WO2017085840A1 - Appareil lié au montage de pièces et son procédé de réglage - Google Patents

Appareil lié au montage de pièces et son procédé de réglage Download PDF

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Publication number
WO2017085840A1
WO2017085840A1 PCT/JP2015/082589 JP2015082589W WO2017085840A1 WO 2017085840 A1 WO2017085840 A1 WO 2017085840A1 JP 2015082589 W JP2015082589 W JP 2015082589W WO 2017085840 A1 WO2017085840 A1 WO 2017085840A1
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WIPO (PCT)
Prior art keywords
component
leveling
sheet
curved surface
component mounting
Prior art date
Application number
PCT/JP2015/082589
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English (en)
Japanese (ja)
Inventor
隆志 城戸
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2015/082589 priority Critical patent/WO2017085840A1/fr
Priority to JP2017551470A priority patent/JP6983658B2/ja
Publication of WO2017085840A1 publication Critical patent/WO2017085840A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • F16F15/08—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with rubber springs ; with springs made of rubber and metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members

Definitions

  • the present invention relates to a component mounting related apparatus and a method for installing the same.
  • a component supplied from a component supply apparatus is adsorbed to a nozzle provided in a moving body (for example, an XY robot), and the component adsorbed by the nozzle is moved to a predetermined position on the substrate by moving the moving body.
  • a component mounting apparatus for mounting a component at the predetermined position is known.
  • Such a component mounting apparatus has a leveling bolt, and the lower end of the leveling bolt is placed on a steel leveling sheet laid on the floor where the component mounting apparatus is installed.
  • the component mounting apparatus vibrates due to the movement of the moving body during the component mounting operation.
  • the component mounting apparatus is integrally connected via the leveling bolt and the leveling sheet, the vibration of the apparatus is transmitted to the floor.
  • Patent Document 1 describes that if a rubber sheet is laid between the leveling sheet and the floor, vibration energy transmitted to the floor is reduced by elastic deformation of the rubber sheet.
  • JP-A-11-214887 (paragraphs 0002 and 0003)
  • the present invention has been made to solve the above-described problems, and has as its main object to suppress vibration of the component mounting related device itself easily and inexpensively.
  • the component mounting related apparatus of the present invention is An apparatus main body for performing positioning control of the moving body in relation to mounting the component on the board;
  • a leveling bolt provided in the apparatus main body, the lower surface of which is a convex curved surface;
  • the upper surface is a concave curved surface, and the leveling sheet that receives the convex curved surface of the leveling bolt with the concave curved surface,
  • the leveling sheet has a rubber magnet sheet in which magnetic powder is dispersed in a rubber matrix in at least one place between the upper surface, the lower surface and the upper and lower surfaces of the leveling sheet. Is.
  • This component mounting related device has a rubber magnet sheet (also referred to as a magnet sheet) in which magnetic powder is dispersed in a rubber matrix at least at one position between the upper surface, the lower surface and the upper and lower surfaces of the leveling sheet. Due to the presence of the rubber magnet sheet, the intensity of the vibration frequency of the apparatus main body becomes very small, and vibration can be suppressed very effectively. In particular, it is epoch-making in that not only vibration transmitted from the apparatus main body to the floor but also vibration of the apparatus main body itself can be suppressed.
  • examples of the apparatus main body that executes the positioning control of the moving body in relation to mounting the component on the substrate include a component mounting apparatus, an adhesive application apparatus, and a flux application apparatus.
  • the apparatus main body may be capable of performing positioning control without executing machine base vibration compensation.
  • the vibration of the apparatus main body itself can be suppressed. Therefore, even if positioning control is executed without executing machine base vibration compensation, components can be mounted with high accuracy. it can. Moreover, the time required to reach the target deviation can be shortened compared to when the machine vibration compensation is executed.
  • the device main body collects a component from the component supply unit on the movable body, moves the movable body to carry the component to a predetermined position on the substrate, and moves the component to the predetermined position. It is good also as what is mounted in the said predetermined position. Since this type of component mounting apparatus requires high accuracy in positioning control of the moving body, it is highly meaningful to apply the present invention.
  • the method of installing the component mounting related apparatus of the present invention is as follows.
  • An apparatus main body that performs positioning control of a moving body in association with mounting a component on a board, a leveling bolt that is provided on the apparatus main body and that has a lower surface that is a convex curved surface, and an upper surface that is a concave curved surface, and the leveling bolt
  • a leveling sheet that receives the convex curved surface of the concave curved surface
  • a component mounting related device installation method that installs a component mounting related device provided on a floor surface
  • a rubber magnet sheet is disposed at least at one position between the upper surface, the lower surface, and the upper and lower surfaces of the leveling sheet, and then the leveling bolt of the apparatus body is placed on the leveling sheet. Due to the presence of the rubber magnet sheet, the intensity of the vibration frequency of the apparatus main body becomes very small, and vibration can be suppressed very effectively. In particular, it is epoch-making in that not only vibration transmitted from the apparatus main body to the floor but also vibration of the apparatus main body itself can be suppressed. Thus, according to the installation method of the component mounting related apparatus of the present invention, the vibration of the component mounting related apparatus itself can be easily and inexpensively suppressed.
  • the apparatus main body may be capable of performing positioning control without executing machine vibration compensation.
  • the vibration of the apparatus main body itself can be suppressed. Therefore, even if positioning control is executed without executing machine base vibration compensation, components can be mounted with high accuracy. it can. Moreover, the time required to reach the target deviation can be shortened compared to when the machine vibration compensation is executed.
  • the device main body collects a component from a component supply unit on the movable body, and moves the movable body to carry the component to a predetermined position on the substrate. It is good also as a component mounting apparatus which mounts the said component in the said predetermined position. Since this type of component mounting apparatus requires high accuracy in positioning control of the moving body, it is highly meaningful to apply the present invention.
  • FIG. 1 is a configuration diagram of a component mounting apparatus 1.
  • FIG. FIG. 6 is a partial cross-sectional view of the support leg 60.
  • the graph which shows a modal test result.
  • the graph which shows a positioning waveform.
  • FIG. 1 is a configuration diagram of the component mounting apparatus 1
  • FIG. 2 is a partial sectional view of a support leg 60
  • FIG. 3 is a graph showing a modal test result
  • FIG. 4 is a graph showing a positioning waveform. 1 is the X-axis direction
  • the front (front) and rear (back) directions are the Y-axis directions
  • the vertical direction is the Z-axis directions.
  • the component mounting apparatus 1 includes an apparatus main body 10 and support legs 60.
  • the apparatus main body 10 includes a machine base 11 and a frame 12 supported by the machine base 11.
  • a support base 14 is provided at the lower part of the frame 12.
  • the apparatus main body 10 includes a component supply apparatus 20, a substrate transfer apparatus 30, a head 40, an XY robot 50, and a control apparatus 58 that controls the entire apparatus.
  • a plurality of the component supply devices 20 are arranged on the support base 14 so as to be aligned in the left-right direction (X-axis direction).
  • the component supply device 20 is a tape feeder that sends out a carrier tape containing components at a predetermined pitch to a component supply position where the head 40 (nozzle 42) can pick up.
  • the carrier tape includes a bottom tape in which cavities (recesses) are formed at a predetermined pitch in the longitudinal direction, and a top film attached to the upper surface of the bottom tape in a state where components are accommodated in the respective cavities. Become.
  • the substrate transfer device 30 is configured as a dual lane transfer device provided with two substrate transfer paths in the present embodiment, and is a front-rear direction (Y-axis direction) of the support base 14. It is installed in the center.
  • the substrate transport device 30 includes a belt conveyor device 32, and transports the substrate S from the left to the right (substrate transport direction) in FIG.
  • a backup plate 34 that can be moved up and down by a lifting device (not shown) is provided at the center of the substrate transporting device 30 in the substrate transporting direction (X-axis direction).
  • a plurality of pins 36 are provided on the upper surface of the backup plate 34.
  • the head 40 is a moving body that can be moved to an arbitrary position on the XY plane by the XY robot 50.
  • the head 40 causes the component supplied by the component supply device 20 to be adsorbed by the nozzle 42 and mounted on the substrate S transferred by the substrate transfer device 30.
  • the XY robot 50 includes a pair of left and right Y-axis guide rails 51 provided on the upper portion of the frame 12 along the front-rear direction (Y-axis direction) and a pair of left and right Y-axis guide rails 51.
  • a long Y-axis slider 52 that can be moved along the Y-axis guide rail 51 in a bridged state, and an X-axis provided on the lower surface of the Y-axis slider 52 along the left-right direction (X-axis direction)
  • a guide rail 53 and an X-axis slider 54 that can move along the X-axis guide rail 53 are provided.
  • a head 40 is attached to the X-axis slider 54.
  • the XY robot 50 can move the head 40 to an arbitrary position on the XY plane by being controlled by the control device 58.
  • the control device 58 is configured as a microprocessor including a CPU, a ROM, a RAM, and the like, and executes positioning control of the XY robot 50 in association with mounting the component supplied from the component supply device 20 on the substrate S. .
  • the support leg 60 is for installing the apparatus main body 10 on the floor surface F in which the surface of the concrete floor is resin-coated.
  • the support leg 60 includes a leveling bolt 62, a leveling sheet 64, and a rubber magnet sheet 66.
  • the leveling bolts 62 are made of metal (for example, made of stainless steel) and are provided so as to protrude downward from the four corners of the lower surface of the machine base 11 of the apparatus main body 10.
  • the leveling bolt 62 is a stepped bolt as shown in FIG. 2.
  • the lower step is thicker than the upper step, and the lower surface of the lower step is a convex curved surface 62a.
  • the leveling bolt 62 is screwed to the bottom plate of the machine base 11, and the height of the device body 10 from the floor surface is adjusted by adjusting the screwing amount (screwing amount) or the device body 10 is supported horizontally. You can do it.
  • the leveling sheet 64 is a disk-shaped member made of metal (for example, stainless steel), and the upper surface is a concave curved surface 64a, and the convex curved surface 62a of the leveling bolt 62 is received by the concave curved surface 64a. Therefore, the convex curved surface 62 a of the leveling bolt 62 can be displaced while being in contact with the concave curved surface 64 a of the leveling sheet 64.
  • the rubber magnet sheet 66 is a disk-shaped sheet in which magnetic powder is dispersed in a rubber matrix, and is disposed between the lower surface of the leveling sheet 64, that is, between the leveling sheet 64 and the floor surface F.
  • “A4 MAGNET SHEET magnet sheet” sold by Daiso Japan Daiso Sangyo Co., Ltd.
  • the thickness of the rubber magnet sheet 66 is about 1 to 2 mm.
  • the leveling sheet 64 with the rubber magnet sheet 66 attached to the lower surface is arranged at predetermined four locations on the floor surface F.
  • the rubber magnet sheets 66 are disposed at four predetermined locations, and the leveling sheet 64 is placed on the rubber magnet sheets 66.
  • the convex curved surface 62 a of the leveling bolt 62 of the apparatus main body 10 is placed on the concave curved surface 64 a of the leveling sheet 64.
  • the control device 58 of the apparatus main body 10 mounts components on the board S based on a production job provided from a management computer (not shown)
  • the control device 58 causes the nozzle 42 of the head 40 to collect the components supplied from the component supply device 20.
  • the control device 58 controls the XY robot 50 to move the nozzle 42 directly above the component supply position of the desired component.
  • the control device 58 controls a Z-axis motor and a pressure adjusting device for the nozzle 42 (not shown) so as to lower the nozzle 42 and supply negative pressure to the nozzle 42. Thereby, a desired part is adsorbed to the tip of the nozzle 42.
  • the control device 58 raises the nozzle 42 and controls the XY robot 50 to carry the component adsorbed on the tip of the nozzle 42 to above the predetermined position of the substrate S (positioning control). Then, at the predetermined position, the control device 58 controls the lowering of the nozzle 42 so that the atmospheric pressure is supplied to the nozzle 42. Thereby, the components adsorbed by the nozzle 42 are separated and mounted at a predetermined position on the substrate S. Other components to be mounted on the substrate S are similarly mounted on the substrate S.
  • the control device 58 can switch between valid / invalid of machine base compensation control by a switch operation by an operator.
  • the machine compensation control is control that uses the filter K (s) of Example 1 of Japanese Patent No. 4840987, and realizes reduction of residual vibration and reduction of movement time during execution of positioning control. Can do.
  • a modal test which is a test for investigating the natural vibration of the device, will be described.
  • the component mounting apparatus 1 of the present embodiment the one in which the rubber magnet sheet 66 of the support leg 60 of the component mounting apparatus 1 is omitted (Comparative Form 1), and the rubber magnet sheet of the support leg 60 of the component mounting apparatus 1 are used.
  • a high-attenuation rubber sheet not containing magnetic powder (a vibration-proof rubber sheet manufactured by Modal Test Kurashiki Processing Co., Ltd.) (Comparative Form 2) was prepared.
  • the result of the modal test is shown in FIG. In FIG. 3, black circles are points representing machine vibration.
  • Machine vibration is a phenomenon that causes the device itself to vibrate from the foot due to the drive reaction force of this type of component mounting device, and is the lowest frequency vibration among the natural vibrations of the device, impeding high-speed performance. As a factor to account for, the ratio is large.
  • the frequency of the machine vibration is lower in the comparative example 2 using the high attenuation rubber sheet than in the comparative example 1 in which the rubber magnet sheet or the high attenuation rubber sheet is not used. Increased (decrease in attenuation).
  • the attenuation increased so that the frequency of the machine base vibration could not be clearly identified.
  • the component mounting apparatus 1 of the present embodiment and the one in which the rubber magnet sheet 66 of the support leg 60 of the component mounting apparatus 1 is omitted were prepared.
  • positioning waveform was measured by executing positioning control in a state in which machine compensation control was disabled.
  • For comparative form 1 in addition to executing positioning control with machine base compensation control disabled and measuring positioning waveform (comparative form 1-1), positioning waveform measured with machine base compensation control enabled (Comparative Form 1-2). The result is shown in FIG. FIG. 4 shows a waveform at the positioning end (zero deviation). As can be seen from FIG.
  • the intensity of the vibration frequency of the apparatus body 10 becomes very small, and vibration can be suppressed very effectively.
  • vibration can be suppressed very effectively.
  • not only vibration transmitted from the apparatus main body 10 to the floor but also vibration of the apparatus main body 10 itself can be suppressed.
  • This is an effect obtained by combining the rubber magnet sheet 66 with the configuration of the leveling bolt 62 having the convex curved surface 62a on the lower surface and the leveling sheet 64 having the concave curved surface 64a for receiving the convex curved surface 62a.
  • the vibration of the apparatus main body 10 itself can be easily and inexpensively suppressed.
  • vibration of the apparatus main body 10 itself can be suppressed, even if positioning control is executed without executing machine base vibration compensation, components can be mounted with high accuracy. . Moreover, the time required to reach the target deviation can be shortened compared to when the machine vibration compensation is executed.
  • this type of component mounting apparatus 1 is required to have high accuracy in positioning control of the head 40 on which the nozzle 42 is mounted, the significance of applying the present invention is high.
  • the rubber magnet sheet 66 is disposed on the lower surface of the leveling sheet 64, but the rubber magnet sheet 166 may be disposed on the concave curved surface 64a of the leveling sheet 64 as shown in FIG. In this case, the rubber magnet sheet 166 is sandwiched between the leveling bolt 62 and the leveling sheet 64. Further, as shown in FIG. 6, a rubber magnet sheet 266 may be disposed between the upper and lower surfaces of the leveling sheet 264. In the case of FIG. 5 and FIG. 6, the same effect as the above-described embodiment can be obtained.
  • the A4 magnet sheet sold by Daiso Japan is exemplified as the rubber magnet sheet 66, but other rubber sheets may be used.
  • a rubber magnet sheet disclosed in Japanese Patent Application Laid-Open No. 2006-199814 specifically, a rubber magnet sheet obtained by dispersing ferrite magnetic powder or rare earth magnetic powder in a matrix composed of rubber components. Also good.
  • the apparatus main body 10 collects a part from the part supply apparatus 20 onto the head 40 that is a moving body, and moves the part 40 to a predetermined position on the substrate S to move the part to a predetermined position.
  • the position it may be anything as long as it performs positioning control of the moving body in connection with mounting the component on the board S.
  • a component fixing adhesive (or flux) mounted on the moving body may be applied to a predetermined position of the substrate S.
  • control device 58 capable of executing the machine compensation control is used, but a control device that cannot execute the machine compensation control may be used. This is because the vibration of the apparatus main body 10 itself can be suppressed without executing the machine base compensation control.
  • the convex curved surface 62a of the leveling bolt 62 is brought into contact with the concave curved surface 64a of the leveling sheet 64.
  • a universal joint or a ball joint may be configured based on this structure.
  • the leveling bolt 62 and the leveling sheet 64 are not integrated, but the convex curved surface 62a of the leveling bolt 62 can be displaced while being in contact with the concave curved surface 64a of the leveling sheet 64. If they can be maintained, both may be integrated.
  • only one rubber magnet sheet 66 is provided, but two or more layers may be provided. Further, the rubber magnet sheet 66 may be used in combination with an anti-slip sheet.
  • the present invention is applicable to, for example, a component mounting apparatus, an adhesive application apparatus, a flux application apparatus, and the like.
  • 1 component mounting device 10 device body, 11 machine base, 12 frame, 14 support base, 20 component supply device, 30 substrate transport device, 32 belt conveyor device, 34 backup plate, 36 pins, 40 heads, 42 nozzles, 50 XY Robot, 51 Y-axis guide rail, 52 Y-axis slider, 53 X-axis guide rail, 54 X-axis slider, 58 control device, 60 support leg, 62 leveling bolt, 62a convex curved surface, 64,264 leveling sheet, 64a concave curved surface, 66,166,266 Rubber magnet sheet.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Vibration Prevention Devices (AREA)

Abstract

Appareil de montage de pièces 1 pourvu d'un corps 10 d'appareil et de pieds de support 60. Le corps 10 d'appareil effectue une commande de positionnement d'une tête 50 en liaison avec le montage d'une pièce sur un substrat S. Les pieds de support 60 servant à régler le corps 10 d'appareil sur un plancher F. Lesdits pieds de support 60 sont pourvus d'un boulon de nivellement 62, d'un siège de nivellement 64 et d'une feuille de caoutchouc magnétique 66. La surface inférieure du boulon de nivellement 62 est une surface incurvée convexe. La surface supérieure du siège de nivellement 64 est une surface incurvée concave et est conçue pour recevoir la surface incurvée convexe du boulon de nivellement 62 sur ladite surface incurvée concave. La feuille de caoutchouc magnétique 66 est une feuille discoïde dans laquelle une poudre magnétique est dispersée dans une matrice de caoutchouc et est disposée sur la surface inférieure du siège de nivellement 64.
PCT/JP2015/082589 2015-11-19 2015-11-19 Appareil lié au montage de pièces et son procédé de réglage WO2017085840A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2015/082589 WO2017085840A1 (fr) 2015-11-19 2015-11-19 Appareil lié au montage de pièces et son procédé de réglage
JP2017551470A JP6983658B2 (ja) 2015-11-19 2015-11-19 部品実装関連装置

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PCT/JP2015/082589 WO2017085840A1 (fr) 2015-11-19 2015-11-19 Appareil lié au montage de pièces et son procédé de réglage

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020003463A1 (fr) * 2018-06-28 2020-01-02 株式会社Ｆｕｊｉ Dispositif associé au montage de composant et procédé de réglage de sa hauteur
JP2020169668A (ja) * 2019-04-02 2020-10-15 パナソニックＩｐマネジメント株式会社 作業機の防振装置および作業機

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639746A (ja) * 1986-06-27 1988-01-16 Inoue Japax Res Inc 防振材
JPH04211196A (ja) * 1990-03-05 1992-08-03 Fujitsu Ltd 耐震台足構造
JPH0592552U (ja) * 1992-05-14 1993-12-17 小野ゴム工業株式会社 制振用脚ゴム
JPH11214887A (ja) * 1998-01-27 1999-08-06 Fuji Mach Mfg Co Ltd 電気部品装着機支持装置
JP2002261475A (ja) * 2001-03-02 2002-09-13 Fujitsu Fip Corp 設置用台足装置及びこれを備えた被設置構造物
JP2006199814A (ja) * 2005-01-20 2006-08-03 Bridgestone Corp ゴム磁石シート
JP2009250269A (ja) * 2008-04-01 2009-10-29 Tohoku Sharyo Seizosho:Kk 防振プレート

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639746A (ja) * 1986-06-27 1988-01-16 Inoue Japax Res Inc 防振材
JPH04211196A (ja) * 1990-03-05 1992-08-03 Fujitsu Ltd 耐震台足構造
JPH0592552U (ja) * 1992-05-14 1993-12-17 小野ゴム工業株式会社 制振用脚ゴム
JPH11214887A (ja) * 1998-01-27 1999-08-06 Fuji Mach Mfg Co Ltd 電気部品装着機支持装置
JP2002261475A (ja) * 2001-03-02 2002-09-13 Fujitsu Fip Corp 設置用台足装置及びこれを備えた被設置構造物
JP2006199814A (ja) * 2005-01-20 2006-08-03 Bridgestone Corp ゴム磁石シート
JP2009250269A (ja) * 2008-04-01 2009-10-29 Tohoku Sharyo Seizosho:Kk 防振プレート

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020003463A1 (fr) * 2018-06-28 2020-01-02 株式会社Ｆｕｊｉ Dispositif associé au montage de composant et procédé de réglage de sa hauteur
CN112425277A (zh) * 2018-06-28 2021-02-26 株式会社富士 元件安装关联装置及其高度调整方法
JPWO2020003463A1 (ja) * 2018-06-28 2021-04-30 株式会社Ｆｕｊｉ 部品実装関連装置及びその高さ調整方法
CN112425277B (zh) * 2018-06-28 2023-02-24 株式会社富士 元件安装关联装置及其高度调整方法
JP2020169668A (ja) * 2019-04-02 2020-10-15 パナソニックＩｐマネジメント株式会社 作業機の防振装置および作業機
JP7241258B2 (ja) 2019-04-02 2023-03-17 パナソニックＩｐマネジメント株式会社 作業機の防振装置および作業機

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