KR102312556B1 - 유리 기판의 제조 장치 및 제조 방법 - Google Patents
유리 기판의 제조 장치 및 제조 방법 Download PDFInfo
- Publication number
- KR102312556B1 KR102312556B1 KR1020197016656A KR20197016656A KR102312556B1 KR 102312556 B1 KR102312556 B1 KR 102312556B1 KR 1020197016656 A KR1020197016656 A KR 1020197016656A KR 20197016656 A KR20197016656 A KR 20197016656A KR 102312556 B1 KR102312556 B1 KR 102312556B1
- Authority
- KR
- South Korea
- Prior art keywords
- glass substrate
- housing
- air supply
- opening
- surface treatment
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims abstract description 143
- 239000000758 substrate Substances 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 238000004381 surface treatment Methods 0.000 claims abstract description 76
- 238000000034 method Methods 0.000 claims abstract description 46
- 238000004891 communication Methods 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 66
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 239000005357 flat glass Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 5
- 238000011144 upstream manufacturing Methods 0.000 description 5
- 238000007788 roughening Methods 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 238000002438 flame photometric detection Methods 0.000 description 3
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 3
- 239000012159 carrier gas Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000007600 charging Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003280 down draw process Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-223248 | 2016-11-16 | ||
JP2016223248A JP6665760B2 (ja) | 2016-11-16 | 2016-11-16 | ガラス基板の製造装置及び製造方法 |
PCT/JP2017/037958 WO2018092506A1 (ja) | 2016-11-16 | 2017-10-20 | ガラス基板の製造装置及び製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190084098A KR20190084098A (ko) | 2019-07-15 |
KR102312556B1 true KR102312556B1 (ko) | 2021-10-14 |
Family
ID=62146441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197016656A KR102312556B1 (ko) | 2016-11-16 | 2017-10-20 | 유리 기판의 제조 장치 및 제조 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6665760B2 (zh) |
KR (1) | KR102312556B1 (zh) |
CN (1) | CN109963820B (zh) |
TW (1) | TWI722251B (zh) |
WO (1) | WO2018092506A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022539831A (ja) | 2019-07-11 | 2022-09-13 | グッド ティー セルズ、 インコーポレイテッド | 免疫チェックポイント阻害剤抵抗性癌の予防、改善または治療用組成物 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014080331A (ja) | 2012-10-17 | 2014-05-08 | Asahi Glass Co Ltd | 反射防止性ガラスの製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4045592B2 (ja) * | 2002-08-22 | 2008-02-13 | 三菱マテリアル株式会社 | プラズマエッチング用シリコン電極板 |
JP4381160B2 (ja) * | 2003-07-16 | 2009-12-09 | 積水化学工業株式会社 | 表面処理装置 |
JP4312001B2 (ja) * | 2003-07-28 | 2009-08-12 | リアライズ・アドバンストテクノロジ株式会社 | 基板支持装置および基板取り外し方法 |
JP4398262B2 (ja) * | 2004-01-08 | 2010-01-13 | 大日本スクリーン製造株式会社 | 基板処理装置 |
WO2007077765A1 (ja) * | 2005-12-28 | 2007-07-12 | Sharp Kabushiki Kaisha | ステージ装置及びプラズマ処理装置 |
JP5235293B2 (ja) * | 2006-10-02 | 2013-07-10 | 東京エレクトロン株式会社 | 処理ガス供給機構および処理ガス供給方法ならびにガス処理装置 |
JP5444599B2 (ja) * | 2007-09-28 | 2014-03-19 | 東京エレクトロン株式会社 | ガス供給装置及び成膜装置 |
CN102473627B (zh) * | 2009-07-23 | 2014-11-05 | 夏普株式会社 | 湿蚀刻装置和湿蚀刻方法 |
JP5874393B2 (ja) * | 2011-12-28 | 2016-03-02 | 日本電気硝子株式会社 | ガラス板加工装置およびその加工方法 |
JP5865095B2 (ja) * | 2012-01-30 | 2016-02-17 | 住友精密工業株式会社 | エッチング装置 |
JP6048817B2 (ja) * | 2012-12-27 | 2016-12-21 | 日本電気硝子株式会社 | 板状ガラスの表面処理装置及び表面処理方法 |
JP2016064926A (ja) * | 2013-02-07 | 2016-04-28 | 旭硝子株式会社 | ガラス製造方法 |
WO2014123089A1 (ja) * | 2013-02-07 | 2014-08-14 | 旭硝子株式会社 | ガラス製造方法 |
EP3053888B1 (en) * | 2013-09-30 | 2021-02-17 | Nippon Sheet Glass Company, Limited | Method for producing glass sheet |
KR101413626B1 (ko) * | 2013-12-31 | 2014-08-06 | 김호권 | 화학강화를 이용한 강화유리 제조장치 및 제조방법 |
US10358381B2 (en) * | 2014-01-31 | 2019-07-23 | Nippon Sheet Glass Company, Limited | Method for producing glass sheet, and glass sheet |
KR102135740B1 (ko) * | 2014-02-27 | 2020-07-20 | 주식회사 원익아이피에스 | 기판 처리 장치 및 기판 처리 방법 |
KR102368126B1 (ko) * | 2014-04-16 | 2022-02-25 | 에이지씨 가부시키가이샤 | 에칭 장치, 에칭 방법, 기판의 제조 방법, 및 기판 |
-
2016
- 2016-11-16 JP JP2016223248A patent/JP6665760B2/ja active Active
-
2017
- 2017-10-20 WO PCT/JP2017/037958 patent/WO2018092506A1/ja active Application Filing
- 2017-10-20 KR KR1020197016656A patent/KR102312556B1/ko active IP Right Grant
- 2017-10-20 CN CN201780070959.4A patent/CN109963820B/zh active Active
- 2017-10-31 TW TW106137517A patent/TWI722251B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014080331A (ja) | 2012-10-17 | 2014-05-08 | Asahi Glass Co Ltd | 反射防止性ガラスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN109963820B (zh) | 2021-12-31 |
TW201829339A (zh) | 2018-08-16 |
TWI722251B (zh) | 2021-03-21 |
JP6665760B2 (ja) | 2020-03-13 |
WO2018092506A1 (ja) | 2018-05-24 |
KR20190084098A (ko) | 2019-07-15 |
JP2018080079A (ja) | 2018-05-24 |
CN109963820A (zh) | 2019-07-02 |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |