Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
  • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
  • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
  • C08G63/66—Polyesters containing oxygen in the form of ether groups
  • C08G63/668—Polyesters containing oxygen in the form of ether groups derived from polycarboxylic acids and polyhydroxy compounds
  • C08G63/672—Dicarboxylic acids and dihydroxy compounds
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
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  • B32B27/00—Layered products comprising a layer of synthetic resin
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• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
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  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
  • B32B27/24—Layered products comprising a layer of synthetic resin characterised by the use of special additives using solvents or swelling agents
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
  • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
  • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
  • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
  • C08G63/16—Dicarboxylic acids and dihydroxy compounds
  • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
  • C08G63/181—Acids containing aromatic rings
  • C08G63/185—Acids containing aromatic rings containing two or more aromatic rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
  • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
  • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
  • C08G63/16—Dicarboxylic acids and dihydroxy compounds
  • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
  • C08G63/19—Hydroxy compounds containing aromatic rings
  • C08G63/193—Hydroxy compounds containing aromatic rings containing two or more aromatic rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
  • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
  • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
  • C08G63/16—Dicarboxylic acids and dihydroxy compounds
  • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
  • C08G63/19—Hydroxy compounds containing aromatic rings
  • C08G63/193—Hydroxy compounds containing aromatic rings containing two or more aromatic rings
  • C08G63/195—Bisphenol A
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/18—Manufacture of films or sheets
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
  • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2250/00—Layers arrangement
  • B32B2250/02—2 layers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2250/00—Layers arrangement
  • B32B2250/24—All layers being polymeric
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2250/00—Layers arrangement
  • B32B2250/24—All layers being polymeric
  • B32B2250/244—All polymers belonging to those covered by group B32B27/36
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/30—Properties of the layers or laminate having particular thermal properties
  • B32B2307/306—Resistant to heat
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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• • B—PERFORMING OPERATIONS; TRANSPORTING
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  • B32B2307/00—Properties of the layers or laminate
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• • B—PERFORMING OPERATIONS; TRANSPORTING
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  • B32B2307/00—Properties of the layers or laminate
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• • B—PERFORMING OPERATIONS; TRANSPORTING
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  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/70—Other properties
  • B32B2307/724—Permeability to gases, adsorption
  • B32B2307/7242—Non-permeable
  • B32B2307/7246—Water vapor barrier
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
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  • B32B2307/748—Releasability
• • B—PERFORMING OPERATIONS; TRANSPORTING
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• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/08—PCBs, i.e. printed circuit boards
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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  • B32B2457/10—Batteries
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
  • B32B2457/202—LCD, i.e. liquid crystal displays
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
  • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2201/00—Properties
  • C08L2201/08—Stabilised against heat, light or radiation or oxydation
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2201/00—Properties
  • C08L2201/10—Transparent films; Clear coatings; Transparent materials
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2203/00—Applications
  • C08L2203/16—Applications used for films
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2203/00—Applications
  • C08L2203/20—Applications use in electrical or conductive gadgets

Definitions

• the present invention relates to a polyarylate resin excellent in heat resistance, abrasion resistance, solubility in non-halogen organic solvents, water vapor barrier properties, mechanical properties, dripping resistance and deformation resistance, and a film and a laminate comprising the same. Is.
• polyarylate resin Since polyarylate resin is excellent in heat resistance, mechanical strength and transparency, it is expected to be applied to a wide range of fields such as electrical and electronic applications, automotive applications, and mechanical applications. In recent years, polyarylate resins have been studied to be applied to liquid crystal displays by taking advantage of their characteristics.
• the polyarylate resin When a polyarylate resin is used in a liquid crystal display, the polyarylate resin is dissolved in an organic solvent at room temperature to form a resin solution and coated on the display. Therefore, solubility in non-halogen organic solvents is required from the viewpoint of the effects of the above and the safety of workers.
• Patent Document 1 discloses a polyarylate resin containing diphenyl ether-4,4'-dicarboxylic acid.
• Patent Documents 2 and 3 disclose polyarylate resins containing 2,2-bis (4-hydroxyphenyl) -4-methylpentane.
• the polyarylate resin of Patent Document 1 has a limit in solubility in non-halogen organic solvents, which has been increasingly demanded in recent years, and further improvement in the solubility has been demanded. Further, the polyarylate resin of Patent Document 1 has a problem in water vapor barrier properties and deformation resistance (for example, adhesion).
• the polyarylate resins of Patent Documents 2 and 3 have problems in heat resistance, mechanical strength, and dripping resistance.
• dripping may occur.
• Liquid dripping is a phenomenon in which a coating film in a solution state immediately after being applied on a substrate is deformed without being able to maintain its shape.
• the shape and thickness of the coating film could not be controlled, which caused a production problem.
• the problem of dripping occurred not only when the application surface of the substrate was arranged perpendicularly or inclined with respect to the horizontal plane, but also when the substrate was arranged parallel to the horizontal plane.
• the coating film that is in a solution state immediately after coating cannot maintain the shape at its edge (edge), and coating It was difficult to control the shape and thickness of the film.
• the present invention solves the above-mentioned problems, and includes heat resistance, abrasion resistance, solubility in non-halogen organic solvents, water vapor barrier properties, mechanical strength, dripping resistance, and deformation resistance (for example, adhesion) It is an object to provide a polyarylate resin having excellent properties.
• the present inventors have found that the dihydric phenol residue represented by the general formula (1) and the aromatic divalent carboxylic acid residue represented by the general formula (2).
• the inventors have found that the above object can be achieved by using a group together, and have reached the present invention.
• the gist of the present invention is as follows.
• a polyarylate resin comprising a dihydric phenol residue represented by the general formula (1) and an aromatic divalent carboxylic acid residue represented by the general formula (2).
• X represents a linear or branched divalent hydrocarbon group having 4 to 8 carbon atoms.
• R 1 and R 2 each independently represent a monovalent hydrocarbon group having 1 to 6 carbon atoms or a halogen atom which may be substituted with a halogen atom, and p and q are And independently represents an integer of 0 to 4.
• R 3 and R 4 each independently represents a monovalent hydrocarbon group having 1 to 6 carbon atoms or a halogen atom which may be substituted with a halogen atom, and r and s are And each independently represents an integer of 0 to 4.
• the molar ratio of the residues represented by the general formula (1) and the general formula (3) is [residue represented by the general formula (1)] / [residue represented by the general formula (3)].
• the polyarylate resin according to ⁇ 4> which is 20/80 to 80/20.
• ⁇ 6> ⁇ 4> or ⁇ 5> wherein the dihydric phenol residue represented by the general formula (3) is a 3,3 ′, 5,5′-tetramethyl-4,4′-biphenol residue.
• Arylate resin. ⁇ 7> The polyhydride according to any one of ⁇ 1> to ⁇ 6>, wherein the dihydric phenol residue represented by the general formula (1) is a 2,2-bis (4-hydroxyphenyl) -4-methylpentane residue.
• Arylate resin. ⁇ 8> The polyarylate resin according to any one of ⁇ 1> to ⁇ 7>, wherein the aromatic divalent carboxylic acid residue represented by the general formula (2) is a diphenyl ether-4,4′-dicarboxylic acid residue.
• ⁇ 9> The polyarylate resin according to any one of ⁇ 1> to ⁇ 8>, further comprising a phthalic acid residue represented by the general formula (4).
• ⁇ 10> The polyarylate resin according to ⁇ 9>, wherein the content of the phthalic acid residue represented by the general formula (4) is 20 to 50 mol% with respect to the wholly aromatic divalent carboxylic acid component.
• ⁇ 11> A film comprising the polyarylate resin according to any one of ⁇ 1> to ⁇ 10>.
• ⁇ 12> A laminate in which the polyarylate resin layer according to any one of ⁇ 1> to ⁇ 10> is provided on a substrate.
• a polyarylate resin excellent in heat resistance, wear resistance, solubility in non-halogen organic solvents, water vapor barrier properties, mechanical strength, dripping resistance, and deformation resistance (for example, adhesion)
• the polyarylate resin of the present invention has excellent heat resistance, abrasion resistance, solubility in non-halogen organic solvents, and sufficient mechanical strength while maintaining water vapor barrier properties, dripping resistance, and Excellent deformation resistance (for example, adhesion).
• the polyarylate resin of the present invention is composed of a dihydric phenol residue and an aromatic divalent carboxylic acid residue.
• the dihydric phenol residue it is necessary to contain a residue represented by the general formula (1).
• solubility in a non-halogen organic solvent, water vapor barrier property, and deformation resistance (for example, adhesion) are lowered, which is not preferable.
• heat resistance may fall.
• Deformation resistance refers to the ability of the polyarylate resin itself to hardly deform even when a load such as external stress and / or internal stress is continuously applied to the polyarylate resin itself.
• the deformation resistance includes, for example, the adhesion (peeling resistance) of the film or laminate when the polyarylate resin is used in the form of a film or laminate.
• X represents a linear or branched divalent hydrocarbon group having 4 to 8, preferably 4 to 7, more preferably 5 to 7 or 4 to 6 carbon atoms.
• the number of carbon atoms in X is less than 4, water vapor barrier properties and / or solubility in halogenated organic solvents may be reduced.
• the number of carbon atoms in X is greater than 8, the high glass transition temperature may decrease.
• straight chain is meant that the carbon chain is straight in the chemical structure of the resulting hydrocarbon compound, assuming that the two bonds of the divalent hydrocarbon group are bonded to a hydrogen atom. .
• Branched means that the carbon chain is branched in the chemical structure of the resulting hydrocarbon compound, assuming that the two bonds of the divalent hydrocarbon group are bonded to a hydrogen atom.
• the divalent hydrocarbon group include aliphatic hydrocarbon groups such as a saturated aliphatic hydrocarbon group and an unsaturated aliphatic hydrocarbon group.
• Preferable X is a linear or branched divalent saturated aliphatic hydrocarbon group, more preferably a branched divalent saturated aliphatic hydrocarbon group.
• linear divalent saturated aliphatic hydrocarbon group examples include, for example, a tetramethylene group, a pentamethylene group, a hexamethylene group, a heptamethylene group, an octamethylene group, a 2,2-butylene group, 2,2- Examples thereof include linear alkylene groups such as pentylene group, 2,2-hexylene group, 2,2-heptylene group, 2,2-octylene group and 3,3-pentylene group.
• branched divalent saturated aliphatic hydrocarbon group include, for example, a 3-methyl-2,2-butylene group, a 4-methyl-2,2-pentylene group, and a 2-ethyl-1,1-hexylene group. And branched alkylene groups such as 2-methyl-1,1-propylene group and 3-methyl-1,1-butylene group.
• Examples of the dihydric phenol that gives the residue represented by the general formula (1) include 2,2-bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) pentane, 2,2- Bis (4-hydroxyphenyl) hexane, 2,2-bis (4-hydroxyphenyl) -3-methylbutane, 2,2-bis (4-hydroxyphenyl) -4-methylpentane, 1,1-bis (4- Hydroxyphenyl) -2-ethylhexane, 2,2-bis (4-hydroxyphenyl) butane, 1,1-bis (4-hydroxyphenyl) -2-methylpropane, 2,2-bis (4-hydroxyphenyl) And octane, 1,1-bis (4-hydroxyphenyl) -3-methylbutane, 3,3-bis (4-hydroxyphenyl) pentane).
• 2,2-bis (4-hydroxyphenyl) -4-methylpentane is preferable from the viewpoint of water vapor barrier properties.
• the content of the dihydric phenol that gives the residue represented by the general formula (1) with respect to the total dihydric phenol component is usually 5 to 100 mol%, preferably 10 to 100 mol%. More preferably, it is ⁇ 90 mol%. From the viewpoint of further improving heat resistance, water vapor barrier properties, solubility in non-halogen organic solvents, mechanical strength, dripping resistance, and deformation resistance (for example, adhesion), it is represented by the general formula (1).
• the content of the dihydric phenol that gives a residue is preferably 20 to 80 mol%, more preferably 40 to 70 mol%, more preferably 40 to 65 mol%, based on the total dihydric phenol component. More preferably, it is most preferably 40 to 60 mol%.
• the content of the dihydric phenol that gives the residue represented by the general formula (1) with respect to the total dihydric phenol component is the content of the dihydric phenol residue represented by the general formula (1) with respect to the residue of the total dihydric phenol component. It is a quantity.
• the dripping resistance is a characteristic that does not easily cause dripping even when a resin solution obtained from a polyarylate resin is applied. For example, even when a resin solution is applied, the viscosity of the applied resin solution is low. It is a characteristic that does not easily deteriorate.
• the heat resistance can be further improved by containing the residue represented by the general formula (3).
• the content of the dihydric phenol that gives the residue represented by the general formula (3) with respect to the total dihydric phenol component is usually preferably 20 to 80 mol%, and preferably 30 to 60 mol%. More preferably, it is more preferably 35 to 60 mol%, and most preferably 40 to 60 mol%.
• R 3 and R 4 each represents a substituent bonded to the benzene ring, and each independently represents a monovalent hydrocarbon group having 1 to 6 carbon atoms which may be substituted with a halogen atom. Or represents a halogen atom.
• the halogen atom which may be substituted with a monovalent hydrocarbon group and the halogen atom as R 3 and R 4 may each independently be any halogen atom, for example, a fluorine atom, a chlorine atom or a bromine atom Can be mentioned.
• Examples of the monovalent hydrocarbon group include a saturated aliphatic hydrocarbon group, an alicyclic hydrocarbon group, and an aromatic hydrocarbon group, and in these groups, a hydrogen atom may be substituted with a halogen atom.
• Examples of the saturated aliphatic hydrocarbon group include an alkyl group having 1 to 6, preferably 1 to 3 carbon atoms or a halogenated alkyl group having 1 to 6 carbon atoms, preferably 1 to 3 carbon atoms.
• saturated aliphatic hydrocarbon group examples include alkyl groups such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, and halogenated alkyl groups thereof.
• alicyclic hydrocarbon group examples include a cycloalkyl group having 3 to 6, preferably 4 to 6 carbon atoms (for example, a cyclohexyl group) or a halogenated cycloalkyl group having 3 to 6 carbon atoms, preferably 4 to 6 carbon atoms.
• aromatic hydrocarbon group examples include a phenyl group and a halogenated phenyl group.
• saturated aliphatic hydrocarbon groups especially methyl groups, ethyl groups
• aromatic hydrocarbon groups especially phenyl groups
• alicyclic hydrocarbons because they are industrially easily available and easily synthesized.
• Group (especially cyclohexyl group) is preferable, and saturated aliphatic hydrocarbon group (especially methyl group) is more preferable.
• r and s represent the number of substituents bonded to the benzene ring, and each independently represents an integer of 0 to 4. When r and s are 0, it means that all hydrogen atoms bonded to the benzene ring are not substituted with R 3 and R 4 .
• the plurality of R 3 may be the same or different from each other.
• the plurality of R 4 may be the same or different from each other. From the viewpoint of excellent solubility in non-halogen solvents, r and s are each preferably an integer of 1 to 4, particularly 1 to 3.
• Examples of the dihydric phenol that gives the residue represented by the general formula (3) include 4,4′-biphenol, 3,3′-dimethyl-4,4′-biphenol, 3,3 ′, 5,5 ′. -Tetramethyl-4,4'-biphenol, 2,2 ', 3,3', 5,5'-hexamethyl-4,4'-biphenol, 3,3 ', 5,5'-tetra-tert-butyl -2,2'-biphenol.
• 3,3 ′, 5,5′-tetramethyl-4,4′-biphenol is preferable from the viewpoint of solubility in a non-halogen organic solvent.
• the total content of dihydric phenols giving the residues represented by the general formula (1) and general formula (3) with respect to all dihydric phenol components is heat-resistant and soluble in non-halogen organic solvents. From the viewpoint of further improving the property, water vapor barrier property, mechanical strength, dripping resistance, and deformation resistance (for example, adhesion), it is preferably 90 mol% or more, more preferably 95% or more, More preferably, it is 100 mol%.
• the molar ratio of the dihydric phenol that gives the residues represented by the general formula (1) and the general formula (3) is the molar ratio of the residues represented by the general formula (1) and the general formula (3).
• dihydric phenol residue other dihydric phenol residues other than the residues represented by the general formula (1) and the general formula (3) may be contained as long as the effects of the present invention are not impaired.
• dihydric phenols that give other dihydric phenol residues include 1,1-bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4 -Methyl-2-hydroxyphenyl) methane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 2,2-bis (4- Hydroxyphenyl) propane, 2,2-bis (3-methyl-4-hydroxyphenyl) propane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 1,1-bis (4-hydroxy) Phenyl) -1-phenylethane, 2,2-bis (3-phenyl-4-hydroxyphenyl) propane, 1,1-bis (3-methyl)
• the content of the dihydric phenol component in the total dihydric phenol component from the viewpoint of solubility in non-halogen organic solvents, heat resistance, water vapor barrier properties, and deformation resistance (for example, adhesion)
• the content is preferably less than 10 mol%, more preferably 5 mol% or less, and still more preferably substantially not contained.
• the aromatic divalent carboxylic acid residue it is necessary to contain a residue represented by the general formula (2).
• a residue represented by the general formula (2) solubility in non-halogen organic solvents, heat resistance, wear resistance, mechanical strength and dripping resistance, especially heat resistance, wear resistance, mechanical strength And, since the dripping resistance is lowered, it is not preferable.
• the content of the aromatic divalent carboxylic acid that gives the residue represented by the general formula (2) with respect to the total aromatic divalent carboxylic acid component is usually 10 to 100 mol%, further improving the wear resistance. From this point of view, it is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, further preferably 70 to 100 mol%, and more preferably 90 to 100 mol%.
• the content of the aromatic divalent carboxylic acid that gives the residue represented by the general formula (2) balances between ensuring wear resistance and further improving heat resistance, dripping resistance and / or mechanical strength.
• the content of the aromatic divalent carboxylic acid that gives the residue represented by the general formula (2) with respect to the total aromatic divalent carboxylic acid component is the content of the aromatic divalent carboxylic acid residue represented by the general formula (2). It is the content with respect to the residue of the wholly aromatic divalent carboxylic acid component.
• R 1 and R 2 each represents a substituent bonded to the benzene ring, and each independently represents a monovalent hydrocarbon group having 1 to 6 carbon atoms which may be substituted with a halogen atom. Or represents a halogen atom.
• the halogen atom which may be substituted with a monovalent hydrocarbon group and the halogen atom as R 1 and R 2 may each independently be any halogen atom, for example, a fluorine atom, a chlorine atom or a bromine atom Can be mentioned.
• Examples of the monovalent hydrocarbon group include a saturated aliphatic hydrocarbon group, an alicyclic hydrocarbon group, and an aromatic hydrocarbon group, and in these groups, a hydrogen atom may be substituted with a halogen atom.
• Examples of the saturated aliphatic hydrocarbon group include an alkyl group having 1 to 6, preferably 1 to 3 carbon atoms or a halogenated alkyl group having 1 to 6 carbon atoms, preferably 1 to 3 carbon atoms.
• saturated aliphatic hydrocarbon group examples include alkyl groups such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, and halogenated alkyl groups thereof.
• alicyclic hydrocarbon group examples include a cycloalkyl group having 3 to 6, preferably 4 to 6 carbon atoms (for example, a cyclohexyl group) or a halogenated cycloalkyl group having 3 to 6 carbon atoms, preferably 4 to 6 carbon atoms.
• aromatic hydrocarbon group examples include a phenyl group and a halogenated phenyl group.
• saturated aliphatic hydrocarbon groups especially methyl groups, ethyl groups
• aromatic hydrocarbon groups especially phenyl groups
• alicyclic hydrocarbons because they are industrially easily available and easily synthesized.
• Group (especially cyclohexyl group) is preferable, and saturated aliphatic hydrocarbon group (especially methyl group) is more preferable.
• p and q represent the number of substituents bonded to the benzene ring, and each independently represents an integer of 0 to 4.
• p and q are 0, it means that all hydrogen atoms bonded to the benzene ring are not substituted with R 1 and R 2 .
• p is 2 to 4
• a plurality of R 1 may be the same or different from each other.
• q is 2 to 4
• the plurality of R 2 may be the same or different from each other.
• p and q are respectively Independently 0 or 1, particularly preferably 0 simultaneously.
• Examples of the aromatic divalent carboxylic acid that gives the residue represented by the general formula (2) include diphenyl ether-2,2′-dicarboxylic acid, diphenyl ether-2,3′-dicarboxylic acid, diphenyl ether-2,4′- Examples thereof include dicarboxylic acid, diphenyl ether-3,3′-dicarboxylic acid, diphenyl ether-3,4′-dicarboxylic acid, and diphenyl ether-4,4′-dicarboxylic acid. Among these, diphenyl ether-4,4'-dicarboxylic acid is preferred because it is easily available industrially.
• a phthalic acid residue represented by the general formula (4) may be further contained as the aromatic divalent carboxylic acid residue.
• the heat resistance and mechanical strength can be further improved by including the phthalic acid residue represented by the general formula (4).
• Examples of the compound giving a phthalic acid residue represented by the general formula (4) include terephthalic acid, isophthalic acid, and orthophthalic acid.
• the content of the phthalic acid residue represented by the general formula (4) is usually 50 mol with respect to the wholly aromatic divalent carboxylic acid component (that is, all residues derived from the wholly aromatic divalent carboxylic acid component). From the viewpoint of wear resistance, it is preferably 40% or less, more preferably 35 mol% or less, further preferably 30 mol% or less, and 25 mol% or less. Is most preferred.
• the content of the phthalic acid residue represented by the general formula (4) includes heat resistance, solubility in non-halogen organic solvents, water vapor barrier properties, dripping resistance, deformation resistance (for example, adhesion) and / or Alternatively, from the viewpoint of further improving the mechanical strength, it is preferably 10 mol% or more, more preferably 20 mol% or more, and more preferably 25 mol% or more with respect to the wholly aromatic divalent carboxylic acid component. Is more preferable.
• the content of the phthalic acid residue represented by the general formula (4) is to ensure abrasion resistance, heat resistance, solubility in non-halogen organic solvents, water vapor barrier properties, dripping resistance, and deformation resistance.
• the viewpoint of a balance with (for example, adhesion) and / or further improvement in mechanical strength it is preferably 20 to 50 mol%, preferably 20 to 40 mol%, based on the total aromatic divalent carboxylic acid component. More preferred is 25 to 40 mol%.
• the aromatic divalent carboxylic acid residue is a group other than the aromatic divalent carboxylic acid that gives the residues of the general formula (2) and the general formula (4) as long as the effects of the present invention are not impaired.
• An aromatic divalent carboxylic acid residue may be contained.
• aromatic divalent carboxylic acids that give such residues include phthalic acid derivatives such as terephthalic acid, isophthalic acid, and orthophthalic acid; 4,4′-biphenyldicarboxylic acid, 2,2′-biphenyldicarboxylic acid, and the like.
• the derivative means that in the aromatic divalent carboxylic acid, the hydrogen atom bonded to the benzene ring is methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, and tert. -A compound substituted with an alkyl group such as a butyl group.
• the content thereof is preferably less than 10 mol%, more preferably substantially not contained, in the wholly aromatic divalent carboxylic acid component.
• an aliphatic diol, an alicyclic diol, an aliphatic dicarboxylic acid in addition to the dihydric phenol residue and the aromatic divalent carboxylic acid residue, as long as the effects of the present invention are not impaired.
• the aliphatic diol include ethylene glycol and propylene glycol.
• the alicyclic diol include 1,4-cyclohexanediol, 1,3-cyclohexanediol, and 1,2-cyclohexanediol.
• Examples of the aliphatic dicarboxylic acid include adipic acid and sebacic acid.
• Examples of the alicyclic dicarboxylic acid include 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, and 1,2-cyclohexanedicarboxylic acid.
• the content of the residue of the other component is preferably less than 10 mol%, and more preferably substantially free of the total moles of raw material monomers.
• the weight average molecular weight of the polyarylate resin of the present invention is preferably 60000 to 150,000 from the viewpoints of heat resistance, mechanical strength and processability.
• the weight average molecular weight is less than 60000, the glass transition temperature and / or the mechanical strength may decrease.
• the weight average molecular weight exceeds 150,000, the solution viscosity and / or melt viscosity when dissolved in a non-halogen organic solvent is too high, and the processability may be lowered.
• the glass transition temperature of the polyarylate resin of the present invention is preferably 200 ° C. or higher, more preferably 215 ° C. or higher, and most preferably 230 ° C. or higher.
• a polyarylate resin for a liquid crystal display or the like it is usual to coat the liquid crystal display, apply an ITO (indium-tin oxide) solution thereon, and then crystallize at a temperature of 200 ° C. or higher. .
• ITO indium-tin oxide
• the thermal decomposition temperature of the polyarylate resin of the present invention is preferably a 10% mass reduction temperature of 370 ° C. or higher, more preferably 380 ° C. or higher, and more preferably 390 ° C. or higher. Most preferably.
• the polyarylate resin of the present invention is excellent in solubility in a non-halogen organic solvent.
• the non-halogen organic solvent include aromatic compounds such as toluene, xylene and benzene; cyclic ether compounds such as tetrahydrofuran, 1,4-dioxane and 1,3-dioxolane; and cyclic ketones such as cyclohexanone and cyclopentanone. Compounds. Of these, aromatic compounds (particularly xylene) and cyclic ketone compounds (particularly cyclohexanone) are preferred.
• Examples of the method for producing the polyarylate resin of the present invention include a method of reacting in an organic solvent such as an interfacial polymerization method and a solution polymerization method, or a method of reacting in a molten state such as melt polymerization. From the viewpoint of polymerizability and / or the appearance of the resulting resin, it is preferable to use an interfacial polymerization method capable of performing a reaction in an organic solvent, particularly a reaction at a low temperature.
• a solution in which a divalent carboxylic acid halide is dissolved in an organic solvent incompatible with water is mixed with an aqueous alkaline solution containing a dihydric phenol, a terminal blocking agent, an antioxidant and a polymerization catalyst ( And a polymerization reaction is carried out with stirring at a temperature of 50 ° C. or lower for 1 to 8 hours.
• the solvent used in the organic phase is preferably a solvent that is incompatible with water and dissolves polyarylate.
• a solvent examples include methylene chloride and chloroform, and methylene chloride is preferred because it is easy to use in production.
• alkaline aqueous solution used in the aqueous phase examples include aqueous solutions of sodium hydroxide, potassium hydroxide and mixtures thereof.
• the end-capping agent is used from the viewpoint of adjusting the molecular weight of the polyarylate resin and improving the thermal stability.
• terminal blocker monohydric phenol, monohydric acid chloride, monohydric alcohol, monohydric carboxylic acid is mentioned, for example.
• Examples of the monohydric phenol include phenol, o-cresol, m-cresol, p-cresol, p-tert-butylphenol, o-phenylphenol, m-phenylphenol, p-phenylphenol, o-methoxyphenol, m- Methoxyphenol, p-methoxyphenol, 2,3,6-trimethylphenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5 -Xylenol, 2-phenyl-2- (4-hydroxyphenyl) propane, 2-phenyl-2- (2-hydroxyphenyl) propane, 2-phenyl-2- (3-hydroxyphenyl) propane.
• Examples of the monovalent acid chloride include benzoyl chloride, benzoic acid chloride, methanesulfonyl chloride, and phenyl chloroformate.
• Examples of the monohydric alcohol include methanol, ethanol, n-propanol, isopropanol, n-butanol, 2-butanol, pentanol, hexanol, dodecyl alcohol, stearyl alcohol, benzyl alcohol, and phenethyl alcohol.
• Examples of the monovalent carboxylic acid include acetic acid, propionic acid, octanoic acid, cyclohexanecarboxylic acid, benzoic acid, toluic acid, phenylacetic acid, p-tert-butylbenzoic acid, and p-methoxyphenylacetic acid.
• monohydric phenol particularly p-tert-butylphenol is preferred because of its high thermal stability.
• An antioxidant is used to prevent oxidation of the dihydric phenol component.
• examples of the antioxidant include hydrosulfite sodium, L-ascorbic acid, erythorbic acid, catechin, tocophenol, and butylhydroxyanisole. Of these, hydrosulfite sodium is preferred because of its excellent water solubility.
• polymerization catalyst examples include quaternary ammonium salts such as tri-n-butylbenzylammonium halide, tetra-n-butylammonium halide, trimethylbenzylammonium halide, triethylbenzylammonium halide; and tri-n-butylbenzylphosphonium halide.
• quaternary phosphonium salts such as tetra-n-butylphosphonium halide, trimethylbenzylphosphonium halide, and triethylbenzylphosphonium halide.
• tri-n-butylbenzylammonium halide trimethylbenzylammonium halide, tetra-n-butylammonium halide, tri-n-butylbenzylphosphonium halide, tetra -N-Butylphosphonium halide is preferred.
• the polyarylate resin of the present invention is dissolved in an organic solvent, the polyarylate resin is coated on the substrate and dried, or the molten resin is extruded onto the substrate to provide a polyarylate resin layer on the substrate.
• a laminated body can be obtained.
• a film can be obtained by peeling the resin layer from the laminate.
• organic solvent for dissolving the polyarylate resin examples include methylene chloride, 1,2-dichloroethane, chloroform, carbon tetrachloride, chlorobenzene, 1,1,2,2-tetrachloroethane other than the above-mentioned non-halogen organic solvents. 1,1,1-trichloroethane, o-dichlorobenzene, m-dichlorobenzene, and p-dichlorobenzene.
• Examples of the substrate include a PET film, a polyimide film, a glass plate, and a stainless plate.
• coating methods include wire bar coater coating, film applicator coating, brush coating, spray coating, gravure roll coating, screen printing, reverse roll coating, lip coating, air knife coating, curtain flow. Examples thereof include a coating method and a dip coating method.
• the tensile rupture strength of the film obtained from the polyarylate resin of the present invention is preferably 70 MPa or more, more preferably 80 MPa or more, and more preferably 90 MPa or more from the viewpoint of mechanical strength.
• the tensile elongation at break of the film is preferably 60% or more, more preferably 65% or more, and further preferably 70% or more.
• the film obtained from the polyarylate resin of the present invention has a water vapor transmission coefficient of preferably 0.80 g ⁇ cm / (m 2 ⁇ day) or less, and preferably 0.70 g ⁇ cm / (m 2 ⁇ day) or less. More preferably, it is 0.65 g ⁇ cm / (m 2 ⁇ day) or less.
• the loss elastic modulus (E ′′) of the film obtained from the polyarylate resin of the present invention (when the frequency is 1 Hz) is preferably 0.20 GPa or less, more preferably 0.15 GPa or less, and 0 More preferably, it is 12 GPa or less.
• the polyarylate resin of the present invention, the film and laminate obtained therefrom are heat resistant, soluble in non-halogen organic solvents, water vapor barrier properties, mechanical strength, dripping resistance, and deformation resistance (for example, adhesion). Is excellent. Therefore, it can be suitably used in the field of electric / electronic materials as a substrate film for liquid crystal displays, film capacitors, lighting, solar cells, printed circuits and the like.
• the polyarylate resin of the present invention is excellent in dripping resistance.
• the viscosity stabilization time when measuring the solution viscosity is an index.
• the viscosity stabilization time is a time until the viscosity is stabilized, and refers to a time until the viscosity does not change with respect to the time.
• the viscosity stabilization time when measuring the solution viscosity is preferably 10 minutes or more, more preferably 15 minutes or more, and further preferably 20 minutes or more from the viewpoint of suppressing dripping.
• Resin composition By 1 H-NMR analysis using a high resolution nuclear magnetic resonance apparatus (LA-400 NMR manufactured by JEOL Ltd.), the resin composition was obtained from the peak intensity of each copolymer component (resolution) : 400 MHz, solvent: a mixed solvent having a volume ratio of deuterated trifluoroacetic acid and deuterated tetrachloroethane of 1/11, temperature: 50 ° C.).
• the polyarylate resin was measured under the following conditions, and the temperature at which 10% mass decreased was determined as the thermal decomposition temperature.
• Equipment TG / DTA 7200, manufactured by Hitachi High-Tech Science Corporation Temperature increase rate: 10 ° C./min
• Inflow gas air, flow rate 200 mL / min A: 390 ° C. or higher (best).
• ⁇ 380 ° C. or higher and lower than 390 ° C. (good).
• X Less than 370 ° C. (practical problem).
• ⁇ More than 0.65 g ⁇ cm / (m 2 ⁇ day) and 0.70 g ⁇ cm / (m 2 ⁇ day) or less (good). ⁇ : 0.70 g ⁇ cm / (m 2 ⁇ day) to 0.80 g ⁇ cm / (m 2 ⁇ day) or less (no problem in practical use). X: More than 0.80 g ⁇ cm / (m 2 ⁇ day) (practical problem).
• Loss modulus (E '') The film obtained in (5) was measured under the following conditions, and the value at a frequency of 1 Hz was defined as the loss elastic modulus (E ′′). The smaller the loss elastic modulus (E ′′), the better the film is in deformation resistance (for example, adhesion).
• X The resin solution did not have fluidity, or the resin was not dissolved at all (there was a problem in practical use).
• Viscosity stabilization time 90 parts by mass of N-methylpyrrolidone was added to 10 parts by mass of the polyarylate resin to obtain a resin solution.
• the viscosity of the obtained resin solution is measured at a temperature of 25.0 ° C. using a digital viscometer (VISCOMETER TVB-10) manufactured by Toki Sangyo Co., Ltd., a HM-1 type rotor, and a small amount of HM / H2 sample adapter. At that time, the time from the start of measurement until the viscosity was stabilized was measured.
• A More than 20 minutes (best).
• ⁇ 15 minutes or more and less than 20 minutes (good).
• ⁇ 10 minutes or more and less than 15 minutes (no problem in practical use).
• X Less than 10 minutes (practical problem).
• Example 1 In a reaction vessel equipped with a stirrer, 100.00 parts by mass of 2,2-bis (4-hydroxyphenyl) -4-methylpentane (BisMIBK) as a dihydric phenol component and p-tert-butylphenol as an end-capping agent 1.61 parts by mass of (PTBP), 31.51 parts by mass of sodium hydroxide (NaOH) as an alkali, 1.57 parts by mass of a 50% by mass aqueous solution of tri-n-butylbenzylammonium chloride (TBBAC) as a polymerization catalyst, oxidation As an inhibitor, 0.51 part by mass of hydrosulfite sodium was charged and dissolved in 3100 parts by mass of water (aqueous phase).
• PTBP 2,2-bis (4-hydroxyphenyl) -4-methylpentane
• TBBAC tri-n-butylbenzylammonium chloride
• Examples 2 to 9 and Comparative Examples 1 to 6 As shown in Table 1, a polyarylate resin was obtained in the same manner as in Example 1 except that the resin composition was changed.
• Table 1 shows the evaluation results of the polyarylate resins obtained in Examples 1 to 9 and Comparative Examples 1 to 6.
• BisMIBK 2,2-bis (4-hydroxyphenyl) -4-methylpentane
• TMBP 3,3 ′, 5,5′-tetramethyl-4,4′-biphenol
• BisA bisphenol A
• DEDC diphenyl ether-4,4′-dicarboxylic acid chloride
• TPC terephthalic acid chloride
• the polyarylate resins of Examples 1 to 9 were composed of the dihydric phenol residue and the aromatic divalent carboxylic acid residue defined in the present invention, the glass transition temperature and the thermal decomposition temperature were high. The solubility of was also high. Moreover, when it was set as the film, the water vapor permeability coefficient and the loss elastic modulus (E ′′) were low, and the tensile breaking strength and the tensile breaking elongation were high. Also, the viscosity stabilization time was long.
• the polyarylate resin of Comparative Examples 1 and 2 does not use the monomer that gives the residue represented by the general formula (1) to the dihydric phenol component, and uses bisphenol A and bisphenol S, it has low solubility in xylene. When the film was used, the water vapor transmission coefficient and loss modulus (E ′′) were high. Since the polyarylate resin of Comparative Examples 3 and 4 did not use a monomer that gives the residue represented by the general formula (1) to the dihydric phenol component, it has low thermal decomposability and low solubility in xylene and cyclohexanone. The water vapor transmission coefficient and loss elastic modulus (E ′′) in the case of a film were high.
• the polyarylate resin of the present invention a film comprising the polyarylate resin, and a laminate having the polyarylate resin layer are suitably used in the field of electrical and electronic materials as a substrate film for liquid crystal displays, film capacitors, lighting, solar cells, printed circuits and the like. be able to.

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• 2017
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