WO2018034063A1 - 積層レンズ構造体、カメラモジュール、及び積層レンズ構造体の製造方法 - Google Patents
積層レンズ構造体、カメラモジュール、及び積層レンズ構造体の製造方法 Download PDFInfo
- Publication number
- WO2018034063A1 WO2018034063A1 PCT/JP2017/023612 JP2017023612W WO2018034063A1 WO 2018034063 A1 WO2018034063 A1 WO 2018034063A1 JP 2017023612 W JP2017023612 W JP 2017023612W WO 2018034063 A1 WO2018034063 A1 WO 2018034063A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- lens structure
- laminated lens
- structure according
- recess
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00403—Producing compound lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00307—Producing lens wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/0048—Moulds for lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0073—Optical laminates
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Definitions
- the present disclosure relates to a laminated lens structure, a camera module, and a manufacturing method of the laminated lens structure.
- a lens is obtained by bringing a photocurable resin and a transfer body on which a transfer shape portion is formed into contact with each other, and deforming the photocurable resin according to the transfer shape of the transfer body.
- a technique that assumes modeling of a model such as an array is described.
- a substrate provided with an aperture, a lens inserted into the aperture and fixed to the substrate, and a portion where a side surface of the aperture and the surface of the substrate intersect with each other are provided.
- a laminated lens structure comprising a plurality of lens structures each having a recessed portion that is recessed from the surface of the substrate, and the lenses are arranged in the optical axis direction by bonding the substrates. Is done.
- the substrate provided with the aperture, the lens inserted into the aperture and fixed to the substrate, and the side surface of the aperture intersects the surface of the substrate.
- a laminated lens structure including a plurality of lens structures each having a recessed portion that is recessed from the surface of the substrate, and the lenses are arranged in the optical axis direction by bonding the substrates.
- an imaging device having an imaging surface on which a subject image is formed by the lens of the laminated lens structure.
- the substrate has an opening, and the substrate is provided with a recessed portion that is recessed from the surface of the substrate at a portion where the side surface of the opening and the surface of the substrate intersect.
- a step of inserting the first mold into the opening portion from the side where the recess portion is not provided to seal the opening portion a step of filling the opening portion with resin
- a laminated lens structure comprising: a step of inserting a second mold into the opening portion from the side where the recess is provided and pressing the second mold against the resin; and a step of curing the resin.
- FIG. 1 It is a schematic diagram which shows a part of manufacturing process of the lens module manufactured by a semiconductor process. It is a mimetic diagram showing composition of a lower replica substrate, a substrate, and an upper replica substrate concerning one embodiment of this indication. It is a schematic sectional drawing which shows the state which removed the lower replica board
- FIG. It is a schematic diagram which shows the camera module provided with the laminated lens structure which concerns on this embodiment, and a laminated lens structure. It is a schematic diagram which shows the variation of the shape of a dent part.
- FIG. 1 is a schematic diagram showing a part of a manufacturing process of a lens module manufactured by a semiconductor process.
- a substrate 2000 constituting a lens module is made of a material such as silicon (Si), for example, and an opening 2100 is formed in the substrate 2000 by a semiconductor process.
- the side surface of the opening 2100 is formed as a tapered surface having an angle of about 55 ° according to the crystal orientation.
- An antireflection film for suppressing reflection is formed on the side surface of the opening 2100.
- FIG. 1 shows that a lower replica substrate 1000 provided with a lower mold 1100 is closely attached to a substrate 2000 with an opening 2100 formed from below and a resin R is filled in the opening 2100.
- a process is shown in which the upper replica substrate 3000 provided is in close contact with the substrate 2000 from above.
- the resin R in the opening portion 2100 is formed by the lower replica substrate 1000 and the upper replica substrate 3000 which are imprint molds.
- the resin R is, for example, a light (ultraviolet ray) curable resin.
- the opening 2100 has a lower portion.
- a lens that follows the shapes of the mold 1100 and the upper mold 3100 is molded. After molding the lens, the lower mold 1100 and the upper mold 3100 are removed from the substrate 2000.
- the resin R is caused by capillary action. It protrudes from the upper surface 2010 of the substrate 2000. For this reason, when ultraviolet rays are irradiated, the resin that protrudes from the upper surface 2010 of the substrate 2000 is cured, and the upper surface 2010 becomes uneven.
- the upper surface 2010 is a surface that comes into contact with an adjacent substrate 2000 when a plurality of substrates 2000 are stacked to form a lens array.
- FIG. 2 is a schematic diagram illustrating configurations of the lower replica substrate 100, the substrate 200, and the upper replica substrate 300 according to an embodiment of the present disclosure.
- an opening 210 is formed in the substrate 200, and the side surface 212 of the opening 210 is a tapered surface that widens upward.
- a recessed portion 220 that is recessed from the upper surface 202 is provided at a position where the upper surface 202 and the side surface 212 of the substrate 200 intersect.
- the lower replica substrate 100 provided with the lower mold 110 is brought into close contact with the substrate 200 on which the opening portion 210 is formed from the lower side, and after filling the resin R into the opening portion 210,
- the upper replica substrate 300 provided with the mold 310 is brought into close contact with the substrate 200 from above.
- the lower surface 302 of the upper replica substrate 300 is brought closer to the upper surface 202 of the substrate 200, the interval between the lower surface 302 and the upper surface 202 becomes narrower, but the recessed portion 220 is provided at the edge of the opening 210.
- the recess 220 functions as an air buffer layer, and the seepage of the resin R into the upper surface 202 due to capillary action is reduced. Thereby, it can suppress that resin R protrudes on the upper surface 202.
- FIG. 3 and 4 are schematic cross-sectional views showing a state where the lower replica substrate 100 and the upper replica substrate 300 are removed after the resin R is cured.
- the lens 400 is formed by curing the resin R. By molding, the side surface 402 of the lens 400 is joined (fixed) to the side surface 212 of the aperture 210.
- the lens 400 has lens surfaces 404 and 406 that follow the shapes of the lower mold 110 and the upper mold 310.
- FIG. 3 shows a case where the upper surface 222 of the recessed portion 220 is located at a position lower than the uppermost portion of the lens surface 406.
- FIG. 4 shows a case where the upper surface 222 of the recessed portion 220 is positioned higher than the uppermost portion of the lens surface 406. As shown in FIG.
- FIG. 5 is a schematic diagram showing a laminated lens structure 800 according to the present embodiment and a camera module 900 including the laminated lens structure 800.
- the laminated lens structure 800 is configured by laminating a substrate 200 having a lens 400 as shown in FIGS. In FIG. 5, the upper substrate 200 and the lower substrate 200 are joined.
- the camera module 900 includes a laminated lens structure 800 and an image sensor 700.
- the laminated lens structure 800 forms a subject image on the imaging surface of the imaging device 700, and the imaging device 700 outputs an image signal corresponding to the amount of light of the subject image by photoelectric conversion.
- FIG. 6A to 6H are schematic diagrams showing variations in the shape of the recess 220.
- the shape of the recessed portion 220 is not particularly limited as long as it functions as an air buffer layer for suppressing the permeation of the resin R to the upper surface 202.
- FIG. 6A shows an example in which the recess 220 is configured by a flat upper surface 222 and a tapered side surface 224. The angle of the side surface 224 can be set to about 55 ° which is the same as the side surface of the opening 210.
- FIG. 6B shows an example in which the recess 220 is configured by a flat upper surface 222 and a vertical side surface 226. In particular, by using dry etching in the manufacturing process, the vertical side surface 226 can be formed.
- 6C shows an example in which the recessed portion 220 is configured only from the tapered surface 228.
- channel 230 is shown. 6D is the same as that of FIG. 6B.
- FIG. 6E shows an example in which the recessed portion 220 is formed from a curved surface 232 that is not flat.
- FIG. 6F shows an example in which the recessed portion 220 is configured from an acute-angled cut 234.
- 6G and 6H show an example in which the recessed portion 220 is configured from a plurality of acute angle cuts 236.
- FIG. 7A to 7D are schematic cross-sectional views showing an example in which an alignment mark 250 is provided adjacent to the recess 220.
- FIG. FIG. 7A shows an example in which an alignment mark 250 is provided adjacent to the recess 220 shown in FIG. 6B.
- FIG. 7B shows an example in which an alignment mark 250 is provided adjacent to the recess 220 shown in FIG. 6A.
- FIG. 7C shows an example in which the alignment mark 250 is provided adjacent to the recess 220 shown in FIG. 6B, and the side surface 212 of the aperture 210 is configured vertically.
- FIG. 7D shows an example in which the alignment mark 250 is provided adjacent to the recess 220 shown in FIG. 6A and the side surface 212 of the opening 210 is configured vertically.
- FIG. 7F is a schematic cross-sectional view showing an example in which an alignment mark 250 penetrating the substrate 200 is provided.
- FIG. 7E is a schematic cross-sectional view showing a configuration in which the alignment mark 250 is not provided in the configuration shown in FIG. 7F.
- the alignment mark 250 can be formed together with the formation of the recess 220 or the formation of the opening 210.
- FIG. 8 is a schematic cross-sectional view showing a process of stacking two substrates 200a and 200b to form one substrate 200 and molding a lens in the aperture 210.
- step S ⁇ b> 20 the substrate 200 is placed on the lower replica substrate 100, and the lower mold 110 is inserted into the opening 210.
- the resin R is filled in the opening portion 210.
- step S24 the upper replica substrate 300 is placed on the substrate 200, and the upper mold 310 is pressed against the resin R. Then, by irradiating ultraviolet rays, the resin R is cured and the lens 400 is molded.
- the upper replica substrate 300 and the lower replica substrate 100 are removed from the substrate 200.
- the recess 220 is provided on the substrate 200 a that contacts the upper replica substrate 300. In this way, even when a plurality of substrates 200 are bonded to form a single lens 400, the penetration of the resin R can be suppressed by providing the recess 220.
- the opening 210 of the upper substrate 200 is formed larger than the opening 210 of the lower substrate 200.
- FIG. 9A to 9C are schematic cross-sectional views showing a state in which three substrates 200 are laminated.
- FIG. 9A shows an example in which the tapered surfaces (side surfaces 212) of the opening portions 210 of all the substrates 200 are set in the same direction and the tapered surfaces are directed downward.
- FIG. 9B shows an example in which the uppermost substrate 200 is inverted with respect to FIG. 9A so that the tapered surface of the opening 210 faces upward.
- FIG. 9C shows an example in which the first and second substrates 200 from the top are inverted with respect to FIG. 9A so that the tapered surface of the opening 210 faces upward.
- FIG. 10 is a schematic cross-sectional view showing how the substrate 200 is warped due to the difference in thermal expansion coefficient.
- the diameter of the lens 400 increases and the amount of the resin R increases as the distance from the substrate 200 increases.
- the force F that the resin R pulls the substrate 200 increases toward the top of the substrate 200, so that the upper surface of the substrate 200 becomes concave. Warping occurs.
- the taper surfaces of the apertures 210 of the substrate 200 are all downward, and the volume of the lens 400 increases toward the bottom of each substrate 200, so the warpage in the direction indicated by the arrow increases.
- the lowermost substrate 200 is thicker than the other substrates 200, and the volume of the lens 400 is large.
- FIG. 11 is a schematic cross-sectional view showing the structure of a compound eye provided with two sets of lenses 400 having the structure shown in FIG. 9C.
- the first and second substrates 200 from the top are inverted and the tapered surface of the opening 210 is directed upward, so that the warpage of the entire stacked substrates 200 can be reduced. Is possible.
- FIGS. 12 to 14 are schematic cross-sectional views showing the method of manufacturing the substrate 200 in the order of steps.
- the method shown in FIG. 12 is a method of penetrating the opening 210 at the same time when forming the recess 220.
- a resist 500 is formed on the surface of the substrate 200 before processing, and the resist 500 is patterned by performing photolithography, subsequent etching, and the like.
- step S32 the region of the substrate 200 not covered with the resist 500 is etched by wet etching or dry etching using the resist 500 as a mask. Thereby, a recess 600 and an alignment mark 250 are formed on the surface of the substrate 200.
- the resist 500 is removed, and a new resist 510 is formed on the surface of the substrate 200 and patterned. At this time, the resist 510 is patterned so that a region wider than the recess 600 is opened.
- the substrate 200 is etched by wet etching or dry etching using the resist 510 as a mask.
- the bottom of the recess 600 is further etched to form an opening 610 that penetrates the substrate 200, thereby completing the opening 210.
- the recessed part 220 is formed when the recessed part 600 expands in a horizontal direction.
- the resist 510 is removed. As described above, the substrate 200 in which the recessed portion 220 is provided at the edge of the opening portion 210 can be manufactured.
- the method shown in FIG. 13 is a method of forming the opening 210 through the recess 620 after forming the recess 620 corresponding to the recess 220.
- a resist 530 is formed on the surface of the substrate 200 before processing, and the resist 530 is patterned by performing photolithography, subsequent etching, and the like.
- step S42 the region of the substrate 200 not covered with the resist 530 is etched by wet etching or dry etching. Thereby, a recess 620 and an alignment mark 250 are formed on the surface of the substrate 200.
- the resist 530 is removed, and a new resist 540 is formed on the surface of the substrate 200 and patterned. At this time, the resist 540 is patterned so that a range narrower than the bottom of the recess 620 is opened.
- the substrate 200 is etched using the resist 540 as a mask by wet etching or dry etching. As a result, a region narrower than the bottom of the recess 620 is further etched to form an opening 210 that penetrates the substrate 200. By further etching a region narrower than the bottom of the recess 620, the recess 220 is formed.
- the resist 540 is removed. As described above, the substrate 200 in which the recessed portion 220 is provided at the edge of the opening portion 210 can be manufactured.
- the method shown in FIG. 14 is a method in which the opening 210 is formed first, and then a recess is formed on the edge of the opening 210.
- a resist 550 is formed on the surface of the substrate 200 before processing, and the resist 550 is patterned by performing photolithography, subsequent etching, and the like.
- the resist 550 is used as a mask, and etching is performed by wet etching or dry etching so that the region of the substrate 200 not covered with the resist 550 penetrates. Thereby, an opening 210 and an alignment mark 250 are formed on the surface of the substrate 200.
- next step S54 the resist 550 is removed.
- next step S ⁇ b> 56 a recess 220 is formed at the edge of the opening 210.
- the formation method of the recessed part 220 may be based on etching, or may be based on machining or the like.
- the recess portion 220 is provided on the substrate 200.
- the upper replica substrate 300 may be provided with a recess portion having a similar function to suppress the seepage of the resin R due to the capillary phenomenon. is there.
- the recess portion 220 is formed at the edge of the aperture portion 210, so that the aperture portion 210 is filled.
- a substrate provided with an aperture, A lens inserted into the aperture and fixed to the substrate; Provided at a portion where the side surface of the hole portion and the surface of the substrate intersect, a recessed portion recessed from the surface of the substrate, A plurality of lens structures having A laminated lens structure in which the lenses are arranged in the optical axis direction by bonding the substrates.
- the recessed portion is parallel to the surface of the substrate, and has a first surface lower than the surface of the substrate, a second surface connecting the surface of the substrate and the first surface,
- the laminated lens structure according to (1) or (2) comprising: (4) The laminated lens structure according to (3), wherein the second surface is an inclined surface having a predetermined angle with respect to the surface of the substrate. (5) The laminated lens structure according to (3), wherein the second surface is a surface perpendicular to the surface of the substrate. (6) The laminated lens structure according to (1) or (2), wherein the concave portion is configured by an inclined surface having a predetermined angle with respect to the surface of the substrate.
- the substrate corresponding to one lens is configured by bonding a plurality of unit substrates, Any one of the above (1) to (9), wherein the opening formed in the unit substrate located on one surface side of the substrate is larger than the unit substrate located on the other surface side of the substrate.
- a side surface of the opening portion of the substrate is a tapered surface, A part of the plurality of substrates is arranged such that the tapered surface faces one side of the substrate,
- a laminated lens structure comprising a plurality of lens structures each having a recess recessed from the surface of the substrate, and the lenses are arranged in the optical axis direction by bonding the substrates;
- An imaging device having an imaging surface on which a subject image is formed by the lens of the laminated lens structure;
- a camera module The substrate having an opening, wherein the recess is provided in the portion where the side surface of the opening and the surface of the substrate intersect each other, the recess being recessed from the surface of the substrate.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Lens Barrels (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
なお、上記の効果は必ずしも限定的なものではなく、上記の効果とともに、または上記の効果に代えて、本明細書に示されたいずれかの効果、または本明細書から把握され得る他の効果が奏されてもよい。
1.前提となる技術
2.本開示に係るレンズ構造体の構成例
3.凹み部の形状のバリエーション
4.基板の積層について
5.凹み部を有する基板の製造方法
先ず、本開示の一実施形態の前提となる技術について説明する。図1は、半導体プロセスで製造されるレンズモジュールの製造工程の一部を示す模式図である。図1において、レンズモジュールを構成する基板2000は、例えばシリコン(Si)等の材料から構成され、基板2000には半導体プロセスによって開孔部2100が形成されている。開孔部2100の側面は、結晶方位に従い、55°程度の角度のテーパー面として形成される。開孔部2100の側面には、反射を抑えるための反射防止膜が形成されている。
図2は、本開示の一実施形態に係る下レプリカ基板100、基板200、上レプリカ基板300の構成を示す模式図である。図1と同様に、基板200には開孔部210が形成され、開孔部210の側面212は上に向かって広がるテーパー面とされている。基板200の上面202と側面212が交わる位置には、上面202よりも凹んだ凹み部220が設けられている。
図6A~図6Hは、凹み部220の形状のバリエーションを示す模式図である。凹み部220は、上面202への樹脂Rの浸み出しを抑えるための空気のバッファ層として機能するものであれば、その形状は特に限定されるものではない。図6Aは、凹み部220を平坦な上面222とテーパーの側面224から構成した例を示している。側面224の角度は、開孔部210の側面と同じ55°程度とすることができる。図6Bは、凹み部220を平坦な上面222と垂直の側面226から構成した例を示している。特にドライエッチングを製造工程で用いることで、垂直の側面226を形成することができる。図6Cは、凹み部220をテーパー面228のみから構成した例を示している。図6Dの右側では、凹み部220を溝230から構成した例を示している。図6Dの左側の凹み部220は、図6Bと同様である。
基板200としてシリコン基板を用いる場合、一例として、基板200として用いるシリコンウェハの1枚の厚さは規格で定められた725μmまたは775μmとなる。レンズ400の厚さが大きく、基板200の厚さが不足する場合は、基板200を複数貼り合わせて1枚のレンズ400を成形する。
次に、開孔部210の縁に凹み部220を設けた基板200の製造方法について説明する。ここでは、図12~図14に示す3通りの製造方法についてそれぞれ説明する。図12~図14は、基板200の製造方法を工程順に示す概略断面図である。
(1) 開孔部が設けられた基板と、
前記開孔部に挿入されて前記基板に固定されたレンズと、
前記開孔部の側面と前記基板の表面とが交わる部位に設けられ、前記基板の表面よりも凹んだ凹み部と、
を有するレンズ構造体を複数備え、
それぞれの前記基板が接合されることで前記レンズが光軸方向に配列された、積層レンズ構造体。
(2) 前記凹み部は、前記開孔部の縁に設けられた、前記(1)に記載の積層レンズ構造体。
(3) 前記凹み部は、前記基板の表面と平行であり、前記基板の表面よりも低い第1の面と、前記基板の表面と前記第1の面とを接続する第2の面と、から構成される、前記(1)又は(2)に記載の積層レンズ構造体。
(4) 前記第2の面は、前記基板の表面に対して所定の角度を有する斜面である、前記(3)に記載の積層レンズ構造体。
(5) 前記第2の面は、前記基板の表面に対して垂直な面である、前記(3)に記載の積層レンズ構造体。
(6) 前記凹み部は、前記基板の表面に対して所定の角度を有する斜面から構成される、前記(1)又は(2)に記載の積層レンズ構造体。
(7) 前記凹み部は、前記基板の表面に対して溝状に構成される、前記(1)又は(2)に記載の積層レンズ構造体。
(8) 前記凹み部は、前記基板の表面に対して凹んだ曲面から構成される、前記(1)又は(2)に記載の積層レンズ構造体。
(9) 前記凹み部は、前記基板の表面に形成された鋭角の切り込みから構成される、前記(1)又は(2)に記載の積層レンズ構造体。
(10) 前記基板の前記表面には前記基板を積層する際の位置決めとなるアライメントマークが形成された、請求項1に記載の積層レンズ構造体。
(11) 1のレンズに対応する前記基板は複数の単位基板を貼り合わせることで構成され、
前記基板の一方の面側に位置する前記単位基板に形成された前記開孔部は、前記基板の他方の面側に位置する前記単位基板よりも大きい、前記(1)~(9)のいずれかに記載の積層レンズ構造体。
(12) 前記基板の前記開孔部の側面はテーパー面とされ、
複数の前記基板の一部は、前記テーパー面が前記基板の一方の側に向くように配置され、
複数の前記基板の残りは、前記テーパー面が前記基板の他方を向くように配置された、前記(1)~(10)のいずれかに記載の積層レンズ構造体。
(13) 開孔部が設けられた基板と、前記開孔部に挿入されて前記基板に固定されたレンズと、前記開孔部の側面と前記基板の表面とが交わる部位に設けられ、前記基板の表面よりも凹んだ凹み部と、を有するレンズ構造体を複数備え、それぞれの前記基板が接合されることで前記レンズが光軸方向に配列された、積層レンズ構造体と、
前記積層レンズ構造体の前記レンズによって被写体像が結像される撮像面を有する撮像素子と、
を備える、カメラモジュール。
(14) 開孔部を有する基板であって、前記開孔部の側面と前記基板の表面とが交わる部位に前記基板の表面よりも凹んだ凹み部が設けられた前記基板に対し、前記凹み部が設けられていない側から第1の型を前記開孔部に挿入して前記開孔部を封止する工程と、
前記開孔部に樹脂を充填する工程と、
前記凹み部が設けられた側から第2の型を前記開孔部に挿入して前記第2の型を樹脂に押し当てる工程と、
前記樹脂を硬化させる工程と、
を含む、積層レンズ構造体の製造方法。
110 下型
200 基板
210 開孔部
212 側面
220 凹み部
222 上面
224,226 側面
228 テーパー面
230 溝
232 曲面
234,236 切り込み
250 アライメントマーク
300 上レプリカ基板
310 上型
400 レンズ
700 撮像素子
800 積層レンズ構造体
900 カメラモジュール
Claims (14)
- 開孔部が設けられた基板と、
前記開孔部に挿入されて前記基板に固定されたレンズと、
前記開孔部の側面と前記基板の表面とが交わる部位に設けられ、前記基板の表面よりも凹んだ凹み部と、
を有するレンズ構造体を複数備え、
それぞれの前記基板が接合されることで前記レンズが光軸方向に配列された、積層レンズ構造体。 - 前記凹み部は、前記開孔部の縁に設けられた、請求項1に記載の積層レンズ構造体。
- 前記凹み部は、前記基板の表面と平行であり、前記基板の表面よりも低い第1の面と、前記基板の表面と前記第1の面とを接続する第2の面と、から構成される、請求項1に記載の積層レンズ構造体。
- 前記第2の面は、前記基板の表面に対して所定の角度を有する斜面である、請求項3に記載の積層レンズ構造体。
- 前記第2の面は、前記基板の表面に対して垂直な面である、請求項3に記載の積層レンズ構造体。
- 前記凹み部は、前記基板の表面に対して所定の角度を有する斜面から構成される、請求項1に記載の積層レンズ構造体。
- 前記凹み部は、前記基板の表面に対して溝状に構成される、請求項1に記載の積層レンズ構造体。
- 前記凹み部は、前記基板の表面に対して凹んだ曲面から構成される、請求項1に記載の積層レンズ構造体。
- 前記凹み部は、前記基板の表面に形成された鋭角の切り込みから構成される、請求項1に記載の積層レンズ構造体。
- 前記基板の前記表面には前記基板を積層する際の位置決めとなるアライメントマークが形成された、請求項1に記載の積層レンズ構造体。
- 1のレンズに対応する前記基板は複数の単位基板を貼り合わせることで構成され、
前記基板の一方の面側に位置する前記単位基板に形成された前記開孔部は、前記基板の他方の面側に位置する前記単位基板よりも大きい、請求項1に記載の積層レンズ構造体。 - 前記基板の前記開孔部の側面はテーパー面とされ、
複数の前記基板の一部は、前記テーパー面が前記基板の一方の側に向くように配置され、
複数の前記基板の残りは、前記テーパー面が前記基板の他方を向くように配置された、請求項1に記載の積層レンズ構造体。 - 開孔部が設けられた基板と、前記開孔部に挿入されて前記基板に固定されたレンズと、前記開孔部の側面と前記基板の表面とが交わる部位に設けられ、前記基板の表面よりも凹んだ凹み部と、を有するレンズ構造体を複数備え、それぞれの前記基板が接合されることで前記レンズが光軸方向に配列された、積層レンズ構造体と、
前記積層レンズ構造体の前記レンズによって被写体像が結像される撮像面を有する撮像素子と、
を備える、カメラモジュール。 - 開孔部を有する基板であって、前記開孔部の側面と前記基板の表面とが交わる部位に前記基板の表面よりも凹んだ凹み部が設けられた前記基板に対し、前記凹み部が設けられていない側から第1の型を前記開孔部に挿入して前記開孔部を封止する工程と、
前記開孔部に樹脂を充填する工程と、
前記凹み部が設けられた側から第2の型を前記開孔部に挿入して前記第2の型を樹脂に押し当てる工程と、
前記樹脂を硬化させる工程と、
を含む、積層レンズ構造体の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020197003732A KR102419074B1 (ko) | 2016-08-15 | 2017-06-27 | 적층 렌즈 구조체, 카메라 모듈 및 적층 렌즈 구조체의 제조 방법 |
JP2018534288A JP6979952B2 (ja) | 2016-08-15 | 2017-06-27 | 積層レンズ構造体、カメラモジュール、及び積層レンズ構造体の製造方法 |
US16/323,917 US10866345B2 (en) | 2016-08-15 | 2017-06-27 | Laminated lens structure, camera module, and method for manufacturing laminated lens structure |
CN201780047541.1A CN109564335B (zh) | 2016-08-15 | 2017-06-27 | 层叠透镜结构、相机模块和层叠透镜结构的制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016159249 | 2016-08-15 | ||
JP2016-159249 | 2016-08-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018034063A1 true WO2018034063A1 (ja) | 2018-02-22 |
Family
ID=61197208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/023612 WO2018034063A1 (ja) | 2016-08-15 | 2017-06-27 | 積層レンズ構造体、カメラモジュール、及び積層レンズ構造体の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10866345B2 (ja) |
JP (1) | JP6979952B2 (ja) |
KR (1) | KR102419074B1 (ja) |
CN (1) | CN109564335B (ja) |
TW (1) | TWI770034B (ja) |
WO (1) | WO2018034063A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10203431B2 (en) * | 2016-09-28 | 2019-02-12 | Ricoh Company, Ltd. | Microlens array, image display apparatus, object apparatus, and mold |
KR20200104463A (ko) * | 2019-02-26 | 2020-09-04 | 삼성디스플레이 주식회사 | 표시 장치 |
KR20200124796A (ko) * | 2019-04-24 | 2020-11-04 | 삼성디스플레이 주식회사 | 표시 장치 제조 방법, 표시 장치용 보호 필름, 및 이를 제조하는 벤딩 패널 제조장치 |
CN110376699B (zh) * | 2019-07-26 | 2021-12-03 | 业成科技(成都)有限公司 | 镜片对位方法、镜头模组及成像装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007163889A (ja) * | 2005-12-14 | 2007-06-28 | Seiko Precision Inc | 撮像装置及びその製造方法 |
JP2009003130A (ja) * | 2007-06-20 | 2009-01-08 | Sharp Corp | レンズユニット、レンズユニットの製造方法および撮像装置 |
JP2011508253A (ja) * | 2007-12-19 | 2011-03-10 | ヘプタゴン・オサケ・ユキチュア | 光学要素の製造 |
JP2012533775A (ja) * | 2009-12-21 | 2012-12-27 | フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー.ファオ | 光学積層体およびその製造方法 |
JP2015011072A (ja) * | 2013-06-26 | 2015-01-19 | 住友ベークライト株式会社 | レンズシート、光導波路、光電気混載基板、光モジュールおよび電子機器 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001300944A (ja) * | 2000-04-20 | 2001-10-30 | Sony Corp | 複合レンズの成形方法及び複合レンズ |
CN100517737C (zh) * | 2006-10-25 | 2009-07-22 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器封装结构 |
JP4226067B2 (ja) | 2007-06-14 | 2009-02-18 | Aji株式会社 | 造形方法、レンズの製造方法、及び造形装置 |
JP2009279790A (ja) * | 2008-05-20 | 2009-12-03 | Sharp Corp | レンズ及びその製造方法、並びに、レンズアレイ、カメラモジュール及びその製造方法、電子機器 |
JP4764942B2 (ja) * | 2008-09-25 | 2011-09-07 | シャープ株式会社 | 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器 |
KR101634353B1 (ko) * | 2008-12-04 | 2016-06-28 | 삼성전자주식회사 | 마이크로 렌즈, 상기 마이크로 렌즈 제조방법, 상기 마이크로 렌즈 제조 장치, 및 상기 마이크로 렌즈를 구비한카메라 모듈 |
KR101648540B1 (ko) * | 2009-08-13 | 2016-08-16 | 삼성전자주식회사 | 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치 |
JP2011180292A (ja) * | 2010-02-26 | 2011-09-15 | Fujifilm Corp | レンズアレイ |
JP2011180293A (ja) * | 2010-02-26 | 2011-09-15 | Fujifilm Corp | レンズアレイ |
FR2963114B1 (fr) * | 2010-07-26 | 2013-05-10 | Commissariat Energie Atomique | Dispositif optique, boitier a l'echelle d'une tranche pour un tel dispositif optique et procede correspondant. |
US8810933B2 (en) * | 2011-06-30 | 2014-08-19 | Lg Innotek Co., Ltd. | Lens unit, manufacturing method of the same, and camera module including the same |
JP2013122480A (ja) * | 2011-12-09 | 2013-06-20 | Konica Minolta Advanced Layers Inc | ウエハレンズおよびその製造方法 |
US9625684B2 (en) * | 2013-05-09 | 2017-04-18 | Google Technology Holdings LLC | Lens laminate and method |
EP3037852A4 (en) * | 2013-08-20 | 2017-03-22 | Daicel Corporation | Wafer lens, wafer lens array, wafer lens laminate, and wafer lens array laminate |
NL2012262C2 (en) * | 2014-02-13 | 2015-08-17 | Anteryon Wafer Optics B V | Method of fabricating a wafer level optical lens assembly. |
JP6967830B2 (ja) * | 2015-07-31 | 2021-11-17 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、レンズモジュール及びその製造方法、並びに、電子機器 |
JP2017032798A (ja) * | 2015-07-31 | 2017-02-09 | ソニーセミコンダクタソリューションズ株式会社 | レンズ付き基板、積層レンズ構造体、カメラモジュール、並びに、製造装置および方法 |
-
2017
- 2017-06-26 TW TW106121184A patent/TWI770034B/zh active
- 2017-06-27 CN CN201780047541.1A patent/CN109564335B/zh active Active
- 2017-06-27 WO PCT/JP2017/023612 patent/WO2018034063A1/ja active Application Filing
- 2017-06-27 US US16/323,917 patent/US10866345B2/en active Active
- 2017-06-27 JP JP2018534288A patent/JP6979952B2/ja active Active
- 2017-06-27 KR KR1020197003732A patent/KR102419074B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007163889A (ja) * | 2005-12-14 | 2007-06-28 | Seiko Precision Inc | 撮像装置及びその製造方法 |
JP2009003130A (ja) * | 2007-06-20 | 2009-01-08 | Sharp Corp | レンズユニット、レンズユニットの製造方法および撮像装置 |
JP2011508253A (ja) * | 2007-12-19 | 2011-03-10 | ヘプタゴン・オサケ・ユキチュア | 光学要素の製造 |
JP2012533775A (ja) * | 2009-12-21 | 2012-12-27 | フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー.ファオ | 光学積層体およびその製造方法 |
JP2015011072A (ja) * | 2013-06-26 | 2015-01-19 | 住友ベークライト株式会社 | レンズシート、光導波路、光電気混載基板、光モジュールおよび電子機器 |
Also Published As
Publication number | Publication date |
---|---|
JP6979952B2 (ja) | 2021-12-15 |
CN109564335A (zh) | 2019-04-02 |
CN109564335B (zh) | 2022-09-16 |
KR20190039119A (ko) | 2019-04-10 |
JPWO2018034063A1 (ja) | 2019-06-13 |
TWI770034B (zh) | 2022-07-11 |
TW201825931A (zh) | 2018-07-16 |
US20190162880A1 (en) | 2019-05-30 |
KR102419074B1 (ko) | 2022-07-07 |
US10866345B2 (en) | 2020-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2018034063A1 (ja) | 積層レンズ構造体、カメラモジュール、及び積層レンズ構造体の製造方法 | |
KR102414837B1 (ko) | 전자 모듈과 그 제조 방법 및 이를 구비하는 카메라 모듈 | |
JP2004312666A (ja) | 固体撮像装置及び固体撮像装置の製造方法 | |
TW200532761A (en) | Micro-optics on optoelectronics | |
TWI782897B (zh) | 光學元件堆疊組件 | |
TWI593091B (zh) | 光學晶圓之製造 | |
JP6300466B2 (ja) | マスクブランク用基板、マスクブランク、インプリントモールド、およびそれらの製造方法 | |
US20060018029A1 (en) | Manufacturing of optical units for semiconductor packages with optical sensors | |
TW201947277A (zh) | 光控濾光片 | |
JP2009122162A (ja) | 光基板の製造方法及び光基板、光集積回路、光インターコネクタ、光合分波器 | |
JP2006005071A (ja) | 半導体装置用パッケージおよび半導体装置ならびに半導体装置用パッケージの製造方法 | |
KR101856481B1 (ko) | 광 디바이스용 기판 및 그 제조방법 및 광 디바이스 | |
JP2005134690A (ja) | 光学素子の製造方法 | |
KR100983043B1 (ko) | 마이크로 렌즈용 마스터 및 마이크로 렌즈 제조방법 | |
US20220137269A1 (en) | Method of manufacturing a plurality of optical elements and product thereof | |
JP2010052172A (ja) | 合成樹脂の成形装置 | |
KR100906637B1 (ko) | 마스터 기판 형성용 코어 및 이를 이용한 마스터 기판제조방법 | |
US20220168978A1 (en) | Wafer alignment features | |
JP2005300715A (ja) | 三次元構造体の製造方法 | |
TWI492839B (zh) | 晶圓級光學元件的製造方法及結構 | |
WO2024004211A1 (ja) | 半導体装置の製造方法、半導体装置、集積回路要素の製造方法、及び集積回路要素 | |
US20220040941A1 (en) | Yard control | |
TWM604272U (zh) | 三維列印裝置 | |
JP2008058738A (ja) | 光学素子及びその製造方法 | |
JP2007201164A (ja) | 電子部品用ガラスキャップ成形工法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17841291 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2018534288 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20197003732 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 17841291 Country of ref document: EP Kind code of ref document: A1 |