WO2017082744A1 - Procédé de formation d'un stratifié pour carte de circuits imprimés - Google Patents

Procédé de formation d'un stratifié pour carte de circuits imprimés Download PDF

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Publication number
WO2017082744A1
WO2017082744A1 PCT/PL2016/000122 PL2016000122W WO2017082744A1 WO 2017082744 A1 WO2017082744 A1 WO 2017082744A1 PL 2016000122 W PL2016000122 W PL 2016000122W WO 2017082744 A1 WO2017082744 A1 WO 2017082744A1
Authority
WO
WIPO (PCT)
Prior art keywords
laminate
copper
printed circuit
weight
additive
Prior art date
Application number
PCT/PL2016/000122
Other languages
English (en)
Other versions
WO2017082744A4 (fr
Inventor
Wojciech STRUŚ
Artur SKORUT
Original Assignee
Skorut Systemy Solarne - Sp. Z O. O.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skorut Systemy Solarne - Sp. Z O. O. filed Critical Skorut Systemy Solarne - Sp. Z O. O.
Publication of WO2017082744A1 publication Critical patent/WO2017082744A1/fr
Publication of WO2017082744A4 publication Critical patent/WO2017082744A4/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Definitions

  • the Polish patent specification No. PL 189558 entitled "A method for direct plating of dielectrics, in particular the walls of holes in printed circuits boards” reveals a method for subtractive plating of a board made of glass- epoxy laminate, copper coated on both sides, and with drilled holes . According to the method the board undergoes a process of electrochemical degreasing. Then it is treated in acetone. Then the holes in the board are conditioned in the Cleaner Conditioner 3223 solution by Shipley Co. which contains cationic surfactants, at the temperature of 60°C for 5 minutes.
  • the copper foil is micro-etched in a solution containing 100 ml/1 of concentrated H2SO4 and 20 ml/1 of 30% H 2 0 2 - Then the board is covered with a palladium activator containing 50 g/1 of stannous chloride, 1 g/1 of palladium chloride and 150 ml/1 of concentrated hydrochloric acid. The activation is carried out for 5 to 25 minutes at the temperature of 60°C after which the acceleration process takes place, i.e. dipping the board for 5 to 10 minutes in 1M H 2 S0 4 solution .
  • the titanium chloride compound is burned in the presence of oxygen from the oxygen-containing gas and hydrogen to form plurality of ultrafine (or so-called nanoscale) particles.
  • the resulting T1O 2 containing particles according to the known inventions provide a magnetic susceptibility value ( ⁇ ) of at least 0.8-lQ "6 cm 3 /g at 300 K and are at least 30% by weight rutile, with the balance being essentially anatase. The percentage can be between 0.8xl0 ⁇ 6 cm 3 /g and 2.4xl0 -6 cm 3 /g at 300 K.
  • the prepared laminate undergoes the process of manufacturing printed circuit boards with the use of the semi-additive or additive method.
  • the process of manufacturing printed circuit boards is performed as follows :
  • Such prepared pieces of cut laminate are coated with the photo resistor with imaged plate pattern and then by galvanisation in the chemical copper at the same time printed circuit traces are made with required dimensions and the drilled holes are coated with copper.
  • Trilon B in the amount ranging from 20% to 25% by
  • the exposure process is performed without masks by selective exposure with the use of a laser beam.
  • the copper treated with ionisation turns into metallic form.
  • Such particles of metal form the centres of reaction during the bath in chemical copper.
  • the chemical plating is carried out for 60 to 120 minutes.
  • laminate is obtained with the surface and drilled holes coated with a 1.5-2.0 ⁇ thick copper layer.
  • Such prepared substrate is used to manufacture printed circuit boards according to the subtractive method.
  • the activated surfaces of the laminate undergo the drying process and then after drying the surface of the laminate and the drilled holes are exposed to UV radiation.
  • a catalytic substance that is a photoactive titanium dioxide or Ti0 2 -Me n O type complex oxides in the amount of at least 10% by weight as compared to the resin weight.
  • the amount of the added photoactive titanium dioxide or Ti0 2 -Me n 0 type complex oxides ranges from 10% to 40% by weight as compared to the resin weight.
  • the process of formation of the printed circuit board is carried out when two conditions are met by the used dielectric substrate, wherein the base laminate forming the basic component for the manufactured printed circuit board is properly prepared.
  • the laminate intended for manufacturing printed circuit boards should undergo an additional two-track treatment during its formation.
  • dielectric laminates or other materials during their formation it is necessary to add a component with a significant catalytic or photocatalytic activity with a later appropriate laminate surface development.
  • Photosensitive titanium dioxide formed according to patent number US 8,012,451 or a different similar titanium oxide and Ti0 2 ⁇ Me n O m type complex oxides are such components with significant catalytic activity. Examples of photoactivity results are included in Table 1 which provides physical and chemical properties of photocatalysts - dielectric material fillers, developed for the purposes of this invention. Table 1
  • Table 1 shows that the systems of complex oxides Si0 2 - Ti0 2 , ZNO - Ti0 2 , Bi 2 0 3 - Ti0 2 , W0 3 - Ti0 2 with no less than 30% of Si0 2 by weight, 50% of ZnO by weight, 10% of WO3 by weight and 10% of ⁇ 2 ⁇ 3 by weight respectively have appropriate photoactivity and dispersion and prove to be useful as photosensitive dielectric components of laminates.
  • pressed catalysts in dielectrics the latter become photosensitive with example values of photoactivity listed in Table 2 and thus allow the reaction of Pd 2+ , Fe 2+ , Ni 2+ , Cu 2+ ions formation as active centres of electrolyte-free plating.
  • Table 2 shows that the systems of complex oxides Si0 2 - Ti0 2 , ZNO - Ti0 2 , Bi 2 0 3 - Ti0 2 , W0 3 - Ti0 2 with no less than 30% of Si0 2 by weight, 50% of ZnO by weight, 10% of WO3 by weight
  • the advantage of the method of modification of laminates used to manufacture printed circuit boards according to this invention is the lack of electrolytic deposition of metals from saline solutions which has many important uses. They include, among others, plating of surfaces of dielectric materials containing additives with catalytic or photocatalytic activity.
  • photoselective plating is used wherein metal is deposited only on those sections of the dielectric surface where exposure to light results in a metal particle formation reaction. With the use of appropriate masks or selective exposure with the use of laser, this diversity of plating can be successfully used to carry out the additive and semi-additive method for the needs of the electronic industry.
  • Laminate manufactured according to the known process containing a filler incorporated together with resin as a catalyst in the amount of 25% by weight as compared to epoxy resin, and the laminate surface was developed to approx. 170% and had drilled holes.
  • the laminate was cut into pieces.
  • the pieces of the cut laminate were activated with palladium salts and dried and after drying they were placed in chemical copper bath for approx. 110 minutes. In the chemical copper bath, the entire surface of the pieces of cut laminate was coated with an approx. 1.65 ⁇ thick copper layer. The same copper layer was also applied on the inner surface of the drilled holes.
  • the pieces of cut laminate were coated with an approx. 1.50 ⁇ thick copper layer.
  • the same copper layer was also applied on the inner surface of the drilled holes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)

Abstract

La présente invention concerne le procédé de modification de stratifiés utilisés dans la fabrication de cartes de circuits imprimés. La présente invention permet d'utiliser les stratifiés utilisés dans le procédé soustractif pour la fabrication industrielle de cartes de circuits imprimés dans des procédés semi-additifs et additifs. La modification de stratifiés utilisés pour fabriquer des cartes de circuits imprimés consiste à utiliser deux processus : 1. Ajouter à la résine comprenant le stratifié une substance catalytique qui est du dioxyde de titane photosensible ou des oxydes complexes de type TiO2-MenO en une quantité d'au moins 10 % en poids par rapport au poids de la résine, de préférence de 10 % à 40 % en poids. 2. Développer la surface du stratifié fabriqué dans le premier processus d'au moins 150 %. Pour obtenir l'adhérence requise du cuivre au substrat diélectrique, le procédé de placage photosélectif est utilisé. Le placage photosélectif est un procédé dans lequel le métal est déposé uniquement sur les sections de la surface diélectrique où l'exposition à la lumière entraîne une réaction de formation de métal. Le principe de placage photosélectif est que, pendant l'exposition du matériau photosensible diélectrique dans les sections où l'absorption a lieu, des centres catalytiques sont créés, les germes de nucléation sur lesquels se dépose le métal ultérieurement pendant un dépôt chimique. Ce procédé entraîne la formation d'un dessin de motif sur la surface de la carte comprenant des particules de métal. Le procédé de formation de la carte de circuits imprimés est effectué lorsque deux conditions sont satisfaites par le substrat diélectrique, le stratifié de base formant le composant de base de la carte de circuits imprimés fabriquée étant correctement préparé. Le stratifié destiné à la fabrication de cartes de circuits imprimés doit être soumis à un traitement supplémentaire à deux voies pendant sa formation. Aux stratifiés diélectriques ou d'autres matériaux connus et utilisés dans l'état de la technique pendant leur formation, on ajoute un composant ayant une activité catalytique ou photocatalytique importante avec un développement de surface de stratifié approprié ultérieur.
PCT/PL2016/000122 2015-11-13 2016-11-08 Procédé de formation d'un stratifié pour carte de circuits imprimés WO2017082744A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PL414778A PL414778A1 (pl) 2015-11-13 2015-11-13 Sposób modyfikacji laminatów stosowanych do wytwarzania obwodów drukowanych
PLP.414778 2015-11-13

Publications (2)

Publication Number Publication Date
WO2017082744A1 true WO2017082744A1 (fr) 2017-05-18
WO2017082744A4 WO2017082744A4 (fr) 2017-06-29

Family

ID=57681709

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/PL2016/000122 WO2017082744A1 (fr) 2015-11-13 2016-11-08 Procédé de formation d'un stratifié pour carte de circuits imprimés

Country Status (4)

Country Link
AR (1) AR106668A1 (fr)
PL (1) PL414778A1 (fr)
TW (1) TW201729656A (fr)
WO (1) WO2017082744A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
PL189558B1 (pl) 1998-07-17 2005-08-31 Procter & Gamble Sposób wytwarzania wielofazowej tabletki detergentowej
US20070014975A1 (en) * 2005-07-14 2007-01-18 Fuji Photo Film Co., Ltd. Method of manufacturing wiring substrate, and wiring substrate
US7468175B2 (en) 2006-12-13 2008-12-23 Worthington Technologies, Llc Highly photosensitive titanium dioxide and process for forming the same
WO2008157642A1 (fr) * 2007-06-18 2008-12-24 Steven Lee Dutton Procédé d'émulsion photosensible automatisée pour la fabrication de circuits imprimés et de circuits imprimés multicouches
EP2899235A1 (fr) * 2012-09-14 2015-07-29 Mitsubishi Engineering-Plastics Corporation Composition de résine thermoplastique, article moulé en résine, et procédé de fabrication d'un article moulé en résine auquel est fixée une couche de placage

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
PL189558B1 (pl) 1998-07-17 2005-08-31 Procter & Gamble Sposób wytwarzania wielofazowej tabletki detergentowej
US20070014975A1 (en) * 2005-07-14 2007-01-18 Fuji Photo Film Co., Ltd. Method of manufacturing wiring substrate, and wiring substrate
US7468175B2 (en) 2006-12-13 2008-12-23 Worthington Technologies, Llc Highly photosensitive titanium dioxide and process for forming the same
US8012451B2 (en) 2006-12-13 2011-09-06 Worthington Technologies, Llc Highly photosensitive titanium dioxide and process for forming the same
WO2008157642A1 (fr) * 2007-06-18 2008-12-24 Steven Lee Dutton Procédé d'émulsion photosensible automatisée pour la fabrication de circuits imprimés et de circuits imprimés multicouches
EP2899235A1 (fr) * 2012-09-14 2015-07-29 Mitsubishi Engineering-Plastics Corporation Composition de résine thermoplastique, article moulé en résine, et procédé de fabrication d'un article moulé en résine auquel est fixée une couche de placage

Also Published As

Publication number Publication date
AR106668A1 (es) 2018-02-07
WO2017082744A4 (fr) 2017-06-29
TW201729656A (zh) 2017-08-16
PL414778A1 (pl) 2017-05-22

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