上表面的平整度，有利于减少定位偏差，增加下基板3的稳定性。
设有通孔24和第三指示位31时，优选将下基板3固定在中框2上的步骤包括：在下基板3的上表面刷胶，将第三指示位31与通孔24对准，将下基板3粘接在中框2的下表面。下基板3的上表面已经刷胶，在通孔24和第三指示位31对准时将下基板3放置到中框2上，即可实现中框2和下基板3的定位、粘接，使得智能卡制卡组件更加易于加工，生产效率更高。
下基板3与中框2粘接，能够初步的固定下基板3和中框2，避免层压时两者发生异位，还能够避免胶液从下基板3与中框2的连接面之间渗出，保证下基板3和中框2的定位。
进一步地，在本发明实施例中，在步骤S6之后进行步骤S7，步骤S7包括：冲裁掉边沿区域。这种去掉制卡边沿区域得到的智能卡，能够避免定位孔、储胶槽23处的空心结构影响智能卡边沿区域的稳定性，即经冲裁掉边沿区域的智能卡具有更好的结构稳定性。
以下结合附图，对本发明实施例提供的优选智能卡制造工艺进行详细说明：
1）如图1所示，先将上基板1反向放置，使其内侧（即上基板1的下表面）朝上，在图1中能够看到上基板1上的第一指示位11和四个第二指示位12；
2）如图2所示，在上基板1的内侧先刷胶，再将显示屏4和柔性电路板5粘接在上基板1上，显示屏4对应第一指示位11；实际上第一指示位11指示了显示屏4的位置，而显示屏4又限制了柔性电路板5的固定位置；显示屏4选择液晶屏；第一指示位11为印刷线框；
3）如图5所示，将中框2粘接在上基板1上，且中框2的通孔24与上基板1上的第二指示位12对齐。在图3-4中能够看到中框2具有中空腔体21、四个溢胶槽22、四个储胶槽23和四个通孔24；第二指示位12为印刷圆框，通孔24为印刷圆框；
4）向中空腔体21内灌注过量胶液；
5）在下基板3的内侧（即下基板3的上表面）刷胶，将下基板3粘接在中框2上，且下基板3的第三指示位31与中框2的通孔24对齐。在图6中能够看到下基板3的上表面具有四个第三指示位31；第三指示位31为印刷圆框；
6）将上基板1、中框2和下基板3移至层压装置进行层压，中空腔体21内的多余胶液会经溢胶槽22挤入储胶槽23，空气也可排至储胶槽23；待中空腔体21内的胶液固化，制得智能卡初产品；
7）冲裁智能卡初产品得到智能卡成品，如图7-8所示。
该优选智能卡制造工艺具有如下优点：
1）液晶屏通过上基板1上的印刷线框精准定位，操作简单，生产效率高。
2）上基板1、中框2和下基板3通过圆孔和印刷圆框精准定位。
3）中框2设计溢胶槽22和储胶槽23，智能卡灌胶层压后，卡的厚度符合卡的规范要求，卡的显示区域内的胶体不容易产生气泡。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (15)

  1. 智能卡制卡组件，包括顺序设置的上基板、中框和下基板，其特征在于，所述上基板、所述中框和所述下基板之间形成中空腔体，所述中空腔体用于灌胶连接所述上基板、所述中框和所述下基板，所述中框上设有溢胶槽，所述溢胶槽的一端连通所述中空腔体。
  2. 根据权利要求1所述的智能卡制卡组件，其特征在于，所述中框上设有储胶槽，所述储胶槽通过所述溢胶槽与所述中空腔体连通。
  3. 根据权利要求2所述的智能卡制卡组件，其特征在于，所述中框的四周均设有所述储胶槽，各所述储胶槽对应有至少一个所述溢胶槽。
  4. 根据权利要求1所述的智能卡制卡组件，其特征在于，所述溢胶槽位于所述中框靠近所述上基板的一侧。
  5. 根据权利要求1-4任一项所述的智能卡制卡组件，其特征在于，还包括设于所述中空腔体内的柔性电路板和显示屏，所述柔性电路板与所述显示屏电连接。
  6. 根据权利要求5所述的智能卡制卡组件，其特征在于，所述上基板上设有用于指示所述显示屏的安放位置的第一指示位，所述显示屏对应所述第一指示位粘接在所述上基板上。
  7. 根据权利要求1-4任一项所述的智能卡制卡组件，其特征在于，所述中框上设有通孔，所述上基板的下表面设有与所述通孔对应的第二指示位。
  8. 根据权利要求1-4任一项所述的智能卡制卡组件，其特征在于，所述中框上设有通孔，所述下基板的上表面设有与所述通孔对应的第三指示位。
  9. 基于权利要求1所述智能卡制卡组件的智能卡制造工艺，其特征在于，包括如下步骤：
    将所述中框固定在所述上基板的下表面；
    向所述中空腔体内灌入胶液；
    将所述下基板固定在所述中框的下表面；
    层压所述上基板、所述中框和所述下基板，使所述中空腔体内的空气和/或多余胶液被挤压到所述溢胶槽内，并固化胶液。
  10. 基于权利要求9所述智能卡制卡组件的智能卡制造工艺，其特征在于，在将所述中框固定在所述上基板的步骤之前，在所述中框上设置储胶槽，所述储胶槽通过所述溢胶槽与所述中空腔体连通；使得在层压所述上基板、所述中框和所述下基板时，所述中空腔体内的空气和/或多余胶液被挤压到所述溢胶槽内或者经所述溢胶槽被挤压到所述储胶槽内。
  11. 根据权利要求9所述的智能卡制造工艺，其特征在于，还包括在将所述中框固定在所述上基板之前进行的如下步骤：将柔性电路板和显示屏固定在上基板的下表面。
  12. 根据权利要求11所述的智能卡制造工艺，其特征在于，还包括在将所述柔性电路板和所述显示屏固定在所述上基板之前进行的如下步骤：在所述上基板的下表面印刷用于指示所述显示屏的安放位置的第一指示位；
    将所述柔性电路板和所述显示屏固定在所述上基板的步骤包括：在所述上基板的下表面刷胶，将所述柔性电路板和所述显示屏粘贴于上基板的下表面，且所述显示屏位于所述第一指示位处。
  13. 根据权利要求9所述的智能卡制造工艺，其特征在于，还包括在将所述中框固定在所述上基板之前进行的如下步骤：在所述中框上开设通孔，在所述上基板的下表面印刷与所述通孔对应的第二指示位；
    将所述中框固定在所述上基板的步骤包括：在所述上基板的下表面刷胶，将所述通孔与所述第二指示位对准，将所述中框粘接于所述上基板的下表面。
  14. 根据权利要求9所述的智能卡制造工艺，其特征在于，还包括在将所述中框固定在所述上基板之前进行的如下步骤：在所述中框上开设通孔，在所述下基板的上表面印刷与所述通孔对应的第三指示位；
    将所述下基板固定在所述中框的步骤包括：在所述下基板的上表面刷胶，将所述第三指示位与所述通孔对准，将所述下基板粘接在所述中框的下表面。
  15. 根据权利要求9所述的智能卡制造工艺，其特征在于，还包括在层压所述上基板、所述中框和所述下基板的步骤之后进行的如下步骤：冲裁掉边沿区域。
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