WO2017092694A1 - 摄像模组及其电气支架 - Google Patents

摄像模组及其电气支架 Download PDF

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Publication number
WO2017092694A1
WO2017092694A1 PCT/CN2016/108243 CN2016108243W WO2017092694A1 WO 2017092694 A1 WO2017092694 A1 WO 2017092694A1 CN 2016108243 W CN2016108243 W CN 2016108243W WO 2017092694 A1 WO2017092694 A1 WO 2017092694A1
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WO
WIPO (PCT)
Prior art keywords
camera module
electrical
bracket
stand
base
Prior art date
Application number
PCT/CN2016/108243
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
王明珠
张宝忠
陈振宇
黄桢
蒋恒
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201510868893.6A external-priority patent/CN105472219B/zh
Priority claimed from CN201510868840.4A external-priority patent/CN105472218B/zh
Priority claimed from CN201510868802.9A external-priority patent/CN105472217B/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to EP16870004.5A priority Critical patent/EP3386181B1/en
Priority to US15/780,532 priority patent/US10701255B2/en
Priority to KR1020187018609A priority patent/KR20180093963A/ko
Priority to JP2018528295A priority patent/JP2018538749A/ja
Priority to KR1020207031189A priority patent/KR102403631B1/ko
Publication of WO2017092694A1 publication Critical patent/WO2017092694A1/zh
Priority to JP2022000177A priority patent/JP7299360B2/ja

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/009—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras having zoom function
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the invention relates to the field of camera modules, and more particularly relates to a camera module and an electrical bracket and a circuit setting method thereof, and also relates to a high-precision electric bracket integrated driving coil or EMI (Electro Magnetic Interference) shielding conductive
  • EMI Electro Magnetic Interference
  • the camera module also has a trend of thin and light.
  • the traditional COB (Chip on Board) process camera module is composed of a soft and hard bonding board, a photosensitive chip, a mirror base, a motor drive, and a lens assembly.
  • Each electronic component is placed on the surface of the circuit board, and the devices do not overlap each other.
  • the imaging requirements of the camera module are also getting higher and higher, and the assembly difficulty is increased, and the device specifications are higher.
  • the base of the conventional camera module in order to make the base of the conventional camera module have a good supporting function, it must have a large size and occupy a large space, so that the size of the entire camera module is increased. If the size of the base is reduced to reduce the size of the camera module, the support of the base may be affected.
  • the circuit board of the conventional camera module is separately disposed at the bottom of the camera module, and is relatively far away from the components of the motor, the photosensitive chip, and the like that require energy supply.
  • This not only requires the consumption of more energy-conducting components, such as wires, but also does not adequately design the components that make up the circuit in the entire circuit arrangement of the camera module, thereby constituting the space occupied by the components of the circuit. Not being reasonably narrowed down. That is to say, if the relative positional relationship between the circuit board of the camera module and other components is reasonably arranged, the space occupied by the circuit components of the camera module can be further reduced, thereby further reducing the size of the camera module.
  • the assembly process of the assembled components includes: covering the surface of the circuit board with a steel mesh, brushing the solder paste, placing the electronic components one by one to the corresponding positions, and reflowing at 230 ° C.
  • FIG. 1 of the accompanying drawings illustrates an IC component mounting form in accordance with the prior art, wherein 101 refers to a wiring board. 102 refers to the IC component Pad on the circuit board. 103 means solder, and 104 means IC component (including capacitor, resistor, driver chip, DSP chip, etc.).
  • solder paste printing precision and electronic component attaching accuracy are far worse than the processing precision of the circuit board, and the component lead and baking process have the risk of assembly offset, the processing precision is poor or the thickness is large, and the module is affected. performance.
  • a drive motor which is an independently assembled component including a housing, a spring, a magnet, a carrier, a coil, a base, etc.
  • the outer casing, the elastic piece, the magnet, the carrier, the coil and the like are sequentially assembled to the base, and then fixed by glue or welding to realize assembly of the drive motor.
  • the accuracy of such an assembly process is far less than that of the camera module, and neither manual assembly nor mechanized automatic assembly can achieve rapid assembly in large quantities, and assembly accuracy is poor or the thickness is large.
  • the size of the group fluctuates greatly and the quality is difficult to guarantee.
  • FIG. 4 of the accompanying drawings illustrates a schematic structural view of a camera module according to the prior art, wherein the camera module includes a lens 1, a carrier 2, a voice coil motor 3, and a filter 4, a photosensitive chip 5 and a wiring board 6, wherein the lens 1 is connected to the carrier 2, the lens 1 and the carrier 2 are located in the middle of the voice coil motor 3, and the filter 4 is located in the photosensitive chip Between the lens 1 and the lens 1, the photosensitive chip 5 and the filter 4 are supported by the wiring board 6.
  • the voice coil motor 3 comprises a drive coil 31 which surrounds the carrier 2.
  • the motor needs to be soldered to the circuit board to realize the energizable connection of the motor.
  • the process complicated but it is also possible that many additional problems are caused by this welding process.
  • the product qualification rate is likely to be affected by the quality of the finished welding.
  • this welded connection is not secure and is susceptible to damage during use and maintenance.
  • the base is arranged between the motor and the base, the connection between the motor and the circuit board needs to cross the base, which not only occupies space, but also has relatively weak firmness.
  • the external soldering electrical connection between the motor and the base is more susceptible to the external environment, such as dust may affect the connection effect and service life.
  • the camera module In the manufacture of the camera module, according to the traditional COB (Chip on Board) process, the camera module is assembled by a soft and hard bonding board, a photosensitive chip, a mirror base, a motor drive, and a lens. Among them, each electronic component is placed on the surface of the circuit board, and the devices do not overlap each other.
  • the imaging module has a higher imaging requirement while reducing the volume, which further increases the difficulty of assembly.
  • the chip area will increase accordingly, and passive components such as driving resistors and capacitors will increase accordingly, so that the module size will inevitably have to be larger and larger, and thus the existing smart device camera module.
  • the thinning and miniaturization required for the package structure are contradictory, so there is a great need for a solution capable of compact camera modules or new packaging technologies to meet the trend of product development.
  • the base is arranged between the motor and the circuit board, the connection between the motor and the circuit board needs to cross the base, which not only occupies space, but also has relatively weak robustness.
  • the external soldering electrical connection between the motor and the base is more susceptible to the external environment, for example, dust may affect the connection effect and service life.
  • the base in order to make the base have a good supporting function, it must have a large size and occupy a large space, so that the size of the entire camera module is increased. If the size of the base is reduced to reduce the size of the camera module, the support of the base may be affected.
  • the circuit board of the conventional camera module is separately disposed at the bottom of the camera module, and is relatively far away from the components of the motor, the photosensitive chip, and the like that require energy supply. This not only requires the consumption of more energy-conducting components, such as wires, but also does not adequately design the components that make up the circuit in the entire circuit arrangement of the camera module, thereby constituting the space occupied by the components of the circuit. Not being reasonably narrowed down.
  • the space occupied by the circuit components of the camera module can be further reduced, thereby further reducing the size of the camera module, and also The width dimension or thickness dimension of the camera module can be selectively reduced according to market needs.
  • an electromagnetic shielding component needs to be added to ensure that the camera module does not interact with other electromagnetic wave sources or devices other than itself. Interplay, thus ensuring that the camera module is still extremely precise with minimal volume.
  • the traditional method is to wrap the metal casing, conductive cloth or conductive copper foil on the outside of the camera module, and then connect it to the grounding end of the camera module using conductive glue or conductive tape.
  • the assembly accuracy is far less than that of the camera module. No matter whether it is artificial wrapping or mechanized automatic wrapping, it can not be processed and assembled in large batches. Even because of poor assembly accuracy or large thickness, it is easy to make the final
  • the size of the camera module produced has fluctuated greatly, and the quality is difficult to guarantee, let alone pursue the aforementioned thinness and precision.
  • the conventional method generally adds a separate electromagnetic shielding component 96 to the camera module 90 in a wrapped or nested manner after the camera module 90 is assembled.
  • the electromagnetic shielding component 96 is usually made of a metal casing, a conductive cloth or a conductive copper foil, and is wrapped or nested outside the camera module 90, and then the electromagnetic shielding component 96 is connected to the camera module 90 by using conductive glue or conductive tape.
  • the ground terminal is used to achieve assembly of the electromagnetic shielding element 96.
  • the accuracy of the assembly method is often much smaller than that of the camera module 90.
  • the existing method can not be processed and assembled in large quantities in the electromagnetic shielding component 96.
  • Another object of the present invention is to provide a camera module and an electrical stand therefor, wherein the camera module includes a circuit, wherein the circuit is properly arranged to reduce the overall size of the camera module.
  • Another object of the present invention is to provide a camera module and an electrical stand therefor, wherein the camera module includes a circuit, wherein the circuit is well protected from external environment, such as dust.
  • Another object of the present invention is to provide a camera module and an electrical stand thereof, wherein the camera module includes a circuit, wherein the circuit includes a series of electronic components and a series of conductors, wherein the electronic component and the conductor are fixed It is set at a preset position and can maintain its preset relative position to ensure the stability of the circuit.
  • Another object of the present invention is to provide a camera module and an electrical stand therefor, wherein the camera module includes a circuit and an electrical stand, wherein the circuit is securely disposed on the electrical stand.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the electrical bracket structure is directly assembled by internal fitting due to the connection with the electronic components without structural members, and the precision and the accumulated offset and the tilt tolerance are reduced. .
  • Another object of the present invention is to provide a camera module and an electric bracket thereof, wherein the conductive medium conduction method replaces the solder paste, the assembly precision is increased, the thickness is thinned, the solder paste pollution is reduced, the module size is reduced, and the mold is improved. Group quality and manufacturing yield.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the electronic component is selected from an embedded electrical bracket, and the solder paste pin is not used, and the cost is reduced.
  • Another object of the present invention is to provide a camera module and an electric stand therefor, wherein the electric stand protects the product and improves product reliability.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the back focus limit of the conventional camera module can be reduced, and the module thickness can be reduced.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the camera module includes an electrical bracket, wherein the electrical bracket can be formed into any shape, and is used in addition to the function of the conventional base supporting motor. To set up the circuit to reduce the size of the entire camera module.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the camera module includes an electrical bracket, wherein the electrical bracket can be formed into any shape, and is used in addition to the function of the conventional base supporting motor. To set up the circuit to fully guarantee the stability and safety of the circuit of the camera module.
  • Another object of the present invention is to provide a camera module and an electrical stand thereof, wherein the electric stand integrates the functions of the base and the circuit board in the conventional camera module to make the structure more compact.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein a predetermined electronic component and a conductive sub-component are disposed on the electrical bracket to form a preset circuit between the electrical components.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the camera module has a small structural size and a thin thickness.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the electrical components of the camera module are embedded in the electrical bracket, eliminating module manufacturing processing, reducing process steps, and saving assembly costs.
  • Another object of the present invention is to provide a camera module and an electrical stand thereof, wherein the camera module has the advantages of small size and firm structure.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the resistor capacitor component of the camera module is embedded, thereby avoiding poor conduction of the module caused by solder resist, dust, etc. Product yield.
  • Another object of the present invention is to provide a camera module and an electric stand thereof, wherein the market competitiveness of the camera module is enhanced, thereby enhancing the market competitiveness of electronic devices using the camera module.
  • An object of the present invention is to provide a camera module and an electric stand thereof, wherein the electric stand includes an electric stand main body and a driving coil, wherein the electric stand is pre-manufactured by directly adopting the driving coil fitting manner.
  • the inside of the main body reduces the size space occupied by the assembly tolerances, and eliminates the labor and material loss that are assembled one by one.
  • Another object of the present invention is to provide a camera module and an electric bracket thereof, wherein a driving coil is prefabricated in the electric bracket to replace the original structural member, so that the processing precision of the camera module can be increased, the length and The thickness is reduced and thinned, and the peripheral size of the camera module is correspondingly reduced, thereby improving the competitiveness of the camera module and the satisfaction of the customer.
  • Another object of the present invention is to provide a camera module and an electrical support thereof, wherein the electrical branch is transmitted through
  • the driving coil is prefabricated in the frame to protect the camera module.
  • the structure can be connected in various ways. In some embodiments, the welding or gluing connection can be used to further enhance the connection. Product reliability.
  • Another object of the present invention is to provide a camera module and an electric bracket thereof, wherein the driving coil is prefabricated inside the electric bracket to replace the package of the back portion of the conventional conductive layer, thereby avoiding the package size and material. Loss and manpower increase, while increasing the reliability of shielding protection.
  • Another object of the present invention is to provide a camera module and an electric bracket thereof, wherein an external conductive connection of the driving coil and a voice coil motor (VCM) is prefabricated by the inside of the electric bracket, such as welding and conductive bonding.
  • VCM voice coil motor
  • EMI electromagnetic interference
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the camera module uses an electrical bracket that is provided with an integrated EMI shielding conductive layer as a base, thereby providing electromagnetic shielding capability for the camera module. There is no need to additionally wrap or attach electromagnetic shielding elements or materials before being used.
  • Another object of the present invention is to provide a camera module and an electric bracket thereof, the electric bracket is formed with an EMI shielding cover, and the EMI shielding cover matches the electrical bracket body of the electric bracket of the camera module, so that the electric bracket can be directly assembled
  • the camera module generates an electromagnetic shielding effect on the camera module by combining the electrical bracket body of the electric bracket.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, wherein the combination of the EMI shield and the electrical bracket to achieve an electromagnetic shielding effect can use various connections such as welding, gluing, electroplating, sedimentation, spraying, and the like. Ways to improve product reliability and reduce processes.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof that reduce assembly tolerances because there is no need to additionally wrap or attach electromagnetic shielding components.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, which are relatively small in size.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, the camera module having high precision.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, which have higher electromagnetic shielding effectiveness.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, which have fewer assembly steps.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, which assembly work is relatively simple.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, which assembly reduces the wear of the electromagnetic shielding material.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, which have increased assembly efficiency.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, which are reduced in assembly cost.
  • Another object of the present invention is to provide a camera module and an electrical bracket thereof, which have high product competitiveness and satisfaction based on the above advantages.
  • the present invention provides a camera module comprising:
  • the photosensitive chip is capable of receiving light passing through the optical lens, wherein the circuit is securely disposed on the supporting device to form an electrical bracket, the photosensitive chip being electrically connectable to the electrical bracket Circuit.
  • the circuit includes a plurality of electronic components, a set of conductors, wherein the set of conductors can be electrically connected to the electronic components in a predetermined manner.
  • the circuit further includes a series of connection elements, wherein the connection elements conduct the electronic components and the conductors to the photosensitive chip.
  • the support device includes a support body, wherein the electronic component is disposed to the support body.
  • the electronic component is embedded in the support body.
  • the conductor is disposed to the support body.
  • the conductor is embedded in the support body.
  • the support body has a bracket body surface, wherein the connecting element is disposed on the support body and is electrically connectable to the photosensitive chip on a surface of the bracket body.
  • the connecting element is disposed on a surface of the bracket body of the support body.
  • the circuit includes a plurality of electronic components and a series of connection elements, wherein the electronic components enable an electrically connectable connection to the photosensitive chip by the connection elements.
  • the support device includes a support body, wherein the electronic component is disposed to the support body.
  • the electronic component is embedded in the support body.
  • the electronic component is selected from the group consisting of a capacitor, a resistor, a driver chip, and a DSP chip, and combinations thereof.
  • the connecting element is selected from the group consisting of a pad and a pin.
  • it further includes a filter, wherein the filter is disposed on the light Between the lens and the sensor chip.
  • it further includes a motor, wherein the photosensitive lens is disposed to the motor, wherein the motor is supported by the support device.
  • the motor is electrically connectable to the electrical circuit.
  • it further includes a flexible circuit board, wherein the flexible circuit board is electrically connectable to the electrical circuit.
  • the connecting element includes a series of photosensitive chip connecting members for electrically connecting the photosensitive chip to the electronic component.
  • the connecting element further includes a series of circuit board connecting members for electrically connecting the flexible circuit board to the electronic component.
  • the connecting element further includes a series of motor connection components for electrically connecting the motor to the electronic component.
  • the present invention also provides an electrical stand for a camera module and comprising:
  • the circuit comprises a plurality of electronic components, a set of conductors, wherein the set of conductors is electrically connectable to the electronic components in a predetermined manner, wherein the circuitry is securely disposed to the support device.
  • the present invention further provides a camera module, including:
  • An electric bracket includes an electric bracket main body and a driving coil, and the driving coil is integrated in the electric bracket main body;
  • An optical lens located in the photosensitive path of the photosensitive chip
  • the camera module includes a flexible circuit board coupled to the electrical stand for connecting the sensor chip.
  • the camera module includes a filter disposed between the photosensitive chip and the optical lens and supported by the electrical support body.
  • the electrical stand body includes a base and a top wall, wherein the top wall of the ring extends to the base, the photosensitive chip is mounted in the base, the drive coil Embedded in the top wall or further in-line extending within the base.
  • the electrical stand body includes a base, the photosensitive chip is mounted in the base, and the drive coil includes a drive coil line and a drive coil body, the drive coil line A path is disposed on the base, and the drive coil body is electrically connected to the drive coil line and is located on a top side of the base to surround the carrier.
  • the drive coil circuit is embedded in the base.
  • the drive coil implements electromagnetic interference shielding protection of the camera module.
  • the drive coil is selected from one of a single layer metal, a multilayer metal, or a conductive non-metal monolithic, mesh, or parallel array structure.
  • the drive coil is manufactured in a manner selected from the group consisting of electroplating, sedimentation, spraying, welding, or gluing.
  • the present invention provides a camera module manufacturing method including the following steps:
  • the driving coil is selected from the group consisting of a single layer metal, a multilayer metal or a conductive non-metal whole piece, mesh, or parallel array structure.
  • the electrical bracket has both a function of a base and a wiring board for supporting and connecting the filter, the photosensitive chip and the carrier.
  • the present invention provides an electrical support integrated with a drive coil, comprising:
  • a driving coil is integrated in the main body of the electric device to electromagnetically sense with a magnet of a camera module to form a driving motor for driving an optical lens of the camera module to generate displacement.
  • the invention also provides an electrical bracket with an EMI shielding conductive layer, which is applied to a camera module, which comprises:
  • An electrical bracket body integrally provided with an electrical circuit
  • An EMI shielding conductive layer is disposed on the electrical bracket body to form an integral structure with the electrical bracket body, wherein a photosensitive chip of the camera module is conductively connected to the circuit of the electrical bracket body And disposed in the main body of the electric bracket, the EMI shielding conductive layer provides a shielding effect against electromagnetic interference.
  • the camera module is a fixed focus camera module, and a lens of the camera module is coupled to the electrical bracket body of the electrical bracket.
  • the electrical stand body includes a base and a top wall, the lens is located The photosensitive chip is assembled in the pedestal in the top wall.
  • the camera module is an autofocus camera module
  • the camera module further includes a motor electrically connected to the electrical bracket, the electrical bracket including a base and a a top wall, wherein the photosensitive chip is disposed in the base, the top wall extends from the base, and the motor is located in the top wall.
  • the EMI shielding conductive layer forms a unitary structure with the pedestal and the top wall.
  • the camera module is an autofocus camera module
  • the camera module further includes a motor electrically connected to the electrical bracket, the electrical bracket including a base, wherein The photosensitive chip is disposed in the base, wherein the EMI shielding conductive layer forms an integral structure with the base, and the camera module further includes an EMI shielding cover disposed around the motor and Located on the top side of the base.
  • the EMI shielding conductive layer is coupled to the EMI shield to form an integral shield structure.
  • the EMI shielding conductive layer is a unitary structure or a multi-segment independent structure.
  • the EMI shielding conductive layer is a single layer construction, a multilayer construction, a mesh construction, or a parallel array structure.
  • the EMI shielding conductive layer is made of a metallic material, a conductive non-metallic material, or a composite of metal and non-metal.
  • the position where the EMI shielding conductive layer is disposed on the electrical bracket is a bottom position of the camera module, a side annular wrapping, a separate position of the top opening, or a combination thereof.
  • the EMI shielding conductive layer is entirely embedded in the electrical bracket body or partially embedded in the electrical bracket body or outside the electrical bracket body.
  • the EMI shielding conductive layer is fabricated using electroplating, sedimentation, spray coating, welding, gluing, or die casting methods.
  • the EMI shielding conductive layer and the EMI shield are soldered, electrically bonded or lapped.
  • the present invention provides a camera module including:
  • the lens being located in a photosensitive path of the photosensitive chip
  • An electrical bracket includes an electrical bracket body and an EMI shielding conductive layer, the EMI shielding conductive layer being disposed on the electrical bracket body to form a unitary structure with the electrical bracket body, wherein the optical chip is conductively
  • the EMI shielding conductive layer is shielded from electromagnetic interference by being connected to the electrical bracket body and disposed in the electrical bracket body.
  • 1 is a method of setting a circuit of a camera module according to the prior art.
  • FIG. 2A is a cross-sectional view of a camera module in accordance with a first preferred embodiment of the present invention.
  • 2B to 2C illustrate a bracket of the camera module and a method of setting a circuit of the camera module according to the first preferred embodiment of the present invention.
  • 3A is a cross-sectional view of a camera module in accordance with a second preferred embodiment of the present invention.
  • 3B-3C illustrate a bracket of the camera module and a method for setting a circuit of the camera module according to the second preferred embodiment of the present invention.
  • FIG. 4 is a schematic view showing the structure of a prior art camera module including a driving coil.
  • FIG. 5 is a schematic cross-sectional view of a camera module and an electromagnetic shielding member according to the prior art.
  • Figure 6 is a schematic diagram of a camera module in accordance with a third preferred embodiment of the present invention.
  • Figure 7 is a schematic diagram of a camera module in accordance with a fourth preferred embodiment of the present invention.
  • Figure 8 is a cross-sectional view of a camera module and an electrical stand in accordance with a fifth preferred embodiment of the present invention.
  • FIG. 9 is a cross-sectional view of a camera module and an electrical stand in accordance with a sixth preferred embodiment of the present invention.
  • Figure 10 is a cross-sectional view showing a camera module and an electrical stand in accordance with a seventh preferred embodiment of the present invention.
  • Figure 11 is a cross-sectional view showing a camera module and an electric stand according to an eighth preferred embodiment of the present invention.
  • the camera module includes a support device 10, a circuit 20, a sensor chip 30, an optical lens 40, a motor 50, and a flexible circuit board 60.
  • the optical lens 40 is mounted to the motor 50, and the optical lens 40 can be driven by the motor 50 to be suitable for autofocus.
  • the flexible circuit board 60 and the motor 50 are disposed on different sides of the supporting device 10, so that the optical lens 40 is located in the photosensitive path of the photosensitive chip 30, so that when the camera module is used to collect images of objects, The light reflected by the object can be further accepted by the photosensitive chip 30 after being processed by the optical lens 40 to be suitable for photoelectric conversion. That is, in the present invention, the The support device 10 can be used to connect the flexible circuit board 60 and the motor 50. That is, the supporting device 10 simultaneously integrates the functions of the base and the circuit board of the conventional camera module for assembling the motor lens assembly and the flexible circuit board connecting the photosensitive chips.
  • the circuit 20 is used to turn on the various electrical components of the camera module, such as the motor 50 and the sensor chip 30, and to enable these electrical components to function.
  • the motor 50 can drive the optical lens 40 to focus the camera module.
  • the support device 10 includes a support body 11 and has a light-passing aperture 100 in which the light-passing aperture 100 is disposed.
  • the circuit 20 includes a plurality of electronic components 21, a set of conductors 22 and a series of connecting elements 23, wherein the set of conductors 22 can be electrically connected to the electronic component 21 in a predetermined manner and implemented by the connecting component 23 with the motor 50
  • the flexible circuit board 60 and the photosensitive chip 30 are electrically connected to form the circuit 20 of the camera module, so that the camera module has a preset function.
  • the electronic component 21 can be selected from, but not limited to, a capacitor, a resistor, a driver chip, and a DSP chip.
  • the electronic component 21 and the conductor 22 are embedded in the support body 11 made of a laminated resin, wherein the connecting member 23 is disposed on the support body 11.
  • the circuit 20 and the support device 10 together form an electrical support 1000, wherein the electrical support 1000 formed by the circuit 20 and the support device 10 as a whole can
  • the base of the conventional camera module supports the components of the camera module, and has the function of facilitating electrical conduction of various components of the camera module. Since the electronic component 21 and the conductor 22 of the circuit 20 are embedded in the support body 11, the arrangement of the circuit 20 is reasonably arranged, and the electrical bracket 1000 is equivalent in size to the base of the conventional camera module or Smaller, but able to integrate more features. This is in line with the market demand for thinner electronic devices.
  • the embedded design of the electronic component 21 and the conductor 22 is not only more reasonable in terms of space but also has many advantages.
  • the electronic component 21 and the conductor 22 are embedded in the support body 11 without being exposed to the external environment, thereby being protected from external environment, such as dust, to obtain more protection and prolong the service life. Extend the service life of the electric stand 1000 and the entire camera module.
  • the electronic component 21 and the conductor 22 are embedded in the support body 11, and the connection manner is fixed, and they do not interfere with each other due to the influence of the external environment.
  • the embedded arrangement is convenient, high precision, difficult to offset, and excellent in performance.
  • the arrangement of the conductor 22 is more reasonable, and the circuit arrangement is not disturbed due to the complicated structure of the circuit 20, for example, a disorder of the wires occurs.
  • the camera module further includes a filter 70, wherein the filter 70 is used to filter out stray light to further improve the image quality, wherein the filter 70 It is disposed between the optical lens 40 and the photosensitive chip 30.
  • the position at which the photosensitive chip 30 is disposed is adapted to the position of the light passing hole 100.
  • the photosensitive chip 30 is electrically connected to the support device 10. Specifically, the photosensitive chip 30 includes a series of The photosensitive chip guide 31 and a photosensitive chip main body 32 are disposed on the photosensitive chip main body 32.
  • the connecting element 23 of the circuit is arranged on the support body 11 of the support device 10. More specifically, the support body 11 has a bracket body surface 111, wherein the connecting component 23 is disposed on the bracket body surface 111 to facilitate the circuit 20 to guide the other components of the camera module through the connecting component 23.
  • the photosensitive chip 30 and the motor 50 according to the first preferred embodiment of the present invention enable the camera module to be regulated and have a preset function to improve the quality thereof.
  • the connecting component 23 includes a series of photosensitive chip connecting members 231, wherein the photosensitive chip guiding member 31 is electrically connected to the corresponding photosensitive chip connecting member 231, thereby realizing the photosensitive chip. 30 is energized with the interconnection of the circuit 20.
  • the photosensitive chip connecting member 231 is embodied as a photosensitive chip pad.
  • the photosensitive chip pad is soldered to the photosensitive chip 30.
  • the connection between the photosensitive chip pad and the photosensitive chip 30 can be implemented as, but not limited to, soldering.
  • the photosensitive chip 30 of the camera module adopts a solution of flipping the photosensitive chip.
  • the shape of the support body 11 can be set as needed.
  • the support device 10 is electrically connectable to the flexible circuit board 60.
  • the connecting element 23 of the support device 10 further comprises a series of circuit board connection members 232.
  • the flexible wiring board 60 includes a series of circuit board guides 61 and a circuit board main body 62, wherein the circuit board guides 61 are disposed on the circuit board main body 62.
  • the circuit board guide 61 is electrically connected to the corresponding circuit board connecting member 232, thereby achieving an energizable connection between the circuit 20 and the flexible circuit board 60, thereby enabling the electrical bracket to be electrically connected to the power supply device.
  • the support device 10 is attached to the flexible circuit board 60 such that the support device 10 is electrically connected to the 20 while being stably supported by the flexible circuit board 60.
  • the position of the board guide 61 on the board main body 62 is adapted to the position of the board connecting member 232 on the supporting device 10.
  • the flexible circuit board 60 can be electrically connected to the circuit 20.
  • the circuit board guide 61 is electrically connectable to the circuit board connecting member 232 on the support device 10, and the power connection can be, but is not limited to, soldering.
  • the board connection member 232 is embodied as a circuit board pad.
  • the electrical bracket 1000 is soldered to the flexible circuit board 60.
  • the connection between the support device 10 and the flexible circuit board 60 can be implemented as, but not limited to, For welding.
  • the connecting element 23 further includes a series of motor connecting members 233, wherein the motor connecting member 233 is disposed on the bracket body surface 111.
  • the motor connection member 233 is embodied as a motor pad. The motor pad is used to electrically connect the motor 50 to the circuit 20 to enable the motor 50 to be driven and further drive the optical lens 40 to adjust the camera module.
  • the motor 50 includes a series of motor guides 51 and a motor body 52, wherein the motor guides 51 are disposed to the motor body 52. It is worth mentioning that the position of the motor guide 51 on the motor body 52 is adapted to the position of the motor connecting member 233 on the support device 10. When the motor 50 is placed on the support device 10, the motor 50 can be electrically connected to the circuit 20. More specifically, the motor guide 51 is electrically connected to the motor connecting member 233 on the supporting device 10, and the energizable connection manner may be, but not limited to, ACP (Anisotropic Conductive Glue), ultrasonic welding, thermocompression bonding, Reflow soldering.
  • ACP Anisotropic Conductive Glue
  • the flexible circuit board 60 and the supporting device 10 are separately provided only for the example of the invention and not limitation. According to other embodiments of the present invention, the flexible circuit board 60 can also be integrally provided with the support device 10. In addition, the respective shapes or integral shapes of the flexible wiring board 60 and the supporting device 10 may be arbitrarily set as needed.
  • the connecting component 23 can be embodied as a pad or a pin or the like but is not limited to a pad and a pin. The invention is not limited in this respect.
  • the electronic component 21 of the circuit 20 and the conductor 22 are both embedded in the support body 11 merely by way of example and not limitation. According to other embodiments of the present invention, only a part of the electronic component 21 and the conductor 22 may be embedded in the support body 11 , and another part may be disposed elsewhere, for example, on the surface of the support body 11 . . Those skilled in the art should be able to understand that the present invention provides an arrangement of electronic components and conductors, but does not mean that all electronic components and conductors of the camera module must be embedded in the bracket body. The specific setting method can be set according to specific needs.
  • the electric stand 1000 according to the first preferred embodiment of the present invention comprises an IC component and a wire, that is, the wire originally laid on the circuit board is integrated into the electric stand, and only a small amount of wire is required on the circuit board.
  • the IC component mounting process in the SMT process is reduced, and the IC component is integrated into the support device 10 to form the electrical package 1000.
  • connection element 23 of the circuit 20 is disposed on the surface of the support body 11 and is merely an example and not a limitation of the invention. According to this In other embodiments of the invention, the connecting element 23 can also be in other arrangements.
  • the camera module includes a support device 10A, a circuit 20A, a sensor chip 30A, an optical lens 40A, a motor 50A, and a flexible circuit board 60A.
  • the optical lens 40A is mounted to the motor 50A, and the optical lens 40A can be driven by the motor 50A to be adapted for autofocus.
  • the flexible circuit board 60A and the motor 50A are disposed on different sides of the supporting device 10A, so that the optical lens 40A is located in the photosensitive path of the photosensitive chip 30A, so that when the camera module is used to collect an image of an object, The light reflected by the object can be further accepted by the photosensitive chip 30A after being processed by the optical lens 40A to be suitable for photoelectric conversion. That is, in the present invention, the supporting device 10A can be used to connect the flexible wiring board 60A and the motor 50A. That is, the supporting device 10A simultaneously integrates the functions of the base and the circuit board of the conventional camera module for assembling the motor lens assembly and the flexible circuit board connecting the photosensitive chips.
  • the circuit 20A is used to turn on the various electrical components of the camera module, such as the motor 50A and the sensor chip 30A, and to enable these electrical components to function.
  • the motor 50A can drive the optical lens 40A to focus the camera module.
  • the support device 10A includes a support body 11A and has a light passing hole 100A, wherein the light passing hole 100A is disposed in the support body 11A.
  • the circuit 20A includes a plurality of electronic components 21A and a series of connection elements 23A through which the electronic component 21A is electrically connected to the motor 50A, the flexible circuit board 60A, and the photosensitive chip 30A, thereby enabling electrical connection
  • the circuit 20A of the camera module is formed such that the camera module has a preset function.
  • the electronic component 21A can be selected from, but not limited to, a capacitor, a resistor, a driver chip, and a DSP chip.
  • the electronic component 21A is embedded in the support body 11A, wherein the connection member 23A is disposed on the support body 11A.
  • the circuit 20A and the supporting device 10A together form an electric stand 1000A, wherein the electric stand 1000A formed by the circuit 20A and the supporting device 10A as a whole can
  • the base of the conventional camera module supports the components of the camera module, and has the function of helping the various components of the camera module to perform electrical conductors. Since the electronic component 21A of the circuit 20A is embedded in the support body 11A, the arrangement of the circuit 20A is reasonably arranged, and the size of the base of the conventional camera module is equal to or smaller than that of the conventional camera module. Ability to integrate more features. This is in line with the market demand for thinner electronic devices.
  • the embedded design of the electronic component 21A is not only more reasonable in terms of space but also has many advantages.
  • the electronic component 21A is embedded in the support body 11A, which does not need to be exposed to the external environment, and is protected from external environment, such as dust, to obtain more protection, prolong the service life, and thereby extend the electrical support. 1000A and the life of the entire camera module.
  • the electronic component 21A is embedded in the support body 11A, and the connection mode is solid. The settings will not interfere with each other due to the influence of the external environment.
  • the embedded arrangement is convenient, high precision, difficult to offset, and excellent in performance.
  • the camera module further includes a filter 70A, wherein the filter 70A is used to filter out stray light to further improve the image quality, wherein the filter 70A It is disposed between the optical lens 40A and the photosensitive chip 30A.
  • the position where the photosensitive chip 30A is disposed is adapted to the position of the light passing hole 100A.
  • the photosensitive chip 30A is electrically connected to the support device 10A.
  • the photosensitive chip 30A includes a series of photosensitive chip guides 31A and a photosensitive chip main body 32A, wherein the photosensitive chip guides 31A are disposed on the photosensitive chip main bodies 32A.
  • the connecting element 23A of the circuit is disposed on the support body 11A of the support device 10A. More specifically, the support body 11A has a bracket body surface 111A, wherein the connecting component 23A is disposed on the bracket body surface 111A to facilitate the circuit 20A to guide the other components of the camera module through the connecting component 23A.
  • the photosensitive chip 30A and the motor 50A according to the second preferred embodiment of the present invention enable the camera module to be regulated and have a preset function to improve the quality thereof.
  • the shape of the support body 11A can be set as needed.
  • the support device 10A is electrically connectable to the flexible circuit board 60A and can be electrically connected to the power supply device.
  • the supporting device 10A is attached to the flexible wiring board 60A so that the supporting device 10A can be electrically connected to the 20 while the flexible wiring board 60A is stably supported.
  • the manner in which the board guide 61A is electrically connected to the support device 10A can be, but is not limited to, soldering.
  • the electric bracket 1000A is soldered to the flexible wiring board 60A.
  • the connection between the support device 10A and the flexible circuit board 60A can be implemented as, but not limited to, soldering.
  • the motor 50A includes a series of motor guides 51A and a motor body 52A, wherein the motor guides 51A are disposed to the motor body 52A.
  • the motor guide 51A is electrically connected to the connecting component 23A of the circuit 20A, and the energizable connection manner can be, but not limited to, ACP (Anisotropic Conductive Glue), ultrasonic welding, thermocompression bonding, reflow soldering.
  • the connecting component 23A can be embodied as a pad or a pin or the like but is not limited to a pad and a pin. The invention is not limited in this respect.
  • the electrical bracket 1000A of the camera module includes only IC components and does not include wires.
  • the pad under the electrical bracket is directly connected to the IC component.
  • the back focus of such a module can be greatly reduced.
  • the flexible circuit board 60A and the supporting device 10A are separately provided only for the example of the invention and not limitation. According to other embodiments of the present invention, the flexible circuit board 60A may also be integrally provided with the support device 10A. Further, the respective shapes or integral shapes of the flexible wiring board 60A and the supporting device 10A may be arbitrarily set as needed.
  • the camera module includes an electrical bracket body 310, a carrier 320, a sensor chip 330, an optical lens 340, one or more magnets 350, and a drive coil 360.
  • the plurality of magnets 350 are uniformly disposed on the carrier 320.
  • the electric stand includes the electric stand main body 310 and the drive coil 360, that is, the electric stand of the present invention integrates the drive coil 360.
  • the drive coil 360 of the conventional camera module is integrated into the electrical stand of the present invention, while other structures of the drive motor are independent of the electrical stand and are used to assemble the optical lens 340. That is, the drive coil 360, and the carrier 320 and the magnet 350 are configured to form a drive motor.
  • the optical lens 340 is mounted to the carrier 320, and the carrier 320 is driven to move the optical lens 340 to perform autofocus by electromagnetic induction of the magnet 350 and the drive coil 360. That is, the carrier 320 may be a structure of a conventional drive motor that can cooperate with the optical lens 340 and drive the optical lens 340 to generate displacement under electromagnetic induction.
  • the optical lens 340 when the optical lens 340 is disposed on the electrical bracket body 310 through the carrier 320, the optical lens 340 is driven by the plurality of magnets 350 and the driving coil 360 to perform auto focus.
  • the electrical bracket body 310 wraps the driving coil 360, that is, the electrical bracket body 310 is characterized in that, according to the circuit design, the driving coil of the driving coil assembled in the driving motor is required in the original camera module. Pre-fabricated or assembled on the electric bracket, so that the processing precision of the camera module is increased, the length and the thickness are reduced, and the peripheral size of the camera module is correspondingly reduced, in particular Therefore, the camera module of the structural design does not need to use a welding or gluing connection method to further improve product reliability.
  • the optical lens 340 is located in the photosensitive path of the photosensitive chip 330, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed after being processed by the optical lens 340.
  • the photosensitive chip 330 is accepted to be suitable for photoelectric conversion.
  • the electrical support body 310 includes a base 311 and a top wall 312 that extends perpendicularly from the base 311 and may be annular. It can be understood that the driving coil 360 can be embedded in the top wall 312 or disposed inside or outside the top wall 312. Accordingly, the electric stand body 310 of the present invention integrates the drive coil 360 to input a control current to the drive coil 360.
  • the electrical stand body 310 of the present invention is formed by forming a PCB circuit board of a conventional camera module to remove a holder of a conventional camera module.
  • the electrical support body 310 functions as the carrier 320 supporting the motor and conducting the photosensitive chip 330. That is, the electrical bracket body 310 A groove or a receiving cavity is formed inside for connecting the photosensitive chip 330.
  • the driving coil 360 is directly integrated into the electric bracket body 310, the input current can be directly transmitted to the driving coil 360, unlike in the structure of the conventional camera module, an electrical connection structure is required for the motor and the PCB.
  • the boards are connected.
  • the base 311 has a top side groove 3113 and a bottom side groove 3115 for assembling a filter 370 and the photosensitive chip 330 of the camera module.
  • the photosensitive chip 330 can be flipped in the groove 3112 on the bottom side.
  • the photosensitive chip 330 may also be directly received in the intermediate through hole 3114 formed by the base, and both ends thereof may be electrically connected to the inner surface of the base 311.
  • the base 311 may have an annular side wall 3111, and a bottom wall 3112 defining the grooves 3113 and 3115 and forming the through hole 3114. It will be appreciated that in other embodiments, the bottom wall 3112 may be absent.
  • the electrical stand body 310 also includes a series of connectors disposed on a surface of the electrical stand body, including a series of light sensor chip connectors, a series of circuit board connectors, and a series of electronic component connectors. Moreover, passive components such as capacitors and resistors are embedded in the electrical bracket 310, so that the electrical bracket 310 can match the corresponding photosensitive chip 330 and the external wiring device, and the electrical bracket 310 also integrates the driving.
  • the coil body of the coil 360 drives the coil body and drives the coil circuit to electrically connect the motor to directly supply power to the motor and input a control current thereto, thereby allowing the lens 311 to be moved to zoom.
  • the camera module includes a flexible circuit board that is coupled to the electrical bracket body 310.
  • the electrical bracket body 310 can also integrate the functions of the base and the circuit board of the conventional camera module.
  • the electrical bracket body 310 supports the photosensitive chip 330.
  • the photosensitive chip 330 is electrically connected to the electrical stand body 310.
  • the photosensitive chip 330 includes a series of photosensitive chip guides and a photosensitive chip main body, wherein the photosensitive chip guides are disposed on the photosensitive chip main body.
  • the electrical stand body 310 is electrically connectable to the photosensitive chip guide. That is, the photosensitive chip 330 is electrically connected to the electrical holder body 310, and the photosensitive chip 330 is allowed to operate normally.
  • the filter 370 of the camera module is used to filter out stray light to further improve the image quality.
  • the filter 370 is disposed between the photosensitive chip 330 and the optical lens 340 and supported by the electrical support body 310.
  • the filter 370 is an infrared cut filter.
  • the driving coil 360 is wrapped to the electric bracket body 310, wherein the driving coil 360 can appear in any form, including but not limited to a single layer, a multilayer metal or a conductive non-metal whole piece. Mesh, or parallel array structure.
  • the drive coil 360 can be disposed at any position of the electrical bracket body 310, including but not limited to a bottom portion of the module, a side annular wrap, and a separate position or combination of top surface openings.
  • the driving coil 360 is manufactured by way of example but not limited to electroplating, sinking Drop, spray, weld, glue.
  • the electrical bracket body is equivalent to including a carrier support portion, a filter support portion and a chip support portion, wherein the electrical support portion is vertically extended from the carrier support portion, and the filter
  • the light sheet supporting portion is recessed from the carrier supporting portion for supporting and fixing the filter 370, and the chip supporting portion is located below the filter supporting portion to fix the photosensitive chip 330, so that when The photosensitive chip 330 is disposed at the chip supporting portion, and the filter 370 is disposed on the filter supporting portion.
  • optical lens 340 When the optical lens 340 is disposed on the carrier supporting portion of the electric bracket body through the carrier 320
  • the optical lens 340 can be driven by the driving of the plurality of magnets 350 and the driving coil 360, and when the image of the object is obtained, the light reflected by the object can be used by the optical
  • the processing of the lens 340 is further accepted by the photosensitive chip 330 to be suitable for photoelectric conversion.
  • a camera module manufacturing and assembling method which includes the following steps:
  • a filter 370 is disposed on the electrical stand body 310;
  • the driving coil 360 may be disposed at any position of the electric bracket main body 310 or may appear in any form, such as a single layer, a multi-layer metal or a conductive non-metal whole piece or the like.
  • the electrical bracket body 310 has the functions of a base and a circuit board at the same time, and is also used for supporting and connecting the filter 370, the photosensitive chip 330, the optical lens 340, and the like.
  • the camera module includes an electrical bracket body 310, a carrier 320, a sensor chip 330, an optical lens 340, a plurality of magnets 350, and a drive coil 360.
  • the plurality of magnets 350 are uniformly disposed on the carrier 320.
  • the optical lens 340 is mounted to the carrier 320, and is movable by the magnet 350 and the drive coil 360 to drive the optical lens 340 to perform autofocus.
  • the drive coil 360 is prefabricated in the electrical bracket body 310.
  • the optical lens 340 is located in the photosensitive path of the photosensitive chip 330, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed after being processed by the optical lens 340.
  • the photosensitive chip 330 is accepted to be suitable for photoelectric conversion.
  • the camera module includes a flexible circuit board connected to the electrical bracket body 310, wherein the electrical bracket body 310 can simultaneously integrate the base of the conventional camera module and the work of the circuit board. It can function as a flexible wiring board for connecting the photosensitive chip 330.
  • the electrical bracket body 310 supports the photosensitive chip 330.
  • the photosensitive chip 330 is electrically connected to the electrical stand body 310.
  • the photosensitive chip 330 includes a series of photosensitive chip guides and a photosensitive chip main body, wherein the photosensitive chip guides are disposed on the photosensitive chip main body.
  • the electrical stand body 310 is electrically connectable to the photosensitive chip guide. That is, the photosensitive chip 330 is electrically connected to the electrical stand body 310.
  • the camera module includes a filter 370, wherein the filter is used to filter out stray light to further improve the image quality.
  • the filter 370 is disposed between the photosensitive chip 330 and the optical lens 340 and supported by the electrical support body 310.
  • the driving coil 360 is wrapped around the electric bracket body 310, wherein the driving coil 360 can appear in any form, such as a single layer, a multi-layer metal or a conductive non-metal whole piece. Shape, or parallel array structure.
  • the drive coil 360 can be disposed at any position of the electrical bracket body 310, including but not limited to a bottom portion of the module, a side annular wrap, and a separate position or combination of top surface openings.
  • the manner in which the drive coil 360 is manufactured includes, but is not limited to, electroplating, sedimentation, spraying, welding, gluing.
  • the drive coil 360 includes a drive coil line 361 and a drive coil body 362 connected to the drive coil line 361.
  • the drive coil body 362 surrounds the carrier 320 in which the plurality of magnets 350 are disposed.
  • the drive coil line 361 is then wrapped by the electrical stand body 310 to directly interconnect the power through the electrical stand body 310. That is, in this preferred embodiment of the invention, the electrical support body 310 may be free of the top wall 312 and only the base 311.
  • the drive coil line 361 is embedded in the base 311.
  • the drive coil body 362 is connected to the drive coil line 361 and is located around the carrier 320 to wrap the carrier 320.
  • the driving coil line 361 pre-fabricated by the driving bracket 360 inside the electric bracket main body 310 and the driving coil body 362 of a voice coil motor (VCM) are electrically connected, wherein the connecting process may be welding, conductive bonding,
  • VCM voice coil motor
  • the lap or the like further enables electromagnetic interference (EMI) shielding protection in multiple directions of the camera module. Therefore, the camera module can further improve the shielding effect while maximizing reliability.
  • EMI electromagnetic interference
  • the invention pre-manufactures or assembles the driving coil conductive layer which is originally assembled in the driving motor to the electric bracket of the invention, thereby reducing the size space occupied by the assembly tolerance, and eliminating the manual and material loss assembled one by one. And the machining accuracy is improved, and the size of the entire camera module is reduced.
  • the camera module 210 includes a lens 211, a motor 212, an electrical bracket 213, a filter 214, and a photosensitive chip 215.
  • the camera module 210 may further include a matching circuit board of the connection device, that is, a flexible circuit board FPC, or directly mounted on an electronic device having a matching line, thereby performing a camera function.
  • the lens 211 includes a plurality of lenses, and also has a set of housings 2111 (lenses) for providing protection and assisting in fixing and moving the lens 211.
  • the motor 212 is implemented as a surround lens 211 in this embodiment.
  • the driving mechanism has a permanent magnet and a coil, and has an opening at each end of the surrounding structure, the lower opening is matchedly connected to the electric bracket 213, and the upper opening is for the lens 211 to move on the side.
  • the camera module 210 is an auto-focus module, and the motor 212 can drive the casing 2111 of the lens connected thereto when the driving current is input, so that the lens approaches or Keep away from the photosensitive chip 215 to achieve the effect of zooming. It can be understood that in other embodiments, the camera module can also be a fixed focus camera module, which has no motor-like drive mechanism.
  • the electrical bracket 213 includes an EMI shielding conductive layer 2131, and an electrical bracket body 2132.
  • the electrical bracket body 2132 is made of a conventional PCB circuit board, that is, the conventional bracket is removed, and the PCB line is removed. The board simultaneously functions to provide a circuit and support the motor 212 and the photosensitive chip 215.
  • the circuit is disposed on the electrical bracket body 2132 and is adapted to be electrically connected to the photosensitive chip 215 and the motor 212.
  • the electrical bracket 213 also includes a series of connectors disposed on the surface of the electrical bracket body, including a series of photosensitive chip connectors, a series of circuit board connectors, and a series of electronic component connectors.
  • a passive component such as a capacitor or a resistor is embedded in the electrical bracket 213, so that the electrical bracket 213 can match the corresponding photosensitive chip 215 and the external line device, and the electrical bracket 213 can also be electrically connected.
  • the motor 212 supplies power of the motor 212 directly or indirectly and inputs a control current thereto, thereby allowing the lens 211 to be moved to zoom.
  • an EMI shielding conductive layer 2131 is embedded in the electrical bracket 213 along its bracket shape, so that the electrical bracket 213 itself has an electromagnetic shielding effect to avoid being in the EMI shielding. Electromagnetic waves between the photosensitive chip 215 on one side of the conductive layer 2131 and a part of the passive components such as capacitors and resistors embedded in the electric stand and the object on the other side of the EMI shielding conductive layer 2131 mutually induce or influence each other.
  • the EMI shielding conductive layer 2131 is comprised of copper, but those skilled in the art will appreciate that embodiments of the EMI shielding conductive layer 2131 should not be considered as part of the present invention.
  • the material of the EMI shielding conductive layer 2131 can also be changed to other metals, such as aluminum or steel, or for preventing constant and extremely low frequency magnetic fields, materials such as ferrite can also be used, It is limited to pure metal, or may be made of a composite material, or a conductive non-metal material, or a conductive conductive paint may be injected into the interlayer cavity reserved by the electrical bracket 213.
  • the material can be made into a single layer structure, a multilayer structure, a mesh structure, a parallel array structure, etc., and the effect of generating the EMI shielding conductive layer 2131 to shield electromagnetic influence can be achieved.
  • the manufacturing method of the EMI shielding conductive layer 2131 also includes, but is not limited to, electroplating, sedimentation, spraying, welding, gluing, and die casting.
  • the structural design of the EMI shielding conductive layer 2131 can be pre-fabricated in the interior of the electrical bracket 213 by a fitting manner because it does not require additional structural cooperation with the camera module 210, thereby reducing the number of the shielding layer.
  • the size space occupied by the assembly tolerances also eliminates the need for manual assembly and material loss due to high tolerances and artifacts.
  • the structural part is replaced by the prefabrication in the electric bracket 213
  • the processing precision is high, and the thinning and the thickness of the camera module 210 are thinned compared with the conventional extra coating method, so that the peripheral size of the camera module 210 is correspondingly reduced, and the product is improved. Competitiveness and customer satisfaction. What is more, the EMI shielding conductive layer 2131 can protect the camera module 210.
  • the prefabricated structure can be used without using a soldering or gluing connection, which further improves the reliability of the product.
  • the EMI shielding conductive layer 2131 and the electrical support body 2132 form a unitary structure, which may not be in the above-described embedded manner. That is, the EMI shielding conductive layer 2131 may be disposed at any position of the electrical bracket body 2132.
  • the EMI shielding conductive layer 2131 may be an integral structure or a multi-stage independent structure. It may be formed at the bottom of the camera module, or form a side annular wrap, or a separate location of the top opening or a combination of the above.
  • the present invention is not limited in this respect, and it merely forms an integral structure with the electric stand main body 2132 and functions to prevent electromagnetic interference.
  • the filter 214 is used to filter out stray light to further improve the image quality, for example, it may be an infrared cut filter.
  • the photosensitive chip 215 is configured to receive and sense light projected through the lens 211 to be output to the circuit board 20 or an electronic device having a matching line through the electrical bracket 213 in an electronic signal.
  • the filter 214 and the photosensitive chip 215 are both fitted and fixed to the electrical bracket 213, wherein the filter 214 is located on the side of the motor 212 that is coupled to the motor 212, and the photosensitive chip 215 is Located in the electrical bracket 213, light is passed through the lens 211 and then passed through the filter 214 to be projected onto the photosensitive chip 215.
  • the electrical bracket body 2132 of the electrical bracket 213 includes a base 21321, and a top wall 21322 extending from the base 21321 and disposed outside the motor 212, which is covered by
  • the EMI shielding conductive layer 2131 for protecting the camera module 210 is also embedded along the extended top wall. The inside thereof enhances electromagnetic wave protection for each element of the camera module 210 located inside the covering area of the electric bracket 213.
  • the pedestal 21321 is correspondingly formed with intermediate through holes, and grooves on the top side and the bottom side, respectively, to accommodate the filter 214 and the photosensitive chip 215, respectively.
  • each of the groove widths is larger than the intermediate through holes, and the photosensitive chip 215 is suitable for the flip-chip process to be attached to the electrical bracket 213.
  • the photosensitive chip 215 may also be disposed in the intermediate through hole, and both ends thereof may be electrically connected to the inner surface of the electric bracket 213.
  • the base 21321 can have an annular side wall and a bottom wall integrally formed with the side wall. In other embodiments, the bottom wall can be omitted.
  • a camera module 210A according to a sixth preferred embodiment of the present invention further includes an EMI shield 216A. And wherein the circumference of the base structure of the electric bracket 213A is not extended along the outer edge of the motor 212A, in other words, the electric bracket 213A is still in the base type, that is, the embodiment is described in this embodiment.
  • the electric bracket body 2132A of the electric bracket 213A does not form the top wall 21322 in the above embodiment.
  • the EMI shielding guide embedded in the electric bracket 213A The electrical layer 2131 extends outside the electrical bracket 213A along the outer edge of the motor 212A around the base structure formed by the electrical bracket 213A, and is electrically connected to the EMI shield 216A, thereby The EMI shielding conductive layer 2131 completely covers the camera module 210A in combination with the EMI shielding cover 216A, leaving only a part of the outer casing of the electrical bracket 213A and its associated components.
  • the manner in which the EMI shield 216A and the EMI shielding conductive layer 2131 are electromagnetically connected is bonded using conductive glue.
  • conductive glue any suitable material that can be used to bond to the EMI shielded conductive layer 2131 .
  • the EMI shielding cover 216A and the EMI shielding conductive layer 2131 may be electrically connected to each other, such as by conductive bonding, or only to each other, or by ultrasonic bonding with a metal gasket, or by conventional welding, or
  • the two can be electromagnetically connected to form a complete electromagnetic shielding mechanism, thereby avoiding electromagnetic leakage problems.
  • the EMI shield 216A may be constructed, for example, of a copper-containing material, but those skilled in the art will appreciate that the embodiment of the EMI shield 216A should not be considered as limiting the scope and scope of the present invention. In practical applications, the material of the EMI shielding cover 216A can also be changed to other metals, such as aluminum or steel, or to prevent constant and extremely low frequency magnetic fields, and materials such as ferrite can also be used, not limited to pure metals.
  • non-metallic materials made of composite materials or conductive materials, or coated with non-conducting materials such as organic plastics, coated with conductive paint, or made of single-layer structure, multi-layer structure, mesh structure, parallel array
  • the manufacturing method of the EMI shield 216A also includes, but is not limited to, electroplating, sedimentation, spraying, welding, gluing, and die casting.
  • the camera module 210 (210A) is a dynamic focus module, wherein the lens 211 (211A) can change the distance between the camera module 215 and the photosensitive chip 215 by the motor 212 (212A).
  • the present invention also provides a fixed focus module.
  • the casing 2111B is implemented as a lens for protecting and supporting the lens 211B.
  • the lens 211B is fixed to the electric bracket 213B by the casing 2111B.
  • the top wall 21322B extends from the outer periphery of the casing 2111B around the electric bracket 213B, so that the EMI shielding conductive layer 2131B embedded in the electric bracket 213B faces the camera module. 210B electromagnetic shielding.
  • the camera module 210C and the electromagnetic shielding member according to the eighth preferred embodiment of the present invention wherein the motor 212 (212A) is also absent, the casing 2111C is also implemented as a protection. And supporting the configuration of the lens 211C, the lens 211C is fixed to the electric bracket 213C by the casing 2111C.
  • the camera module 210C further includes an EMI shield 16C. And the circumference of the base structure in which the electric bracket 213C is not formed extends along the outer edge of the casing 2111C, in other words, the electric bracket 213C is still in the base type.
  • the EMI shielding conductive layer 2131C embedded in the electrical bracket 213C protrudes beyond the electrical bracket 213C along the outer edge of the casing 2111C around the base structure formed by the electrical bracket 213C, and
  • the EMI The shielding cover 16C is electrically connected, so that the EMI shielding conductive layer 2131C and the EMI shielding cover 16C are completely covered with the camera module 210C, leaving only a part of the outer casing of the electrical bracket 213C and its associated device. outer.
  • the camera module according to various embodiments of the present invention is only a preferred example for displaying an electrical bracket 213 and/or an EMI shield provided with a pre-made EMI shielding conductive layer 2131.
  • the 216A can be accurately and quickly applied to the assembly of camera modules to achieve electromagnetic shielding protection for different degrees or different types of camera modules.
  • those skilled in the art should understand that the embodiments of the EMI shielding conductive layer 2131 and the EMI shielding cover 216A should not be considered as limiting the content and scope of the present invention.
  • the EMI shielding conductive layer 2131 is partially distributed in the electric bracket 213, and coated (including plating, sedimentation, spraying, welding, gluing, and die casting, etc.) on the side of the electric bracket 213, and the
  • the electrical bracket 213 of the EMI shielding conductive layer 2131 is formed into a different shape or the wall 132 is extended in a different manner (including deformably covering the outside of the lens 211), or the EMI shielding cover 216A is implemented as Different shapes include using a transparent conductive material to completely close the outer side of the camera module 210A, the top surface opening, and only the partial area.
  • the electric stand main body 2132 may be disposed entirely outside the electric stand main body 2132 of the electric stand 213 or the like.
  • a method for assembling a camera module includes the following steps: (a.1) providing an EMI shielding conductive layer 2131 to an electrical bracket 213, (a.2) for electrically connecting a photosensitive chip 215 A photosensitive path of the lens 211 to the photosensitive chip 215 is fixed to the electrical bracket 213 and (a.3).
  • the step (a.3) may further include: (a.3.1) attaching a filter 214 to the electrical bracket 213, and (a.3.2) fixing a lens of the lens 211 to a set of shells. 2111, and (a.3.2) support to fix the casing 2111.
  • the step (a.3.2) may further include: (a.3.2.1) mounting the casing 2111 to a motor 212, and (a.3.2.2) fixing the motor 212 to the electric bracket 213.
  • the lens 211 is supported by the electrical bracket 213.
  • the step (a.1) is intended to provide the electromagnetic support 213 with electromagnetic shielding capability, thereby eliminating the advantages of the above-mentioned advantages such as improved processing precision, product thinning, improved product reliability, etc., in the assembly step.
  • the process of wrapping or wrapping the electromagnetic shielding tape or the like is required, thereby greatly reducing the assembly time and labor, and improving the assembly efficiency and improving the accuracy and reliability of the product.
  • the step (a.2) is based on the electrical bracket 213 itself, that is, the circuit and related components are pre-embedded, so that the photosensitive chip 215 can be directly electrically connected thereto.
  • the step (a.3) further fixes the lens 211 to the appropriate position of the electric bracket 213, so that the light can pass through the lens 211 and can be projected onto the photosensitive chip 215 to form an image, thereby completing the fixed focus camera module.
  • the step (a.3.1) is to attach the filter 214 to the electrical bracket 213, so as to reduce or avoid the influence of specific stray light when the camera module is imaged.
  • the filter 214 can be disposed between the lens 211 and the photosensitive chip 215. Thereby achieving the effect of first filtering and then sensitizing.
  • the step (a.3.2) is to indirectly fix the lens 211 to the corresponding position on the electric bracket 213 by using the sleeve 2111, so that the light can pass through the lens 211 and can be projected onto the photosensitive chip 215, thereby imaging. .
  • the step (a.3.2.1) and the step (a.3.2.2) need to be utilized.
  • the step (a.3.2.1) is mainly to further load the lens 211 equipped with the casing 2111 into the motor 212 matching the casing 2111, so that the motor 212 can move the motor 212 independently or in cooperation with the casing.
  • the lens 211 thereby allowing the external device or line to achieve the purpose of zooming by controlling the motor 212 to move the lens 211, and thus the motor 212 is fixed to the electric bracket 213 by the step (a.3.2.2).
  • the motor 212 moves the lens 211, the lens 211 is moved relative to the photosensitive chip 215 fixed to the electrical bracket 213.
  • a method of assembling a camera module according to another preferred embodiment of the present invention further includes the following steps: (a.4) attaching an EMI shield 216A to the electrical bracket 213A.
  • the step (a.4) may further include: (a.4.1) covering an EMI shield 216A to the electrical bracket 213A and (a.4.2) electrically connecting the EMI shield 216A and the EMI shield Conductive layer 2131A.
  • the step (a.4) is to provide an electromagnetic shielding effect for the camera module 210A by using a pre-fabricated EMI shield 216A in cooperation with the electrical bracket 213A, thereby achieving a more perfect electromagnetic shielding protection.
  • This method uses a pre-fabricated EMI shield 216A that differs from conventional wound or wrapped electromagnetic shielding tape or the like in that the pre-fabricated EMI shield 216A can be used to precisely control the thickness and ensure uniform thickness of each part.
  • the pre-fabricated EMI shield 216A can be used to precisely control the thickness and ensure uniform thickness of each part.
  • the step (a.4.1) and the step (a.4.2) are when the EMI shielding cover 216A is not used, when the EMI shielding cover 216A is covered on the electric bracket 213A to jointly cover the
  • conductive adhesive, conductive paste, soldering, painting or other means to fix the EMI shield 216A and the electrical bracket 213 and ensure that the two are electrically connected to each other or fill between the two without conductivity. Voids to avoid electromagnetic leakage or enhance electromagnetic shielding.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lens Barrels (AREA)
PCT/CN2016/108243 2015-12-01 2016-12-01 摄像模组及其电气支架 WO2017092694A1 (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP16870004.5A EP3386181B1 (en) 2015-12-01 2016-12-01 Photographing module and electric bracket thereof
US15/780,532 US10701255B2 (en) 2015-12-01 2016-12-01 Photographing module and electric bracket thereof
KR1020187018609A KR20180093963A (ko) 2015-12-01 2016-12-01 촬상 모듈 및 그의 전기적 지지체
JP2018528295A JP2018538749A (ja) 2015-12-01 2016-12-01 撮像モジュール及びその電気支持体
KR1020207031189A KR102403631B1 (ko) 2015-12-01 2016-12-01 촬상 모듈 및 그의 전기적 지지체
JP2022000177A JP7299360B2 (ja) 2015-12-01 2022-01-04 撮像モジュール及びその電気支持体（ｐｈｏｔｏｇｒａｐｈｉｎｇ ｍｏｄｕｌｅ ａｎｄ ｅｌｅｃｔｒｉｃ ｂｒａｃｋｅｔ ｔｈｅｒｅｏｆ）

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CN201510868840.4 2015-12-01
CN201510868893.6A CN105472219B (zh) 2015-12-01 2015-12-01 集成驱动线圈的电气支架和摄像模组及其应用
CN201510868840.4A CN105472218B (zh) 2015-12-01 2015-12-01 摄像模组和电气支架及其组装方法和应用
CN201510868802.9 2015-12-01
CN201510868893.6 2015-12-01
CN201510868802.9A CN105472217B (zh) 2015-12-01 2015-12-01 具有emi屏蔽导电层的电气支架和摄像模组及其组装方法

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EP3386181A4 (en) 2019-07-31
EP3386181B1 (en) 2022-04-06
JP2022036323A (ja) 2022-03-07
JP7299360B2 (ja) 2023-06-27
KR20200125771A (ko) 2020-11-04
KR20180093963A (ko) 2018-08-22
JP2018538749A (ja) 2018-12-27
KR102403631B1 (ko) 2022-05-30
EP3386181A1 (en) 2018-10-10
US10701255B2 (en) 2020-06-30
US20180352127A1 (en) 2018-12-06

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