WO2018092506A1 - ガラス基板の製造装置及び製造方法 - Google Patents

ガラス基板の製造装置及び製造方法 Download PDF

Info

Publication number
WO2018092506A1
WO2018092506A1 PCT/JP2017/037958 JP2017037958W WO2018092506A1 WO 2018092506 A1 WO2018092506 A1 WO 2018092506A1 JP 2017037958 W JP2017037958 W JP 2017037958W WO 2018092506 A1 WO2018092506 A1 WO 2018092506A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
opening
air supply
housing
main surface
Prior art date
Application number
PCT/JP2017/037958
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
好晴 山本
弘樹 中塚
大野　和宏
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to KR1020197016656A priority Critical patent/KR102312556B1/ko
Priority to CN201780070959.4A priority patent/CN109963820B/zh
Publication of WO2018092506A1 publication Critical patent/WO2018092506A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Definitions

  • the present invention relates to an apparatus and a method for manufacturing a glass substrate, and more particularly to an apparatus and a method for performing a surface treatment with a processing gas on one main surface of a sheet glass to be a glass substrate.
  • liquid crystal displays LCD
  • plasma displays PDP
  • field emission displays FED
  • organic EL displays OLED
  • disconnects the plate-shaped glass (band-shaped plate glass) shape
  • After further cutting both end portions it is obtained by subjecting each cut surface to a polishing process, if necessary.
  • the glass as an insulator has a property of being easily charged, and in the glass substrate manufacturing process, for example, when a glass substrate is placed on a mounting table and subjected to predetermined processing, the glass substrate and the mounting table
  • the glass substrate may be charged by contact peeling (this may be referred to as peeling charging).
  • peeling charging When a conductive object approaches the charged glass substrate, a discharge occurs, and this discharge causes damage to various elements formed on the surface of the glass substrate and electrode wires constituting the electronic circuit, or damage to the glass substrate itself.
  • There are fears sometimes referred to as dielectric breakdown or electrostatic breakdown).
  • the charged glass substrate is likely to stick to the mounting table, and there is a possibility that the glass substrate may be damaged by forcibly peeling it off. Since these naturally cause display defects, they should be avoided as much as possible.
  • the back surface of the glass substrate (the surface on the side contacting the mounting surface of the mounting table), the back surface is subjected to surface treatment.
  • a roughening method is conceivable. The larger the contact area between the glass substrate and the mounting table, the greater the amount of charge when peeling, so the glass substrate can be roughened by roughening the back surface of the glass substrate in contact with the mounting surface of the mounting table. It is expected that it is possible to reduce charging area at the time of peeling by reducing the contact area between and the mounting table.
  • the back surface of the glass substrate is roughened, for example, the surface roughness of the back surface.
  • a conveying means that conveys a glass substrate in a predetermined direction and a processing gas containing hydrogen fluoride gas are provided.
  • a surface treatment apparatus including an injector that supplies a gas substrate toward one main surface (main surface on the back surface side) of a glass substrate and discharges the supplied processing gas to an exhaust system.
  • the injector is provided with a first slit connected to the hydrogen fluoride gas source at a predetermined position in the transport direction of the glass substrate, and a second slit connected to the carrier gas source is the first slit. It is provided at a predetermined position on both sides in the transport direction.
  • a third slit connected to the exhaust system is provided at a predetermined position on both sides of the second slit in the transport direction.
  • the result of the surface treatment depends not only on the conveyance speed of the glass substrate by the conveying means but also on the type, supply amount, and supply position of the processing gas. It is greatly influenced. Therefore, when actually performing the surface treatment described above, depending on the material and size of the glass substrate to be processed, the configuration of the production line, etc., the conveyance speed of the glass substrate, the type of the processing gas, the supply amount, and It is necessary to appropriately set the supply position (the positions of the first and second slits in Patent Document 1).
  • this manufacturing apparatus supplies a processing gas to one main surface of a sheet glass that is conveyed by a conveying apparatus that conveys a sheet glass to be a glass substrate in a predetermined direction and has a predetermined surface.
  • the surface treatment apparatus includes a housing, an opening opening on one main surface side of the housing, and an opening.
  • One or a plurality of air supply units which are attached so as to be removable and have an air supply port for supplying a processing gas to one main surface, and the air supply unit is made of a plate-like glass in the opening. It is characterized by being capable of being attached to a plurality of positions along the transport direction.
  • the member which has an air supply opening for supplying process gas to one main surface of the plate glass currently conveyed is unitized, and the some along the conveyance direction of plate glass It was possible to attach to the position.
  • the conveyance direction position of an air supply port can be easily adjusted only by changing the attachment position of an air supply unit. Therefore, even when it is necessary to change the type of the sheet glass to be conveyed, it is possible to easily set the optimum processing conditions, and thereby to apply a good surface treatment to the sheet glass. It becomes possible. Or even if it is the same kind of plate glass, the conveyance speed may be changed according to the production status and the configuration of other parts of the production line. By changing the position, it is possible to easily set the supply conditions including the supply position of the processing gas, and to perform a high-quality surface treatment.
  • the opening of the surface treatment apparatus is provided with an opening, and the air supply unit having the above-described configuration is attached to the opening. Can be placed in the interior space.
  • the surface treatment apparatus can be incorporated into the production line without making it unnecessarily large. Further, since most of the inside of the housing can be made hollow, even if the attachment position of the air supply unit is changed or added, there is no possibility that interference with other members becomes a problem.
  • the glass substrate manufacturing apparatus further includes an exhaust unit that is detachably attached to the opening, and exhausts the processing gas.
  • the exhaust unit is disposed in the transport direction in the opening. It may be capable of being attached to a plurality of positions along.
  • the position of the exhaust port is an element that affects the flow of the processing gas in the space facing one of the main surfaces, so by adjusting the position of the exhaust port as described above, Optimal processing conditions can be set. Therefore, it is possible to easily reset the processing conditions of the plate glass with the processing gas, and it is possible to apply a high-quality surface treatment to the plate glass.
  • the glass substrate manufacturing apparatus is further provided with a dummy unit that is detachably attached to the opening and closes the opening, and the dummy unit extends along the transport direction in the opening. It may be attached to a plurality of positions.
  • the remaining part of the opening can be closed with the dummy unit.
  • the attachment position of an air supply unit can be adjusted easily.
  • the opening can be completely closed by the dummy unit, it is possible to easily perform a high-quality surface treatment without hindering the flow of the processing gas regardless of the arrangement of the air supply unit or the like. It becomes possible.
  • the position of an air supply unit and a dummy unit can be easily replaced by sharing dimensions with an air supply unit. Therefore, recombination can be performed quickly.
  • the glass substrate manufacturing apparatus has a gap forming surface that forms a predetermined gap with one main surface in a state where the air supply unit is attached to the opening. Also good.
  • the exhaust unit and the dummy unit may also have a gap forming surface.
  • the air supply unit has a roller that supports the one main surface of the glass sheet being conveyed by the conveying device in a state where the air supply unit is attached to the opening. It may be.
  • these exhaust unit and dummy unit may also have a roller that supports one main surface.
  • rollers for supporting one main surface of the sheet glass in each unit, these rollers can be incorporated into the surface treatment apparatus as a component of the transport apparatus.
  • the plate-like glass has a large dimension in the transport direction, it is possible to reliably support the portion passing through the surface treatment apparatus and form a predetermined gap between each unit. It becomes possible. Accordingly, this also makes it possible to stably perform a high-quality surface treatment.
  • the air supply unit may be attached to the opening by fitting so that the internal space of the housing is sealed.
  • the exhaust unit and the closing unit may also be fitted to the opening so as to seal the internal space of the housing.
  • the internal space of the housing can be reliably sealed even when each unit is mounted so that it can be removed from the opening. Thereby, the situation which obstruct
  • the exhaust system is configured by connecting the internal space of the housing to the exhaust unit, the required exhaust performance can be ensured by sealing the internal space of the housing.
  • the glass substrate manufacturing apparatus includes a first exhaust port that connects the space between one main surface and the exhaust unit and the internal space of the housing to the exhaust unit.
  • the internal space of the housing may be connected to a scrubber for processing gas.
  • the processing gas exhaust system can be configured more simply regardless of the mounting position of the exhaust unit. Further, since the exhausted gas includes not only the processing gas but also the outside air (usually air), even if the processing gas is included, its concentration is lower than that at the time of supply. Therefore, an exhaust system from the exhaust unit to the scrubber can be configured in the internal space of the housing without much consideration for corrosion resistance.
  • the glass substrate manufacturing apparatus is a second device for connecting the space between one main surface and the housing and the internal space of the housing to both ends of the housing in the conveyance direction of the sheet glass.
  • the exhaust space may be provided, and the internal space of the housing may be connected to a scrubber for processing gas.
  • the air supply unit is connected to one end side of the communication pipe attached to the casing, and the other end side of the communication pipe is connected to the outside of the casing via the flexible hose. It may be connected to a processing gas generator located in the area.
  • this manufacturing method includes a transporting process for transporting a sheet glass to be a glass substrate in a predetermined direction, and a surface treatment for performing a predetermined surface treatment on one main surface of the sheet glass transported in a predetermined direction.
  • the surface treatment step is performed by supplying a treatment gas to one main surface of the plate glass that is being conveyed in a predetermined direction by the surface treatment apparatus, and the surface treatment
  • the apparatus is attached to the casing, an opening opening on one main surface side of the casing, and detachable from the opening, and supplies a processing gas to one main surface.
  • One or a plurality of air supply units having an air supply port, and the air supply unit is characterized by being capable of being attached to a plurality of positions along the sheet glass conveying direction in the opening. It is done.
  • the position in the conveyance direction of the air supply port can be easily adjusted only by changing the mounting position of the air supply unit. Therefore, even when it is necessary to change the type of the sheet glass to be conveyed, it is possible to easily set the optimum processing conditions, and thereby to apply a good surface treatment to the sheet glass. It becomes possible. Or even if it is the same kind of plate glass, the conveyance speed may be changed according to the production status and the configuration of other parts of the production line.
  • the supply conditions including can be easily set, and it becomes possible to perform a good surface treatment.
  • the opening of the surface treatment apparatus is provided with an opening, and the air supply unit having the above-described configuration is attached to the opening. Can be placed in the interior space.
  • the surface treatment apparatus can be incorporated into the production line without making it unnecessarily large. Further, since most of the inside of the housing can be made hollow, even if the attachment position of the air supply unit is changed or added, there is no possibility that interference with other members becomes a problem.
  • a high-quality surface treatment can be performed on the plate glass regardless of the type of the plate glass used as the glass substrate.
  • FIG. 3 is a cross-sectional view of the main part AA of the surface treatment apparatus shown in FIG.
  • FIG. 3 is a cross-sectional view of the air supply unit shown in FIG.
  • FIG. 6 is a CC cross-sectional view of the air supply unit shown in FIG. 5.
  • FIG. 3 is a cross-sectional view of the exhaust unit shown in FIG. It is a principal part enlarged view for demonstrating an example of the surface treatment using the surface treatment apparatus shown in FIG. It is sectional drawing of the manufacturing apparatus of the glass substrate which concerns on 2nd embodiment of this invention.
  • FIGS. 1-10 a first embodiment of the present invention will be described with reference to FIGS.
  • a case will be described as an example in which surface treatment is performed on the back surface of a glass substrate cut out to a predetermined size from a formed strip-shaped plate glass as the plate-shaped glass.
  • FIG. 1 shows an embodiment of a glass substrate manufacturing apparatus 10 according to the first embodiment of the present invention.
  • the manufacturing apparatus 10 includes a transport device 11 for transporting the glass substrate P in a predetermined direction X1, and one main surface P1 (the lower surface in FIG. 1) of the glass substrate P transported by the transport device 11.
  • a surface treatment device 12 that performs a predetermined surface treatment and a treatment tank 13 that accommodates the transfer device 11 and the surface treatment device 12 are provided.
  • the surface treatment apparatus 12 is for supplying a treatment gas Ga to one main surface P ⁇ b> 1 of the glass substrate P to perform a predetermined surface treatment.
  • the head portion 16 that forms the insertion path 15 of the substrate P, the opening 17 that is formed on the side of the housing 14 that faces the insertion path 15 (the upper side in this embodiment), and the air supply that is attached to the opening 17 Unit 18 is mainly provided.
  • the surface treatment apparatus 12 further includes an exhaust unit 19 and dummy units 20 a and 20 b that are attached to the opening 17 together with the air supply unit 18. Details of each component will be described below.
  • the housing 14 has a box shape as shown in FIG. 1 and FIG. 2, and the upper side of the housing 14 (side facing the glass substrate P) is open over substantially the entire region in the transport direction X1 of the glass substrate P.
  • a portion 17 is provided.
  • the opening portion 17 refers to a bottom portion 21 where the air supply unit 18, the exhaust unit 19, and the dummy units 20 a and 20 b abut, and a width direction of the bottom portion 21 (a direction orthogonal to the conveyance direction X ⁇ b> 1 of the glass substrate P).
  • the internal space 23 of the housing 14 is connected to the external space 24 of the housing 14 (here, the external space of the housing 14).
  • the inner space of the processing tank 13 is referred to.)
  • a communication hole 25 connected to the space on the insertion path 15 side.
  • a seal member 26 such as an O-ring is disposed around the communication hole 25, and the air supply unit 18, the exhaust unit 19, and the dummy unit 20a, In the state where 20b is placed, the communication hole 25 is blocked and the internal space 23 of the housing 14 is sealed with respect to the external space 24 (see FIG. 4).
  • exhaust port forming members 27 are attached to both ends of the casing 14 in the conveyance direction X1 of the glass substrate P, and a slit-like exhaust gas extending in the width direction between the casing 14 and the exhaust port forming member 27.
  • a mouth 28 is formed (see FIG. 2).
  • the exhaust port 28 is connected to the internal space 23 through communication holes 29 (see FIG. 1) provided at both ends of the casing 14 in the transport direction X1, and is formed by a scrubber 30 (see FIG. 1) described later. Exhaust is possible.
  • the air supply unit 18, the exhaust unit 19, and the dummy units 20 a and 20 b are respectively attached to the opening 17 of the housing 14 so as to be removable.
  • two air supply units 18, one exhaust unit 19, and five dummy units 20a and 20b are respectively attached to predetermined positions along the conveyance direction X1 of the opening 17 (see FIG. 1). reference).
  • the dummy unit 20b, the air supply unit 18, the dummy unit 20a, the dummy unit 20a, the dummy unit 20a, the air supply unit 18, the exhaust unit 19, and the dummy unit 20a from the most upstream side in the transport direction X1 in the opening portion 17. Are arranged in this order.
  • FIG. 1 As shown in FIG.
  • the conveyance direction dimensions C1 to C3 of the units 18 to 20a are the same (except for the most upstream dummy unit 20b), and the width direction dimensions W1 to W3 are also the same.
  • the conveyance direction dimension L (see FIG. 3) of the housing 14 excluding the exhaust port forming member 27 is the conveyance direction of the air supply unit 18, the exhaust unit 19, and the dummy units 20 a and 20 b attached to the opening 17. It is equal to the sum of dimensions C1 to C3 (see FIG. 2).
  • the units 18 to 20a and 20b are attached to the opening 17 in a state where they abut each other in the transport direction X1 (see FIG. 1). Thereby, the air supply unit 18, the exhaust unit 19, and the dummy unit 20a are arbitrarily attached to a plurality of positions (seven positions excluding the most upstream side in the illustrated example) along the transport direction X1 of the opening 17. It is possible.
  • the distance T (see FIG. 3) between the inner side surfaces 22a of the side wall portion 22 located on both sides of the opening portion 17 in the width direction (see FIG. 3) is the same as the air supply unit 18, the exhaust unit 19, and the The dummy units 20a and 20b are equal to the widthwise dimensions W1 to W3 (see FIG. 2), respectively.
  • the units 18 to 20a and 20b are in a state of being attached to the opening 17 by, for example, inlay fitting (see FIGS. 2 and 4). Due to the above attachment mode, the internal space 23 of the housing 14 is sealed with respect to the external space 24.
  • the air supply unit 18 opens toward the insertion path 15 of the glass substrate P and supplies the processing gas Ga toward one main surface P1 of the glass substrate P as shown in FIGS. 1 and 5.
  • the air supply port 31 has a slit shape extending in the width direction, and the processing gas Ga can be uniformly introduced over the entire width direction of the air supply port 31 having the slit shape.
  • the introduction part 33 has an introduction path 34 of a predetermined form.
  • a part of the introduction part 33 is located in the internal space 23 through the communication hole 25 of the housing 14.
  • FIG. 6 shows one form of the introduction path 34 for the processing gas Ga.
  • the introduction path 34 shown in this figure has a form branched in multiple stages from the process gas generator 32 side to the air supply port 31 side, and thereby the width direction of the air supply port 31 (left and right in FIG. 6).
  • Direction) the processing gas Ga can be introduced evenly over the entire region.
  • two introduction paths 34 are provided, and a communication pipe 35 (shown by a two-dot chain line in FIG. 5) at an end 34 a of each introduction path 34 opposite to the air supply port 31. Are connected at one end.
  • a seal member 36 such as an O-ring may be provided on the inner periphery of the end portion 34a.
  • the communication pipe 35 is disposed below the air supply unit 18 among a plurality of pipe mounting portions 37 (see FIG. 3) formed on the portion of the housing 14 opposite to the opening 17. It is attached only to the tube attachment part 37 located.
  • a processing gas generator 32 is connected to the other end of the communication pipe 35 via a flexible hose 38.
  • a lid 39 is attached to a pipe attachment portion 37 to which the communication pipe 35 is not attached. Thereby, the air supply unit 18 can be connected to the processing gas generator 32 in a fixed state regardless of the mounting position of the air supply unit 18.
  • the exhaust unit 19 has an exhaust port 40 for exhausting the processing gas Ga supplied toward one main surface P1 of the glass substrate P, as shown in FIG.
  • the exhaust port 40 connects the external space 24 of the housing 14, particularly the space between one main surface P 1 of the glass substrate P and the exhaust unit 19, to the internal space 23 of the housing 14. Then, it has a slit shape extending in the width direction (see FIG. 2).
  • the internal space 23 of the housing 14 is connected to the scrubber 30 via a communication hole 41 provided in the lower portion of the housing 14 (see FIG. 1). Thereby, the processing gas Ga supplied toward the one main surface P1 of the glass substrate P is drawn into the scrubber 30 via the exhaust port 40 of the exhaust unit 19 and the internal space 23 of the housing 14. Yes.
  • exhaust ports 28 are provided at both ends in the transport direction of the housing 14, and the exhaust ports 28 are connected to the internal space 23 of the housing 14. (See FIG. 1).
  • the processing gas Ga or the outside air is drawn into the scrubber 30 through the exhaust port 28 and the internal space 23 of the housing 14 at both ends of the insertion passage 15 in the transport direction.
  • the dummy units 20 a and 20 b are attached for the purpose of closing the opening 17 by filling the gap between the air supply unit 18 and the exhaust unit 19 attached to the opening 17. Therefore, the dummy units 20a and 20b do not have a function for supplying and exhausting air to the space on the one main surface P1 side of the glass substrate P.
  • the air supply unit 18, the exhaust unit 19, and the dummy units 20 a and 20 b are all attached to the opening 17 and are predetermined between the main surface P 1 of the glass substrate P.
  • the gap formation surfaces 43a to 43c for forming the gap 42 (see FIG. 8).
  • the gap forming surface 43a of the air supply unit 18 takes a form in which a portion in the vicinity of the air supply port 31 is protruded to the insertion passage 15 side from the surrounding portion.
  • the gap 42 between the one main surface P1 and the gap forming surface 43a is the smallest in the vicinity of the air supply port 31.
  • the air supply unit 18, the exhaust unit 19, and the dummy units 20 a and 20 b are all attached to the opening 17, and one of the glass substrates P being transported by the transport device 11.
  • Support rollers 44a to 44c for supporting the main surface P1 are provided.
  • the glass substrate P is transported in a predetermined direction X1 while being supported by the support roller 45 (see FIG. 1) of the transport device 11 and the support rollers 44a to 44c provided in the units 18 to 20a and 20b. It has come to be.
  • the air supply unit 18, the exhaust unit 19, and the dummy units 20a and 20b all have heaters 46a to 46c (see FIG. 8). Thereby, in the state attached to the opening part 17, the temperature of the process gas Ga which flows through the clearance gap between one main surface P1 of the glass substrate P can be adjusted.
  • a plate glass (band plate glass) formed into a band shape by a known means such as a down draw method represented by an overflow down draw method or a float method is used in a predetermined longitudinal direction. After being cut into dimensions, one having two or four sides polished as required is used.
  • the dimension in the direction along the transport direction X1 is larger than the transport direction dimension of the surface treatment apparatus 12 (substantially the transport direction dimension L of the housing 14). Larger is desirable.
  • a flow of the treatment gas Ga as described below can be created to perform a predetermined surface treatment on one main surface P1. That is, as shown in FIG. 8, in a state where the glass substrate P is introduced into the inside of the surface treatment device 12 (insertion passage 15) by the transfer device 11, a predetermined treatment gas Ga, for example, fluorination is performed by the treatment gas generator 32. A processing gas Ga obtained by mixing hydrogen gas with a carrier gas such as nitrogen gas is generated. Then, the processing gas Ga is supplied from the air supply port 31 to the gap 42 between the main surface P ⁇ b> 1 through the flexible hose 38, the communication pipe 35, and the introduction path 34.
  • a predetermined treatment gas Ga for example, fluorination is performed by the treatment gas generator 32.
  • a processing gas Ga obtained by mixing hydrogen gas with a carrier gas such as nitrogen gas is generated. Then, the processing gas Ga is supplied from the air supply port 31 to the gap 42 between the main surface P ⁇ b> 1 through the flexible hose 38, the communication pipe 35, and the introduction path 34.
  • the scrubber 30 applies a pulling force to the internal space 23 of the housing 14, and the processing gas Ga supplied to the gap 42 through the exhaust ports 28 and 40 (see FIG. 8) connected to the internal space 23. Exhaust. Thereby, the gap 42 is filled with the processing gas Ga, and a predetermined flow of the processing gas Ga is formed in the gap 42. Further, the exhaust ports 28 (see FIG. 1) arranged at both ends of the gap 42 in the transport direction X1 prevent the processing gas Ga from leaking outside the gap 42, that is, outside the surface treatment apparatus 12 as much as possible. Is done. Of course, although not shown in the figure, a certain exhausting means may be provided in the processing tank 13 to perform a predetermined exhausting process on the internal space of the processing tank 13.
  • the glass substrate P is introduced into the insertion passage 15 while continuing the supply of the processing gas Ga, and the glass substrate P finishes passing through the insertion passage 15, thereby processing the one main surface P ⁇ b> 1.
  • Surface treatment with gas Ga is completed.
  • one main surface P1 is roughened, while the surface properties and surface accuracy of the other main surface P2 (upper surface in FIG. 8) are maintained.
  • the roughening will be described by the change of the surface roughness Ra.
  • the surface roughness Ra [nm] of one main surface P1 is 0.1 nm or more and 1.8 nm or less before and after the surface treatment.
  • Surface treatment conditions for one main surface P1 by the processing gas Ga are set so as to improve (in this case, increase) in a range, more preferably in a range of 0.1 nm or more and 0.8 nm or less. It is better.
  • surface roughness Ra [nm] here says the value obtained by measuring by the method of applying JIS R 1683: 2007 mutatis mutandis.
  • the air supply port 31 for supplying the processing gas Ga to the one main surface P1 of the glass substrate P being transferred by the transfer apparatus 11 is provided.
  • the member which has is unitized and can be attached to a plurality of positions along the conveyance direction X1 of the glass substrate P.
  • the position of the air supply port 31 in the transport direction X1 can be easily adjusted simply by changing the mounting position of the air supply unit 18. Therefore, even when it is necessary to change the type of the glass substrate P to be transported, it is possible to easily set the optimum processing conditions, and thereby to perform a good surface treatment on the glass substrate P. It becomes possible.
  • the conveyance speed by the conveying apparatus 11 may be changed according to a production condition or the structure of the other part of a manufacturing line, in such a case, processing is also possible.
  • the supply conditions including the supply position of the gas Ga can be easily set, and it becomes possible to perform a good surface treatment.
  • the opening 14 is provided in the casing 14, and the air supply unit 18 having the above-described configuration is attached to the opening 17. Therefore, most of the air supply unit including the introduction path 34 is provided. It can be arranged in the internal space 23 of the housing 14. Thereby, the surface treatment apparatus 12 can be incorporated in a production line without enlarging the size more than necessary. Further, since most of the inside of the housing 14 can be made hollow, even if the mounting position of the air supply unit 18 is changed or added, there is no possibility that interference with other members becomes a problem.
  • the exhaust ports 28 and 40 are connected to the internal space 23 of the housing 14, and the internal space 23 is connected to the scrubber 30.
  • the exhaust port 40 can be easily connected to the scrubber 30 only by changing the mounting position of the exhaust unit 19.
  • the mounting position of the air supply unit 18 is changed by making the internal space 23 a part of the exhaust system, there is no possibility that the air supply system and the exhaust system interfere with each other. Therefore, it is possible to easily change the position of the air supply port 31 only by changing the attachment position of the air supply unit 18 and the communication pipe 35.
  • FIG. 9 shows a cross-sectional view of a glass substrate P manufacturing apparatus 50 according to an example (second embodiment of the present invention).
  • this manufacturing apparatus 50 includes a transfer device 11, a surface treatment device 51, and a treatment tank 13, as in the first embodiment, while the configuration of the surface treatment device 51 is the first embodiment. It differs from the surface treatment apparatus 12 which concerns on a form.
  • the surface treatment apparatus 51 is configured by attaching three air supply units 18 and five dummy units 20 a and 20 b to the opening 17 of the housing 14.
  • the fourth dummy unit 20a from the upstream side (left side in FIGS. 1 and 9) is replaced with the air supply unit 18, and the seventh exhaust unit 19 from the upstream side is replaced.
  • the configuration is replaced with a dummy unit 20a.
  • the processing area of one main surface P ⁇ b> 1 borne by one air supply unit 18 can be reduced. Therefore, for example, a uniform and sufficient surface treatment is performed on one main surface P1 without generating a region where the concentration of the processing gas Ga is stagnant between the air supply ports 31 and 31 and the concentration thereof decreases. be able to.
  • the number of exhaust units 19 is reduced to zero as shown in FIG. Even if the configuration described above is adopted, there is no particular problem because the leakage of the processing gas Ga to the outside of the surface processing apparatus 51 can be prevented as much as possible.
  • the opening 17 has a continuous space on the bottom 21 in the one conveyance direction X1 is exemplified, but it is of course possible to adopt other configurations.
  • the partition wall (Not shown) is provided so as to connect the pair of side wall portions 22, 22, and the units 18 to 20 a are placed in a plurality of unit housing portions (not shown) partitioned by these partition walls and the side wall portions 22, 22. It is also possible to select and arrange them.
  • the exhaust ports 28 and 40 are connected to the scrubber 30 via the internal space 23 of the housing 14, but it is of course possible to adopt other configurations.
  • the exhaust hole 28 and the scrubber 30 may be connected by connecting the communication hole 29 provided on the side of the housing 14 and the communication hole 41 provided on the bottom of the housing 14 with a predetermined pipe.
  • the inside of the housing 14 does not have to be a cavity, and an arbitrary structure can be adopted as long as interference with the units 18 to 20a can be avoided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
PCT/JP2017/037958 2016-11-16 2017-10-20 ガラス基板の製造装置及び製造方法 WO2018092506A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020197016656A KR102312556B1 (ko) 2016-11-16 2017-10-20 유리 기판의 제조 장치 및 제조 방법
CN201780070959.4A CN109963820B (zh) 2016-11-16 2017-10-20 玻璃基板的制造装置及制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016223248A JP6665760B2 (ja) 2016-11-16 2016-11-16 ガラス基板の製造装置及び製造方法
JP2016-223248 2016-11-16

Publications (1)

Publication Number Publication Date
WO2018092506A1 true WO2018092506A1 (ja) 2018-05-24

Family

ID=62146441

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/037958 WO2018092506A1 (ja) 2016-11-16 2017-10-20 ガラス基板の製造装置及び製造方法

Country Status (5)

Country Link
JP (1) JP6665760B2 (zh)
KR (1) KR102312556B1 (zh)
CN (1) CN109963820B (zh)
TW (1) TWI722251B (zh)
WO (1) WO2018092506A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022539831A (ja) 2019-07-11 2022-09-13 グッド ティー セルズ、 インコーポレイテッド 免疫チェックポイント阻害剤抵抗性癌の予防、改善または治療用組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157418A (ja) * 2012-01-30 2013-08-15 Sumitomo Precision Prod Co Ltd エッチング装置
WO2015045405A1 (ja) * 2013-09-30 2015-04-02 日本板硝子株式会社 ガラス板の製造方法
WO2015115100A1 (ja) * 2014-01-31 2015-08-06 日本板硝子株式会社 ガラス板の製造方法及びガラス板
JP2016064926A (ja) * 2013-02-07 2016-04-28 旭硝子株式会社 ガラス製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4045592B2 (ja) * 2002-08-22 2008-02-13 三菱マテリアル株式会社 プラズマエッチング用シリコン電極板
JP4381160B2 (ja) * 2003-07-16 2009-12-09 積水化学工業株式会社 表面処理装置
JP4312001B2 (ja) * 2003-07-28 2009-08-12 リアライズ・アドバンストテクノロジ株式会社 基板支持装置および基板取り外し方法
JP4398262B2 (ja) * 2004-01-08 2010-01-13 大日本スクリーン製造株式会社 基板処理装置
WO2007077765A1 (ja) * 2005-12-28 2007-07-12 Sharp Kabushiki Kaisha ステージ装置及びプラズマ処理装置
JP5235293B2 (ja) * 2006-10-02 2013-07-10 東京エレクトロン株式会社 処理ガス供給機構および処理ガス供給方法ならびにガス処理装置
JP5444599B2 (ja) * 2007-09-28 2014-03-19 東京エレクトロン株式会社 ガス供給装置及び成膜装置
CN102473627B (zh) * 2009-07-23 2014-11-05 夏普株式会社 湿蚀刻装置和湿蚀刻方法
JP5874393B2 (ja) * 2011-12-28 2016-03-02 日本電気硝子株式会社 ガラス板加工装置およびその加工方法
JP2014080331A (ja) 2012-10-17 2014-05-08 Asahi Glass Co Ltd 反射防止性ガラスの製造方法
JP6048817B2 (ja) * 2012-12-27 2016-12-21 日本電気硝子株式会社 板状ガラスの表面処理装置及び表面処理方法
WO2014123089A1 (ja) * 2013-02-07 2014-08-14 旭硝子株式会社 ガラス製造方法
KR101413626B1 (ko) * 2013-12-31 2014-08-06 김호권 화학강화를 이용한 강화유리 제조장치 및 제조방법
KR102135740B1 (ko) * 2014-02-27 2020-07-20 주식회사 원익아이피에스 기판 처리 장치 및 기판 처리 방법
KR102368126B1 (ko) * 2014-04-16 2022-02-25 에이지씨 가부시키가이샤 에칭 장치, 에칭 방법, 기판의 제조 방법, 및 기판

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157418A (ja) * 2012-01-30 2013-08-15 Sumitomo Precision Prod Co Ltd エッチング装置
JP2016064926A (ja) * 2013-02-07 2016-04-28 旭硝子株式会社 ガラス製造方法
WO2015045405A1 (ja) * 2013-09-30 2015-04-02 日本板硝子株式会社 ガラス板の製造方法
WO2015115100A1 (ja) * 2014-01-31 2015-08-06 日本板硝子株式会社 ガラス板の製造方法及びガラス板

Also Published As

Publication number Publication date
CN109963820B (zh) 2021-12-31
TW201829339A (zh) 2018-08-16
TWI722251B (zh) 2021-03-21
JP6665760B2 (ja) 2020-03-13
KR20190084098A (ko) 2019-07-15
KR102312556B1 (ko) 2021-10-14
JP2018080079A (ja) 2018-05-24
CN109963820A (zh) 2019-07-02

Similar Documents

Publication Publication Date Title
JP6048817B2 (ja) 板状ガラスの表面処理装置及び表面処理方法
EP1881087B1 (en) Winding plasma cvd apparatus and method
JP5486249B2 (ja) 成膜方法
JP5542488B2 (ja) 成膜装置
JP5077748B2 (ja) 成膜装置
KR20120022072A (ko) 성막 장치
WO2018092506A1 (ja) ガラス基板の製造装置及び製造方法
JP5562723B2 (ja) 成膜方法、成膜装置、およびガスバリアフィルムの製造方法
JP2009079265A (ja) プラズマ装置
JP2003049273A (ja) プラズマｃｖｄ装置及びプラズマｃｖｄによる成膜方法
JP2011143387A (ja) グラビア塗工装置
JP6270176B2 (ja) 板状ガラスの表面処理装置及び表面処理方法
JP5708148B2 (ja) 反応性スパッタリング装置および反応性スパッタリング方法
US20190185998A1 (en) Plasma atomic layer deposition apparatus and atomic layer deposition method
JP7286477B2 (ja) 薄膜形成装置
JP2002231642A (ja) プラズマ処理装置およびプラズマ処理機、並びにプラズマ処理方法
JP2008174826A (ja) プラズマｃｖｄ装置
JP4656580B2 (ja) 塗布装置
JP5095087B2 (ja) 成膜装置及び成膜方法
JP2005026062A (ja) プラズマプロセス装置
JP2015170680A (ja) Ｃｖｄ装置およびｃｖｄ方法
KR101439781B1 (ko) 유리 코팅장치
JP5713842B2 (ja) 成膜装置
JP2008181800A (ja) プラズマプロセス装置
JPH11297598A (ja) 基板処理装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17872649

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20197016656

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 17872649

Country of ref document: EP

Kind code of ref document: A1