WO2018047957A1 - 導電性接着剤組成物 - Google Patents

導電性接着剤組成物 Download PDF

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Publication number
WO2018047957A1
WO2018047957A1 PCT/JP2017/032554 JP2017032554W WO2018047957A1 WO 2018047957 A1 WO2018047957 A1 WO 2018047957A1 JP 2017032554 W JP2017032554 W JP 2017032554W WO 2018047957 A1 WO2018047957 A1 WO 2018047957A1
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WO
WIPO (PCT)
Prior art keywords
conductive adhesive
conductive
adhesive composition
wiring board
inorganic particles
Prior art date
Application number
PCT/JP2017/032554
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English (en)
French (fr)
Japanese (ja)
Inventor
晃司 高見
Original Assignee
タツタ電線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to CN201780051113.6A priority Critical patent/CN109563382A/zh
Priority to KR1020197004703A priority patent/KR20190046796A/ko
Publication of WO2018047957A1 publication Critical patent/WO2018047957A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to a conductive adhesive composition used for a printed wiring board.
  • a conductive adhesive obtained by adding a conductive filler to an adhesive resin composition has been used to attach a reinforcing plate or an electromagnetic wave shielding film to a printed wiring board.
  • an opening is formed in the coverlay of the printed wiring board to expose a circuit made of copper foil, and the opening is filled with a conductive adhesive.
  • the circuit is electrically connected to the reinforcing plate and the electromagnetic shielding film.
  • a conductive adhesive for example, an adhesive in which a thermosetting resin is mixed with a conductive filler and silica particles having a predetermined specific surface area is disclosed. And it is described by mix
  • the electroconductive adhesive agent which consists of an adhesive composition containing the inorganic filler which has a predetermined particle diameter, and a thermosetting resin is disclosed. And it is described by using such a conductive adhesive that the connection reliability in a circuit with a high level of wet heat resistance and through-hole steps is improved (for example, see Patent Document 2).
  • the conductivity and the adhesion to the printed wiring board are lowered, so that the reflow resistance (withstands the reflow process).
  • High heat resistance and high adhesion between the printed circuit board and the conductivity after the reflow process are required.
  • the hole diameter of the opening provided in the cover lay also tends to be small.
  • the present invention has been made in view of the above problems, and an object thereof is to provide a conductive adhesive composition capable of ensuring excellent conductivity even after reflow.
  • the conductive adhesive composition of the present invention is a conductive adhesive composition containing at least one of a thermoplastic resin and a thermosetting resin, a conductive filler, and inorganic particles.
  • the inorganic particles have a cumulative frequency of 40% or less at a particle diameter of 5 ⁇ m measured using a laser diffraction particle size distribution analyzer.
  • Another conductive adhesive composition of the present invention is a conductive adhesive composition containing at least one of a thermoplastic resin and a thermosetting resin, a conductive filler, and inorganic particles, and is inorganic.
  • the particles have a cumulative frequency of 80% or less at a particle diameter of 10 ⁇ m measured using a laser diffraction particle size distribution analyzer.
  • the “cumulative frequency” here refers to the cumulative frequency from the small particle diameter side in the particle size distribution curve (vertical axis is cumulative frequency%, horizontal axis is particle diameter) obtained by a laser diffraction particle size distribution analyzer. Say that.
  • the conductive adhesive composition of the present invention has a cumulative frequency at a particle size of 5 ⁇ m measured using at least one of a thermoplastic resin and a thermosetting resin, a conductive filler, and a laser diffraction particle size distribution measuring device. It is a conductive adhesive composition containing 40% or less inorganic particles.
  • thermosetting resin is not particularly limited, and polyamide resin, polyimide resin, acrylic resin, phenol resin, epoxy resin, polyurethane resin, polyurethane urea resin, melamine resin, alkyd resin, etc. are used. can do. These may be used alone or in combination of two or more.
  • thermosetting resin is not particularly limited, and a phenolic resin composition, an epoxy resin composition, a urethane resin composition, a melamine resin composition, an alkyd resin composition, or the like can be used. These may be used alone or in combination of two or more.
  • the conductive adhesive film of the present invention contains a conductive filler.
  • the conductive filler is not particularly limited, and for example, a metal filler, a metal-coated resin filler, a carbon filler, and a mixture thereof can be used.
  • the metal filler include copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and gold-coated nickel powder. These metal powders can be electrolyzed, atomized, or reduced. Can be created by law.
  • the average particle diameter of the conductive filler is preferably 3 to 50 ⁇ m in order to facilitate contact between the fillers.
  • examples of the shape of the conductive filler include a spherical shape, a flake shape, a dendritic shape, and a fibrous shape.
  • the conductive filler is preferably at least one selected from the group consisting of silver powder, silver-coated copper powder, and copper powder from the viewpoint of connection resistance and cost.
  • the conductive filler is preferably contained in a proportion of 40 to 90% by mass with respect to the total amount of the conductive adhesive composition.
  • silane coupling agents for conductive adhesive films, silane coupling agents, antioxidants, pigments, dyes, tackifying resins, plasticizers, UV absorbers, antifoaming agents, leveling regulators are used as long as solder reflow resistance is not deteriorated. , Fillers, flame retardants, etc. may be added.
  • the inorganic particles contained in the conductive adhesive composition of the present invention have a cumulative frequency of 40% or less at a particle diameter of 5 ⁇ m measured using a laser diffraction particle size distribution analyzer.
  • the cumulative frequency at a particle diameter of 5 ⁇ m exceeds 40%, inorganic particles having a small particle diameter increase, so that it is difficult to fix the conductive filler between the inorganic particles, and the thermoplastic resin (or due to heat during reflow) (or This is because the connection between the conductive fillers may be disconnected due to the flow of the thermosetting resin), and thus the connection resistance may not be sufficiently reduced after reflow.
  • the inorganic particles may have a cumulative frequency of 80% or less at a particle diameter of 10 ⁇ m measured using a laser diffraction particle size distribution measuring apparatus.
  • the cumulative frequency at a particle diameter of 10 ⁇ m exceeds 80%, inorganic particles having a small particle diameter increase, and as described above, due to the flow of the thermoplastic resin (or thermosetting resin) due to heat during reflow, This is because the connection between the conductive fillers may be cut off, and thus the connection resistance may not be sufficiently reduced after reflow.
  • the cumulative frequency at a particle size of 5 ⁇ m and 10 ⁇ m can be measured with a commercially available laser diffraction particle size distribution analyzer (for example, trade name: MICROTRAC S3500 manufactured by Microtrac).
  • a commercially available laser diffraction particle size distribution analyzer for example, trade name: MICROTRAC S3500 manufactured by Microtrac.
  • the inorganic particles are not particularly limited, but silica, alumina, aluminum hydroxide, magnesium hydroxide, barium sulfate, calcium carbonate, titanium oxide, zinc oxide, antimony trioxide, magnesium oxide, talc, montmorolinite, kaolin, bentonite Inorganic compounds such as Among these, it is preferable to use silica particles from the viewpoint of cost.
  • the inorganic particles are preferably contained in a proportion of 10 to 30% by mass with respect to the total amount of the conductive adhesive composition, and more preferably 10 to 25% by mass. If the content of the inorganic particles is less than 10% by mass, the connection stability after reflow becomes unstable. If the content exceeds 30% by mass, the amount of the inorganic particles increases, so that the peelable substrate and the like. This is because it may be difficult to apply the conductive adhesive composition to the surface of the film or the conductivity of the conductive adhesive composition may be reduced.
  • the average particle diameter of the inorganic particles is preferably 1 to 15 ⁇ m, more preferably 2 to 10 ⁇ m.
  • the average particle diameter is less than 1 ⁇ m, the film forming property of the conductive adhesive composition is lowered, and it becomes difficult to control the thickness.
  • the average particle diameter exceeds 15 ⁇ m, it is difficult to reduce the thickness.
  • the conductive adhesive film of the present invention may contain a curing agent as necessary. It does not specifically limit as said hardening
  • the amount of the curing agent used is preferably 0.1 to 200 parts by mass or less, more preferably 0.2 to 100 parts by mass with respect to 100 parts by mass of the resin component of the thermosetting resin. More preferably, it is 0.2 to 50 parts by mass.
  • the conductive adhesive film of the present invention may be used in combination with an imidazole-based curing accelerator in order to accelerate the curing of the curing agent.
  • the curing accelerator is not particularly limited.
  • 2-phenyl-4,5-dihydroxymethylimidazole, 2-heptadecylimidazole, 2,4-diamino-6- (2′-undecylimidazolyl) ethyl-S -Triazine 1-cyanoethyl-2-phenylimidazole, 2-phenylimidazole, 5-cyano-2-phenylimidazole, 2,4-diamino-6- [2'methylimidazolyl- (1 ')]-ethyl-S- Imidazoles such as triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 1-cyanoethyl-2
  • an alkyl group, ethylcyano group, hydroxyl group, azine, etc. are attached to the ring.
  • These curing accelerators are effective in improving heat resistance and the like if they are in appropriate amounts.
  • the use amount of the curing accelerator is preferably 0.01 to 1.0 part by mass with respect to 100 parts by mass of the resin component of the thermosetting resin.
  • the conductive adhesive film 1 of the present invention coats the peelable substrate 2 (release film) and the surface of the peelable substrate 2 with the above-described conductive adhesive composition.
  • the conductive adhesive layer 4 formed by this is provided.
  • the coating method is not particularly limited, and known coating equipment represented by die coating, lip coating, comma coating and the like can be used. In addition, what is necessary is just to set suitably the conditions at the time of coating the mold release base material 2 with a conductive adhesive composition.
  • the releasable substrate 2 is formed by applying a silicon-based or non-silicon-based release agent on the surface on which the conductive adhesive layer 4 is formed on a base film such as polyethylene terephthalate or polyethylene naphthalate. Can be used. Note that the thickness of the releasable substrate 2 is not particularly limited, and is appropriately determined in consideration of ease of use.
  • the thickness of the conductive adhesive layer 4 is preferably 15 to 100 ⁇ m. If the thickness is less than 15 ⁇ m, the embeddability may be insufficient, and sufficient connection with the ground circuit may not be obtained. By setting to such a thickness, when the substrate has irregularities, it flows appropriately, so that it can be deformed into a shape that fills the recess and can be bonded with good adhesion.
  • the conductive adhesive composition of the present invention can be used as an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer depending on the purpose of use.
  • the conductive adhesive composition of the present invention when used as a conductive adhesive film for bonding to a reinforcing plate, it can be used as an isotropic conductive adhesive layer.
  • an electromagnetic wave shielding film having a metal layer it can be used as an isotropic conductive adhesive layer or an anisotropic conductive adhesive layer, but it should be used as an anisotropic conductive adhesive layer. Is preferred.
  • the blending amount of the conductive filler is preferably 5% by mass or more and less than 40% by mass in the total solid content of the conductive adhesive composition.
  • the conductive filler is preferably 40% by mass or more and 90% by mass or less in the total solid content of the conductive adhesive composition.
  • the conductive adhesive film using the conductive adhesive of the present invention is excellent in adhesion to the printed wiring board, and the adhesion to the printed wiring board is to a resin board such as a polyimide film. And adhesion to metal materials such as gold-plated copper foil and conductive reinforcing plate are included.
  • the electromagnetic wave shielding film 20 using the conductive adhesive composition of the present invention includes a conductive adhesive layer 4 and a protective layer 13 provided on the surface of the conductive adhesive layer 4.
  • the protective layer 13 is not particularly limited as long as it has insulating properties (that is, a layer formed of an insulating resin composition), and a known layer can be used.
  • thermoplastic resin composition for example, a thermoplastic resin composition, a thermosetting resin composition, an active energy ray curable composition, or the like can be used.
  • the thermoplastic resin composition is not particularly limited, but polyamide resin, polyimide resin, acrylic resin, polyester resin, urethane resin, polycarbonate resin, polyolefin resin, styrene resin composition, vinyl acetate A resin composition or the like can be used.
  • the thermosetting resin composition is not particularly limited, but a phenolic resin composition, an epoxy resin composition, a urethane resin composition, a melamine resin composition, an alkyd resin composition, or the like is used. Can do.
  • the active energy ray-curable composition is not particularly limited, and for example, a polymerizable compound having at least two (meth) acryloyloxy groups in the molecule can be used.
  • the resin component (excluding the conductive filler) used for the conductive adhesive layer 4 described above may be used.
  • the protective layer 13 may be a laminate of two or more layers having different materials or physical properties such as hardness or elastic modulus.
  • the thickness of the protective layer 13 is not particularly limited and can be appropriately set as necessary, but is 1 ⁇ m or more (preferably 4 ⁇ m or more), 20 ⁇ m or less (preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less). It can be.
  • the protective layer 13 may include a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, and a viscosity as necessary.
  • a regulator, an antiblocking agent, etc. may be included.
  • this electromagnetic wave shielding film 20 forms the protective layer 13 by coating the resin composition for protective layers on one side of a peelable film, for example, and drying, Next, on the protective layer 13 There is a method of forming the conductive adhesive layer 4 by coating the above-mentioned conductive adhesive composition and drying it.
  • a conventionally known coating method such as a gravure coating method, a kiss coating method, a die coating method, a lip coating method, a comma coating method, a blade coating method, or a roll coating method.
  • a knife coating method, a spray coating method, a bar coating method, a spin coating method, a dip coating method, or the like can be used.
  • the electromagnetic wave shielding film 20 can be adhered on the printed wiring board by hot pressing.
  • the conductive adhesive layer 4 of the electromagnetic wave shielding film 20 is softened by heating, and flows into a ground portion provided on the printed wiring board by pressurization. Thereby, the ground circuit and the conductive adhesive are electrically connected, and the shielding effect can be enhanced.
  • this electromagnetic wave shielding film 20 can be used for the shield printed wiring board 30 shown in FIG. 2, for example.
  • the shield printed wiring board 30 includes a printed wiring board 40 and an electromagnetic wave shielding film 20.
  • the printed wiring board 40 includes a base substrate 41, a printed circuit (ground circuit) 42 formed on the base substrate 41, and an insulating adhesive layer 43 provided on the base substrate 41 adjacent to the printed circuit 42. And an insulating cover lay 44 provided to cover the insulating adhesive layer 43.
  • the insulating adhesive layer 43 and the cover lay 44 constitute an insulating layer of the printed wiring board 40, and the insulating adhesive layer 43 and the cover lay 44 have openings for exposing a part of the printed circuit 42. A portion 45 is formed.
  • the base substrate 41, the insulating adhesive layer 43, and the coverlay 44 are not particularly limited, and may be, for example, a resin film. In this case, it can be formed of a resin such as polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyether imide, or polyphenylene sulfide.
  • the printed circuit 42 can be, for example, a copper wiring pattern formed on the base substrate 41.
  • the electromagnetic wave shielding film 20 is placed on the printed wiring board 40 and pressurized while being heated by a press. A part of the conductive adhesive layer 4 softened by heating flows into the opening 45 by pressurization. Thereby, the electromagnetic wave shielding film 20 is affixed on the printed wiring board 40 through the conductive adhesive layer 4.
  • the electromagnetic wave shielding film of the present invention may have a metal layer. By having a metal layer, more excellent electromagnetic shielding performance can be obtained.
  • the electromagnetic wave shielding film 21 using the conductive adhesive composition of the present invention includes a metal layer (shield layer) 14 and a first surface of the metal layer 14.
  • the conductive adhesive layer 4 provided on the side and the protective layer 13 provided on the second surface side opposite to the first surface of the metal layer 14 are provided.
  • Examples of the metal material for forming the metal layer 14 include nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, and an alloy containing any one or more of these materials. It can be selected as appropriate according to the required electromagnetic shielding effect and repeated bending / sliding resistance.
  • the thickness of the metal layer 14 is not particularly limited, and can be set to 0.1 ⁇ m to 8 ⁇ m, for example.
  • a formation method of the metal layer 14 there are an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic, and the like.
  • the metal layer 14 may be a metal foil or metal nanoparticles.
  • this electromagnetic wave shielding film 21 can be used for the shield printed wiring board 31 shown in FIG. 3, for example.
  • the shield printed wiring board 31 includes the above-described printed wiring board 40 and the electromagnetic wave shielding film 21.
  • the electromagnetic wave shielding film 21 is placed on the printed wiring board 40 and pressed while being heated by a press machine. A part of the adhesive layer 4 softened by heating flows into the opening 45 by pressurization. As a result, the electromagnetic wave shielding film 21 is attached to the printed wiring board 40 via the adhesive layer 4, and the metal layer 14 and the printed circuit 42 of the printed wiring board 40 are connected via the conductive adhesive. The metal layer 14 and the printed circuit 42 are connected.
  • the electroconductive adhesive composition of this invention can be used for a shield printed wiring board provided with a reinforcement board. More specifically, for example, it can be used for the shield printed wiring board 32 shown in FIG.
  • the shield printed wiring board 32 includes a printed wiring board 47, a conductive adhesive layer 4, and a conductive reinforcing plate 15.
  • the printed wiring board 47 and the conductive reinforcing plate 15 are bonded and electrically connected by the conductive adhesive layer 4 of the present invention.
  • a plating layer (for example, a gold plating layer) 46 is provided on a part of the surface of the printed circuit 42, and the plating layer 46 is exposed from the opening 45.
  • the printed circuit 42 and the conductive reinforcing plate 15 are not provided through the conductive adhesive layer 4 flowing into the opening 45 without providing the plating layer 46. May be directly connected to each other.
  • the portion where the electronic component is mounted is distorted due to the bending of the printed wiring board.
  • a conductive metal plate or the like can be used as the conductive reinforcing plate 15.
  • a stainless plate, an iron plate, a copper plate, an aluminum plate, or the like can be used as the conductive reinforcing plate 15.
  • a stainless steel plate By using a stainless steel plate, it has sufficient strength to support electronic components even with a thin plate thickness.
  • the thickness of the conductive reinforcing plate 15 is not particularly limited, but is preferably 0.025 to 2 mm, more preferably 0.1 to 0.5 mm. If the thickness of the conductive reinforcing plate 15 is within this range, the circuit board to which the conductive reinforcing plate 15 is bonded can be reasonably built into a small device, and the strength sufficient to support the mounted electronic component. Have Further, a metal layer such as Ni or Au may be formed on the surface of the conductive reinforcing plate 15 by plating or the like. The surface of the conductive reinforcing plate 15 may be provided with an uneven shape by sandblasting, etching, or the like.
  • examples of the electronic component here include a chip component such as a resistor and a capacitor in addition to a connector and an IC.
  • a method for manufacturing the shield printed wiring board 32 will be described.
  • a conductive adhesive film to be the conductive adhesive layer 4 is placed on the conductive reinforcing plate 15 and is heated and pressed with a press to produce a conductive adhesive film with a reinforcing plate.
  • a conductive adhesive film with a reinforcing plate is placed on the printed wiring board 47 and pressed while being heated by a press. A part of the adhesive layer 4 softened by heating flows into the opening 45 by pressurization.
  • the conductive reinforcing plate 15 is attached to the printed wiring board 47 via the adhesive layer 4, and the conductive reinforcing plate 15 and the printed circuit 42 of the printed wiring board 47 are connected via the conductive adhesive.
  • the conductive reinforcing plate 15 and the printed circuit 42 are brought into conduction. Therefore, the electromagnetic wave shielding ability by the conductive reinforcing plate 15 can be obtained.
  • the present invention can also be applied to rigid printed wiring boards. Furthermore, the present invention can be applied not only to a single-side shielded wiring board but also to a double-sided shield wiring board.
  • Examples 1 to 3, Comparative Examples 1 to 3 ⁇ Preparation of conductive adhesive composition>
  • the conductive adhesive compositions of Examples 1 to 3 and Comparative Examples 1 to 5 having the composition (mass%) shown in Table 1 were produced by the following production method.
  • the following materials constituting the resin composition shown in Table 1 are mixed with silver-coated copper powder that is a conductive filler and spherical silica particles that are inorganic particles to produce a paste-like conductive adhesive composition. did.
  • Thermoplastic resin Polyamide resin having a complex viscosity at 150 ° C. of 8.2 ⁇ 10 3 Pa ⁇ s and a terminal being an anhydrous carboxyl group
  • Thermosetting resin Glycidylamine epoxy resin (trade name: jER604, manufactured by Mitsubishi Chemical) )
  • Silane coupling agent Shin-Etsu Silicone
  • Cyanate-based curing agent Lonza Japan
  • an electromagnetic wave shielding film was produced using the above-mentioned conductive adhesive composition. More specifically, a PET film having a thickness of 60 ⁇ m and a release treatment applied to the surface was used as the support substrate. Next, a protective layer composition (solid content 30% by mass) consisting of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and methyl ethyl ketone is applied onto the support substrate and dried by heating. Thus, a supporting substrate with a protective layer having a thickness of 5 ⁇ m was produced.
  • a shield layer was formed on the surface of the protective layer. More specifically, a rolled copper foil having a thickness of 2 ⁇ m was bonded to the protective layer.
  • the printed wiring board has two copper foil patterns extending parallel to each other at an interval, and has an insulating layer (thickness: 25 ⁇ m) made of polyimide, covering the copper foil pattern. An opening (diameter: 0.8 mm) for exposing the copper foil pattern was provided. Moreover, the adhesive layer of the electromagnetic wave shielding film and the printed wiring board were overlapped so that the opening was completely covered with the electromagnetic wave shielding film.
  • the printed wiring board which the edge part of the copper foil pattern was not covered with the insulating layer and the edge part of the copper foil pattern was exposed was used.
  • the present invention is suitable for a conductive adhesive composition used for a printed wiring board.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
PCT/JP2017/032554 2016-09-09 2017-09-08 導電性接着剤組成物 WO2018047957A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780051113.6A CN109563382A (zh) 2016-09-09 2017-09-08 导电性胶粘剂组合物
KR1020197004703A KR20190046796A (ko) 2016-09-09 2017-09-08 도전성 접착제 조성물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016177044A JP2018039959A (ja) 2016-09-09 2016-09-09 導電性接着剤組成物
JP2016-177044 2016-09-09

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JP (1) JP2018039959A (zh)
KR (1) KR20190046796A (zh)
CN (1) CN109563382A (zh)
TW (1) TWI699787B (zh)
WO (1) WO2018047957A1 (zh)

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JP2020204027A (ja) * 2019-06-12 2020-12-24 東洋インキＳｃホールディングス株式会社 導電性接着剤、及びプリント配線板
WO2022181570A1 (ja) * 2021-02-24 2022-09-01 タツタ電線株式会社 電磁波シールドフィルム
CN115038768A (zh) * 2020-02-19 2022-09-09 拓自达电线株式会社 导电性胶粘剂、电磁波屏蔽膜以及导电性粘结膜

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Publication number Priority date Publication date Assignee Title
KR102640186B1 (ko) * 2018-12-03 2024-02-22 타츠타 전선 주식회사 그라운드 부재 및 차폐 프린트 배선판
TWI800728B (zh) * 2019-05-20 2023-05-01 日商拓自達電線股份有限公司 導電性接著片
DE102020204215A1 (de) 2020-04-01 2021-10-07 Rampf Holding GmbH + Co. KG Leitfähiges Polyurethan
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