WO2018062372A1 - 光透過性導電フィルム及びパターン状の導電層を有する光透過性導電フィルムの製造方法 - Google Patents

光透過性導電フィルム及びパターン状の導電層を有する光透過性導電フィルムの製造方法 Download PDF

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WO2018062372A1
WO2018062372A1 PCT/JP2017/035179 JP2017035179W WO2018062372A1 WO 2018062372 A1 WO2018062372 A1 WO 2018062372A1 JP 2017035179 W JP2017035179 W JP 2017035179W WO 2018062372 A1 WO2018062372 A1 WO 2018062372A1
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conductive layer
film
light
layer
conductive
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PCT/JP2017/035179
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English (en)
French (fr)
Japanese (ja)
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俊輝 伊神
守雄 滝沢
明弘 相川
林　秀樹
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積水化学工業株式会社
積水ナノコートテクノロジー株式会社
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Application filed by 積水化学工業株式会社, 積水ナノコートテクノロジー株式会社 filed Critical 積水化学工業株式会社
Priority to KR1020187027796A priority Critical patent/KR102446081B1/ko
Priority to CN201780032474.6A priority patent/CN109155167B/zh
Publication of WO2018062372A1 publication Critical patent/WO2018062372A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Definitions

  • One embodiment of the present invention relates to a light-transmitting conductive film having light transmittance and conductivity. Another embodiment of the present invention relates to a method for producing a light transmissive conductive film having a patterned conductive layer using the light transmissive conductive film.
  • touch panel type liquid crystal display devices have been widely used in electronic devices such as smartphones, mobile phones, notebook computers, tablet PCs, copiers, and car navigation systems.
  • a liquid crystal display device a light transmissive conductive film in which a transparent conductive layer is laminated on a substrate is used.
  • the light transmissive conductive film is usually mounted on the touch panel after patterning a light transmissive and conductive conductive layer by performing an etching process.
  • a light transmissive and conductive conductive layer by performing an etching process.
  • Patent Document 1 a transparent conductive film in which the surface tension of an amorphous transparent conductive thin film is adjusted is disclosed.
  • the pattern electrode and the wiring are used simultaneously for improving the detection sensitivity, and the conductive layer is used as the pattern electrode for increasing the density and miniaturizing the wiring.
  • the conductive layer is also used for wiring connecting to the pattern electrode.
  • the pattern electrode and wiring pattern formation methods are also changing.
  • a method of performing an etching process after forming a resist by screen printing using a liquid resist has been the mainstream.
  • the method has been changed to a method in which a dry film resist is attached to a conductive layer and etching treatment is performed after exposure and development.
  • the conductive layer is broken or the edge of the conductive layer is excessively chipped, causing problems such as failure, responsiveness deterioration, and pattern appearance. It becomes easy.
  • the present inventors have found that these problems are caused by the adhesion of the dry film resist to the surface of the conductive layer.
  • one of the objects of the present invention is to provide a light-transmitting conductive film that can improve the adhesion of a member such as a dry film resist to the surface of the conductive layer.
  • Another object of the present invention is to provide a method for producing a light transmissive conductive film having a patterned conductive layer using the light transmissive conductive film.
  • a conductive layer having optical transparency and conductivity, and a base material disposed on one surface side of the conductive layer, the base side of the conductive layer; Provides a light-transmissive conductive film having a surface tension of 28 dyn / cm or more and 34 dyn / cm or less on the opposite surface.
  • the arithmetic average height Sa in a visual field of 70 ⁇ m ⁇ 90 ⁇ m on the surface opposite to the substrate side of the conductive layer is 0.5 nm or more and 20 nm or less, and the conductive layer
  • the arithmetic average roughness Ra in the range of 1.0 ⁇ m ⁇ 1.0 ⁇ m on the surface opposite to the substrate side is 2.0 nm or more and 15 nm or less.
  • the conductive layer is a crystallized conductive layer.
  • the light transmissive conductive film is used by contacting a dry film resist on the outer surface of the conductive layer.
  • a step of bringing a dry film resist into contact with the surface of the light-transmissive conductive film described above on the side opposite to the substrate side of the conductive layer, and the conductive layer is patterned.
  • a method for producing a light-transmitting conductive film having a pattern-like conductive layer comprising a step of forming a conductive layer and a step of peeling the dry film resist.
  • the light transmissive conductive film which is one embodiment of the present invention includes a light transmissive and conductive layer and a base material disposed on one surface side of the conductive layer.
  • the surface tension of the surface of the conductive layer opposite to the substrate side is 28 dyn / cm or more and 34 dyn / cm or less.
  • the adhesion of a member such as a dry film resist to the surface can be improved.
  • FIG. 1 is a cross-sectional view showing a light transmissive conductive film according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing a light transmissive conductive film according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view showing a state where the conductive layer of the light-transmitting conductive film according to one embodiment of the present invention is a patterned conductive layer.
  • the light transmissive conductive film which is one embodiment of the present invention includes a conductive layer and a base material.
  • the conductive layer has light transmittance and conductivity.
  • the base material is disposed on one surface side of the conductive layer.
  • the surface tension of the surface of the conductive layer on the side opposite to the substrate side is 28 dyn / cm or more and 34 dyn / cm or less.
  • the adhesion of a member such as a dry film resist to the surface of the conductive layer can be improved.
  • a dry film resist is attached to the conductive layer in order to form a patterned conductive layer
  • the adhesion of the dry film resist can be improved.
  • peeling of a dry film resist can be suppressed and the defect
  • disconnection of the conductive layer can be prevented, and the shape of the edge portion of the conductive layer can be improved.
  • the surface tension can be measured as follows.
  • the surface tension is measured at 25 ° C.
  • a tension checker pen (2-ethoxyethanol mixed solution) manufactured by Kasuga Electric Co., Ltd. can be used when the surface tension is in the range of more than 34 dyn / cm and not more than 40 dyn / cm.
  • a liquid mixture for wet tension test manufactured by Wako Pure Chemical Industries, Ltd. can be used (based on JIS K6768: 1999). Specifically, using a tension checker pen or a wet tension test mixed liquid, the liquid is spread on the surface of the conductive layer so as to have an area of 2 cm 2 or more to form a liquid film.
  • the amount of the liquid is, for example, such that a liquid film is formed without forming a pool.
  • the measurement should be performed in the unmeasured area each time, the liquid should not be spread multiple times, and the line should not be drawn multiple times with the tension checker pen and the wet tension test mixture.
  • the surface tension is determined 5 seconds after the liquid is spread to form a liquid film. If the area of 80% or more is maintained after 5 seconds with respect to the area of 100% immediately after spreading the liquid without tearing the liquid film, the conductive layer has a predetermined surface tension. .
  • the surface tension when high surface tension is shown is the surface tension of the conductive layer.
  • the measurement is usually performed 3 times or more, and the average value is defined as the surface tension.
  • the arithmetic average height Sa in the visual field of 70 ⁇ m ⁇ 90 ⁇ m (square) on the surface of the conductive layer opposite to the substrate side preferably satisfies the following lower limit and upper limit.
  • the arithmetic average height Sa is preferably 0.5 nm or more, more preferably 1.0 nm or more, still more preferably 2.0 nm or more, still more preferably 4.0 nm or more, particularly preferably 6.0 nm or more, and particularly preferably Is 8.0 nm or more, more preferably 10 nm or more, very preferably 12 nm or more, and most preferably 15 nm or more.
  • the arithmetic average height Sa is preferably 20 nm or less, more preferably 19 nm or less.
  • the arithmetic average height Sa is not less than the above lower limit or not more than the above upper limit, the adhesion of a member such as a dry film resist to the surface of the conductive layer can be further enhanced.
  • the arithmetic average roughness Ra in the range of 1.0 ⁇ m ⁇ 1.0 ⁇ m on the surface of the conductive layer opposite to the substrate side preferably satisfies the following lower limit and upper limit.
  • the arithmetic average roughness Ra is preferably 2.0 nm or more, more preferably 2.5 nm or more, further preferably 5 nm or more, even more preferably 7 nm or more, particularly preferably 10 nm or more, preferably 15 nm or less, more Preferably it is 14 nm or less, More preferably, it is 13 nm or less.
  • the adhesion of a member such as a dry film resist to the surface of the conductive layer can be further enhanced.
  • the arithmetic average height Sa and the arithmetic average roughness Ra can be specifically measured as follows.
  • the arithmetic average height Sa is measured using a white interference microscope (for example, “VertScan” manufactured by Ryoka System Co., Ltd. or an equivalent product). Specifically, a CCD camera (for example, SONY HR-50 1/3 or equivalent) is used, the lens barrel is 1 ⁇ , the objective lens is 50 ⁇ , the measurement mode is wave mode, and the measurement range is Y Observation is made in the direction 71.15 ⁇ m and the X direction 94.89 ⁇ m, and the arithmetic average height Sa is calculated for an arbitrary region in the Y direction 70 ⁇ m and the X direction 90 ⁇ m. The measurement is usually performed twice or more, and the average value is defined as the arithmetic average height Sa.
  • a white interference microscope for example, “VertScan” manufactured by Ryoka System Co., Ltd. or an equivalent product.
  • a CCD camera for example, SONY HR-50 1/3 or equivalent
  • the lens barrel is 1 ⁇
  • the objective lens is 50
  • the arithmetic average roughness Ra is measured using a scanning probe microscope (for example, “SPM-9700” manufactured by Shimadzu Corporation or an equivalent product). Specifically, a microcantilever (“OMCL-TR800PSA-1" manufactured by Olympus or equivalent) can be used, and is calculated from the measurement result obtained by scanning the measurement area in the contact area of 1.0 ⁇ m ⁇ 1.0 ⁇ m. To do. The measurement is usually performed twice or more, and the average value is defined as the arithmetic average roughness Ra.
  • the substrate preferably includes a substrate film, preferably includes a hard coat layer, and preferably includes an undercoat layer.
  • the hard coat layer and the undercoat layer may be each independently a single layer or multiple layers.
  • the light transmissive conductive film which is one embodiment of the present invention is preferably annealed.
  • the annealing treatment the crystallinity of the conductive layer can be increased, and a crystallized conductive layer can be formed.
  • the conductive layer is a crystallized conductive layer, and in such a case, it is preferable from the viewpoint of reducing resistance and improving pattern formation by etching.
  • the light transmissive conductive film is preferably used by bringing a dry film resist into contact with the outer surface of the conductive layer.
  • the light transmissive conductive film is suitably used for forming a patterned conductive layer by bringing a dry film resist into contact with the outer surface of the conductive layer.
  • the manufacturing method of the translucent conductive film which has the pattern-shaped conductive layer which concerns on another embodiment of this invention comprises the following each process.
  • the process of making a dry film resist contact the surface on the opposite side to the said base material side of the said conductive layer of the said light-transmitting conductive film.
  • the process of making the said conductive layer pattern-form conductive layer.
  • a step of peeling the dry film resist By forming the patterned conductive layer through these steps, the formation accuracy of the patterned conductive layer can be increased.
  • a step of curing the dry film resist is provided between the step of bringing the dry film resist into contact with and the step of forming the conductive layer patterned conductive layer.
  • the conductive layer is preferably etched.
  • the light-transmitting conductive film which is one embodiment of the present invention is used for a touch panel, the formation accuracy of the patterned conductive layer can be increased, so that the occurrence of problems due to disconnection of the conductive layer can be suppressed. Therefore, the light transmissive conductive film can be suitably used for a liquid crystal display device, and can be suitably used for a touch panel.
  • FIG. 1 is a cross-sectional view showing a light transmissive conductive film according to an embodiment of the present invention.
  • the light transmissive conductive film 1 shown in FIG. 1 includes a substrate 2, a conductive layer 3, and a protective film 4.
  • the base material 2 has a first surface 2a and a second surface 2b.
  • the first surface 2a and the second surface 2b are opposed to each other.
  • a conductive layer 3 is laminated on the first surface 2 a of the substrate 2.
  • the first surface 2a is a surface on the side where the conductive layer 3 is laminated.
  • the substrate 2 is a member disposed between the conductive layer 3 and the protective film 4 and is a support member for the conductive layer 3. Further, a protective film may be attached to the surface of the conductive layer 3 opposite to the base 2.
  • the protective film 4 is laminated on the second surface 2b of the substrate 2.
  • the second surface 2b is a surface on the side where the protective film 4 is laminated.
  • the surface tension of the surface of the conductive layer 3 on the side opposite to the substrate 2 side is 28 dyn / cm or more and 34 dyn / cm or less.
  • the base material 2 has a base film 11, first and second hard coat layers 12 and 13, and an undercoat layer 14.
  • the base film 11 is made of a material having high light transmittance.
  • a second hard coat layer 13 and an undercoat layer 14 are laminated in this order.
  • the undercoat layer 14 is in contact with the conductive layer 3.
  • a first hard coat layer 12 is laminated on the surface of the base film 11 on the protective film 4 side.
  • the first hard coat layer 12 is in contact with the protective film 4.
  • the conductive layer 3 is made of a material having optical transparency and conductivity, preferably a material having high optical transparency and high electrical conductivity.
  • the conductive layer 3 is laminated on the first surface 2 a of the substrate 2.
  • the protective film may be laminated on the second surface of the base material by an adhesive layer. It is preferable that the 2nd surface of a base material is in contact with the said adhesive layer of a protective film.
  • FIG. 2 is a cross-sectional view showing a light transmissive conductive film according to an embodiment of the present invention.
  • the first hard coat layer 12 is not provided.
  • the light transmissive conductive film 1A has a base 2A in which an undercoat layer 14, a second hard coat layer 13, and a base film 11 are laminated in this order.
  • the protective film 4 is laminated directly on the surface of the base film 11 opposite to the conductive layer 3.
  • the first hard coat layer may not be provided like the light transmissive conductive film 1A.
  • a protective film may be directly laminated on the surface of the base film.
  • at least one of the second hard coat layer and the undercoat layer may not be provided.
  • the undercoat layer and the conductive layer may be laminated in this order, or the conductive layer may be laminated directly on the base film.
  • the undercoat layer may be a single layer or a multilayer.
  • the manufacturing method of the light-transmitting conductive film 1 is not particularly limited, but can be manufactured by the following method, for example.
  • 1st hard coat layer 12 is formed on one surface of substrate film 11. Specifically, when an ultraviolet curable resin is used as the resin, a photocurable monomer and a photoinitiator are stirred in a diluent to prepare a coating solution. The obtained coating liquid is applied onto the base film 11 and the resin is cured by irradiating with ultraviolet rays to form the first hard coat layer 12.
  • the protective film 4 is formed on the first hard coat layer 12.
  • a protective film provided with a pressure-sensitive adhesive layer on a base sheet is used as the protective film 4
  • the adhesive surface is bonded to the surface of the first hard coat layer 12, and the first hard coat layer 12 is then bonded.
  • the protective film 4 can be formed.
  • a second hard coat layer 13 is formed on the surface of the base film 11 opposite to the first hard coat layer 12.
  • a photocurable monomer and a photoinitiator are stirred in a diluent to prepare a coating solution.
  • the obtained coating liquid is applied onto the surface of the base film 11 opposite to the first hard coat layer 12 side, and the resin is cured by irradiating with ultraviolet rays, whereby the second hard coat layer 13 is formed.
  • the undercoat layer 14 is formed on the second hard coat layer 13. Specifically, when SiO 2 is used, the undercoat layer 14 can be formed on the second hard coat layer 13 by vapor deposition or sputtering.
  • the first and second hard coat layers 12 and 13 and the undercoat layer 14 are formed on the base film 11.
  • the first and second hard coat layers 12 and 13 and the undercoat layer 14 may not be provided.
  • the surface of the base film 11 on the conductive layer 3 side is the first surface 2 a of the base material 2
  • the surface of the base film 11 on the protective film 4 side is the second surface of the base material 2. It is the surface 2b.
  • the light transmissive conductive film 1 can be produced by forming the conductive layer 3 on the undercoat layer 14.
  • the method for forming the conductive layer is not particularly limited, and a method by vapor deposition or sputtering can be used.
  • the formed conductive layer can be improved in crystallinity by annealing.
  • the annealing treatment may be performed in a state where a protective film is used on the side opposite to the conductive layer side of the substrate. Moreover, the annealing treatment may be performed in a state where the protective film attached to the conductive layer side is peeled off.
  • the light transmissive conductive film 1 is obtained by, for example, using the above-described method for producing a light transmissive conductive film having a patterned conductive layer, as shown in FIG. 3, the conductive layer 3 (FIG. 1) as a patterned conductive layer. By making it 3X, it can be used as the light transmissive conductive film 1X.
  • a patterned conductive layer 3X can be formed by partially forming a resist layer on the surface of the conductive layer 3 opposite to the base film 11 side and performing an etching process. After the etching process, washing with water is performed.
  • the light transmissive conductive film 1X has a patterned conductive layer 3X.
  • the patterned conductive layer 3 ⁇ / b> X is partially stacked on the first surface 2 a of the substrate 2.
  • the light transmissive conductive film 1 ⁇ / b> X has, on the first surface 2 a of the substrate 2, a portion with the patterned conductive layer 3 ⁇ / b> X and a portion without the patterned conductive layer 3 ⁇ / b> X.
  • Annealing methods include several means such as a method using hot air drying and a method using infrared rays.
  • the annealing method is not particularly limited, but a method using far infrared rays is preferable.
  • the annealing temperature is preferably 120 ° C. or higher, more preferably 140 ° C. or higher, preferably 200 ° C. or lower, more preferably 170 ° C. or lower.
  • the treatment time for the annealing treatment is preferably 5 minutes or more, more preferably 10 minutes or more, preferably 60 minutes or less, more preferably 30 minutes or less.
  • the light transmissive conductive film 1X may be used while the protective film 4 is laminated, or may be used after the protective film 4 is peeled off.
  • the total thickness of the substrate is preferably 23 ⁇ m or more, more preferably 50 ⁇ m or more, preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less.
  • the base material may include a base film, a hard coat layer, and / or an undercoat layer, and the total thickness of the base material in such a case is preferably not less than the above lower limit and not more than the above upper limit.
  • the base film preferably has high light transmittance.
  • the material of the base film is not particularly limited.
  • examples include phthalate, triacetylcellulose, and cellulose nanofiber.
  • the material for the base film may be used alone or in combination.
  • the thickness of the base film is preferably 5 ⁇ m or more, more preferably 20 ⁇ m or more, preferably 190 ⁇ m or less, more preferably 125 ⁇ m or less.
  • the pattern of the conductive layer can be made even less visible.
  • the average transmittance in the visible light region with a wavelength of 380 to 780 nm is preferably 85% or more, more preferably 90% or more, and usually 100% or less.
  • the base film may contain various stabilizers, ultraviolet absorbers, plasticizers, lubricants, or colorants.
  • First and second hard coat layers are preferably composed of a binder resin.
  • the binder resin is preferably a cured resin.
  • the curable resin a thermosetting resin, an active energy ray curable resin, or the like can be used. From the viewpoint of improving productivity and economy, the curable resin is preferably an ultraviolet curable resin.
  • Examples of the photocurable monomer for forming the ultraviolet curable resin include 1,6-hexanediol diacrylate, 1,4-butanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, and tetraethylene glycol diacrylate.
  • triacrylate compounds such as trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol monohydroxytriacrylate and trimethylolpropane triethoxytriacrylate; such as pentaerythritol tetraacrylate and di-trimethylolpropane tetraacrylate Tetraacrylate compounds
  • pentaacrylate compounds such as dipentaerythritol (monohydroxy) pentaacrylate.
  • a polyfunctional acrylate compound having five or more functional groups may be used as the ultraviolet curable resin.
  • a polyfunctional acrylate compound may be used independently and may use multiple. Moreover, you may add a photoinitiator, a photosensitizer, a leveling agent, a diluent, etc. to a polyfunctional acrylate compound.
  • the first hard coat layer may be composed of a resin portion and a filler.
  • the pattern of the conductive layer can be made even less visible.
  • surface undulation called “Yuzu skin” may occur or fogging due to surface irregularities may occur, and when used in a liquid crystal display device, display light becomes difficult to see.
  • the first hard coat layer does not contain a filler and is constituted only by a resin portion from the viewpoint of making it difficult to cause the skin and cloudiness.
  • the average particle diameter of the filler is smaller than the thickness of the first hard coat layer, and the filler does not protrude on the surface of the first hard coat layer.
  • the filler is not particularly limited.
  • metal oxide such as silica, iron oxide, aluminum oxide, zinc oxide, titanium oxide, silicon dioxide, antimony oxide, zirconium oxide, tin oxide, cerium oxide, and indium-tin oxide.
  • Product particles resin particles such as silicone, (meth) acryl, styrene, melamine, and the like. More specifically, resin particles such as crosslinked poly (meth) methyl acrylate can be used.
  • the said filler may be used independently and may use multiple together.
  • each of the first and second hard coat layers may contain various stabilizers, ultraviolet absorbers, plasticizers, lubricants or colorants.
  • the undercoat layer is, for example, a refractive index adjustment layer.
  • the undercoat layer By providing the undercoat layer, the difference in refractive index between the conductive layer and the second hard coat layer or substrate film can be reduced, so that the light transmissive conductive film can be made more transparent. Can be increased.
  • the undercoat layer can be formed by a vacuum deposition method, a sputtering method, an ion plating method, or a coating method.
  • the conductive layer is made of a light-transmitting conductive material.
  • the conductive material is not particularly limited, for example, IZO (indium zinc oxide) or, In-based oxides such as ITO (indium tin oxide), Sn, such as SnO 2, FTO (fluorine-doped tin oxide) -Based oxides, Zn-based oxides such as AZO (aluminum zinc oxide), GZO (gallium zinc oxide), sodium, sodium-potassium alloy, lithium, magnesium, aluminum, magnesium-silver mixture, magnesium-indium mixture, aluminum -Lithium alloys, Al / Al 2 O 3 mixtures, Al / LiF mixtures, metals such as gold, CuI, Ag nanowires (AgNW), carbon nanotubes (CNT) or conductive transparent polymers.
  • the said electroconductive material may be used independently and may use multiple together.
  • the conductive material includes: In-based oxides such as IZO (indium zinc oxide) and ITO (indium tin oxide); Sn-based oxides such as SnO 2 and FTO (fluorine-doped tin oxide); AZO (aluminum zinc) Oxide) and Zn-based oxides such as GZO (gallium zinc oxide) are preferable, and ITO (indium tin oxide) is more preferable.
  • In-based oxides such as IZO (indium zinc oxide) and ITO (indium tin oxide)
  • Sn-based oxides such as SnO 2 and FTO (fluorine-doped tin oxide)
  • AZO (aluminum zinc) Oxide) and Zn-based oxides such as GZO (gallium zinc oxide) are preferable, and ITO (indium tin oxide) is more preferable.
  • Examples of the method for controlling the surface tension in the conductive layer include a method for controlling the oxygen flow rate during ITO film formation to be larger than the bottom of the U curve, and a method for controlling the flow rate by increasing / decreasing the argon flow rate.
  • a method for controlling the arithmetic average height Sa and the arithmetic average roughness Ra for example, there is a method of adding a filler to the hard coat layer.
  • the filler material include metal oxide particles such as silica, iron oxide, aluminum oxide, zirconium oxide, and indium-tin oxide, and resin particles such as silicone, acrylic, styrene, and melamine.
  • the fillers may be used alone or in combination.
  • Other methods for controlling the arithmetic average height Sa and the arithmetic average roughness Ra include a method for controlling the polymerization rate when forming the hard coat layer and the undercoat layer.
  • the thickness of the conductive layer is preferably 12 nm or more, more preferably 16 nm or more, still more preferably 17 nm or more, preferably 50 nm or less, more preferably 30 nm or less, and even more preferably 19.9 nm or less.
  • the thickness of the conductive layer is not less than the above lower limit, the resistance value of the light-transmitting conductive film can be effectively reduced, and the conductivity can be further increased.
  • the thickness of the conductive layer is less than or equal to the above upper limit, the pattern of the conductive layer can be made less visible and the light transmissive conductive film can be made even thinner.
  • the average transmittance in the visible light region with a wavelength of 380 to 780 nm is preferably 85% or more, more preferably 90% or more, and usually 100% or less. It is.
  • the protective film is comprised by the base material sheet and the adhesive layer.
  • the protective film preferably has a base sheet.
  • the base sheet preferably has high light transmittance.
  • the material of the base sheet is not particularly limited, but for example, polyolefin, polyethersulfone, polysulfone, polycarbonate, cycloolefin polymer, polyarylate, polyamide, polymethyl methacrylate, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate , Triacetyl cellulose, and cellulose nanofibers.
  • polystyrene resin examples include polyethylene, polypropylene and the like.
  • the material of the protective film preferably contains polyolefin, preferably contains polypropylene, and the material of the base sheet is preferably polyolefin, and is polypropylene. It is preferable.
  • the above polypropylene is obtained by polymerizing propylene monomer.
  • Polypropylene is a polymer.
  • the polymer includes a copolymer.
  • Examples of polypropylene include a homopolymer of propylene monomer and a copolymer of polymerization components mainly composed of propylene monomer.
  • the content of the propylene monomer is 50% by weight or more, preferably 80% by weight or more, more preferably 90% by weight in 100% by weight of the polymerizable polymerization component. It is at least% by weight and usually less than 100% by weight.
  • the form of copolymerization may be random or block.
  • polypropylene examples include propylene homopolymer, propylene random polymer, and propylene block polymer.
  • Polypropylene is preferably a homopolymer of propylene monomer, and is preferably a propylene homopolymer.
  • the pressure-sensitive adhesive layer can be composed of a (meth) acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a urethane-based adhesive, or an epoxy-based adhesive. From the viewpoint of suppressing an increase in adhesive force due to heat treatment, the adhesive layer is preferably composed of a (meth) acrylic adhesive.
  • the above (meth) acrylic pressure-sensitive adhesive is a pressure-sensitive adhesive obtained by adding a crosslinking agent, a tackifying resin, various stabilizers and the like to a (meth) acrylic polymer as necessary.
  • the (meth) acrylic polymer is not particularly limited, but (meth) acrylic copolymer obtained by copolymerizing a mixed monomer containing a (meth) acrylic acid ester monomer and another copolymerizable monomer. A polymer is preferred.
  • the (meth) acrylic acid ester monomer is not particularly limited, and is obtained by an esterification reaction between a primary or secondary alkyl alcohol having 1 to 12 carbon atoms in the alkyl group and (meth) acrylic acid ( A meth) acrylic acid ester monomer is preferred.
  • Specific examples of the (meth) acrylate monomer include ethyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate.
  • the said (meth) acrylic acid ester monomer may be used independently and may use multiple together.
  • Examples of other polymerizable monomers that can be copolymerized include hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate; Isobornyl (meth) acrylate, hydroxyalkyl (meth) acrylate, glycerin dimethacrylate, glycidyl (meth) acrylate, 2-methacryloyloxyethyl isocyanate, (meth) acrylic acid, itaconic acid, maleic anhydride, crotonic acid, malein Examples thereof include functional monomers such as acid and fumaric acid.
  • the said other polymerizable monomer which can be copolymerized may be used independently, and may use multiple together.
  • the crosslinking agent is not particularly limited, and for example, an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent.
  • the above crosslinking agents may be used alone or in combination.
  • the tackifying resin is not particularly limited, and examples thereof include petroleum resins such as aliphatic copolymers, aromatic copolymers, aliphatic / aromatic copolymers, and alicyclic copolymers.
  • petroleum resins such as aliphatic copolymers, aromatic copolymers, aliphatic / aromatic copolymers, and alicyclic copolymers.
  • the tackifying resin may be a hydrogenated resin.
  • the tackifying resins may be used alone or in combination.
  • the thickness of the protective film is preferably 25 ⁇ m or more, more preferably 50 ⁇ m or more, preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less.
  • the thickness of the protective film is not less than the above lower limit and not more than the above upper limit, the pattern of the conductive layer can be made even less visible.
  • Example 1 Production of light-transmitting conductive film A PET film having a thickness of 125 ⁇ m was used as the base film. An acrylic hard coat resin in which zirconia particles were dispersed was applied to one surface of the PET film to obtain a hard coat layer having a thickness of 1.0 ⁇ m. An acrylic hard coat resin was applied to the other surface of the PET film to obtain a hard coat layer having a thickness of 1.0 ⁇ m. In this way, a double-sided hard coat film was obtained.
  • This double-sided hard coat film was placed in a vacuum apparatus and evacuated. After reaching a vacuum degree of 8.0 ⁇ 10 ⁇ 4 Pa, an argon gas was introduced, and a SiO x layer, a SiO 2 layer, and a SiO x layer were formed in this order in an argon atmosphere by a DC magnetron sputtering method.
  • Indium tin oxide (ITO) was laminated thereon. Specifically, using an ITO sintered body target with SnO 2 of 7 wt%, a cathode having a maximum horizontal magnetic flux density of 1000 gauss on the target surface, a sputtering pressure of 0.4 Pa, an O 2 pressure of 0.004 Pa. A conductive layer (indium tin oxide layer) having a thickness of 18 nm was formed at an Ar pressure of 0.11 Pa to obtain a light-transmitting conductive film.
  • a surface protective film having a thickness of 30 ⁇ m (“Toretec 7332” manufactured by Toray Film Processing Co., Ltd., substrate: polyolefin, adhesive strength at 23 ° C .: 0.07 N / 50 mm width)
  • Toretec 7332 manufactured by Toray Film Processing Co., Ltd., substrate: polyolefin, adhesive strength at 23 ° C .: 0.07 N / 50 mm width
  • the surface protective film was peeled off.
  • the samples thus prepared were evaluated for surface tension, arithmetic average height Sa, and arithmetic average roughness Ra.
  • the support film was peeled off, and the substrate was developed by being immersed in a 1% by weight alkaline solution (1 / 4N KOH aqueous solution) at 30 ° C. for 1 minute.
  • the cured resist pattern was peeled off by immersing the base material in a 3% by mass NaOH aqueous solution at 50 ° C. for 120 seconds. In this way, a light transmissive conductive film having a patterned conductive layer was obtained.
  • Example 2 to 5 and Comparative Example 1 Except that the flow rate (pressure) of oxygen (O 2 ) and argon (Ar) during the formation of the conductive layer was changed as shown in Table 1 below, the conductive layer was formed in the same manner as in Example 1, A light transmissive conductive film was obtained.
  • a light transmissive conductive film having a patterned conductive layer was obtained in the same manner as in Example 1.
  • Example 6 A PET film having a thickness of 125 ⁇ m was used as the base film.
  • An acrylic hard coat resin in which zirconia particles and silica particles having a particle diameter of 1.0 ⁇ m were dispersed was applied to one surface of the PET film to obtain a hard coat layer having a thickness of 1.0 ⁇ m.
  • An acrylic hard coat resin was applied to the other surface of the PET film to obtain a hard coat layer having a thickness of 1.0 ⁇ m. In this way, a double-sided hard coat film was obtained.
  • Example 7 A PET film having a thickness of 125 ⁇ m was used as the base film.
  • An acrylic hard coat resin in which zirconia particles and acrylic particles having a particle diameter of 1.0 ⁇ m were dispersed was applied to one surface of the PET film to obtain a hard coat layer having a thickness of 1.0 ⁇ m.
  • An acrylic hard coat resin was applied to the other surface of the PET film to obtain a hard coat layer having a thickness of 1.0 ⁇ m. In this way, a double-sided hard coat film was obtained.
  • a PET film having a thickness of 125 ⁇ m was used as the base film.
  • An acrylic hard coat resin in which zirconia particles and silica particles having a particle size of 1.5 ⁇ m were dispersed was applied to one surface of the PET film to obtain a hard coat layer having a thickness of 1.0 ⁇ m.
  • An acrylic hard coat resin was applied to the other surface of the PET film to obtain a hard coat layer having a thickness of 1.0 ⁇ m. In this way, a double-sided hard coat film was obtained.
  • a light-transmitting conductive film was obtained in the same manner as in Example 1 except that this double-sided hard coat film was used.
  • the liquid was spread on the surface of the conductive layer to have an area of 2 cm 2 or more to form a liquid film.
  • the amount of liquid was such that a liquid film was formed without creating a pool.
  • the measurement was performed in an unmeasured area every time, the liquid was not spread several times, and the line was not drawn with the tension checker pen and the wet tension test mixed liquid several times.
  • the determination of the surface tension was performed 5 seconds after the liquid was spread to form a liquid film.
  • the liquid film was not torn and the area of 80% or more was maintained after 5 seconds with respect to the area of 100% immediately after spreading the liquid, it was determined that the conductive layer had a predetermined surface tension. .
  • the arithmetic average height Sa was measured using a white interferometer “VertScan” manufactured by Ryoka System. Specifically, a CCD camera SONY HR-50 1/3 is used, the lens barrel is 1 ⁇ , the objective lens is 50 ⁇ , the measurement mode is the wave mode, the measurement range is 71.15 ⁇ m in the Y direction, and 94 in the X direction. Observed as 89 ⁇ m. The arithmetic average height Sa in the region of 70 ⁇ m in the Y direction and 90 ⁇ m in the X direction of the obtained observation image was obtained.
  • the arithmetic average roughness Ra was measured using a scanning probe microscope (“SPM-9700” manufactured by Shimadzu Corporation). Specifically, it was calculated from the measurement results obtained by using a microcantilever ("OMCL-TR800PSA-1" manufactured by Olympus) and scanning in the contact area in a measurement area of 1.0 ⁇ m ⁇ 1.0 ⁇ m. The measurement was performed twice, and the average value was adopted as the arithmetic average height Sa and the arithmetic average roughness Ra.
  • adhesiveness was determined according to the following criteria.
  • the detection terminal of the multimeter was brought into contact with the conductive layer of the light-transmitting conductive film on which the pattern was formed, and the presence or absence of conduction between the terminals (distance between terminals: 8 cm) was confirmed.
  • the adhesion was determined according to the following criteria.

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PCT/JP2017/035179 2016-09-29 2017-09-28 光透過性導電フィルム及びパターン状の導電層を有する光透過性導電フィルムの製造方法 WO2018062372A1 (ja)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02299106A (ja) * 1989-05-12 1990-12-11 Nitto Denko Corp 透明導電性フイルム
WO1999059814A1 (fr) * 1998-05-15 1999-11-25 Toyo Boseki Kabushiki Kaisha Film conducteur transparent et ecran tactile
JP2000243146A (ja) * 1999-02-23 2000-09-08 Toyobo Co Ltd 透明導電性フィルムおよびこれを用いたタッチパネル
JP2007146117A (ja) * 2005-11-04 2007-06-14 Mitsui Mining & Smelting Co Ltd ニッケルインク及びそのニッケルインクで形成した導体膜
JP2010269504A (ja) * 2009-05-21 2010-12-02 Toyobo Co Ltd 透明導電性積層フィルム及び透明導電性積層シート並びにタッチパネル
WO2011102168A1 (ja) * 2010-02-17 2011-08-25 日本写真印刷株式会社 透明電極フィルム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098474B2 (ja) * 2006-08-02 2012-12-12 セイコーエプソン株式会社 液晶表示装置の製造方法
JP2010059280A (ja) * 2008-09-02 2010-03-18 Toppan Printing Co Ltd ハードコート塗液、ハードコートフィルムおよびタッチパネル用上部電極板
JP5405391B2 (ja) * 2010-05-21 2014-02-05 日本メクトロン株式会社 透明フレキシブルプリント配線板及びその製造方法
CN104541204B (zh) * 2012-09-27 2019-05-14 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及触控面板的制造方法
KR20140082405A (ko) * 2012-12-24 2014-07-02 도레이첨단소재 주식회사 투명 도전성 필름
EP3001428B1 (en) * 2013-05-23 2019-08-07 Lintec Corporation Conductive film and electronic device having conductive film

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02299106A (ja) * 1989-05-12 1990-12-11 Nitto Denko Corp 透明導電性フイルム
WO1999059814A1 (fr) * 1998-05-15 1999-11-25 Toyo Boseki Kabushiki Kaisha Film conducteur transparent et ecran tactile
JP2000243146A (ja) * 1999-02-23 2000-09-08 Toyobo Co Ltd 透明導電性フィルムおよびこれを用いたタッチパネル
JP2007146117A (ja) * 2005-11-04 2007-06-14 Mitsui Mining & Smelting Co Ltd ニッケルインク及びそのニッケルインクで形成した導体膜
JP2010269504A (ja) * 2009-05-21 2010-12-02 Toyobo Co Ltd 透明導電性積層フィルム及び透明導電性積層シート並びにタッチパネル
WO2011102168A1 (ja) * 2010-02-17 2011-08-25 日本写真印刷株式会社 透明電極フィルム

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