WO2017006887A1 - 樹脂組成物、該樹脂組成物を用いたプリプレグ又はレジンシート並びにそれらを用いた積層板及びプリント配線板 - Google Patents
樹脂組成物、該樹脂組成物を用いたプリプレグ又はレジンシート並びにそれらを用いた積層板及びプリント配線板 Download PDFInfo
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- WO2017006887A1 WO2017006887A1 PCT/JP2016/069737 JP2016069737W WO2017006887A1 WO 2017006887 A1 WO2017006887 A1 WO 2017006887A1 JP 2016069737 W JP2016069737 W JP 2016069737W WO 2017006887 A1 WO2017006887 A1 WO 2017006887A1
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
- C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2400/00—Characterised by the use of unspecified polymers
- C08J2400/24—Thermosetting resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Definitions
- the present invention relates to a resin composition, a prepreg or resin sheet using the resin composition, a laminate using the prepreg or resin sheet, a printed wiring board using the resin composition, and a method for producing the resin composition.
- One of the measures is to reduce the thermal expansion of the insulating layer used for the printed wiring board. This is a technique for suppressing warpage by bringing the thermal expansion coefficient of a printed wiring board close to the thermal expansion coefficient of a semiconductor element, and is currently being actively worked on (see, for example, Patent Documents 1 to 3).
- methods for suppressing the warpage of the semiconductor plastic package include increasing the rigidity of the laminated board (higher rigidity) and increasing the glass transition temperature of the laminated board (high Tg). (For example, see Patent Documents 4 and 5).
- JP 2013-216884 A Japanese Patent No. 3173332 JP 2009-035728 A JP 2013-001807 A JP2011-177892A
- the above-described low thermal expansion and high rigidity of the laminated plate can be achieved by highly filling the resin composition used for the laminated plate with a filler.
- the high filler filling has a problem that the peel strength (metal foil peel strength) of the laminated sheet with respect to the metal foil is lowered.
- the laminated plate is exposed to a chemical solution in an etching process, a desmear process, a plating process, and the like, there is a problem that if the chemical resistance of the laminated plate is low, the process is contaminated and the quality and productivity of the product are deteriorated. .
- a strongly alkaline cleaning liquid is used for the purpose of removing smear generated by mechanical drilling or laser drilling. Therefore, if the chemical resistance is insufficient, the inner wall of the through hole other than smear and the surface of other resin layers are also eluted, and the problem that the laminate is contaminated becomes prominent (desmear resistance).
- an object of the present invention is to provide a resin composition capable of achieving both high levels of metal foil peel strength and desmear resistance, for example, in the production of printed wiring boards.
- a resin composition containing a prepolymer (P) comprising a specific component and a thermosetting component is a metal foil in the production of a printed wiring board.
- the present inventors have found that it is possible to achieve both high peel strength and desmear resistance, and have reached the present invention.
- a resin composition comprising a prepolymer (P) obtained by polymerizing an alkenyl-substituted nadiimide (A), a maleimide compound (B), and an amino-modified silicone (C), and a thermosetting component.
- the thermosetting component includes an alkenyl-substituted nadiimide (A) and / or a maleimide compound (B).
- the alkenyl-substituted nadiimide (A) includes a compound represented by the following general formula (1).
- each R 1 independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- R 2 represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, a naphthylene group, or The group represented by the general formula (2) or (3) is shown.
- R 3 represents a substituent represented by a methylene group, an isopropylidene group, CO, O, S, or SO 2.
- each R 4 independently represents an alkylene group having 1 to 4 carbon atoms or a cycloalkylene group having 5 to 8 carbon atoms.
- the maleimide compound (B) is bis (4-maleimidophenyl) methane, 2,2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane, bis (3-ethyl-5-methyl-4-maleimidophenyl) Any one of [1] to [4], which is at least one selected from the group consisting of methane, polytetramethylene oxide-bis (4-maleimidobenzoate) and a maleimide compound represented by the following general formula (6) The resin composition described in 1.
- R 5 each independently represents a hydrogen atom or a methyl group, and n 1 represents an integer of 1 or more.
- the amino-modified silicone (C) includes a compound represented by the following general formula (Y).
- each R 9 independently represents a hydrogen atom, a methyl group or a phenyl group, and each R 10 independently represents an alkylene group having 1 to 10 carbon atoms which may have a side chain.
- N represents an integer of 0 or more.
- D inorganic filler
- a metal foil-clad laminate comprising a cured product of a laminate in which at least one selected from the group consisting of the prepreg according to [10] and [11] and the resin sheet according to [12] and a metal foil are laminated.
- a printed wiring board comprising an insulating layer and a conductor layer formed on the surface of the insulating layer, wherein the insulating layer comprises the resin composition according to any one of [1] to [9] Board.
- the resin composition of the present invention for example, in the production of a printed wiring board, excellent metal foil peel strength and desmear resistance can be achieved at a high level.
- the resin composition of the present embodiment includes a prepolymer (P) obtained by polymerizing an alkenyl-substituted nadiimide (A), a maleimide compound (B), and an amino-modified silicone (C), and a thermosetting component.
- the content of the prepolymer (P) is preferably 10 to 90% by mass, more preferably 30 to 80% by mass, and 40 to 70% by mass. Is more preferable.
- the content of the thermosetting component is preferably 10 to 90% by mass, more preferably 20 to 70% by mass, and 30 to 60% by mass. Further preferred.
- thermosetting component For example, an alkenyl substituted nadiimide (A), a maleimide compound (B), a cyanate ester compound, an epoxy resin, a benzoxazine compound, a phenol resin etc. are mentioned. These may be used alone or in combination of two or more. Among them, the thermosetting component preferably contains an alkenyl-substituted nadiimide (A) and / or a maleimide compound (B).
- the resin composition will be described in detail.
- alkenyl-substituted nadiimide (A) used in the present embodiment is not particularly limited as long as it is a compound having one or more alkenyl-substituted nadiimide groups in the molecule. Specific examples thereof include compounds represented by the following general formula (1).
- each R 1 independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- R 2 represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, a naphthylene group, or the following general formula
- the group represented by Formula (2) or (3) is shown.
- R 3 represents a substituent represented by a methylene group, an isopropylidene group, CO, O, S, or SO 2 .
- R 4 represents an independently selected alkylene group having 1 to 4 carbon atoms or a cycloalkylene group having 5 to 8 carbon atoms.
- alkenyl substituted nadiimide (A) represented by Formula (1) examples include, but are not limited to, compounds represented by the following formula (4) (BANI-M (manufactured by Maruzen Petrochemical Co., Ltd.)) and compounds represented by the following formula (5). (BANI-X (manufactured by Maruzen Petrochemical Co., Ltd.)). These may be used alone or in combination of two or more.
- the content of the alkenyl-substituted nadiimide (A) includes the number of alkenyl groups ( ⁇ ) which is one of the functional groups of the alkenyl-substituted nadiimide (A) described later and the number of maleimide groups ( ⁇ ) of the maleimide compound. May be determined by the ratio of the number of functional groups ([ ⁇ / ⁇ ]), but is preferably 10 to 60 parts by mass with respect to 100 parts by mass in total of the prepolymer (P) and the thermosetting component, More preferably, the content is set to ⁇ 50 parts by mass, and further preferably 20 to 40 parts by mass.
- the moldability is excellent even when the filler is filled, curability and thermal elastic modulus (for example, flexural modulus at 250 ° C., flexural elasticity at solder reflow temperature). Ratio), desmear resistance, and chemical resistance can be obtained.
- alkenyl-substituted nadiimide (A) when used as the thermosetting component, the alkenyl-substituted nadiimide (A) used as a raw material for the prepolymer (P) (hereinafter referred to as “alkenyl-substituted nadiimide ( A-1) ”) and the alkenyl-substituted nadiimide (A) used as the thermosetting component (hereinafter also referred to as“ alkenyl-substituted nadiimide (A-2) ”) may be the same or different. May be.
- the mass ratio of the alkenyl-substituted nadiimide (A-1) to the entire alkenyl-substituted nadiimide (A) ((A -1) / (A)) is preferably 0.1 to 1.0, more preferably 0.5 to 1.0, and still more preferably 0.8 to 1.0. .
- the ratio ([ ⁇ / ⁇ ]) of the number of alkenyl groups ( ⁇ ) of the alkenyl-substituted nadiimide (A) and the number of maleimide groups ( ⁇ ) of the maleimide compound (B) is preferably 0.9 to 4.3. More preferably, it is 0.5 to 4.0, and more preferably 1.5 to 3.0.
- the maleimide compound (B) used in the present embodiment is not particularly limited as long as it is a compound having one or more maleimide groups in the molecule. Specific examples thereof include, for example, N-phenylmaleimide, N-hydroxyphenylmaleimide, bis (4-maleimidophenyl) methane, 2,2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane, bis (3 , 5-dimethyl-4-maleimidophenyl) methane, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, bis (3,5-diethyl-4-maleimidophenyl) methane, polytetramethylene oxide-bis (4-maleimidobenzoate), maleimide compounds represented by the following formula (6), prepolymers of these maleimide compounds, or prepolymers of maleimide compounds and amine compounds. These may be used alone or in combination of two or more.
- R 5 each independently represents a hydrogen atom or a methyl group, and among them, a hydrogen atom is preferable.
- n 1 represents an integer of 1 or more.
- the upper limit value of n 1 is preferably 10, more preferably 7.
- the content of the maleimide compound (B) may be determined by the ratio between the number of alkenyl groups of the alkenyl-substituted nadiimide (A) and the number of maleimide groups of the maleimide compound (B),
- the amount is preferably 30 to 80 parts by weight, more preferably 35 to 70 parts by weight, and more preferably 40 to 60 parts by weight with respect to 100 parts by weight as the total of the prepolymer (P) and the thermosetting component. Further preferred.
- the maleimide compound (B) used as the thermosetting component when used as the thermosetting component, the maleimide compound (B) used as a raw material for the prepolymer (P) (hereinafter referred to as “maleimide compound (B-1)”)
- the maleimide compound (B) used as the thermosetting component hereinafter also referred to as “maleimide compound (B-2)” may be the same or different, but different Is preferred.
- maleimide compound (B-1) examples include bis (4-maleimidophenyl) methane, 2,2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane, and bis (3-ethyl-5-methyl-4- Maleimidophenyl) methane, polytetramethylene oxide-bis (4-maleimidobenzoate), maleimide compounds represented by the above general formula (6) are preferred, and 2,2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane Bis (3-ethyl-5-methyl-4-maleimidophenyl) methane is more preferred, and 2,2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane is more preferred.
- maleimide compound (B-2) examples include bis (4-maleimidophenyl) methane, 2,2-bis ⁇ 4- (4-maleimidophenoxy) -phenyl ⁇ propane, bis (3-ethyl-5-methyl-4- Maleimidophenyl) methane, polytetramethylene oxide-bis (4-maleimidobenzoate), maleimide compounds represented by the above general formula (6) are preferred, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, Polytetramethylene oxide-bis (4-maleimidobenzoate) and a maleimide compound represented by the general formula (6) are more preferred, and a maleimide compound represented by the general formula (6) is more preferred.
- Maleimide compounds (B-1) and (B-2) may be used alone or in combination of two or more.
- the content of maleimide compound (B-1) depends on the number of amino groups in amino-modified silicone (C). It is determined. That is, the ratio ( ⁇ -1 / ⁇ ) of the maleimide group number ( ⁇ -1) of the maleimide compound (B-1) to the amino group number ( ⁇ ) of the amino-modified silicone (C) is 1.0 to 20.0. It is preferably 4.0 to 15.0, more preferably 6.0 to 12.0.
- the content of the maleimide compound (B-2) is preferably the difference between the content of the maleimide compound (B) and the content of the maleimide compound (B-1) ([(B- (B-1)]).
- amino-modified silicone (C) used in the present embodiment is not particularly limited as long as it is a compound having one or more amino groups in the molecule. Specific examples thereof include compounds represented by the following general formula (Y).
- each R 9 independently represents a hydrogen atom, a methyl group or a phenyl group, and among them, a methyl group is preferable.
- R 10 each independently represents an alkylene group having 1 to 10 carbon atoms which may have a side chain, and among them, an alkylene group having 2 to 10 carbon atoms is preferable.
- n represents an integer of 0 or more.
- the amino group equivalent of the amino-modified silicone (C) is preferably from 130 to 6000, more preferably from 400 to 3000, and even more preferably from 600 to 2500.
- the content of the amino-modified silicone (C) is preferably 1 to 40 parts by mass with respect to 100 parts by mass in total of the prepolymer (P) and the thermosetting component. More preferably, the content is set to ⁇ 30 parts by mass, and further preferably 5 to 20 parts by mass.
- the resin composition of this embodiment may contain an epoxy resin.
- an epoxy resin is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule.
- the epoxy resin is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule.
- Epoxy resins may be used alone or in combination of two or more.
- the content of the epoxy resin is not particularly limited, but is preferably 3 to 45% by mass, more preferably 3 to 35% by mass with respect to 100 parts by mass in total of the prepolymer (P) and the thermosetting component. More preferably, it is 3 to 20% by mass.
- the content of the epoxy resin is within the above range, the heat resistance and curability tend to be further improved.
- thermosetting component in addition to the prepolymer (P) and the thermosetting component as long as the desired properties are not impaired.
- a thermoplastic resin etc. are mentioned.
- thermoplastic resin or the like it is possible to impart characteristics such as metal adhesion and stress relaxation.
- the resin composition of this embodiment further contains an inorganic filler (D).
- the inorganic filler (D) used in the present embodiment is not particularly limited as long as it has insulating properties.
- silica from the viewpoint of low thermal expansion
- alumina or aluminum nitride from the viewpoint of high thermal conductivity
- the content of the inorganic filler (D) is not particularly limited, but is 50 to 500 parts by mass with respect to 100 parts by mass in total of the prepolymer (P) and the thermosetting component. However, it is preferable from the viewpoint of characteristics such as low thermal expansion and high thermal conductivity, and among them, it is more preferably 100 to 300 parts by mass, and further preferably 100 to 250 parts by mass.
- the resin composition of the present embodiment preferably contains a cyanate ester compound as a thermosetting component.
- a cyanate ester compound as a thermosetting component.
- the naphthol aralkyl type cyanate ester represented by following General formula (7) the novolak type cyanic acid represented by following General formula (8) Ester, biphenylaralkyl cyanate ester, bis (3,3-dimethyl-4-cyanatophenyl) methane, bis (4-cyanatophenyl) methane, 1,3-dicyanatobenzene, 1,4-dicyanatobenzene 1,3,5-tricyanatobenzene, 1,3-dicyanatonaphthalene, 1,4-dicyanatonaphthalene, 1,6-dicyanatonaphthalene, 1,8-dicyanatonaphthalene, 2,6-dicyanatonaphthalene 2,7-dicyanatonaphthalene, 1,3,6-
- the naphthol aralkyl cyanate ester compound represented by the following general formula (7), the novolac cyanate ester and the biphenyl aralkyl cyanate ester represented by the following general formula (8) are excellent in flame retardancy and cured. It is particularly preferable because of its high properties and a low thermal expansion coefficient of the cured product.
- each R 6 independently represents a hydrogen atom or a methyl group, and among them, a hydrogen atom is preferable.
- n 2 is an integer of 1 or more.
- the upper limit value of n 2 is preferably 10, more preferably 6.
- R 7 each independently represents a hydrogen atom or a methyl group, and among them, a hydrogen atom is preferable.
- n 3 is an integer of 1 or more.
- the upper limit value of n 3 is preferably 10, more preferably 7.
- cyanate ester compounds are not particularly limited, and any existing method as a cyanate ester synthesis method may be used. Specifically, it can be obtained by reacting a naphthol aralkyl type phenol resin represented by the following general formula (9) with cyanogen halide in an inert organic solvent in the presence of a basic compound. Alternatively, a similar naphthol aralkyl type phenol resin and a salt of a basic compound may be formed in a solution containing water, and then a two-phase interface reaction with cyanogen halide may be performed for synthesis. it can.
- each R 8 independently represents a hydrogen atom or a methyl group, and among them, a hydrogen atom is preferable.
- n 4 represents an integer of 1 or more.
- upper limit of n 4 is preferably 10, more preferably 6.
- the naphthol aralkyl cyanate ester compounds include naphthols such as ⁇ -naphthol and ⁇ -naphthol, p-xylylene glycol, ⁇ , ⁇ '-dimethoxy-p-xylene, 1,4-di (2-hydroxy- It can be selected from those obtained by condensing naphthol aralkyl resin obtained by reaction with 2-propyl) benzene and cyanic acid.
- the content of the cyanate ester compound is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass in total of the prepolymer (P) and the thermosetting component. More preferably, the content is 1 to 5 parts by mass, and still more preferably 0.3 to 3 parts by mass.
- silane coupling agents and wetting and dispersing agents In the resin composition of this embodiment, in order to improve the dispersibility of the fine particles and the adhesive strength between the resin and the fine particles or the glass cloth, a silane coupling agent or a wetting and dispersing agent can be used in combination. These silane coupling agents are not particularly limited as long as they are silane coupling agents generally used for inorganic surface treatment.
- aminosilanes such as ⁇ -aminopropyltriethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, epoxysilanes such as ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -Acrylic silanes such as acryloxypropyltrimethoxysilane, cationic silanes such as N- ⁇ - (N-vinylbenzylaminoethyl) - ⁇ -aminopropyltrimethoxysilane hydrochloride, phenylsilanes, etc. It is also possible to use one kind or a combination of two or more kinds as appropriate.
- the wetting and dispersing agent is not particularly limited as long as it is a dispersion stabilizer used for coatings.
- wetting and dispersing agents such as DISPER-110, 111, 118, 180, 161, BYK-W996, W9010, W903 manufactured by Big Chemie Japan Co., Ltd. may be mentioned.
- the curing accelerator is not particularly limited, and examples thereof include organic peroxides exemplified by benzoyl peroxide, lauroyl peroxide, acetyl peroxide, parachlorobenzoyl peroxide, di-tert-butyl-di-perphthalate, and the like.
- An azo compound such as azobisnitrile; N, N-dimethylbenzylamine, N, N-dimethylaniline, N, N-dimethyltoluidine, 2-N-ethylanilinoethanol, tri-n-butylamine, pyridine, quinoline, Tertiary amines such as N-methylmorpholine, triethanolamine, triethylenediamine, tetramethylbutanediamine, N-methylpiperidine; phenols such as phenol, xylenol, cresol, resorcin, catechol; lead naphthenate, lead stearate , Naphth Organic metal salts such as zinc oxide, zinc octylate, tin oleate, dibutyltin malate, manganese naphthenate, cobalt naphthenate and acetylacetone iron; these organic metal salts are dissolved in hydroxyl group-containing compounds such as phenol and bisphenol Inorganic metal salt
- the resin composition of the present embodiment may contain a solvent as necessary.
- a solvent for example, when an organic solvent is used, the viscosity at the time of preparing the resin composition is lowered, the handling property is improved, and the impregnation property to the glass cloth is enhanced.
- the kind of solvent will not be specifically limited if it can melt
- Specific examples thereof include ketones such as acetone, methyl ethyl ketone and methyl cellosolve, aromatic hydrocarbons such as toluene and xylene, amides such as dimethylformamide, propylene glycol monomethyl ether and acetate thereof.
- a solvent can be used individually by 1 type or in combination of 2 or more types.
- the resin composition of this embodiment may contain silicone powder.
- Silicone powder acts as a flame retardant aid that delays the burning time and enhances the flame retardant effect.
- the silicone powder is not particularly limited.
- a finely powdered polymethylsilsesquioxane having a siloxane bond crosslinked in a three-dimensional network an addition polymer of vinyl group-containing dimethylpolysiloxane and methylhydrogenpolysiloxane.
- a fine powder made from an addition polymer of vinyl group-containing dimethylpolysiloxane and methylhydrogenpolysiloxane coated with polymethylsilsesquioxane in which the siloxane bond is crosslinked in a three-dimensional network.
- the surface of the inorganic support may be coated with polymethylsilsesquioxane in which siloxane bonds are crosslinked in a three-dimensional network.
- the average particle size (D50) of the silicone powder is not particularly limited, but the average particle size (D50) is preferably 1 to 15 ⁇ m in consideration of dispersibility.
- the content of the silicone powder is not particularly limited, but is preferably 3 to 120 parts by mass with respect to a total of 100 parts by mass of the prepolymer (P) and the thermosetting component. Since the moldability and dispersibility may be lowered, 3 to 60 parts by mass is particularly preferable.
- thermosetting resins thermoplastic resins and oligomers thereof, various high molecular compounds such as elastomers, and other flame retardants, as long as desired properties are not impaired.
- these compounds and additives can be used in combination. These are not particularly limited as long as they are generally used.
- examples of the flame retardant compound include nitrogen-containing compounds such as melamine and benzoguanamine, and oxazine ring-containing compounds.
- Additives include UV absorbers, antioxidants, photopolymerization initiators, fluorescent brighteners, photosensitizers, dyes, pigments, thickeners, lubricants, antifoaming agents, surface conditioners, brighteners, polymerization Inhibitors and the like can be used in appropriate combinations as desired.
- the method for producing the resin composition of the present embodiment is as follows: Polymerizing alkenyl-substituted nadiimide (A), maleimide compound (B), and amino-modified silicone (C) to obtain prepolymer (P); Mixing the obtained prepolymer (P) with a thermosetting component; including.
- the components (A) to (C) may be polymerized simultaneously or in any combination, but the components (B) and (C) are polymerized.
- a primary prepolymer and polymerize the primary prepolymer and the component (A) it is possible to obtain a primary prepolymer and polymerize the primary prepolymer and the component (A) to obtain a secondary prepolymer, which improves peel strength, improves desmear resistance, improves moldability, or a silicone component. This is preferable because it tends to suppress bleeding out.
- other optional components may be mixed as necessary.
- the components (A) to (C), the thermosetting component, and the optional components used in the method for producing the resin composition of the present embodiment are as described in the paragraph of the resin composition.
- an organic solvent can be used as necessary.
- the kind of the organic solvent is not particularly limited as long as it can dissolve the resin in the resin composition. Specific examples thereof are as described above.
- a known process for uniformly dissolving or dispersing each component can be performed.
- the stirring and dispersing treatment is performed using a stirrer equipped with a stirrer having an appropriate stirring ability. Dispersibility is improved.
- the above stirring, mixing, and kneading treatment can be appropriately performed using, for example, a known device such as a ball mill or a bead mill for mixing, or a revolving or rotating mixing device.
- the prepreg of this embodiment is a prepreg obtained by impregnating or applying the above resin composition to a base material.
- the prepreg of the present embodiment can be obtained, for example, by combining the above resin composition with a substrate, specifically, impregnating or applying the above resin composition to the substrate.
- the manufacturing method of the prepreg of this embodiment can be performed according to a conventional method, and is not specifically limited. For example, after impregnating or coating the above-mentioned resin composition on a base material, it is semi-cured (B stage) by heating in a dryer at 100 to 200 ° C. for 1 to 30 minutes. The method of obtaining is mentioned.
- the amount of the resin composition (including the inorganic filler) relative to the total amount of the prepreg is not particularly limited, but is preferably in the range of 30 to 90% by mass.
- the substrate used in the prepreg of the present embodiment is not particularly limited, and known materials used for various printed wiring board materials are appropriately selected and used depending on the intended use and performance. be able to. Specific examples thereof include glass fibers such as E glass, D glass, S glass, Q glass, spherical glass, NE glass and T glass, inorganic fibers other than glass such as quartz, polyparaphenylene terephthalamide (Kevlar), and the like.
- glass fibers such as E glass, D glass, S glass, Q glass, spherical glass, NE glass and T glass
- inorganic fibers other than glass such as quartz, polyparaphenylene terephthalamide (Kevlar), and the like.
- E glass cloth, T glass cloth, S glass cloth, Q glass cloth and organic fiber are preferable from the viewpoint of low thermal expansion.
- These base materials can be used alone or in combination of two or more.
- a shape of a base material For example, a woven fabric, a nonwoven fabric, roving, a chopped strand mat, a surfacing mat, etc. are mentioned.
- the weaving method of the woven fabric is not particularly limited, and for example, plain weave, Nanako weave, twill weave and the like are known, and can be appropriately selected from these known ones depending on the intended use and performance. .
- a glass woven fabric whose surface is treated with a fiber-opening treatment or a silane coupling agent is preferably used.
- the thickness and mass of the base material are not particularly limited, but usually about 0.01 to 0.3 mm is preferably used.
- the base material is preferably a glass woven fabric having a thickness of 200 ⁇ m or less and a mass of 250 g / m 2 or less, and a glass woven fabric made of glass fibers such as E glass, S glass, and T glass. Is more preferable.
- the laminated board of this embodiment can be obtained by, for example, stacking and curing one or more of the above prepregs.
- the metal foil tension laminated board of this embodiment can be obtained by laminating
- the metal foil-clad laminate of the present embodiment can be obtained, for example, by laminating at least one or more of the prepregs described above, and arranging and molding the metal foil on one or both sides thereof.
- a metal foil-clad laminate can be produced.
- the metal foil used here will not be specifically limited if it is used for printed wiring board material, Well-known copper foils, such as a rolled copper foil and an electrolytic copper foil, are preferable.
- the thickness of the metal foil is not particularly limited, but is preferably 1 to 70 ⁇ m, more preferably 1.5 to 35 ⁇ m.
- a multi-stage press a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, etc. can be used at the time of forming a metal foil-clad laminate.
- the temperature is generally 100 to 300 ° C.
- the pressure is 2 to 100 kgf / cm 2
- the heating time is generally 0.05 to 5 hours.
- post-curing can be performed at a temperature of 150 to 300 ° C., if necessary.
- a multilayer board can be formed by laminating and combining the above-described prepreg and a separately prepared wiring board for an inner layer.
- the metal foil-clad laminate of this embodiment can be suitably used as a printed wiring board by forming a predetermined wiring pattern.
- the metal foil-clad laminate of this embodiment has a low coefficient of thermal expansion, good formability, metal foil peel strength, and chemical resistance (particularly desmear resistance), and a semiconductor that requires such performance. It can be used particularly effectively as a printed wiring board for a package.
- the present embodiment in addition to the above-described prepreg form, it may be in the form of an embedded sheet in which the above resin composition is applied to a metal foil or film.
- the resin sheet of the present embodiment is a resin sheet obtained by applying the above-described resin composition to one side or both sides of a support.
- the resin sheet is used as one means of thinning, and is, for example, a thermosetting resin (including an inorganic filler) directly used for a prepreg or the like on a support such as a metal foil or a film. Can be applied and dried.
- the support used in producing the resin sheet of the present embodiment is not particularly limited, and known materials used for various printed wiring board materials can be used. Examples thereof include a polyimide film, a polyamide film, a polyester film, a polyethylene terephthalate (PET) film, a polybutylene terephthalate (PBT) film, a polypropylene (PP) film, a polyethylene (PE) film, an aluminum foil, a copper foil, and a gold foil. Among these, electrolytic copper foil and PET film are preferable.
- the resin sheet of the present embodiment is particularly preferably one obtained by applying the above-described resin composition to a support and then semi-curing (B-stage).
- the method for producing the resin sheet of this embodiment is preferably a method for producing a composite of a B-stage resin and a support.
- the resin composition is coated on a support such as a copper foil, and then semi-cured by a method of heating in a dryer at 100 to 200 ° C. for 1 to 60 minutes to produce a resin sheet. The method of doing is mentioned.
- the amount of the resin composition attached to the support is preferably in the range of 1 to 300 ⁇ m in terms of the resin thickness of the resin sheet.
- the resin sheet of this embodiment can be used as a build-up material for printed wiring boards.
- the laminated board of this embodiment can be obtained, for example, by stacking and curing one or more of the above-described resin sheets.
- the metal foil tension laminated board of this embodiment can be obtained by laminating
- the metal foil-clad laminate of the present embodiment can be obtained by, for example, using the above-mentioned resin sheet and arranging and laminating metal foils on one side or both sides thereof. More specifically, for example, a single resin sheet as described above or a plurality of sheets from which the support is peeled off as desired are stacked, and a metal foil such as copper or aluminum is disposed on one or both sides thereof.
- a metal foil-clad laminate can be produced by laminating as necessary.
- the metal foil used here will not be specifically limited if it is used for printed wiring board material, Well-known copper foils, such as a rolled copper foil and an electrolytic copper foil, are preferable.
- the method for forming the metal foil-clad laminate and the molding conditions thereof There are no particular limitations on the method for forming the metal foil-clad laminate and the molding conditions thereof, and general methods and conditions for a laminate for a printed wiring board and a multilayer board can be applied.
- a multi-stage press, a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, etc. can be used at the time of forming a metal foil-clad laminate.
- the temperature is generally 100 to 300 ° C.
- the pressure is 2 to 100 kgf / cm 2
- the heating time is generally 0.05 to 5 hours.
- post-curing can be performed at a temperature of 150 to 300 ° C. as required.
- the laminate of this embodiment may be a laminate obtained by laminating and curing one or more resin sheets and prepregs each, and is obtained by laminating and curing a resin sheet, prepreg, and metal foil. It may be a metal foil-clad laminate.
- the printed wiring board of this embodiment is a printed wiring board including an insulating layer and a conductor layer formed on the surface of the insulating layer, and the insulating layer includes the resin composition described above.
- the printed wiring board according to the present embodiment is produced, for example, by forming a conductive layer serving as a circuit on an insulating layer by metal foil or electroless plating.
- the conductor layer is generally made of copper or aluminum.
- the insulating layer for printed wiring board on which the conductor layer is formed can be suitably used for a printed wiring board by forming a predetermined wiring pattern.
- the printed wiring board of this embodiment maintains the elastic modulus excellent also under the reflow temperature at the time of semiconductor mounting because an insulating layer contains the above-mentioned resin composition, and effectively warps a semiconductor plastic package. Since it suppresses and is excellent in metal foil peel strength and desmear resistance, it can be used particularly effectively as a printed wiring board for semiconductor packages.
- the printed wiring board of the present embodiment can be manufactured by the following method, for example.
- the metal foil-clad laminate such as a copper-clad laminate
- An inner layer circuit is formed by etching the surface of the metal foil-clad laminate to produce an inner layer substrate. If necessary, surface treatment is performed on the inner layer circuit surface of the inner layer substrate to increase the adhesive strength, then the required number of the prepregs are stacked on the inner layer circuit surface, and a metal foil for the outer layer circuit is laminated on the outer side. Then, it is integrally molded by heating and pressing.
- a multilayer laminate is produced in which an insulating layer made of a cured material of the base material and the thermosetting resin composition is formed between the inner layer circuit and the metal foil for the outer layer circuit.
- desmear treatment is performed to remove smears, which are resin residues derived from the resin component contained in the cured product layer.
- a plated metal film is formed on the wall surface of this hole to connect the inner layer circuit and the metal foil for the outer layer circuit, and the outer layer circuit is formed by etching the metal foil for the outer layer circuit to produce a printed wiring board. Is done.
- the above-described prepreg base material and the above-described resin composition attached thereto
- the above-described resin sheet the support and the above-described resin composition attached thereto
- the resin composition layer of the metal foil-clad laminate constitutes an insulating layer containing the above-described resin composition.
- the insulating layer preferably has a difference between the bending elastic modulus at 25 ° C. and the bending elastic modulus at 250 ° C. of 20% or less, more preferably 0 to 20%. Preferably, it is 0 to 15%.
- the insulating layer has a good elastic modulus maintenance rate.
- the elastic modulus maintenance factor refers to the ratio of the flexural modulus at 250 ° C. to the flexural modulus at 25 ° C.
- the method for setting the difference between the bending elastic modulus at 25 ° C. and the bending elastic modulus at 250 ° C. within 20% of the insulating layer is not particularly limited, but for example, a resin used for the insulating layer A method of appropriately adjusting the type and content of each component of the composition to the above-described range is exemplified.
- Example 1 18 parts by mass of a maleimide compound (BMI-80, maleimide group equivalent 285 g / eq, manufactured by Kay Chemical Co., Ltd.) and diamino-modified silicone (X-22-161B, amino group equivalent 1500 g / eq, Shin-Etsu Chemical Co., Ltd.) (Manufactured) 12 parts by mass were polymerized to obtain a primary prepolymer.
- the obtained primary prepolymer was polymerized with 16 parts by mass of bisdiallylnadiimide (BANI-M, alkenyl group equivalent 286 g / eq, manufactured by Maruzen Petrochemical Co., Ltd.) to obtain a secondary prepolymer.
- BMI-80 maleimide group equivalent 285 g / eq, manufactured by Kay Chemical Co., Ltd.
- X-22-161B amino group equivalent 1500 g / eq, Shin-Etsu Chemical Co., Ltd.
- maleimide compound (BMI-2300, maleimide group equivalent 186 g / eq, manufactured by Daiwa Kasei Kogyo Co., Ltd.) 32 parts by mass, bisdiallyl nadiimide (BANI-M, alkenyl group equivalent 286 g / eq, 16 parts by mass of Maruzen Petrochemical Co., Ltd., 6 parts by mass of biphenyl aralkyl type epoxy resin (NC-3000H, manufactured by Nippon Kayaku Co., Ltd.), 160 parts by mass of slurry silica (SC-2050MB, manufactured by Admatex Co., Ltd.) Parts, epoxy silane coupling agent (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) 2 parts by mass, styryl silane coupling agent (KBM-1403, manufactured by Shin-Etsu Chemical Co., Ltd.), 1 part by mass, wetting and dispersing agent (DISPERBYK- 16
- the number of maleimide groups / the number of amino groups and the number of alkenyl groups / the number of maleimide groups are represented by the following formulas.
- Numberer of maleimide groups / number of amino groups] (mass parts of maleimide compound / maleimide group equivalent of maleimide compound) / (mass part of diamino modified silicone / amino group equivalent of diamino modified silicone)
- Numberer of alkenyl groups / number of maleimide groups] (mass parts of bisdiallylnadiimide / alkenyl group equivalents of bisdiallylnadiimide) / (mass parts of maleimide compounds / maleimide group equivalents of maleimide compounds)
- a varnish was obtained by diluting the obtained resin composition with methyl ethyl ketone. This varnish was impregnated with T glass cloth (T2118) and dried by heating at 160 ° C. for 3 minutes to obtain a prepreg having a resin composition content
- Example 2 18 parts by mass of a maleimide compound (BMI-80, maleimide group equivalent 285 g / eq, manufactured by Kay Chemical Co., Ltd.) and diamino-modified silicone (X-22-161B, amino group equivalent 1500 g / eq, Shin-Etsu Chemical Co., Ltd.) (Manufactured) 12 parts by mass were polymerized to obtain a primary prepolymer.
- the obtained primary prepolymer was polymerized with 32 parts by mass of bisdiallylnadiimide (BANI-M, alkenyl group equivalent 286 g / eq, manufactured by Maruzen Petrochemical Co., Ltd.) to obtain a secondary prepolymer.
- maleimide compound (BMI-2300, maleimide group equivalent 186 g / eq, manufactured by Daiwa Kasei Kogyo Co., Ltd.) 32 parts by mass, biphenylaralkyl type epoxy resin (NC-3000H, Nippon Kayaku Co., Ltd.) 6 parts by mass, slurry silica (SC-2050MB, manufactured by Admatex) 160 parts by mass, epoxy silane coupling agent (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.), 2 parts by mass, styryl silane coupling agent (KBM-1403, manufactured by Shin-Etsu Chemical Co., Ltd.) 1 part by mass, wetting and dispersing agent (DISPERBYK-161, manufactured by Big Chemie Japan) 1 part by mass, curing accelerator (TPIZ, manufactured by Wako Pure Chemical Industries, Ltd.) 5 parts by weight of a resin group having a maleimide group number / amino group number ratio of 7.9 and an alken
- a varnish was obtained by diluting the obtained resin composition with methyl ethyl ketone. This varnish was impregnated with T glass cloth (T2118) and dried by heating at 160 ° C. for 3 minutes to obtain a prepreg having a resin composition content of 46.5% by mass.
- a varnish was obtained by diluting the obtained resin composition with methyl ethyl ketone. This varnish was impregnated with T glass cloth (T2118) and dried by heating at 160 ° C. for 3 minutes to obtain a prepreg having a resin composition content of 46.5% by mass.
- Table 1 shows the results of measurements of copper foil peel strength and desmear resistance using the obtained copper-clad laminate.
- Copper foil peel strength According to JIS C 6481, a test piece with a 12 ⁇ m copper foil (30 mm ⁇ 150 mm ⁇ 0.1 mm) was used to measure the peel strength of the copper foil.
- Desmear resistance In order to evaluate chemical resistance in the desmear process, after removing the copper foil of the copper-clad laminate prepared above by etching, a swelling liquid ("Swelling Dip Securigant P” manufactured by Atotech Japan Co., Ltd.) ) At 80 ° C. for 10 minutes, then immersed in a roughening solution (Atotech Japan Co., “Concentrate Compact CP”) at 80 ° C. for 5 minutes, and finally a neutralization solution (Atotech Japan Co., “Reduction Conditioner”). It was immersed in securigant P500 ”) at 45 ° C. for 10 minutes, and the mass loss (mass%) before and after the treatment was determined. This experiment was performed three times, and the arithmetic average of the three mass loss rates was used as the evaluation value.
- a swelling liquid (“Swelling Dip Securigant P” manufactured by Atotech Japan Co., Ltd.)
- a roughening solution Atotech Japan Co., “Concentrate Compact CP”
- the resin composition of the present invention and the printed wiring board containing the resin composition can be suitably used as members of various electronic devices such as personal computers and communication devices.
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Abstract
Description
[1]
アルケニル置換ナジイミド(A)、マレイミド化合物(B)、及びアミノ変性シリコーン(C)を重合して得られるプレポリマー(P)と、熱硬化性成分とを含む樹脂組成物。
[2]
前記熱硬化性成分が、アルケニル置換ナジイミド(A)及び/又はマレイミド化合物(B)を含む、[1]に記載の樹脂組成物。
[4]
前記アルケニル置換ナジイミド(A)が下記一般式(1)で表される化合物を含む、[1]又は[2]に記載の樹脂組成物。
[4]
前記アルケニル置換ナジイミド(A)が、下記式(4)で表される化合物及び/又は下記式(5)で表される化合物を含む、[1]~[3]のいずれかに記載の樹脂組成物。
前記マレイミド化合物(B)が、ビス(4-マレイミドフェニル)メタン、2,2-ビス{4-(4-マレイミドフェノキシ)-フェニル}プロパン、ビス(3-エチル-5-メチル-4-マレイミドフェニル)メタン、ポリテトラメチレンオキシド-ビス(4-マレイミドベンゾエート)及び下記一般式(6)で表されるマレイミド化合物からなる群より選ばれる少なくとも1種である、[1]~[4]のいずれかに記載の樹脂組成物。
[6]
前記アミノ変性シリコーン(C)が、下記一般式(Y)で表される化合物を含む、[1]~[5]のいずれかに記載の樹脂組成物。
[7]
無機充填材(D)をさらに含む、[1]~[6]のいずれかに記載の樹脂組成物。
[8]
前記無機充填材(D)が、シリカ、アルミナ及び窒化アルミニウムからなる群より選ばれる少なくとも1種を含む、[7]に記載の樹脂組成物。
[9]
前記無機充填材(D)の含有量が、プレポリマー(P)及び熱硬化性成分の合計100質量部に対して50~500質量部である、[7]又は[8]に記載の樹脂組成物。
[10]
[1]~[9]のいずれかに記載の樹脂組成物を基材に含浸又は塗布したプリプレグ。
[11]
前記基材が、Eガラスクロス、Tガラスクロス、Sガラスクロス、Qガラスクロス及び有機繊維からなる群より選ばれる少なくとも1種である、[10]に記載のプリプレグ。
[12]
[1]~[9]のいずれかに記載の樹脂組成物を支持体に塗布したレジンシート。
[13]
[10]及び[11]に記載のプリプレグ、並びに[12]に記載のレジンシートからなる群より選ばれる少なくとも1種を1枚以上重ねた積層体の硬化物を含む積層板。
[14]
[10]及び[11]に記載のプリプレグ、並びに[12]に記載のレジンシートからなる群より選ばれる少なくとも1種と、金属箔とを積層した積層体の硬化物を含む金属箔張積層板。
[15]
絶縁層と、前記絶縁層の表面に形成された導体層とを含むプリント配線板であって、前記絶縁層が、[1]~[9]のいずれかに記載の樹脂組成物を含むプリント配線板。
[16]
アルケニル置換ナジイミド(A)、マレイミド化合物(B)、及びアミノ変性シリコーン(C)を重合してプレポリマー(P)を得る工程と、
得られたプレポリマー(P)と熱硬化性成分とを混合させる工程と、
を含む樹脂組成物の製造方法。
本実施形態の樹脂組成物は、アルケニル置換ナジイミド(A)、マレイミド化合物(B)、及びアミノ変性シリコーン(C)を重合して得られるプレポリマー(P)と、熱硬化性成分とを含む。
本実施形態の樹脂組成物において、プレポリマー(P)の含有量は、10~90質量%であることが好ましく、30~80質量%であることがより好ましく、40~70質量%であることがさらに好ましい。
本実施形態の樹脂組成物において、熱硬化性成分の含有量は、10~90質量%であることが好ましく、20~70質量%であることがより好ましく、30~60質量%であることがさらに好ましい。
前記熱硬化性成分としては、特に限定されないが、例えば、アルケニル置換ナジイミド(A)、マレイミド化合物(B)、シアン酸エステル化合物、エポキシ樹脂、ベンゾオキサジン化合物、フェノール樹脂等が挙げられる。これらは1種を単独で用いてもよく2種以上を併用してもよい。中でも、前記熱硬化性成分としては、アルケニル置換ナジイミド(A)及び/又はマレイミド化合物(B)を含むことが好ましい。
以下、当該樹脂組成物について詳細に説明する。
本実施形態に用いるアルケニル置換ナジイミド(A)は、分子中に1個以上のアルケニル置換ナジイミド基を有する化合物であれば、特に限定されるものではない。その具体例としては下記一般式(1)で表される化合物が挙げられる。
また、本実施形態の樹脂組成物において、前記熱硬化性成分としてアルケニル置換ナジイミド(A)を用いる場合、前記プレポリマー(P)の原料として用いるアルケニル置換ナジイミド(A)(以下「アルケニル置換ナジイミド(A-1)」とも記す)と、前記熱硬化性成分として用いるアルケニル置換ナジイミド(A)(以下「アルケニル置換ナジイミド(A-2)」とも記す)とは、同一であってもよく、異なっていてもよい。
本実施形態の樹脂組成物において、アルケニル置換ナジイミド(A-1)と(A-2)とを用いる場合、アルケニル置換ナジイミド(A)全体に対するアルケニル置換ナジイミド(A-1)の質量割合((A-1)/(A))は、0.1~1.0であることが好ましく、0.5~1.0であることがより好ましく、0.8~1.0であることがさらに好ましい。アルケニル置換ナジイミド(A-1)及び(A)の質量割合をこのような範囲とすることで、金属箔ピール強度及び耐デスミア性に優れるプリント配線板を得ることができる。
上述したアルケニル置換ナジイミド(A)のアルケニル基数(α)及びマレイミド化合物(B)のマレイミド基数(β)の比(〔β/α〕)は0.9~4.3であることが好ましく、1.5~4.0とすることがより好ましく、1.5~3.0とすることがさらに好ましい。
本実施形態に用いるマレイミド化合物(B)は、分子中に1個以上のマレイミド基を有する化合物であれば、特に限定されるものではない。その具体例としては、例えば、N-フェニルマレイミド、N-ヒドロキシフェニルマレイミド、ビス(4-マレイミドフェニル)メタン、2,2-ビス{4-(4-マレイミドフェノキシ)-フェニル}プロパン、ビス(3,5-ジメチル-4-マレイミドフェニル)メタン、ビス(3-エチル-5-メチル-4-マレイミドフェニル)メタン、ビス(3,5-ジエチル-4-マレイミドフェニル)メタン、ポリテトラメチレンオキシド-ビス(4-マレイミドベンゾエート)、下記式(6)で表されるマレイミド化合物、これらマレイミド化合物のプレポリマー、若しくはマレイミド化合物とアミン化合物のプレポリマーなどが挙げられる。これらは1種若しくは2種以上を適宜混合して使用することも可能である。
本実施形態の樹脂組成物において、前記熱硬化性成分としてマレイミド化合物(B)を用いる場合、プレポリマー(P)の原料として用いるマレイミド化合物(B)(以下「マレイミド化合物(B-1)」とも記す)と、前記熱硬化性成分として用いるマレイミド化合物(B)(以下「マレイミド化合物(B-2)」とも記す)とは、同一であってもよく異なっていてもよいが、異なっていることが好ましい。
マレイミド化合物(B-1)としては、ビス(4-マレイミドフェニル)メタン、2,2-ビス{4-(4-マレイミドフェノキシ)-フェニル}プロパン、ビス(3-エチル-5-メチル-4-マレイミドフェニル)メタン、ポリテトラメチレンオキシド-ビス(4-マレイミドベンゾエート、上記一般式(6)で表されるマレイミド化合物が好ましく、2,2-ビス{4-(4-マレイミドフェノキシ)-フェニル}プロパン、ビス(3-エチル-5-メチル-4-マレイミドフェニル)メタンがより好ましく、2,2-ビス{4-(4-マレイミドフェノキシ)-フェニル}プロパンがさらに好ましい。
マレイミド化合物(B-2)としては、ビス(4-マレイミドフェニル)メタン、2,2-ビス{4-(4-マレイミドフェノキシ)-フェニル}プロパン、ビス(3-エチル-5-メチル-4-マレイミドフェニル)メタン、ポリテトラメチレンオキシド-ビス(4-マレイミドベンゾエート)、上記一般式(6)で表されるマレイミド化合物が好ましく、ビス(3-エチル-5-メチル-4-マレイミドフェニル)メタン、ポリテトラメチレンオキシド-ビス(4-マレイミドベンゾエート)、上記一般式(6)で表されるマレイミド化合物がより好ましく、上記一般式(6)で表されるマレイミド化合物がさらに好ましい。
マレイミド化合物(B-1)及び(B-2)は1種を単独で用いてもよく、2種以上を併用してもよい。
また、本実施形態の樹脂組成物において、マレイミド化合物(B-1)と(B-2)とを用いる場合、マレイミド化合物(B-1)の含有量はアミノ変性シリコーン(C)のアミノ基数によって決定される。すなわち、アミノ変性シリコーン(C)のアミノ基数(γ)に対するマレイミド化合物(B-1)のマレイミド基数(β-1)の比(β-1/γ〕)が1.0~20.0であることが好ましく、4.0~15.0とすることがより好ましく、6.0~12.0とすることがさらに好ましい。マレイミド化合物(B-2)の含有量はマレイミド化合物(B)の含有量とマレイミド化合物(B-1)の含有量との差(〔(B-(B-1)〕)とすることが好ましい。マレイミド化合物(B-1)と(B-2)との含有量をこのような範囲とすることで、金属箔ピール強度及び耐デスミア性に優れるプリント配線板を得ることができる。
本実施形態に用いるアミノ変性シリコーン(C)は、分子中に1個以上のアミノ基を有する化合物であれば、特に限定されるものではない。その具体例としては下記一般式(Y)で表される化合物が挙げられる。
本実施形態の樹脂組成物において、アミノ変性シリコーン(C)の含有量は、プレポリマー(P)及び熱硬化性成分の合計100質量部に対して1~40質量部とすることが好ましく、3~30質量部とすることがより好ましく、5~20質量部とすることがさらに好ましい。成分(C)の含有量をこのような範囲とすることで、金属箔ピール強度及び耐デスミア性に優れるプリント配線板を得ることができる。
エポキシ樹脂の含有量は、特に限定されないが、プレポリマー(P)及び熱硬化性成分の合計100質量部に対して、好ましくは3~45質量%であり、より好ましくは3~35質量%であり、さらに好ましくは3~20質量%である。エポキシ樹脂の含有量が上記範囲内であることにより、耐熱性、硬化性がより向上する傾向にある。
また、本実施形態の樹脂組成物は、無機充填材(D)さらに含むことが好ましい。
本実施形態に用いる無機充填材(D)は絶縁性を有するものであれば特に限定されないが、例えば、天然シリカ、溶融シリカ、アモルファスシリカ、中空シリカ等のシリカ類、アルミナ、窒化アルミニウム、窒化ホウ素、ベーマイト、酸化モリブデン、酸化チタン、ホウ酸亜鉛、錫酸亜鉛、クレー、カオリン、タルク、焼成クレー、焼成カオリン、焼成タルク、マイカ、ガラス短繊維(EガラスやDガラスなどのガラス微粉末類)、中空ガラス、球状ガラスなどが挙げられる。これらは1種若しくは2種以上を適宜混合して使用することが可能である。
本実施形態の樹脂組成物は、熱硬化性成分として、シアン酸エステル化合物を含むことが好ましい。
本実施形態に用いるシアン酸エステル化合物の種類としては特に限定されないが、例えば下記一般式(7)で表されるナフトールアラルキル型シアン酸エステル、下記一般式(8)で表されるノボラック型シアン酸エステル、ビフェニルアラルキル型シアン酸エステル、ビス(3,3-ジメチル-4-シアナトフェニル)メタン、ビス(4-シアナトフェニル)メタン、1,3-ジシアナトベンゼン、1,4-ジシアナトベンゼン、1,3,5-トリシアナトベンゼン、1,3-ジシアナトナフタレン、1,4-ジシアナトナフタレン、1,6-ジシアナトナフタレン、1,8-ジシアナトナフタレン、2,6-ジシアナトナフタレン、2、7-ジシアナトナフタレン、1,3,6-トリシアナトナフタレン、4、4’-ジシアナトビフェニル、ビス(4-シアナトフェニル)エーテル、ビス(4-シアナトフェニル)チオエーテル、ビス(4-シアナトフェニル)スルホン、2、2-ビス(4-シアナトフェニル)プロパン、及びこれらのプレポリマー等が挙げられる。これらは、1種を単独で用いてもよく、2種以上を併用してもよい。
本実施形態の樹脂組成物には、微粒子の分散性、樹脂と微粒子やガラスクロスの接着強度を向上させるために、シランカップリング剤や湿潤分散剤を併用することも可能である。これらのシランカップリング剤としては、一般に無機物の表面処理に使用されているシランカップリング剤であれば、特に限定されるものではない。具体例としては、γ-アミノプロピルトリエトキシシラン、N-β-(アミノエチル)-γ-アミノプロピルトリメトキシシランなどのアミノシラン系、γ-グリシドキシプロピルトリメトキシシランなどのエポキシシラン系、γ-アクリロキシプロピルトリメトキシシランなどのアクリルシラン系、N-β-(N-ビニルベンジルアミノエチル)-γ-アミノプロピルトリメトキシシラン塩酸塩などのカチオニックシラン系、フェニルシラン系などが挙げられ、1種若しくは2種以上を適宜組み合わせて使用することも可能である。また湿潤分散剤としては、塗料用に使用されている分散安定剤であれば、特に限定されるものではない。例えばビッグケミー・ジャパン(株)製のDISPER-110、111、118、180、161、BYK-W996、W9010、W903等の湿潤分散剤が挙げられる。
また、本実施形態の樹脂組成物においては、所期の特性が損なわれない範囲において、硬化促進剤を併用することも可能である。硬化促進剤としては、特に限定されないが、例えば、過酸化ベンゾイル、ラウロイルパーオキサイド、アセチルパーオキサイド、パラクロロベンゾイルパーオキサイド、ジ-tert-ブチル-ジ-パーフタレート等で例示される有機過酸化物;アゾビスニトリル等のアゾ化合物;N,N-ジメチルベンジルアミン、N,N-ジメチルアニリン、N,N-ジメチルトルイジン、2-N-エチルアニリノエタノール、トリ-n-ブチルアミン、ピリジン、キノリン、N-メチルモルホリン、トリエタノールアミン、トリエチレンジアミン、テトラメチルブタンジアミン、N-メチルピペリジンなどの第3級アミン類;フェノール、キシレノール、クレゾール、レゾルシン、カテコールなどのフェノール類;ナフテン酸鉛、ステアリン酸鉛、ナフテン酸亜鉛、オクチル酸亜鉛、オレイン酸錫、ジブチル錫マレート、ナフテン酸マンガン、ナフテン酸コバルト、アセチルアセトン鉄などの有機金属塩;これら有機金属塩をフェノール、ビスフェノールなどの水酸基含有化合物に溶解してなるもの;塩化錫、塩化亜鉛、塩化アルミニウムなどの無機金属塩;ジオクチル錫オキサイド、その他のアルキル錫、アルキル錫オキサイドなどの有機錫化合物、トリフェニルイミダゾール(TPIZ)などが挙げられる。
さらに本実施形態の樹脂組成物は、必要に応じて溶剤を含有していてもよい。例えば、有機溶剤を用いると、樹脂組成物の調製時における粘度が下がり、ハンドリング性を向上されるとともにガラスクロスへの含浸性が高められる。溶剤の種類は、樹脂組成物中の樹脂の一部又は全部を溶解可能なものであれば、特に限定されない。その具体例としては、例えば、アセトン、メチルエチルケトン、メチルセルソルブなどのケトン類、トルエン、キシレンなどの芳香族炭化水素類、ジメチルホルムアミドなどのアミド類、プロピレングリコールモノメチルエーテル及びそのアセテートなどが挙げられるが、これらに特に限定されない。溶剤は、1種を単独で或いは2種以上を組み合わせて使用することができる。
本実施形態の樹脂組成物は、シリコーンパウダーを含有していてもよい。シリコーンパウダーは燃焼時間を遅らせ、難燃効果を高める難燃助剤としての作用がある。
シリコーンパウダーは、特に限定されないが、例えば、シロキサン結合が三次元網目状に架橋したポリメチルシルセスキオキサンを微粉末化したもの、ビニル基含有ジメチルポリシロキサンとメチルハイドロジェンポリシロキサンの付加重合物を微粉末化したもの、ビニル基含有ジメチルポリシロキサンとメチルハイドロジェンポリシロキサンの付加重合物による微粉末の表面にシロキサン結合が三次元網目状に架橋したポリメチルシルセスキオキサンを被覆させたもの、無機担持体表面にシロキサン結合が三次元網目状に架橋したポリメチルシルセスキオキサンを被覆させたもの等が挙げられる。これらは、シリコーンゴムパウダー、シリコーン複合パウダーとして、市販されている。
本実施形態の樹脂組成物には、所期の特性が損なわれない範囲において、他の熱硬化性樹脂、熱可塑性樹脂及びそのオリゴマー、エラストマー類などの種々の高分子化合物、他の難燃性の化合物、添加剤などの併用も可能である。これらは一般に使用されているものであれば、特に限定されるものではない。例えば、難燃性の化合物では、メラミンやベンゾグアナミンなどの窒素含有化合物、オキサジン環含有化合物などが挙げられる。添加剤としては、紫外線吸収剤、酸化防止剤、光重合開始剤、蛍光増白剤、光増感剤、染料、顔料、増粘剤、滑剤、消泡剤、表面調整剤、光沢剤、重合禁止剤等、所望に応じて適宜組み合わせて使用することも可能である。
本実施形態の樹脂組成物の製造方法は、
アルケニル置換ナジイミド(A)、マレイミド化合物(B)、及びアミノ変性シリコーン(C)を重合してプレポリマー(P)を得る工程と、
得られたプレポリマー(P)と熱硬化性成分とを混合させる工程と、
を含む。
プレポリマー(P)を得る工程において、(A)~(C)成分を同時に重合させてもよく、任意の組み合わせで重合させてもよいが、(B)成分と(C)成分とを重合させて一次プレポリマーを得て、該一次プレポリマーと(A)成分とを重合させて二次プレポリマーを得ることが、ピール強度の向上、耐デスミア性の向上、成形性の向上、あるいはシリコーン成分のブリードアウトの抑制の傾向があるので好ましい。
得られたプレポリマー(P)と熱硬化性成分とを混合させる工程において、必要に応じてその他の任意性分を混合させてもよい。
本実施形態の樹脂組成物の製造方法において用いる(A)~(C)成分、熱硬化性成分及び任意成分については上記樹脂組成物の段落で説明したとおりである。
本実施形態のプリプレグは、上記の樹脂組成物を基材に含浸又は塗布したプリプレグである。
本実施形態のプリプレグは、例えば、上記の樹脂組成物を基材と組み合わせる、具体的には、上記の樹脂組成物を基材に含浸又は塗布させることにより、得ることができる。本実施形態のプリプレグの製造方法は、常法にしたがって行うことができ、特に限定されない。例えば、上記の樹脂組成物を基材に含浸又は塗布させた後、100~200℃の乾燥機中で1~30分加熱するなどして半硬化(Bステ-ジ化)させることで、プリプレグを得る方法が挙げられる。なお、本実施形態において、プリプレグの総量に対する上記の樹脂組成物(無機充填材を含む。)の量は、特に限定されないが、30~90質量%の範囲であることが好ましい。
本実施形態の積層板は、例えば、上述のプリプレグを1枚以上重ねて硬化して得ることができる。
また、本実施形態の金属箔張積層板は、例えば、上述のプリプレグと、金属箔とを積層して硬化して得ることができる。
本実施形態の金属箔張積層板は、具体的には、例えば、上述のプリプレグを少なくとも1枚以上重ね、その片面若しくは両面に金属箔を配して積層成形することにより、得ることができる。より具体的には、前述のプリプレグを1枚あるいは複数枚以上を重ね、所望によりその片面若しくは両面に銅やアルミニウムなどの金属箔を配置した構成とし、これを必要に応じて積層成形することにより、金属箔張積層板を製造することができる。ここで使用する金属箔は、プリント配線板材料に用いられるものであれば、特に限定されないが、圧延銅箔や電解銅箔などの公知の銅箔が好ましい。また、金属箔の厚みは、特に限定されないが、1~70μmが好ましく、より好ましくは1.5~35μmである。金属箔張積層板の成形方法及びその成形条件についても、特に限定されず、一般的なプリント配線板用積層板及び多層板の手法及び条件を適用することができる。例えば、金属箔張積層板の成形時には多段プレス機、多段真空プレス機、連続成形機、オートクレーブ成形機などを用いることができる。また、金属箔張積層板の成形において、温度は100~300℃、圧力は面圧2~100kgf/cm2、加熱時間は0.05~5時間の範囲が一般的である。さらに、必要に応じて、150~300℃の温度で後硬化を行うこともできる。また、上述のプリプレグと、別途作成した内層用の配線板とを組み合わせて積層成形することにより、多層板とすることも可能である。
本実施形態のレジンシートは、上述の樹脂組成物を支持体の片面又は両面に塗布したレジンシートである。ここで、レジンシートとは、薄葉化の1つの手段として用いられるもので、例えば、金属箔やフィルムなどの支持体に、直接、プリプレグ等に用いられる熱硬化性樹脂(無機充填材を含む)を塗布及び乾燥して製造することができる。
本実施形態の積層板は、例えば、上述のレジンシートを1枚以上重ねて硬化して得ることができる。
また、本実施形態の金属箔張積層板は、例えば、上述のレジンシートと、金属箔とを積層して硬化して得ることができる。
本実施形態の金属箔張積層板は、具体的には、例えば、上述のレジンシートを用いて、その片面もしくは両面に金属箔を配置して積層形成することにより、得ることができる。より具体的には、例えば、前述のレジンシートを1枚あるいは所望によりその支持体を剥離したものを複数枚重ね、その片面もしくは両面に銅やアルミニウムなどの金属箔を配置した構成とし、これを必要に応じて積層成形することにより、金属箔張積層板を製造することができる。ここで使用する金属箔は、プリント配線板材料に用いられるものであれば、特に限定されないが、圧延銅箔や電解銅箔などの公知の銅箔が好ましい。金属箔張積層板の成形方法及びその成形条件についても、特に限定されず、一般的なプリント配線板用積層板及び多層板の手法及び条件を適用することができる。例えば、金属箔張積層板の成形時には多段プレス機、多段真空プレス機、連続成形機、オートクレーブ成形機などを用いることができる。また、金属箔張積層板の成形時において、温度は100~300℃、圧力は面圧2~100kgf/cm2、加熱時間は0.05~5時間の範囲が一般的である。さらに、必要に応じて、150~300℃の温度で後硬化を行うこともできる。
本実施形態の積層板は、レジンシートとプリプレグとを各々1枚以上重ねて硬化して得られる積層板であってもよく、レジンシートとプリプレグと金属箔とを積層して硬化して得られる金属箔張積層板であってもよい。
本実施形態のプリント配線板は、絶縁層と、前記絶縁層の表面に形成された導体層とを含むプリント配線板であって、前記絶縁層が、上述の樹脂組成物を含む。
マレイミド化合物(BMI-80、マレイミド基当量285g/eq、ケイ・アイ化成(株)製)18質量部とジアミノ変性シリコーン(X-22-161B、アミノ基当量1500g/eq、信越化学工業(株)製)12質量部とを重合して一次プレポリマーを得た。得られた一次プレポリマーと、ビスジアリルナジイミド(BANI-M、アルケニル基当量286g/eq、丸善石油化学(株)製)16質量部とを重合して二次プレポリマーを得た。得られた二次プレポリマー、マレイミド化合物(BMI-2300、マレイミド基当量186g/eq、大和化成工業(株)製)32質量部、ビスジアリルナジイミド(BANI-M、アルケニル基当量286g/eq、丸善石油化学(株)製)16質量部、ビフェニルアラルキル型エポキシ樹脂(NC-3000H、日本化薬(株)製)6質量部、スラリーシリカ(SC-2050MB、アドマテックス(株)製)160質量部、エポキシシランカップリング剤(KBM-403、信越化学工業株式会社製)2質量部、スチリルシランカップリング剤(KBM-1403、信越化学工業株式会社製)1質量部、湿潤分散剤(DISPERBYK-161、ビックケミージャパン(株)製)1質量部、硬化促進剤(TPIZ、和光純薬社製)0.5質量部混合し、マレイミド基数/アミノ基数比が7.9、アルケニル基数/マレイミド基数が2.3の樹脂組成物を得た。
なお、本実施例において、マレイミド基数/アミノ基数及びアルケニル基数/マレイミド基数は、下記計算式で表される。
〔マレイミド基数/アミノ基数〕=(マレイミド化合物の質量部数/マレイミド化合物のマレイミド基当量)/(ジアミノ変性シリコーンの質量部数/ジアミノ変性シリコーンのアミノ基当量)
〔アルケニル基数/マレイミド基数〕=(ビスジアリルナジイミドの質量部数/ビスジアリルナジイミドのアルケニル基当量)/(マレイミド化合物の質量部数/マレイミド化合物のマレイミド基当量)
得られた樹脂組成物をメチルエチルケトンで希釈することでワニスを得た。このワニスをTガラスクロス(T2118)に含浸塗工し、160℃で3分間加熱乾燥して、樹脂組成物含有量46.5質量%のプリプレグを得た。
マレイミド化合物(BMI-80、マレイミド基当量285g/eq、ケイ・アイ化成(株)製)18質量部とジアミノ変性シリコーン(X-22-161B、アミノ基当量1500g/eq、信越化学工業(株)製)12質量部とを重合して一次プレポリマーを得た。得られた一次プレポリマーと、ビスジアリルナジイミド(BANI-M、アルケニル基当量286g/eq、丸善石油化学(株)製)32質量部とを重合して二次プレポリマーを得た。得られた二次プレポリマー、マレイミド化合物(BMI-2300、マレイミド基当量186g/eq、大和化成工業(株)製)32質量部、ビフェニルアラルキル型エポキシ樹脂(NC-3000H、日本化薬(株)製)6質量部、スラリーシリカ(SC-2050MB、アドマテックス(株)製)160質量部、エポキシシランカップリング剤(KBM-403、信越化学工業株式会社製)2質量部、スチリルシランカップリング剤(KBM-1403、信越化学工業株式会社製)1質量部、湿潤分散剤(DISPERBYK-161、ビックケミージャパン(株)製)1質量部、硬化促進剤(TPIZ、和光純薬社製)0.5質量部混合し、マレイミド基数/アミノ基数比が7.9、アルケニル基数/マレイミド基数が2.1の樹脂組成物を得た。得られた樹脂組成物をメチルエチルケトンで希釈することでワニスを得た。このワニスをTガラスクロス(T2118)に含浸塗工し、160℃で3分間加熱乾燥して、樹脂組成物含有量46.5質量%のプリプレグを得た。
マレイミド化合物(BMI-80、マレイミド基当量285g/eq、ケイ・アイ化成(株)製)18質量部とジアミノ変性シリコーン(X-22-161B、アミノ基当量1500g/eq、信越化学工業(株)製)12質量部とを重合して一次プレポリマーを得た。得られた一次プレポリマー、マレイミド化合物(BMI-2300、マレイミド基当量186g/eq、大和化成工業(株)製)32質量部、ビスジアリルナジイミド(BANI-M、アルケニル基当量286g/eq、丸善石油化学(株)製)32質量部、ビフェニルアラルキル型エポキシ樹脂(NC-3000H、日本化薬(株)製)6質量部、スラリーシリカ(SC-2050MB、アドマテックス(株)製)160質量部、エポキシシランカップリング剤(KBM-403、信越化学工業株式会社製)2質量部、スチリルシランカップリング剤(KBM-1403、信越化学工業株式会社製)1質量部、湿潤分散剤(DISPERBYK-161、ビックケミージャパン(株)製)1質量部、硬化促進剤(TPIZ、和光純薬社製)0.5質量部を混合し、マレイミド基数/アミノ基数比が7.9、アルケニル基数/マレイミド基数が2.1の樹脂組成物を得た。得られた樹脂組成物をメチルエチルケトンで希釈することでワニスを得た。このワニスをTガラスクロス(T2118)に含浸塗工し、160℃で3分間加熱乾燥して、樹脂組成物含有量46.5質量%のプリプレグを得た。
実施例1、実施例2及び比較例1で得られたプリプレグを、それぞれ1枚を12μm厚の電解銅箔(3EC-III、三井金属鉱業(株)製)を上下に配置し、圧力30kgf/cm2、温度220℃で120分間の積層成型を行い、絶縁層厚さ0.1mmの銅張積層板を得た。
Claims (16)
- アルケニル置換ナジイミド(A)、マレイミド化合物(B)、及びアミノ変性シリコーン(C)を重合して得られるプレポリマー(P)と、熱硬化性成分とを含む樹脂組成物。
- 前記熱硬化性成分が、アルケニル置換ナジイミド(A)及び/又はマレイミド化合物(B)を含む、請求項1に記載の樹脂組成物。
- 無機充填材(D)をさらに含む、請求項1~6のいずれか一項に記載の樹脂組成物。
- 前記無機充填材(D)が、シリカ、アルミナ及び窒化アルミニウムからなる群より選ばれる少なくとも1種を含む、請求項7に記載の樹脂組成物。
- 前記無機充填材(D)の含有量が、プレポリマー(P)及び熱硬化性成分の合計100質量部に対して50~500質量部である、請求項7又は8に記載の樹脂組成物。
- 請求項1~9のいずれか一項に記載の樹脂組成物を基材に含浸又は塗布したプリプレグ。
- 前記基材が、Eガラスクロス、Tガラスクロス、Sガラスクロス、Qガラスクロス及び有機繊維からなる群より選ばれる少なくとも1種である、請求項10に記載のプリプレグ。
- 請求項1~9のいずれか一項に記載の樹脂組成物を支持体に塗布したレジンシート。
- 請求項10及び11に記載のプリプレグ、並びに請求項12に記載のレジンシートからなる群より選ばれる少なくとも1種を1枚以上重ねた積層体の硬化物を含む積層板。
- 請求項10及び11に記載のプリプレグ、並びに請求項12に記載のレジンシートからなる群より選ばれる少なくとも1種と、金属箔とを積層した積層体の硬化物を含む金属箔張積層板。
- 絶縁層と、前記絶縁層の表面に形成された導体層とを含むプリント配線板であって、前記絶縁層が、請求項1~9のいずれか一項に記載の樹脂組成物を含むプリント配線板。
- アルケニル置換ナジイミド(A)、マレイミド化合物(B)、及びアミノ変性シリコーン(C)を重合してプレポリマー(P)を得る工程と、
得られたプレポリマー(P)と熱硬化性成分とを混合させる工程と、
を含む樹脂組成物の製造方法。
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EP16821356.9A EP3321297B1 (en) | 2015-07-06 | 2016-07-04 | Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them |
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US15/737,498 US10721817B2 (en) | 2015-07-06 | 2016-07-04 | Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them |
JP2017527437A JP6819886B2 (ja) | 2015-07-06 | 2016-07-04 | 樹脂組成物、該樹脂組成物を用いたプリプレグ又はレジンシート並びにそれらを用いた積層板及びプリント配線板 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019048929A (ja) * | 2017-09-08 | 2019-03-28 | 株式会社ダイセル | 繊維強化複合材料用組成物、プリプレグ、及び繊維強化複合材料 |
JP2020084057A (ja) * | 2018-11-27 | 2020-06-04 | 日立化成株式会社 | 硬化性組成物及びその製造方法 |
JP7305349B2 (ja) | 2016-04-05 | 2023-07-10 | 三菱瓦斯化学株式会社 | 樹脂組成物及びその製造方法、プリプレグ、レジンシート、積層板、金属箔張積層板、並びにプリント配線板 |
Families Citing this family (1)
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---|---|---|---|---|
CN114981343A (zh) * | 2020-01-16 | 2022-08-30 | 琳得科株式会社 | 树脂片 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03221526A (ja) * | 1990-01-26 | 1991-09-30 | Hitachi Chem Co Ltd | マレイミド樹脂硬化物の製造方法 |
JPH04236228A (ja) * | 1991-01-16 | 1992-08-25 | Teijin Ltd | 熱硬化樹脂の製造方法及びそれに用いる熱硬化性組成物 |
JPH07179816A (ja) * | 1993-12-24 | 1995-07-18 | Maruzen Petrochem Co Ltd | 耐汚染性被膜形成用熱硬化性樹脂組成物 |
JP2013187376A (ja) * | 2012-03-08 | 2013-09-19 | Hitachi Chemical Co Ltd | 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0627180B2 (ja) * | 1988-07-05 | 1994-04-13 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
US5087766A (en) * | 1989-04-25 | 1992-02-11 | Mitsubishi Petrochemical Co., Ltd. | Process for producing allyl-substituted phenol compound and the product |
US5300588A (en) * | 1991-04-04 | 1994-04-05 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
US5290882A (en) * | 1991-08-13 | 1994-03-01 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
JP2669247B2 (ja) * | 1992-02-13 | 1997-10-27 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
JP3221526B2 (ja) | 1993-06-15 | 2001-10-22 | 日本電信電話株式会社 | 光増幅用光ファイバ |
JP3173332B2 (ja) | 1995-03-13 | 2001-06-04 | 新神戸電機株式会社 | 金属箔張り積層板の製造法 |
US5856425A (en) * | 1997-10-10 | 1999-01-05 | Occidental Chemical Corporation | Dispensable resin paste |
US6709738B2 (en) * | 2001-10-15 | 2004-03-23 | 3M Innovative Properties Company | Coated substrate with energy curable cyanate resin |
TWI391424B (zh) * | 2005-01-12 | 2013-04-01 | Taiyo Holdings Co Ltd | A hardened resin composition for inkjet and a hardened product thereof, and a printed circuit board using the same |
CN101365765B (zh) * | 2006-01-23 | 2012-05-23 | 日立化成工业株式会社 | 粘接剂组合物、薄膜状粘接剂、粘接薄片及使用其的半导体装置 |
JP5024205B2 (ja) | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
JP5445455B2 (ja) * | 2008-08-04 | 2014-03-19 | 日立化成株式会社 | 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置 |
US8932705B2 (en) * | 2008-12-24 | 2015-01-13 | Samsung Electro-Mechanics Co., Ltd. | Thermosetting resin composition and board using the same |
JP5737185B2 (ja) * | 2009-11-13 | 2015-06-17 | 日立化成株式会社 | 半導体装置、半導体装置の製造方法及び接着剤層付き半導体ウェハ |
WO2011058996A1 (ja) * | 2009-11-13 | 2011-05-19 | 日立化成工業株式会社 | 接着剤組成物、それを用いた半導体装置及びその製造方法 |
TW201204548A (en) | 2010-02-05 | 2012-02-01 | Sumitomo Bakelite Co | Prepreg, laminate, printed wiring board, and semiconductor device |
WO2011152402A1 (ja) * | 2010-06-02 | 2011-12-08 | 三菱瓦斯化学株式会社 | 樹脂組成物およびこれを用いたプリプレグ及び積層板 |
JP5659673B2 (ja) * | 2010-10-06 | 2015-01-28 | 住友ベークライト株式会社 | 樹脂シート、積層板、電子部品、プリント配線板及び半導体装置 |
JP2013001807A (ja) | 2011-06-16 | 2013-01-07 | Panasonic Corp | 電子回路基板材料用樹脂組成物、プリプレグ及び積層板 |
JP3173332U (ja) | 2011-11-17 | 2012-02-02 | 奇▲こう▼科技股▲ふん▼有限公司 | 含油軸受ファン構造 |
JP5895156B2 (ja) | 2011-12-19 | 2016-03-30 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、封止材およびそれらを用いた電子部品 |
JP2013216884A (ja) | 2012-03-14 | 2013-10-24 | Hitachi Chemical Co Ltd | 熱硬化性樹脂組成物、プリプレグ及び積層板 |
JP6259557B2 (ja) * | 2012-07-03 | 2018-01-10 | 日立化成株式会社 | 熱硬化性樹脂組成物、及びこれを用いたプリプレグ、積層板、プリント配線板 |
EP2910588B1 (en) | 2012-10-19 | 2022-11-02 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, laminate and printed-wiring board |
EP3094162B1 (en) * | 2014-01-07 | 2023-08-09 | Mitsubishi Gas Chemical Company, Inc. | Insulating layer for printed wire board, and printed wire board |
-
2016
- 2016-07-04 KR KR1020177034846A patent/KR102288007B1/ko active IP Right Grant
- 2016-07-04 US US15/737,498 patent/US10721817B2/en active Active
- 2016-07-04 CN CN201680039779.5A patent/CN107735417B/zh active Active
- 2016-07-04 JP JP2017527437A patent/JP6819886B2/ja active Active
- 2016-07-04 EP EP16821356.9A patent/EP3321297B1/en active Active
- 2016-07-04 WO PCT/JP2016/069737 patent/WO2017006887A1/ja active Application Filing
- 2016-07-06 TW TW105121318A patent/TWI698465B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03221526A (ja) * | 1990-01-26 | 1991-09-30 | Hitachi Chem Co Ltd | マレイミド樹脂硬化物の製造方法 |
JPH04236228A (ja) * | 1991-01-16 | 1992-08-25 | Teijin Ltd | 熱硬化樹脂の製造方法及びそれに用いる熱硬化性組成物 |
JPH07179816A (ja) * | 1993-12-24 | 1995-07-18 | Maruzen Petrochem Co Ltd | 耐汚染性被膜形成用熱硬化性樹脂組成物 |
JP2013187376A (ja) * | 2012-03-08 | 2013-09-19 | Hitachi Chemical Co Ltd | 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3321297A4 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7305349B2 (ja) | 2016-04-05 | 2023-07-10 | 三菱瓦斯化学株式会社 | 樹脂組成物及びその製造方法、プリプレグ、レジンシート、積層板、金属箔張積層板、並びにプリント配線板 |
JP2019048929A (ja) * | 2017-09-08 | 2019-03-28 | 株式会社ダイセル | 繊維強化複合材料用組成物、プリプレグ、及び繊維強化複合材料 |
JP7060347B2 (ja) | 2017-09-08 | 2022-04-26 | 株式会社ダイセル | 繊維強化複合材料用組成物、プリプレグ、及び繊維強化複合材料 |
JP2020084057A (ja) * | 2018-11-27 | 2020-06-04 | 日立化成株式会社 | 硬化性組成物及びその製造方法 |
JP7293621B2 (ja) | 2018-11-27 | 2023-06-20 | 株式会社レゾナック | 硬化性組成物及びその製造方法 |
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