WO2018161371A1 - 一种可折叠面板及其制作方法 - Google Patents

一种可折叠面板及其制作方法 Download PDF

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Publication number
WO2018161371A1
WO2018161371A1 PCT/CN2017/077286 CN2017077286W WO2018161371A1 WO 2018161371 A1 WO2018161371 A1 WO 2018161371A1 CN 2017077286 W CN2017077286 W CN 2017077286W WO 2018161371 A1 WO2018161371 A1 WO 2018161371A1
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WIPO (PCT)
Prior art keywords
binding
flexible substrate
driving chip
foldable panel
thin film
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PCT/CN2017/077286
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English (en)
French (fr)
Inventor
刘敏伦
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/521,665 priority Critical patent/US10290239B2/en
Publication of WO2018161371A1 publication Critical patent/WO2018161371A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present invention relates to the field of flexible display technologies, and in particular, to a foldable panel and a method of fabricating the same.
  • Flexible display is a highly competitive display technology in the future.
  • the display By mounting flexible display medium electronic components and materials on a flexible or flexible substrate, the display has the characteristics of being able to bend or curl into any shape, which is light and thin. It is easy to carry and so on, especially its foldability, so that the panel can obtain a larger display area without occupying more space.
  • the VA area (view area) side of the flexible display panel needs to reserve a certain space for the driver IC (chip), so that the flexible display panel AA area (Ative Area, effective display area)
  • AA area Active Area, effective display area
  • the proportion of the entire plane is relatively small. How to increase the proportion of AA area becomes a more important technical issue.
  • the present invention provides a foldable panel with a high effective display area ratio and a reliable structure, and a manufacturing method thereof.
  • a foldable panel includes a flexible display panel and a driving chip, the driving chip is disposed at a binding end of the flexible substrate of the flexible display panel, and the binding end faces away from the light emitting side of the flexible display panel The direction of the bending causes the driving chip to be located at the back of the flexible substrate; the flexible substrate is further provided with a thin film circuit layer connected between the effective display area and the driving chip, and a surface of the thin film circuit layer is disposed There are conductive lines connecting the flexible display panel and the driving chip, respectively.
  • the conductive line is disposed on an inner surface of the thin film circuit layer and disposed opposite to the flexible substrate.
  • the binding end of the flexible substrate is provided with a plurality of first binding terminals adjacent to the effective display area and a plurality of second binding terminals adjacent to the driving chip, the first The binding terminal is the same as the second binding terminal, and the first binding terminal is connected to the second binding terminal one-to-one through the thin film circuit layer.
  • At least two conductive lines are connected between each of the first binding terminals and the second binding terminals.
  • the driving chip is directly attached to the flexible substrate or attached to the flexible substrate through a flexible circuit board.
  • the flexible substrate is further provided with a reinforcing plate on the back side of the binding end, and the reinforcing plate covers at least the back surface of the binding end where the driving chip is disposed.
  • the conductive line is wavy.
  • the conductive line is a chain structure formed by connecting a plurality of conductive rings.
  • the conductive ring connection portions of the two adjacent conductive lines are staggered from each other.
  • Another object of the present invention is to provide a method for fabricating the foldable panel, comprising:
  • the binding end is bent so that the driving chip is located at the back of the flexible substrate.
  • the invention has a thin film circuit layer formed on the binding end surface of the flexible substrate, and the electrical connection between the flexible display panel and the driving chip is realized by the conductive line in the thin film circuit layer, and the binding end faces away from the light side bend of the flexible display panel.
  • the driver chip is hidden on the back of the effective display area, so that the effective display area of the panel is maximized, and the circuit has good bending performance, avoiding the use of expensive flip chip and the risk of line breakage.
  • the folding reliability of the panel reduces the manufacturing cost.
  • FIG. 1 is a schematic structural view of a foldable panel according to an embodiment of the present invention.
  • FIG. 2 is a top plan view of a foldable panel in an unfolded state according to an embodiment of the present invention.
  • FIG. 3 is a schematic partial structural view of a foldable panel after being bent according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of bridging of a thin film wiring layer according to an embodiment of the present invention.
  • Fig. 5 is a partial enlarged view of Fig. 4;
  • FIG. 6 is a schematic diagram of bridging of another thin film circuit layer according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a main manufacturing method of a foldable panel according to an embodiment of the present invention.
  • the foldable panel of the embodiment of the present invention mainly includes a flexible display panel 10 and a driving chip (IC) 20, wherein the flexible display panel 10 has a flexible substrate 100 as a base, and the flexible substrate 100 includes a corresponding effective display area. And a bonding end of the effective display area side, the driving chip 20 is disposed on the binding end of the flexible substrate 100 by a bonding process, and the binding end is bent toward the light-emitting side of the flexible display panel 10 The driving chip 20 is finally hidden to the back of the flexible substrate 100; the bent portion of the binding end is not provided with a line, but is covered on the flexible substrate 100 with a connection between the effective display area (AA area) and the driving chip 20.
  • the film wiring layer 30, one surface of the thin film wiring layer 30 is provided with conductive lines that connect the flexible display panel 10 and the driving chip 20, respectively.
  • the effective display area ratio of the panel is maximized.
  • the electrical connection between the flexible display panel and the driving chip is realized by the conductive circuit in the thin film circuit layer, which replaces the costly COF (Chip On Film) method in the prior art, thereby saving cost.
  • the flexible display panel 10 of the present embodiment includes a display module 11 and a touch module 12 on the display module 11 .
  • the display module 11 includes a flexible substrate 100 , a thin film transistor layer 111 sequentially stacked on the flexible substrate 100 , The electroluminescent layer 112, the thin film encapsulation layer 113, and the polarizer 114.
  • the back surface of the flexible substrate 100 may also be covered with a back sheet film 115 covered with a light-shielding reflection, the back sheet film 115 covering the AA area, and the flexible substrate 100
  • One side extends out of the binding end, and the driving chip 20 is bound thereto.
  • the touch module 12 includes a touch layer 121, a cover glass 122, and a padding therebetween.
  • the optical adhesive 123 and the touch layer 121 are preferably laminated on the polarizer 114 by using an electronic ink film.
  • the flexible display panel 10 may also have no touch module 12 and only have a display function.
  • the thin film circuit layer 30 is used for bridging the source (source), GOA (gate drive circuit) and the like of the panel with the output end of the driving chip 20, thereby preventing the conductive line from being directly plated on the flexible substrate 100 and being easily broken.
  • the flexible substrate 100 is made of a flexible PI (polyimide) material.
  • the driving chip 20 of the present embodiment may be directly attached to the flexible substrate 100 or may be attached to the flexible substrate 100 through a flexible wiring board.
  • the flexible substrate 100 is also attached to the reinforcing plate 40 on the back side of the binding end.
  • the reinforcing plate 40 covers at least the back side of the binding end provided with the driving chip 20 to ensure the strength of the binding portion of the driving chip 20, and the binding end is bent.
  • the reinforcing plate 40 is oppositely disposed, and the driving chip 20 is hidden on the back surface of the flexible substrate 100, and the free end of the bonding end is substantially parallel to the portion of the flexible substrate 100 in the AA area.
  • the conductive line is disposed on the inner surface of the thin film wiring layer 30, and is disposed opposite to the flexible substrate 100, and the outer surface of the thin film wiring layer 30 has no wiring, thereby effectively protecting the conductive line of the bending region.
  • FIG. 4 it is a schematic diagram of bridging of a thin film circuit layer of the present embodiment.
  • the binding end of the flexible substrate 100 is provided with a plurality of first binding terminals A close to the effective display area and a plurality of second binding terminals B close to the driving chip 20, the first binding terminal A and The number of the second binding terminals B is the same, and the first binding end A is connected to the second binding terminal B one-to-one through the thin film circuit layer 30.
  • one first binding terminal A corresponds to one second binding terminal B, and two sets of binding terminals located on both sides of the bending zone are in one-to-one correspondence.
  • the two ends of the thin film circuit layer 30 are correspondingly provided with two sets of binding terminals respectively corresponding to the first binding terminal A and the second binding terminal B of the flexible substrate 100, and the two ends of each conductive line are respectively connected to the thin film circuit layer.
  • the binding terminals of the flexible substrate 100 and the binding terminals of the thin film circuit layer 30 can be quickly bound by the alignment marks on the two sets of binding terminals at both ends by using the alignment marks at the binding terminals. Thereby bonding the conductive lines over the flexible substrate.
  • each of the conductive lines 1 in the embodiment is a chain structure formed by connecting a plurality of conductive rings, so that each of the conductive lines 1 has a certain free expansion and contraction space, so that it is not easily broken.
  • the conductive ring connection portions of the adjacent two conductive lines 1 are staggered from each other.
  • the junction of the conductive ring and the conductive ring of each conductive line 1 is a stress concentration portion.
  • the first and third conductive lines 1 are at the bend lines b, d.
  • the stress is most concentrated, and the stress at the bending lines a and c is weak, and the stress of the second conductive line l at the bending lines a and c is the most concentrated, and the stress at the bending lines b and d is relatively high.
  • this embodiment passes The stress concentration parts of the adjacent two conductive lines 1 are staggered from each other, that is, the stress concentration parts of the adjacent two conductive lines 1 are not on the same bending line, and the stress is concentrated on the same bending line, thereby ensuring the conduction.
  • the connectivity of the line at the bend since the flexible substrate 100 is under the conductive line in the film circuit layer 30, in the bending region, the bottom of the conductive line has the support of the flexible substrate 100, and the bending avoids the dead fold (the radius of the bending angle is 0), and further The reliability of the line continuity is guaranteed.
  • FIG. 6 is a schematic diagram of bridging another thin film circuit layer according to an embodiment of the present invention.
  • the conductive line of the embodiment is wavy, and the phenomenon of stress concentration can also be avoided.
  • the manufacturing method of the foldable panel of the present invention mainly includes:
  • the first binding terminal and the second binding terminal having the same number are respectively made at a position close to the effective display area and a position close to the driving chip 20;
  • the thin film circuit layer 30 is formed on the flexible substrate 100, and the conductive lines of the thin film circuit layer 30 are respectively connected to the two ends of the corresponding first binding terminal and the second binding terminal;
  • the conductive line in step S3 is located on the inner surface of the thin film circuit layer 30, facing the flexible substrate 100, so that the conductive line is not exposed, and a certain protection is provided.
  • the back sheet film 115 on the back of the flexible substrate 100 covers the AA area, and may not necessarily extend to the binding end, and the back side of the binding end may also be attached with a reinforcing plate 40 corresponding to the portion of the driving chip 20.
  • the present invention fabricates a thin film circuit layer on the bonding end surface of the flexible substrate, and electrically connects the flexible display panel and the driving chip by using the conductive lines in the thin film circuit layer, and makes the binding end facing away from the flexible display.
  • the light-emitting side of the panel is bent to hide the driving chip on the back surface of the effective display area, so that the effective display area of the panel is maximized, and the circuit has good bending performance, avoiding the use of expensive flip chip and The risk of line breakage increases the folding reliability of the panel and reduces the manufacturing cost.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种可折叠面板，包括柔性显示面板（10）和驱动芯片（20），驱动芯片（20）设于柔性显示面板（10）的柔性基板（100）的绑定端，且绑定端朝背向柔性显示面板（10）的出光侧的方向弯折使驱动芯片（20）位于柔性基板（100）背部；柔性基板（100）上还设置有连接在有效显示区域（AA区）和驱动芯片（20）之间的薄膜线路层（30），薄膜线路层（30）的一个表面设置有分别连接柔性显示面板（10）和驱动芯片（20）的导电线路。一种可折叠面板的制作方法。利用柔性基板（100）的绑定端表面的薄膜线路层（30）实现了柔性显示面板（10）和驱动芯片（20）的电连接，并使绑定端背向出光侧弯折，使得面板的有效显示区域占比做到最大，同时也保证了电路具有良好的弯折性能，避免了使用昂贵的覆晶薄膜以及线路断裂风险。

Description

一种可折叠面板及其制作方法 技术领域
本发明涉及柔性显示技术领域，尤其涉及一种可折叠面板及其制作方法。
背景技术
随着更先进的制造设备和材料工程技术的发展，可弯曲、可折叠以及曲面显示在电子产品中的应用日益丰富，为电子产品制造商带来了丰厚的获利机会。
柔性显示是未来极具竞争优势的显示技术，通过将柔性显示介质电子元件与材料安装在有柔性或可弯曲的基板上，使得显示器具有能够弯曲或卷曲成任意形状的特性，有轻、薄且方便携带等特点，尤其是其可折叠性，使得面板可以获得更大的显示区域而不会占据更大的空间。
由于集成化的需要，柔性显示面板的VA区(View Area，可视区域)一侧需要预留一定的空间来放置驱动IC(芯片)，使得柔性显示面板的AA区(Ative Area，有效显示区域)在整个平面的占比就比较小，如何提高AA区域占比成为一个比较重要的技术问题。
发明内容
鉴于现有技术存在的不足，本发明提供了一种有效显示区域占比高、结构可靠的可折叠面板及其制作方法。
为了实现上述的目的，本发明采用了如下的技术方案：
一种可折叠面板，包括柔性显示面板和驱动芯片，所述驱动芯片设于所述柔性显示面板的柔性基板的绑定端，且所述绑定端朝背向所述柔性显示面板的出光侧的方向弯折使所述驱动芯片位于所述柔性基板背部；所述柔性基板上还设置有连接在有效显示区域和所述驱动芯片之间的薄膜线路层，所述薄膜线路层的一个表面设置有分别连接所述柔性显示面板和所述驱动芯片的导电线路。
作为其中一种实施方式，所述导电线路设于所述薄膜线路层内表面，与所述柔性基板相对设置。
作为其中一种实施方式，所述柔性基板的绑定端设置有靠近所述有效显示区域的多个第一绑定端子和靠近所述驱动芯片的多个第二绑定端子，所述第一绑定端子与所述第二绑定端子数量相同，所述第一绑定端子通过所述薄膜线路层与所述第二绑定端子一对一连接。
作为其中一种实施方式，每个所述第一绑定端子与所述第二绑定端子之间连接有至少两条所述导电线路。
作为其中一种实施方式，所述驱动芯片直接贴合在所述柔性基板上或通过柔性线路板贴合在所述柔性基板上。
作为其中一种实施方式，所述柔性基板在所述绑定端的背面还贴合有补强板，所述补强板至少覆盖所述绑定端设置有所述驱动芯片的背面。
作为其中一种实施方式，所述导电线路为波浪线形。
或者，所述导电线路为多个导电环两两相连形成的链条构造。
作为其中一种实施方式，相邻的两条所述导电线路的导电环连接部位相互错开。
本发明的另一目的在于提供一种所述的可折叠面板的制作方法，包括：
在柔性基板的绑定端绑定驱动芯片；
在柔性基板绑定端，在靠近有效显示区域的位置和靠近驱动芯片的位置分别制作数量相同的第一绑定端子和第二绑定端子；
在柔性基板上制作薄膜线路层，并将薄膜线路层的导电线路分别连接在相应的第一绑定端子和第二绑定端子的两端；
折弯绑定端，使驱动芯片位于柔性基板的背部。
本发明在柔性基板的绑定端表面制作有薄膜线路层，利用该薄膜线路层内的导电线路实现柔性显示面板和驱动芯片的电连接，并使绑定端背向柔性显示面板的出光侧弯折而将驱动芯片隐藏在有效显示区域背面，使得面板的有效显示区域占比做到最大，同时也保证了电路具有良好的弯折性能，避免了使用昂贵的覆晶薄膜以及线路断裂风险，提高了面板的折叠可靠性，并降低了制作成本。
附图说明
图1为本发明实施例的一种可折叠面板展开时的结构示意图。
图2为本发明实施例的一种可折叠面板展开时的俯视图。
图3为本发明实施例的一种可折叠面板弯曲后的局部结构示意图。
图4为本发明实施例的一种薄膜线路层的桥接示意图。
图5为图4的局部放大图。
图6为本发明实施例的另一种薄膜线路层的桥接示意图。
图7为本发明实施例的可折叠面板的主要制作方法示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参阅图1～图3，本发明实施例的可折叠面板主要包括柔性显示面板10和驱动芯片(IC)20，其中，柔性显示面板10以柔性基板100作为基底，柔性基板100包括对应有效显示区域的部分和有效显示区域一侧的绑定(bonding)端，驱动芯片20通过bonding工艺设于柔性基板100的绑定端，且绑定端朝背向柔性显示面板10的出光侧的方向弯折，使驱动芯片20最终隐藏到柔性基板100的背部；绑定端的弯折部分并不设置线路，而是在柔性基板100上覆盖有连接在有效显示区域(AA区)和驱动芯片20之间的薄膜线路层30，薄膜线路层30的一个表面设置有分别连接柔性显示面板10和驱动芯片20的导电线路。
由于驱动芯片20最终隐藏到柔性基板100的背面，使得面板的有效显示区域占比做到最大。而由于薄膜线路层内的导电线路实现了柔性显示面板和驱动芯片的电连接，替代了现有技术中成本高昂的COF(Chip On Film，覆晶薄膜)方式，节约了成本。
如图1所示，本实施例的柔性显示面板10包括显示模块11和显示模块11上的触摸模块12，显示模块11包括柔性基板100、柔性基板100上依次堆叠设置的薄膜电晶体层111、电致发光层112、薄膜封装层113以及偏光片114，另外，柔性基板100背面还可以贴合覆盖有一层遮光反射作用的背板薄膜115，该背板薄膜115覆盖AA区，柔性基板100的一侧延伸出绑定端，将驱动芯片20绑定在其上。而触摸模块12包括触摸层121、盖板玻璃122以及填充在二者之 间的光学胶123，触摸层121最好采用电子墨水膜，贴合于偏光片114上。在有的实施方式中，柔性显示面板10也可以不具有触摸模块12，仅具有显示功能。
可以理解，薄膜线路层30用于将面板的Source(源极)、GOA(栅极驱动电路)等线路与驱动芯片20的输出端桥接起来，避免了导电线路直接镀在柔性基板100上易折断的问题，这里，柔性基板100采用柔韧性好的PI(聚酰亚胺)材料。本实施例的驱动芯片20可以直接贴合在柔性基板100上，也可以通过柔性线路板贴合在柔性基板100上。柔性基板100在绑定端的背面还贴合补强板40，该补强板40至少覆盖绑定端设置有驱动芯片20的背面，保证驱动芯片20绑定处的强度，绑定端折弯后，补强板40与相对设置，驱动芯片20隐藏在柔性基板100背面，绑定端的自由端基本平行于柔性基板100在AA区的部分。
这里，导电线路设于薄膜线路层30内表面，与柔性基板100相对设置，而薄膜线路层30的外表面没有线路，有效地保护了弯折区的导电线路。如图4所示，为本实施例的一种薄膜线路层的桥接示意图。结合图4所示，柔性基板100的绑定端设置有靠近有效显示区域的多个第一绑定端子A和靠近驱动芯片20的多个第二绑定端子B，第一绑定端子A与第二绑定端子B数量相同，第一绑定端A子通过薄膜线路层30与第二绑定端子B一对一连接。即一个第一绑定端子A对应一个第二绑定端子B，位于弯折区两侧的两组绑定端子一一对应。薄膜线路层30的两端相应地设有两组绑定端子，分别对应柔性基板100的第一绑定端子A与第二绑定端子B，每根导电线路的两端分别连接在薄膜线路层30两端的两组绑定端子上，通过在各绑定端子处设置对位标记，可以利用各对位标记快速地将柔性基板100的绑定端子与薄膜线路层30的绑定端子绑定，从而将导电线路绑定在柔性基板上方。
其中，每个第一绑定端子A与第二绑定端子B之间连接有至少两条导电线路，使得在某条导电线路断开时，第一绑定端子A与第二绑定端子B仍然可以正常连接，进一步增强了该导电线路的可靠性，本实施例的每对绑定端子之间以3条导电线路为例进行说明。结合图5所示，此种实施方式中的每条导电线路l均为多个导电环两两相连形成的链条构造，使得每条导电线路l均具有一定的自由伸缩空间，使其不易折断。而且相邻的两条导电线路l的导电环连接部位相互错开。在导电线路l的长度方向上，每条导电线路l的导电环与导电环连接处为应力集中部位，例如图5中，第一条、第三条导电线路l在折弯线b、d的应力最为集中，而在折弯线a、c处的应力较弱，而第二条导电线路l在折弯线a、c处的应力最为集中，而在折弯线b、d处的应力较弱，本实施例通过 将相邻的两条导电线路l的应力集中部位相互错开，即相邻两条导电线路l的应力集中部位不在同一折弯线上，避免了应力集中在同一条折弯线上，保证了导电线路在弯折处的连通性。同时，由于柔性基板100在薄膜线路层30中导电线路的下方，在弯折区，导电线路底部有柔性基板100的支撑，其弯折避开了死折(弯折角半径为0)情况，进一步的保证了线路导通的可靠性。
如图6所示，为本发明实施例的另一种薄膜线路层的桥接示意图，该实施例的导电线路为波浪线形，也可以避免应力集中的现象。
如图7，本发明的可折叠面板的制作方法主要包括：
S1、在柔性基板100的绑定端绑定驱动芯片20；
S2、在柔性基板100绑定端，在靠近有效显示区域的位置和靠近驱动芯片20的位置分别制作数量相同的第一绑定端子和第二绑定端子；
S3、在柔性基板100上制作薄膜线路层30，并将薄膜线路层30的导电线路分别连接在相应的第一绑定端子和第二绑定端子的两端；
S4、折弯绑定端，使驱动芯片20位于柔性基板100的背部。
其中，步骤S3中的导电线路最好是位于薄膜线路层30的内表面，朝向柔性基板100，使得导电线路不至于暴露在外，起到一定的保护作用。柔性基板100背部的背板薄膜115覆盖AA区，可以不必延伸至绑定端，而绑定端的背面对应驱动芯片20的部位还可贴附一层补强板40。
综上所述，本发明在柔性基板的绑定端表面制作有薄膜线路层，利用该薄膜线路层内的导电线路实现柔性显示面板和驱动芯片的电连接，并使绑定端背向柔性显示面板的出光侧弯折而将驱动芯片隐藏在有效显示区域背面，使得面板的有效显示区域占比做到最大，同时也保证了电路具有良好的弯折性能，避免了使用昂贵的覆晶薄膜以及线路断裂风险，提高了面板的折叠可靠性，并降低了制作成本。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种可折叠面板，其中，包括柔性显示面板和驱动芯片，所述驱动芯片设于所述柔性显示面板的柔性基板的绑定端，且所述绑定端朝背向所述柔性显示面板的出光侧的方向弯折使所述驱动芯片位于所述柔性基板背部；所述柔性基板上还设置有连接在有效显示区域和所述驱动芯片之间的薄膜线路层，所述薄膜线路层的一个表面设置有分别连接所述柔性显示面板和所述驱动芯片的导电线路。
  2. 根据权利要求1所述的可折叠面板，其中，所述导电线路设于所述薄膜线路层内表面，与所述柔性基板相对设置。
  3. 根据权利要求1所述的可折叠面板，其中，所述柔性基板的绑定端设置有靠近所述有效显示区域的多个第一绑定端子和靠近所述驱动芯片的多个第二绑定端子，所述第一绑定端子与所述第二绑定端子数量相同，所述第一绑定端子通过所述薄膜线路层与所述第二绑定端子一对一连接。
  4. 根据权利要求3所述的可折叠面板，其中，每个所述第一绑定端子与所述第二绑定端子之间连接有至少两条所述导电线路。
  5. 根据权利要求4所述的可折叠面板，其中，所述导电线路为波浪线形。
  6. 根据权利要求4所述的可折叠面板，其中，所述导电线路为多个导电环两两相连形成的链条构造。
  7. 根据权利要求6所述的可折叠面板，其中，相邻的两条所述导电线路的导电环连接部位相互错开。
  8. 根据权利要求1所述的可折叠面板，其中，所述驱动芯片直接贴合在所述柔性基板上或通过柔性线路板贴合在所述柔性基板上。
  9. 根据权利要求1所述的可折叠面板，其中，所述柔性基板在所述绑定端的背面还贴合有补强板，所述补强板至少覆盖所述绑定端设置有所述驱动芯片的背面。
  10. 根据权利要求1所述的可折叠面板，其中，所述导电线路为波浪线形。
  11. 根据权利要求1所述的可折叠面板，其中，所述导电线路为多个导电环两两相连形成的链条构造。
  12. 根据权利要求11所述的可折叠面板，其中，相邻的两条所述导电线路的导电环连接部位相互错开。
  13. 一种可折叠面板的制作方法，其中，所述可折叠面板包括柔性显示面板和驱动芯片，所述驱动芯片设于所述柔性显示面板的柔性基板的绑定端，且所述绑定端朝背向所述柔性显示面板的出光侧的方向弯折使所述驱动芯片位于所述柔性基板背部；所述柔性基板上还设置有连接在有效显示区域和所述驱动芯片之间的薄膜线路层，所述薄膜线路层的一个表面设置有分别连接所述柔性显示面板和所述驱动芯片的导电线路；所述可折叠面板的制作方法包括：
    在柔性基板的绑定端绑定驱动芯片；
    在柔性基板绑定端，在靠近有效显示区域的位置和靠近驱动芯片的位置分别制作数量相同的第一绑定端子和第二绑定端子；
    在柔性基板上制作薄膜线路层，并将薄膜线路层的导电线路分别连接在相应的第一绑定端子和第二绑定端子的两端；
    折弯绑定端，使驱动芯片位于柔性基板的背部。
  14. 根据权利要求13所述的可折叠面板的制作方法，其中，所述导电线路设于所述薄膜线路层内表面，与所述柔性基板相对设置。
  15. 根据权利要求13所述的可折叠面板的制作方法，其中，所述柔性基板的绑定端设置有靠近所述有效显示区域的多个第一绑定端子和靠近所述驱动芯片的多个第二绑定端子，所述第一绑定端子与所述第二绑定端子数量相同，所述第一绑定端子通过所述薄膜线路层与所述第二绑定端子一对一连接。
  16. 根据权利要求15所述的可折叠面板的制作方法，其中，每个所述第一绑定端子与所述第二绑定端子之间连接有至少两条所述导电线路。
  17. 根据权利要求13所述的可折叠面板的制作方法，其中，所述驱动芯片直接贴合在所述柔性基板上或通过柔性线路板贴合在所述柔性基板上。
  18. 根据权利要求13所述的可折叠面板的制作方法，其中，所述柔性基板在所述绑定端的背面还贴合有补强板，所述补强板至少覆盖所述绑定端设置有所述驱动芯片的背面。
  19. 根据权利要求13所述的可折叠面板的制作方法，其中，所述导电线路为波浪线形。
  20. 根据权利要求13所述的可折叠面板的制作方法，其中，所述导电线路为多个导电环两两相连形成的链条构造，且相邻的两条所述导电线路的导电环连接部位相互错开。
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