WO2020133748A1 - 一种显示面板及其制作方法、显示装置 - Google Patents

一种显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2020133748A1
WO2020133748A1 PCT/CN2019/079468 CN2019079468W WO2020133748A1 WO 2020133748 A1 WO2020133748 A1 WO 2020133748A1 CN 2019079468 W CN2019079468 W CN 2019079468W WO 2020133748 A1 WO2020133748 A1 WO 2020133748A1
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WIPO (PCT)
Prior art keywords
layer
adhesive layer
water
base substrate
display area
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PCT/CN2019/079468
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English (en)
French (fr)
Inventor
杨中国
吴元均
李金川
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Publication of WO2020133748A1 publication Critical patent/WO2020133748A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Definitions

  • the present application relates to the technical field of display panels, and in particular to a display panel, a manufacturing method thereof, and a display device.
  • the main packaging method of the top-emitting large-size flexible OLED TV is surface-mount packaging, in which the surface-mount packaging material is mainly composed of a barrier film and a surface-mount packaging adhesive, and is generally attached on both sides of the flexible substrate substrate Combined with surface-attached packaging materials. Since the requirements for packaging of OLED TVs are much higher than that of small-size OLED display screens, this puts higher requirements on the surface-fitting packaging materials of large-size flexible OLED TVs.
  • the surface-mounting encapsulant used for bottom-emitting OLED devices contains MxO (metal oxide) particles as a water-absorbing desiccant, and its particle size is about 1-6um to prevent water vapor from passing through the surface-mounting encapsulation
  • MxO metal oxide
  • the glue material is immersed in the organic light emitting device and causes failure.
  • the transmittance of the adhesive material is low, and the transmittance requirements of the display panel cannot be met.
  • the present application provides a display panel, a manufacturing method thereof, and a display device to prevent moisture from invading the organic light-emitting device from the outside of the adhesive layer, so that not only can the display panel meet the package life requirements, but also meet the transmittance requirements Claim.
  • a display panel including a substrate substrate, and an organic light emitting device and a packaging structure provided on the substrate substrate
  • the substrate substrate includes a display area and is located around the display area Non-display area
  • the organic light-emitting device is located in the display area
  • the packaging structure includes a first adhesive layer disposed on the base substrate and covering the organic light-emitting device, a water-absorbing layer disposed on the first adhesive layer and surrounding the edge of the display area, A second adhesive layer provided on the first adhesive layer and covering the water-absorbing layer, and a barrier layer provided on the second adhesive layer.
  • the thickness of the water-absorbing layer is less than half of the total thickness of the first adhesive layer and the second adhesive layer.
  • the barrier layer includes an inorganic water blocking layer and an organic buffer layer that are alternately stacked and alternately stacked.
  • the total number of the inorganic water blocking layer and the organic buffer layer is not less than three.
  • the organic light-emitting device includes a light-emitting layer, a first inorganic layer, an organic layer, and a second inorganic layer that are sequentially arranged on a base substrate.
  • desiccant particles are distributed in the water-absorbing layer, and the composition of the desiccant particles is metal oxide.
  • nano-level desiccant particles or transparent desiccant particles are distributed in the first adhesive layer and the second adhesive layer.
  • the materials of the first adhesive layer and the second adhesive layer are pressure-sensitive or heat-sensitive adhesive materials.
  • embodiments of the present application also provide a method of manufacturing a display panel.
  • the method of manufacturing the display panel includes: providing a substrate substrate including a display area and a non-display area located around the display area; An organic light-emitting device is formed on the display area of the base substrate; a packaging structure is provided.
  • the packaging structure includes a first adhesive layer, a water-absorbing layer, a second adhesive layer, and a barrier layer that are stacked; the packaging structure is pasted through the first adhesive layer Attached to the base substrate and covering the organic light-emitting device, wherein the water-absorbing layer is located on the first adhesive layer and surrounds the edge of the display area, the second adhesive layer is located on the first adhesive layer and covers the water-absorbing layer, and the barrier layer is located on the first Two on the adhesive layer.
  • the method further includes the steps of: bonding the first adhesive layer and the second adhesive by pressing or heating The layer is cured to obtain the display panel after the encapsulation is completed.
  • the step of providing a packaging structure specifically includes: providing a barrier layer; and sequentially coating the barrier layer with a second adhesive layer, a water-absorbing layer, and a first adhesive layer.
  • the thickness of the water-absorbing layer is less than half of the total thickness of the first adhesive layer and the second adhesive layer.
  • the barrier layer is formed by alternately laminating an inorganic water blocking layer and an organic buffer layer, and the total number of layers of the inorganic water blocking layer and the organic buffer layer is not less than three layers.
  • the step of forming an organic light emitting device on the display area of the base substrate specifically includes: sequentially forming a light emitting layer, a first inorganic layer, an organic layer, and a second inorganic layer on the display area of the base substrate.
  • the embodiments of the present application further provide a display device, the display device includes a driving circuit and a display panel, the driving circuit is used to provide a driving voltage to the display panel, wherein the display panel includes a substrate and a substrate An organic light emitting device and a packaging structure on a base substrate, the base substrate includes a display area and a non-display area located around the display area; the organic light emitting device is located in the display area; the packaging structure includes an organic light emitting device disposed on the base substrate and covering the organic light emitting device A first adhesive layer, a water-absorbing layer disposed on the first adhesive layer and surrounding the edge of the display area, a second adhesive layer disposed on the first adhesive layer and covering the water-absorbing layer, and a second adhesive layer On the barrier layer.
  • the thickness of the water-absorbing layer is less than half of the total thickness of the first adhesive layer and the second adhesive layer.
  • the barrier layer includes an inorganic water blocking layer and an organic buffer layer that are alternately stacked and alternately stacked.
  • the total number of the inorganic water blocking layer and the organic buffer layer is not less than three.
  • the organic light-emitting device includes a light-emitting layer, a first inorganic layer, an organic layer, and a second inorganic layer that are sequentially arranged on a base substrate.
  • desiccant particles are distributed in the water-absorbing layer, and the composition of the desiccant particles is metal oxide.
  • nano-level desiccant particles or transparent desiccant particles are distributed in the first adhesive layer and the second adhesive layer.
  • the materials of the first adhesive layer and the second adhesive layer are pressure-sensitive or heat-sensitive adhesive materials.
  • the display panel provided by the present application includes a base substrate, and an organic light emitting device and a packaging structure provided on the base substrate
  • the base substrate includes a display area and is located around the display area The non-display area
  • the organic light emitting device is located in the display area
  • the packaging structure includes a first adhesive layer disposed on the base substrate and covering the organic light emitting device, a water absorbing layer disposed on the first adhesive layer and surrounding the edge of the display area
  • the second adhesive layer provided on the first adhesive layer and covering the water-absorbing layer, and the barrier layer provided on the second adhesive layer can prevent water vapor by arranging the water-absorbing layer in the adhesive layer around the edge of the display area
  • Invading the organic light-emitting device from the outside of the adhesive layer can not only meet the requirements of the display panel for package life, but also meet the requirements for transmittance.
  • FIG. 1 is a top schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a cross-sectional structure taken along line O-O' in FIG. 1;
  • FIG. 3 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 4 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 5 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic flowchart of an embodiment of S53 in FIG. 5;
  • FIG. 7 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • FIG. 1 is a schematic top view of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional structure taken along line O-O' in FIG. 1.
  • the display panel 10 includes a base substrate 11, and an organic light-emitting device 12 and a packaging structure 13 provided on the base substrate 11.
  • the base substrate 11 includes a display area C1 and a non-display area C2 located around the display area C1, the organic light emitting device 12 is located in the display area C1, and the packaging structure 13 includes a first adhesive provided on the base substrate 11 and covering the organic light emitting device 12
  • the junction layer 131, the water-absorbing layer 132 disposed on the first adhesive layer 131 and surrounding the edge of the display area C1, the second adhesive layer 133 disposed on the first adhesive layer 131 and covering the water-absorbing layer 132, and the second adhesive layer The barrier layer 134 on the adhesive layer 133.
  • the boundary of the water-absorbing layer 132 does not exceed the boundary of the first adhesive layer 131 and the second adhesive layer 133.
  • a barrier layer is generally attached to the organic light-emitting device through an adhesive layer, and desiccant particles are also distributed in the adhesive layer to prevent moisture from entering the organic light-emitting device from the outside of the adhesive layer
  • the transmittance of the adhesive layer is low, which cannot meet the requirements of the display panel for transmittance.
  • the adhesive layer of the packaging structure adopts a method of arranging a water absorbing layer between the two adhesive layers, and the water absorbing layer is disposed around the edge of the display area to prevent water vapor from sticking
  • the intrusion of the organic light-emitting device outside the junction layer can not only meet the requirements of the display panel for package life, but also meet the requirements for transmittance.
  • FIG. 3 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the display panel 20 in this embodiment includes a base substrate 21, and an organic light-emitting device 22 and a packaging structure 23 provided on the base substrate 21.
  • the organic light emitting device 22 is located in the display area C1 of the base substrate 21, and the packaging structure 23 includes a first adhesive layer 231 disposed on the base substrate 21 and covering the organic light emitting device 22, and disposed on and surrounding the first adhesive layer 231
  • the boundary of the water-absorbing layer 232 does not exceed the boundary of the first adhesive layer 231 and the second adhesive layer 233.
  • the base substrate 21 is a flexible thin film transistor (TFT) substrate with a base, and includes a base 211 and a TFT layer 212.
  • the material of the base 211 may be one of organic polymers such as polyimide, polycarbonate, polyethylene terephthalate, and polyethersulfone substrate.
  • the organic light-emitting device 22 includes a light-emitting layer 221, a first inorganic layer 222, an organic layer 223, and a second inorganic layer 224 which are sequentially stacked away from the surface of the base substrate 21.
  • the material of the inorganic layer 222/224 may be one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, and silicon oxynitride.
  • the material of the organic layer 223 may be one of epoxy resin, acrolein-based resin, polyimide resin, polyethylene naphthalate, and polyethylene terephthalate.
  • the first inorganic layer 222 is disposed on the light-emitting layer 221, covering the surface of the light-emitting layer 221 and its surrounding area.
  • the first inorganic layer 222 must be closely combined with the base substrate 21 during the formation process, which is generally completed at a relatively low temperature, and the damage to the light emitting layer 221 should be avoided as much as possible.
  • An organic layer 223 is provided above the first inorganic layer 222, the boundary of the first inorganic layer 222 is outside the organic layer 223, and the area covered by the second inorganic layer 224 is the same as the area covered by the first inorganic layer 222.
  • the thin-film encapsulation structure composed of the first inorganic layer 222, the organic layer 223, and the second organic layer 224 can prevent the organic light-emitting device 22 from failing due to water and oxygen infiltrating the light-emitting layer 221, but the thin-film encapsulation structure is likely to cause a film layer due to foreign matter rupture.
  • the encapsulation structure 23 is disposed on the base substrate 21 and covers the surface and peripheral area of the organic light emitting device 22, and the non-adhesive barrier layer 234 is pasted through the first and second adhesive layers 231/233
  • the thin-film encapsulation structure attached to the organic light-emitting device 22 can prevent the thin-film encapsulation structure from cracking the film layer due to foreign substances, and can also prevent water and oxygen from infiltrating the organic light-emitting device 22.
  • the barrier layer 234 is a water-oxygen-resistant barrier layer, which may be a single layer or a stack of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or the like.
  • the barrier layer 234 may include an inorganic water blocking layer and an organic buffer layer that are alternately stacked, and the total number of layers of the inorganic water blocking layer and the organic buffer layer is not less than three.
  • the barrier layer 234 includes a substrate 2341 and a first inorganic water-blocking layer 2342, an organic buffer layer 2343, and a second inorganic water-blocking layer 2344 that are sequentially stacked away from the surface of the substrate 2341, and the second inorganic barrier of the barrier layer 234
  • the water layer 2343 is bonded to the second adhesive layer 233.
  • the more the total number of the inorganic water blocking layer and the organic buffer layer the better the blocking effect of the barrier layer 234 on water and oxygen.
  • a water absorption layer 232 is provided between the first adhesive layer 231 and the second adhesive layer 233.
  • the water-absorbing layer 232 is disposed around the edge of the display area C1 and does not cover the display area C1 to prevent the transmittance of the display panel from being affected due to the low transmittance of the water-absorbing layer 232.
  • the materials of the first adhesive layer 231, the second adhesive layer 233, and the water-absorbing layer 232 are heat-sensitive or pressure-sensitive adhesive materials, which are hydrophobic.
  • the water-absorbing layer 232 and the first and second adhesive layers 231/233 will be cured, along with the enhancement of the adhesive capacity to complete the packaging of the display panel.
  • the water-absorbing layer 232 may sink into the first adhesive layer 231 and then be wrapped by the first adhesive layer 231 and the second adhesive layer 233.
  • the thickness of the water-absorbing layer 232 is less than half of the total thickness of the first and second adhesive layers 231/233 to ensure that the first and second adhesive layers 231/233 have the base substrate 21 and the barrier layer 234 Adequate adhesion.
  • the width of the water-absorbing layer 232 can be adjusted appropriately according to the width of the effective packaging area around the display area C1. The larger the width of the effective packaging area, the larger the width of the water-absorbing layer 232 to ensure the packaging effect.
  • desiccant particles are uniformly dispersed in the water-absorbing layer 232, and the material of the desiccant particles is metal oxide, such as calcium oxide, barium oxide, etc.
  • the particle size of the desiccant particles is generally less than 6 microns.
  • the water-oxygen barrier capability of the flexible base substrate 21 is generally inferior to that of rigid substrates such as glass and ceramics.
  • the base substrate 21 The package structure 24 is provided on the other side opposite to the organic light-emitting device 22, and the package structure 24 has the same structure as the package structure 23 provided on the same side as the organic light-emitting device 22, however, because the base substrate 21 is provided with the package structure 24 The organic light emitting device 22 is not provided on the side, so the first adhesive layer of the packaging structure 24 is completely attached to the base substrate 21.
  • desiccant particles are evenly distributed in the first and second adhesive layers 231/233 to further prevent water vapor from entering the organic light-emitting device, and, in order to avoid distribution in the first and second adhesive layers 231/233 The influence of the desiccant particles on the transmittance of the display panel 20.
  • the desiccant particles distributed in the first and second adhesive layers 231/233 are preferably nano-level desiccant particles or transparent desiccant particles, such as nano-level molecular sieves , To reduce the scattering or absorption of light by the desiccant particles.
  • the adhesive layer of the packaging structure adopts a method of arranging a water absorption layer between the two adhesive layers, and the water absorption layer is disposed around the edge of the display area to prevent water vapor from The outer side of the adhesive layer invades the organic light-emitting device.
  • the barrier layer adopts a multilayer structure in which an inorganic water-blocking layer and an organic buffer layer are alternately stacked, which can not only meet the requirements of the display panel for package life, but also meet the requirements for transmittance. .
  • FIG. 5 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • the manufacturing method of the display panel includes the following steps:
  • the base substrate includes a display area and a non-display area located around the display area.
  • the base substrate is a flexible TFT substrate with a base.
  • the material of the substrate may be one of organic polymers such as polyimide, polycarbonate, polyethylene terephthalate, and polyethersulfone substrate.
  • S52 An organic light emitting device is formed on the display area of the base substrate.
  • This step specifically includes: sequentially forming a light-emitting layer, a first inorganic layer, an organic layer, and a second inorganic layer on the display area of the base substrate.
  • the material of the first inorganic layer and the second inorganic layer may be one or more of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, tantalum nitride, titanium oxide, aluminum oxynitride, and silicon oxynitride.
  • the material of the organic layer may be one of epoxy resin, acrolein-based resin, polyimide resin, polyethylene naphthalate, and polyethylene terephthalate.
  • the first inorganic layer is provided on the light-emitting layer, covering the surface of the light-emitting layer and its surrounding area.
  • the first inorganic layer must be tightly combined with the base substrate during the formation process, which is generally completed at a relatively low temperature, and the damage to the light emitting layer should be avoided as much as possible.
  • An organic layer is provided above the first inorganic layer, the boundary of the first inorganic layer is outside the organic layer, and the area covered by the second inorganic layer is the same as the area covered by the first inorganic layer.
  • the thin-film encapsulation structure composed of the first inorganic layer, the organic layer, and the second organic layer can prevent the organic light-emitting device from failing because water and oxygen enter the light-emitting layer.
  • the packaging structure includes a first adhesive layer, a water absorption layer, a second adhesive layer, and a barrier layer that are stacked.
  • this step specifically includes the following sub-steps:
  • S531 Provide a barrier layer.
  • the barrier layer is a water-oxygen-resistant barrier layer, which may be a single layer or a stack of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or the like.
  • the barrier layer may be formed by alternately stacking an inorganic water blocking layer and an organic buffer layer, and the total number of layers of the inorganic water blocking layer and the organic buffer layer is not less than three layers.
  • S531 may specifically include: providing a substrate on which a first inorganic water-blocking layer, an organic buffer layer, and a second inorganic water-blocking layer are sequentially formed.
  • a substrate on which a first inorganic water-blocking layer, an organic buffer layer, and a second inorganic water-blocking layer are sequentially formed.
  • the more the total number of the inorganic water blocking layer and the organic buffer layer the better the blocking effect of the water and oxygen barrier layer.
  • S532 Coat the second adhesive layer, the water-absorbing layer, and the first adhesive layer in this order on the barrier layer.
  • this step may specifically include:
  • the first adhesive layer is coated on the second adhesive layer, and the first adhesive layer covers the water-absorbing layer.
  • S533 A release film is pasted on the first adhesive layer to isolate and protect the adhesive layer.
  • the packaging structure is attached to the base substrate and covers the organic light-emitting device through the first adhesive layer, wherein the water absorption layer is located on the first adhesive layer and surrounds the edge of the display area, and the second adhesive layer is located on the first adhesive layer The water absorption layer is covered on the connecting layer, and the barrier layer is located on the second adhesive layer.
  • the water-oxygen barrier capacity of the flexible substrate substrate is generally inferior to that of rigid substrates such as glass and ceramics.
  • S54 further includes:
  • the packaging structure is attached to the other side of the base substrate opposite to the organic light-emitting device through the first adhesive layer, and since the organic light-emitting device is not provided on this side of the base substrate, the first An adhesive layer is completely attached to the base substrate.
  • the packaging structure is provided on the base substrate and covers the surface and peripheral area of the organic light-emitting device, and the non-adhesive barrier layer is attached to the thin film of the organic light-emitting device through the first and second adhesive layers
  • the thin film packaging structure can be prevented from rupturing the film layer due to foreign substances, and at the same time, it can block water and oxygen from entering the organic light-emitting device.
  • the water absorbing layer provided between the first and second adhesive layers is disposed around the edge of the display area and does not cover the display panel.
  • the display area can prevent the transmittance of the display panel from being affected by the low transmittance of the water-absorbing layer.
  • the materials of the first and second adhesive layers and the water-absorbing layer are heat-sensitive or pressure-sensitive adhesive materials, which are hydrophobic.
  • the water-absorbing layer and the adhesive layer When heated or pressurized, the water-absorbing layer and the adhesive layer will be cured, accompanied by the enhancement of the adhesive capacity to complete the packaging of the display panel.
  • the water-absorbing layer may sink into the first adhesive layer and be wrapped by the first and second adhesive layers.
  • the thickness of the water-absorbing layer is less than half of the total thickness of the first and second adhesive layers to ensure that the adhesive layer has sufficient adhesion to the base substrate and the barrier layer.
  • the width of the water-absorbing layer can be adjusted appropriately according to the width of the effective packaging area around the display area. The larger the width of the effective packaging area, the larger the width of the water-absorbing layer, so as to ensure the packaging effect.
  • desiccant particles are uniformly dispersed in the water-absorbing layer.
  • the material of the desiccant particles is metal oxide, such as calcium oxide and barium oxide.
  • the particle size of the desiccant particles is generally less than 6 microns.
  • desiccant particles are evenly distributed in the first and second adhesive layers to further prevent moisture from entering the organic light-emitting device, and, in order to avoid the influence of the desiccant particles distributed in the adhesive layer on the transmittance of the display panel
  • the desiccant particles distributed in the adhesive layer are preferably nano-level desiccant particles or transparent desiccant particles to reduce the scattering or absorption of light by the desiccant particles.
  • the method for manufacturing the display panel provided by the embodiments of the present application may be specifically implemented as the following steps:
  • S101 coating PI liquid on a glass substrate, and then fabricating a TFT, thereby providing a flexible TFT substrate;
  • S102 Manufacture a bottom-emitting or top-emitting OLED device on a flexible TFT substrate by evaporation or inkjet printing;
  • S104 an organic layer is made by inkjet printing on the first inorganic layer, and the ink is cured by ultraviolet light;
  • Atomic layer deposition or chemical vapor deposition is used to form a second inorganic layer above the organic layer;
  • S106 Provide a packaging structure
  • S110 Provide packaging structure
  • the adhesive layer of the encapsulation structure adopts a way of arranging a water absorbing layer between the two adhesive layers, and the water absorbing layer is arranged around the edge of the display area to prevent moisture Invading the organic light-emitting device from the outside of the adhesive layer can not only meet the requirements of the display panel for package life, but also meet the requirements for transmittance.
  • FIG. 7 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the display device 71 includes a driving circuit and the display panel 72 of any of the foregoing embodiments.
  • the driving circuit is used to provide a drive to the display panel 72. Voltage.
  • the display panel 72 in this embodiment includes a base substrate, and an organic light emitting device and a packaging structure provided on the base substrate.
  • the base substrate includes a display area and a non-display area located around the display area; the organic light emitting device is located in the display area
  • the packaging structure includes a first adhesive layer disposed on the base substrate and covering the organic light-emitting device, a water-absorbing layer disposed on the first adhesive layer and surrounding the edge of the display area, and a water-absorbing layer disposed on the first adhesive layer and covering the water-absorbing The second adhesive layer of the layer and the barrier layer provided on the second adhesive layer.
  • the adhesive layer of the packaging structure adopts a method of arranging a water absorption layer between the two adhesive layers, and the water absorption layer is disposed around the edge of the display area, which can prevent water vapor from sticking
  • the intrusion of the organic light-emitting device outside the junction layer can not only meet the requirements of the display panel for package life, but also meet the requirements for transmittance.

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Abstract

本申请涉及一种显示面板及其制作方法、显示装置，该显示面板包括衬底基板、以及设置于衬底基板上的有机发光器件和封装结构，封装结构包括设置于衬底基板上并覆盖有机发光器件的第一粘接层、设置于第一粘接层上且环绕显示区域边缘的吸水层、设置于第一粘接层上并覆盖吸水层的第二粘接层、以及设置于第二粘接层上的阻隔层。

Description

一种显示面板及其制作方法、显示装置 技术领域
本申请涉及显示面板技术领域，具体涉及一种显示面板及其制作方法、显示装置。
 背景技术
目前，顶发光大尺寸柔性OLED电视的主要封装方式是面贴合封装，其中，面贴合封装材料主要由阻隔膜和面贴合封装胶材组成，并且一般在柔性衬底基板两侧都贴合有面贴合封装材料。由于OLED电视对封装的要求远高于小尺寸OLED显示屏，这对大尺寸柔性OLED电视的面贴合封装材料提出了更高的要求。
现有技术中，用于底发光OLED器件的面贴合封装胶材里面含有MxO（金属氧化物）颗粒作为吸水的干燥剂，其粒径为1-6um左右，以防止水汽经面贴合封装胶材浸入有机发光器件而导致失效。但由于干燥剂颗粒对光的散射和吸水，使得胶材透过率低，而无法满足显示面板对透过率的要求。
 技术问题
本申请提供了一种显示面板及其制作方法、显示装置，以防止水汽从粘接层外侧侵入有机发光器件，使得不仅能满足显示面板对封装寿命的要求，同时也能满足对透过率的要求。
 技术解决方案
为了解决上述问题，本申请实施例提供了一种显示面板，该显示面板包括衬底基板、以及设置于衬底基板上的有机发光器件和封装结构，衬底基板包括显示区域和位于显示区域四周的非显示区域；有机发光器件位于显示区域；封装结构包括设置于衬底基板上并覆盖有机发光器件的第一粘接层、设置于第一粘接层上且环绕显示区域边缘的吸水层、设置于第一粘接层上并覆盖吸水层的第二粘接层、以及设置于第二粘接层上的阻隔层。
进一步地，吸水层的厚度小于第一粘接层和第二粘接层的总厚度的一半。
进一步地，阻隔层包括层叠交替设置的无机阻水层和有机缓冲层交替层叠形成，无机阻水层和有机缓冲层的总层数不小于三层。
进一步地，有机发光器件包括在衬底基板上层叠依次设置的发光层、第一无机层、有机层和第二无机层。
进一步地，吸水层中分布有干燥剂颗粒，干燥剂颗粒的成分为金属氧化物。
进一步地，第一粘接层和第二粘接层中分布有纳米级别的干燥剂颗粒或透明的干燥剂颗粒。
进一步地，第一粘接层和第二粘接层的材料为压敏型或热敏型的胶材。
为了解决上述问题，本申请实施例还提供了一种显示面板的制作方法，该显示面板的制作方法包括：提供衬底基板，衬底基板包括显示区域和位于显示区域四周的非显示区域；在衬底基板的显示区域上形成有机发光器件；提供封装结构，封装结构包括层叠设置的第一粘接层、吸水层、第二粘接层以及阻隔层；通过第一粘接层将封装结构贴附于衬底基板上并覆盖有机发光器件，其中，吸水层位于第一粘接层上且环绕显示区域边缘，第二粘接层位于第一粘接层上并覆盖吸水层，阻隔层位于第二粘接层上。
进一步地，在通过第一粘接层将封装结构贴附于衬底基板上并覆盖有机发光器件的步骤之后，还包括以下步骤：通过加压或加热使第一粘接层和第二粘接层固化，得到封装完成后的显示面板。
进一步地，提供封装结构的步骤，具体包括：提供阻隔层；在阻隔层上依次涂布第二粘接层、吸水层、第一粘接层。
进一步地，吸水层的厚度小于第一粘接层和第二粘接层的总厚度的一半。
进一步地，阻隔层由无机阻水层和有机缓冲层交替层叠形成，并且无机阻水层和有机缓冲层的总层数不小于三层。
进一步地，在衬底基板的显示区域上形成有机发光器件的步骤具体包括：在衬底基板的显示区域上依次形成发光层、第一无机层、有机层和第二无机层。
为了解决上述问题，本申请实施例还提供了一种显示装置，该显示装置包括驱动电路和显示面板，驱动电路用于向显示面板提供驱动电压，其中，显示面板包括衬底基板、以及设置于衬底基板上的有机发光器件和封装结构，衬底基板包括显示区域和位于显示区域四周的非显示区域；有机发光器件位于显示区域；封装结构包括设置于衬底基板上并覆盖有机发光器件的第一粘接层、设置于第一粘接层上且环绕显示区域边缘的吸水层、设置于第一粘接层上并覆盖吸水层的第二粘接层、以及设置于第二粘接层上的阻隔层。
进一步地，吸水层的厚度小于第一粘接层和第二粘接层的总厚度的一半。
进一步地，阻隔层包括层叠交替设置的无机阻水层和有机缓冲层交替层叠形成，无机阻水层和有机缓冲层的总层数不小于三层。
进一步地，有机发光器件包括在衬底基板上层叠依次设置的发光层、第一无机层、有机层和第二无机层。
进一步地，吸水层中分布有干燥剂颗粒，干燥剂颗粒的成分为金属氧化物。
进一步地，第一粘接层和第二粘接层中分布有纳米级别的干燥剂颗粒或透明的干燥剂颗粒。
进一步地，第一粘接层和第二粘接层的材料为压敏型或热敏型的胶材。
 有益效果
本申请的有益效果是：区别于现有技术，本申请提供的显示面板包括衬底基板、以及设置于衬底基板上的有机发光器件和封装结构，衬底基板包括显示区域和位于显示区域四周的非显示区域，有机发光器件位于显示区域，封装结构包括设置于衬底基板上并覆盖有机发光器件的第一粘接层、设置于第一粘接层上且环绕显示区域边缘的吸水层、设置于第一粘接层上并覆盖吸水层的第二粘接层、以及设置于第二粘接层上的阻隔层，通过将粘接层中的吸水层环绕显示区域边缘设置，可以防止水汽从粘接层外侧侵入有机发光器件，不仅能满足显示面板对封装寿命的要求，同时也能满足对透过率的要求。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的显示面板的俯视结构示意图；
图2是沿图1中的线O-O’截取的横截面结构示意图；
图3是本申请实施例提供的显示面板的另一结构示意图；
图4是本申请实施例提供的显示面板的又一结构示意图；
图5是本申请实施例提供的显示面板的制作方法的流程示意图；
图6是图5中S53的一实施例的流程示意图；
图7是本申请实施例提供的显示装置的结构示意图。
 本发明的实施方式
下面结合附图和实施例，对本申请作进一步地详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
请参阅图1和图2，图1是本申请实施例提供的显示面板的俯视结构示意图，图2是沿图1中的线O-O’截取的横截面结构示意图。该显示面板10包括衬底基板11、以及设置于衬底基板11上的有机发光器件12和封装结构13。衬底基板11包括显示区域C1和位于显示区域C1四周的非显示区域C2，有机发光器件12位于显示区域C1，封装结构13包括设置于衬底基板11上并覆盖有机发光器件12的第一粘接层131、设置于第一粘接层131上且环绕显示区域C1边缘的吸水层132、设置于第一粘接层131上并覆盖吸水层132的第二粘接层133以及设置于第二粘接层133上的阻隔层134。在本实施例中，吸水层132的边界不超出第一粘接层131和第二粘接层133的边界。
为了防止水汽浸入有机发光器件而导致失效，一般通过粘接层在有机发光器件上贴附阻隔层，并且粘接层中还分布有干燥剂颗粒以防止水汽从粘接层的外侧浸入有机发光器件，但由于干燥剂颗粒对光的散射和吸水，使得粘接层的透过率低，从而无法满足显示面板对透过率的要求。
区别于现有技术，本实施例中的显示面板，其封装结构的粘接层采用两层粘接层之间设置吸水层的方式，并且该吸水层环绕显示区域边缘设置，可以防止水汽从粘接层外侧侵入有机发光器件，不仅能满足显示面板对封装寿命的要求，同时也能满足对透过率的要求。
请参阅图3，图3是本申请实施例提供的显示面板的另一结构示意图。本实施例中的显示面板20包括衬底基板21、以及设置于衬底基板21上的有机发光器件22和封装结构23。有机发光器件22位于衬底基板21的显示区域C1，封装结构23包括设置于衬底基板21上并覆盖有机发光器件22的第一粘接层231、设置于第一粘接层231上且环绕显示区域C1边缘的吸水层232、设置于第一粘接层231上并覆盖吸水层232的第二粘接层233、以及设置于第二粘接层233上的阻隔层234。其中，吸水层232的边界不超出第一粘接层231和第二粘接层233的边界。
衬底基板21为带有基底的柔性薄膜晶体管（TFT）基板，包括基底211和TFT层212。基底211的材质可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚醚砜基板等有机聚合物中的一种。
有机发光器件22包括远离衬底基板21表面层叠依次设置的发光层221、第一无机层222、有机层223和第二无机层224。无机层222/224的材质可以是氮化硅、氮化铝、氮化锆、氮化钛、氮化钽、氧化钛、氮氧化铝、氮氧化硅中的一种或多种。有机层223的材质可以是环氧树脂、丙烯醛基树脂、聚酰亚胺树脂、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯中的一种。具体地，第一无机层222设置在发光层221上，覆盖发光层221的表面及其周围区域。第一无机层222在形成过程中必须与衬底基板21紧密结合，该过程一般在较低温度下完成，而且要尽量避免对发光层221的损坏。在第一无机层222上方设置有机层223，第一无机层222的边界在有机层223外侧，第二无机层224覆盖的区域与第一无机层222覆盖的区域相同。第一无机层222、有机层223、第二有机层224构成的薄膜封装结构，能够防止有机发光器件22因为水氧浸入发光层221而失效，但该薄膜封装结构很容易因为异物而导致膜层破裂。
在本实施例中，封装结构23设置于衬底基板21上并覆盖有机发光器件22的表面以及周边区域，通过第一、第二粘接层231/233将没有粘接性的阻隔层234贴附到有机发光器件22的薄膜封装结构上，能够防止该薄膜封装结构因为异物而导致膜层破裂，同时也能阻隔水氧浸入有机发光器件22。
其中，阻隔层234为抗水氧阻隔层，可以是氮化硅、氧化硅、氮氧化硅、氧化铝等中的单层或叠层。
在一些实施例中，阻隔层234可以包括层叠交替设置的无机阻水层和有机缓冲层，并且无机阻水层和有机缓冲层的总层数不小于三层。例如，参阅图3，阻隔层234包括基板2341以及依次远离基板2341表面层叠设置的第一无机阻水层2342、有机缓冲层2343和第二无机阻水层2344，阻隔层234的第二无机阻水层2343与第二粘接层233贴合。其中，无机阻水层和有机缓冲层的总层数越多，阻隔层234对水氧的阻隔效果越好。
进一步地，为了防止水汽从第一、第二粘接层231/233的两侧进入有机发光器件22，在第一粘接层231和第二粘接层233之间设置了吸水层232。该吸水层232环绕显示区域C1边缘设置，不覆盖显示区域C1，以防止因为吸水层232的透过率低而影响显示面板的透过率。
可选地，第一粘接层231、第二粘接层233和吸水层232的材质为热敏型或压敏型胶材，具有疏水性。当加热或者加压时，吸水层232和第一、第二粘接层231/233会发生固化，同时伴随着粘接能力的增强，以完成显示面板的封装。另外，如图3所示，因为被按压，吸水层232可能会陷入至第一粘接层231中，进而被第一粘接层231和第二粘接层233所包裹。
可选地，吸水层232的厚度小于第一、第二粘接层231/233的总厚度的一半，以保证第一、第二粘接层231/233对衬底基板21以及阻隔层234具有足够的粘附力。
另外，吸水层232的宽度可随显示区域C1周边的封装有效区域的宽度大小而适当调整，封装有效区域的宽度越大，吸水层232的宽度也相应越大，以保证封装效果。
可选地，吸水层232中均匀分散有干燥剂颗粒，该干燥剂颗粒的材料为金属氧化物，如氧化钙、氧化钡等，该干燥剂颗粒的粒径一般小于6微米。
更进一步地，请参阅图4，柔性衬底基板21的水氧阻隔能力通常不及玻璃、陶瓷等刚性基板，为了防止外界环境水汽由柔性衬底基板21浸入有机发光器件22，在衬底基板21与有机发光器件22相对的另一侧上设置了封装结构24，封装结构24和与有机发光器件22同一侧设置的封装结构23结构相同，但是，因为衬底基板21设置封装结构24的这一侧未设置有机发光器件22，所以封装结构24的第一粘接层完全贴附于衬底基板21上。
可选地，第一、第二粘接层231/233中均匀分布有干燥剂颗粒，以进一步阻止水汽进入有机发光器件，并且，为了避免第一、第二粘接层231/233中分布的干燥剂颗粒对显示面板20透过率的影响，第一、第二粘接层231/233中分布的干燥剂颗粒优选为纳米级别的干燥剂颗粒或透明的干燥剂颗粒，如纳米级别的分子筛，以减小干燥剂颗粒对光线的散射或吸收。
区别于现有技术，本申请实施例提供的显示面板，其封装结构的粘接层采用两层粘接层之间设置吸水层的方式，并且该吸水层环绕显示区域边缘设置，可以防止水汽从粘接层外侧侵入有机发光器件，另外，阻隔层采用无机阻水层和有机缓冲层交替层叠的多层结构，不仅能满足显示面板对封装寿命的要求，同时也能满足对透过率的要求。
请参阅图5，图5是本申请实施例提供的显示面板的制作方法的流程示意图。该显示面板的制作方法包括以下步骤：
S51：提供衬底基板，衬底基板包括显示区域和位于显示区域四周的非显示区域。
衬底基板为带有基底的柔性TFT基板。基底的材质可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、聚醚砜基板等有机聚合物中的一种。
S52：在衬底基板的显示区域上形成有机发光器件。
该步骤具体包括：在衬底基板的显示区域上依次形成发光层、第一无机层、有机层和第二无机层。第一无机层、第二无机的材质可以是氮化硅、氮化铝、氮化锆、氮化钛、氮化钽、氧化钛、氮氧化铝、氮氧化硅中的一种或多种。有机层的材质可以是环氧树脂、丙烯醛基树脂、聚酰亚胺树脂、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯中的一种。
具体地，第一无机层设置在发光层上，覆盖发光层的表面及其周围区域。第一无机层在形成过程中必须与衬底基板紧密结合，该过程一般在较低温度下完成，而且要尽量避免对发光层的损坏。在第一无机层上方设置有机层，第一无机层的边界在有机层外侧，第二无机层覆盖的区域与第一无机层覆盖的区域相同。第一无机层、有机层、第二有机层构成的薄膜封装结构，能够防止有机发光器件因为水氧进入发光层而失效，但该薄膜封装结构很容易因为异物而导致膜层破裂。
S53：提供封装结构，封装结构包括层叠设置的第一粘接层、吸水层、第二粘接层以及阻隔层。
请参阅图6，该步骤具体包括以下子步骤：
S531：提供阻隔层。
其中，阻隔层为抗水氧阻隔层，可以是氮化硅、氧化硅、氮氧化硅、氧化铝等中的单层或叠层。在一些实施例中，阻隔层可以由无机阻水层和有机缓冲层交替层叠形成，并且无机阻水层和有机缓冲层的总层数不小于三层。
例如，S531可以具体包括：提供一基板，在该基板上依次形成第一无机阻水层、有机缓冲层和第二无机阻水层。其中，无机阻水层和有机缓冲层的总层数越多，阻隔层对水氧的阻隔效果越好。
S532：在阻隔层上依次涂布第二粘接层、吸水层、第一粘接层。
紧接上述例子，该步骤可以具体包括：
在阻隔层的第二无机阻水层上涂布第二粘接层；
在第二粘接层上涂布一圈吸水层，该吸水层的边界不超出第二粘接层的边界；
在第二粘接层上涂布第一粘接层，并且第一粘接层覆盖吸水层。
可选地，在S532之后，还包括：
S533：在第一粘接层上贴一层离型膜，以对粘接层进行隔离和保护。
S54: 通过第一粘接层将封装结构贴附于衬底基板上并覆盖有机发光器件，其中，吸水层位于第一粘接层上且环绕显示区域边缘，第二粘接层位于第一粘接层上并覆盖吸水层，阻隔层位于第二粘接层上。
可选地，柔性衬底基板的水氧阻隔能力通常不及玻璃、陶瓷等刚性基板，为了防止外界环境水汽由衬底基板浸入有机发光器件，S54还进一步包括：
通过第一粘接层将封装结构贴附于衬底基板与有机发光器件相对的另一侧上，并且因为衬底基板的这一侧未设置有机发光器件，所以这一侧的封装结构的第一粘接层完全贴附于衬底基板上。
可选地，在S54之后，还包括以下步骤：
S55：通过加压或加热使第一粘接层和第二粘接层固化，以得到封装完成后的显示面板。
在上述实施例中，封装结构设置于衬底基板上并覆盖有机发光器件的表面以及周边区域，通过第一、第二粘接层将没有粘接性的阻隔层贴附到有机发光器件的薄膜封装结构上，能够防止该薄膜封装结构因为异物而导致膜层破裂，同时也能阻隔水氧进入有机发光器件。
进一步地，为了防止水汽从第一、第二粘接层的两侧进入有机发光器件，在第一、第二粘接层之间设置的吸水层环绕显示区域边缘设置，并不覆盖显示面板的显示区域，能够防止因为吸水层的透过率低而影响显示面板的透过率。
可选地，第一、第二粘接层和吸水层的材质为热敏型或压敏型胶材，具有疏水性。当加热或者加压时，吸水层和粘接层会发生固化，同时伴随着粘接能力的增强，以完成显示面板的封装。另外，因为被按压，吸水层可能会陷入至第一粘接层中，进而被第一、第二粘接层所包裹。
可选地，吸水层的厚度小于第一、第二粘接层的总厚度的一半，以保证粘接层对衬底基板以及阻隔层具有足够的粘附力。
另外，吸水层的宽度可随显示区域周边的封装有效区域的宽度大小而适当调整，封装有效区域的宽度越大，吸水层的宽度也相应越大，以保证封装效果。
可选地，吸水层中均匀分散有干燥剂颗粒，该干燥剂颗粒的材料为金属氧化物，如氧化钙、氧化钡等，该干燥剂颗粒的粒径一般小于6微米。
可选地，第一、第二粘接层中均匀分布有干燥剂颗粒，以进一步阻止水汽进入有机发光器件，并且，为了避免粘接层中分布的干燥剂颗粒对显示面板透过率的影响，粘接层中分布的干燥剂颗粒优选为纳米级别的干燥剂颗粒或透明的干燥剂颗粒，以减小干燥剂颗粒对光线的散射或吸收。
举例而言，本申请实施例提供的显示面板的制作方法可以被具体实施为以下步骤：
S101：在玻璃基板上涂布PI液，然后制作TFT，从而提供柔性TFT基板；
S102：在柔性TFT基板上通过蒸镀或喷墨打印制作底发光或顶发光OLED器件；
S103：用在OLED器件的上方，用原子层沉积或化学气相沉积制作第一层阻水层；
S104：在第一无机层上方用喷墨打印制作有机层，通过紫外光使油墨固化；
S105：在有机层的上方，用原子层沉积或化学气相沉积制作第二层无机层；
S106：提供封装结构；
S107：撕掉封装结构的一侧的离型膜；
S108：将封装结构贴合到柔性TFT基板上；
S109：切割面板，将PI膜与玻璃基板分离；
S110：提供封装结构；
S111：撕掉封装结构的一侧的离型膜；
S112：将面封装结构贴合到柔性TFT基板PI侧；
S113：最后通过加压或加热使封装结构的粘接层固化，从而完成封装。
区别于现有技术，本申请提供的显示面板的制作方法，其封装结构的粘接层采用两层粘接层之间设置吸水层的方式，并且该吸水层环绕显示区域边缘设置，可以防止水汽从粘接层外侧侵入有机发光器件，不仅能满足显示面板对封装寿命的要求，同时也能满足对透过率的要求。
请参阅图7，图7是本申请实施例提供的显示装置的结构示意图，该显示装置71包括驱动电路和上述任一实施例的显示面板72，其中，驱动电路用于向显示面板72提供驱动电压。
本实施例中的显示面板72包括衬底基板、以及设置于衬底基板上的有机发光器件和封装结构，衬底基板包括显示区域和位于显示区域四周的非显示区域；有机发光器件位于显示区域；封装结构包括设置于衬底基板上并覆盖有机发光器件的第一粘接层、设置于第一粘接层上且环绕显示区域边缘的吸水层、设置于第一粘接层上并覆盖吸水层的第二粘接层、以及设置于第二粘接层上的阻隔层。
区别于现有技术，本实施例中的显示装置，其封装结构的粘接层采用两层粘接层之间设置吸水层的方式，并且该吸水层环绕显示区域边缘设置，可以防止水汽从粘接层外侧侵入有机发光器件，不仅能满足显示面板对封装寿命的要求，同时也能满足对透过率的要求。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种显示面板，其包括衬底基板、以及设置于所述衬底基板上的有机发光器件和封装结构，所述衬底基板包括显示区域和位于所述显示区域四周的非显示区域；
    所述有机发光器件位于所述显示区域；
    所述封装结构包括设置于所述衬底基板上并覆盖所述有机发光器件的第一粘接层、设置于所述第一粘接层上且环绕所述显示区域边缘的吸水层、设置于所述第一粘接层上并覆盖所述吸水层的第二粘接层、以及设置于所述第二粘接层上的阻隔层。
  2. 根据权利要求1所述的显示面板，其中，所述吸水层的厚度小于所述第一粘接层和所述第二粘接层的总厚度的一半。
  3. 根据权利要求1所述的显示面板，其中，所述阻隔层包括层叠交替设置的无机阻水层和有机缓冲层，所述无机阻水层和所述有机缓冲层的总层数不小于三层。
  4. 根据权利要求1所述的显示面板，其中，所述有机发光器件包括在所述衬底基板上层叠依次设置的发光层、第一无机层、有机层和第二无机层。
  5. 根据权利要求1所述的显示面板，其中，所述吸水层中分布有干燥剂颗粒，所述干燥剂颗粒的成分为金属氧化物。
  6. 根据权利要求1所述的显示面板，其中，所述第一粘接层和所述第二粘接层中分布有纳米级别的干燥剂颗粒或透明的干燥剂颗粒。
  7. 根据权利要求1所述的显示面板，其中，所述第一粘接层和所述第二粘接层的材料为压敏型或热敏型的胶材。
  8. 一种显示面板的制作方法，其包括：
    提供衬底基板，所述衬底基板包括显示区域和位于所述显示区域四周的非显示区域；
    在所述衬底基板的所述显示区域上形成机发光器件；
    提供封装结构，所述封装结构包括层叠设置的第一粘接层、吸水层、第二粘接层以及阻隔层；
    通过所述第一粘接层将所述封装结构贴附于所述衬底基板上并覆盖所述有机发光器件，其中，所述吸水层位于所述第一粘接层上且环绕所述显示区域边缘，所述第二粘接层位于所述第一粘接层上并覆盖所述吸水层，所述阻隔层位于所述第二粘接层上。
  9. 根据权利要求8所述的制作方法，其中，在所述通过所述第一粘接层将所述封装结构贴附于所述衬底基板上并覆盖所述有机发光器件的步骤之后，还包括以下步骤：
    通过加压或加热使所述第一粘接层和所述第二粘接层固化，得到封装完成后的显示面板。
  10. 根据权利要求8所述的制作方法，其中，所述提供封装结构的步骤，具体包括：
    提供所述阻隔层；
    在所述阻隔层上依次涂布所述第二粘接层、所述吸水层、所述第一粘接层。
  11. 根据权利要求8所述的制作方法，其中，所述吸水层的厚度小于所述第一粘接层和所述第二粘接层的总厚度的一半。
  12. 根据权利要求8所述的制作方法，其中，所述阻隔层由无机阻水层和有机缓冲层交替层叠形成，并且所述无机阻水层和所述有机缓冲层的总层数不小于三层。
  13. 根据权利要求8所述的制作方法，其中，所述在衬底基板的显示区域上形成有机发光器件的步骤具体包括：
    在所述衬底基板的所述显示区域上依次形成发光层、第一无机层、有机层和第二无机层。
  14. 一种显示装置，其包括驱动电路和显示面板，所述驱动电路用于向所述显示面板提供驱动电压，其中，
    所述显示面板包括衬底基板、以及设置于所述衬底基板上的有机发光器件和封装结构，所述衬底基板包括显示区域和位于所述显示区域四周的非显示区域；
    所述有机发光器件位于所述显示区域；
    所述封装结构包括设置于所述衬底基板上并覆盖所述有机发光器件的第一粘接层、设置于所述第一粘接层上且环绕所述显示区域边缘的吸水层、设置于所述第一粘接层上并覆盖所述吸水层的第二粘接层、以及设置于所述第二粘接层上的阻隔层。
  15. 根据权利要求14所述的显示装置，其中，所述吸水层的厚度小于所述第一粘接层和所述第二粘接层的总厚度的一半。
  16. 根据权利要求14所述的显示装置，其中，所述阻隔层包括层叠交替设置的无机阻水层和有机缓冲层，所述无机阻水层和所述有机缓冲层的总层数不小于三层。
  17. 根据权利要求14所述的显示装置，其中，所述有机发光器件包括在所述衬底基板上层叠依次设置的发光层、第一无机层、有机层和第二无机层。
  18. 根据权利要求14所述的显示装置，其中，所述吸水层中分布有干燥剂颗粒，所述干燥剂颗粒的成分为金属氧化物。
  19. 根据权利要求14所述的显示装置，其中，所述第一粘接层和所述第二粘接层中分布有纳米级别的干燥剂颗粒或透明的干燥剂颗粒。
  20. 根据权利要求14所述的显示装置，其中，所述第一粘接层和所述第二粘接层的材料为压敏型或热敏型的胶材。
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