WO2017215063A1 - 柔性oled的制作方法及柔性oled - Google Patents

柔性oled的制作方法及柔性oled Download PDF

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WO2017215063A1
WO2017215063A1 PCT/CN2016/089956 CN2016089956W WO2017215063A1 WO 2017215063 A1 WO2017215063 A1 WO 2017215063A1 CN 2016089956 W CN2016089956 W CN 2016089956W WO 2017215063 A1 WO2017215063 A1 WO 2017215063A1
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film
flexible
polymer film
magnetic
oled
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PCT/CN2016/089956
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English (en)
French (fr)
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李文杰
曾维静
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深圳市华星光电技术有限公司
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Priority to US15/121,038 priority Critical patent/US20180226609A1/en
Publication of WO2017215063A1 publication Critical patent/WO2017215063A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating a flexible OLED and a flexible OLED.
  • An OLED (Organic Light-Emitting Diode) display also known as an organic electroluminescent display, is an emerging flat panel display device which has a simple manufacturing process, low cost, low power consumption, and high luminance.
  • the working temperature has wide adaptability, light volume, fast response, easy to realize color display and large screen display, easy to realize integration with integrated circuit driver, easy to realize flexible display, and the like, and thus has broad application prospects.
  • Flexible OLED panels have become an important research direction of organic light-emitting devices.
  • Flexible substrates have been chosen to replace traditional glass substrates to achieve the flexibility of panels.
  • Commonly used flexible substrates include metal films (aluminum foil or copper foil) and polymer films (such as poly Imide, etc.). Compared with the polymer film, the metal film has good flexibility and light weight.
  • the OLED device is made of a polymer film as a flexible substrate, the polymer emulsion is uniformly coated on the carrier substrate to obtain a polymer. The film is then fabricated into an OLED device on the polymer film, and the polymer film is stripped from the carrier substrate after the OLED device is fabricated.
  • FIG. 1 it is a schematic diagram of the peeling of the conventional flexible substrate and the carrier substrate.
  • the common peeling methods are mechanical delamination and laser-lift-off delamination.
  • the mechanical peeling method is simple but It is easy to cause warpage of the flexible substrate, and there is literature indicating that a voltage drop occurs between the polymer flexible substrate and the carrier substrate during the stripping process, and the accumulated charge destroys the TFT layer of the OLED device; the laser stripping method can avoid the above The problem of voltage drop, but the operation is expensive. Therefore, a peeling method that does not damage the flexible substrate and the TFT layer is proposed, which is particularly important for the development of flexible display devices.
  • the organic light-emitting device is very sensitive to water vapor and oxygen.
  • the penetration of water and oxygen greatly reduces the life of the device.
  • the polymer substrate has a small molecular weight and the loose cross-linking between the molecular chains makes the structure loose and porous. More, increasing the possibility of water vapor entering the device.
  • the object of the present invention is to provide a method for fabricating a flexible OLED, which is simple and easy, and can realize non-destructive separation of the flexible substrate and the carrier substrate by degaussing the carrier substrate, thereby improving flexibility. Device performance of OLEDs.
  • the present invention first provides a method for fabricating a flexible OLED, comprising the following steps:
  • Step 1 Providing a magnetic substrate and a flexible magnetic film, wherein the magnetic substrate is magnetically controllable, and the flexible magnetic film is fixed on the magnetic substrate by magnetic attraction;
  • Step 2 forming a polymer film on the flexible magnetic film
  • Step 3 forming an OLED device on the polymer film
  • Step 4. Encapsulate the OLED device.
  • the flexible magnetic film is a metal film; the material of the polymer film comprises one of polyimide, polyurethane, polyether sulfone resin, polyethylene naphthalate, polyvinyl alcohol, and polyether ether ketone. kind or more.
  • the manufacturing method of the flexible OLED further includes: before step 4 after step 3 or after step 4, demagnetizing the magnetic substrate to remove the magnetic properties of the magnetic substrate, and removing the magnetic substrate from the flexible magnetic film.
  • the step 4 is: forming a package film on the polymer film and the OLED device, the package film coating the top surface and the side surface of the OLED device to complete packaging of the OLED device; A composite film formed by laminating a layer of an organic film and a plurality of inorganic films.
  • the step 4 includes:
  • Step 41 applying a ring of glue on the polymer film on the periphery of the OLED device, and setting a desiccant on the polymer film on the inner side of the glue;
  • Step 42 Providing a package cover plate, and fitting the package cover plate to a side of the polymer film provided with a glue material and a desiccant;
  • Step 43 curing the glue material to complete packaging of the OLED device.
  • the viscosity of the rubber material is 100-1000 Pa ⁇ s;
  • the desiccant is a liquid desiccant, the liquid desiccant has a viscosity of 0.4 to 0.5 Pa ⁇ s, and in the step 41, the liquid desiccant is applied to a region of the polymer film located inside the rubber material;
  • the package cover is a transparent flexible glass substrate
  • the method of curing the rubber material comprises one or more of UV irradiation curing and heat curing.
  • the present invention also provides a flexible OLED comprising a flexible magnetic film, a polymer film disposed on the flexible magnetic film, an OLED device disposed on the polymer film, and the OLED device and the polymer film. And covering the top and side of the OLED device with a package film.
  • the flexible magnetic film is a metal film; the material of the polymer film comprises one of polyimide, polyurethane, polyether sulfone resin, polyethylene naphthalate, polyvinyl alcohol, and polyether ether ketone. Or a plurality of; the encapsulating film is a composite film formed by overlapping a plurality of organic thin films and a plurality of inorganic thin films.
  • the present invention also provides another flexible OLED comprising a flexible magnetic film, a polymer film disposed on the flexible magnetic film, an OLED device disposed on the polymer film, above the polymer film and the OLED device a package cover, a glue between the polymer film and the package cover and located at the periphery of the OLED device, and a desiccant between the polymer film and the package cover and located inside the glue.
  • the flexible magnetic film is a metal film; the material of the polymer film comprises one of polyimide, polyurethane, polyether sulfone resin, polyethylene naphthalate, polyvinyl alcohol, and polyether ether ketone.
  • the desiccant is a liquid desiccant, the liquid desiccant has a viscosity of 0.4-0.5 Pa ⁇ s; and the package cover is a transparent flexible glass substrate.
  • the present invention provides a method for fabricating a flexible OLED, which uses a magnetic substrate as a carrier substrate, and magnetically adsorbs the flexible magnetic film on the magnetic substrate, and then forms a polymer film on the flexible magnetic film.
  • the OLED device is fabricated on the polymer film, and the OLED device is packaged to complete the fabrication of the flexible OLED.
  • the fabrication method is simple, and the magnetic substrate can be demagnetized to achieve non-destructive separation between the flexible magnetic film and the magnetic substrate.
  • the flexible magnetic film is preferably a metal film having a good moisture barrier property, which can reduce the water vapor transmission rate and improve the stability of the OLED device.
  • the reliability of OLED device performance is further enhanced by packaging OLED devices.
  • the invention provides a flexible OLED with simple process and excellent performance.
  • 1 is a schematic view showing the peeling of a conventional flexible substrate and a carrier substrate
  • FIG. 2 is a flow chart of a method of fabricating a flexible OLED of the present invention
  • FIG. 3 is a schematic view of steps 1-3 of the method for fabricating a flexible OLED of the present invention.
  • FIG. 4 is a schematic view of a first embodiment of step 4 of the method for fabricating a flexible OLED of the present invention.
  • FIG 5 is a schematic view showing a second embodiment of the step 4 of the method for fabricating the flexible OLED of the present invention and a second embodiment of the flexible OLED of the present invention.
  • the present invention firstly provides a method for fabricating a flexible OLED, comprising the following steps:
  • Step 1 please refer to FIG. 3, a magnetic substrate 10 and a flexible magnetic film 20 are provided.
  • the magnetic substrate 10 is magnetically controllable, and the flexible magnetic film 20 is fixed on the magnetic substrate 10 by magnetic attraction.
  • the flexible magnetic film 20 is a metal film.
  • the thickness of the metal film is less than 100 ⁇ m, it exhibits good flexibility, and has good thermal stability and water vapor barrier capability, and can be effective for forming an OLED device. Protection, the performance of the OLED device is stable, and the service life is extended.
  • the material of the metal film is Invar.
  • the metal thin film has a thickness of 10 ⁇ m to 100 ⁇ m.
  • the present invention does not require a material of the magnetic substrate 10, and only needs to be controlled by magnetic properties.
  • the magnetic substrate 10 is an electromagnet, and is magnetic when energized, and the magnet disappears after power-off.
  • Step 2 Referring to FIG. 3, a polymer film 30 is formed on the flexible magnetic film 20.
  • the polymer film 30 is formed on the flexible magnetic film 20 by a spin coating method or a chemical vapor deposition method.
  • the thickness of the polymer film 30 can be controlled by adjusting parameters such as the concentration of the raw material, the time and speed of spin coating or deposition.
  • the material of the polymer film 30 includes one or more of polyimide, polyurethane, polyether sulfone resin, polyethylene naphthalate, polyvinyl alcohol, and polyether ether ketone.
  • the polymer film 30 has a thickness of 10 ⁇ m to 200 ⁇ m.
  • the flexible magnetic film 20 has a certain fixing and supporting effect on the polymer film 30.
  • the polymer film 30 has the same area as the flexible magnetic film 20.
  • Step 3 Referring to FIG. 3, an OLED device 40 is formed on the polymer film 30.
  • the OLED device 40 includes a TFT layer 41, an organic light emitting layer 42 on the TFT layer 41, and a protective layer 43 on the organic light emitting layer 42.
  • Step 4 Referring to FIG. 4 or FIG. 5, the OLED device 40 is packaged.
  • the step 4 may be: forming a package film 50 on the polymer film 30 and the OLED device 40, the package film 50 covering the top surface and the side surface of the OLED device 40, The encapsulation of the OLED device 40 is completed.
  • the encapsulating film 50 is a composite film formed by overlapping a plurality of organic thin films and a plurality of inorganic thin films.
  • the material of the inorganic thin film may be an oxynitride of silicon
  • the material of the organic thin film may be an organic high molecular material.
  • the thickness of the package film 50 is 1 ⁇ m to 50 ⁇ m.
  • the encapsulation film 50 is produced by one or more methods of evaporation, sputtering, and vapor deposition.
  • the package film 50 can be integrated on the whole surface during packaging, has a good water vapor barrier capability, prevents moisture from entering the inside of the OLED device 40, and prolongs the service life of the device.
  • the step 4 may also include:
  • Step 41 Apply a circle of glue 60 to the area of the polymer film 30 located at the periphery of the OLED device 40, and a desiccant 70 is disposed on the area of the polymer film 30 inside the glue 60.
  • the viscosity of the rubber material 60 is 100 to 1000 Pa ⁇ s.
  • Step 42 A package cover 80 is provided, and the package cover 80 is attached to one side of the polymer film 30 on which the glue 60 and the desiccant 70 are disposed.
  • Step 43 curing the glue material 60 to complete packaging of the OLED device 40.
  • the desiccant 70 is a liquid desiccant.
  • the liquid desiccant is applied to a region of the polymer film 30 located inside the glue 60.
  • the liquid desiccant has a viscosity of 0.4 to 0.5 Pa ⁇ s.
  • the package cover 80 is a transparent flexible glass substrate.
  • the method for curing the rubber material 60 includes one or more of UV (ultraviolet light) irradiation curing and heat curing.
  • the above packaging method can prevent moisture from entering the inside of the OLED device 40 from the side of the device and the surface of the package cover 80, thereby extending the service life of the OLED device 40.
  • the method for fabricating the flexible OLED further includes: before step 4 after step 3 or after step 4, demagnetizing the magnetic substrate 10 to remove the magnetic properties of the magnetic substrate 10, and removing the magnetic substrate 10 from the flexible magnetic film. Removed on 20.
  • the magnetic substrate 10 is an electromagnet, the magnetic substrate 10 is demagnetized by a power-off method.
  • the present invention further provides a flexible OLED, including a flexible magnetic film 20, a polymer film 30 disposed on the flexible magnetic film 20, an OLED device 40 disposed on the polymer film 30, and the OLED device 40 and the polymer film 30 and covering the OLED device 40 The top and side of the encapsulation film 50.
  • the flexible magnetic film 20 and the polymer film 30 together constitute a flexible substrate of the OLED device 40.
  • the polymer film 30 has the same area as the flexible magnetic film 20.
  • the flexible magnetic film 20 is a metal film, and the material of the metal film is preferably Invar.
  • the metal thin film has a thickness of 10 ⁇ m to 100 ⁇ m.
  • the material of the polymer film 30 includes one or more of polyimide, polyurethane, polyether sulfone resin, polyethylene naphthalate, polyvinyl alcohol, and polyether ether ketone.
  • the polymer film 30 has a thickness of 10 ⁇ m to 200 ⁇ m.
  • the flexible magnetic film 20 has a certain fixing and supporting effect on the polymer film 30.
  • the OLED device 40 includes a TFT layer 41, an organic light emitting layer 42 on the TFT layer 41, and a protective layer 43 on the organic light emitting layer 42.
  • the encapsulating film 50 is a composite film formed by overlapping a plurality of organic thin films and a plurality of inorganic thin films.
  • the material of the inorganic thin film may be an oxynitride of silicon
  • the material of the organic thin film may be an organic high molecular material.
  • the thickness of the package film 50 is 1 ⁇ m to 50 ⁇ m.
  • the present invention further provides another flexible OLED, comprising a flexible magnetic film 20, a polymer film 30 disposed on the flexible magnetic film 20, and an OLED device 40 disposed on the polymer film 30.
  • a package cover 80 located above the polymer film 30 and the OLED device 40, a glue 60 located between the polymer film 30 and the package cover 80 and located at the periphery of the OLED device 40, and the polymer film A desiccant 70 between the 30 and the package cover 80 and located inside the glue 60.
  • the flexible magnetic film 20 and the polymer film 30 together constitute a flexible substrate of the OLED device 40.
  • the polymer film 30 has the same area as the flexible magnetic film 20.
  • the flexible magnetic film 20 is a metal film, and the material of the metal film is preferably Invar.
  • the metal thin film has a thickness of 10 ⁇ m to 100 ⁇ m.
  • the material of the polymer film 30 includes one or more of polyimide, polyurethane, polyether sulfone resin, polyethylene naphthalate, polyvinyl alcohol, and polyether ether ketone.
  • the polymer film 30 has a thickness of 10 ⁇ m to 200 ⁇ m.
  • the flexible magnetic film 20 has a certain fixing and supporting effect on the polymer film 30.
  • the OLED device 40 includes a TFT layer 41, an organic light emitting layer 42 on the TFT layer 41, and a protective layer 43 on the organic light emitting layer 42.
  • the desiccant 70 is a liquid desiccant.
  • the desiccant 70 completely fills a space enclosed by the glue 60 between the polymer film 30 and the package cover 80.
  • the liquid desiccant has a viscosity of 0.4 to 0.5 Pa ⁇ s.
  • the package cover 80 is a transparent flexible glass substrate.
  • the present invention provides a method for fabricating a flexible OLED and a flexible OLED.
  • the manufacturing method of the flexible OLED of the present invention uses a magnetic substrate as a carrier substrate, and the flexible magnetic film is fixed on the magnetic substrate by magnetic adsorption, and then a polymer film is formed on the flexible magnetic film, and an OLED device is fabricated on the polymer film. After the OLED device is packaged, the fabrication of the flexible OLED is completed.
  • the fabrication method is simple, and the magnetic substrate can be demagnetized to achieve non-destructive separation between the flexible magnetic film and the magnetic substrate.
  • the flexible magnetic film is preferably a metal film having a good moisture barrier property, which can reduce the water vapor transmission rate and improve the stability of the OLED device.
  • the reliability of OLED device performance is further enhanced by packaging OLED devices.
  • the flexible OLED of the invention has simple process and excellent performance.

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Abstract

一种柔性OLED的制作方法及柔性OLED。该制作方法，采用磁性基板（10）作为载体基板，通过磁力吸附使柔性磁性薄膜（20）固定于磁性基板上，之后在柔性磁性薄膜上形成聚合物薄膜（30），在聚合物薄膜上制作OLED器件（40），对OLED器件进行封装后，完成柔性OLED的制作，该制作方法简单，通过对磁性基板进行消磁即可实现柔性磁性薄膜和磁性基板之间的无损分离。另外，柔性磁性薄膜优选为具有良好的水汽阻隔能力的金属薄膜，可降低水汽通过率，提高OLED器件的稳定性。通过对OLED器件进行封装进一步提升了OLED器件性能的可靠性。该柔性OLED，制程简单，性能优异。

Description

柔性OLED的制作方法及柔性OLED 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性OLED的制作方法及柔性OLED。
背景技术
OLED(Organic Light-Emitting Diode，有机发光二极管)显示器，也称为有机电致发光显示器，是一种新兴的平板显示装置，由于其具有制作工艺简单、成本低、功耗低、发光亮度高、工作温度适应范围广、体积轻薄、响应速度快，而且易于实现彩色显示和大屏幕显示、易于实现和集成电路驱动器相匹配、易于实现柔性显示等优点，因而具有广阔的应用前景。
柔性OLED面板成为有机发光器件的重要研究方向，选择柔性衬底替代传统的玻璃基板以实现面板的可弯曲性，常用的柔性衬底包括金属薄膜(铝箔或铜箔)和聚合物薄膜(如聚酰亚胺等)。金属薄膜和聚合物薄膜相比，后者具有良好的柔韧性并且质地轻薄，以聚合物薄膜为柔性衬底制作OLED器件时，常将聚合物乳液均匀涂布于载体基板上，制得聚合物薄膜，然后在聚合物薄膜上制作OLED器件，待OLED器件制作好后再将聚合物薄膜从载体基板上剥离。
如图1所示，为传统的柔性衬底与载体基板的剥离示意图，常见的剥离方式有机械剥离法(Mechanical delamination)和镭射剥离法(Laser-lift-off delamination)，机械剥离法操作简单但是容易造成柔性衬底的翘曲，并且有文献表明在剥离过程中聚合物柔性衬底和载体基板之间会产生电压降，累计的电荷会破坏OLED器件的TFT层；采用镭射剥离法可以避免上述电压降的问题，但是操作费用昂贵。因此，提出一种不损坏柔性衬底和TFT层的剥离方式，对于柔性显示器件的开发尤为重要。
另外，有机发光器件对水汽和氧气非常敏感，水和氧的渗透会大大缩减器件的寿命，聚合物衬底由于其分子量小的缘故，并且分子链之间的疏松交联作用使得结构松散、孔洞较多，增加了水汽进入器件的可能性。
发明内容
本发明的目的在于提供一种柔性OLED的制作方法，简单易行，通过对载体基板进行消磁即可实现柔性衬底与载体基板的无损分离，提升柔性 OLED的器件性能。
本发明的目的还在于提供一种柔性OLED，制程简单，性能优异。
为实现上述目的，本发明首先提供一种柔性OLED的制作方法，包括以下步骤：
步骤1、提供磁性基板与柔性磁性薄膜，所述磁性基板的磁性可控，通过磁力吸附使所述柔性磁性薄膜固定于磁性基板上；
步骤2、在所述柔性磁性薄膜上形成聚合物薄膜；
步骤3、在所述聚合物薄膜上形成OLED器件；
步骤4、对OLED器件进行封装。
所述柔性磁性薄膜为金属薄膜；所述聚合物薄膜的材料包括聚酰亚胺、聚氨酯、聚醚砜树脂、聚萘二甲酸乙二醇酯、聚乙烯醇、及聚醚醚酮中的一种或多种。
所述柔性OLED的制作方法还包括：在步骤3之后步骤4之前、或者在步骤4之后，对磁性基板进行消磁处理，使磁性基板的磁性消失，将磁性基板从柔性磁性薄膜上移除。
所述步骤4为：在所述聚合物薄膜及OLED器件上形成封装薄膜，所述封装薄膜包覆所述OLED器件的顶面和侧面，完成对OLED器件的封装；所述封装薄膜为由多层有机薄膜与多层无机薄膜交叠形成的复合薄膜。
所述步骤4包括：
步骤41、在聚合物薄膜上位于所述OLED器件外围的区域涂布一圈胶材，在聚合物薄膜上位于胶材内侧的区域设置干燥剂；
步骤42、提供一封装盖板，将所述封装盖板与所述聚合物薄膜上设有胶材及干燥剂的一面对应贴合；
步骤43、对所述胶材进行固化，完成对OLED器件的封装。
所述胶材的粘度为100～1000Pa·s；
所述干燥剂为液态干燥剂，所述液态干燥剂的粘度为0.4～0.5Pa·s，所述步骤41中，将所述液态干燥剂涂布于聚合物薄膜上位于胶材内侧的区域；
所述封装盖板为透明柔性玻璃基板；
所述步骤43中，对所述胶材进行固化的方法包括UV照射固化、及加热固化中的一种或多种。
本发明还提供一种柔性OLED，包括柔性磁性薄膜、设于所述柔性磁性薄膜上的聚合物薄膜、设于所述聚合物薄膜上的OLED器件、及位于所述OLED器件及聚合物薄膜上且包覆所述OLED器件的顶面和侧面的封装薄膜。
所述柔性磁性薄膜为金属薄膜；所述聚合物薄膜的材料包括聚酰亚胺、聚氨酯、聚醚砜树脂、聚萘二甲酸乙二醇酯、聚乙烯醇、及聚醚醚酮中的一种或多种；所述封装薄膜为由多层有机薄膜与多层无机薄膜交叠形成的复合薄膜。
本发明还提供另一种柔性OLED，包括柔性磁性薄膜、设于所述柔性磁性薄膜上的聚合物薄膜、设于所述聚合物薄膜上的OLED器件、位于所述聚合物薄膜及OLED器件上方的封装盖板、位于所述聚合物薄膜与封装盖板之间且位于OLED器件外围的胶材、及位于所述聚合物薄膜与封装盖板之间且位于胶材内侧的干燥剂。
所述柔性磁性薄膜为金属薄膜；所述聚合物薄膜的材料包括聚酰亚胺、聚氨酯、聚醚砜树脂、聚萘二甲酸乙二醇酯、聚乙烯醇、及聚醚醚酮中的一种或多种；所述干燥剂为液态干燥剂，所述液态干燥剂的粘度为0.4～0.5Pa·s；所述封装盖板为透明柔性玻璃基板。
本发明的有益效果：本发明提供的一种柔性OLED的制作方法，采用磁性基板作为载体基板，通过磁力吸附使柔性磁性薄膜固定于磁性基板上，之后在柔性磁性薄膜上形成聚合物薄膜，在聚合物薄膜上制作OLED器件，对OLED器件进行封装后，完成柔性OLED的制作，该制作方法简单，通过对磁性基板进行消磁即可实现柔性磁性薄膜和磁性基板之间的无损分离。另外，所述柔性磁性薄膜优选为具有良好的水汽阻隔能力的金属薄膜，可降低水汽通过率，提高OLED器件的稳定性。通过对OLED器件进行封装进一步提升了OLED器件性能的可靠性。本发明提供的一种柔性OLED，制程简单，性能优异。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为传统的柔性衬底与载体基板的剥离示意图；
图2为本发明的柔性OLED的制作方法的流程图；
图3为本发明的柔性OLED的制作方法的步骤1-3的示意图；
图4为本发明的柔性OLED的制作方法的步骤4的第一实施例的示意 图暨本发明的柔性OLED的第一实施例的结构示意图；
图5为本发明的柔性OLED的制作方法的步骤4的第二实施例的示意图暨本发明的柔性OLED的第二实施例的结构示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图2，本发明首先提供一种柔性OLED的制作方法，包括以下步骤：
步骤1、请参阅图3，提供磁性基板10与柔性磁性薄膜20，所述磁性基板10的磁性可控，通过磁力吸附使所述柔性磁性薄膜20固定于磁性基板10上。
优选的，所述柔性磁性薄膜20为金属薄膜，当金属薄膜的厚度小于100μm时，其表现出良好的可挠性，并具有良好的热稳定性与隔绝水汽能力，可对OLED器件形成有效的保护，使OLED器件的性能稳定，使用寿命延长。
优选的，所述金属薄膜的材料为因瓦合金(Invar)。
具体的，所述金属薄膜的厚度为10μm～100μm。
具体的，本发明对磁性基板10的材质没有要求，只需要其磁性可以控制即可；优选的，所述磁性基板10为电磁铁，通电时有磁性，断电后磁性消失。
步骤2、请参阅图3，在所述柔性磁性薄膜20上形成聚合物薄膜30。
具体的，所述柔性磁性薄膜20与聚合物薄膜30共同构成OLED器件的柔性衬底。
具体的，所述步骤2中，采用旋涂的方法或者化学气相沉积的方法在所述柔性磁性薄膜20上形成聚合物薄膜30。所述聚合物薄膜30的厚度可以通过调节原材料的浓度、旋涂或沉积的时间和速度等参数来控制。
具体的，所述聚合物薄膜30的材料包括聚酰亚胺、聚氨酯、聚醚砜树脂、聚萘二甲酸乙二醇酯、聚乙烯醇、及聚醚醚酮中的一种或多种。
优选的，所述聚合物薄膜30的厚度为10μm～200μm。
特别的，通过在柔性磁性薄膜20上形成聚合物薄膜30，使得柔性磁性薄膜20对聚合物薄膜30具有一定的固定和支撑作用。
优选的，所述聚合物薄膜30与柔性磁性薄膜20的面积相同。
步骤3、请参阅图3，在所述聚合物薄膜30上形成OLED器件40。
具体的，所述OLED器件40包括TFT层41、位于TFT层41上的有机发光层42、及位于所述有机发光层42上的保护层43。
步骤4、请参阅图4或图5，对OLED器件40进行封装。
具体的，请参阅图4，所述步骤4可以为：在所述聚合物薄膜30及OLED器件40上形成封装薄膜50，所述封装薄膜50包覆所述OLED器件40的顶面和侧面，完成对OLED器件40的封装。
具体的，所述封装薄膜50为由多层有机薄膜与多层无机薄膜交叠形成的复合薄膜。优选的，所述无机薄膜的材料可以为硅的氮氧化物，所述有机薄膜的材料可以为有机高分子材料。具体的，所述封装薄膜50的厚度为1μm～50μm。
具体的，所述封装薄膜50通过蒸镀、溅射、及气相沉积中的一种或多种方法制得。
上述封装薄膜50在封装时可实现整面贴合，具有很好的水汽阻隔能力，防止水汽进入OLED器件40内部，延长器件的使用寿命。
或者，请参阅图5，所述步骤4也可以包括：
步骤41、在聚合物薄膜30上位于所述OLED器件40外围的区域涂布一圈胶材60，在聚合物薄膜30上位于胶材60内侧的区域设置干燥剂70。
优选的，所述胶材60的粘度为100～1000Pa·s。
步骤42、提供一封装盖板80，将所述封装盖板80与所述聚合物薄膜30上设有胶材60及干燥剂70的一面对应贴合。
步骤43、对所述胶材60进行固化，完成对OLED器件40的封装。
具体的，所述干燥剂70为液态干燥剂，所述步骤41中，将所述液态干燥剂涂布于聚合物薄膜30上位于胶材60内侧的区域。
优选的，所述液态干燥剂的粘度为0.4～0.5Pa·s。
优选的，所述封装盖板80为透明柔性玻璃基板。
具体的，所述步骤43中，对所述胶材60进行固化的方法包括UV(紫外光)照射固化、及加热固化中的一种或多种。
上述封装方式可以阻碍水汽从器件侧面和封装盖板80面进入OLED器件40内部，从而延长OLED器件40的使用寿命。
具体的，上述柔性OLED的制作方法还包括：在步骤3之后步骤4之前、或者在步骤4之后，对磁性基板10进行消磁处理，使磁性基板10的磁性消失，将磁性基板10从柔性磁性薄膜20上移除。当所述磁性基板10为电磁铁时，采用断电的方法对磁性基板10进行消磁处理。
请参阅图4，本发明还提供一种柔性OLED，包括柔性磁性薄膜20、 设于所述柔性磁性薄膜20上的聚合物薄膜30、设于所述聚合物薄膜30上的OLED器件40、及位于所述OLED器件40及聚合物薄膜30上且包覆所述OLED器件40的顶面和侧面的封装薄膜50。
具体的，所述柔性磁性薄膜20与聚合物薄膜30共同构成OLED器件40的柔性衬底。优选的，所述聚合物薄膜30与柔性磁性薄膜20的面积相同。
优选的，所述柔性磁性薄膜20为金属薄膜，所述金属薄膜的材料优选为因瓦合金。
具体的，所述金属薄膜的厚度为10μm～100μm。
具体的，所述聚合物薄膜30的材料包括聚酰亚胺、聚氨酯、聚醚砜树脂、聚萘二甲酸乙二醇酯、聚乙烯醇、及聚醚醚酮中的一种或多种。
优选的，所述聚合物薄膜30的厚度为10μm～200μm。
特别的，通过在柔性磁性薄膜20上形成聚合物薄膜30，使得柔性磁性薄膜20对聚合物薄膜30具有一定的固定和支撑作用。
具体的，所述OLED器件40包括TFT层41、位于TFT层41上的有机发光层42、及位于所述有机发光层42上的保护层43。
具体的，所述封装薄膜50为由多层有机薄膜与多层无机薄膜交叠形成的复合薄膜。优选的，所述无机薄膜的材料可以为硅的氮氧化物，所述有机薄膜的材料可以为有机高分子材料。具体的，所述封装薄膜50的厚度为1μm～50μm。
请参阅图5，本发明还提供另一种柔性OLED，包括柔性磁性薄膜20、设于所述柔性磁性薄膜20上的聚合物薄膜30、设于所述聚合物薄膜30上的OLED器件40、位于所述聚合物薄膜30及OLED器件40上方的封装盖板80、位于所述聚合物薄膜30与封装盖板80之间且位于OLED器件40外围的胶材60、及位于所述聚合物薄膜30与封装盖板80之间且位于胶材60内侧的干燥剂70。
具体的，所述柔性磁性薄膜20与聚合物薄膜30共同构成OLED器件40的柔性衬底。优选的，所述聚合物薄膜30与柔性磁性薄膜20的面积相同。
优选的，所述柔性磁性薄膜20为金属薄膜，所述金属薄膜的材料优选为因瓦合金。
具体的，所述金属薄膜的厚度为10μm～100μm。
具体的，所述聚合物薄膜30的材料包括聚酰亚胺、聚氨酯、聚醚砜树脂、聚萘二甲酸乙二醇酯、聚乙烯醇、及聚醚醚酮中的一种或多种。
优选的，所述聚合物薄膜30的厚度为10μm～200μm。
特别的，通过在柔性磁性薄膜20上形成聚合物薄膜30，使得柔性磁性薄膜20对聚合物薄膜30具有一定的固定和支撑作用。
具体的，所述OLED器件40包括TFT层41、位于TFT层41上的有机发光层42、及位于所述有机发光层42上的保护层43。
具体的，所述干燥剂70为液态干燥剂。优选的，所述干燥剂70完全填充所述聚合物薄膜30与封装盖板80之间由胶材60围成的空间。
优选的，所述液态干燥剂的粘度为0.4～0.5Pa·s。
优选的，所述封装盖板80为透明柔性玻璃基板。
综上所述，本发明提供一种柔性OLED的制作方法及柔性OLED。本发明的柔性OLED的制作方法，采用磁性基板作为载体基板，通过磁力吸附使柔性磁性薄膜固定于磁性基板上，之后在柔性磁性薄膜上形成聚合物薄膜，在聚合物薄膜上制作OLED器件，对OLED器件进行封装后，完成柔性OLED的制作，该制作方法简单，通过对磁性基板进行消磁即可实现柔性磁性薄膜和磁性基板之间的无损分离。另外，所述柔性磁性薄膜优选为具有良好的水汽阻隔能力的金属薄膜，可降低水汽通过率，提高OLED器件的稳定性。通过对OLED器件进行封装进一步提升了OLED器件性能的可靠性。本发明的柔性OLED，制程简单，性能优异。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

  1. 一种柔性OLED的制作方法，包括以下步骤：
    步骤1、提供磁性基板与柔性磁性薄膜，所述磁性基板的磁性可控，通过磁力吸附使所述柔性磁性薄膜固定于磁性基板上；
    步骤2、在所述柔性磁性薄膜上形成聚合物薄膜；
    步骤3、在所述聚合物薄膜上形成OLED器件；
    步骤4、对OLED器件进行封装。
  2. 如权利要求1所述的柔性OLED的制作方法，其中，所述柔性磁性薄膜为金属薄膜；所述聚合物薄膜的材料包括聚酰亚胺、聚氨酯、聚醚砜树脂、聚萘二甲酸乙二醇酯、聚乙烯醇、及聚醚醚酮中的一种或多种。
  3. 如权利要求1所述的柔性OLED的制作方法，还包括：在步骤3之后步骤4之前、或者在步骤4之后，对磁性基板进行消磁处理，使磁性基板的磁性消失，将磁性基板从柔性磁性薄膜上移除。
  4. 如权利要求1所述的柔性OLED的制作方法，其中，所述步骤4为：在所述聚合物薄膜及OLED器件上形成封装薄膜，所述封装薄膜包覆所述OLED器件的顶面和侧面，完成对OLED器件的封装；所述封装薄膜为由多层有机薄膜与多层无机薄膜交叠形成的复合薄膜。
  5. 如权利要求1所述的柔性OLED的制作方法，其中，所述步骤4包括：
    步骤41、在聚合物薄膜上位于所述OLED器件外围的区域涂布一圈胶材，在聚合物薄膜上位于胶材内侧的区域设置干燥剂；
    步骤42、提供一封装盖板，将所述封装盖板与所述聚合物薄膜上设有胶材及干燥剂的一面对应贴合；
    步骤43、对所述胶材进行固化，完成对OLED器件的封装。
  6. 如权利要求5所述的柔性OLED的制作方法，其中，所述胶材的粘度为100～1000Pa·s；
    所述干燥剂为液态干燥剂，所述液态干燥剂的粘度为0.4～0.5Pa·s，所述步骤41中，将所述液态干燥剂涂布于聚合物薄膜上位于胶材内侧的区域；
    所述封装盖板为透明柔性玻璃基板；
    所述步骤43中，对所述胶材进行固化的方法包括UV照射固化、及加热固化中的一种或多种。
  7. 一种柔性OLED，包括柔性磁性薄膜、设于所述柔性磁性薄膜上的 聚合物薄膜、设于所述聚合物薄膜上的OLED器件、及位于所述OLED器件及聚合物薄膜上且包覆所述OLED器件的顶面和侧面的封装薄膜。
  8. 如权利要求7所述的柔性OLED，其中，所述柔性磁性薄膜为金属薄膜；所述聚合物薄膜的材料包括聚酰亚胺、聚氨酯、聚醚砜树脂、聚萘二甲酸乙二醇酯、聚乙烯醇、及聚醚醚酮中的一种或多种；所述封装薄膜为由多层有机薄膜与多层无机薄膜交叠形成的复合薄膜。
  9. 一种柔性OLED，包括柔性磁性薄膜、设于所述柔性磁性薄膜上的聚合物薄膜、设于所述聚合物薄膜上的OLED器件、位于所述聚合物薄膜及OLED器件上方的封装盖板、位于所述聚合物薄膜与封装盖板之间且位于OLED器件外围的胶材、及位于所述聚合物薄膜与封装盖板之间且位于胶材内侧的干燥剂。
  10. 如权利要求9所述的柔性OLED，其中，所述柔性磁性薄膜为金属薄膜；所述聚合物薄膜的材料包括聚酰亚胺、聚氨酯、聚醚砜树脂、聚萘二甲酸乙二醇酯、聚乙烯醇、及聚醚醚酮中的一种或多种；所述干燥剂为液态干燥剂，所述液态干燥剂的粘度为0.4～0.5Pa·s；所述封装盖板为透明柔性玻璃基板。
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