WO2017197692A1 - 一种散热方法及终端 - Google Patents
一种散热方法及终端 Download PDFInfo
- Publication number
- WO2017197692A1 WO2017197692A1 PCT/CN2016/085821 CN2016085821W WO2017197692A1 WO 2017197692 A1 WO2017197692 A1 WO 2017197692A1 CN 2016085821 W CN2016085821 W CN 2016085821W WO 2017197692 A1 WO2017197692 A1 WO 2017197692A1
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- WIPO (PCT)
- Prior art keywords
- temperature
- terminal
- collector
- current
- housing
- Prior art date
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
Definitions
- the present disclosure relates to the field of communications, for example, to a heat dissipation method and terminal.
- the processing speed of the terminal chip is getting faster and faster, and the performance of the terminal is also continuously improved.
- the heating problem of the terminal is becoming more and more serious.
- the heat dissipation method of the related art includes: transferring heat of the internal chip of the terminal to the terminal housing through a heat dissipating material such as a thermal pad, a graphite heat sink, a heat dissipating copper foil, etc. to achieve heat balance on the terminal; or detecting by a thermal sensor inside the terminal chip The temperature of the chip, and when the temperature of the chip exceeds the preset temperature value, lowers the running speed of the terminal chip or limits the data throughput of the terminal according to a preset model, thereby lowering the terminal temperature.
- a heat dissipating material such as a thermal pad, a graphite heat sink, a heat dissipating copper foil, etc.
- the temperature that the end user can actually accept varies with the actual environment in which the terminal is located, and the existing heat dissipation method adopts a single heat dissipation measure, which cannot truly lower the terminal temperature to a temperature that the user can actually accept, and reduces the temperature.
- the thermal performance of the terminal varies with the actual environment in which the terminal is located, and the existing heat dissipation method adopts a single heat dissipation measure, which cannot truly lower the terminal temperature to a temperature that the user can actually accept, and reduces the temperature.
- Embodiments of the present disclosure provide a heat dissipation method and a terminal, which can improve heat dissipation performance of the terminal.
- an embodiment of the present disclosure provides a heat dissipation method, which is applied to a terminal, where the terminal includes a first temperature collector disposed in a first region of the housing and a second temperature collector disposed in a second region of the housing
- the heat dissipation method includes:
- first temperature collector Obtaining a current first temperature collected by the first temperature collector and a current second temperature collected by the second temperature collector when the preset time arrives, wherein the first temperature is used to characterize the maximum temperature of the housing of the terminal, The second temperature is used to characterize the ambient temperature of the environment in which the terminal is located;
- the operating parameters of the terminal are adjusted according to the difference between the first temperature and the temperature threshold, so that the terminal uses the adjusted operating parameter.
- adjusting the operating parameters of the terminal according to the difference between the first temperature and the temperature threshold including:
- the method further includes:
- the next acquisition, determination, and adjustment step is performed when the next preset time after adjusting the current operating parameters of the terminal arrives.
- the first temperature collector includes at least two first temperature sub-collectors, wherein the step of acquiring the current first temperature collected by the first temperature collector comprises:
- the maximum of the at least two pending first temperatures is taken as the first temperature.
- the operating parameters of the to-be-running level include:
- the setting method of the correspondence between the second temperature and the temperature threshold includes:
- the correspondence between the second temperature and the temperature threshold is set based on the user behavior.
- an embodiment of the present disclosure provides a terminal, including: a first temperature collector disposed in a first area of a housing of the terminal, a second temperature collector disposed in a second area of the housing of the terminal, and A control chip connected to both the first temperature collector and the second temperature collector, wherein:
- the first temperature collector is configured to acquire the current first temperature when the preset time arrives, wherein the first temperature is used to characterize the highest housing temperature of the terminal;
- the second temperature collector is configured to acquire the current second temperature when the preset time arrives, wherein the second temperature is used to characterize the ambient temperature of the environment in which the terminal is located;
- the control chip is configured to determine a corresponding current temperature threshold according to the second temperature and a preset relationship between the second temperature and the temperature threshold; and when the first temperature acquired by the first temperature collector is greater than the temperature threshold, according to the first temperature and temperature The difference in threshold adjusts the operating parameters of the terminal.
- the first area includes an intermediate position inside the terminal housing
- the second area includes an edge position inside the terminal housing
- the first temperature collector includes at least two first temperature sub-collectors, wherein:
- the first temperature collector is configured to acquire at least two first temperature points when the preset time arrives At least two pending first temperatures collected by the device; and a maximum of the at least two pending first temperatures is taken as the first temperature.
- the first temperature collector and the second temperature collector are implemented by a thermal sensor, and the thermal sensor comprises: a thermistor and a flexible circuit board, wherein the flexible circuit board is connected to both the thermistor and the control chip.
- the terminal further includes an analog-to-digital converter, and the analog-to-digital converter is connected to the flexible circuit board and the control chip, where
- the thermistor is configured to convert temperature into an electrical signal
- the flexible circuit board is configured to transmit an electrical signal to the analog to digital converter
- the analog to digital converter is configured to convert the electrical signal from analog to digital and to the control chip.
- Embodiments of the present disclosure provide a heat dissipation method and terminal.
- the heat dissipation method is applied to the terminal, the terminal includes a first temperature collector disposed in the first region of the self-housing and a second temperature collector disposed in the second region of the self-housing, and the heat dissipation method includes: acquiring when the preset time arrives a current first temperature collected by the first temperature collector and a current second temperature collected by the second temperature collector, wherein the first temperature is used to characterize the highest housing temperature of the terminal, and the second temperature is used to characterize the environment in which the terminal is located
- the ambient temperature is determined according to the correspondence between the second temperature and the preset second temperature and the temperature threshold; when the first temperature is greater than the temperature threshold, the current terminal is adjusted according to the difference between the first temperature and the temperature threshold Operating parameters.
- the embodiment of the present disclosure determines a current temperature threshold that is adapted to the current ambient temperature according to the second temperature, that is, the ambient temperature, so that the terminal can use different temperature thresholds according to different ambient temperatures to perform heat dissipation of the terminal, so that the terminal can be
- the judgment of the temperature threshold in different situations adjusts the operating parameters, so that the terminal achieves good heat dissipation, thus improving the heat dissipation performance of the terminal, and expanding the adaptability of the terminal for heat dissipation at different ambient temperatures.
- FIG. 1 is a schematic flow chart of a heat dissipation method according to an embodiment of the present disclosure
- FIG. 2 is a schematic diagram of a first temperature collector and a second temperature collector according to an embodiment of the present disclosure
- FIG. 3 is a schematic diagram of a mapping relationship between a second temperature and a temperature threshold according to an embodiment of the present disclosure
- FIG. 4 is a schematic diagram of an interface of a heat dissipation setting according to an embodiment of the present disclosure
- FIG. 5 is a schematic flowchart diagram of a heat dissipation method according to an embodiment of the present disclosure
- FIG. 6 is a schematic structural diagram of a terminal according to an embodiment of the present disclosure.
- FIG. 7 is a schematic diagram of a terminal housing according to an embodiment of the present application.
- FIG. 8 is a schematic structural diagram of a terminal according to an embodiment of the present application.
- FIG. 1 is a schematic flowchart of a heat dissipation method according to an embodiment of the present disclosure.
- the heat dissipation method is applied to a terminal, wherein the terminal includes a first temperature collector disposed in a first region of the self-housing and a second region disposed in the self-housing The second temperature collector.
- the heat dissipation method of this embodiment includes: step 101, step 102, and step 103.
- step 101 when the current preset time arrives, the current first temperature collected by the first temperature collector and the current second temperature collected by the second temperature collector are acquired, wherein the first temperature is used to represent the shell of the terminal.
- the highest temperature of the body, the second temperature is used to characterize the ambient temperature of the environment in which the terminal is located;
- the preset time is used to represent the time period during which the first temperature collector of the terminal collects the first temperature and the second temperature collector collects the second temperature.
- the terminal arrives at the current preset time, the current first temperature and the second temperature are collected.
- the preset time can be set according to actual needs, and the embodiment of the present application does not specifically limit this.
- the terminal housing protects a terminal printed circuit board (PCB), a terminal battery, and the like.
- the inner side of the terminal housing faces the terminal main board, and the terminal housing includes a battery cover 21 and a housing side 22 (see FIG. 2).
- the heat generated by the chip on the terminal PCB main board is transmitted to the terminal housing through the shield cover, the heat dissipation film, the air layer, and the like.
- the terminal housing is the place where the end user grips, and the temperature directly felt by the end user is the heat transferred to the terminal housing. Therefore, the positions of the first temperature collector and the second temperature collector are reserved in the terminal housing, and the first temperature collector and the second temperature collector are respectively disposed in the first area and the second area of the terminal housing ( See Figure 2 for an example).
- the first area of the terminal housing includes an intermediate position inside the terminal housing, that is, a position corresponding to the main heating chip on the main board of the terminal and the terminal housing, and the position is a place frequently touched by the user.
- the temperature of the first region of the terminal housing can be used to characterize the temperature of the terminal housing that the user can actually feel.
- the embodiment of the present disclosure does not specifically limit the setting of the first area.
- the second area of the terminal housing includes an edge position inside the terminal housing, that is, the position of the top and bottom of the terminal housing when the terminal display screen is vertically placed, because the top and bottom areas of the terminal housing avoid the terminal.
- the heat generating chip on the internal motherboard, and the position is a place that the user does not touch frequently, so the temperature of the second area of the terminal housing is not affected by the internal heat generating chip and user behavior of the terminal, and can be used to characterize the environment in which the terminal is located. temperature.
- the embodiment of the present application does not specifically limit the setting of the second area.
- first area and the second area in FIG. 2 are only an example, and the first area and the second area may be set according to actual usage habits. limit.
- the first temperature is used to characterize the highest temperature of the housing of the terminal, that is, the temperature perceived by the user operating the terminal. Understandably, if the temperature of the housing of the terminal is too high, the user experience of the terminal may be affected.
- the second temperature is used to characterize the ambient temperature of the environment in which the terminal is located, and the ambient temperature of the environment in which the terminal is located is susceptible to the current season and the environment in which the terminal is located. For example, there is a large gap between the summer and winter ambient temperatures, or the indoor and outdoor ambient temperatures. For different ambient temperatures, the terminal user has different requirements on the temperature of the housing of the terminal. Therefore, it is necessary to detect the ambient temperature of the environment in which the terminal is located, so that the terminal can perform corresponding heat dissipation measures at different ambient temperatures, thereby improving the terminal in different conditions. Adaptability to heat dissipation at ambient temperature.
- the first temperature collector and the second temperature collector are temperature collection systems, thermal sensors, thermistors, and the like, which are not specifically limited in the embodiment of the present application.
- first temperature collector and the second temperature collector is a thermistor (NTC, Negative Temperature Coefficient) and a flexible printed circuit (FPC), wherein the flexible circuit board is provided with gold.
- NTC Negative Temperature Coefficient
- FPC flexible printed circuit
- the finger is connected with the shrapnel at the corresponding position on the main board.
- obtaining the current first temperature collected by the first temperature collector includes: acquiring at least two to-be-determined numbers collected by at least two first temperature sub-collectors set on the terminal when the current preset time arrives a temperature; determining a maximum value of the at least two to-be-determined first temperatures; and determining a maximum value of the at least two to-be-determined first temperatures as the first temperature.
- the first temperature collector of the terminal includes at least two first temperature sub-collectors.
- the first temperature collector includes four first temperature sub-collectors disposed in the first region (see FIG. 2): a first temperature sub-collector A1 disposed inside the terminal battery cover and a first temperature sub-collection
- the first temperature sub-collector A4 and the first temperature sub-collector A5 are respectively disposed on the inner sides of the two outer casing sides of the terminal.
- the four first temperature to be determined are obtained by the four first temperature sub-collectors, and the maximum first temperature to be determined is determined, and the maximum first temperature to be determined is taken as the first temperature of the terminal.
- the second temperature collector A2 disposed in the second region of the terminal is configured to acquire a second temperature that is used to characterize the ambient temperature of the environment in which the terminal is located.
- step 102 determining a corresponding current temperature threshold according to a correspondence between the second temperature and the preset second temperature and the temperature threshold;
- the end user's requirements for the housing temperature of the terminal are different at different ambient temperatures, as shown in FIG.
- the horizontal axis is the second temperature for characterizing the ambient temperature of the environment in which the terminal is located; and the vertical axis is the temperature threshold corresponding to the second temperature, that is, the maximum temperature of the terminal housing acceptable to the user. That is to say, the temperature of the housing of the terminal cannot exceed the maximum value of the housing temperature of the terminal that the user can accept. If it exceeds, the terminal heat dissipation processing, such as reducing the running speed of the terminal, is required, thereby reducing the generation of heat of the terminal, thereby reducing the terminal's
- the temperature of the housing is used to achieve heat dissipation from the terminal.
- the second temperature and the predetermined second temperature have a corresponding relationship with the temperature threshold, ie the temperature threshold is a function of the second temperature.
- the terminal can reduce its own central processing unit (CPU, Central Processing Unit) and graphics processing unit (GPU, Graphics Processing Unit). Performance, etc., to reduce the temperature of its own casing.
- CPU Central Processing Unit
- GPU Graphics Processing Unit
- Performance etc.
- the terminal presets the correspondence between the second temperature and the temperature threshold, and can refer to the provisions of the International Electrotechnical Commission (IEC), see Table 1. Shown as follows:
- the setting method of the correspondence between the second temperature and the temperature threshold comprises: setting a correspondence between the second temperature and the temperature threshold based on the user behavior.
- the user can set the correspondence between the temperature and the temperature threshold by opening the setting interface of the terminal and setting the heat dissipation setting option. For example, when the temperature is 30 degrees, the corresponding temperature threshold is set to 40 degrees according to the user's needs.
- the embodiment of the present disclosure may further set the correspondence between the second temperature and the temperature threshold by other methods according to actual needs.
- step 103 when the first temperature is greater than the temperature threshold, the current operating parameter of the terminal is adjusted according to the difference between the first temperature and the temperature threshold, so that the terminal uses the adjusted current operating parameter.
- the terminal sets the current operating parameter of the terminal according to the difference between the first temperature and the temperature threshold in advance.
- the terminal opens different applications, such as call, charging, data Internet access, wireless fidelity (WIFI, WIreless-FIdelity) video, games, etc.
- the temperature of the terminal is different, that is, the first temperature is different. Therefore, the terminal can be combined.
- the application currently open by the terminal and based on the first temperature and temperature threshold The difference sets the current operating parameters of the terminal, so that the terminal reduces the temperature of the terminal housing to a temperature threshold corresponding to the ambient temperature through corresponding heat dissipation measures.
- the terminal can identify the application currently open by the terminal through the scene model recognition system.
- the terminal is currently performing communication, and the current operating parameter of the terminal adjusted by the terminal according to the difference between the first temperature and the temperature threshold is the current radio frequency power of the terminal. Then, if the difference between the first temperature and the temperature threshold is the first level difference, the current radio frequency of the corresponding terminal to be adjusted is 5% of the preset radio frequency; if the difference between the first temperature and the temperature threshold is The second level difference, the current radio frequency of the corresponding terminal to be adjusted is 10% of the preset radio frequency power; if the difference between the first temperature and the temperature threshold is the third level difference, then the corresponding terminal to be adjusted The current RF power is 15% of the preset RF power.
- the terminal obtains different levels of operating parameters to be adjusted according to the difference between the first temperature and the temperature threshold, thereby achieving hierarchical heat dissipation of the terminal and improving the heat dissipation performance of the terminal.
- the corresponding relationship between the difference between the first temperature and the temperature threshold and the current operating parameter to be adjusted is not specifically limited in the embodiment of the present application.
- the current operating parameter of the terminal is adjusted according to the difference between the first temperature and the temperature threshold, including: a difference between the first temperature and the temperature threshold, and a correspondence between the preset difference and the operating parameters of each level, Determine the running parameters of the to-be-running level; adjust the current running parameters of the terminal to the running parameters of the to-be-running level.
- the terminal can implement the hierarchical heat dissipation of the terminal by using different levels of operating parameters according to the difference between the first temperature and the temperature threshold.
- the embodiment of the present application does not specifically limit the setting of the correspondence between the difference and the operating parameters of each level.
- the operating parameter of the to-be-running level includes: at least one of a charging current value to be operated, a brightness of the backlight to be operated, and a first parameter to be operated.
- the first to-be-operated parameters include the radio frequency to be operated, the operating frequency of the CPU to be operated, the operating frequency of the GPU to be operated, and the like.
- the terminal determines the to-be-operated level parameter according to the difference between the current first temperature and the temperature threshold as the first charging current value and the first radio frequency power.
- the application currently opened by the terminal may be an application or multiple applications.
- the terminal is currently communicating, To ensure that the radio frequency power amplifier of the normal communication terminal of the terminal and the base station increases the transmission power, the terminal adjusts the radio frequency power of the radio frequency power amplifier to adjust the current radio frequency power of the terminal to the first radio frequency power, thereby achieving heat dissipation of the terminal. If the terminal is still charging while communicating, the heat dissipation of the terminal is further achieved by adjusting the current charging current value of the terminal to the first charging current value, that is, reducing the charging current value.
- the operating parameters of the to-be-running level include the application software of the terminal or the working parameters of each functional module.
- the backlight brightness of the current liquid crystal display (LCD) of the terminal the current WIFI data throughput of the terminal
- the current CPU processing frequency of the terminal the current CPU processing frequency of the terminal
- the GPU processing frequency adjustment the backlight brightness of the current liquid crystal display (LCD) of the terminal.
- the application software currently opened by the terminal can include various applications, such as a call, high-speed data transmission, WIFI video transmission, a game scene, and the like.
- the terminal can adjust the operating parameters of the high-power devices of each module according to different levels of operating parameters and hierarchically through its own heating control system. In this way, the system performance and user experience of the terminal can be fully taken into account.
- the terminal adjusts the current backlight brightness to the backlight brightness to be operated, and adjusts the current charging current value of the terminal to The value of the charging current to be operated for terminal cooling. If the next preset time arrives, the terminal uses the currently collected real-time temperature to determine that the first temperature is still greater than the temperature threshold, then the terminal adjusts the current charging current value and the backlight brightness, and further the current RF power amplifier. The RF power is adjusted to the RF power to be operated to improve the heat dissipation performance of the terminal.
- the terminal makes the terminal through different parameters of the to-be-running level. A gradual grading of heat dissipation is achieved.
- the method further includes: performing a next heat dissipation process when the next preset time after adjusting the current operating parameter of the terminal arrives.
- the heat dissipation process includes steps 101-103, that is, when the next preset time arrives, the terminal adopts the real-time temperature (current temperature) collected at this time, and repeats steps 101-103 to perform the next heat dissipation process.
- the terminal implements stepwise grading through different parameters of the to-be-running level. Cooling.
- the terminal performs the heat dissipation process until the current first temperature of the terminal is less than or equal to the corresponding temperature threshold, and the terminal maintains the current operating parameter, and does not perform the heat dissipation process.
- FIG. 5 is a schematic flowchart diagram of a heat dissipation method according to an embodiment of the present application, where the method includes steps 201-207.
- step 201 when the current preset time arrives, the current first temperature collected by the first temperature collector and the current second temperature collected by the second temperature collector are acquired.
- the first temperature is used to characterize the highest case temperature of the terminal
- the second temperature is used to characterize the ambient temperature of the environment in which the terminal is located.
- a corresponding current temperature threshold is determined according to a correspondence between the second temperature and the preset second temperature and the temperature threshold.
- the terminal can set the correspondence between the second temperature and the temperature threshold according to the user behavior.
- step 203 it is determined whether the first temperature is greater than a temperature threshold. If the first temperature is greater than the temperature threshold, step 204 is performed; if the first temperature is not greater than the temperature threshold, step 207 is performed.
- step 204 the operating parameter of the to-be-running level is determined according to the difference between the first temperature and the temperature threshold, and the correspondence between the preset difference and the operating parameters of each level.
- the operating parameter of the to-be-running level includes at least one of a charging current value to be operated, a brightness of the backlight to be operated, and a first parameter to be operated.
- the first to-be-operated parameters include the radio frequency to be operated, the operating frequency of the CPU to be operated, the operating frequency of the GPU to be operated, and the like.
- step 205 the current operating parameters of the terminal are adjusted to the operating parameters of the to-be-running level.
- the current first temperature and temperature thresholds of the terminal may be different, and the operating parameters of the corresponding to-be-running level are also different, thereby causing the terminal to pass different levels.
- the operating parameters realize the hierarchical heat dissipation of the terminal and improve the heat dissipation performance of the terminal.
- step 206 when the next preset time after adjusting the current operating parameters of the terminal arrives, step 201 is continued.
- each heat dissipation process performed by the terminal may be different because the terminal's current first temperature, temperature threshold, and to-be-running level parameters may be different. Therefore, the terminal implements step-by-step hierarchical heat dissipation through different to-be-running level parameters. In addition, the terminal performs the heat dissipation process until the current first temperature of the terminal is less than or equal to the corresponding temperature threshold, and the terminal maintains the current operating parameter, and does not perform the heat dissipation process.
- step 207 the current operating parameters of the terminal are maintained.
- the embodiment of the present application provides a heat dissipation method and a terminal, wherein the heat dissipation method is applied to a terminal, and the terminal includes a first temperature collector disposed in a first region of the self-housing and a second device disposed in the second casing
- the second temperature collector of the area includes: obtaining a current first temperature collected by the first temperature collector and a current second temperature collected by the second temperature collector when the current preset time arrives, wherein the first temperature Determining a maximum housing temperature of the terminal, the second temperature is used to characterize an ambient temperature of the environment in which the terminal is located; determining a corresponding current temperature threshold according to the second temperature and a corresponding relationship between the second temperature and the temperature threshold; When a temperature is greater than a temperature threshold, the current operating parameter of the terminal is adjusted according to the difference between the first temperature and the temperature threshold.
- the embodiment of the present application determines the current temperature threshold that is adapted to the current ambient temperature according to the second temperature, that is, the ambient temperature, so that the terminal can use different temperature thresholds according to different ambient temperatures to perform heat dissipation of the terminal, so that the terminal can
- the current operating parameters are adjusted according to the judgment of the temperature threshold in different situations, so that the terminal achieves good heat dissipation. Therefore, the heat dissipation performance of the terminal is improved, and the adaptability of the terminal for heat dissipation at different ambient temperatures is expanded.
- FIG. 6 is a schematic structural diagram of a terminal according to an embodiment of the present disclosure.
- the terminal 10 includes: a first temperature collector 101 disposed in a first area of the housing of the terminal, and a second area disposed in the second area of the terminal 10 of the terminal.
- the second temperature collector 102 and the control chip 103 connected to both the first temperature collector 101 and the second temperature collector 102.
- the first temperature collector 101 is configured to acquire a current first temperature when the current preset time arrives, wherein the first temperature is used to characterize the highest housing temperature of the terminal 10;
- the second temperature collector 102 is configured to acquire the current second temperature when the current preset time arrives, where The second temperature is used to characterize the ambient temperature of the environment in which the terminal 10 is located;
- the control chip 103 is configured to determine a corresponding current temperature threshold according to a second temperature acquired by the second temperature collector 102 and a preset relationship between the second temperature and the temperature threshold; the first temperature acquired by the first temperature collector 101 is greater than At the temperature threshold, the current operating parameters of the terminal 10 are adjusted according to the difference between the first temperature and the temperature threshold.
- the first area includes an intermediate position inside the housing of the terminal 10, and the second area includes an edge position inside the housing of the terminal 10.
- the intermediate position of the inner side of the terminal 10 and the edge position of the inner side of the terminal 10 of the terminal 10 are Different positions;
- the first temperature collector 101 includes at least two first temperature sub-collectors.
- the first temperature collector 101 is configured to acquire at least two pending first temperatures collected by at least two first temperature sub-collectors disposed on the terminal 10 when the current preset time arrives; and determine at least two to-be-determined first temperatures a maximum value; a maximum value of at least two to-be-determined first temperatures is taken as the first temperature.
- FIG. 7 is a schematic diagram of a terminal housing according to an embodiment of the present disclosure.
- the terminal housing 20 includes a battery cover 21 and a housing side 22 .
- the terminal housing 20 is configured to protect the terminal PCB main board, the terminal battery and the like.
- the inner side of the terminal housing 20 faces the terminal main board, and the heat generated by the chip on the terminal PCB main board is transmitted through the shield cover, the heat dissipation film, the air layer, and the like.
- the outside of the terminal housing 20 is where the end user grips, and the temperature directly felt by the end user is the heat transferred to the terminal housing 20.
- the positions of the first temperature collector and the second temperature collector may be reserved in the terminal housing 20, and the first temperature collector and the second temperature collector are respectively disposed in the first area of the terminal housing 20 and the first The second area (shown in Figure 7).
- the embodiment of the present application does not specifically limit this.
- the first area (shown in FIG. 7) includes an intermediate position inside the casing 20 of the terminal 10, that is, a position corresponding to the main heat generating chip on the inner main board of the terminal corresponding to the terminal housing 20, and the position is a user.
- the place where it is often touched, so the temperature of the first area of the terminal housing 20 can be used to characterize the temperature of the terminal housing 20 that the user can actually feel.
- the embodiment of the present application does not specifically limit the setting of the first area.
- the second area (shown in FIG. 7) includes the edge position inside the housing 20 of the terminal 10, that is, the position of the top and bottom of the terminal housing 20 when the terminal display screen is placed vertically, due to the top of the terminal housing 20 and
- the bottom area avoids the heat generating chip on the internal motherboard of the terminal, and the position is a place that the user does not touch frequently, so the temperature of the second area of the terminal housing 20 is not affected by the internal heat generating chip and the user of the terminal.
- the effects of behavior can be used to characterize the ambient temperature of the environment in which the terminal is located.
- the embodiment of the present application does not specifically limit the setting of the second area.
- the first temperature collector includes four first temperature sub-collectors: a first temperature sub-collector A1 and a first temperature sub-collector A3 disposed inside the terminal battery cover 21, and a terminal
- a first temperature sub-collector A4 and a first temperature sub-collector A5 are disposed on the inner sides of the two outer casing sides 22, respectively.
- the maximum undetermined first temperature is determined by acquiring the four to-be-determined first temperatures collected by the four first temperature sub-collectors, and the maximum undetermined first temperature is taken as the first temperature of the terminal.
- a second temperature collector A2 is disposed at the bottom of the inner side of the terminal battery cover 21, and a second temperature is collected by the second temperature collector A2 for characterizing the ambient temperature of the environment in which the terminal is located.
- the first temperature collector 101 and the second temperature collector 102 are implemented by a thermal sensor comprising: a thermistor 104 and a flexible circuit board 105, wherein the flexible circuit board 105 and the thermistor 104 and the control chip 103 are connected.
- the flexible circuit board 105 is provided with a gold finger, and is connected with the elastic piece at a corresponding position on the terminal PCB main board.
- the resistance value of the thermistor 104 changes, so that the voltage value obtained by the sampling port of the control chip 103 is changed. A change occurs, and the change in temperature is detected by the conversion relationship between resistance and voltage.
- the terminal 10 further includes an analog to digital converter 106, and the analog to digital converter 106 is connected to both the flexible circuit board 105 and the control chip 103.
- the thermistor 104 is configured to convert temperature into an electrical signal.
- the flexible circuit board 105 is configured to transmit an electrical signal to the analog to digital converter 106;
- the analog to digital converter 106 is configured to convert an electrical signal from an analog quantity to a digital quantity and transmit it to the control chip 103.
- the terminal in the embodiment of the present disclosure includes a smart phone, a smart TV, a tablet computer, and the like.
- embodiments of the present disclosure can be provided as a method, system, or computer program product. Accordingly, the present disclosure may take the form of a hardware embodiment, a software embodiment, or a combination of software and hardware aspects. Moreover, the present disclosure may employ computer-usable storage media (including but not limited to disk storage and optical storage) in one or more of the computer-usable program code embodied therein. The form of a computer program product implemented on the device.
- the computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing device to operate in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture comprising the instruction device.
- the apparatus implements the functions specified in one or more blocks of a flow or a flow and/or block diagram of the flowchart.
- These computer program instructions can also be loaded onto a computer or other programmable data processing device such that a series of operational steps are performed on a computer or other programmable device to produce computer-implemented processing for execution on a computer or other programmable device.
- the instructions provide steps for implementing the functions specified in one or more of the flow or in a block or blocks of a flow diagram.
- the foregoing embodiment method can be implemented by means of software plus a necessary general hardware platform, and of course, by hardware.
- the technical solution of the embodiments of the present disclosure may be embodied in the form of a software product stored in a storage medium (such as a ROM/RAM, a magnetic disk, an optical disk), including instructions for making one
- the terminal device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) performs the method described in the embodiments of the present application.
- the embodiment of the present application determines a temperature threshold that is adapted to the current ambient temperature according to the ambient temperature, so that the terminal can perform heat dissipation of the terminal according to different ambient temperatures, so that the terminal can adjust the operating parameter according to the judgment of the temperature threshold in different situations, so that the terminal Achieve good heat dissipation, thus improving the heat dissipation performance of the terminal, and expanding the adaptability of the terminal for heat dissipation at different ambient temperatures.
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Abstract
一种散热方法及终端。其中,散热方法应用于终端(10),终端(10)包括设置于自身壳体(20)第一区域的第一温度采集器(101)和设置于自身壳体(20)第二区域的第二温度采集器(102),方法包括:获取第一温度采集器(101)采集的当前第一温度,和第二温度采集器(102)采集的当前第二温度(步骤201),其中,第一温度用于表征终端的最高壳体温度,第二温度用于表征终端所处环境的环境温度;根据第二温度和预设的第二温度与温度阈值的对应关系确定对应的当前温度阈值(步骤202);在第一温度大于温度阈值时,根据第一温度与温度阈值的差值调整终端当前的运行参数,以便终端使用调整后的当前运行参数。
Description
本公开涉及通信领域,例如涉及一种散热方法及终端。
目前,终端的芯片处理速度越来越快,终端的性能也不断提高,与此同时,终端的发热问题也越来越严重。
相关技术的散热方法包括:通过导热垫、石墨散热片、散热铜箔等散热材料将终端内部芯片的热量传递到终端壳体,来实现终端上的热量均衡;或者通过终端芯片内部的热传感器检测芯片温度,并在芯片温度超过预设温度值时,根据预设模型降低终端的芯片运行速度或者限制终端的数据吞吐量,从而来降低终端温度。
但是,终端用户实际可以接受的温度是随着终端所处的实际环境而变化的,而现有的散热方法采用单一的散热措施,无法使终端温度真正降低到用户实际可以接受的温度,降低了终端的散热性能。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本公开实施例提供一种散热方法及终端,能够提高终端的散热性能。
第一方面,本公开实施例提供了一种散热方法,应用于终端,终端包括设置于自身壳体第一区域的第一温度采集器和设置于自身壳体第二区域的第二温度采集器,该散热方法包括:
在预设时间到达时,获取第一温度采集器采集的当前第一温度,和第二温度采集器采集的当前第二温度,其中,第一温度用于表征终端的壳体的最高温度,第二温度用于表征终端所处环境的环境温度;
根据第二温度和预设的第二温度与温度阈值的对应关系确定对应的当前温度阈值;
在第一温度大于温度阈值时,根据第一温度与温度阈值的差值调整终端的运行参数,以便终端使用调整后的运行参数。
可选地,根据第一温度与温度阈值的差值调整终端的运行参数,包括:
根据第一温度与温度阈值的差值,和预设的差值与各级别的运行参数的对应关系,确定待运行级别的运行参数;
将终端当前的运行参数调整为待运行级别的运行参数。
可选地,在根据第一温度与温度阈值的差值调整终端的运行参数之后,方法还包括:
在调整终端当前的运行参数之后的下一个预设时间到达时,执行下一次获取、确定和调整的步骤。
可选地,第一温度采集器包括至少两个第一温度分采集器,其中,获取第一温度采集器采集的当前第一温度的步骤包括:
在当前预设时间到达时,获取至少两个第一温度分采集器采集的至少两个待定第一温度;
将至少两个待定第一温度中的最大值作为第一温度。
进一步地,待运行级别的运行参数包括:
待运行充电电流值、待运行背光亮度,和第一待运行参数中的至少一种参数。
可选地,第二温度与温度阈值的对应关系的设置方法包括:
基于用户行为设置第二温度与温度阈值的对应关系。
第二方面,本公开实施例提供了一种终端,包括:设置于终端的壳体第一区域的第一温度采集器、设置于终端的壳体第二区域的第二温度采集器、以及与第一温度采集器和第二温度采集器均连接的控制芯片,其中:
第一温度采集器配置为在预设时间到达时获取当前第一温度,其中,第一温度用于表征终端的最高壳体温度;
第二温度采集器配置为在预设时间到达时获取当前第二温度,其中,第二温度用于表征终端所处环境的环境温度;
控制芯片配置为根据第二温度和预设的第二温度与温度阈值的对应关系确定对应的当前温度阈值;在第一温度采集器获取的第一温度大于温度阈值时,根据第一温度与温度阈值的差值调整终端的运行参数。
可选地,第一区域包括终端壳体内侧的中间位置,第二区域包括终端壳体内侧的边缘位置,第一温度采集器包括至少两个第一温度分采集器,其中:
第一温度采集器配置为在预设时间到达时,获取至少两个第一温度分采集
器采集的至少两个待定第一温度;以及将至少两个待定第一温度中的最大值作为第一温度。
可选地,第一温度采集器和第二温度采集器由热传感器实现,热传感器包括:热敏电阻和柔性线路板,其中,柔性线路板与热敏电阻和控制芯片均连接。
可选地,终端还包括模数转换器,模数转换器与柔性线路板和控制芯片均连接,其中,
热敏电阻配置为将温度转换为电信号;
柔性线路板配置为将电信号传输给模数转换器;
模数转换器配置为将电信号由模拟量转为数字量并传输给控制芯片。
本公开的实施例提供了一种散热方法及终端。散热方法应用于终端,终端包括设置于自身壳体第一区域的第一温度采集器和设置于自身壳体第二区域的第二温度采集器,散热方法包括:在预设时间到达时,获取第一温度采集器采集的当前第一温度,和第二温度采集器采集的当前第二温度,其中,第一温度用于表征终端的最高壳体温度,第二温度用于表征终端所处环境的环境温度;根据第二温度和预设的第二温度与温度阈值的对应关系确定对应的当前温度阈值;在第一温度大于温度阈值时,根据第一温度与温度阈值的差值调整终端当前的运行参数。可以看出,本公开实施例根据第二温度即环境温度确定出适应当前环境温度的当前温度阈值,使终端可以根据不同的环境温度采用不同的温度阈值来进行终端的散热,这样,终端可以根据不同情形下的温度阈值的判断调整运行参数,使得终端达到良好的散热,如此提高了终端的散热性能,扩展了终端在不同环境温度下进行散热的适应性。
在阅读并理解了附图和详细描述后,可以明白其他方面。
图1为本公开实施例提供的一种散热方法的流程示意图;
图2为本公开实施例提供的第一温度采集器和第二温度采集器的示意图;
图3为本公开实施例提供的第二温度与温度阈值的映射关系示意图;
图4为本公开实施例提供的一种散热设置的界面示意图;
图5为本公开实施例提供的一种散热方法的流程示意图;
图6为本公开实施例提供的一种终端的结构示意图;
图7为本申请实施例提供的一种终端壳体示意图;以及
图8为本申请实施例提供的一种终端的结构示意图。
实施方式
下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述。
实施例一
图1为本公开实施例提供的一种散热方法的流程示意图,该散热方法应用于终端,其中终端包括设置于自身壳体第一区域的第一温度采集器和设置于自身壳体第二区域的第二温度采集器。本实施例的散热方法包括:步骤101,步骤102以及步骤103。
在步骤101中,在当前预设时间到达时,获取第一温度采集器采集的当前第一温度,和第二温度采集器采集的当前第二温度,其中,第一温度用于表征终端的壳体的最高温度,第二温度用于表征终端所处环境的环境温度;
需要说明的是,预设时间用于表征终端的第一温度采集器采集第一温度、及第二温度采集器采集第二温度的时间周期。终端在当前预设时间到达时,采集的是当前的第一温度和第二温度。预设时间可以根据实际需要进行设置,本申请实施例对此不做具体的限制。
在一些实施例中,终端壳体保护终端印制电路板(PCB,Printed Circuit Board)、终端电池等器件。终端壳体的内侧面向终端主板,终端壳体包括电池盖21和外壳侧边22(参见图2所示)。终端PCB主板上芯片在运行时产生的热量会通过屏蔽罩,散热膜,空气层等传递到终端壳体上。终端壳体为终端用户握触的地方,终端用户直接感受到的温度即为传递到终端壳体上的热量。因此,在终端壳体预留第一温度采集器和第二温度采集器的位置,并将第一温度采集器和第二温度采集器分别设置在终端壳体的第一区域和第二区域(示例性的参见图2所示)上。
终端壳体的第一区域包括终端壳体内侧的中间位置,即覆盖了终端内部主板上的主要发热芯片与终端壳体对应的位置,且该位置为用户经常触摸的地方,
因此终端壳体的第一区域的温度可以用来表征用户实际可以感受到的终端壳体的温度。本公开实施例对第一区域的设置不做具体限制。
终端壳体的第二区域包括终端壳体内侧的边缘位置,即终端显示屏竖直放置的时候,终端壳体的顶部和底部的位置,由于终端壳体的顶部和底部的区域避开了终端内部主板上的发热芯片,且该位置为用户不经常触摸的地方,因此终端壳体的第二区域的温度不受终端内部发热芯片和用户行为的影响,可以用来表征终端所处环境的环境温度。本申请实施例对第二区域的设置不做具体限制。
需要补充的是,图2中的第一区域和第二区域的位置仅为一种举例说明,可依据实际使用习惯对第一区域和第二区域进行设置,本申请实施例对此不做具体限制。
其中,第一温度用于表征终端的壳体的最高温度,即操作该终端的用户所感受到的温度。可理解地,若终端的壳体温度过高,会影响该终端的用户体验。
第二温度用于表征终端所处环境的环境温度,而终端所处环境的环境温度容易受当前季节及终端所处环境的影响。例如,对于夏天和冬天的环境温度,或者室内和室外的环境温度是有很大的差距的。对于不同的环境温度,终端用户对终端的壳体温度的要求是不同的,因此需要检测终端所处环境的环境温度,以便终端能够在不同环境温度下进行相应的散热措施,提高了终端在不同环境温度下进行散热的适应性。
实际应用中,第一温度采集器和第二温度采集器为温度采集系统、热传感器、热敏电阻等,本申请实施例对其不做具体限制。
例如,第一温度采集器和第二温度采集器的一种实现方式是热敏电阻(NTC,Negative Temperature Coefficient)和柔性线路板(FPC,Flexible Printed Circuit),其中,柔性线路板上设置有金手指,与主板上对应位置的弹片连接,当温度升高时,该热敏电阻的阻值会变化,从而使对应的电压值发送变化,通过阻值和电压的换算关系来检测温度的变化。
可选的,获取第一温度采集器采集的当前第一温度包括:在当前预设时间到达时,获取终端上设置的至少两个第一温度分采集器采集的至少两个待定第
一温度;判断至少两个待定第一温度的最大值;将至少两个待定第一温度的最大值作为第一温度。
其中,终端的第一温度采集器包括至少两个第一温度分采集器。
例如,第一温度采集器包括设置在第一区域(参见图2所示)的4个第一温度分采集器:在终端电池盖内侧设置的第一温度分采集器A1和第一温度分采集器A3,及终端的两个外壳侧边内侧分别设置的第一温度分采集器A4和第一温度分采集器A5。通过4个第一温度分采集器获取4个待定第一温度,判断出最大的待定第一温度,并将该最大的待定第一温度作为终端的第一温度。
另外,终端第二区域(参见图2所示)设置的第二温度采集器A2配置为采集第二温度,该第二温度用于表征终端所处环境的环境温度。
在步骤102中,根据第二温度和预设的第二温度与温度阈值的对应关系确定对应的当前温度阈值;
可理解地,终端用户在不同的环境温度下对终端的壳体温度的要求是不同的,参见图3所示。图3中横轴为第二温度,用于表征终端所处环境的环境温度;纵轴为与第二温度对应的温度阈值,即用户可以接受的终端壳体的最大温度。也就是说,终端的壳体温度不能超过用户可以接受的终端的壳体温度的最大值,若超过则需要进行终端散热处理如降低终端的运行速度等,减少终端热量的产生,从而降低终端的壳体温度,实现终端的散热。第二温度和预设的第二温度与温度阈值具有对应关系即温度阈值是第二温度的函数。
参见图3所示,若终端的第二温度为30度时,则与第二温度对应的温度阈值为40度;第二温度为5度时,则与第二温度对应的温度阈值为45度。那么,当检测到第二温度为30度,且第一温度超过温度阈值40度时,终端可以通过降低自身的中央处理器(CPU,Central Processing Unit)和图形处理器(GPU,Graphics Processing Unit)性能等方式,来降低自身的壳体温度。当终端检测到第二温度为5度,且第一温度超过温度阈值45度时,终端可以通过降低自身的CPU和GPU性能等方式,来降低自身的壳体温度。
另外,终端预先设置第二温度与温度阈值的对应关系可以参考国际电工委员会(IEC,International Electrotechnical Commission)的规定,参见表1
所示:
表1:温度阈值参考范围
可选地,第二温度与温度阈值的对应关系的设置方法包括:基于用户行为设置第二温度与温度阈值的对应关系。
可选地,如图4所示,用户可以通过打开终端的设置界面,并在散热设置选项中设置温度与温度阈值的对应关系。例如,温度为30度时,根据用户需要将对应的温度阈值设置为40度。
当然,本公开实施例根据实际需要还可以通过其他方法来设置第二温度与温度阈值的对应关系。
在步骤103中,在第一温度大于温度阈值时,根据第一温度与温度阈值的差值调整终端当前的运行参数,以便终端使用调整后的当前运行参数。
其中,终端预先根据第一温度与温度阈值的差值设置终端当前的运行参数。终端在打开不同的应用时,比如通话、充电、数据上网、无线保真(WIFI,WIreless-FIdelity)视频、游戏等应用时,终端的发热情况即第一温度是不同的,因此,终端可以结合终端当前打开的应用,并根据第一温度与温度阈值的
差值设置终端当前的运行参数,以便终端通过相应的散热措施使终端的壳体温度降到与环境温度对应的温度阈值。另外,终端可以通过场景模型识别系统来识别终端当前打开的应用。
举例来说,终端当前正在进行通信,终端根据第一温度与温度阈值的差值调整的终端当前的运行参数为终端当前的射频功率。那么,若第一温度与温度阈值的差值为第一级别差值,那么对应的待调整的终端当前的射频功率为预设射频功率的5%;若第一温度与温度阈值的差值为第二级别差值,那么对应的待调整的终端当前的射频功率为预设射频功率的10%;若第一温度与温度阈值的差值为第三级别差值,那么对应的待调整的终端当前的射频功率为预设射频功率的15%。如此一来,终端根据第一温度与温度阈值的差值得到不同级别的待调整的运行参数,从而实现了对终端的分级散热,提高终端的散热性能。本申请实施例对终端设置第一温度与温度阈值的差值与待调整的当前的运行参数的对应关系不做具体的限制。
可选地,根据第一温度与温度阈值的差值调整终端当前的运行参数,包括:根据第一温度与温度阈值的差值,和预设的差值与各级别的运行参数的对应关系,确定待运行级别的运行参数;将终端当前的运行参数调整为待运行级别的运行参数。
需要说明的是,终端通过预设差值与各级别运行参数的对应关系,使得终端可以根据第一温度与温度阈值的差值的不同,通过不同级别的运行参数实现了终端的分级散热。本申请实施例对差值与各级别的运行参数的对应关系的设置不做具体的限制。
可选地,待运行级别的运行参数包括:待运行充电电流值、待运行背光亮度,和第一待运行参数中的至少一种参数。
其中,第一待运行参数包括待运行射频功率、待运行CPU工作频率,待运行GPU工作频率等。
举例来说,终端根据当前的第一温度与温度阈值的差值确定出的待运行级别参数为第一充电电流值、第一射频功率。需要说明的是,终端当前所打开的应用可以是一种应用,也可以是多个应用。比如,终端当前正在进行通信,为
了保证终端与基站的正常通信终端的射频功率放大器会加大发射功率,那么终端通过降低射频功率放大器的射频功率,即将终端当前的射频功率调整为第一射频功率,从而来实现终端的散热。若终端在进行通信的同时还正在充电,那么,通过将终端当前的充电电流值调整为第一充电电流值,即降低充电电流值,进一步实现终端的散热。
在实际应用中,待运行级别的运行参数包括终端的各个应用软件或者各个功能模块的工作参数。如终端当前的液晶显示器(LCD,Liquid Crystal Display)的背光亮度、终端当前的WIFI数据吞吐量、终端当前的CPU处理频率和GPU处理频率调整。
可理解的,终端当前打开的应用软件可以包括多种应用,如通话、高速数据传输、WIFI视频传输、游戏场景等。终端可以根据不同级别的运行参数,分级的通过自身的发热控制系统来调整各个模块的高功耗器件的工作参数。如此一来,便可以充分的兼顾终端的系统性能和用户体验。
举例来说,若终端确定出的待运行级别参数为待运行充电电流值、待运行背光亮度,那么终端通过将当前的背光亮度调整为待运行背光亮度,并将终端当前的充电电流值调整为待运行充电电流值,以进行终端散热。若下一个预设时间到达时,终端采用当前采集到的实时温度判断出第一温度仍然大于温度阈值,那么,终端调整当前的充电电流值和背光亮度的同时,进一步将当前的射频功率放大器的射频功率调整为待运行射频功率,以便提高终端的散热性能。可以看出,对于每个预设时间段内终端执行的散热流程,由于终端当前的第一温度、温度阈值,及待运行级别参数都可能不同,因此,终端通过不同的待运行级别参数使终端实现了逐步的分级的散热。
可选地,在根据第一温度与温度阈值的差值调整终端当前的运行参数之后,方法还包括:在调整终端当前的运行参数之后的下一个预设时间到达时,执行下一次散热流程。
其中,散热流程包括步骤101-步骤103,也就是说当下一个预设时间到达时,终端采用这时采集到的实时温度(当前温度),重复步骤101-步骤103执行下一次散热流程。
需要说明的是,终端执行的每一次散热流程,由于终端当前的第一温度、温度阈值,及待运行级别参数都可能不同,因此,终端通过不同的待运行级别参数使终端实现了逐步的分级的散热。另外,终端循环的执行散热流程直到终端当前的第一温度小于等于对应的温度阈值时,终端保持当前的运行参数,并不再执行散热流程。
实施例二
图5为本申请实施例提供的一种散热方法的流程示意图,该方法包括步骤201-207。
在步骤201中,在当前预设时间到达时,获取第一温度采集器采集的当前第一温度,和第二温度采集器采集的当前第二温度。
其中,第一温度用于表征终端的最高壳体温度,第二温度用于表征终端所处环境的环境温度。
在步骤202中,根据第二温度和预设的第二温度与温度阈值的对应关系确定对应的当前温度阈值。
需要说明的是,终端可以根据用户行为来设置第二温度与温度阈值的对应关系。
在步骤203中,判断第一温度是否大于温度阈值,如果第一温度大于温度阈值,则执行步骤204;如果第一温度不大于温度阈值,则执行步骤207。
在步骤204中,根据第一温度与温度阈值的差值,和预设的差值与各级别的运行参数的对应关系,确定待运行级别的运行参数。
其中,待运行级别的运行参数包括:待运行充电电流值、待运行背光亮度,和第一待运行参数中的至少一种参数。其中,第一待运行参数包括待运行射频功率、待运行CPU工作频率,待运行GPU工作频率等。
在步骤205中,将终端当前的运行参数调整为待运行级别的运行参数。
可以理解的是,对于每个预设时间段内终端执行的散热流程,终端当前的第一温度和温度阈值可能不同,那么对应的待运行级别的运行参数也是不同的,从而使终端通过不同级别的运行参数实现了终端的分级散热,提高了终端的散热性能。
在步骤206中,在调整终端当前的运行参数之后的下一个预设时间到达时,继续执行步骤201。
这里,终端执行的每一次散热流程,由于终端当前的第一温度、温度阈值,及待运行级别参数都可能不同,因此,终端通过不同的待运行级别参数使终端实现了逐步的分级的散热。另外,终端循环的执行散热流程直到终端当前的第一温度小于等于对应的温度阈值时,终端保持当前的运行参数,并不再执行散热流程。
在步骤207中,保持终端当前的运行参数。
综上所述,本申请实施例提供了一种散热方法及终端,其中,散热方法应用于终端,终端包括设置于自身壳体第一区域的第一温度采集器和设置于自身壳体第二区域的第二温度采集器,方法包括:在当前预设时间到达时,获取第一温度采集器采集的当前第一温度,和第二温度采集器采集的当前第二温度,其中,第一温度用于表征终端的最高壳体温度,第二温度用于表征终端所处环境的环境温度;根据第二温度和预设的第二温度与温度阈值的对应关系确定对应的当前温度阈值;在第一温度大于温度阈值时,根据第一温度与温度阈值的差值调整终端当前的运行参数。可以看出,由于本申请实施例根据第二温度即环境温度确定出适应当前环境温度的当前温度阈值,使终端可以根据不同的环境温度采用不同的温度阈值来进行终端的散热,这样,终端可以根据不同情形下的温度阈值的判断调整当前运行参数,使得终端达到良好的散热,因此,提高了终端的散热性能,扩展了终端在不同环境温度下进行散热的适应性。
实施例三
图6为本公开实施例提供的一种终端的结构示意图,该终端10包括:设置于终端的壳体第一区域的第一温度采集器101、设置于终端10的壳体第二区域的第二温度采集器102、以及与第一温度采集器101和第二温度采集器102均连接的控制芯片103。
第一温度采集器101配置为在当前预设时间到达时获取当前第一温度,其中,第一温度用于表征终端10的最高壳体温度;
第二温度采集器102配置为当前预设时间到达时获取当前第二温度,其中,
第二温度用于表征终端10所处环境的环境温度;
控制芯片103配置为根据第二温度采集器102获取的第二温度和预设的第二温度与温度阈值的对应关系确定对应的当前温度阈值;在第一温度采集器101获取的第一温度大于温度阈值时,根据第一温度与温度阈值的差值调整终端10当前的运行参数。
可选地,第一区域包括终端10壳体内侧的中间位置,第二区域包括终端10壳体内侧的边缘位置,其中,终端10壳体内侧的中间位置与终端10壳体内侧的边缘位置属于不同的位置;第一温度采集器101包括至少两个第一温度分采集器。第一温度采集器101配置为在当前预设时间到达时,获取终端10上设置的至少两个第一温度分采集器采集的至少两个待定第一温度;判断至少两个待定第一温度的最大值;将至少两个待定第一温度的最大值作为第一温度。
图7为本申请实施例提供的一种终端壳体示意图,参见图7所示,终端壳体20包括电池盖21和外壳侧边22。终端壳体20配置为保护终端PCB主板、终端电池等器件,终端壳体20的内侧面向终端主板,终端PCB主板上芯片在运行时产生的热量会通过屏蔽罩,散热膜,空气层等传递到终端壳体20上。终端壳体20的外侧为终端用户握触的地方,终端用户直接感受到的温度即为传递到终端壳体20上的热量。因此,可以在终端壳体20预留第一温度采集器和第二温度采集器的位置,并将第一温度采集器和第二温度采集器分别设置在终端壳体20的第一区域和第二区域(如图7所示)上。本申请实施例对此不做具体限制。
可理解的,第一区域(如图7所示)包括终端10壳体20内侧的中间位置,即覆盖了终端内部主板上的主要发热芯片与终端壳体20对应的位置,且该位置为用户经常触摸的地方,因此终端壳体20的第一区域的温度可以用来表征用户实际可以感受到的终端壳体20的温度。当然,本申请实施例对第一区域的设置不做具体限制。
第二区域(如图7所示)包括终端10壳体20内侧的边缘位置,即终端显示屏竖直放置的时候,终端壳体20的顶部和底部的位置,由于终端壳体20的顶部和底部的区域避开了终端内部主板上的发热芯片,且该位置为用户不经常触摸的地方,因此终端壳体20的第二区域的温度不受终端内部发热芯片和用户
行为的影响,可以用来表征终端所处环境的环境温度。本申请实施例对第二区域的设置不做具体限制。
另外,参见图2所示,第一温度采集器包括4个第一温度分采集器:在终端电池盖21内侧设置的第一温度分采集器A1和第一温度分采集器A3,及终端的两个外壳侧边22内侧分别设置的第一温度分采集器A4和第一温度分采集器A5。通过获取4个第一温度分采集器采集的4个待定第一温度,判断出最大的待定第一温度,并将该最大的待定第一温度作为终端的第一温度。在终端电池盖21内侧的底部设置第二温度采集器A2,并利用第二温度采集器A2采集第二温度,该第二温度用于表征终端所处环境的环境温度。
可选地,第一温度采集器101和第二温度采集器102由热传感器实现,热传感器包括:热敏电阻104和柔性线路板105,其中,柔性线路板105与热敏电阻104和控制芯片103均连接。
其中,柔性线路板105上设置有金手指,与终端PCB主板上对应位置的弹片连接,当温度变化时,该热敏电阻104的阻值会变化,从而使控制芯片103采样端口获得的电压值发生变化,通过阻值和电压的换算关系来检测温度的变化。
可选地,参考图8所示,终端10还包括模数转换器106,模数转换器106与柔性线路板105和控制芯片103均连接。
热敏电阻104配置为将温度转换为电信号。
柔性线路板105配置为将电信号传输给模数转换器106;
模数转换器106配置为将电信号由模拟量转换为数字量并将传输给控制芯片103。
需要说明的是,本公开实施例中的终端包括智能手机、智能电视、平板电脑等。
本领域内的技术人员应明白,本公开的实施例可提供为方法、系统、或计算机程序产品。因此,本公开可采用硬件实施例、软件实施例、或结合软件和硬件方面的实施例的形式。而且,本公开可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质(包括但不限于磁盘存储器和光学存储
器等)上实施的计算机程序产品的形式。
本公开是参照根据本公开实施例的方法、设备(系统)、和计算机程序产品的流程图和/或方框图来描述的。应理解可由计算机程序指令实现流程图和/或方框图中的每一流程和/或方框、以及流程图和/或方框图中的流程和/或方框的结合。可提供这些计算机程序指令到通用计算机、专用计算机、嵌入式处理机或其他可编程数据处理设备的处理器以产生一个机器,使得通过计算机或其他可编程数据处理设备的处理器执行的指令产生用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的装置。
这些计算机程序指令也可存储在能引导计算机或其他可编程数据处理设备以特定方式工作的计算机可读存储器中,使得存储在该计算机可读存储器中的指令产生包括指令装置的制造品,该指令装置实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能。
这些计算机程序指令也可装载到计算机或其他可编程数据处理设备上,使得在计算机或其他可编程设备上执行一系列操作步骤以产生计算机实现的处理,从而在计算机或其他可编程设备上执行的指令提供用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的步骤。
以上所述,仅为本公开的较佳实施例而已,并非用于限定本公开的保护范围。
需要说明的是,本发明公开的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。
通过以上的实施方式的描述,本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现,当然也可以通过硬件。基于这样的理解,本公开实施例的技术方案可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中,包括指令用以使得一台终端设备(可以是手机,计算机,服务器,空调器,或者网络设备等)执行本申请实施例所述的方法。
本申请实施例根据环境温度确定出适应当前环境温度的温度阈值,使终端可以根据不同的环境温度来进行终端的散热,这样,终端可以根据不同情形下的温度阈值的判断调整运行参数,使得终端达到良好的散热,如此提高了终端的散热性能,扩展了终端在不同环境温度下进行散热的适应性。
Claims (11)
- 一种散热方法,应用于具有壳体的终端,所述壳体包括第一区域和第二区域,所述方法包括:获取第一区域的第一温度和第二区域的第二温度,其中,所述第一温度用于表征所述终端的壳体的最高温度,所述第二温度用于表征所述终端所处环境的环境温度;根据所述第二温度确定当前温度阈值,其中所述温度阈值是第二温度的函数;以及在所述第一温度大于所述温度阈值时,根据所述第一温度与所述温度阈值的差值调整所述终端的运行参数。
- 根据权利要求1所述的方法,其中,所述根据所述第一温度与所述温度阈值的差值调整所述终端当前的运行参数,包括:根据所述第一温度与所述温度阈值的差值确定待运行级别的运行参数,其中所述待运行级别的运行参数是所述第一温度与所述温度阈值的差值的函数;将所述终端当前的运行参数调整为所述待运行级别的运行参数。
- 根据权利要求1所述的方法,其中,在所述根据所述第一温度与所述温度阈值的差值调整所述终端当前的运行参数之后,所述方法还包括:在预定时间后,重复所述获取,确定和调整的步骤。
- 根据权利要求1所述的方法,其中,所述获取所述第一温度采集器采集的当前第一温度包括:获取所述终端上的至少两个待定第一温度;以及将所述至少两个待定第一温度的最大值作为所述第一温度。
- 根据权利要求2所述的方法,其中,所述待运行级别的运行参数,包括:待运行充电电流值、待运行背光亮度,和第一待运行参数中的至少之一,其中,所述第一待运行参数包括待运行射频功率,待运行CPU工作频率,待运行GPU工作频率。
- 根据权利要求1所述的方法,其中,所述温度阈值和第二温度的函数基于用户行为设定。
- 如权利要求1-6任一项所述的方法,其中,所述第一温度由设置于第一区域的第一温度采集器采集,所述第二温度由设置于第二区域的第二温度采集 器采集。
- 一种终端,包括:壳体;设置于所述壳体第一区域的第一温度采集器;设置于所述壳体第二区域的第二温度采集器;以及与所述第一温度采集器和所述第二温度采集器均连接的控制芯片,其中,所述第一温度采集器设置为获取当前第一温度,所述第一温度用于表征所述终端的最高壳体温度;所述第二温度采集器设置为获取当前第二温度,所述第二温度用于表征所述终端所处环境的环境温度;所述控制芯片用于根据所述第二温度确定当前温度阈值;在所述第一温度大于所述温度阈值时,根据所述第一温度与所述温度阈值的差值调整所述终端当前的运行参数,所述温度阈值是所述第二温度的函数。
- 根据权利要求8所述的终端,其中,所述第一区域包括所述终端壳体内侧的中间位置,所述第二区域包括所述终端壳体内侧的边缘位置,其中,所述终端壳体内侧的中间位置与所述终端壳体内侧的边缘位置属于不同的位置;所述第一温度采集器包括至少两个第一温度分采集器,其中,所述第一温度分采集器设置为采集待定第一温度;所述第一温度采集器设置为获取至少两个第一温度分采集器采集的至少两个待定第一温度;将所述至少两个待定第一温度的最大值作为所述第一温度。
- 根据权利要求8所述的终端,其中,所述第一温度采集器和所述第二温度采集器包括热传感器,所述热传感器包括:热敏电阻和柔性线路板,其中,所述柔性线路板与所述热敏电阻和所述控制芯片均连接。
- 根据权利要求10所述的终端,其中,所述终端还包括模数转换器,所述模数转换器连接在柔性电路板和控制芯片之间。
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