WO2017209149A1 - Dispositif électroluminescent - Google Patents

Dispositif électroluminescent Download PDF

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Publication number
WO2017209149A1
WO2017209149A1 PCT/JP2017/020154 JP2017020154W WO2017209149A1 WO 2017209149 A1 WO2017209149 A1 WO 2017209149A1 JP 2017020154 W JP2017020154 W JP 2017020154W WO 2017209149 A1 WO2017209149 A1 WO 2017209149A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
emitting device
led
light emitting
package
Prior art date
Application number
PCT/JP2017/020154
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English (en)
Japanese (ja)
Inventor
田村　量
賢治 草野
友一 秋山
今井　貞人
高史 飯野
龍一 羽田
Original Assignee
シチズン電子株式会社
シチズン時計株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シチズン電子株式会社, シチズン時計株式会社 filed Critical シチズン電子株式会社
Priority to JP2018520938A priority Critical patent/JPWO2017209149A1/ja
Publication of WO2017209149A1 publication Critical patent/WO2017209149A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to a light emitting device.
  • a COB (Chip On Board) LED package in which a plurality of LED (light emitting diode) elements are mounted on one substrate and these LED elements are integrally sealed with a translucent resin containing a phosphor.
  • LED light emitting diode
  • a translucent resin containing a phosphor a translucent resin containing a phosphor.
  • white light or the like can be obtained according to the application by mixing light from each LED element and light obtained by exciting the phosphor with the light.
  • Patent Document 1 discloses a high-luminance light-emitting element having a base having thermal conductivity, a wiring board having a conductive portion fixed to the base, and a light-emitting element chip mounted on a mounting area of the base. Is described.
  • the base has a heat dissipation surface for dissipating heat from the light-emitting element chip, and the conductive portion of the wiring board is connected to the light-emitting element chip by an electrical connection member and one of the conductive portions.
  • An electrical connection surface for supplying a drive current for driving the light emitting element chip is provided in the portion, and the electrical connection surface and the heat dissipation surface of the base are arranged to face each other.
  • an LED chip is mounted on an electrode pattern formed on the surface of a base insulating substrate, the LED chip is sealed with a light-transmitting resin, and then a through-hole provided on a substrate on the mounting side.
  • a back-side mounted LED formed by back-side mounting so as to embed a sealing resin portion in a hole is described.
  • a light emitting device In order to increase the amount of light emitted from the light emitting device, it is conceivable to configure a light emitting device by mounting a plurality of COB LED packages on a common circuit board (main circuit board, wiring board, motherboard).
  • a common circuit board main circuit board, wiring board, motherboard.
  • the connection electrode to the external power source is formed on the upper surface of the package substrate, when the LED package is mounted on the upper surface of the circuit substrate, the space between the circuit substrate and the LED package is Difficult to make electrical connection.
  • the light emitting device emits light, heat is generated from each LED package. If a plurality of LED packages are used, the amount of heat generated is increased by the number of LED packages. Therefore, the heat is efficiently released to the outside. Is required.
  • an object of the present invention is to provide a light emitting device that uses a plurality of COB LED packages to increase the amount of emitted light and improve the heat dissipation of these LED packages.
  • Another object of the present invention is to improve the light extraction efficiency of the light emitting device including the LED package mounted on the opening of the circuit board from the back side of the circuit board and the bonding strength of the LED package.
  • a circuit board having an opening, a package board, an LED element mounted on the package board, and a sealing resin for sealing the LED element.
  • the package board is inserted into the opening from the back side of the circuit board.
  • the LED package has an LED package soldered to the back surface of the circuit board, and a heat dissipation board disposed in contact with the package board on the back side of the circuit board.
  • the LED package is soldered to the circuit board.
  • the two opposite corners of the package substrate are solder-connected to the circuit board, the slits are formed so as to correspond to the two corners of the package substrate, It is preferable that the LED package or the heat dissipation board is mechanically fixed at positions corresponding to the two corners.
  • the four corners of the package substrate are soldered to the circuit board, the slits are formed so as to correspond to the four corners of the package substrate, and the circuit board is at a position corresponding to the middle of each side of the package substrate, It is preferably mechanically fixed to the LED package or the heat dissipation substrate.
  • the light emitting device includes a plurality of LED packages, and the circuit board includes a plurality of openings into which the plurality of LED packages are inserted, and the package substrate of each LED package includes an elastic heat dissipation sheet. It is preferable to be in contact with the heat dissipation substrate.
  • the light emitting device has a plurality of LED packages
  • the circuit board has a plurality of openings into which the plurality of LED packages are respectively inserted, and the four corners of the circuit board are mechanically fixed to the heat dissipation board, It is preferable that another slit is formed in the circuit board at positions adjacent to the fixed positions at the four corners of the circuit board.
  • a circuit board having an opening, a package substrate, an LED element mounted on the package substrate, and a sealing resin that seals the LED element are inserted into the opening from the back side of the circuit board,
  • a light-emitting device comprising: a light-reflective ring-shaped resin formed so as to contact an upper surface of a substrate and an end surface of a circuit board in an opening.
  • a circuit board in which a plurality of openings are formed a package board in which connection electrodes to the circuit board are formed on the upper end, a plurality of LED elements mounted on the package board, and a plurality of LED elements are sealed.
  • a plurality of LED packages each having a sealing resin to be stopped, inserted into a plurality of openings from the back side of the circuit board, and having connection electrodes electrically connected to the back side of the circuit board;
  • a light emitting device including a heat dissipation substrate disposed on a back surface side of a circuit board so as to sandwich a package substrate of a plurality of LED packages therebetween.
  • connection electrodes of the plurality of LED packages are solder-connected to the back surface of the circuit board, and the circuit board is slit at positions adjacent to the connection positions where the connection electrodes of the plurality of LED packages are respectively solder-connected. Is preferably formed.
  • connection electrodes of the plurality of LED packages are respectively formed at two opposite corners of the package substrate, the slits are formed to correspond to the two corners of the package substrate, and the circuit board is In addition, it is preferably mechanically fixed to the plurality of LED packages or the heat dissipation substrate at positions corresponding to the other two corners of the package substrate.
  • connection electrodes of the plurality of LED packages are respectively formed at the four corners of the package substrate, the slits are formed so as to correspond to the four corners of the package substrate, and the circuit substrate is in the middle of each side of the package substrate. It is preferable to be mechanically fixed to the plurality of LED packages or the heat dissipation board at a position corresponding to.
  • the package substrates of the plurality of LED packages are in contact with the heat dissipation substrate via elastic heat dissipation sheets.
  • the four corners of the circuit board may be mechanically fixed to the heat dissipation board, and the circuit board may further have other slits formed at positions adjacent to the fixing positions at the four corners of the circuit board. preferable.
  • the light emitting device is formed so that each of the plurality of openings surrounds the sealing resin of the LED package inserted into the opening and contacts the upper surface of the package substrate and the end surface of the circuit board in the opening. It is preferable to further have a light-reflecting cyclic resin.
  • the cyclic resin has a slope inclined so that the diameter of the space portion in the opening becomes larger toward the upper side in the opening.
  • each of the plurality of LED packages further includes a resin frame formed on the package substrate so as to surround the plurality of LED elements and filled with sealing resin therein, and the annular resin has a plurality of openings.
  • the annular resin has a plurality of openings.
  • the height from the upper surface of the heat dissipation substrate to the upper surface of the circuit board in the plurality of openings is preferably larger than the height from the upper surface of the heat dissipation substrate to the upper surface of the sealing resin of the plurality of LED packages.
  • the amount of emitted light is increased by using a plurality of COB LED packages, and the heat dissipation of these LED packages is improved.
  • the stress generated by soldering the LED package to the circuit board is relieved, and the circuit board is less likely to bend.
  • the light extraction efficiency and the bonding strength of the LED package of the light emitting device including the LED package mounted on the opening of the circuit board from the back side of the circuit board are improved.
  • FIG. 1 is a perspective view of a light emitting device 1.
  • FIG. 2 is a top view of the light emitting device 1.
  • FIG. 1 is a side view of a light emitting device 1.
  • FIG. It is a reverse view of the light-emitting device 1 from which the thermal radiation board
  • 3 is a top view of the circuit board 2.
  • FIG. 3 is a cross-sectional view of the light emitting device 1 taken along line VI-VI in FIG. 2.
  • (A) to (D) are perspective views for explaining the structure and manufacturing process of the LED package 4.
  • (A) And (B) is the top view and sectional drawing for demonstrating the effect
  • FIG. 1 is a perspective view of a light emitting device 1.
  • FIG. 2 is a top view of the light emitting device 1.
  • FIG. 1 is a side view of a light emitting device 1.
  • FIG. It is a
  • FIG. It is the elements on larger scale of another light-emitting device 1A.
  • (A) And (B) is the top view and side view of another light-emitting device 1B.
  • (A) to (C) are a top view, a side view, and a partially enlarged view of still another light emitting device 1C.
  • FIG. 16 is a cross-sectional view of the light emitting device 1D along the line XIX-XIX in FIG. It is a fragmentary sectional view of light-emitting device 1D for demonstrating the function of the cyclic resin 56.
  • FIG. It is sectional drawing at the time of using LED package 4 'with the light-emitting device 1D. It is sectional drawing at the time of using LED package 5 by light-emitting device 1D.
  • (A) And (B) is a fragmentary sectional view of light-emitting device 1D at the time of using another cyclic resin 56A, 56B.
  • (A) And (B) is the top view and sectional drawing of another cyclic resin 56C. It is sectional drawing of another LED package 5 '. It is a top view of another light emitting device 1E. It is a figure which shows the example of the shape of the heat sink in the light-emitting device 1E. (A) and (B) explain the stress generated when the LED package is solder-connected to the back side of the circuit board 2 'and the circuit board 2' and the heat dissipation board 3 on the back side thereof are screwed together. It is the top view and sectional drawing for doing. It is sectional drawing which shows the example of the light-emitting device containing a back surface mounting type LED package.
  • the light emitting device 1 has a structure in which a plurality of LED packages 4 are mounted on a circuit board 2 from the back side, and a heat dissipation board 3 is arranged on the back side.
  • FIG. 4 is a rear view of the light emitting device 1 from which the heat dissipation substrate 3 has been removed.
  • the light emitting device 1 has 21 LED packages 4 as light emitting portions, and is used as, for example, various LED light source devices for illumination. However, this 21 is an example, and the number of LED packages 4 is not particularly limited, and may be one, for example.
  • FIG. 5 is a top view of the circuit board 2.
  • the circuit board 2 (main circuit board, wiring board, mother board) is a substantially rectangular insulating board.
  • FR-4 Flume Retardant Type 4
  • FR-4 Flume Retardant Type 4
  • 21 openings 12 for inserting the LED packages 4 are formed on the circuit board 2 at substantially equal intervals.
  • two screw holes 17 and “ ⁇ ”-shaped slits 16 are formed per one opening 12 around each opening 12 in the circuit board 2.
  • the two slits 16 are opposed to each other with the opening 12 interposed therebetween, and the two screw holes 17 are also opposed to each other with the opening 12 interposed therebetween.
  • a total of four of these are formed at the rectangular corners surrounding the opening 12.
  • Each is arranged.
  • a fixing screw 15 is attached to the screw hole 17.
  • two electrodes 13 for connecting the light emitting device 1 to an external power source are formed.
  • the circuit board 2 is for electrically connecting the electrode 13 and the LED package 4 mounted in each opening 12 (that is, a plurality of LED packages 4 to each other).
  • a wiring pattern is formed.
  • each LED package 4 emits light.
  • all the LED packages 4 of the light emitting device 1 may emit light simultaneously, or only some of the LED packages 4 may emit light depending on the wiring pattern on the circuit board 2.
  • the heat dissipation substrate 3 is a rectangular metal substrate disposed on the back side of the circuit board 2 in contact with the package substrates of the plurality of LED packages 4 so that each LED package 4 is sandwiched between the circuit boards 2. Since the heat dissipation substrate 3 functions as a heat sink for releasing the heat generated in each LED package 4 to the outside of the light emitting device 1, it is made of, for example, aluminum or copper having excellent heat resistance and heat dissipation. However, the material of the heat dissipation substrate 3 may be other than aluminum and copper as long as it has excellent heat resistance and heat dissipation. As shown in FIGS. 1 to 3, at the four corners of the circuit board 2 and the heat dissipation board 3, they are fixed to each other by screws 14.
  • FIG. 6 is a cross-sectional view of the light emitting device 1 taken along line VI-VI in FIG.
  • a step is formed in the thickness direction in each opening 12 of the circuit board 2, and the diameter of the opening 12 is larger on the back side than on the top side.
  • Each LED package 4 is a COB LED package, and includes a package substrate 20, an LED element 51, a resin frame 53, and a sealing resin 54, and is inserted into the opening 12 from the back side of the circuit substrate 2.
  • Each LED package 4 is solder-connected to the step portion in the opening 12 from the back surface side of the circuit board 2 at the end of the package substrate 20.
  • the step 12 as shown in FIG. 6 may not be formed in the opening 12 of the circuit board 2, and each LED package 4 is soldered to the back surface of the circuit board 2 outside the opening 12. It may be.
  • FIGS. 7A to 7D are perspective views for explaining the structure and manufacturing process of the LED package 4.
  • the package substrate 20 is configured by attaching an insulating substrate 22 having an opening 221 at the center to the upper surface of the metal substrate 21, and has a rectangular shape as a whole.
  • the upper surface of the metal substrate 21 has a mounting region 211 in which the LED element 51 is mounted at the center, and the rear surface of the metal substrate 21 is in contact with the heat dissipation substrate 3. Since the metal substrate 21 has a function of dissipating heat generated by the LED elements 51 and phosphor particles, which will be described later, toward the heat dissipation substrate 3, the metal substrate 21 is made of, for example, aluminum or copper, similarly to the heat dissipation substrate 3.
  • an arc-shaped wiring pattern 23a is formed on one side of the center line that bisects the opening 221, and an arc-shaped wiring pattern 23b is formed on the other side. It is formed so as to surround it.
  • a connection electrode 24a connected to the wiring pattern 23a is provided at one corner located diagonally on the upper surface of the insulating substrate 22, and a connection electrode 24b connected to the wiring pattern 23b is provided at the other corner, respectively. Is formed.
  • the LED element 51 is, for example, a blue LED made of a gallium nitride compound semiconductor and emitting blue light having an emission wavelength band of about 450 to 460 nm.
  • the emission wavelength band of the LED element 51 is not particularly limited, and the LED element 51 may be, for example, a green LED that emits green light or a red LED that emits red light.
  • the LED element 51 of one LED package 4 is a blue LED, and the LED element 51 of another LED package 4 is a green LED. It may be.
  • FIG. 7B shows an example in which nine LED elements 51 are mounted for ease of illustration, but the number of LED elements 51 included in the LED package 4 is not particularly limited. For example, it may be one.
  • the lower surface of the LED element 51 is fixed to the upper surface of the metal substrate 21 with, for example, a transparent insulating adhesive.
  • the LED element 51 has a pair of element electrodes on the upper surface, and as shown in FIG. 7C, the element electrodes of the adjacent LED elements 51 are mutually connected by bonding wires 52 (hereinafter simply referred to as wires 52). Is electrically connected.
  • a wire 52 coming out of the LED element 51 located on the outer peripheral side of the mounting region 211 is connected to the wiring pattern 23 a or the wiring pattern 23 b of the insulating substrate 22. Thereby, a current is supplied to each LED element 51 through the wire 52.
  • the resin frame 53 is a circular frame made of, for example, white resin in accordance with the size of the mounting region 211, and surrounds the LED element 51 mounted on the mounting region 211 on the upper surface of the insulating substrate 22.
  • the wiring patterns 23a and 23b are fixed at positions overlapping with each other.
  • the resin frame 53 is a dam material for preventing the sealing resin 54 from flowing out, and the light emitted from the LED element 51 to the side is above the LED package 4 (on the upper surface side of the circuit board 2). Reflect towards.
  • the sealing resin 54 is made of, for example, a colorless and transparent thermosetting resin such as an epoxy resin or a silicone resin.
  • the sealing resin 54 is filled in a space on the mounting region 211 surrounded by the resin frame 53, and the LED element 51 and the wire 52 is integrally covered and protected (sealed).
  • the upper surface of the circuit board 2 is higher than the upper surfaces of the resin frame 53 and the sealing resin 54, but these heights are the same or reversed depending on the thickness of the circuit board 2. You may do it.
  • the sealing resin 54 may contain a phosphor that is excited by the LED element 51.
  • the sealing resin 54 may contain a yellow phosphor such as YAG (Yttrium Aluminum Garnet).
  • the LED package 4 emits white light obtained by mixing the blue light from the LED element 51 and the yellow light obtained by exciting the yellow phosphor thereby.
  • the sealing resin 54 may contain, for example, a plurality of types of phosphors such as a yellow phosphor and a red phosphor, or may contain different types of phosphors for each LED package 4.
  • a plurality of LED elements 51 are mounted in the mounting region 211 of the package substrate 20 shown in FIG.
  • the LED elements 51 are connected to each other by wires 52 and are electrically connected to the wiring patterns 23 a and 23 b through the wires 52.
  • a resin frame 53 is formed around the opening 221 on the upper surface of the insulating substrate 22, and then a region surrounded by the resin frame 53 is filled with the sealing resin 54. The Thereby, the LED package 4 shown in FIG. 6 is completed.
  • the shape of the opening 221 of the insulating substrate 22 in the LED package 4 may be rectangular, unlike the illustrated example.
  • the mounting area 211 of the metal substrate 21 and the resin frame 53 are also rectangular.
  • the mounting area 211 may be rectangular and the LED elements 51 may be arranged in a rectangular lattice.
  • the opening 12 of the circuit board 2 may be rectangular, unlike the illustrated example.
  • the LED package 4 is mounted on each opening 12 of the circuit board 2 from the back surface side. Therefore, even a COB LED package having no electrode on the back surface of the package substrate can be easily mounted. It is possible to easily increase the amount of emitted light. Further, in the light emitting device 1, the heat dissipation substrate 3 is disposed in contact with the package substrate of each LED package 4, and the heat generated in each LED package 4 is released to the outside of the device through the heat dissipation substrate 3. Will improve. The same applies to the light emitting devices 1A to 1E described below.
  • FIG. 28A illustrates the stress generated when the LED package is solder-connected to the back side of the circuit board 2 ′ and the circuit board 2 ′ and the heat dissipation board 3 on the back side thereof are screwed.
  • FIG. FIG. 28B is a cross-sectional view along the line XXVIIIB-XXVIIIB shown in FIG.
  • an LED package in which a circular resin frame 53 is formed on the upper surface of a rectangular package substrate 20 and an LED element (not shown) is mounted on the inner region and sealed with a sealing resin 54 is the circuit substrate 2.
  • the circular openings 12 ' are connected to the circuit board 2' from the back side by solders 25a and 25b.
  • the back surface side of the package substrate 20 is in contact with the heat dissipation substrate 3, and the circuit board 2 ′ is fixed to the heat dissipation substrate 3 with the LED package interposed therebetween via two screws 15.
  • FIGS. 8A and 8B are a top view and a cross-sectional view for explaining the function of the slit 16 in the circuit board 2 of the light emitting device 1, respectively.
  • FIG. 8A is a partially enlarged view of the upper surface of the circuit board 2, and the position of the package board 20 of the LED package 4 is also indicated by a broken line.
  • FIG. 8B is a cross-sectional view taken along line VIIIB-VIIIB shown in FIG.
  • the package substrate 20 is connected to the wiring pattern on the back surface side of the circuit board 2 by solder 25a and 25b at two opposing corners where the connection electrodes 24a and 24b are formed. ing.
  • the slit 16 of the circuit board 2 is formed in the vicinity of the connection position so as to correspond to the two corners of the LED package 4 where the solder 25a and 25b are connected. In other words, the slit 16 is formed at a position adjacent to a connection position where each LED package 4 is solder-connected.
  • the shape of the slit 16 is not particularly limited, for example, may be a straight line shape or a curved shape, unlike the “ ⁇ ” shape shown in the figure.
  • the circuit board 2 is fixed to the package board 20 (LED package 4) by screws 15 at positions corresponding to the other two corner portions of the package board 20 that are not soldered.
  • the fixing means is not limited to a screw as long as the circuit board 2 and the package substrate 20 are mechanically fixed.
  • the circuit board 2 and the heat dissipation board 3 may be mechanically fixed by screws 15 around the package board 20 (opening 12).
  • a horizontal stress Fh acts on the circuit board 2 'and the package board 20 at the joints formed by the solders 25a and 25b. Further, by screwing the circuit board 2, the stress Fv in the vertical direction also acts on the circuit board 2 as shown in FIG. However, in the circuit board 2, since the slit 16 is formed in the vicinity of the connection position of the solders 25a and 25b, a reverse force Fh ′ that cancels the horizontal stress Fh also acts, and this results from the solder connection. Stress is relieved. In addition, since the slit 16 is formed in the circuit board 2, a reverse force Fv ′ that cancels the stress Fv in the vertical direction also acts, so that the stress caused by screwing is also alleviated.
  • FIG. 9 is a cross-sectional view of another LED package 4 '.
  • the LED package 4 ′ is different from the LED package 4 in that it has a ceramic substrate 30 instead of the package substrate 20 in which the metal substrate 21 and the insulating substrate 22 are bonded together, but otherwise has the same configuration as the LED package 4.
  • the ceramic substrate 30 is also an example of a package substrate, and the light emitting device 1 may have an LED package 4 ′ shown in FIG. 9 instead of the LED package 4.
  • the ceramic substrate 30 is a flat substrate on which a wiring pattern and connection electrodes are formed and on which the LED elements 51 are mounted.
  • the ceramic substrate 30 also functions as the metal substrate 21 and the insulating substrate 22 of the LED package 4.
  • the package substrate can be a flat substrate having no opening. Further, although the ceramic substrate has a property of being easily cracked, since the stress relaxation effect can be obtained as described above by providing the slit 16 in the circuit substrate 2, even when the ceramic substrate is used as the package substrate, the ceramic substrate is cracked. Can be prevented.
  • FIG. 10 is a cross-sectional view of yet another LED package 5.
  • the LED package 5 is different from the LED package 4 in that it has a lead frame 40 instead of the package substrate 20 and a lens resin 55 is added, but has the same configuration as the LED package 4 in other points.
  • the lead frame 40 is also an example of a package substrate, and the light emitting device 1 may have the LED package 5 shown in FIG.
  • the lead frame 40 is electrically connected to the LED element 51 and the circuit board 2, the mounting part 41 having the LED element 51 mounted on the upper surface and the back surface being in contact with the heat dissipation board 3, and being thinner than the mounting part 41. Electrode portions 44a and 44b. Insulating resin 42 is filled between the mounting portion 41 and the electrode portions 44a and 44b, and between the electrode portions 44a and 44b and the heat dissipation substrate 3 to be electrically insulated from each other. If the LED package 5 having the lead frame 40 is used, it is possible to ensure both electrical insulation between the LED package and the heat dissipation board and heat dissipation from the LED package to the heat dissipation board.
  • the lens resin 55 is a substantially hemispherical member formed on the upper surface side of the opening 12 in which the LED package 5 is inserted.
  • the lens resin 55 covers the entire sealing resin 54 and extends from the LED element 51 through the sealing resin 54.
  • the emitted light is condensed.
  • the lens resin 55 is formed by injection molding using, for example, a transparent resin such as a silicone resin after the LED package 5 is mounted in the opening 12 from the back side of the circuit board 2. Even when the LED packages 4 and 4 ′ described above are used, such a lens resin may be formed on the upper surface side of the circuit board 2.
  • FIG. 11 is a partially enlarged view of another light emitting device 1A.
  • FIG. 11 only the part of one LED package in the light emitting device 1A is shown in an enlarged manner.
  • the LED package shown in FIG. 11 is the same as the LED package 4 described above. However, unlike the LED package 4, the four corners of the package substrate 20 are formed on the back side of the circuit board 2A by solder 25a, 25b, 25c, 25d. Connected to the wiring pattern.
  • the circuit board 2A has four slits 16A per LED package.
  • the slit 16A has the same “ ⁇ ” shape as the slit 16, and is located in the vicinity of the connection position so as to correspond to the four corners of the LED package 4 where the solder 25a, 25b, 25c, and 25d are connected. Is formed.
  • the circuit board 2A is fixed to the heat dissipation board 3 with four screws 15A at positions corresponding to the middle of the sides of the package board 20 of each LED package 4.
  • the screw 15A may fix the circuit board 2A and the package board 20.
  • the positions of the slits are not limited to two, but may be four.
  • the stress caused by solder connection and the stress mitigating effect caused by screwing can be obtained.
  • FIGS. 12A and 12B are a top view and a side view of yet another light emitting device 1B, respectively.
  • the number of mounted LED packages 4 is 15, and the point that the package substrate 20 of each LED package 4 is in contact with the heat radiating substrate 3 through the heat radiating sheet 6 is the light emitting device 1.
  • Reference numeral 2B in FIGS. 12A and 12B denotes a circuit board of the light-emitting device 1B.
  • the heat dissipation sheet 6 is a rubber type sheet having thermal conductivity and elasticity.
  • each LED package When a plurality of LED packages are mounted on a circuit board, the height of each LED package may vary depending on the soldering state. If there is such a variation in height, a gap may be formed between the LED package 4 and the heat dissipation board 3, and heat dissipation to the heat dissipation board 3 may be insufficient.
  • the package substrate 20 of each LED package 4 is preferably brought into contact with the heat dissipation substrate 3 through the heat dissipation sheet 6 having thermal conductivity and elasticity as in the light emitting device 1B. With the heat dissipating sheet 6, it is possible to absorb variations in height when a plurality of LED packages are mounted on a circuit board, and a stable thermal connection from each LED package to the heat dissipating board becomes possible.
  • FIGS. 13A to 13C are a top view, a side view, and a partially enlarged view of still another light emitting device 1C, respectively.
  • FIG. 13C is an enlarged view of the upper surface of the portion indicated by reference numeral XIIIC in FIGS. 13A and 13B.
  • the light emitting device 1C is different from the light emitting device 1 in that the number of mounted LED packages 4 is 15, and the slits 16C are formed at the four corners of the circuit board 2C. It has the same configuration as the device 1.
  • the slit 16 ⁇ / b> C has the same “ ⁇ ” shape as the slit 16, and is provided around the screw 14 that fixes the circuit board 2 and the heat dissipation board 3 at each of the four corners of the circuit board 2 ⁇ / b> C. It is formed one by one.
  • the circuit board When the four corners of the circuit board are fixed with screws or the like, the circuit board may bend, and for example, the central part of the circuit board may rise, resulting in poor connection of the LED package.
  • FIG. 29 is a cross-sectional view showing an example of a light emitting device including a back surface mount type LED package.
  • the LED package having the metal substrate 21, the insulating substrate 22, the LED element 51, the resin frame 53, and the sealing resin 54 is formed on the circuit board 2D in a stepped opening (through hole) of the circuit board 2D. It is mounted from the back side.
  • This LED package is solder-connected to the circuit board 2D at the connection electrodes 24a and 24b formed on the upper surface end of the insulating substrate 22, and the heat dissipation board 3 is disposed on the back side of the LED package and the circuit board 2D. Has been placed.
  • the LED element 51 is mounted at the center of the upper surface of the metal substrate 21 and is electrically connected to the wiring patterns 23a and 23b on the insulating substrate 22 fixed to the outer peripheral portion of the upper surface of the metal substrate 21 via wires 52. It is sealed with a sealing resin 54 filled in a resin frame 53 on the insulating substrate 22.
  • a part of the emitted light L directed from the upper surface of the sealing resin 54 which is the light emitting portion of the LED package to the side is irradiated onto the end surface 2E of the circuit board 2D.
  • the opening of the circuit board is not subjected to special processing in consideration of reflection, and the reflectance of the end face of the circuit board is low, so a part of the emitted light from the light emitting part is irradiated to this end face.
  • optical loss vignetting
  • a loss of several percent of the total luminous flux from the LED element may occur, thereby reducing the light extraction efficiency above the board.
  • the circuit board If the circuit board is made thinner or the diameter of the opening is made larger, this loss will be reduced. However, the circuit board needs to have a certain thickness from the viewpoint of mechanical strength. Since there is a limit, there is a limit in enlarging the diameter of the opening.
  • the bonding strength is weak.
  • the LED package is easily peeled off at the joint. Accordingly, in a light emitting device including a back surface mounting type LED package, a device for increasing the bonding strength between the LED package and the circuit board is also required. Therefore, in the following, a light emitting device with improved light extraction efficiency and LED package bonding strength will be described.
  • FIG 14 to 16 are a perspective view, a top view, and a side view, respectively, of yet another light emitting device 1D.
  • 17 is a rear view of the light emitting device 1D from which the heat dissipation substrate 3 is removed
  • FIG. 18 is a top view of the circuit board 2D of the light emitting device 1D
  • FIG. 19 is taken along line XIX-XIX in FIG. It is sectional drawing of light-emitting device 1D.
  • the light emitting device 1D is different from the light emitting device 1 in that the slit 16 is not formed on the circuit board and the annular resin 56 is formed around each opening 12 instead. It has the same configuration as the device 1.
  • the light emitting device 1 ⁇ / b> D will be described with a focus on differences from the light emitting device 1, and description overlapping with the light emitting device 1 will be omitted.
  • the light emitting device 1 ⁇ / b> D is applied so as to surround the entire periphery of the end surface of the circuit board 2 ⁇ / b> D in each of the plurality of openings 12 (see FIG. 18).
  • the cyclic resin 56 is a light-reflective white resin.
  • particles such as titanium oxide, silicon dioxide, zirconium dioxide, alumina, or boron nitride are used as a reflective filler in a silicone resin, an epoxy resin, an acrylic resin, or the like. Consists of mixing.
  • the lower end of the annular resin 56 covers the upper surface end of the package substrate 20 without contacting the resin frame 53 of the LED package 4 inserted into the opening 12, and the upper end of the annular resin 56 is on the upper surface of the circuit board 2D. It reaches the edge of the opening 12. That is, the annular resin 56 surrounds the sealing resin 54 of the LED package 4, and the upper surface of the package substrate 20 of the LED package 4 and the end surface of the circuit substrate 2 ⁇ / b> D in the opening 12 (corresponding to the end surface 2 ⁇ / b> E in FIG. 29). ).
  • the surface of the annular resin 56 is preferably a slope that is monotonously inclined so that the diameter of the space portion in the opening 12 becomes larger toward the upper side in the opening 12.
  • the opening 12 of the circuit board 2D may also be rectangular, unlike the illustrated example.
  • the annular resin 56 is formed in a rectangular frame shape so as to surround the entire circumference of the end surface of the circuit board 2 ⁇ / b> D in the opening 12.
  • FIG. 20 is a partial cross-sectional view of the light emitting device 1D for explaining the function of the annular resin 56.
  • the light-reflective annular resin 56 is applied to the end surface of the circuit board 2D in the opening 12, so that the side from the top surface of the sealing resin 54 of the LED package 4 is shown in FIG.
  • the outgoing light L traveling in the direction is reflected above the light emitting device 1D on the surface of the annular resin 56.
  • the surface of the annular resin 56 an inclined surface, the emitted light L is easily reflected above the light emitting device 1D. For this reason, in light-emitting device 1D, the light extraction efficiency from LED package 4 improves compared with the case where the cyclic resin 56 is not provided.
  • the height h1 from the upper surface of the heat dissipation board 3 to the upper surface of the circuit board 2D in the opening 12 is the upper end of the resin frame 53 of the LED package 4 from the upper surface of the heat dissipation board 3.
  • the height to the upper surface of the sealing resin 54 is greater than h2.
  • the cyclic resin 56 is particularly effective for improving the light extraction efficiency from the LED package 4 when h1> h2 as described above.
  • each LED package 4 is solder-connected to the step portion in the opening 12 from the back surface side of the circuit board 2D at the end of the package substrate 20, and the circuit board in the opening 12 is further connected.
  • the annular resin 56 applied so as to cover the 2D end face is also fixed to the circuit board 2D.
  • the bonding area between the circuit board 2D and the LED package 4 is relatively wide. .
  • the mechanical bonding strength between the circuit board 2D and the LED package 4 is improved as compared with the case where the annular resin 56 is not provided.
  • FIG. 21 is a cross-sectional view when the LED package 4 'is used in the light emitting device 1D.
  • FIG. 22 is a cross-sectional view when the LED package 5 is used in the light emitting device 1D.
  • the LED package 4 may be replaced with the LED package 4 ′ having the ceramic substrate 30, or the LED package 5 having the lead frame 40 and the lens resin 55. May be.
  • the lens resin 55 may be disposed so as to cover the sealing resin 54 and the annular resin 56 for each opening 12 of the circuit board 2D. .
  • FIG. 23 (A) and 23 (B) are partial cross-sectional views of the light emitting device 1D when different annular resins 56A and 56B are used, respectively.
  • the annular resins 56A and 56B are made of the same material as the annular resin 56, but the end surface 2E of the circuit board 2D in each opening 12 and the resin frame 53 of the LED package 4 inserted in the opening 12 are used. The region on the package substrate 20 between them is filled. As described above, the end of the annular resin 56 ⁇ / b> B on the center side of the opening 12 may be in contact with the resin frame 53 of the LED package 4 inserted into the opening 12.
  • the amount of resin applied as the cyclic resin is larger than that in FIG. 23A.
  • FIG. 23B the amount of resin applied as the cyclic resin is larger than that in FIG. 23A.
  • the end of the cyclic resin 56B is directly above the resin frame 53. Has reached. If more resin than this is applied as the cyclic resin, the cyclic resin covers the upper surface of the sealing resin 54 and hinders light emission. Therefore, the amount of resin is preferably smaller than the example of FIG.
  • the cross section of the resin frame 53 is rectangular and the upper end thereof is a flat surface. However, as shown in FIGS. 23 (A) and 23 (B), the resin frame 53 The cross section of 53 may be rounded.
  • FIGS. 24A and 24B are a top view and a cross-sectional view of still another cyclic resin 56C, respectively.
  • FIG. 24B shows a cross section of the cyclic resin 56C along the line XXIVB-XXIVB in FIG.
  • the annular resins 56, 56A, and 56B are formed by applying a resin on the circuit board 2D after each LED package 4 is mounted on the circuit board 2D.
  • the annular resin may be produced in advance as a single component by resin molding or the like, and this is formed in each opening 12 of the circuit board 2D. It may be fitted in.
  • FIG. 25 is a cross-sectional view of yet another LED package 5 '.
  • the LED package 5 ′ is an LED package in which a hemispherical lens resin 55 ′ is formed, similar to the LED package 5 shown in FIGS. 10 and 22.
  • the lens resin 55 of the LED package 5 is formed so as to cover the entire upper surface side of the opening 12 of the circuit board 2 after the LED package 5 is mounted on the circuit board 2.
  • the lens resin 55 ′ of the LED package 5 ′ is not so large as to cover the entire upper surface side of the opening 12 of the circuit board 2D, and spreads only above the resin frame 53 and the sealing resin 54 of the LED package 5 ′.
  • it is formed at the stage of a single LED package.
  • an LED package in which a lens resin is formed in advance such as the LED package 5 ', may be used.
  • FIG. 26 is a top view of yet another light emitting device 1E.
  • the light emitting device 1E is different from the light emitting device 1 only in that the same cyclic resin 56 as that of the light emitting device 1D is added, and has the same configuration as the light emitting device 1 in other points.
  • one light emitting device may have both the slit 16 of the light emitting device 1 and the annular resin 56 of the light emitting device 1D.
  • FIG. 27 is a diagram showing an example of the shape of the heat dissipation board in the light emitting device 1E.
  • the heat radiating substrate 3 of the light emitting devices 1 and 1D is composed of one metal substrate having a size sufficient to cover all the LED packages 4 in the light emitting device.
  • the heat radiating board 3 ′ in the example shown in FIG. 27 is composed of two metal substrates denoted by reference numerals 3a and 3b.
  • One heat radiating board 3a is in contact with a part of the LED packages 4 and the other heat radiating board.
  • 3 b is in contact with the remaining LED package 4.
  • the heat dissipation substrate of the light emitting device does not necessarily have to be in contact with all the LED packages, and a plurality of the heat dissipation substrates may be arranged so as to cover all the LED packages.
  • the heat dissipation board should just function as a heat sink, the shape is not limited to a flat plate shape, and may be formed with heat dissipation fins.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne un dispositif électroluminescent dans lequel la quantité de lumière émise à l'aide d'une pluralité de boîtiers de LED COB est augmentée, et la dissipation de chaleur des boîtiers LED est améliorée. Le dispositif électroluminescent comporte : une carte de circuit imprimé dans laquelle sont formées une pluralité d'ouvertures; une pluralité de boîtiers LED ayant chacun un substrat de boîtier dans lequel une électrode de connexion à la carte de circuit imprimé est formée sur la partie terminale de la surface supérieure, une pluralité d'éléments LED montés sur le substrat de boîtier, et une résine de scellement destinée à sceller la pluralité d'éléments LED, la pluralité de boîtiers LED étant insérés, respectivement, dans la pluralité d'ouvertures à partir du côté de la surface arrière de la carte de circuit imprimé, et les électrodes de connexion étant électriquement connectées à la surface arrière de la carte de circuit imprimé; et un substrat de dissipation de chaleur disposé sur le côté de la surface arrière de la carte de circuit imprimé de façon à prendre en sandwich les substrats de boîtier de la pluralité de boîtiers de LED contre la carte de circuit imprimé.
PCT/JP2017/020154 2016-05-31 2017-05-30 Dispositif électroluminescent WO2017209149A1 (fr)

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JP2019212752A (ja) * 2018-06-05 2019-12-12 日亜化学工業株式会社 発光装置
JPWO2021039096A1 (fr) * 2019-08-27 2021-03-04
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JP2022025833A (ja) * 2020-07-30 2022-02-10 日本特殊陶業株式会社 半導体パッケージ、および、半導体パッケージアレイ
JP2023143976A (ja) * 2018-12-12 2023-10-06 日亜化学工業株式会社 発光モジュールの製造方法、発光モジュール及びプロジェクタ
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CN113497075B (zh) * 2020-04-01 2024-06-11 刘台徽 全彩微型发光二极管封装体及其封装方法
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