WO2017193660A1 - 电光源一体式led金属基线路板的制造方法 - Google Patents

电光源一体式led金属基线路板的制造方法 Download PDF

Info

Publication number
WO2017193660A1
WO2017193660A1 PCT/CN2017/073584 CN2017073584W WO2017193660A1 WO 2017193660 A1 WO2017193660 A1 WO 2017193660A1 CN 2017073584 W CN2017073584 W CN 2017073584W WO 2017193660 A1 WO2017193660 A1 WO 2017193660A1
Authority
WO
WIPO (PCT)
Prior art keywords
aluminum
copper foil
plate
metal
circuit board
Prior art date
Application number
PCT/CN2017/073584
Other languages
English (en)
French (fr)
Inventor
楼方寿
楼红卫
Original Assignee
浙江罗奇泰克电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201610303262.4A external-priority patent/CN105813391B/zh
Priority claimed from CN201610303355.7A external-priority patent/CN105813389B/zh
Priority claimed from CN201610494529.2A external-priority patent/CN106132098B/zh
Application filed by 浙江罗奇泰克电子有限公司 filed Critical 浙江罗奇泰克电子有限公司
Publication of WO2017193660A1 publication Critical patent/WO2017193660A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Definitions

  • the invention relates to the field of LED photoelectric technology, in particular to a method for manufacturing an LED metal-based circuit board integrating a driving power source and a light source.
  • the lamp bead in the LED lighting fixture generates heat during the working process. Therefore, it is necessary to use a metal-based circuit board with good heat dissipation and heat resistance as the carrier of the LED lamp bead; at the same time, the lamp bead of the LED lamp is soldered by the patch.
  • the components of the driving power supply part are mainly soldered by means of plug-ins. Therefore, the driving power source and the light source of the LED lamp are separately manufactured and connected and assembled, which causes great trouble for people's production and life. Materials and manufacturing costs are also relatively high. In pursuit of lightness, convenience, and improved product performance, it is expected that the power driver and light source of the LED illuminator will be integrated to further meet the needs of people's production and life.
  • One method is to place the driving power supply part directly in the LED light source circuit on the aluminum-based circuit board in a patch manner, in an AC-AC manner.
  • LED lamps made in this way tend to produce flicker, and are affected by factors such as surges in the power grid.
  • the driver chip is easily damaged. The heat generated during power supply can seriously affect the performance of the LED lamp bead.
  • Another method is to use a FR4, CEM-1 or CEM-3 plate that is milled (or punched) to be used as a substrate, inlaid into a previously milled (or punched)
  • the aluminum plate of the same size is then coated with an insulating layer, coated with a copper foil plate, and then processed by a circuit board to form an integrated light source for an electric light source.
  • the disadvantage of this method is that the material cost and the processing cost are doubled.
  • production efficiency is very low, can only be manufactured in a small amount, can not be scaled production; and when pressing, due to the thickness error caused by the cutting of the power substrate and the aluminum plate itself, the error of the substrate embedded in the aluminum plate and the punching The impact of the generated dust and other production during pressing, these factors will seriously affect the combination of insulation layer and copper foil, aluminum plate, and ultimately affect the product quality indicators such as peel strength, insulation and thermal conductivity.
  • the above two methods have the following deficiencies in a single step: mainly refers to the step of applying glue.
  • the traditional method adopts three methods of roll coating, printing and spray coating. These three methods have the following disadvantages: 1 roll coating, glue The thickness is difficult to adjust, the thickness is uneven, the production speed is slow, generally about 3-4m/min; 2 printing, low efficiency, slow speed, small product size, general product width is below 60cm, can not produce size 1m*2m
  • Such a large-size aluminum-based copper clad plate; 3 spray coating, although the product can be sprayed very evenly, can also produce large-size plates, but because the sprayed insulating glue is foggy, a large amount of colloidal matter is dispersed into the air, except Region affecting the environment has a health impact on the surrounding operators, it will also waste a lot of raw materials and increase production costs.
  • the invention provides a circuit board manufacturing method which combines a metal such as copper and aluminum with good heat dissipation and heat resistance as a substrate, and combines a driving power source portion and a light source portion of the LED lighting device, which can greatly facilitate the production of the LED. Manufacturing and daily use reduce material consumption and increase productivity. Specifically, a method of manufacturing an electric light source integrated LED metal-based wiring board is disclosed.
  • the aluminum base plate with thickness of 0.2-1.5mm is selected and washed with water to prepare the desired aluminum plate; the specific method for surface treatment of aluminum plate is: a, soak the aluminum base plate at 10% -12%, the temperature is 56-60 ° in the alkali etching tank, treatment for 3.5-4.5 minutes, b, the alkali-etched aluminum base plate is washed with water and soaked in a neutralization tank with a nitric acid content of 10%-12% After treatment for 2-3 minutes, the surface residue of the aluminum base plate is further removed, c, and the treated aluminum base plate is washed and dried;
  • step (3) Spraying thermal conductive adhesive: The thermal conductive adhesive is directly coated on the aluminum plate by the spray nozzle coating technology, and the sprayed aluminum plate is baked in the tunnel furnace, and the thermal conductive adhesive is in a semi-cured state, and the gelation time is controlled. In the 50-70 seconds; wherein the thickness of the thermal conductive adhesive is above 300 ⁇ m, the number of spraying is adjusted according to the thickness of the thermal conductive adhesive, and the thickness of each spray coating is between 50 ⁇ m and 150 ⁇ m, and the sprayed aluminum plate is placed in the tunnel furnace. And at 140 Bake at °C-150 °C for 4-6 minutes. After step (3), a layer of prepreg is added, and then step (4) is performed.
  • the prepreg is made of glass cloth, and the thermal conductivity is above 1 W/mk, and the spray coating coating technology is adopted to solve several existing coatings.
  • thermal conductive insulating spray curtain coating technology can also be widely applied to the manufacture of non-photoelectric integrated metal-based copper clad laminates and circuit boards.
  • Laminated copper foil a copper foil with a thickness of 0.018-0.1 mm is laminated on an aluminum plate coated with thermal conductive glue, and the composite aluminum plate which has been typeset is first transferred to a press for heating, pressurization, vacuum pressing, The aluminum plate, the thermal conductive glue and the copper foil are combined together, and then the hot pressed composite aluminum plate is transferred to a cold press for cooling and shear forming to obtain an aluminum-based copper clad laminate;
  • etching and removing the film after the aluminum plate surface and the copper foil surface are printed and solidified, etching, removing the film, removing the film, and then performing surface cleaning and drying, the surface cleaning water pressure is controlled at 0.24-0.36 Mp, and the rinsing time is 20 More than two seconds;
  • An aluminum-based circuit board is obtained by oxidation prevention.
  • the substrate material may also be replaced by any one of a metal plate having a thickness of 0.072-0.2 mm or a stainless steel plate having a thickness of 0.2-1.5 mm, an iron plate, a silicon steel plate, or the like, and an alloy plate.
  • the manufacturing method of the electric light source integrated LED metal base circuit board, the substrate material is aluminum plate, including the manufacture of the aluminum base copper plate and the manufacture of the aluminum base circuit board, which comprises the following steps:
  • the aluminum base plate with thickness of 0.2-1.5mm is selected and washed with water to prepare the desired aluminum plate; the specific method for surface treatment of aluminum plate is: a, soak the aluminum base plate at 10% -12%, the temperature is 56-60 ° in the alkali etching tank, treatment for 3.5-4.5 minutes, b, the alkali-etched aluminum base plate is washed with water and soaked in a neutralization tank with a nitric acid content of 10%-12% After treatment for 2-3 minutes, the surface residue of the aluminum base plate is further removed, c, and the treated aluminum base plate is washed and dried;
  • step (3) Spraying thermal conductive adhesive: The thermal conductive adhesive is directly coated on the aluminum plate by the spray nozzle coating technology, and the sprayed aluminum plate is baked in the tunnel furnace, and the thermal conductive adhesive is in a semi-cured state, and the gelation time is controlled. In the 50-70 seconds; wherein the thickness of the thermal conductive adhesive is above 300 ⁇ m, the number of spraying is adjusted according to the thickness of the thermal conductive adhesive, and the thickness of each spray coating is between 50 ⁇ m and 150 ⁇ m, and the sprayed aluminum plate is placed in the tunnel furnace. And baked at 140 ° C - 150 ° C for 4-6 minutes. After step (3), a prepreg is further coated, and then step (4) is performed. The prepreg is made of glass cloth, and the thermal conductivity is above 1 W/mk;
  • Laminated copper foil a copper foil with a thickness of 0.018-0.1 mm is laminated on an aluminum plate coated with a thermal conductive adhesive, and the composite aluminum plate which has been typeset is first transferred to a press for heating, pressurization, vacuum pressing, The aluminum plate, the thermal conductive glue and the copper foil are combined together, and then the hot pressed composite aluminum plate is transferred to a cold press for cooling;
  • the aluminum-based copper clad board is divided into a copper foil surface and an aluminum panel surface. First, the aluminum panel surface is printed, and then the copper foil surface pattern is printed. The printed ink materials are all light-solid type, and the aluminum panel surface light-solid energy is used. Controlled at 900-1000mj; copper foil surface light solid energy control is 650-800mj;
  • etching and removing the film after the aluminum plate surface and the copper foil surface are printed and solidified, etching, removing the film, removing the film, and then performing surface cleaning and drying, the surface cleaning water pressure is controlled at 0.24-0.36 Mp, and the rinsing time is 20 More than two seconds;
  • An aluminum-based circuit board is obtained by oxidation prevention.
  • the substrate material may also be replaced by any one of a metal plate having a thickness of 0.072-0.2 mm or a stainless steel plate having a thickness of 0.2-1.5 mm, an iron plate, a silicon steel plate, or the like, and an alloy plate.
  • the manufacturing method of the electric light source integrated LED metal base circuit board comprises the manufacture of the metal base copper clad board and the manufacture of the metal base circuit board, comprising the following steps:
  • metal plate used as substrate material, surface degreasing, roughening, washing and drying to obtain metal base plate;
  • the substrate material is copper plate with thickness of 0.072-0.2 mm, 0.2 to 1.5 mm of aluminum, stainless steel, iron, silicon steel and other metals and alloy sheets.
  • the PP adhesive is superposed on the metal base plate;
  • the thermal conductive insulating film is a thermal conductive PP composed of a glass cloth and a thermal conductive adhesive, or an ordinary PP composed of a glass cloth and an epoxy resin. Or a thermal conductive film composed of a thermal conductive adhesive;
  • Laminated copper foil a copper foil having a thickness of 0.018-0.1 mm is laminated on a metal base plate laminated with a thermal conductive insulating film, and laminated to bond the metal base plate, the thermal conductive insulating film, and the copper foil together. , made of metal-based copper clad laminate;
  • the metal-based copper-clad board includes a substrate surface and a copper foil surface, and the metal-based copper-clad board is opened and drilled according to design requirements, and then the copper foil surface is Front of the substrate surface deal with;
  • Wiring of the circuit diagram using a printing process or an exposure process, the printing process is printed by UV ink, first performing substrate surface printing, UV curing, forming a substrate surface pattern, and then performing copper foil surface printing, UV curing, forming a board surface. a circuit pattern; the exposure process is: coating and baking the substrate surface and the copper foil surface with a photosensitive ink, and performing exposure and development to realize pattern forming of the circuit surface and the substrate surface;
  • the copper foil in the copper foil surface and the substrate metal in the substrate surface are etched with acid or alkaline; the ink is removed by alkali to form a line; and the surface and the substrate surface are surface-cleaned and dried;
  • Coating of solder resist white oil After the surface of the copper foil surface is surface-treated, it is coated or printed with a white photosensitive ink according to a solder resist pattern, and then baked and dried at a temperature of 80-110 ° C;
  • Exposure and development exposing the solder resist pattern to the copper foil line after alignment; developing with sodium carbonate solution, and performing surface cleaning and drying;
  • the invention adopts the above improvement measures, and the beneficial effects thereof are remarkable: the invention can mass-produce the metal-based circuit board integrating the electricity collection and the light source, changes the traditional form of the circuit board, and implants a new function for the circuit board. Moreover, the invention has no falling ash during processing, and the product has the characteristics of strong adhesion of copper foil, good heat dissipation, high thermal conductivity and high pressure resistance, and can change indoor and outdoor LED lighting fixtures such as LED downlights, spotlights, and flat lamps.
  • the assembly structure has the characteristics of energy saving, energy saving and material saving.
  • FIG. 1 is a block diagram showing a production process of Embodiment 1 of the present invention.
  • FIG. 2 is a block diagram of a production process of Embodiment 2 of the present invention.
  • Embodiment 3 is a block diagram of a production process of Embodiment 3 of the present invention.
  • Figure 4 is a block diagram showing the production process of Embodiment 4 of the present invention.
  • a method for manufacturing an electric light source integrated LED metal-based circuit board the substrate material is an aluminum plate, including the manufacture of an aluminum-based copper clad plate and the production of an aluminum-based circuit board, which comprises the following steps:
  • the aluminum base plate with thickness of 0.2-1.5mm is selected and washed with water to prepare the desired aluminum plate; the specific method for surface treatment of aluminum plate is: a, soak the aluminum base plate at 10% -12%, the temperature is 56-60 ° in the alkali etching tank, treatment for 3.5-4.5 minutes, b, the alkali-etched aluminum base plate is washed with water and soaked in a neutralization tank with a nitric acid content of 10%-12% After treatment for 2-3 minutes, the surface residue of the aluminum base plate was further removed, and the treated aluminum base plate was washed and dried.
  • the specific method for surface treatment of aluminum plate is: a, soak the aluminum base plate at 10% -12%, the temperature is 56-60 ° in the alkali etching tank, treatment for 3.5-4.5 minutes, b, the alkali-etched aluminum base plate is washed with water and soaked in a neutralization tank with a nitric acid content of 10%-12% After treatment for 2-3 minutes, the surface residue of the aluminum base plate
  • the thermal conductive adhesive is directly coated on the aluminum plate by the spray nozzle coating technology, and the sprayed aluminum plate is baked in the tunnel furnace, and the thermal conductive adhesive is in a semi-cured state, and the gelation time is controlled. In the 50-70 seconds; wherein the thickness of the thermal conductive adhesive is above 300 ⁇ m, the number of spraying is adjusted according to the thickness of the thermal conductive adhesive, and the thickness of each spray coating is between 50 ⁇ m and 150 ⁇ m, and the sprayed aluminum plate is placed in the tunnel furnace. And baking at 140 ° C -150 ° C for 4-6 minutes, after spraying the thermal paste, a layer of prepreg is applied, the prepreg is made of glass cloth, and the thermal conductivity is above 1w/mk.
  • Laminated copper foil a copper foil with a thickness of 0.018-0.1 mm is laminated on the aluminum plate of the coated thermal conductive film, and the typed composite aluminum plate is first transferred to a press for heating, pressurization, and vacuum pressing. In combination, an aluminum plate, a thermal conductive film, and a copper foil are combined to obtain an aluminum-based copper clad laminate.
  • etching and film removal firstly, the double-sided pattern is short-circuited, and the ink protection of the aluminum plate surface is complete and rational. After the aluminum plate surface and the copper foil surface pattern are formed, it is placed in an acidic etching solution for etching, removing the film, and after removing the film. The surface is cleaned and dried. The water pressure is controlled at 24-36N and the cleaning time is over 20 seconds.
  • Coating of solder resist white oil coating and printing should be cleaned, the concentration of dilute sulfuric acid in chemical solution is controlled at 3-5%, the effect of copper foil surface and aluminum surface can be ensured, and the surface of copper foil surface is polished. Brush and mesh, the width of the wear scar is the same as that of the single panel, and will not be described. After the white oil is applied, it is dried and then wait for exposure.
  • Character printing and curing Character printing requires different requirements, some are component identification, and some are trademark models. Because the aluminum plate surface is somewhat uneven, it is impossible to complete the character printing of the concave portion by printing. Therefore, the logo such as the trademark is designed on the aluminum surface, and all other component symbols are designed in the white oil surface.
  • the printed character plate will be thermally cured at a temperature of 150 ° C for 45 minutes.
  • Anti-oxidation treatment of aluminum-based circuit board the concentration of 5-6% hydrogen peroxide, sulfuric acid concentration of 4-5%, reduce the micro-etching damage to the aluminum plate.
  • the pressure of the lower spray after anti-oxidation should be increased to 25-35N, and the pressure of the hot air knife should reach 20-30N, so that the water can be blown and completely dried, and the temperature is controlled between 65-80 degrees.
  • the substrate material may be replaced by a copper plate having a thickness of 0.072-0.2 mm or a stainless steel plate having a thickness of 0.2-1.5 mm, a metal plate such as an iron plate or a silicon steel plate, and an alloy plate having a thickness of 0.2-1.5 mm.
  • the manufacturing method of the electric light source integrated LED metal base circuit board, the substrate material is aluminum plate, including the manufacture of the aluminum base copper plate and the manufacture of the aluminum base circuit board, which comprises the following steps:
  • (1) Surface treatment of aluminum plate an aluminum base plate having a thickness of 0.2-1.5 mm is selected, washed, and dried to prepare a desired aluminum plate.
  • the specific method for surface treatment of aluminum plate is as follows: a. The aluminum base plate is immersed in an alkali etching tank of 10%-12% and a temperature of 56-60° for 3.5-4.5 minutes, b, an alkali substrate after alkali etching The plate is further washed with water and treated in a neutralization tank having a nitric acid content of 10% to 12% for 2-3 minutes to further remove the surface residue of the aluminum base plate. c. The treated aluminum base plate is washed and dried.
  • Spraying thermal conductive adhesive directly apply the thermal conductive adhesive on the aluminum plate by using the spray nozzle coating technology, and adjust the number of spraying according to the thickness of the thermal conductive adhesive.
  • the thickness of each spraying is between 50 ⁇ m and 150 ⁇ m, and the spraying can be adjusted.
  • the conveying speed and the frequency of the rubber pump motor are converted to the required thickness.
  • the sprayed aluminum plate is placed in a tunnel furnace at 140 ° C - 150 ° C for 4-6 minutes, and the gelation time of the semi-cured state of the thermal paste is controlled. 50-70 seconds;
  • a prepreg is applied and then the copper foil is laminated.
  • the prepreg is made of glass cloth, and the thermal conductivity is above 1 W/mk.
  • Laminated copper foil a copper foil with a thickness of 0.018-0.1 mm is laminated on the aluminum plate of the coated thermal conductive film, and the typed composite aluminum plate is first transferred to a press for heating, pressurization, and vacuum pressing. In combination, an aluminum plate, a thermal conductive film, and a copper foil are combined to obtain an aluminum-based copper clad laminate.
  • the aluminum-based copper clad plate is preheated through the drying tunnel, the drying tunnel temperature parameter is 160-180 ° C, and the transmission speed is 3.5-4 m/min.
  • Circuit diagram molding firstly, the aluminum plate surface (the side not covered with the copper foil) is printed, and then the copper foil surface (the side on which the aluminum-based copper clad plate is covered with the copper foil) is printed on the circuit pattern, and the printed ink materials are all used.
  • Light-solid type, aluminum plate surface light-solid energy control is 900-1000mj, wherein the aluminum plate surface printing blade pressure is 25-35N; copper foil surface light-solid energy control is 650-800mj, wherein the copper surface printing blade pressure is 18-25N .
  • Etching and removing the film After printing and solidifying the aluminum plate surface and the copper foil surface, it is placed in an acidic chemical solution for etching and film removal, and then the surface is cleaned and dried after the film is removed, and the surface cleaning water pressure is controlled at 0.24-0.36. Mp, the rinse time is more than 20 seconds.
  • Coating of solder resist white oil coating and printing should be cleaned, the concentration of dilute sulfuric acid in chemical solution is controlled at 3-5%, the effect of copper foil surface and aluminum surface can be ensured, and the surface of copper foil surface is polished. Brush and mesh, the width of the wear scar is the same as that of the single panel, and will not be described. After the white oil is applied, it is dried and then wait for exposure.
  • Character printing and curing Character printing requires different requirements, some are component identification, and some are trademark models. Because the aluminum plate surface is somewhat uneven, it is impossible to complete the characters in the hollow by printing. Therefore, the trademark is designed on the aluminum surface, and all other component symbols are designed on the white oil surface.
  • the printed character plate will be thermally cured at a temperature of 150 ° C for 45 minutes.
  • Punching 1.
  • the numerical control drilling is mainly the elemental platinum aperture of the drilling drive board.
  • the drilling speed should be adjusted.
  • the parameter is 3-4 million drills.
  • the hole diameter and shape are completed once by the punching machine. It can be done down.
  • Anti-oxidation treatment of aluminum-based circuit board the concentration of 5-6% hydrogen peroxide, sulfuric acid concentration of 4-5%, reduce the micro-etching damage to the aluminum plate.
  • the pressure of the lower spray after anti-oxidation should be increased to 25-35N, and the pressure of the hot air knife should reach 20-30N, so that the water can be blown and completely dried, and the temperature is controlled between 65-80 degrees.
  • the substrate material may be replaced by a copper plate having a thickness of 0.072-0.2 mm or a stainless steel plate having a thickness of 0.2-1.5 mm, a metal plate such as an iron plate or a silicon steel plate, and an alloy plate having a thickness of 0.2-1.5 mm.
  • the manufacturing method of the electric light source integrated LED metal base circuit board comprises the manufacture of the metal base copper clad board and the manufacture of the metal base circuit board based on the metal base copper clad board, the steps include:
  • the thermal conductive insulating film is laminated on the iron base plate.
  • the thermal conductive insulating film can be a thermal conductive PP composed of glass cloth and thermal conductive adhesive, or a common PP composed of glass cloth and epoxy resin. Or a thermal conductive film composed of a thermal adhesive.
  • Laminated copper foil a copper foil having a thickness of 0.018-0.1 mm is laminated on an iron base plate laminated with a thermal conductive insulating film, and the typed plate is hot pressed and cold pressed by a press to make an iron substrate.
  • the plate, the thermal conductive insulating film, and the copper foil are combined to form an iron-based copper clad laminate.
  • the iron-based copper clad plate includes a substrate surface and a copper foil surface, the side covering the copper foil is called a copper foil surface, and the other side is a substrate surface, and the iron base is After the copper clad plate is opened and drilled according to the design requirements, the copper foil surface and the substrate surface are pretreated.
  • Wiring of the circuit diagram The exposure process is adopted, and the substrate surface and the copper foil surface are simultaneously coated with a photosensitive ink, baked and dried, and then exposed and developed to form a pattern of the wiring surface and the substrate surface.
  • the exposure energy of the copper foil surface is 500 mj
  • the substrate surface exposure energy is 600 mj
  • the double-sided development is performed using a sodium carbonate solution having a concentration of 0.8-1.2%.
  • Etching and film removal After the circuit pattern is formed, the substrate surface and the copper foil surface are etched with acid or alkaline; the ink is removed by the alkali solution; after the ink is removed, the circuit surface and the substrate surface are surface-cleaned and dried.
  • the solder resist pattern is aligned with the copper foil line after exposure; the sodium carbonate solution having a concentration of 1.2% is used, and the development operation is performed at a transmission speed of 3.8 m/min and a head pressure of 22.5 N. After the development is completed, the board surface is cleaned and dried.
  • Character mark printing and curing The surface of the substrate of the power driving portion is recessed, and the printing method is used for letterpress printing.
  • the substrate material may be a stainless steel plate instead of any one of a metal such as an aluminum plate of 0.2 to 1.5 mm, a silicon steel plate, or a metal alloy.
  • the manufacturing method of the electric light source integrated LED metal base circuit board comprises the manufacture of the metal base copper clad board and the manufacture of the metal base circuit board based on the metal base copper clad board, the steps include:
  • the thermal insulating insulating film is laminated on a copper base plate, and the thermal conductive insulating film may be a thermal conductive PP composed of a glass cloth and a thermal conductive adhesive, or an ordinary PP composed of a glass cloth and an epoxy resin. Or a thermal conductive film composed of a thermal adhesive.
  • Laminated copper foil a copper foil having a thickness of 0.018-0.1 mm is laminated on a copper base plate laminated with a thermally conductive insulating film, and the typed plate is hot pressed and cold pressed by a press to form a copper substrate.
  • the board, the thermal conductive insulating film, and the copper foil are combined to form a copper-based copper clad laminate.
  • the copper-based copper clad plate includes a substrate surface and a copper foil surface, the side covering the copper foil is called a copper foil surface, and the other side is a substrate surface, and the copper base is After the copper clad plate is opened and drilled according to the design requirements, the copper foil surface and the substrate surface are pretreated.
  • Circuit diagram molding Firstly, the aluminum plate surface is printed, then the copper foil surface pattern is printed.
  • the printed ink materials are all light-solid type, the aluminum plate surface light-solid energy is controlled at 950 mj; the copper foil surface light-solid energy is controlled at 700 mj.
  • Etching and film removal After the circuit pattern is formed, the substrate surface and the copper foil surface are etched with acid or alkaline; the ink is removed by the alkali solution; after the ink is removed, the circuit surface and the substrate surface are surface-cleaned and dried.
  • Exposure and development Exposing the solder resist pattern to the copper foil line after exposure; using a sodium carbonate solution with a concentration of 1.0%, and developing at a transmission speed of 3.5 m/min and a nozzle pressure of 20 N for development and development After the completion, the board surface is cleaned and dried.
  • Character mark printing and curing The surface of the substrate of the power driving portion is recessed, and the printing method is used for letterpress printing.
  • the substrate material may be replaced by any one of a metal such as an aluminum plate of 0.2 to 1.5 mm, an iron plate, a silicon steel plate, a stainless steel plate, and a metal alloy.
  • a metal such as an aluminum plate of 0.2 to 1.5 mm, an iron plate, a silicon steel plate, a stainless steel plate, and a metal alloy.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

电光源一体式LED金属基线路板的制造方法，经过金属板表处理→涂覆导热胶→覆合铜箔层压→开料、钻定位孔、前处理→线路图成型→蚀刻去膜→打靶工艺定位孔、线路通断测试→阻焊白油的涂布→曝光→显影→字符印刷和固化→冲孔→v割→防氧化处理，其中涂覆导热胶采用喷刀形成的帘幕喷涂导热胶，或者叠覆导热绝缘胶片到金属基底板上，线路图成型采用印刷工艺或者曝光工艺，可大批量生产电光源一体的金属基线路板，且制作的LED和电源均具有良好的散热性。

Description

电光源一体式LED金属基线路板的制造方法 技术领域
本发明涉及LED光电技术领域，具体地说是一种集驱动电源与光源为一体的LED金属基线路板的制造方法。
背景技术
LED照明灯具中的灯珠在工作过程中要产生热量，因此，需要采用散热性、耐热性良好的金属基线路板作为LED灯珠的载体；同时LED灯具的灯珠以贴片的方式焊接为主，而驱动电源部分的元器件主要以插件的方式进行焊接，因此，LED灯具的驱动电源与光源采用分别制造，连接装配使用的办法生产，这样给人们的生产生活带来很大的麻烦，材料和制造成本也相对较高。为追求轻巧、方便、提高产品性能，人们期望将LED照明器的电源驱动和光源合为一体，进一步满足人们的生产生活需要。
目前对集电源驱动部分和光源于一体的研究有两种，一种做法是在铝基线路板上直接以贴片的方式将驱动电源部分置于LED光源电路之内，以AC-AC的方式驱动，这种方式制成的LED灯具往往会产生闪烁现象，并且受到电网线路的浪涌等因素的影响，驱动芯片极易损坏，电源工作时产生的热量会严重影响LED灯珠的性能，LED灯具的性能、稳定性受到严重影响；另一种做法是用铣好(或用冲床冲好)尺寸的FR4、CEM-1或CEM-3板作基板，镶嵌到事先铣好(或冲好)同样尺寸的铝板上，然后涂布绝缘层，覆上铜箔板压合，再进行线路板加工生产，制成电光源一体式LED灯具，这种方法的缺点是材料成本和加工成本成倍增加、生产效率很低，只能少量制造，无法规模化生产；而且压合时，由于电源基材和铝板本身裁切时产生的厚度误差、基板镶嵌在铝板上出现的误差以及冲切时产生的粉尘等在压合时生产的影响，这些因素都会严重影响到绝缘层与铜箔、铝板的结合，最终影响到产品的剥离强度、绝缘性和导热性等技术质量指标。
上述两种做法的在单个步骤中还存在以下不足：主要指涂胶步骤，传统做法采用滚涂、印刷和喷雾式涂布三种方式，这三种方式分别存在以下不足：①滚涂，胶的厚度很难调整、厚薄不均，生产速度较慢，一般在3-4m/min左右；②印刷，效率低、速度慢，产品尺寸小，一般产品宽度在60cm以下，不能生产尺寸1m*2m这样的大规格铝基覆铜板；③喷雾式涂布，虽然产品可以喷得很均匀，也能生产大规格板，但由于喷出的绝缘胶呈雾状，大量胶体物质飘散到空气中，除了严重影响环境对周围操作人员有健康影响外，还会大量浪费原材料，提高生产成本。
技术问题
本发明提供了一种具有良好散热、耐热性的铜、铝等金属作为基板、将LED照明灯具的驱动电源部分和光源部分合二为一的线路板制造方法，可以极大地方便LED的生产制造和日常使用，降低材料消耗，提高生产率。具体地说是公开了一种电光源一体式LED金属基线路板的制造方法。
问题的解决方案
技术解决方案
本发明是通过以下技术方案实现的：电光源一体式LED金属基线路板的制造方法，基板材料为铝板，包括铝基覆铜板的制作以及铝基线路板的制作，其包括以下步骤：
(1)铝板表面处理：选用厚度为0.2-1.5mm的铝基底板经处理后水洗烘干，制备得所需铝板；铝板表面处理的具体方法为：a、将该铝基底板浸泡在10％-12％，温度为56-60°的碱蚀槽中，处理3.5-4.5分钟，b、经碱蚀后的铝基底板再经水洗后泡在硝酸含量为10％-12％的中和槽处理2-3分钟，进一步除去铝基底板表面残留物，c、将处理后的铝基底板水洗烘干；
(2)配制导热胶；
(3)喷涂导热胶：采用喷刀喷帘涂布技术直接将导热胶涂布在铝板上，经喷涂后的铝板放隧道炉中烘烤，并使导热胶处于半固化状态，胶化时间控制在50-70秒；其中导热胶的厚度在300μm以上，按导热胶的厚度调整喷涂的次数，每次喷帘涂布的厚度为50μm-150μm之间，经过喷涂后的铝板放入隧道炉中，并在140 ℃-150℃的条件下烘烤4-6分钟。步骤(3)后再加覆一层半固化片，再进行步骤(4)的操作，半固化片采用玻璃布，导热系数在1W/mk以上，采用喷刀喷帘式涂布技术，解决现有几种涂胶方式带来的缺陷，高压喷刀在其下方喷出的是帘幕，可均匀地对线路板进行涂胶，且节省油墨或绝缘胶，工作速度快，每分钟可以走到20-25米，劳动效率成几何倍数的增长；
该导热绝缘胶喷帘涂布技术，还可广泛应用于非光电一体式金属基覆铜板、线路板的制造。
(4)覆合铜箔：将厚度为0.018-0.1mm的铜箔层叠在喷涂有导热胶的铝板上，先将经过排版的复合铝板转入压机加温、加压，抽真空压合，使铝板、导热胶、铜箔结合一起，再将热压好的复合铝板转入冷压机冷却，剪切成型，得铝基覆铜板；
(5)开料、钻定位孔、前处理，将铝基覆铜板经过烘道预算加热，烘道温度参数为160-180℃，传动速度在3.5-4m/分钟；
(6)线路图成型：包括双面感光油墨涂布、曝光、显影，首先是液态感光涂布双面同时完成，所述铝基覆铜板分为铜箔面以及铝板面，铜箔面为上温区，其温度控制在80-110℃，铝板面为下温区，其温度控制在70-90℃，铜箔面的曝光能量为450-550mj，铝板面曝光能量为550-650mj；双面显影，采用浓度为0.8-1.2％的碳酸钠溶液，且显影机的速度为3.2m-4m/分钟，压力18-24N；
(7)蚀刻去膜：将铝板面与铜箔面印刷成型固化后，进行蚀刻、去膜，去膜后再进行表面清洗、干燥，表面清洗水压控制在0.24-0.36Mp，冲洗时间达到20秒以上；
(8)打靶工艺定位孔、线路通断测试；
(9)阻焊白油的涂布；
(10)曝光，在铝板面先垫厚度为0.1-0.15mm的菲林墨片，再对线路阻焊进行曝光；
(11)显影，采用浓度为0.8-1.2％的碳酸钠溶液，显影机的速度为3.2m-4m/分钟，压力为18-24N，清洗的下喷压力为25-35N，热风刀压力为20-30N；
(12)字符印刷和固化；
(13)冲孔；
(14)v割；
(15)防氧化处理得铝基线路板。
当然，其中基板材料还可以采用厚度为0.072-0.2mm的铜板或厚度为0.2-1.5mm的不锈钢板、铁板、硅钢板等金属及合金板中的任意一种替换铝板。
电光源一体式LED金属基线路板的制造方法，基板材料为铝板，包括铝基覆铜板的制作以及铝基线路板的制作，其包括以下步骤：
(1)铝板表面处理：选用厚度为0.2-1.5mm的铝基底板经处理后水洗烘干，制备得所需铝板；铝板表面处理的具体方法为：a、将该铝基底板浸泡在10％-12％，温度为56-60°的碱蚀槽中，处理3.5-4.5分钟，b、经碱蚀后的铝基底板再经水洗后泡在硝酸含量为10％-12％的中和槽处理2-3分钟，进一步除去铝基底板表面残留物，c、将处理后的铝基底板水洗烘干；
(2)配制导热胶；
(3)喷涂导热胶：采用喷刀喷帘涂布技术直接将导热胶涂布在铝板上，经喷涂后的铝板放隧道炉中烘烤，并使导热胶处于半固化状态，胶化时间控制在50-70秒；其中导热胶的厚度在300μm以上，按导热胶的厚度调整喷涂的次数，每次喷帘涂布的厚度为50μm-150μm之间，经过喷涂后的铝板放入隧道炉中，并在140℃-150℃的条件下烘烤4-6分钟。步骤(3)后再加覆一层半固化片，再进行步骤(4)的操作，半固化片采用玻璃布，导热系数在1W/mk以上；
(4)覆合铜箔：将厚度为0.018-0.1mm的铜箔层叠在喷涂导热胶后的铝板上，先将经过排版的复合铝板转入压机加温、加压，抽真空压合，使铝板、导热胶、铜箔结合一起，再将热压好的复合铝板转入冷压机冷却；
(5)开料、钻定位孔、前处理，将铝基覆铜板经过烘道预算加热，烘道温度参数为160-180℃，传动速度在3.5-4m/分钟；
(6)线路图成型：所述铝基覆铜板分为铜箔面以及铝板面，首先铝板面印刷，然后铜箔面线路图形印刷，印刷的油墨材料均采用光固型，铝板面光固能量控制在900-1000mj；铜箔面光固能量控制在650-800mj；
(7)蚀刻去膜：将铝板面与铜箔面印刷成型固化后，进行蚀刻、去膜，去膜后再进行表面清洗、干燥，表面清洗水压控制在0.24-0.36Mp，冲洗时间达到20秒以上；
(8)打靶工艺定位孔、线路通断测试；
(9)阻焊白油的涂布；
(10)曝光，在铝板面先垫厚度为0.1-0.15mm的菲林墨片，再对线路阻焊进行曝光；
(11)显影，采用浓度为0.8-1.2％的碳酸钠溶液，显影机的速度为3.2m-4m/分钟，压力为18-24N，清洗的下喷压力为25-35N，热风刀压力为20-30N；
(12)字符印刷和固化；
(13)冲孔；
(14)v割；
(15)防氧化处理得铝基线路板。
当然，其中基板材料还可以采用厚度为0.072-0.2mm的铜板或厚度为0.2-1.5mm的不锈钢板、铁板、硅钢板等金属及合金板中的任意一种替换铝板。
电光源一体式LED金属基线路板的制造方法，包括金属基覆铜板的制造以及金属基线路板的制造，包括以下步骤：
(1)金属板表面处理：将金属板作为基板材料，对其进行表面除油、粗化、清洗、烘干，制得金属基底板；所述基板材料采用厚度为0.072-0.2mm的铜板、0.2-1.5mm的铝板、不锈钢板、铁板、硅钢板等金属及合金板中的任意一种。
(2)叠覆导热绝缘胶片：在金属基底板上叠覆PP胶；所述的导热绝缘胶片为玻璃布和导热胶组成的导热PP，或者为以玻璃布和环氧树脂组成的普通PP，或者由导热胶组成的导热胶膜；
(3)覆合铜箔：将厚度为0.018-0.1mm的铜箔层叠在叠覆导热绝缘胶片后的金属基底板上，并经层压，使金属基底板、导热绝缘胶片、铜箔结合一起，制成金属基覆铜板；
(4)开料、钻定位孔、前处理：所述金属基覆铜板包括基板面和铜箔面，将金属基覆铜板按设计要求进行开料、钻定位孔后，再进行铜箔面和基板面的前 处理；
(5)线路图成型：采用印刷工艺或者曝光工艺，所述印刷工艺以UV油墨印刷，先进行基板面印刷、UV固化，形成基板面图形，再进行铜箔面印刷、UV固化，形成板面线路图形；所述曝光工艺是对基板面和铜箔面用感光油墨涂布、烘烤干燥后，进行曝光及显影，来实现线路面和基板面的图形成形；
(6)蚀刻去膜：将铜箔面中的铜箔和基板面中的基板金属以酸性或碱性蚀刻；以碱性去除油墨，形成线路；对线路面和基板面进行表面清洗、干燥；
(7)阻焊白油的涂布：线路铜箔面经表面处理后，按阻焊图形以白色感光油墨进行涂布或印刷，然后以80-110℃的温度进行烘烤干燥；
(8)曝光、显影：将阻焊图形与铜箔线路对位后进行曝光；以碳酸钠溶液进行显影，并进行板面清洗烘干；
(9)字符标记印刷和固化；
(10)冲孔：阻焊白油面朝下，用冲床一次完成孔径和外形的冲切；
(11)v割；
(12)防氧化处理：最终制成金属基线路板。
发明的有益效果
有益效果
本发明采取了上述改进措施进行，其有益效果显著：本发明可大批量生产集电、光源于一体的金属基线路板，改变了线路板的传统形式，为线路板植入新的功能。且该发明无加工时的落灰，产品具有铜箔附着力强、散热性好、导热性强、耐压性高等特点，可以改变当前LED筒灯、射灯、平板灯等室内外LED照明灯具的装配结构，有节能降耗、节材增效特点。
对附图的简要说明
附图说明
图1为本发明实施例1的生产工艺框图；
图2为本发明实施例2的生产工艺框图；
图3为本发明实施例3的生产工艺框图；
图4为本发明实施例4的生产工艺框图。
实施该发明的最佳实施例
本发明的最佳实施方式
下面对照附图结合实施例对本发明作进一步的说明：
实施例1
参照图1所示，电光源一体式LED金属基线路板的制造方法，基板材料为铝板，包括铝基覆铜板的制作以及铝基线路板的制作，其包括以下步骤：
(1)铝板表面处理：选用厚度为0.2-1.5mm的铝基底板经处理后水洗烘干，制备得所需铝板；铝板表面处理的具体方法为：a、将该铝基底板浸泡在10％-12％，温度为56-60°的碱蚀槽中，处理3.5-4.5分钟，b、经碱蚀后的铝基底板再经水洗后泡在硝酸含量为10％-12％的中和槽处理2-3分钟，进一步除去铝基底板表面残留物，c、将处理后的铝基底板水洗烘干。
(2)配制导热胶。
(3)喷涂导热胶：采用喷刀喷帘涂布技术直接将导热胶涂布在铝板上，经喷涂后的铝板放隧道炉中烘烤，并使导热胶处于半固化状态，胶化时间控制在50-70秒；其中导热胶的厚度在300μm以上，按导热胶的厚度调整喷涂的次数，每次喷帘涂布的厚度为50μm-150μm之间，经过喷涂后的铝板放入隧道炉中，并在140℃-150℃的条件下烘烤4-6分钟，在喷涂导热胶后加覆一层半固化片，半固化片采用玻璃布，导热系数在1w/mk以上。
(4)覆合铜箔：将厚度为0.018-0.1mm的铜箔层叠在涂好的导热胶膜的铝板上，先将排版好的复合铝板转入压机加温、加压，抽真空压合，使铝板、导热胶膜、铜箔结合一起，得到铝基覆铜板。
(5)开料、钻定位孔、前处理，将铝基覆铜板经过烘道预加热，烘道温度参数为160-180℃，传动速度在3.5-4m/分钟。
(6)线路图成型：包括双面感光油墨涂布、曝光、显影，首先是液态感光涂布双面同时完成，铜箔面(覆合有铜箔的那一面)为上温区，其温度控制在80-110℃，铝板面(未覆合铜箔的那一面)为下温区，其温度控制在70-90℃，铜箔面的曝光能量为450-550mj，铝板面曝光能量为550-650mj；双面显影，采用浓度为0.8-1.2％的碳酸钠溶液，且显影机的速度为3.2m-4m/分钟，压力18-24N。
(7)蚀刻去膜：先检验双面图形开短路的不良，铝板面的油墨保护完整理性，铝板面与铜箔面图形成型后，放入酸性蚀刻液中进行蚀刻、去膜，去膜后再进行表面清洗、干燥处理，清洗水压控制在24-36N，清洗时间达到20秒以上。
(8)打靶工艺定位孔、线路通断测试。
(9)阻焊白油的涂布：涂布和印刷都要洁净处理，化学溶液稀硫酸浓度控制在3-5％，能保证铜箔面和铝板面的效果，铜箔面的抛刷纤维刷及目数，磨痕宽度在工艺和单面板一样，不再描述。白油涂布后烘干后等待曝光。
(10)曝光：因介质层薄，又是半透明，所以必须在铝板面这面垫一张0.1-0.15mm厚的菲林墨片，防止上下框同曝时的现象，曝光时具有对曝光灯散射作用而影响显影效果。
(11)显影：采用浓度为0.8-1.2％的碳酸钠溶液，显影机的速度为3.2m-4m/分钟，压力为18-24N，清洗的下喷压力为25-35N，热风刀压力为20-30N。
(12)字符印刷和固化：字符印刷所需的要求不同，有些是元件标识，有些是商标型号。因铝板面有些不平，无法通过印刷来完成下凹部分的字符印刷，所以将商标等标识设计在铝面上，而其他所有的元件符号设计在白油面为好。印刷好字符的工作板将在温度150℃时间45分钟的条件下进行热固化。
(13)冲孔：1、白油面朝下，用冲床一次完成孔径和外形的冲切。2、少量或样品，采用数控钻孔，对电源驱动板部分的元件孔进行钻孔，钻速要进行调整，以3-4万钻为宜。
(14)v割。
(15)防氧化处理得铝基线路板：采用浓度为5-6％的双氧水，硫酸浓度为4-5％，降低对铝板的微蚀损伤。在防氧化后清洗的下喷压力要提高到25-35N，热风刀压力要达到20-30N，使水分能够吹散完全烘干，温度控制在65-80度之间。
其中基板材料可采用厚度为0.072-0.2mm的铜板或厚度为0.2-1.5mm的不锈钢板、铁板、硅钢板等金属及合金板中的任意一种替换厚度为0.2-1.5mm的铝板。
发明实施例
本发明的实施方式
实施例2
电光源一体式LED金属基线路板的制造方法，基板材料为铝板，包括铝基覆铜板的制作以及铝基线路板的制作，其包括以下步骤：
(1)铝板表面处理：选用厚度为0.2-1.5mm的铝基底板经处理后水洗烘干，制备得所需的铝板。铝板表面处理的具体方法为：a、将该铝基底板浸泡在10％-12％，温度为56-60°的碱蚀槽中，处理3.5-4.5分钟，b、经碱蚀后的铝基底板再经水洗后泡在硝酸含量为10％-12％的中和槽处理2-3分钟，进一步除去铝基底板表面残留物，c、将处理后的铝基底板水洗烘干。
(2)配制导热胶。
(3)喷涂导热胶：采用喷刀喷帘涂布技术直接将导热胶涂布在铝板上，按导热胶的厚度调整喷涂的次数，每次喷涂厚度为50μm-150μm之间，可通过调整喷涂传送速度和胶水泵电机变频得到要求的厚度，喷涂好的铝板放隧道炉在140℃-150℃的条件下，烘烤4-6分钟，并使导热胶处半固化状态的胶化时间控制在50-70秒；
可在喷涂导热胶后加覆一层半固化片，再覆合铜箔，半固化片采用玻璃布，导热系数在1W/mk以上。
(4)覆合铜箔：将厚度为0.018-0.1mm的铜箔层叠在涂好的导热胶膜的铝板上，先将排版好的复合铝板转入压机加温、加压，抽真空压合，使铝板、导热胶膜、铜箔结合一起，得铝基覆铜板。
(5)开料、钻定位孔、前处理：将铝基覆铜板经过烘道预加热，烘道温度参数为160-180℃，传动速度在3.5-4m/分钟。
(6)线路图成型：首先铝板面(未覆合铜箔的那一面)印刷，然后铜箔面(铝基覆铜板覆合有铜箔的那一面)线路图形印刷，印刷的油墨材料均采用光固型，铝板面光固能量控制在900-1000mj，其中铝板面印刷的刮刀压力是25-35N；铜箔面光固能量控制在650-800mj，其中铜面印刷的刮刀压力是18-25N。
(7)蚀刻去膜：将铝板面与铜箔面印刷成型固化后，放入酸性药液中进行蚀刻、去膜，去膜后再进行表面清洗、干燥，表面清洗水压控制在0.24-0.36Mp，冲洗时间达到20秒以上。
(8)打靶工艺定位孔、线路通断测试。
(9)阻焊白油的涂布：涂布和印刷都要洁净处理，化学溶液稀硫酸浓度控制在3-5％，能保证铜箔面和铝板面的效果，铜箔面的抛刷纤维刷及目数，磨痕宽度在工艺和单面板一样，不再描述。白油涂布后烘干后等待曝光。
(10)曝光：因介质层薄，又是半透明，所以必须在铝板面这面垫一张0.1-0.15mm厚的菲林墨片，防止上下框同曝时的现象，曝光时具有对曝光灯散射作用而影响显影效果。
(11)显影：采用浓度为0.8-1.2％的碳酸钠溶液，显影机的速度为3.2m-4m/分钟，压力为18-24N，清洗的下喷压力为25-35N，热风刀压力为20-30N。
(12)字符印刷和固化：字符印刷所需的要求不同，有些是元件标识，有些是商标型号。因铝板面有些不平，无法通过印刷来完成镂空处字符，所以将商标设计在铝面上，而其他所有的元件符号设计在白油面为好。印刷好字符的工作板将在温度150℃时间45分钟的条件下热固化。
(13)冲孔：1、数控钻孔主要是钻驱动板的元铂孔径，钻速要进行调整，参数是3-4万钻为宜；2、用冲床一次完成孔径和外形，白油面朝下就可以完成。
(14)v割。
(15)防氧化处理得铝基线路板：采用浓度为5-6％的双氧水，硫酸浓度为4-5％，降低对铝板的微蚀损伤。在防氧化后清洗的下喷压力要提高到25-35N，热风刀压力要达到20-30N，使水分能够吹散完全烘干，温度控制在65-80度之间。
其中基板材料可采用厚度为0.072-0.2mm的铜板或厚度为0.2-1.5mm的不锈钢板、铁板、硅钢板等金属及合金板中的任意一种替换厚度为0.2-1.5mm的铝板。
实施例3
电光源一体式LED金属基线路板的制造方法，包括金属基覆铜板的制造以及基于金属基覆铜板制造金属基线路板，步骤包括：
(1)金属板表面处理：选用厚度为0.2-1.5mm的不锈钢板，对其进行表面除油、粗化、清洗、烘干，制得铁基底板。
(2)叠覆导热绝缘胶片：是将导热绝缘胶片叠覆到铁基底板上，导热绝缘胶片可以为玻璃布和导热胶组成的导热PP，或者为以玻璃布和环氧树脂组成的普通PP，或者由导热胶组成的导热胶膜。
(3)覆合铜箔：将厚度为0.018-0.1mm的铜箔层叠在叠覆导热绝缘胶片后的铁基底板上，将排版好的板由压机进行热压、冷压，使铁基底板、导热绝缘胶片、铜箔结合一起，制成铁基覆铜板。
(4)开料、钻定位孔、前处理，所述铁基覆铜板包括基板面和铜箔面，覆合铜箔的那一面称为铜箔面，则另一面为基板面，将铁基覆铜板按设计要求进行开料、钻定位孔后，再进行铜箔面和基板面的前处理。
(5)线路图成型：采用曝光工艺，基板面和铜箔面同时用感光油墨涂布、烘烤干燥后，进行曝光及显影，形成线路面和基板面的图形。其中铜箔面的曝光能量为500mj，基板面曝光能量为600mj，并采用浓度为0.8-1.2％的碳酸钠溶液进行双面显影。
(6)蚀刻去膜：线路图成型后，将基板面和铜箔面以酸性或碱性进行蚀刻；以碱液去除油墨；去墨后再对线路面和基板面进行表面清洗、干燥处理。
(7)阻焊白油的涂布，线路铜箔面经表面处理后，按阻焊图形以白色感光油墨进行涂布，以80-110℃的温度烘烤干燥。
(8)曝光、显影：将阻焊图形与铜箔线路对位后进行曝光；采用浓度为1.2％的碳酸钠溶液，并以传动速度3.8m/分钟、喷头压力22.5N进行显影操作进行显影，显影完成后予以板面清洗干燥。
(9)字符标记印刷和固化：因电源驱动部分基板面凹陷，采用模印法凸版印刷。
(10)冲孔。
(11)v割。
(12)防氧化处理，最终制成铁基线路板。
当然在实施例3中基板材料还可以为0.2-1.5mm的铝板、硅钢板等金属及金属合金中的任意一种替换不锈钢板。
实施例4
电光源一体式LED金属基线路板的制造方法，包括金属基覆铜板的制造以及基于金属基覆铜板制造金属基线路板，步骤包括：
(1)金属板表面处理：选用厚度为0.072mm的铜板，对其进行表面除油、粗 化、清洗、烘干，制得铜基底板。
(2)叠覆导热绝缘胶片：是将导热绝缘胶片叠覆到铜基底板上，导热绝缘胶片可以为玻璃布和导热胶组成的导热PP，或者为以玻璃布和环氧树脂组成的普通PP，或者由导热胶组成的导热胶膜。
(3)覆合铜箔：将厚度为0.018-0.1mm的铜箔层叠在叠覆导热绝缘胶片后的铜基底板上，将排版好的板由压机进行热压、冷压，使铜基底板、导热绝缘胶片、铜箔结合一起，制成铜基覆铜板。
(4)开料、钻定位孔、前处理，所述铜基覆铜板包括基板面和铜箔面，覆合铜箔的那一面称为铜箔面，则另一面为基板面，将铜基覆铜板按设计要求进行开料、钻定位孔后，再进行铜箔面和基板面的前处理。
(5)线路图成型：首先铝板面印刷，然后铜箔面线路图形印刷，印刷的油墨材料均采用光固型，铝板面光固能量控制在950mj；铜箔面光固能量控制在700mj。
(6)蚀刻去膜：线路图成型后，将基板面和铜箔面以酸性或碱性进行蚀刻；以碱液去除油墨；去墨后再对线路面和基板面进行表面清洗、干燥处理。
(7)阻焊白油的涂布，线路铜箔面经表面处理后，按阻焊图形以白色感光油墨进行涂布，以80-110℃的温度烘烤干燥。
(8)曝光、显影：将阻焊图形与铜箔线路对位后进行曝光；采用浓度为1.0％的碳酸钠溶液，并以传动速度3.5m/分钟、喷头压力20N进行显影操作进行显影，显影完成后予以板面清洗干燥。
(9)字符标记印刷和固化：因电源驱动部分基板面凹陷，采用模印法凸版印刷。
(10)冲孔。
(11)v割。
(12)防氧化处理，最终制成铜基线路板。
当然在实施例4中基板材料还可以为0.2-1.5mm的铝板、铁板、硅钢板、不锈钢板等金属及金属合金中的任意一种替换铜板。
以上列举的仅为本发明的具体实施例，显然，本发明不限于以上实施例，本领 域的普通技术人员能从本发明公开的内容直接导出或联想到的所有变形，均应属于本发明的保护范围。。

Claims (12)

  1. 电光源一体式LED金属基线路板的制造方法，其特征在于，基板材料为铝板，包括铝基覆铜板的制作以及铝基线路板的制作，其包括以下步骤：
    (1)铝板表面处理：选用厚度为0.2-1.5mm的铝基底板经处理后水洗烘干，得到所需铝板备用；
    (2)配制导热胶；
    (3)喷涂导热胶：采用喷刀喷帘涂布直接将导热胶涂布在铝板上，经喷涂后的铝板放隧道炉中烘烤，并使导热胶处于半固化状态，胶化时间控制在50-70秒；
    (4)覆合铜箔：将厚度为0.018-0.1mm的铜箔层叠在喷涂有导热胶的铝板上，并经层压、剪切成型，得铝基覆铜板；
    (5)开料、钻定位孔、前处理；
    (6)线路图成型：包括双面感光油墨涂布、曝光、显影，首先是液态感光涂布双面同时完成，所述铝基覆铜板分为铜箔面以及铝板面，铜箔面为上温区，其温度控制在80-110℃，铝板面为下温区，其温度控制在70-90℃，铜箔面的曝光能量为450-550mj，铝板面曝光能量为550-650mj；双面显影，采用浓度为0.8-1.2％的碳酸钠溶液，且显影机的速度为3.2m-4m/分钟，压力18-24N；
    (7)蚀刻去膜：将铝板面与铜箔面印刷成型固化后，进行蚀刻、去膜，去膜后再进行表面清洗、干燥，表面清洗水压控制在0.24-0.36Mp，冲洗时间达到20秒以上；
    (8)打靶工艺定位孔、线路通断测试；
    (9)阻焊白油的涂布；
    (10)曝光；
    (11)显影；
    (12)字符印刷和固化；
    (13)冲孔；
    (14)v割；
    (15)防氧化处理得铝基线路板。
  2. 电光源一体式LED金属基线路板的制造方法，其特征在于，基板材料为铝板，包括铝基覆铜板的制作以及铝基线路板的制作，其包括以下步骤：
    (1)铝板表面处理：选用厚度为0.2-1.5mm的铝基底板经处理后水洗烘干，得到所需铝板备用；
    (2)配制导热胶；
    (3)喷涂导热胶：采用喷刀喷帘涂布直接将导热胶涂布在铝板上，经喷涂后的铝板放隧道炉中烘烤，并使导热胶处半固化状态的胶化时间控制在50-70秒；
    (4)覆合铜箔：将厚度为0.018-0.1mm的铜箔层叠在喷涂导热胶后的铝板上，并经层压、剪切成型，得铝基覆铜板；
    (5)开料、钻定位孔、前处理；
    (6)线路图成型：所述铝基覆铜板分为铜箔面以及铝板面，首先铝板面印刷，然后铜箔面线路图形印刷，印刷的油墨材料均采用光固型，铝板面光固能量控制在900-1000mj；铜箔面光固能量控制在650-800mj；
    (7)蚀刻去膜：将铝板面与铜箔面印刷成型固化后，进行蚀刻、去膜，去膜后再进行表面清洗、干燥，表面清洗水压控制在0.24-0.36Mp，冲洗时间达到20秒以上；
    (8)打靶工艺定位孔、线路通断测试；
    (9)阻焊白油的涂布；
    (10)曝光；
    (11)显影；
    (12)字符印刷和固化；
    (13)冲孔；
    (14)v割；
    (15)防氧化处理得铝基线路板。
  3. 根据权利要求1或2所述的电光源一体式LED金属基线路板的制造方法，其特征在于，所述步骤(1)铝板表面处理的具体方法为：a、将该铝基底板浸泡在10％-12％，温度为56-60°的碱蚀槽中，处理3.5-4.5分钟，b、经碱蚀后的铝基底板再经水洗后泡在硝酸含量为10％-12％的中和槽处理2-3分钟，进一步除去铝基底板表面残留物，c、将处理后的铝基底板水洗烘干。
  4. 根据权利要求1或2所述的电光源一体式LED金属基线路板的制造方法，其特征在于，步骤(3)中的导热胶的厚度在300μm以上，按导热胶的厚度调整喷涂的次数，每次喷涂厚度为50um-150um之间，经过喷涂后的铝板放入隧道炉中，并在140℃-150℃的条件下烘烤4-6分钟，步骤(3)后再加覆一层半固化片，再进行步骤(4)的操作，半固化片采用玻璃布，导热系数在1W/mk以上。
  5. 根据权利要求1或2所述的电光源一体式LED金属基线路板的制造方法，其特征在于，步骤(4)中，先将经过排版的复合铝板转入压机加温、加压，抽真空压合，使铝板、导热胶、铜箔结合一起，再将热压好的复合铝板转入冷压机冷却。
  6. 根据权利要求1或2所述的电光源一体式LED金属基线路板的制造方法，其特征在于，所述步骤(5)中，将铝基覆铜板经过烘道预算加热，烘道温度参数为160-180℃，传动速度在3.5-4m/分钟。
  7. 根据权利要求1或2所述的电光源一体式LED金属基线路板的制造方法，其特征在于，步骤(10)中，在铝板面先垫厚度为0.1-0.15mm的菲林墨片，再对线路阻焊进行曝光。
  8. 根据权利要求1或2所述的电光源一体式LED金属基线路板的制造方法，其特征在于，步骤(11)显影，采用浓度为0.8-1.2％的碳酸钠溶液，显影机的速度为3.2m-4m/分钟，压力为18-24N，清洗的下喷压力为25-35N，热风刀压力为20-30N。
  9. 根据权利要求1或2所述的电光源一体式LED金属基线路板的制造 方法，其特征在于，所述基板材料采用厚度为0.072-0.2mm的铜板以及厚度为0.2-1.5mm的不锈钢板、铁板和硅钢板中的任意一种替换铝板。
  10. 电光源一体式LED金属基线路板的制造方法，其特征在于，包括金属基覆铜板的制造以及金属基线路板的制造，包括以下步骤：
    (1)金属板表面处理：将金属板作为基板材料，对其进行表面除油、粗化、清洗、烘干，制得金属基底板；
    (2)叠覆导热绝缘胶片：在金属基底板上叠覆PP胶；
    (3)覆合铜箔：将厚度为0.018mm-0.1mm的铜箔层叠在叠覆导热绝缘胶片后的金属基底板上，并经层压，使金属基底板、导热绝缘胶片、铜箔结合一起，制成金属基覆铜板；
    (4)开料、钻定位孔、前处理：所述金属基覆铜板包括基板面和铜箔面，将金属基覆铜板按设计要求进行开料、钻定位孔后，再进行铜箔面和基板面的前处理；
    (5)线路图成型：采用印刷工艺或者曝光工艺，所述印刷工艺以UV油墨印刷，先进行基板面印刷、UV固化，形成基板面图形，再进行铜箔面印刷、UV固化，形成板面线路图形；所述曝光工艺是对基板面和铜箔面用感光油墨涂布、烘烤干燥后，进行曝光及显影，来实现线路面和基板面的图形成形；
    (6)蚀刻去膜：将铜箔面中的铜箔和基板面中的基板金属以酸性或碱性蚀刻；以碱性去除油墨，形成线路；对线路面和基板面进行表面清洗、干燥；
    (7)阻焊白油的涂布：线路铜箔面经表面处理后，按阻焊图形以白色感光油墨进行涂布或印刷，然后以80-110℃的温度进行烘烤干燥；
    (8)曝光、显影：将阻焊图形与铜箔线路对位后进行曝光；以碳酸钠溶液进行显影，并进行板面清洗烘干；
    (9)字符标记印刷和固化；
    (10)冲孔：阻焊白油面朝下，用冲床一次完成孔径和外形的冲切；
    (11)v割；
    (12)防氧化处理：最终制成金属基线路板。
  11. 根据权利要求10所述的电光源一体式LED金属基线路板的制造方法，其特征在于，所述的导热绝缘胶片为玻璃布和导热胶组成的导热PP，或者为以玻璃布和环氧树脂组成的普通PP，或者由导热胶组成的导热胶膜。
  12. 根据权利要求10所述的电光源一体式LED金属基线路板的制造方法，其特征在于，所述基板材料采用厚度为0.072-0.2mm的铜板、0.2-1.5mm的铝板、0.2-1.5mm的不锈钢板、铁板和硅钢板中的任意一种。
PCT/CN2017/073584 2016-05-10 2017-02-15 电光源一体式led金属基线路板的制造方法 WO2017193660A1 (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201610303355.7 2016-05-10
CN201610303262.4 2016-05-10
CN201610303262.4A CN105813391B (zh) 2016-05-10 2016-05-10 一种led铝基线路板的制作方法
CN201610303355.7A CN105813389B (zh) 2016-05-10 2016-05-10 一种电光源一体式led铝基线路板的生产工艺
CN201610494529.2 2016-06-30
CN201610494529.2A CN106132098B (zh) 2016-06-30 2016-06-30 一种led金属基线路板的制造方法

Publications (1)

Publication Number Publication Date
WO2017193660A1 true WO2017193660A1 (zh) 2017-11-16

Family

ID=60267927

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/073584 WO2017193660A1 (zh) 2016-05-10 2017-02-15 电光源一体式led金属基线路板的制造方法

Country Status (1)

Country Link
WO (1) WO2017193660A1 (zh)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108501475A (zh) * 2018-05-31 2018-09-07 郭凯华 高耐热高导热高耐电压可挠性铝基覆铜板制作方法
CN109673109A (zh) * 2019-01-18 2019-04-23 胜宏科技（惠州）股份有限公司 一种led线路板制作方法
CN110740576A (zh) * 2019-09-18 2020-01-31 惠州市亚科芯基电子科技有限公司 一种基于电镀填孔工艺的新型bt板制作方法
CN111520624A (zh) * 2020-03-17 2020-08-11 亚鹰建筑科技集团有限公司 一种多色发光玻璃的成型工艺
CN112437552A (zh) * 2019-08-24 2021-03-02 王定锋 一种阻焊是油墨阻焊的双层导线电路板及其制作方法
CN112469197A (zh) * 2019-09-07 2021-03-09 王定锋 一种连体铝条线路板及制作方法
CN112672512A (zh) * 2020-12-16 2021-04-16 广州添利电子科技有限公司 一种三合一绿油塞孔工艺
CN112788854A (zh) * 2021-01-15 2021-05-11 新余市木林森线路板有限公司 一种导热铝基板线路生产用热压工艺
CN113066759A (zh) * 2021-03-02 2021-07-02 Tcl华星光电技术有限公司 驱动走线的制作方法、显示面板及显示面板的制作方法
CN113891574A (zh) * 2021-11-17 2022-01-04 深圳市星之光精密电路有限公司 一种新能源智能汽车印制电路板的制造方法
CN113905535A (zh) * 2021-10-07 2022-01-07 江西驰硕科技股份有限公司 一种间隔丝印方式做连续长板工艺
CN114211893A (zh) * 2021-12-14 2022-03-22 广东合通建业科技股份有限公司 用于提升Mini-LED灯板反射率的制备工艺
CN114578029A (zh) * 2022-03-02 2022-06-03 江苏可信电子材料有限公司 一种pcb阻焊油墨性能测试方法
CN114710883A (zh) * 2022-03-29 2022-07-05 江西景旺精密电路有限公司 一种小尺寸led电路板加工方法以及电路板
CN114828412A (zh) * 2022-02-28 2022-07-29 诚亿电子（嘉兴）有限公司 一种铁基pcb板的制作方法
CN115157018A (zh) * 2022-07-28 2022-10-11 九江德福科技股份有限公司 一种锂电铜箔解决箔面纹理不良的方法
CN116581033A (zh) * 2023-07-13 2023-08-11 四川英创力电子科技股份有限公司 一种Micro-LED MIP灯珠载板制作方法
CN116867165A (zh) * 2023-08-22 2023-10-10 江西兆信精密电子有限公司 一种mini LED键盘模组钢片基材背光电路板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101068452A (zh) * 2007-05-15 2007-11-07 杭州裕兴层压板材有限公司 一种铝基覆铜箔层压板以及制造工艺
CN102186306A (zh) * 2011-04-29 2011-09-14 惠州中京电子科技股份有限公司 一种金属基线路板及其制造方法
CN102802348A (zh) * 2012-07-17 2012-11-28 昆山生隆科技发展有限公司 一种led用耐高压铝基印制电路板及其制造方法
CN105813389A (zh) * 2016-05-10 2016-07-27 浙江罗奇泰克电子有限公司 一种电光源一体式led铝基线路板的生产工艺
CN105813391A (zh) * 2016-05-10 2016-07-27 浙江罗奇泰克电子有限公司 一种led铝基线路板的制作方法
CN106132098A (zh) * 2016-06-30 2016-11-16 浙江罗奇泰克电子有限公司 一种led金属基线路板的制造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101068452A (zh) * 2007-05-15 2007-11-07 杭州裕兴层压板材有限公司 一种铝基覆铜箔层压板以及制造工艺
CN102186306A (zh) * 2011-04-29 2011-09-14 惠州中京电子科技股份有限公司 一种金属基线路板及其制造方法
CN102802348A (zh) * 2012-07-17 2012-11-28 昆山生隆科技发展有限公司 一种led用耐高压铝基印制电路板及其制造方法
CN105813389A (zh) * 2016-05-10 2016-07-27 浙江罗奇泰克电子有限公司 一种电光源一体式led铝基线路板的生产工艺
CN105813391A (zh) * 2016-05-10 2016-07-27 浙江罗奇泰克电子有限公司 一种led铝基线路板的制作方法
CN106132098A (zh) * 2016-06-30 2016-11-16 浙江罗奇泰克电子有限公司 一种led金属基线路板的制造方法

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108501475A (zh) * 2018-05-31 2018-09-07 郭凯华 高耐热高导热高耐电压可挠性铝基覆铜板制作方法
CN109673109A (zh) * 2019-01-18 2019-04-23 胜宏科技（惠州）股份有限公司 一种led线路板制作方法
CN109673109B (zh) * 2019-01-18 2024-03-19 胜宏科技（惠州）股份有限公司 一种led线路板制作方法
CN112437552A (zh) * 2019-08-24 2021-03-02 王定锋 一种阻焊是油墨阻焊的双层导线电路板及其制作方法
CN112469197A (zh) * 2019-09-07 2021-03-09 王定锋 一种连体铝条线路板及制作方法
CN110740576A (zh) * 2019-09-18 2020-01-31 惠州市亚科芯基电子科技有限公司 一种基于电镀填孔工艺的新型bt板制作方法
CN111520624A (zh) * 2020-03-17 2020-08-11 亚鹰建筑科技集团有限公司 一种多色发光玻璃的成型工艺
CN112672512A (zh) * 2020-12-16 2021-04-16 广州添利电子科技有限公司 一种三合一绿油塞孔工艺
CN112788854B (zh) * 2021-01-15 2022-04-19 新余市木林森线路板有限公司 一种导热铝基板线路生产用热压工艺
CN112788854A (zh) * 2021-01-15 2021-05-11 新余市木林森线路板有限公司 一种导热铝基板线路生产用热压工艺
CN113066759A (zh) * 2021-03-02 2021-07-02 Tcl华星光电技术有限公司 驱动走线的制作方法、显示面板及显示面板的制作方法
CN113905535A (zh) * 2021-10-07 2022-01-07 江西驰硕科技股份有限公司 一种间隔丝印方式做连续长板工艺
CN113905535B (zh) * 2021-10-07 2023-07-04 江西驰硕科技股份有限公司 一种间隔丝印方式做连续长板工艺
CN113891574A (zh) * 2021-11-17 2022-01-04 深圳市星之光精密电路有限公司 一种新能源智能汽车印制电路板的制造方法
CN114211893B (zh) * 2021-12-14 2022-12-06 广东合通建业科技股份有限公司 用于提升Mini-LED灯板反射率的制备工艺
CN114211893A (zh) * 2021-12-14 2022-03-22 广东合通建业科技股份有限公司 用于提升Mini-LED灯板反射率的制备工艺
CN114828412A (zh) * 2022-02-28 2022-07-29 诚亿电子（嘉兴）有限公司 一种铁基pcb板的制作方法
CN114578029A (zh) * 2022-03-02 2022-06-03 江苏可信电子材料有限公司 一种pcb阻焊油墨性能测试方法
CN114710883B (zh) * 2022-03-29 2024-02-06 江西景旺精密电路有限公司 一种小尺寸led电路板加工方法以及电路板
CN114710883A (zh) * 2022-03-29 2022-07-05 江西景旺精密电路有限公司 一种小尺寸led电路板加工方法以及电路板
CN115157018A (zh) * 2022-07-28 2022-10-11 九江德福科技股份有限公司 一种锂电铜箔解决箔面纹理不良的方法
CN115157018B (zh) * 2022-07-28 2023-12-12 九江德福科技股份有限公司 一种锂电铜箔解决箔面纹理不良的方法
CN116581033A (zh) * 2023-07-13 2023-08-11 四川英创力电子科技股份有限公司 一种Micro-LED MIP灯珠载板制作方法
CN116581033B (zh) * 2023-07-13 2023-10-13 四川英创力电子科技股份有限公司 一种Micro-LED MIP灯珠载板制作方法
CN116867165A (zh) * 2023-08-22 2023-10-10 江西兆信精密电子有限公司 一种mini LED键盘模组钢片基材背光电路板
CN116867165B (zh) * 2023-08-22 2024-04-12 江西兆信精密电子有限公司 一种mini LED键盘模组钢片基材背光电路板

Similar Documents

Publication Publication Date Title
WO2017193660A1 (zh) 电光源一体式led金属基线路板的制造方法
CN105813391B (zh) 一种led铝基线路板的制作方法
CN105813389A (zh) 一种电光源一体式led铝基线路板的生产工艺
CN106132098B (zh) 一种led金属基线路板的制造方法
CN103249253B (zh) 高精密铝基材电路板制造工艺及其系统
CN103929883B (zh) 一种单晶cob封装碗杯孔状铝基板的制作方法
WO2018107924A1 (zh) 一种柔性线路板及其制备方法、太阳能光伏组件
CN101699931B (zh) 高导热陶瓷电路板的生产方法
WO2020220681A1 (zh) 一种民用高速传输无人机电源印制电路板的制作方法
CN109068491B (zh) 一种铝基板加工工艺
CN111511120A (zh) 一种Raised Pad制作方法
CN101699932B (zh) 一种高导热陶瓷电路板的生产方法
CN105208794A (zh) 一种无铅喷锡的pcb软板制作方法
CN105142353A (zh) 一种印刷线路板选择性化金工艺
CN104768331A (zh) 一种pcb中线路开路的修补方法
CN101699935B (zh) 一种可定位高导热陶瓷电路板的生产方法
CN104105348A (zh) 一种铝基板加工工艺
CN107889369B (zh) 一种铜基板表面处理工艺
CN105388711B (zh) 一种阻焊网版的晒网工艺
CN109287078B (zh) 铁基材线路板的制造方法、铁基材线路板和光源组件
CN101699933B (zh) 一种铜面光亮高导热陶瓷电路板的生产方法
CN101699936B (zh) 一种铜面光亮且可定位高导热陶瓷电路板的生产方法
CN104320915B (zh) 一种手机模组挠性双面镂空印制板的制作方法
CN114727497A (zh) 一种电路板的印刷工艺
CN113966079A (zh) 一种led柔性电路板及其制备方法

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17795281

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17795281

Country of ref document: EP

Kind code of ref document: A1