WO2017166397A1 - 液晶面板的切割方法 - Google Patents

液晶面板的切割方法 Download PDF

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Publication number
WO2017166397A1
WO2017166397A1 PCT/CN2016/082781 CN2016082781W WO2017166397A1 WO 2017166397 A1 WO2017166397 A1 WO 2017166397A1 CN 2016082781 W CN2016082781 W CN 2016082781W WO 2017166397 A1 WO2017166397 A1 WO 2017166397A1
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WIPO (PCT)
Prior art keywords
cutting
alignment mark
position information
reference alignment
cutting position
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PCT/CN2016/082781
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English (en)
French (fr)
Inventor
班松
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深圳市华星光电技术有限公司
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Priority to US15/110,094 priority Critical patent/US10293508B2/en
Publication of WO2017166397A1 publication Critical patent/WO2017166397A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to the field of manufacturing liquid crystal panels, and in particular, to a method for cutting a liquid crystal panel.
  • each of the liquid crystal panels to be formed on the substrate has an alignment mark, a CCD (Charge Coupled Device) recognizes the alignment mark and generates cutting control information, and the cutter cuts according to the cutting control information.
  • the part cut by the cutter is called waste.
  • the machine needs to transfer the substrate forward to the position that the CCD can scan, and then the CCD recognizes the second set of alignment again. Mark to control the tool to continue the second cut. This leads to more process steps and low cutting efficiency.
  • the present invention provides a method for cutting a liquid crystal panel, which simplifies the process of the original cutting process.
  • a cutting method of a liquid crystal panel for cutting a substrate to form a liquid crystal panel comprising: providing a control device, an image recognition device, and a cutter having the cutter in a first cutting direction Cutting position information indicating each of the cutting positions is preset in each of the cutting positions; a reference alignment mark is disposed on the substrate, and the reference alignment mark is located at two adjacent cutting positions And capturing, by the image recognition device, the reference alignment mark, and generating reference position information indicating the reference alignment mark; and the control device controls the location according to the reference position information and the cutting position information The cutter is sequentially moved to each of the cutting positions and cut Cut.
  • control device controls the tool to sequentially move to each of the cutting positions and perform cutting according to the reference position information and the cutting position information: the control device according to the reference position information and the cutting Position information, determining respective distance values between the reference alignment mark and each of the cutting positions; the control device controls the cutters to sequentially move to respective ones corresponding to the respective distance values according to the respective distance values Cut the position and cut.
  • the substrate comprises an upper substrate and a lower substrate
  • the cutter comprises a first cutter for cutting the upper substrate
  • the upper substrate has the first cutter on a first cutting position in the first cutting direction and a second cutting position
  • the second cutter is for cutting the lower substrate
  • the second cutting tool has the second cutting tool in the first cutting direction a third cutting position and a fourth cutting position
  • the control device is provided with a cutting position indicating the first cutting position, the second cutting position, the third cutting position, and the fourth cutting position information.
  • the reference alignment mark includes a first reference alignment mark and a second reference alignment mark, the first reference alignment mark being located between the first cutting position and the second cutting position, A second reference registration mark is located between the third cutting position and the fourth cutting position.
  • the ingesting the reference alignment mark by the image recognition device and generating the reference position information indicating the reference alignment mark includes: capturing, by the image recognition device, the first reference alignment mark and the The second reference alignment mark generates first reference position information indicating the first reference alignment mark, and second reference position information indicating the second reference alignment mark.
  • the control device determines, according to the reference position information and the cutting position information, each distance value between the reference alignment mark and each of the cutting positions: the control device is according to the first reference position Information and the cutting position information, determining a first distance value between the first reference alignment mark and the first cutting position, and a first interval between the first reference alignment mark and the second cutting position a second distance value; the control device determines a third distance value between the second reference alignment mark and the third cutting position according to the second reference position information and the cutting position information, and the a fourth distance value between the reference mark and the fourth cutting position.
  • the control device controls, according to each of the distance values, the tool to sequentially move to each of the cutting positions corresponding to each of the distance values and performs cutting: the control device according to the first distance value and the Determining the second distance value, controlling the first tool to sequentially move to the first distance The first cutting position corresponding to the value and the second cutting position corresponding to the second distance value are cut; the control device controls the station according to the third distance value and the fourth distance value The second cutter sequentially moves to the third cutting position corresponding to the third distance value and the fourth cutting position corresponding to the fourth distance value and performs cutting.
  • the first reference alignment mark and the second reference alignment mark each include two alignment marks, and the connection lines of the two alignment marks are parallel to the first cutting direction.
  • the first tool or the second tool has a stroke limit value, and the first distance value, the second distance value, the third distance value, and the fourth distance value are all less than or equal to The travel limit value.
  • the stroke limit value is 19 mm.
  • the first reference alignment mark and the second reference alignment mark are respectively disposed on the upper and lower substrates, and the image recognition module only needs to ingest the first reference alignment mark and the Determining the second reference alignment mark, the control module can determine two offset distances of the first tool from the first reference alignment mark to the two cutting positions, and the second tool is aligned by the second reference Marking two offset distances from the two cutting positions; the control device can respectively control the first tool and the second tool to complete two cuts according to the offset distance; and after completing the previous cutting The first cutter and the second cutter move directly to the position of the next cutting to continue cutting.
  • the single-substrate transfer substrate process and the one-time alignment mark recognition process are omitted, thereby simplifying the cutting process and improving the cutting efficiency.
  • FIG. 1 is a schematic flow chart of a cutting method of a liquid crystal panel according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing a cutting operation of the cutting method of the embodiment of the present invention.
  • FIG. 3 is a schematic view showing still another cutting operation of the cutting method of the embodiment of the present invention.
  • FIG. 4 is a schematic view showing still another cutting operation of the cutting method of the embodiment of the present invention.
  • Fig. 5 is a schematic view showing still another cutting operation of the cutting method of the embodiment of the present invention.
  • Fig. 6 is a schematic view showing still another cutting operation of the cutting method of the embodiment of the present invention.
  • the cutting device in this embodiment is a non-cross type cutter (not shown), and in other embodiments, other types of cutters can also be used.
  • the cutting method 100 of the liquid crystal panel of this embodiment includes:
  • S110 providing a control device, an image recognition device and a cutter, the substrate having respective cutting positions of the cutter in a first cutting direction, and the control device is provided with cutting position information indicating each of the cutting positions ;
  • a reference alignment mark is disposed on the substrate, and the reference alignment mark is located between two adjacent cutting positions;
  • the reference identification mark is taken by the image recognition device, and reference position information indicating the reference alignment mark is generated;
  • the control device controls the cutter to sequentially move to each of the cutting positions and perform cutting according to the reference position information and the cutting position information.
  • the cutter has a machine table 210 on which a substrate is placed.
  • the substrate includes a lower substrate 220 and an upper substrate 230.
  • the lower substrate 220 is provided with a plurality of color filter units
  • the upper substrate 230 is provided with a plurality of thin film transistor array units.
  • the substrate provided with the color filter unit may be on, and the substrate provided with the thin film transistor array unit is below.
  • the shaded portions on the lower substrate 220 and the upper substrate 230 are waste materials to be cut by the cutter.
  • the cutting machine is provided with a control device (not shown), an image recognition device 240, a first cutter 250 and a second cutter 260.
  • the first tool 250 is used to cut the upper substrate 230 to form a thin film transistor array substrate.
  • the second cutter 260 is used to cut the lower substrate 220 to form a color filter substrate.
  • the upper substrate 230 and the lower substrate 220 respectively have a first cutter 250 and a second cutter 260 respective cutting positions in the first cutting direction.
  • the first cutting direction is the longitudinal direction of the upper substrate 230 or the lower substrate 220.
  • the first direction may be a lateral direction of the upper substrate or the lower substrate.
  • Cutting position information indicating each of the cutting positions of the first cutter 250 and the second cutter 260 is preliminarily provided in the control device.
  • the image recognition device 240 is preferably a CCD, and the CCD has the advantages of fast image capturing speed and high recognition accuracy. In other embodiments, other types of image recognition devices 240 may also be used.
  • a reference alignment mark is disposed on the substrate such that the reference alignment mark is located between two adjacent ones of the cutting positions.
  • the upper substrate 230 has adjacent first and second cutting positions 231, 232.
  • a first reference alignment mark 233 is disposed on the upper substrate 230 such that the first reference alignment mark 233 is located between the first cutting position 231 and the second cutting position 232.
  • the lower substrate 220 has adjacent third cutting positions 221 and fourth cutting positions 222.
  • a second reference alignment mark 223 is disposed on the lower substrate 220 such that the second reference alignment mark 223 is located between the third cutting position 221 and the fourth cutting position 222.
  • the first reference alignment mark 233 and the second reference alignment mark 223 each include two alignment marks, and the lines of the two alignment marks are parallel to the first cutting direction. In other embodiments, the number of alignment marks in the first reference alignment mark 233 or the second reference alignment mark 223 is determined according to specific design needs.
  • the first reference alignment mark 233 is disposed opposite to the second reference alignment mark 223, that is, the projected position of the first reference alignment mark 233 on the lower substrate 220 coincides with the second reference alignment mark 223.
  • only the cutting tool is cut in the first direction, that is, the upper substrate 230 and the lower substrate 220 are cut in the longitudinal direction as an example. Therefore, only the first tool 250 and the second tool 260 are described. Two of the above cutting positions. In the actual cutting process, the cutter is continuously cut in the longitudinal and transverse directions of the substrate according to the cutting method 100 of the present embodiment.
  • the image recognition device 240 takes the reference alignment mark and generates reference position information indicating the reference registration mark. Specifically, the machine 210 moves the substrate such that both the first reference registration mark 233 and the second reference alignment mark 223 are within a range that the image recognition device 240 can scan. As shown in FIGS. 3 and 4, the image recognition device 240 picks up the first reference registration mark 233 at a time, and generates first reference position information indicating the first reference registration mark 233, respectively, and indicates the second reference alignment mark. The second reference position information of 223.
  • the control device In S140, the control device generates the first reference bit generated by the image recognition device 240. Setting information, the second reference position information, and the cutting position information preset in the control device, controlling the first cutter 250 to sequentially move to the first cutting position 231 and the second cutting position 232 for cutting, And controlling the second cutter 260 to sequentially move to the third cutting position 221 and the fourth cutting position 222 for cutting. Specifically, as shown in FIG. 3, the control device determines a first distance value between the first reference alignment mark 233 and the first cutting position 231 according to the first reference position information and the cutting position information. And a second distance value between the first reference alignment mark 233 and the second cutting position 232.
  • the control device controls the first tool 250 to move to the first cutting position 231 corresponding to the first distance value according to the first distance value, after which the first tool 250 performs a cutting operation.
  • the control device controls the first tool 250 to directly translate from the first cutting position 231 to the second cutting position 232 according to the second distance value, after which the first The cutter 250 performs a second cutting operation.
  • the control device determines a third distance value between the second reference alignment mark 223 and the third cutting position 221 according to the second reference position information and the cutting position information, and A fourth distance value between the second reference alignment mark 223 and the fourth cutting position 222.
  • the control device controls the second tool 260 to move to the third cutting position 221 corresponding to the third distance value according to the third distance value, after which the second tool 260 performs a cutting operation.
  • the control device controls the second cutter 260 to directly translate from the third cutting position 221 to the fourth cutting position 222 according to the fourth distance value, after which the second The cutter 260 performs a second cutting operation.
  • the first tool 250 or the second tool 260 has a stroke limit value, the stroke limit value being the first tool 250 or the second tool 260 being perpendicular to the first cutting direction, in this embodiment, that is, at the base In the lateral direction of the material, the one-way maximum stroke is translated by the first reference alignment mark 233 or the second reference alignment mark 223 to the cutting position.
  • the stroke limit value is 19 mm.
  • the stroke limit is a function of a particular cutting process. For the first cutter 250, when the first cutting is performed, the lateral movement distance from the first reference alignment mark 233 to the first cutting position 231 should be less than or equal to 19 mm, that is, the first distance should be less than or equal to 19 mm.
  • the first cutter 250 When the second cutting is performed, the first cutter 250 is laterally translated from the first cutting position 231, passes through the first reference alignment mark 233, and finally moves to the second cutting position 232.
  • the lateral movement distance from the first reference alignment mark 233 to the second cutting position 232 should also be less than or equal to 19 mm, ie the second distance should also be less than or equal to 19 mm. That is, the distance between the first cutting position 231 and the second cutting position 232 It should be less than or equal to 2*19mm.
  • the first reference alignment mark 233 on the upper substrate 230 and the design of the adjacent cutting position are generally satisfied to meet the stroke limit value in consideration of material saving and yield improvement. Requirements.
  • the first tool 250 is able to translate within the stroke limit value, which in turn completes the cutting action.
  • the third distance and the fourth distance are both less than or equal to 19 mm, and the distance between the third cutting position 221 and the fourth cutting position 222 is less than or equal to 2*19 mm.
  • the first reference alignment mark and the second reference alignment mark are respectively disposed on the upper and lower substrates, and the image recognition module only needs to ingest the first reference alignment mark and the Determining the second reference alignment mark, the control module can determine two offset distances of the first tool from the first reference alignment mark to the two cutting positions, and the second tool is aligned by the second reference Marking two offset distances from the two cutting positions; the control device can respectively control the first tool and the second tool to complete two cuts according to the offset distance; and after completing the previous cutting The first cutter and the second cutter move directly to the position of the next cutting to continue cutting.
  • the single-substrate transfer substrate process and the one-time alignment mark recognition process are omitted, thereby simplifying the cutting process and improving the cutting efficiency.

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Abstract

一种液晶面板的切割方法（100），包括：提供控制装置、图像识别装置（240）和刀具（250，260），所述基材（220，230）上具有所述刀具（250，260）在第一切割方向上的各个切割位置（221，222，231，232），所述控制装置中预设有指示各个所述切割位置（221，222，231，232）的切割位置信息；在所述基材（220，230）上设置基准对位标记（223，233），所述基准对位标记（223，233）位于相邻两个所述切割位置（221，222，231，232）之间；通过所述图像识别装置（240）摄取所述基准对位标记（223，233），并生成指示所述基准对位标记（223，233）的基准位置信息；所述控制装置根据所述基准位置信息与所述切割位置信息，控制所述刀具（250，260）依次移动到各个所述切割位置（221，222，231，232）并进行切割。该切割方法（100），能够简化切割工艺，提高切割效率。

Description

液晶面板的切割方法
本申请要求于2016年3月29日提交中国专利局、申请号为201610188094.9、发明名称为“液晶面板的切割方法”的中国专利申请的优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及液晶面板制造技术领域，尤其涉及一种液晶面板的切割方法。
背景技术
在液晶面板的制造过程中，需要对整块的基材进行切割，以分割出符合设计尺寸的液晶面板。基材上各个待成型的液晶面板均具有对位标记，CCD(Charge Coupled Device，电荷耦合元件)识别对位标记并生成切割控制信息，刀具则根据切割控制信息进行切割。刀具切割掉的部分称为废材。现有技术中，在同一个切割方向上，(例如纵向或横向)刀具完成一次切割之后，机台需要将基材向前传送到CCD可扫描到的位置，然后CCD再次识别第二组对位标记，以控制刀具继续进行第二次切割。如此导致工艺环节较多，切割效率低下。
发明内容
有鉴于此，本发明提供了一种液晶面板的切割方法，精简了原有切割流程的工艺环节。
一种液晶面板的切割方法，用于切割基材以形成液晶面板，所述切割方法包括：提供控制装置、图像识别装置和刀具，所述基材上具有所述刀具在第一切割方向上的各个切割位置，所述控制装置中预设有指示各个所述切割位置的切割位置信息；在所述基材上设置基准对位标记，所述基准对位标记位于相邻两个所述切割位置之间；通过所述图像识别装置摄取所述基准对位标记，并生成指示所述基准对位标记的基准位置信息；所述控制装置根据所述基准位置信息与所述切割位置信息，控制所述刀具依次移动到各个所述切割位置并进行切 割。
其中，所述控制装置根据所述基准位置信息与所述切割位置信息，控制所述刀具依次移动到各个所述切割位置并进行切割包括：所述控制装置根据所述基准位置信息与所述切割位置信息，确定所述基准对位标记与各个所述切割位置间的各个距离值；所述控制装置根据各个所述距离值控制所述刀具依次移动到与各个所述距离值对应的各个所述切割位置并进行切割。
其中，所述基材包括上基板和下基板，所述刀具包括第一刀具和第二刀具，所述第一刀具用于切割所述上基板，所述上基板上具有所述第一刀具在所述第一切割方向上的第一切割位置与第二切割位置，所述第二刀具用于切割所述下基板，所述下基板上具有所述第二刀具在所述第一切割方向上的第三切割位置与第四切割位置，所述控制装置中预设有指示所述第一切割位置、所述第二切割位置、所述第三切割位置以及所述第四切割位置的切割位置信息。
其中，所述基准对位标记包括第一基准对位标记与第二基准对位标记，所述第一基准对位标记位于所述第一切割位置与所述第二切割位置之间，所述第二基准对位标记位于所述第三切割位置与所述第四切割位置之间。
其中，所述通过所述图像识别装置摄取所述基准对位标记，并生成指示所述基准对位标记的基准位置信息包括：通过所述图像识别装置摄取所述第一基准对位标记与所述第二基准对位标记，生成指示所述第一基准对位标记的第一基准位置信息，以及指示所述第二基准对位标记的第二基准位置信息。
其中，所述控制装置根据所述基准位置信息与所述切割位置信息，确定所述基准对位标记与各个所述切割位置间的各个距离值包括：所述控制装置根据所述第一基准位置信息与所述切割位置信息，确定所述第一基准对位标记与所述第一切割位置间的第一距离值，以及所述第一基准对位标记与所述第二切割位置间的第二距离值；所述控制装置根据所述第二基准位置信息与所述切割位置信息，确定所述第二基准对位标记与所述第三切割位置间的第三距离值，以及所述第二基准对位标记与所述第四切割位置间的第四距离值。
其中，所述控制装置根据各个所述距离值控制所述刀具依次移动到与各个所述距离值对应的各个所述切割位置并进行切割包括：所述控制装置根据所述第一距离值与所述第二距离值，控制所述第一刀具依次移动到与所述第一距离 值对应的所述第一切割位置以及与所述第二距离值对应的所述第二切割位置并进行切割；所述控制装置根据所述第三距离值与所述第四距离值，控制所述第二刀具依次移动到与所述第三距离值对应的所述第三切割位置以及与所述第四距离值对应的所述第四切割位置并进行切割。
其中，所述第一基准对位标记与所述第二基准对位标记均包括两个对位标记，两个所述对位标记的连线平行于所述第一切割方向。
其中，所述第一刀具或所述第二刀具具有行程极限值，所述第一距离值、所述第二距离值、所述第三距离值以及所述第四距离值均小于或等于所述行程极限值。
其中，所述行程极限值为19mm。
由此，本实施例的切割方法，通过在上、下基板上分别设置第一基准对位标记和第二基准对位标记，图像识别模块仅需一次摄取所述第一基准对位标记和所述第二基准对位标记，控制模块就能确定第一刀具由所述第一基准对位标记处到两次切割位置的两个偏移距离，以及第二刀具由所述第二基准对位标记处到两次切割位置的两个偏移距离；控制装置即可根据上述偏移距离，分别控制所述第一刀具和所述第二刀具各完成两次切割；且在完成前次切割之后，所述第一刀具和所述第二刀具直接移动到下一次切割的位置继续切割。相比较现有技术，省去了一次机台传送基材工序和一次对位标记识别工序，从而简化了切割工艺，提高了切割效率。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例的液晶面板的切割方法的示意性流程图。
图2是本发明实施例的切割方法的切割操作示意图。
图3是本发明实施例的切割方法的又一切割操作示意图。
图4是本发明实施例的切割方法的又一切割操作示意图。
图5是本发明实施例的切割方法的又一切割操作示意图。
图6是本发明实施例的切割方法的又一切割操作示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本实施例中的切割设备为非交叉型(Non-Cross Type)的切割机(图未示)，在其他实施例中，还可以使用其他类型的切割机。
如图1所示，本实施例的液晶面板的切割方法100包括：
S110，提供控制装置、图像识别装置和刀具，所述基材上具有所述刀具在第一切割方向上的各个切割位置，所述控制装置中预设有指示各个所述切割位置的切割位置信息；
S120，在所述基材上设置基准对位标记，所述基准对位标记位于相邻两个所述切割位置之间；
S130，通过所述图像识别装置摄取所述基准对位标记，并生成指示所述基准对位标记的基准位置信息；
S140，所述控制装置根据所述基准位置信息与所述切割位置信息，控制所述刀具依次移动到各个所述切割位置并进行切割。
具体而言，如图1和图2所示，在S110中，所述切割机具有机台210，机台210上放置有基材。所述基材包括下基板220和上基板230。下基板220上设有若干彩色滤光片单元，上基板230上设有若干薄膜晶体管阵列单元。在其他实施例中，也可以是设有彩色滤光片单元的基板在上，而设有薄膜晶体管阵列单元的基板在下。在本实施例中，下基板220与上基板230上的阴影部分为将被刀具切除的废材。所述切割机上设有控制装置(图未示)、图像识别装置240、第一刀具250和第二刀具260。第一刀具250用于切割上基板230，以形成薄膜晶体管阵列基板。第二刀具260用于切割下基板220，以形成彩色滤光片基板。上基板230与下基板220上分别具有第一刀具250和第二刀具 260在第一切割方向上的各个切割位置。本实施例中，如图2所示，所述第一切割方向为上基板230或下基板220的纵向。当然，在其他实施例中，所述第一方向可以为上基板或下基板的横向。所述控制装置中预设有指示第一刀具250和第二刀具260的各个所述切割位置的切割位置信息。本实施例中，图像识别装置240优选的为CCD，CCD具有摄取图形速度快，识别精度高的优点。在其他实施例中，还可以使用其他类型的图像识别装置240。
在S120中，在所述基材上设置基准对位标记，使得所述基准对位标记位于相邻两个所述切割位置之间。具体而言，如图3所示，上基板230上具有相邻的第一切割位置231和第二切割位置232。在上基板230上设置第一基准对位标记233，使得第一基准对位标记233位于第一切割位置231和第二切割位置232之间。如图4所示，下基板220上具有相邻的第三切割位置221和第四切割位置222。在下基板220上设置第二基准对位标记223，使得第二基准对位标记223位于第三切割位置221和第四切割位置222之间。第一基准对位标记233与第二基准对位标记223均包括两个对位标记，且两个所述对位标记的连线平行于所述第一切割方向。在其他实施例中，第一基准对位标记233或第二基准对位标记223中的对位标记数量，根据具体的设计需要而定。第一基准对位标记233与第二基准对位标记223正对设置，即第一基准对位标记233在下基板220上的投影位置与第二基准对位标记223重合。本实施例中，仅以所述刀具在所述第一方向上切割——即在纵向上切割上基板230与下基板220为例进行说明，因此仅仅描述了第一刀具250与第二刀具260的两个上述切割位置。实际的切割工艺中，所述刀具根据本实施例的切割方法100在所述基材的纵向与横向上进行连续切割。
在S130中，图像识别装置240摄取所述基准对位标记，并生成指示所述基准对位标记的基准位置信息。具体而言，机台210移动所述基材，使得第一基准对位标记233与所述第二基准对位标记223均位于图像识别装置240可扫描的范围之内。如图3和图4所示，图像识别装置240一次摄取到第一基准对位标记233，并分别生成指示第一基准对位标记233的第一基准位置信息，以及指示第二基准对位标记223的第二基准位置信息。
在S140中，所述控制装置根据图像识别装置240生成的所述第一基准位 置信息、所述第二基准位置信息，以及所述控制装置中预设的所述切割位置信息，控制第一刀具250依次移动到第一切割位置231处和第二切割位置232处进行切割，以及控制第二刀具260依次移动到第三切割位置221和第四切割位置222处进行切割。具体而言，如图3所示，所述控制装置根据所述第一基准位置信息和所述切割位置信息，确定第一基准对位标记233与第一切割位置231间的第一距离值，以及第一基准对位标记233与第二切割位置232间的第二距离值。然后，所述控制装置根据所述第一距离值，控制第一刀具250移动到与所述第一距离值对应的第一切割位置231处，之后第一刀具250执行切割操作。在第一切割位置231完成第一次切割后，所述控制装置根据所述第二距离值，控制第一刀具250直接由第一切割位置231处平移到第二切割位置232处，之后第一刀具250执行第二次切割操作。相应的，如图4所示，所述控制装置根据所述第二基准位置信息和所述切割位置信息，确定第二基准对位标记223与第三切割位置221间的第三距离值，以及第二基准对位标记223与第四切割位置222间的第四距离值。然后，所述控制装置根据所述第三距离值，控制第二刀具260移动到与所述第三距离值对应的第三切割位置221处，之后第二刀具260执行切割操作。在第三切割位置221完成第一次切割后，所述控制装置根据所述第四距离值，控制第二刀具260直接由第三切割位置221处平移到第四切割位置222处，之后第二刀具260执行第二次切割操作。
第一刀具250或第二刀具260存在行程极限值，所述行程极限值为第一刀具250或第二刀具260在垂直于所述第一切割方向上，本实施例中，即在所述基材的横向上，由第一基准对位标记233或第二基准对位标记223处平移到切割位置的单向最大行程。本实施例中，所述行程极限值为19mm。在其他实施例中，所述行程极限值根据具体的切割工艺而定。对于第一刀具250而言，其进行第一切割时，由第一基准对位标记233到第一切割位置231的横向移动距离应小于或等于19mm，即所述第一距离应小于或等于19mm；进行第二次切割时，第一刀具250由第一切割位置231起横向平移，经过第一基准对位标记233处，最终移动到第二切割位置232处。类似的，由第一基准对位标记233到第二切割位置232处的横向移动距离应也小于或等于19mm，即所述第二距离也应小于或等于19mm。即，第一切割位置231与第二切割位置232的间距 应该小于或等于2*19mm。在实际的液晶面板制造过程中，出于节约材料以及提高产量的考虑，通常上基板230上的第一基准对位标记233以及相邻所述切割位置的设计，均能满足所述行程极限值的要求。由此第一刀具250能够在所述行程极限值内进行平移，继而完成切割动作。对于第二刀具260而言，类似的，所述第三距离和所述第四距离均小于或等于19mm，第三切割位置221与第四切割位置222的间距小于或等于2*19mm。
由此，本实施例的切割方法，通过在上、下基板上分别设置第一基准对位标记和第二基准对位标记，图像识别模块仅需一次摄取所述第一基准对位标记和所述第二基准对位标记，控制模块就能确定第一刀具由所述第一基准对位标记处到两次切割位置的两个偏移距离，以及第二刀具由所述第二基准对位标记处到两次切割位置的两个偏移距离；控制装置即可根据上述偏移距离，分别控制所述第一刀具和所述第二刀具各完成两次切割；且在完成前次切割之后，所述第一刀具和所述第二刀具直接移动到下一次切割的位置继续切割。相比较现有技术，省去了一次机台传送基材工序和一次对位标记识别工序，从而简化了切割工艺，提高了切割效率。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易的想到各种等效的修改或替换，这些修改或替换都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以权利要求的保护范围为准。

Claims (13)

  1. 一种液晶面板的切割方法，用于切割基材以形成液晶面板，其中，所述切割方法包括：
    提供控制装置、图像识别装置和刀具，所述基材上具有所述刀具在第一切割方向上的各个切割位置，所述控制装置中预设有指示各个所述切割位置的切割位置信息；
    在所述基材上设置基准对位标记，所述基准对位标记位于相邻两个所述切割位置之间；
    通过所述图像识别装置摄取所述基准对位标记，并生成指示所述基准对位标记的基准位置信息；
    所述控制装置根据所述基准位置信息与所述切割位置信息，控制所述刀具依次移动到各个所述切割位置并进行切割。
  2. 根据权利要求1所述的切割方法，其中，所述控制装置根据所述基准位置信息与所述切割位置信息，控制所述刀具依次移动到各个所述切割位置并进行切割包括：
    所述控制装置根据所述基准位置信息与所述切割位置信息，确定所述基准对位标记与各个所述切割位置间的各个距离值；
    所述控制装置根据各个所述距离值控制所述刀具依次移动到与各个所述距离值对应的各个所述切割位置并进行切割。
  3. 根据权利要求2所述的切割方法，其中，所述基材包括上基板和下基板，所述刀具包括第一刀具和第二刀具，所述第一刀具用于切割所述上基板，所述上基板上具有所述第一刀具在所述第一切割方向上的第一切割位置与第二切割位置，所述第二刀具用于切割所述下基板，所述下基板上具有所述第二刀具在所述第一切割方向上的第三切割位置与第四切割位置，所述控制装置中预设有指示所述第一切割位置、所述第二切割位置、所述第三切割位置以及所述第四切割位置的切割位置信息。
  4. 根据权利要求3所述的切割方法，其中，所述基准对位标记包括第一基准对位标记与第二基准对位标记，所述第一基准对位标记位于所述第一切割 位置与所述第二切割位置之间，所述第二基准对位标记位于所述第三切割位置与所述第四切割位置之间。
  5. 根据权利要求4所述的切割方法，其中，所述通过所述图像识别装置摄取所述基准对位标记，并生成指示所述基准对位标记的基准位置信息包括：
    通过所述图像识别装置摄取所述第一基准对位标记与所述第二基准对位标记，生成指示所述第一基准对位标记的第一基准位置信息，以及指示所述第二基准对位标记的第二基准位置信息。
  6. 根据权利要求5所述的切割方法，其中，所述控制装置根据所述基准位置信息与所述切割位置信息，确定所述基准对位标记与各个所述切割位置间的各个距离值包括：
    所述控制装置根据所述第一基准位置信息与所述切割位置信息，确定所述第一基准对位标记与所述第一切割位置间的第一距离值，以及所述第一基准对位标记与所述第二切割位置间的第二距离值；所述控制装置根据所述第二基准位置信息与所述切割位置信息，确定所述第二基准对位标记与所述第三切割位置间的第三距离值，以及所述第二基准对位标记与所述第四切割位置间的第四距离值。
  7. 根据权利要求6所述的切割方法，其中，所述控制装置根据各个所述距离值控制所述刀具依次移动到与各个所述距离值对应的各个所述切割位置并进行切割包括：
    所述控制装置根据所述第一距离值与所述第二距离值，控制所述第一刀具依次移动到与所述第一距离值对应的所述第一切割位置以及与所述第二距离值对应的所述第二切割位置并进行切割；所述控制装置根据所述第三距离值与所述第四距离值，控制所述第二刀具依次移动到与所述第三距离值对应的所述第三切割位置以及与所述第四距离值对应的所述第四切割位置并进行切割。
  8. 根据权利要求4所述的切割方法，其中，所述第一基准对位标记与所述第二基准对位标记均包括两个对位标记，两个所述对位标记的连线平行于所述第一切割方向。
  9. 根据权利要求5所述的切割方法，其中，所述第一基准对位标记与所述第二基准对位标记均包括两个对位标记，两个所述对位标记的连线平行于所 述第一切割方向。
  10. 根据权利要求6所述的切割方法，其中，所述第一基准对位标记与所述第二基准对位标记均包括两个对位标记，两个所述对位标记的连线平行于所述第一切割方向。
  11. 根据权利要求7所述的切割方法，其中，所述第一基准对位标记与所述第二基准对位标记均包括两个对位标记，两个所述对位标记的连线平行于所述第一切割方向。
  12. 根据权利要求6所述的切割方法，其中，所述第一刀具或所述第二刀具具有行程极限值，所述第一距离值、所述第二距离值、所述第三距离值以及所述第四距离值均小于或等于所述行程极限值。
  13. 根据权利要求12所述的所述的切割方法，其中，所述行程极限值为19mm。
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