WO2017170492A1 - インダクタ用接着剤及びインダクタ - Google Patents

インダクタ用接着剤及びインダクタ Download PDF

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Publication number
WO2017170492A1
WO2017170492A1 PCT/JP2017/012547 JP2017012547W WO2017170492A1 WO 2017170492 A1 WO2017170492 A1 WO 2017170492A1 JP 2017012547 W JP2017012547 W JP 2017012547W WO 2017170492 A1 WO2017170492 A1 WO 2017170492A1
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Prior art keywords
adhesive
inductor
less
weight
particles
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PCT/JP2017/012547
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English (en)
French (fr)
Japanese (ja)
Inventor
良平 増井
駿介 高橋
高橋　英之
Original Assignee
積水化学工業株式会社
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Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to JP2017518179A priority Critical patent/JP6232167B1/ja
Priority to KR1020187010191A priority patent/KR102195623B1/ko
Priority to CN201780004012.3A priority patent/CN108352243B/zh
Publication of WO2017170492A1 publication Critical patent/WO2017170492A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F37/00—Fixed inductances not covered by group H01F17/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to an inductor adhesive used for an inductor.
  • the present invention also relates to an inductor using the inductor adhesive.
  • Inductors are used in electronic devices such as mobile phones, televisions, and digital cameras.
  • a core material such as a ferrite core is disposed with a gap.
  • an adhesive that does not include particles or an adhesive that includes particles such as glass beads is used in the gap (adhesive portion).
  • Patent Document 1 discloses an adhesive containing non-magnetic particles (particles).
  • glass beads are used as the particles.
  • Patent Document 2 discloses an adhesive containing spacer particles having a CV value of 10% or less.
  • resin particles are used as the particles.
  • the adhesiveness may be lowered because the thickness of the bonded portion (gap portion interval) cannot be controlled with high accuracy. Furthermore, moisture resistance may be low in an adhesive part (gap part) formed using an adhesive.
  • cracks may occur in the ferrite core, or the inductance may decrease compared to the initial value, and the performance of the inductor may deteriorate.
  • An object of the present invention is to provide an inductor adhesive that can increase moisture resistance and can suppress a decrease in adhesiveness even when exposed to high humidity. Moreover, the objective of this invention is providing the inductor using the said adhesive agent for inductors.
  • an adhesive for an inductor used for an inductor which includes a thermosetting compound, a thermosetting agent, an inorganic filler, and spacer particles, and the spacer particles are resin particles or organic.
  • Inorganic hybrid particles wherein the spacer particles have an average particle size of 20 ⁇ m or more and 200 ⁇ m or less, the spacer particles have a CV value of 10% or less, and the inorganic filler in 100% by weight of the adhesive.
  • An inductor adhesive (hereinafter, “inductor adhesive” may be referred to as “adhesive”) is provided in which the content of is more than 30 wt% and 75 wt% or less.
  • the glass transition point of the obtained cured product when the adhesive is heated at 120 ° C. for 20 minutes and then heated at 170 ° C. for 15 minutes to obtain a cured product, the glass transition point of the obtained cured product.
  • the temperature is 120 ° C. or higher and 210 ° C. or lower.
  • the adhesive according to the present invention after placing 30 mg of the adhesive on the first slide glass, placing the second slide glass on the adhesive, 50 g on the second slide glass.
  • the number of the spacer particles is 2 / mm 2 or more and 1000 / mm 2 or less in plan view.
  • the content of the thermosetting agent is 0.01 parts by weight or more and 10 parts by weight or less with respect to 100 parts by weight of the thermosetting compound.
  • the viscosity of the adhesive at 25 ° C. is 10 Pa ⁇ s or more and 150 Pa ⁇ s or less.
  • the content of the spacer particles is 1 wt% or more and 15 wt% or less in 100 wt% of the adhesive.
  • a ratio of the content of the inorganic filler in 100% by weight of the adhesive to the content of the spacer particles in 100% by weight of the adhesive is 3 or more, 60 It is as follows.
  • the ratio of the average particle diameter of the inorganic filler to the average particle diameter of the spacer particles is 0.00005 or more and 0.1 or less.
  • 10% K value of the spacer particles is 980 N / mm 2 or more and 4900 N / mm 2 less.
  • the inductor adhesive is used for bonding a ferrite core in an inductor.
  • an inductor comprising a ferrite core and an adhesive part that adheres the ferrite core, wherein the material of the adhesive part is the above-described adhesive for an inductor.
  • the inductor adhesive according to the present invention includes a thermosetting compound, a thermosetting agent, an inorganic filler, and spacer particles, and the spacer particles are resin particles or organic-inorganic hybrid particles.
  • the average particle diameter is 20 ⁇ m or more and 200 ⁇ m or less
  • the CV value of the particle diameter of the spacer particles is 10% or less
  • the content of the inorganic filler exceeds 30% by weight in 100% by weight of the adhesive, Since it is 75 weight% or less, moisture resistance can be made high and even if it exposes to high humidity, the fall of adhesiveness can be suppressed.
  • FIG. 1 is a cross-sectional view schematically showing an inductor using an inductor adhesive according to an embodiment of the present invention.
  • the adhesive for inductors according to the present invention (hereinafter sometimes abbreviated as adhesive) is used for inductors.
  • the adhesive according to the present invention includes a thermosetting compound, a thermosetting agent, an inorganic filler, and spacer particles.
  • the spacer particles are resin particles or organic-inorganic hybrid particles.
  • the spacer particles have an average particle size of 20 ⁇ m or more and 200 ⁇ m or less.
  • the CV value of the particle diameter of the spacer particles is 10% or less.
  • the content of the inorganic filler is more than 30% by weight and 75% by weight or less.
  • the adhesive portion formed by the adhesive is difficult to absorb water, and even if it is exposed to high humidity, a decrease in adhesiveness can be suppressed.
  • the uniformity of the thickness of the bonded portion can be improved, excellent adhesiveness can be exhibited, and variation in inductance can be suppressed.
  • the thermal shock resistance can be increased, and the thermal shock resistance (long-term reliability) of the inductor can be increased. Even if the inductor is exposed to a high temperature or a low temperature, or is subjected to a thermal cycle, the change in inductance can be reduced.
  • the average particle diameter of the spacer particles is 20 ⁇ m or more and 200 ⁇ m or less. From the viewpoint of further improving the adhesiveness, the average particle diameter of the spacer particles is preferably 25 ⁇ m or more, more preferably 30 ⁇ m or more, preferably 150 ⁇ m or less, more preferably 130 ⁇ m or less.
  • the ratio of the average particle diameter of the inorganic filler to the average particle diameter of the spacer particles is preferably 0.1 or less. More preferably, it is 0.01 or less. From the viewpoint of further improving the moisture resistance, the above ratio (average particle diameter of inorganic filler / average particle diameter of spacer particles) is preferably 0.00005 or more, more preferably 0.0005 or more.
  • the above average particle diameter indicates the number average particle diameter.
  • the average particle diameter of the inorganic filler and the spacer particles can be obtained, for example, by observing 50 arbitrary inorganic fillers or 50 arbitrary spacer particles with an electron microscope or an optical microscope and calculating an average value.
  • the CV value of the particle diameter of the spacer particles is 10% or less. From the viewpoint of further improving the adhesiveness, the CV value of the particle diameter of the spacer particles is preferably 1% or more, and preferably 5% or less.
  • the CV value (coefficient of variation) is expressed by the following formula.
  • CV value (%) ( ⁇ / Dn) ⁇ 100 ⁇ : Standard deviation of spacer particle diameter Dn: Average value of spacer particle diameter
  • the viscosity of the adhesive at 25 ° C is: Preferably it is 10 Pa ⁇ s or more, more preferably 15 Pa ⁇ s or more, preferably 150 Pa ⁇ s or less, more preferably 100 Pa ⁇ s or less, still more preferably 70 Pa ⁇ s or less, particularly preferably 40 Pa ⁇ s or less, and most preferably Is 35 Pa ⁇ s or less.
  • the viscosity ( ⁇ 25) is measured using, for example, an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) and the like, and a spiral viscometer (“PCU-02V” manufactured by Malcolm). And can be measured at 25 ° C. and 10 rpm.
  • an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) is preferably used.
  • a spiral viscometer (“PCU-02V” manufactured by Malcolm) is preferably used.
  • the glass transition temperature of the obtained cured product is Preferably it is 120 degreeC or more, Preferably it is 210 degrees C or less.
  • the adhesive agent which concerns on this invention, after heating at 120 degreeC for 20 minutes, you may heat on conditions other than the conditions heated at 170 degreeC for 15 minutes.
  • the adhesive is placed on the first slide glass, and the second slide glass is placed on the adhesive.
  • the number of the spacer particles is preferably 2 / mm 2 or more, preferably 1000 in plan view. / Mm 2 or less. In the observation in the plan view, the adhesive between the first and second slide glasses is observed.
  • the adhesive is heated at 120 ° C. for 20 minutes and then heated at 170 ° C. for 15 minutes to obtain a cured product.
  • the linear expansion coefficient of the cured product obtained is preferably 60 ppm or less, more preferably 50 ppm or less, still more preferably 40 ppm or less, and particularly preferably 30 ppm or less.
  • the above adhesive is suitably used for bonding a ferrite core in an inductor.
  • thermosetting compound contained in the adhesive is not particularly limited.
  • the thermosetting compound is a compound that can be cured by heating.
  • As for the said thermosetting compound only 1 type may be used and 2 or more types may be used together.
  • thermosetting compound preferably contains an epoxy compound.
  • thermosetting compound preferably has an aromatic skeleton.
  • the aromatic skeleton examples include a benzene skeleton, naphthalene skeleton, fluorene skeleton, biphenyl skeleton, anthracene skeleton, pyrene skeleton, xanthene skeleton, adamantane skeleton, and bisphenol A skeleton.
  • the aromatic skeleton is preferably a benzene skeleton, a naphthalene skeleton, or a fluorene skeleton, and more preferably a naphthalene skeleton.
  • the aromatic skeleton may be a benzene skeleton or a naphthalene skeleton.
  • the thermosetting compound preferably includes a thermosetting compound having a naphthalene skeleton.
  • the content of the thermosetting compound is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, in 100% by weight of the adhesive. More preferably, it is 1% by weight or more, particularly preferably 15% by weight or more, preferably 90% by weight or less, more preferably 80% by weight or less, and further preferably 70% by weight or less.
  • the content of the thermosetting compound having the naphthalene skeleton is preferably 0.01% by weight or more, more preferably 0.1% in 100% by weight of the adhesive.
  • % By weight or more, more preferably 1% by weight or more, particularly preferably 15% by weight or more, preferably 90% by weight or less, more preferably 80% by weight or less, still more preferably 70% by weight or less, particularly preferably 50% by weight. % Or less, most preferably 30% by weight or less.
  • thermosetting agent thermosets the thermosetting compound.
  • examples of the thermosetting agent include an imidazole curing agent, a phenol curing agent, a thiol curing agent, an amine curing agent, an acid anhydride curing agent, a thermal cation initiator, and a thermal radical generator.
  • the said thermosetting agent only 1 type may be used and 2 or more types may be used together.
  • the imidazole curing agent is not particularly limited, and 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-Diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine and 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s- Examples include triazine isocyanuric acid adducts.
  • the thiol curing agent is not particularly limited, and examples thereof include trimethylolpropane tris-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol hexa-3-mercaptopropionate. .
  • the solubility parameter of the thiol curing agent is preferably 9.5 or more, and preferably 12 or less.
  • the solubility parameter is calculated by the Fedors method. For example, the solubility parameter of trimethylolpropane tris-3-mercaptopropionate is 9.6, and the solubility parameter of dipentaerythritol hexa-3-mercaptopropionate is 11.4.
  • the amine curing agent is not particularly limited, and hexamethylenediamine, octamethylenediamine, decamethylenediamine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraspiro [5.5].
  • examples include undecane, bis (4-aminocyclohexyl) methane, metaphenylenediamine, and diaminodiphenylsulfone.
  • thermal cation initiator examples include iodonium cation curing agents, oxonium cation curing agents, and sulfonium cation curing agents.
  • examples of the iodonium-based cationic curing agent include bis (4-tert-butylphenyl) iodonium hexafluorophosphate.
  • examples of the oxonium-based cationic curing agent include trimethyloxonium tetrafluoroborate.
  • sulfonium-based cationic curing agent examples include tri-p-tolylsulfonium hexafluorophosphate.
  • the thermal radical generator is not particularly limited, and examples thereof include azo compounds and organic peroxides.
  • examples of the azo compound include azobisisobutyronitrile (AIBN).
  • examples of the organic peroxide include di-tert-butyl peroxide and methyl ethyl ketone peroxide.
  • the content of the thermosetting agent is not particularly limited.
  • the content of the thermosetting agent with respect to 100 parts by weight of the thermosetting compound is preferably 0.01 parts by weight or more, more preferably 1 part by weight or more, preferably 200 parts by weight or less, more preferably 100 parts by weight or less, more preferably 75 parts by weight or less, particularly preferably 50 parts by weight or less, and most preferably 10 parts by weight or less.
  • the content of the thermosetting agent is not less than the above lower limit, it is easy to sufficiently cure the adhesive. If the content of the thermosetting agent is not more than the above upper limit, it becomes difficult for the surplus thermosetting agent that did not participate in curing after curing to remain, and the heat resistance of the bonded portion is further increased.
  • the spacer particles include resin particles, inorganic particles excluding metal particles, organic-inorganic hybrid particles, and metal particles.
  • the spacer particles are resin particles or organic-inorganic hybrid particles.
  • the spacer particle may be a core-shell particle including a core and a shell disposed on the surface of the core.
  • the core may be an organic core.
  • the shell may be an inorganic shell. From the viewpoint of reducing stress when stress is applied to the bonded portion and maintaining high adhesion, spacer particles excluding metal particles are preferable, and resin particles, inorganic particles excluding metal particles, or organic-inorganic hybrid particles are more preferable. preferable.
  • resin particles or organic-inorganic hybrid particles are used because they are more excellent due to the effects of the present invention.
  • the spacer particles are preferably resin particles formed of resin.
  • the spacer particles are resin particles, when stress is applied to the bonding portion, the stress can be relaxed and the adhesiveness can be maintained high.
  • the resin for forming the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; acrylic resins such as polymethyl methacrylate and polymethyl acrylate; Alkylene terephthalate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polysulfone, polyphenylene Oxide, polyacetal, polyimide, polyamideimide, polyether ether Ketones, polyether sulfones, and polymers such as obtained by a variety of polymerizable monomer having an terephthalate, polyethylene, polypropylene, polystyrene
  • the resin for forming the resin particles is a polymer obtained by polymerizing one or more polymerizable monomers having a plurality of ethylenically unsaturated groups. It is preferably a coalescence.
  • the polymerizable monomer having an ethylenically unsaturated group may be a non-crosslinkable monomer or a crosslinkable monomer. And the monomer.
  • non-crosslinkable monomer examples include styrene monomers such as styrene and ⁇ -methylstyrene; carboxyl group-containing monomers such as (meth) acrylic acid, maleic acid, and maleic anhydride; (Meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl ( Alkyl (meth) acrylate compounds such as meth) acrylate and isobornyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, glycerol (meth) acrylate, polyoxyethylene (meth) acrylate, glycidyl (meth) acrylate, etc.
  • Oxygen atom-containing (meth) acrylate compounds Nitrile-containing monomers such as (meth) acrylonitrile; Vinyl ether compounds such as methyl vinyl ether, ethyl vinyl ether, and propyl vinyl ether; Acids such as vinyl acetate, vinyl butyrate, vinyl laurate, and vinyl stearate Vinyl ester compounds; unsaturated hydrocarbons such as ethylene, propylene, isoprene, and butadiene; halogen-containing monomers such as trifluoromethyl (meth) acrylate, pentafluoroethyl (meth) acrylate, vinyl chloride, vinyl fluoride, and chlorostyrene Etc.
  • Nitrile-containing monomers such as (meth) acrylonitrile
  • Vinyl ether compounds such as methyl vinyl ether, ethyl vinyl ether, and propyl vinyl ether
  • Acids such as vinyl acetate, vinyl butyrate, vinyl laurate, and vinyl stea
  • crosslinkable monomer examples include tetramethylolmethane tetra (meth) acrylate, tetramethylolmethane tri (meth) acrylate, tetramethylolmethane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and dipenta Erythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, glycerol tri (meth) acrylate, glycerol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) Polyfunctional (meth) acrylate compounds such as acrylate, (poly) tetramethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate; triallyl (iso) sia Silane-
  • the resin particles can be obtained by polymerizing the polymerizable monomer having an ethylenically unsaturated group by a known method. Examples of this method include a method of suspension polymerization in the presence of a radical polymerization initiator, and a method of polymerizing by swelling a monomer together with a radical polymerization initiator using non-crosslinked seed particles.
  • examples of inorganic materials for forming the spacer particles include silica and carbon black.
  • the inorganic substance is preferably not a metal.
  • the particles formed from the silica are not particularly limited. For example, after forming a crosslinked polymer particle by hydrolyzing a silicon compound having two or more hydrolyzable alkoxysilyl groups, firing may be performed as necessary. The particle
  • examples of the organic / inorganic hybrid particles include organic / inorganic hybrid particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin.
  • the compression elastic modulus (10% K value) when the spacer particles are compressed by 10% is preferably 980 N / mm 2 or more, more preferably 1200 N / mm 2. or more, preferably 4900 N / mm 2 or less, and more preferably not more than 3000N / mm 2.
  • the 10% K value of the spacer particles can be measured as follows.
  • spacer particles are compressed under a condition that a smooth tester end face of a cylinder (diameter 50 ⁇ m, made of diamond) is loaded at 25 ° C. and a maximum test load of 90 mN over 30 seconds.
  • the load value (N) and compression displacement (mm) at this time are measured. From the measured value obtained, the compression elastic modulus can be obtained by the following formula.
  • the micro compression tester for example, “Fischer Scope H-100” manufactured by Fischer is used.
  • the content of the spacer particles in 100% by weight of the adhesive is preferably 1% by weight or more.
  • it is 2 weight% or more, More preferably, it exceeds 5 weight%, Preferably it is 15 weight% or less, More preferably, it is 12 weight% or less.
  • inorganic filler examples include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.
  • the inorganic filler is preferably silica or alumina, more preferably silica, and even more preferably fused silica.
  • silica the thermal expansion coefficient of the bonded portion is further lowered, and the bonding reliability is further increased.
  • the inorganic filler is preferably a surface-treated product with a coupling agent.
  • the coupling agent examples include silane coupling agents, titanium coupling agents, and aluminum coupling agents.
  • the inorganic filler is preferably a surface-treated product with a silane coupling agent.
  • silane coupling agent examples include phenyl silane, vinyl silane, amino silane, imidazole silane, and epoxy silane. From the viewpoint of further improving the moisture resistance, phenylsilane is preferred.
  • the content of the inorganic filler is more than 30% by weight and 75% by weight or less. From the viewpoint of further improving the moisture resistance, the content of the inorganic filler is preferably more than 35% by weight and more preferably 40% by weight or more in 100% by weight of the adhesive. From the viewpoint of further improving the adhesiveness, the content of the inorganic filler is preferably 70% by weight or less, more preferably 65% by weight or less, and still more preferably 60% by weight or less.
  • the ratio of the content of the inorganic filler in 100% by weight of the adhesive to the content of the spacer particles in 100% by weight of the adhesive (inorganic filler) Content / spacer particle content) is preferably 3 or more, more preferably 4 or more, preferably 60 or less, more preferably 30 or less.
  • the adhesive may contain a photocurable component, and may contain a photocurable compound and a photopolymerization initiator.
  • the adhesive preferably contains a coupling agent.
  • the coupling agent examples include silane coupling agents, titanium coupling agents, and aluminum coupling agents. From the viewpoint of further improving the adhesiveness, the adhesive preferably contains a silane coupling agent.
  • silane coupling agent examples include phenyl silane, vinyl silane, amino silane, imidazole silane, and epoxy silane.
  • the content of the coupling agent is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 2% in 100% by weight of the adhesive. % By weight or less, more preferably 1% by weight or less.
  • the above-mentioned adhesive contains a thixotropic agent. Is preferred.
  • thixotropic agent examples include inorganic particles such as metal particles, calcium carbonate, fumed silica, aluminum oxide, boron nitride, aluminum nitride, and aluminum borate.
  • the above-mentioned thixotropy is imparted in 100% by weight of the adhesive.
  • the content of the agent is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 10% by weight or less, more preferably 5% by weight or less.
  • the adhesive may be, for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, and a lubricant as necessary.
  • various additives such as an antistatic agent and a flame retardant may be included.
  • the inductor according to the present invention includes a ferrite core and an adhesive portion that adheres the ferrite core.
  • the material of the upper bonding portion is the above-described inductor adhesive.
  • the bonding portion is a cured product of the inductor adhesive.
  • the adhesive portion is formed by curing the inductor adhesive.
  • the ferrite core is disposed on the opposite surfaces of the adhesive portion. It is preferable that there is a gap in the ferrite core due to the adhesive portion.
  • FIG. 1 is a cross-sectional view schematically showing an inductor using an inductor adhesive according to an embodiment of the present invention.
  • the inductor 1 shown in FIG. 1 includes a ferrite core 11, a ferrite core 12, and an adhesive portion 13.
  • Inductor 1 includes a plurality of ferrite cores (ferrite core 11 and ferrite core 12).
  • Inductor 1 includes a coil iron core for a transformer component.
  • the ferrite core 11 is an E-type ferrite core.
  • the ferrite core 12 is an I-type farite core. Of the three convex portions of the E-type ferrite core 11, the tips of the outer two convex portions and the side surface of the I-type ferrite core 12 are opposed to each other and have a gap.
  • An adhesive portion 13 is disposed in this gap.
  • the material of the bonding portion 13 is the above-described inductor adhesive.
  • the thickness of the adhesive portion 13 is equal to the particle diameter of the spacer particles included in the adhesive 13. The spacer particles are in contact with both the ferrite core 11 and the ferrite core 12.
  • Thermosetting compound 1 Resorcinol type epoxy compound, "Epolite TDG-LC” manufactured by Kyoeisha Chemical Thermosetting compound 2: bisphenol F type epoxy compound, “EXA-830CRP” manufactured by DIC Thermosetting compound 3: Naphthalene type epoxy compound, “HP-4032D” manufactured by DIC Thermosetting compound 4: bisphenol A type epoxy compound, “EXA-850CRP” manufactured by DIC Thermosetting compound 5: Naphthalene type epoxy compound, “HP-4710” manufactured by DIC Thermosetting compound 6: fluorene type epoxy compound, “OGSOL PG-100” manufactured by Osaka Gas Chemical Company
  • Thermosetting agent 1 Imidazole curing accelerator, Nippon Soda Co., Ltd. “TEP-2E4MZ”
  • Thermosetting agent 2 Imidazole curing accelerator, “2MZA-PW” manufactured by Shikoku Kasei Kogyo Co., Ltd.
  • Coupling agent Silane coupling agent, “KBM-573” manufactured by Shin-Etsu Chemical Co., Ltd.
  • Inorganic filler 1 Silica, average particle size 1 ⁇ m, “SE4050-SPE” manufactured by Admatechs
  • Inorganic filler 2 Silica, average particle size 3.8 ⁇ m, “EXR-4” manufactured by Tatsumori
  • Spacer 1 Average particle diameter 20 ⁇ m, CV value 5%, 10% K value 3600 N / mm 2 , “SP-220” manufactured by Sekisui Chemical Co., Ltd., resin particles Spacer 2: Average particle diameter 150 ⁇ m, CV value 7%, 10% K value 2000 N / mm 2 , “SP-L150” manufactured by Sekisui Chemical Co., Ltd., resin particle spacer 3: average particle diameter 50 ⁇ m, CV value 5%, 10% K value 3800 N / mm 2 , “SP- manufactured by Sekisui Chemical Co., Ltd. 250 ", resin particles Spacer 4: Average particle diameter 200 ⁇ m, CV value 7%, 10% K value 3900 N / mm 2 ,” GS-L200 "manufactured by Sekisui Chemical Co., Ltd., resin particles
  • Example 1 Preparation of Adhesive for Inductor According to the composition shown in Table 1, an adhesive composition was obtained by stirring and mixing each material other than the spacer with a rotation and revolution mixer. Spacer particles were blended in the obtained adhesive composition according to the composition shown in Table 1, and the mixture was stirred and mixed using a rotation and revolution mixer to produce an inductor adhesive.
  • Examples 2 to 16 Comparative Examples 1 and 2
  • An inductor adhesive, an inductor, and a sample for evaluating moisture resistance were obtained in the same manner as in Example 1 except that the types and amounts of the ingredients were changed as shown in Tables 1 and 2.
  • Viscosity When the particle size of the spacer particles in the adhesive is 20 ⁇ m or less, the viscosity ( ⁇ 25) of the adhesive at 25 ° C. is measured using an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.). And measured under the conditions of 25 ° C. and 5 rpm.
  • the viscosity ( ⁇ 25) at 25 ° C. of the adhesive is measured at 25 ° C. using a spiral viscometer (“PCU-02V” manufactured by Malcolm). The measurement was performed under the condition of 10 rpm.
  • Coating property Evaluation of coating property was performed using a dispenser device ("SHOT MASTER300" manufactured by Musashi Engineering Co., Ltd.).
  • the coating conditions are fixed by a precision nozzle (Musashi Engineering Co., Ltd., nozzle tip inner diameter 0.3 mm) and discharge conditions (temperature 25 ° C., discharge pressure 0.3 Mpa), and coated on a glass substrate, thereby improving the coating property. evaluated.
  • the applicability was determined according to the following criteria.
  • Tg glass transition temperature
  • the adhesive was heated at 120 ° C. for 20 minutes, then heated at 170 ° C. for 15 minutes and cured to obtain a cured product.
  • the tan ⁇ of the obtained cured product was measured using a viscoelasticity measuring device (manufactured by IT Measurement & Control Co., Ltd.) under conditions of a temperature rising rate of 10 ° C./min, a grip width of 20 mm and 5 Hz.
  • the temperature at the peak of Tan ⁇ was defined as the glass transition temperature.
  • Moisture resistance Measure the adhesion between the obtained sample for evaluating moisture resistance in an oven at 85 ° C. and 85% humidity for 24 hours and the sample obtained by leaving the sample for evaluating moisture resistance at room temperature. did. The moisture resistance was evaluated by measuring the die shear adhesive strength with a die shear tester “Dage series 4000” manufactured by Dage. The moisture resistance was determined according to the following criteria.
  • Gap controllability In the obtained inductor, using a laser displacement meter (“KS-1100” manufactured by KEYENCE), the gap distance after curing and the gap distance variation 3 ⁇ ( ⁇ : standard deviation) are measured. did. The gap controllability was evaluated from the variation 3 ⁇ in the gap distance / the value X of the gap distance after curing. Gap controllability was determined according to the following criteria.
  • Value X is less than 0.1 ⁇ : Value X is 0.1 or more and less than 0.2 ⁇ : Value X is 0.2 or more and less than 0.4 ⁇ : Value X is 0.4 or more
  • CV value of inductance is less than 5%
  • CV value of inductance is 5% or more and less than 10%
  • ⁇ CV value of inductance is 10% or more and less than 15%
  • CV value of inductance is 15% or more
  • Thermal shock resistance 1 Long-term reliability
  • the obtained inductor was left in an environment where 500 cycles of a temperature change of 30 minutes at a high temperature of 125 ° C. and 30 minutes at a low temperature of ⁇ 40 ° C. were given. Thereafter, the rate of change in inductance was measured.
  • the characteristic change rate means a ratio of variation in inductance due to peeling on the adhesive surface due to thermal shock or a change in the distance between the gaps.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Coils Or Transformers For Communication (AREA)
PCT/JP2017/012547 2016-03-30 2017-03-28 インダクタ用接着剤及びインダクタ WO2017170492A1 (ja)

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CN111477442A (zh) * 2019-01-24 2020-07-31 昆山玛冀电子有限公司 一种改善模压电感烘烤后开裂现象的方法
KR20210110021A (ko) * 2020-02-28 2021-09-07 엘지이노텍 주식회사 자성 코어 및 이를 포함하는 자성 소자

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